JP2015220435A - Spacer for led module, led module including the same and method of manufacturing led module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a spacer for LED module capable of blocking intervention of air between a waterproof film of heat resistant resin with slightly lower adhesion and an LED effectively, and to provide an LED module including the same, and a method of manufacturing the LED module.SOLUTION: A spacer 300 for LED module is included in an LED module where a plurality of LEDs 200 are mounted on a module substrate 100, and a waterproof film 400 of heat resistant resin is fixed tightly to the upper surface of the module substrate 100. The spacer 300 for LED module enhances adhesion to the waterproof film 400, by correcting the height of the LED 200 installed on the upper surface of the module substrate 100 and projecting from the upper surface of the module substrate 100. A plurality of housing holes 310 are formed with a thickness of a correction value, determined depending on the height of the LED 200 projecting from the upper surface of the module substrate 100.

Description

  The present invention relates to a spacer for an LED module, an LED module including the spacer, and a method for manufacturing the LED module. More specifically, the heat dissipation performance and optical performance of the LED module on which a high-brightness LED with a large amount of heat generation is mounted. The present invention relates to a spacer for an LED module that can improve waterproof performance and durability and can improve the appearance of the LED module, an LED module including the spacer, and a method for manufacturing the LED module.

  In general, an LED (LED: Light Emitting Diode) is an element that emits light by passing a current through a terminal of a compound semiconductor and combining electrons and holes in the vicinity of a PN junction or in an active layer. Since the LED does not use mercury, it is environmentally friendly and is a solid-state device. Therefore, the LED is not only long-lived, but also has a significantly low power consumption, and has recently attracted much attention as a new light source.

  Among them, white LEDs that emit white light have been put to practical use in LCD-TV backlights, automobile headlamps, general lighting, etc., and are used as lighting alternatives to existing incandescent and fluorescent lamps. Its uses are gradually expanding.

  In recent years, an LED module in the form of a surface light source is manufactured for such an LED and used for an outdoor signboard or an outdoor lighting device. It is important to provide waterproofing so that they do not touch. As described above, various methods for waterproofing have been developed. In Korean Patent No. 1093653 (Patent Document 1), an LED using a top film embodied by a polyvinyl chloride film is disclosed. A technique for realizing waterproofness of a module is disclosed.

  Referring to FIG. 1, the conventional technology will be described in more detail. The conventional LED module described in Patent Document 1 has a plurality of LEDs (20) mounted on a module substrate (10). Then, the top film (30) is placed in close contact with the concavo-convex shape of the plurality of LEDs (20), thereby realizing waterproofing for the plurality of LEDs (20). The conventional LED module described in Patent Document 1 uses polyvinyl chloride (PVC), polystyrene (PS), polyester (PE), acrylonitrile butadiene styrene (ABS) for such a top film (30). It is stated that you can.

However, recently, high-brightness LEDs that can emit more light have been developed, and such high-brightness LEDs generate a large amount of heat.
However, the polyvinyl chloride film applied to the top film (30) of the conventional LED module has good adhesion, but has low heat resistance, and even if the temperature exceeds 60 ° C. due to the heat emitted from the high-intensity LED. Since deformation and breakage occur, there is a problem that it cannot be used for applications that enclose high-brightness LEDs.

  As shown in FIG. 2, the top film (30 ′) is made of a heat resistant resin such as a porertyrylene terephthalate (PET) so that it can be applied to an LED module equipped with a high-intensity LED. However, these heat resistant resins generally have a disadvantage in that the adhesiveness is lowered.

  That is, as shown in FIG. 2, when a film made of a heat resistant resin is applied to the top film (30 ′), the top film (30 ′) cannot adhere to the uneven shape of the plurality of LEDs (20). There is a problem in that air (31) is interposed between the top film (30 ′) and the plurality of LEDs (20) or the module substrate (10).

  Thus, air (31) is interposed in the gap between the top film (30 ′) and the plurality of LEDs (20), or the gap between the top film (30 ′) and the module substrate (10). The air with low thermal conductivity blocks the conduction of heat generated from the LED (20), forms an unintended optical interface in the light emission path, and the top film (30 ') comes to float. A serious problem occurs in which the heat dissipation performance, optical performance, waterproof performance and durability of the module are all lowered.

  In addition, the air (31) interposed between the top film (30 ') and the plurality of LEDs (20) or the module substrate (10) has a drawback that the appearance of the LED module is also deteriorated.

Korean Registered Patent No. 1093653

  In order to solve the above problems, the present invention provides a heat-resistant resin waterproof film in which a high-brightness LED with a large amount of heat generation is mounted and a heat-resistant resin waterproof film is applied, and the adhesion is slightly reduced. It is an object of the present invention to provide an LED module spacer capable of effectively blocking the presence of air between the LED and the LED, an LED module including the spacer, and a method of manufacturing the LED module.

  In order to solve the above-described problems, the LED module spacer according to the present invention includes a waterproof film made of a heat-resistant resin having a plurality of LEDs mounted on a module substrate and having light transmittance on the surface of the module substrate. As a spacer to improve the adhesion to the waterproof film by compensating for the height of the LED provided on the surface of the module substrate and protruding from the surface of the module substrate. And a plate shape corresponding to the planar shape of the module substrate, wherein a plurality of receiving holes corresponding to the plurality of LEDs are formed and determined according to the height of the LED protruding from the surface of the module substrate. The thickness of the correction value is provided.

  The LED module spacer is preferably made of the same heat resistant resin as the waterproof film so as to further improve the adhesion to the waterproof film.

The heat resistant resin may be polyethylene terephthalate (PET).
The LED module spacer is preferably made of polyethylene terephthalate (PET), polypropylene (PP), polyethylene naphthalate (PEN), or polyetherimide (PEI).

  The thickness of the correction value is preferably 0.7 to 1.3 times the height of the LED protruding from the module substrate surface.

  An LED module according to the present invention includes a board body, a module board made of a metal foil plate provided on the board body in a predetermined circuit pattern shape, a plurality of LEDs mounted on the module board, and the module A plate shape corresponding to the planar shape of the substrate, a plurality of receiving holes corresponding to the plurality of LEDs, respectively, formed on the surface of the module substrate and projecting from the surface of the module substrate. The LED module spacer provided with the thickness of the correction value determined according to the thickness and a heat-resistant resin having a light transmission property are closely fixed to cover the LED module spacer and the LED. Includes waterproof film.

  In the LED module, the LED module spacer is preferably made of the same heat resistant resin as that of the waterproof film so that the adhesion to the waterproof film is further improved.

  In the LED module, the heat-resistant resin may be polyethylene terephthalate (PET).

  In the LED module, the LED module spacer is made of any of polyethylene terephthalate (PET), polypropylene (PP), polyethylene naphthalate (PEN), and polyetherimide (PEI). It is desirable to become.

  In the LED module, the thickness of the correction value is preferably 0.7 to 1.3 times the height of the LED protruding from the surface of the module substrate.

  A method of manufacturing an LED module according to the present invention includes a step of mounting a plurality of LEDs on a module substrate comprising a substrate body and a metal foil plate provided on the substrate body in a predetermined circuit pattern shape; Thickness of a correction value that is provided in the form of a plate corresponding to a planar shape, a plurality of receiving holes corresponding to the plurality of LEDs are formed, and determined according to the height of the LEDs protruding from the module substrate surface A step of installing a spacer for an LED module provided on the surface of the module substrate so that the LED is inserted and accommodated in the accommodation hole, and a waterproof film made of a heat-resistant resin having light transmissivity. A module spacer and a step of closely fixing the LED so as to cover the LED are included.

  In the LED module manufacturing method, the thickness of the correction value is preferably 0.7 to 1.3 times the height of the LED protruding from the module substrate surface.

  In the LED module manufacturing method, the LED module spacer is made of the same heat-resistant resin as the waterproof film so that the adhesion to the waterproof film is further improved, and the heat-resistant resin is polyethylene terephthalate ( PET; Polyethylene terephthalate).

  According to the LED module spacer of the present invention, the LED module including the spacer, and the manufacturing method of the LED module, the spacer is provided with a thickness of the correction value, and is installed on the surface of the module substrate. When a waterproof film of heat-resistant resin such as PET whose adhesion is slightly lowered by covering the LED by relaxing the sudden height change between the LED and the LED, the waterproof film will not be bent suddenly. Even in this case, the LED and the LED module spacer can be fixed in close contact with the surface.

  In particular, the heat-dissipating film and the LED module spacer can be easily manufactured into a film and plate type, and can be easily applied to a high-brightness LED with a large amount of heat generation. By using the same material of terephthalate), the adhesion between the heat dissipation film and the LED module spacer can be further improved.

  In this way, the adhesion of the waterproof film made of a heat resistant resin to the LED can be greatly improved. Therefore, the waterproof film of the heat resistant resin that can realize waterproofing to the high-brightness LED having a large amount of heat generation is applied. However, the thermal conductivity is low, effectively forming an unintended optical interface and effectively blocking the air that makes the waterproof film float up between the waterproof film and the LED. The LED can be stably and firmly fixed to the LED.

  Thereby, the external appearance of the LED module which can prevent the heat dissipation performance, optical performance, waterproof performance, and durability of the LED module from being lowered can also be improved.

Cross-sectional view of a conventional LED module Cross-sectional view of a conventional LED module using a waterproof film of heat-resistant resin 1 is a cross-sectional view of an LED module according to a preferred embodiment of the present invention. 1 is a cross-sectional view illustrating an LED module according to a preferred embodiment of the present invention with components separated from each other. 1 is a perspective view of an LED module spacer provided in an LED module according to a preferred embodiment of the present invention. FIG. 4 is a cross-sectional view illustrating a case where a thickness of a correction value of a spacer for an LED module is higher or lower than that of an LED in an LED module according to a preferred embodiment of the present invention. FIG. 4 is a cross-sectional view illustrating a case where a thickness of a correction value of a spacer for an LED module is higher or lower than that of an LED in an LED module according to a preferred embodiment of the present invention. 4 is a float chart for explaining a method of manufacturing an LED module according to a preferred embodiment of the present invention.

  In the following, a person having ordinary knowledge in the technical field to which the present invention belongs (hereinafter referred to as 'ordinary engineer') with respect to the embodiments of the present invention will be described with reference to the accompanying drawings so as to be easily implemented. This will be described in detail. However, the present invention may be embodied in a plurality of different forms and the scope is not limited to the embodiments described herein.

  The spacer for an LED module of the present invention, the LED module provided with the spacer, and the manufacturing method of the LED module are such that the LED is mounted on the module substrate, and the waterproof film of heat-resistant resin having light transmittance is adhered to the upper surface of the module substrate. A fixed LED module is installed on the upper surface of the module board, and the height of the LED is corrected from the upper surface of the module board by correcting the height of the LED, thereby causing a sudden change in height between the surface of the module board and the upper part of the LED. The present invention relates to an LED module spacer that relaxes and improves the adhesion of a waterproof film of an LED, an LED module including the spacer, and a method of manufacturing the LED module.

Hereinafter, with reference to FIGS. 3 to 6A attached to the present specification, the configuration, operation effect, and usage of the LED module according to the preferred embodiment of the present invention will be described in detail.
An LED module according to a preferred embodiment of the present invention includes a module substrate (100), a plurality of LEDs (200), an LED module spacer (300), and a waterproof film (400). The LED module spacer (300) is hereinafter referred to as a spacer (300) for short.

The module substrate 100 serves as a support substrate on which a bare chip type or package type LED 200 can be mounted.
For this purpose, the module substrate (100) includes a substrate body (110) made of a heat resistant resin and a metal foil plate (120) provided on the substrate body (110) in a predetermined circuit pattern shape. It is.

  The substrate main body (110) is preferably made of any one of heat resistant resins such as PET, PI, PC, and ABS that is not damaged even at a high temperature as compared with other resins, which is resistant to heat such as FR-4. Although it is relatively inexpensive compared to conventional substrate materials, it can not only prevent damage to the substrate body (110) due to heat in the reflow process after mounting the LED (200) in the future, but also withstand voltage and manufacturing It is because it is excellent in property.

  However, the material of the substrate body (110) is not limited to this, and the substrate body (110) can be mounted in a flexible form as needed through thickness adjustment. In general, in order to realize the LED module in a flexible form, the substrate body (110) is mounted with a thickness of 0.3t (t indicates thickness) or less.

The metal foil plate 120 may be formed of a low-priced, light aluminum or aluminum-based alloy plate, and may be formed of a conventionally used copper or copper-based alloy plate. Is possible.
The metal foil plate (120) is completely bonded to the upper surface of the substrate body (110) through a heat resistant adhesive resistant to heat, and a heat resistant adhesive layer (between the substrate body (110) and the metal foil plate (120) is provided. 121) can be formed.
As the heat-resistant adhesive, a heat-resistant silicone adhesive and ceramic adhesive, or a mixture of both can be applied so as not to be damaged by heat in the reflow process.
Such a metal foil plate (120) has a plate shape and is bonded to the upper surface of the substrate body (110), and is subjected to a process such as etching using iron chloride or the like well known to ordinary engineers. After that, a predetermined circuit pattern can be formed.

  Although not shown in detail in the drawing, the substrate body (110) on which the LEDs (200) are mounted in this way is a PI film for wire bonding processes using wires and insulation of reflow soldering parts. And the PSR process are performed.

The LED (200) may be mounted with LED chips and LED packages of various colors and brightness, and particularly when the LED chip is mounted in the form of a bare chip that is directly mounted on the module substrate (100). It is also possible to make the module very thin.
The LED (200) is mounted on the module substrate (100) after being mounted on the solder (210) printed on the upper surface of the module substrate (100) and then through a reflow process. The method of mounting the LED (200) on the upper surface of the module substrate (100) is not limited to this.

  The spacer (300) is provided in the form of a plate corresponding to the planar shape of the module substrate (100), and a plurality of receiving holes (310) respectively corresponding to the plurality of LEDs (200) are formed. 200) is installed on the upper surface of the module substrate (100) so as to be inserted and accommodated in the plurality of accommodation holes (310), and the height of the LED (200) protruding from the upper surface of the module substrate (100) is corrected. This improves the adhesion of the waterproof film (400) to the plurality of LEDs (200).

Therefore, the spacer 300 has a thickness of a correction value determined in accordance with the height of the LED 200 protruding from the upper surface of the module substrate 100 as shown in FIGS. It is provided in the form of a plate with thickness.
That is, the spacer (300) is formed between the upper surface of the module substrate (100) and the upper portion of the LED (200) when the waterproof film (400) is formed of a heat-resistant resin such as PET whose adhesion is relatively low. When the waterproof film (400) is installed so as to cover the LED (200) by reducing the height variation between them, the waterproof film (400) against the LED (200) is prevented from generating a sharply bent portion. ).

The spacer (300) is preferably made of the same heat resistant resin as the waterproof film (400) so as to further improve the adhesion to the waterproof film (400). As the heat resistant resin forming (400), it is desirable to be provided with PET which is excellent in heat resistance and can be easily manufactured in a plate or film form.
However, the heat resistant resin constituting the spacer (300) is not limited to this, and may be made of any one of PP, PEN, and PEI.

On the other hand, the thickness of the correction value of the spacer (300) is determined according to the height of the LED (200) protruding from the upper surface of the module substrate (100). It is desirable that it is 7 times or more and 1.3 times or less.
The reason for this is that when the thickness of the correction value is smaller than 0.7 times or larger than 1.3 times the height of the LED (200), the waterproof film (400) is bent sharply near the LED (200). This is because air may occur between the LED (200) and the waterproof film (400).

  The adhesiveness related to the flexibility of the waterproof film (400) decreases as the waterproof film (400) becomes thicker and improves as the waterproof film (400) becomes thinner. The allowable range may vary depending on the thickness of the waterproof film (400).

  Specifically, for example, when the waterproof film (400) is formed as thin as about 15 μm, the thickness of the correction value is within a range of 0.7 to 1.3 times the height of the LED (200). If it enters, it can secure adhesion without air intervening, but when the waterproof film (400) is formed to be about 100 μm thick, it is 0.8 to 1.2 times the height of the LED (200). Thus, it is possible to ensure adhesion that air does not intervene only in the range.

That is, as shown in FIGS. 6A and 6B, the spacer (300 ′, 300 ″) has a thickness that is ± 20 to about the protrusion height of the LED (200) on the upper surface of the module substrate (100). Whether the film is about 30% thick or thin, adhesion is secured by the flexibility of the waterproof film (400) itself. However, as the thickness of the waterproof film (400) increases, the allowable range increases from ± 30% to ± 30%. It can be as low as 20%.
That is, the allowable range of the height of the LED (200) protruding from the upper surface of the module substrate (100) is inversely proportional to the thickness of the waterproof film (400).

  Here, the height of the LED (200) protruding from the upper surface of the module substrate (100) varies greatly depending on whether the LED (200) is provided with an LED chip or an LED package.

In general, when the LED module is mounted in the form of COF and COB, the LED (200) is provided with an LED chip. At this time, the height of the LED (200) is about 50 to 300 μm.
On the other hand, when the LED (200) is provided in an LED package, the height of the LED (200) is about 700 to 1,500 μm.

  Therefore, when the LED (200) is an LED chip, the spacer (300) may be provided with a thickness within a range of 0.7 to 1.3 times 50 to 300 μm. In the case of an LED package, it may be provided with a thickness within a range of 0.7 to 1.3 times 700 to 1,500 μm.

  In the preferred embodiment of the present invention, the spacer 300 is implemented with a plurality of receiving holes 310 to be applied to an LED module having a plurality of LEDs 200. As an application applied to an LED module provided with one LED (200), it may be embodied in a form in which one accommodation hole (310) is formed.

  In the LED module according to the preferred embodiment of the present invention, the spacer (300) is provided in the form of a plate corresponding to the planar shape of the module substrate (100). Is large, a plurality of spacers (300) may be installed in different zones on the module substrate (100), and may be provided in the form of one large plate corresponding to the planar shape of the module substrate (100). .

  On the other hand, although not specifically described and illustrated in the preferred embodiment of the present invention, such a spacer (300) may be attached and fixed to the upper surface of the module substrate (100) through another adhesive layer. It may be installed on the upper surface of the module substrate (100) by a non-adhesive method such as heat welding.

  The waterproof film (400) realizes waterproofing of the plurality of LEDs (200) by covering and fixing the plurality of LEDs (200) and the spacer (300). Such a waterproof film (400) is preferably made of PET having light transmittance, excellent heat resistance, and low cost, but the material is not necessarily limited thereto. Keep it.

  And the operation | work which adheres and fixes the said waterproof film (400) to several LED (200) and a spacer (300) may be performed by the system of heat sealing | fusion or a vacuum suction, without using another adhesive agent. Alternatively, it can be mounted in a form of bonding using another adhesive.

Hereinafter, a method for manufacturing an LED module according to a preferred embodiment of the present invention will be described in detail with reference to FIGS.
First, a metal foil plate (120) is formed on a substrate body (110) to form a module substrate (100), and then solder (210) is printed on the module substrate (100) to mount an LED (200). (Step s100).
After the LED (200) is mounted on the module substrate (100) in this way, the LED (200) is fixed to the module substrate (100) through a reflow process, the LED (200) and the metal foil plate (120). A wire bonding process for electrically connecting the two and a PSR process for attaching a PI film for insulation of a reflow soldering part can be followed.

  Next, it is provided in the form of a plate corresponding to the planar shape of the module substrate (100), and a plurality of receiving holes (310) respectively corresponding to the plurality of LEDs (200) are formed from the top surface of the module substrate (100). A plurality of LEDs (200) are inserted and accommodated in a plurality of accommodation holes (310) with spacers (300) having a thickness of a correction value determined according to the height of the protruding LEDs (200). Next, it is installed on the upper surface of the module substrate (100) (step s200).

Accordingly, the heights of the plurality of LEDs (200) protruding from the upper surface of the module substrate (100) are corrected, and a steep height between the upper surface of the module substrate (100) and the upper portions of the plurality of LEDs (200) is corrected. The change in height is eased.
Thereafter, a waterproof film (400) made of a heat-resistant resin such as PET having optical transparency is closely fixed so as to cover the spacer (300) and the plurality of LEDs (200) (step s300).

  At this time, since the rapid change in height between the upper surface of the module substrate (100) and the upper portions of the plurality of LEDs (200) is alleviated by the spacer (300), the waterproof film (400) is bent sharply. In addition, the plurality of LEDs (200) and the spacer (300) can be reliably covered and fixed firmly.

The LED module manufacturing method according to the preferred embodiment of the present invention is implemented by first mounting a plurality of LEDs (200) on a module substrate (100) and then installing a spacer (300). Is not limited to this.
For example, the LED module manufacturing method includes a plurality of spacers (300) placed on the module substrate (100) and then inserted and accommodated in the plurality of accommodation holes (310) of the spacer (300). The LED (200) can also be mounted.

As described above, according to the spacer for an LED module according to the present invention, the LED module including the spacer, and the method for manufacturing the LED module, the spacer is provided with a thickness of the correction value, and is installed on the upper surface of the module substrate (100). A waterproof film (400) of a heat-resistant resin such as PET whose adhesion is slightly lowered by relaxing a sudden change in height between the upper surface of the module substrate (100) and the upper portion of the LED (200). When installing so as to cover (200), the waterproof film (400) can be tightly fixed to the upper surfaces of the LED (200) and the spacer (300) without being bent sharply. The adhesion of (400) can be greatly improved.
Thereby, even if the waterproof film (400) of the heat resistant resin capable of realizing the waterproofing of the high-brightness LED (200) having a large amount of heat generation is applied, the waterproof film (400) and the LED (200) are provided between the waterproof film (400) and the LED (200). The presence of air can be effectively blocked to prevent the LED module from deteriorating heat dissipation performance, optical performance, waterproof performance and durability, and appearance can be improved.

  From the above, the present invention has been described in detail only with the specific examples described, but it is obvious for ordinary engineers that various modifications and changes can be made within the scope of the technical idea of the present invention. Of course, such variations and modifications fall within the scope of the appended claims.

100 module substrate 110 substrate body 120 metal foil plate 200 LED
210 Solder 300 LED module spacer (spacer)
310 accommodation hole 400 waterproof film

Claims (13)

  A plurality of LEDs are mounted on a module substrate, and are provided in an LED module in which a waterproof film of a heat-resistant resin having light transmittance is closely fixed to the upper surface of the module substrate, installed on the upper surface of the module substrate, By correcting the height of the LED protruding from the upper surface of the module substrate, the spacer is provided in a plate shape corresponding to the planar shape of the module substrate as a spacer for improving the adhesion to the waterproof film, and the plurality of LEDs A plurality of receiving holes corresponding to each of the module board are formed and provided with a thickness of a correction value determined so as to reduce a difference between the height of the LED protruding from the upper surface of the module board and the height of the module board. LED module spacer.   The LED module spacer according to claim 1, wherein the LED module spacer is made of the same heat-resistant resin as the waterproof film so as to further improve the adhesion to the waterproof film.   The LED module spacer according to claim 2, wherein the heat resistant resin is polyethylene terephthalate (PET).   2. The spacer for LED module is made of any of polyethylene terephthalate (PET), polypropylene (PP), polyethylene naphthalate (PEN), and polyetherimide (PEI). LED module spacer.   5. The LED module according to claim 1, wherein the thickness of the correction value is 0.7 to 1.3 times the height of the LED protruding from the upper surface of the module substrate. Spacer for. A module substrate comprising a substrate body and a metal foil plate provided on the substrate body in a predetermined circuit pattern shape;
A plurality of LEDs mounted on the module substrate;
Provided in the form of a plate corresponding to the planar shape of the module substrate, a plurality of receiving holes respectively corresponding to the plurality of LEDs are formed, installed on the upper surface of the module substrate, and protruding from the upper surface of the module substrate A spacer for an LED module provided with a thickness of a correction value determined so as to reduce variations in the height of the LED and the height of the module substrate;
And a waterproof film that is made of a heat-resistant resin having light permeability and that is closely fixed to the LED module spacer and the LED;
LED module comprising:   The LED module according to claim 6, wherein the LED module spacer is made of the same heat-resistant resin as the waterproof film so that the adhesion to the waterproof film is further improved.   The LED module according to claim 7, wherein the heat resistant resin is polyethylene terephthalate (PET).   The said LED module spacer consists of either polyethylene terephthalate (PET; Polyethylene terephthalate), polypropylene (PP; Polypropylene), polyethylene naphthalate (PEN; Polyethylene naphthalate) and polyetherimide (PEI; Polyetherimide). LED module.   The thickness of the numerical value of the correction is 0.7 to 1.3 times the height of the LED protruding from the upper surface of the module substrate. LED module. Mounting a plurality of LEDs on a module substrate comprising a substrate body and a metal foil plate provided on the substrate body in a predetermined circuit pattern shape;
Provided in the form of a plate corresponding to the planar shape of the module substrate,
A plurality of accommodation holes respectively corresponding to the plurality of LEDs are formed, and thicknesses of correction values determined so as to alleviate a deviation between the height of the LED protruding from the upper surface of the module substrate and the height of the module substrate Installing the LED module spacer provided on the upper surface of the module substrate so that the LED is inserted and accommodated in the accommodation hole;
And a step of closely fixing a waterproof film made of a heat-resistant resin having light permeability so as to cover the LED module spacer and the LED;
The manufacturing method of the LED module containing this.   12. The method of manufacturing an LED module according to claim 11, wherein the numerical value of the correction is 0.7 to 1.3 times the height of the LED protruding from the upper surface of the module substrate. The LED module spacer is composed of the same heat resistant resin as the waterproof film so as to further improve the adhesion with the waterproof film,
The method for manufacturing an LED module according to claim 11 or 12, wherein the heat-resistant resin is polyethylene terephthalate (PET).

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