JP2015213408A5 - - Google Patents
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- Publication number
- JP2015213408A5 JP2015213408A5 JP2014095862A JP2014095862A JP2015213408A5 JP 2015213408 A5 JP2015213408 A5 JP 2015213408A5 JP 2014095862 A JP2014095862 A JP 2014095862A JP 2014095862 A JP2014095862 A JP 2014095862A JP 2015213408 A5 JP2015213408 A5 JP 2015213408A5
- Authority
- JP
- Japan
- Prior art keywords
- parallel
- bus bar
- terminal side
- negative electrode
- positive electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims 2
- 239000003990 capacitor Substances 0.000 claims 1
- 238000009499 grossing Methods 0.000 claims 1
Claims (1)
半導体パワーモジュールの前記正極端子および前記負極端子の側に、平滑コンデンサを設置し、互いに平行に、かつ互いの間に所定の距離が保持されるように固定された負極バスバと正極バスバとによって電気的に接続した、
ことを特徴とする電力変換装置。 A plurality of semiconductor power modules according to any one of claims 2 to 8 and claims 10 to 12 are arranged in parallel in a short direction,
A smoothing capacitor is installed on the positive electrode terminal side and the negative electrode terminal side of the semiconductor power module, and is electrically connected by a negative electrode bus bar and a positive electrode bus bar which are fixed in parallel to each other and maintained at a predetermined distance between each other. Connected,
The power converter characterized by the above-mentioned.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014095862A JP6288769B2 (en) | 2014-05-07 | 2014-05-07 | Semiconductor power module, power conversion device, and moving body using the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014095862A JP6288769B2 (en) | 2014-05-07 | 2014-05-07 | Semiconductor power module, power conversion device, and moving body using the same |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2015213408A JP2015213408A (en) | 2015-11-26 |
JP2015213408A5 true JP2015213408A5 (en) | 2017-04-13 |
JP6288769B2 JP6288769B2 (en) | 2018-03-07 |
Family
ID=54697373
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014095862A Active JP6288769B2 (en) | 2014-05-07 | 2014-05-07 | Semiconductor power module, power conversion device, and moving body using the same |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP6288769B2 (en) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10554123B2 (en) | 2016-12-14 | 2020-02-04 | Mitsubishi Electric Corporation | Power converter with a parallel flat plate conductor electrically connected with a capacitor and a power module |
JP6912560B2 (en) * | 2017-04-19 | 2021-08-04 | 三菱電機株式会社 | Semiconductor modules and power converters |
JP2019087668A (en) * | 2017-11-08 | 2019-06-06 | トヨタ自動車株式会社 | Bus bar |
JP6754387B2 (en) * | 2018-03-15 | 2020-09-09 | 本田技研工業株式会社 | Power converter |
JP7172326B2 (en) | 2018-09-14 | 2022-11-16 | 富士電機株式会社 | Semiconductor units, semiconductor modules and semiconductor devices |
JP7215265B2 (en) | 2019-03-19 | 2023-01-31 | 富士電機株式会社 | Semiconductor units, semiconductor modules and semiconductor devices |
JP7351209B2 (en) * | 2019-12-17 | 2023-09-27 | 富士電機株式会社 | semiconductor equipment |
JP2024038575A (en) | 2022-09-08 | 2024-03-21 | 三菱電機株式会社 | Semiconductor device, method for manufacturing semiconductor device, and power conversion apparatus |
CN115665970B (en) * | 2022-10-08 | 2023-11-21 | 江苏东海半导体股份有限公司 | IGBT drive protection circuit board |
JP2024120308A (en) * | 2023-02-24 | 2024-09-05 | ミネベアパワーデバイス株式会社 | Semiconductor Module |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59177951A (en) * | 1983-03-29 | 1984-10-08 | Toshiba Corp | Semiconductor device |
JP2894402B2 (en) * | 1992-07-20 | 1999-05-24 | 富士電機株式会社 | Semiconductor device |
JP3550970B2 (en) * | 1997-09-19 | 2004-08-04 | 株式会社日立製作所 | Power converter, multilayer laminated conductor and electrical component connector |
JPH11177017A (en) * | 1997-12-16 | 1999-07-02 | Nippon Inter Electronics Corp | Composite semiconductor device |
JP4540884B2 (en) * | 2001-06-19 | 2010-09-08 | 三菱電機株式会社 | Semiconductor device |
JP2004014547A (en) * | 2002-06-03 | 2004-01-15 | Toshiba Corp | Semiconductor device and capacitance regulating circuit |
JP4276037B2 (en) * | 2003-09-18 | 2009-06-10 | 三菱電機株式会社 | Semiconductor module |
JP2013140889A (en) * | 2012-01-05 | 2013-07-18 | Hitachi Ltd | Power module |
JP5835167B2 (en) * | 2012-09-07 | 2015-12-24 | トヨタ自動車株式会社 | Power module structure |
-
2014
- 2014-05-07 JP JP2014095862A patent/JP6288769B2/en active Active
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