JP2015209303A - Lifting device and unit transportation method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To easily perform height adjustment for a unit of a CMP device.SOLUTION: A lifting device 630 includes: a plate 670 which supports an underside of at least one unit of a CMP device; a lifting mechanism 640 which is provided between a floor surface, on which the CMP device is located, and the plate 670, and can adjust the height of the unit with respect to the floor surface; a height adjustment grip 650 which is provided on the lifting mechanism 640; and an adjustment member 660 which can adjust the height of the lifting mechanism 640. The adjustment member 660 has a connection part 662 which is connected to the height adjustment grip 650, an extension part 664 which is extended from the connection part 662, and an operation part 666 which is provided on the extension part 664, and can adjust the height of the lifting mechanism 640 via the height adjustment grip 650 by operation for the operation part 666.

Description

  The present invention relates to a lifting device and a unit conveying method.

  In recent years, a substrate processing apparatus has been used to polish the surface of a substrate such as a semiconductor wafer. The substrate processing apparatus includes, for example, a polishing unit for performing substrate polishing processing, a cleaning unit for performing substrate cleaning processing and drying processing, a load / unload unit for performing substrate transport processing, and the like. Configured. The substrate processing apparatus, for example, transports the substrate put into the load / unload unit to the polishing unit to perform the polishing process, transports the polished substrate to the cleaning unit, performs the cleaning and drying processes, and then performs drying. The substrate that has been processed is configured to be discharged out of the substrate processing apparatus from the load / unload unit.

  The substrate processing apparatus is divided into a plurality of units when carried into an operating place such as a semiconductor factory, and after the loading, each unit is assembled and installation work is performed. For example, when performing maintenance on a unit, the substrate processing apparatus is difficult to perform maintenance while a plurality of units are assembled. Therefore, the unit to be maintained is removed from the substrate processing apparatus for maintenance.

  Here, in the prior art, in order to remove the unit to be maintained from the board device, it is known that the unit is pulled out and conveyed using a caster leg having an adjustable length having a roller that can roll in the unit pulling direction. ing.

JP 2012-209589 A

  However, the prior art does not consider that the height of the unit of the substrate processing apparatus is easily adjusted.

  That is, according to the conventional technique, the frame of the unit is supported by the fixed legs in a state where the unit is not pulled out and conveyed. On the other hand, in the prior art, when the unit is pulled out and conveyed, the frame of the unit is supported by the caster legs by adjusting the length of the caster legs to be longer than the length of the fixed legs. In the prior art, the unit is pulled out and conveyed by rolling a roller using a ball screw mechanism in a state where the frame is supported by the caster legs.

  In the prior art, it is necessary to adjust the length of the caster leg (adjusting the height of the unit) in order to support the frame of the unit with the caster leg. This is done by turning the screw.

Here, for example, the caster leg that supports the position corresponding to the outer peripheral portion of the substrate processing apparatus is located near the work place outside the substrate processing apparatus, so that the worker can easily access it. On the other hand, since the caster leg that supports a position corresponding to the inside of the substrate processing apparatus is located at a distance from the work place, it may be difficult for a worker to access. In particular, the difficulty in accessing the caster legs becomes more prominent as the size of each unit increases and the substrate processing apparatus increases in size.

  Accordingly, an object of the present invention is to easily adjust the height of a unit of a substrate processing apparatus.

  One form of the lifting device according to the present invention has been made in view of the above problems, and is provided with a plate that supports the lower surface of at least one unit of a substrate processing apparatus configured by assembling a plurality of units, and the substrate processing apparatus. An elevating mechanism provided between the floor surface and the plate, the height elevating mechanism capable of adjusting the height of the at least one unit relative to the floor surface, and an extending portion extending from the elevating mechanism along the plate, An adjusting member capable of operating the elevating mechanism via the extending portion.

  Moreover, in one form of the raising / lowering device, it further comprises a height adjusting knob provided in the raising / lowering mechanism, and the adjusting member is connected to the height adjusting knob, and the connecting portion is connected to the plate from the connecting portion. The elevating mechanism may be operable via the height adjustment knob by an operation on the operation unit.

  In one form of the lifting device, the lifting mechanism is provided on the floor side at one end of the plate, and the lifting device is provided on the floor side at the other end of the plate. And a height adjusting adjuster capable of adjusting a height of the at least one unit relative to the floor surface, and the extending portion may extend from the connecting portion in the direction of the height adjusting adjuster.

  Moreover, in one form of the lifting device, the lifting mechanism is laminated between the floor surface and the plate, and has a first member and a second member having opposing surfaces that are not horizontal to each other, the first member, A third member provided in a wedge shape between the first member and the second member by slidingly driving the third member. May be adjustable.

  Moreover, in one form of the lifting device, the lifting device may be a jig that lifts and lowers the at least one unit when transporting the at least one unit using a carriage.

  Moreover, the unit conveyance method of this invention is the process which lifts the at least 1 unit of the substrate processing apparatus comprised by assembling several units using the raising / lowering apparatus of any one of Claims 1-4, and the said lifting The step of inserting a carriage into a lower space of the at least one unit after the step, and after the insertion step until the at least one unit is mounted on the carriage. A step of lowering using a lifting device, and a step of pulling out and conveying at least one unit mounted on the cart using the cart.

  According to this invention of this application, the height adjustment of the unit of a substrate processing apparatus can be performed easily.

FIG. 1 is a plan view showing the overall configuration of the substrate processing apparatus of the present embodiment. FIG. 2 is a perspective view schematically showing the polishing unit. FIG. 3A is a plan view showing the cleaning unit, and FIG. 3B is a side view showing the cleaning unit. FIG. 4 is a diagram schematically showing a state when the cleaning unit 4 is pulled out and conveyed. FIG. 5 is a perspective view of the lifting device 630 of the present embodiment. FIG. 6 is a side view of the lifting device 630 of the present embodiment. FIG. 7 is a perspective view of the lifting device 630 of the present embodiment. FIG. 8 is an enlarged perspective view of one end of the lifting device 630 of the present embodiment. FIG. 9 is an enlarged perspective view of the other end of the lifting device 630 of the present embodiment. FIG. 10 is a cross-sectional view of the elevating mechanism along the cross section α in FIG. 9. FIG. 11 is a diagram for explaining the operation of the lifting device 630 of the present embodiment. FIG. 12 is a perspective view of the cart 700. FIG. 13 is a bottom view of the carriage 700. FIG. 14 is a flowchart of the unit conveyance method of the present embodiment.

  Hereinafter, a lifting device and a unit conveying method according to an embodiment of the present invention will be described with reference to the drawings. Hereinafter, a CMP apparatus will be described as an example of a substrate processing apparatus, but the present invention is not limited to this. Hereinafter, a substrate processing apparatus including the load / unload unit 2, the polishing unit 3, the cleaning unit 4, and the control unit 5 will be described, but the present invention is not limited to this.

  First, the structure of the CMP apparatus will be described, and then the lifting apparatus and unit transport method will be described.

<Substrate processing equipment>
FIG. 1 is a plan view showing the overall configuration of a substrate processing apparatus according to an embodiment of the present invention. As shown in FIG. 1, the CMP apparatus includes a substantially rectangular housing 1, and the inside of the housing 1 is divided into a load / unload unit 2, a polishing unit 3, and a cleaning unit 4 by partition walls 1a and 1b. Has been. The load / unload unit 2, the polishing unit 3, and the cleaning unit 4 are assembled independently and exhausted independently. The CMP apparatus also includes a control unit 5 that controls various operations of the CMP apparatus.

<Load / Unload unit>
The load / unload unit 2 includes two or more (four in this embodiment) front load units 20 on which wafer cassettes for stocking a large number of wafers (substrates) are placed. These front load portions 20 are arranged adjacent to the housing 1 and are arranged along the width direction (direction perpendicular to the longitudinal direction) of the substrate processing apparatus. The front load unit 20 can be equipped with an open cassette, a SMIF (Standard Manufacturing Interface) pod, or a FOUP (Front Opening Unified Pod). Here, SMIF and FOUP are sealed containers that can maintain an environment independent of the external space by accommodating a wafer cassette inside and covering with a partition wall.

The load / unload unit 2 has a traveling mechanism 21 laid along the front load portion 20, and two transfer robots that can move along the arrangement direction of the wafer cassettes on the traveling mechanism 21. (Loader, transport mechanism) 22 is installed. The transfer robot 22 can access the wafer cassette mounted on the front load unit 20 by moving on the traveling mechanism 21. Each transfer robot 22 has two hands up and down. The upper hand is used when returning processed wafers to the wafer cassette. The lower hand is used when a wafer before processing is taken out from the wafer cassette. In this way, the upper and lower hands can be used properly. Furthermore, the lower hand of the transfer robot 22 is configured to be able to reverse the wafer by rotating around its axis.

  Since the load / unload unit 2 is an area where it is necessary to maintain the cleanest state, the load / unload unit 2 has a higher pressure inside the CMP apparatus, the polishing unit 3 and the cleaning unit 4 than the CMP apparatus. Always maintained. The polishing unit 3 is the most dirty region because slurry is used as the polishing liquid. Therefore, a negative pressure is formed inside the polishing unit 3, and the pressure is maintained lower than the internal pressure of the cleaning unit 4. The load / unload unit 2 is provided with a filter fan unit (not shown) having a clean air filter such as a HEPA filter, a ULPA filter, or a chemical filter. From the filter fan unit, particles, toxic vapor, Clean air from which toxic gases have been removed is constantly blowing out.

<Polishing unit>
The polishing unit 3 is a region where the wafer is polished (flattened), and includes a first polishing unit 3A, a second polishing unit 3B, a third polishing unit 3C, and a fourth polishing unit 3D. The first polishing unit 3A, the second polishing unit 3B, the third polishing unit 3C, and the fourth polishing unit 3D are arranged along the longitudinal direction of the substrate processing apparatus as shown in FIG.

  As shown in FIG. 1, the first polishing unit 3A includes a polishing table 30A to which a polishing pad 10 having a polishing surface is attached, and polishing while holding the wafer and pressing the wafer against the polishing pad 10 on the polishing table 30A. A top ring 31A for polishing, a polishing liquid supply nozzle 32A for supplying a polishing liquid or a dressing liquid (for example, pure water) to the polishing pad 10, and a dresser 33A for dressing the polishing surface of the polishing pad 10. And an atomizer 34A for spraying a mixed fluid of liquid (for example, pure water) and gas (for example, nitrogen gas) or a liquid (for example, pure water) to the polishing surface in the form of a mist.

  Similarly, the second polishing unit 3B includes a polishing table 30B to which the polishing pad 10 is attached, a top ring 31B, a polishing liquid supply nozzle 32B, a dresser 33B, and an atomizer 34B. The third polishing unit 3C includes a polishing table 30C to which the polishing pad 10 is attached, a top ring 31C, a polishing liquid supply nozzle 32C, a dresser 33C, and an atomizer 34C. The fourth polishing unit 3D includes a polishing table 30D to which the polishing pad 10 is attached, a top ring 31D, a polishing liquid supply nozzle 32D, a dresser 33D, and an atomizer 34D.

  Since the first polishing unit 3A, the second polishing unit 3B, the third polishing unit 3C, and the fourth polishing unit 3D have the same configuration, the first polishing unit 31A will be described below.

FIG. 2 is a perspective view schematically showing the first polishing unit 3A. The top ring 31 </ b> A is supported by the top ring shaft 36. A polishing pad 10 is affixed to the upper surface of the polishing table 30A, and the upper surface of the polishing pad 10 constitutes a polishing surface for polishing the wafer W. Note that fixed abrasive grains may be used in place of the polishing pad 10. The top ring 31 </ b> A and the polishing table 30 </ b> A are configured to rotate around their axes as indicated by arrows by a drive unit (not shown). For this reason, the gas-liquid two-phase flow containing the polishing abrasive liquid supplied to the polishing pad 10 flows outward of the polishing pad 10 by centrifugal force. The wafer W is held on the lower surface of the top ring 31A by vacuum suction. At the time of polishing, the polishing liquid is supplied from the polishing liquid supply nozzle 32A to the polishing surface of the polishing pad 10, and the wafer W to be polished is pressed against the polishing surface by the top ring 31A and polished.

  Next, a transport mechanism for transporting the wafer will be described. As shown in FIG. 1, a first linear transporter 6 is disposed adjacent to the first polishing unit 3A and the second polishing unit 3B. The first linear transporter 6 has four transfer positions (first transfer position TP1, second transfer position TP2, and third transfer in order from the load / unload unit side) along the direction in which the polishing units 3A and 3B are arranged. This is a mechanism for transferring the wafer between the position TP3 and the fourth transfer position TP4.

  Further, the second linear transporter 7 is disposed adjacent to the third polishing unit 3C and the fourth polishing unit 3D. The second linear transporter 7 has three transfer positions (a fifth transfer position TP5, a sixth transfer position TP6, and a seventh transfer in order from the load / unload unit side) along the direction in which the polishing units 3C and 3D are arranged. This is a mechanism for transporting the wafer between the positions TP7.

  The wafer is transferred to the polishing units 3A and 3B by the first linear transporter 6. The top ring 31A of the first polishing unit 3A moves between the polishing position and the second transport position TP2 by the swing operation of the top ring head. Therefore, the wafer is transferred to the top ring 31A at the second transfer position TP2. Similarly, the top ring 31B of the second polishing unit 3B moves between the polishing position and the third transfer position TP3, and the delivery of the wafer to the top ring 31B is performed at the third transfer position TP3. The top ring 31C of the third polishing unit 3C moves between the polishing position and the sixth transfer position TP6, and the delivery of the wafer to the top ring 31C is performed at the sixth transfer position TP6. The top ring 31D of the fourth polishing unit 3D moves between the polishing position and the seventh transfer position TP7, and the delivery of the wafer to the top ring 31D is performed at the seventh transfer position TP7.

  A lifter 11 for receiving a wafer from the transfer robot 22 is disposed at the first transfer position TP1. The wafer is transferred from the transfer robot 22 to the first linear transporter 6 through the lifter 11. A shutter (not shown) is provided between the lifter 11 and the transfer robot 22 in the partition wall 1a. When the wafer is transferred, the shutter is opened so that the wafer is transferred from the transfer robot 22 to the lifter 11. It has become. A swing transporter 12 is disposed between the first linear transporter 6, the second linear transporter 7, and the cleaning unit 4. The swing transporter 12 has a hand that can move between the fourth transfer position TP4 and the fifth transfer position TP5, and transfers the wafer from the first linear transporter 6 to the second linear transporter 7. Is performed by the swing transporter 12. The wafer is transferred to the third polishing unit 3C and / or the fourth polishing unit 3D by the second linear transporter 7. Further, the wafer polished by the polishing unit 3 is conveyed to the cleaning unit 4 via the swing transporter 12.

<Washing unit>
FIG. 3A is a plan view showing the cleaning unit 4, and FIG. 3B is a side view showing the cleaning unit 4. As shown in FIGS. 3A and 3B, the cleaning unit 4 includes a first cleaning chamber 190, a first transfer chamber 191, a second cleaning chamber 192, a second transfer chamber 193, and a drying unit. It is partitioned into a chamber 194. In the first cleaning chamber 190, an upper primary cleaning module 201A and a lower primary cleaning module 201B arranged in the vertical direction are arranged. The upper primary cleaning module 201A is disposed above the lower primary cleaning module 201B. Similarly, in the second cleaning chamber 192, an upper secondary cleaning module 202A and a lower secondary cleaning module 202B arranged in the vertical direction are arranged. The upper secondary cleaning module 202A is disposed above the lower secondary cleaning module 202B. The primary and secondary cleaning modules 201A, 201B, 202A, and 202B are cleaning machines that clean the wafer using a cleaning liquid. Since these primary and secondary cleaning modules 201A, 201B, 202A, 202B are arranged along the vertical direction, there is an advantage that the footprint area is small.

  A temporary wafer placement table 203 is provided between the upper secondary cleaning module 202A and the lower secondary cleaning module 202B. In the drying chamber 194, an upper drying module 205A and a lower drying module 205B arranged in the vertical direction are arranged. These upper drying module 205A and lower drying module 205B are isolated from each other. Filter fan units 207 and 207 for supplying clean air into the drying modules 205A and 205B are provided above the upper drying module 205A and the lower drying module 205B, respectively. The upper primary cleaning module 201A, the lower primary cleaning module 201B, the upper secondary cleaning module 202A, the lower secondary cleaning module 202B, the temporary placement table 203, the upper drying module 205A, and the lower drying module 205B are arranged on a frame (not shown). It is fixed via bolts.

  A first transfer robot (transfer mechanism) 209 that can move up and down is arranged in the first transfer chamber 191, and a second transfer robot 210 that can move up and down is arranged in the second transfer chamber 193. The first transfer robot 209 and the second transfer robot 210 are movably supported by support shafts 211 and 212 extending in the vertical direction. The first transfer robot 209 and the second transfer robot 210 have a drive mechanism such as a motor inside thereof, and are movable up and down along the support shafts 211 and 212. The first transfer robot 209 has two upper and lower hands like the transfer robot 22. As shown by the dotted line in FIG. 3A, the first transfer robot 209 is disposed at a position where the lower hand can access the temporary table 180 described above. When the lower hand of the first transfer robot 209 accesses the temporary table 180, a shutter (not shown) provided on the partition wall 1b is opened.

  The first transfer robot 209 transfers the wafer W between the temporary placing table 180, the upper primary cleaning module 201A, the lower primary cleaning module 201B, the temporary placing table 203, the upper secondary cleaning module 202A, and the lower secondary cleaning module 202B. Operates to carry. The first transfer robot 209 uses the lower hand when transferring the wafer before cleaning (the wafer to which the slurry is attached), and uses the upper hand when transferring the cleaned wafer. The second transfer robot 210 operates to transfer the wafer W between the upper secondary cleaning module 202A, the lower secondary cleaning module 202B, the temporary placement table 203, the upper drying module 205A, and the lower drying module 205B. Since the second transfer robot 210 transfers only the cleaned wafer, it has only one hand. The transfer robot 22 shown in FIG. 1 takes out the wafer from the upper drying module 205A or the lower drying module 205B using the upper hand, and returns the wafer to the wafer cassette. When the upper hand of the transfer robot 22 accesses the drying modules 205A and 205B, a shutter (not shown) provided on the partition wall 1a is opened.

<Elevating device>
Next, the lifting device will be described. As described above, the CMP apparatus includes the load / unload unit 2, the polishing unit 3a, the polishing unit 3b, the cleaning unit 4, and the control unit 5. These units are manufactured independently and transported to an installation place (operation place) of the substrate processing apparatus. The CMP apparatus is assembled by assembling a plurality of transported units. For example, when performing maintenance on a unit, it is difficult to perform maintenance if a plurality of units are assembled. Therefore, the maintenance target unit is removed from the CMP apparatus for maintenance. In order to remove the maintenance target unit from the CMP apparatus, in this embodiment, the maintenance target unit is pulled out and transported using a lifting device.

  Hereinafter, as a representative of the plurality of units, the drawer conveyance with respect to the cleaning unit 4 will be described. FIG. 4 is a diagram schematically showing a state when the cleaning unit 4 is pulled out and conveyed.

  As shown in FIG. 4, when the cleaning unit 4 is pulled out and transported for maintenance or the like, a carriage 700 is interposed between the floor surface 690 on which the cleaning unit 4 (CMP apparatus) is installed and the cleaning unit 4. The cleaning unit 4 is pulled out and conveyed by the carriage 700. Here, in order to place the cleaning unit 4 on the carriage 700, it is necessary to raise and lower the cleaning unit 4. For this reason, when the cleaning unit 4 is pulled out and transported, an elevating device 630 capable of moving the cleaning unit 4 up and down is provided between the floor surface 690 and the cleaning unit 4.

  Incidentally, the control unit 5 is installed adjacent to the cleaning unit 4 in the area A of FIG. In the region B, the polishing units 3 a and 3 b are installed adjacent to the cleaning unit 4. In the area C, the load / unload unit 2 is installed adjacent to the cleaning unit 4. Therefore, the work place when the cleaning unit 4 is pulled out and conveyed is the region D. An operator needs to raise and lower the entire cleaning unit 4 by operating the lifting device 630 from the work place in the region D. Here, a place close to the work place in the region D is easily accessible by a worker (easy to reach). On the other hand, a place far from the work place in the area D (a place adjacent to the area B of the cleaning unit 4) is difficult for a worker to access (it is hard to reach). Further, the difficulty in accessing a location far from the work place in the region D (a location adjacent to the region B of the cleaning unit 4) becomes more prominent as the size of the cleaning unit 4 increases and the CMP apparatus increases in size.

  Therefore, in the present embodiment, the lifting device 630 that can easily adjust the height of the cleaning unit 4 (or another unit) is realized. Hereinafter, the elevating device 630 will be described.

  FIG. 5 is a perspective view of the lifting device 630 of the present embodiment. FIG. 6 is a side view of the lifting device 630 of the present embodiment. FIG. 7 is a perspective view of the lifting device 630 of the present embodiment. FIG. 8 is an enlarged perspective view of one end of the lifting device 630 of the present embodiment. FIG. 9 is an enlarged perspective view of the other end of the lifting device 630 of the present embodiment. FIG. 10 is a cross-sectional view of the elevating mechanism along the cross section α in FIG. 9. FIG. 11 is a diagram for explaining the operation of the lifting device 630 of the present embodiment.

  As shown in FIGS. 5 to 11, the lifting device 630 is provided between the plate 670 that supports the lower surface of the cleaning unit 4, and the plate 670 and the floor surface 690, and increases the height of the cleaning unit 4 relative to the floor surface 690. An adjustable lifting mechanism 640 and an adjusting member 660 connected to the lifting mechanism 640 are provided. The adjustment member 660 has an extending portion (rod) 664 extending from the elevating mechanism 640 along the plate 670, and the elevating mechanism 640 can be operated via the extending portion 664. Specifically, the lifting device 630 has a height adjustment knob 650 provided in the lifting mechanism 640, and the adjustment member 660 is connected to the height adjustment knob 650. The lifting mechanism 640 is provided on the floor surface 690 side at one end of the plate 670. The lifting device 630 includes two height adjusting adjusters 680 that are provided on the floor surface 690 side at the other end of the plate 670 and can adjust the height of the cleaning unit 4 with respect to the floor surface 690.

  As shown in FIG. 10, the elevating mechanism 640 includes a first member 642 and a second member 644 stacked between the floor surface 690 and the plate 670. The first member 642 and the second member 644 are formed with opposing surfaces 642a and 644a that are not horizontal to each other. The opposing surfaces 642a and 644a are formed in a wedge shape in a side view. The elevating mechanism 640 includes a third member 646 provided in a wedge shape between the first member 642 and the second member 644. The elevating mechanism 640 includes a substantially circular fourth member 648 provided on the upper portion of the first member 642. The elevating mechanism 640 is fixed to the plate 670 by bolts 649.

  The height adjustment knob 650 can adjust the height of the cleaning unit 4 with respect to the floor surface 690 by driving the elevating mechanism 640 (third member 646) (the cleaning unit 4 can be lifted and lowered). ) Member. Specifically, by rotating the height adjustment knob 650, a bolt (not shown) that is interlocked with the height adjustment knob 650 rotates, and the third member 646 is slid and driven by the rotation of the bolt.

  The adjustment member 660 includes a connection portion 662 connected to the height adjustment knob 650, a rod-like extension portion (rod) 664 extending from the connection portion 662 along the plate 670, and an operation portion 666 provided in the extension portion 664. Have The adjustment member 660 can operate the elevating mechanism 640 via the height adjustment knob 650 by operating the operation unit 666. The extending portion 664 passes through the inside of the two saddles 682 fixed to the floor surface 690 side of the plate 670 and extends in the direction of the height adjusting adjuster 680. The saddle 682 restricts the lifting device 630 from rotating around the bolt 649. The extending portion 664 is not supported by the saddle 682 and is supported only by the lifting mechanism 640. The operation unit 666 is covered with a stopper 684. The stopper 684 is fixed to the rising portion 672 at the end of the plate 670 by a bracket 686. The stopper 684 and the bracket 686 are removed when the height of the cleaning unit 4 is adjusted using the lifting device 630. In the present embodiment, the connecting portion 662 is provided at the first end of the extending portion 664 and the operating portion 666 is provided at the second end of the extending portion 664. However, the present invention is not limited to this. .

  The adjustment member 660 can drive the elevating mechanism 640 (third member 646) via the height adjustment knob 650 by an operation on the operation unit 666. Specifically, when the operator rotates the operation unit 666 around the extending axis of the extending unit 664 by using a tool, the extending unit 664 rotates, and the connection unit 662 and the level adjustment knob 650 are interlocked with this. Rotate. In the present embodiment, an example in which the worker rotates the operation unit 666 using a tool has been described, but the present invention is not limited to this. The operator can also rotate the operation unit 666 using an electric appliance or the like.

  For example, as shown in FIG. 11A, when the height adjustment knob 650 is rotated in one direction (for example, counterclockwise) via the adjustment member 660, the third member 646 moves away from the height adjustment knob 650. Slide driven. When the third member 646 is slid in the direction away from the height adjustment knob 650, the second member 644 moves in a direction approaching the floor surface 690, and the first member 642 and the second member 644 are relatively moved. Get closer. Thereby, the height with respect to the floor surface 690 of the washing | cleaning unit 4 becomes low.

  On the other hand, as shown in FIG. 11B, when the height adjustment knob 650 is rotated in the opposite direction (for example, clockwise) via the adjustment member 660, the third member 646 slides in a direction approaching the height adjustment knob 650. Driven. When the third member 646 is slid and driven in a direction approaching the height adjustment knob 650, the second member 644 moves away from the floor surface 690, and the first member 642 and the second member 644 are relatively moved. Leave. Thereby, the height with respect to the floor surface 690 of the washing | cleaning unit 4 becomes high.

Further, as shown in FIG. 11C, when the height adjustment knob 650 is rotated in the same direction as in FIG. 11B (for example, clockwise) via the adjustment member 660, the third member 646 is moved to the height adjustment knob 650. It is driven to slide in the approaching direction. When the third member 646 is slid and driven in the direction approaching the height adjustment knob 650, the second member 644 moves further away from the floor surface 690, and the first member 642 and the second member 644 are further relative to each other. Leave. Thereby, the height with respect to the floor surface 690 of the washing | cleaning unit 4 becomes still higher.

<Dolly>
Next, the cart 700 will be described. FIG. 12 is a perspective view of the cart 700. FIG. 13 is a bottom view of the carriage 700.

  As shown in FIGS. 12 and 13, the carriage 700 includes a pair of arm members 710 and 720 that extend in parallel, a connecting member 730 that connects the arm members 710 and 720, and a floor surface 690 of each of the arm members 710 and 720. A plurality of caster members 740 provided on the side. Three caster members 740 are provided for each of the arm members 710 and 720. The caster member 740 includes wheels 742 that can roll along the extending direction of the arm members 710 and 720.

<Unit transport method>
Next, the unit conveyance method will be described. FIG. 14 is a flowchart of the unit conveyance method of the present embodiment.

  As shown in FIG. 14, in the unit transport method, first, the elevating device 630 is installed in the lower space of the cleaning unit 4 (step S <b> 101). Specifically, as shown in FIG. 4, the worker installs lifting devices 630 in two places in the lower space of the cleaning unit 4. More specifically, the elevating mechanism 640 is disposed on the side far from the region D (the side closer to the region B), and the elevating device 630 is disposed so that the height adjustment adjuster 680 is disposed on the side near the region D. To do. Note that the installation location and the number of installation of the lifting device 630 are not limited to the present embodiment, but are arbitrary.

  Subsequently, in the unit transport method, the cleaning unit 4 is lifted using the lifting mechanism 640 (step S102). Specifically, the worker lifts the cleaning unit 4 by rotating the operation unit 666 clockwise, for example, using a tool or the like.

  Subsequently, in the unit transport method, the cleaning unit 4 is lifted using the height adjustment adjuster 680 (step S103). Specifically, the worker lifts the cleaning unit 4 by rotating the bolts of the two height adjustment adjusters 680 clockwise, for example.

  Subsequently, in the unit transport method, it is determined whether or not the cleaning unit 4 has been lifted to a height at which the carriage can be inserted (step S104). When it is determined that the cleaning unit 4 has not been lifted to a height at which the carriage can be inserted (No at Step S104), the unit transport method returns to Step S102.

  In other words, the unit transport method is to lift the cleaning unit 4 using the lifting mechanism 640 and the height adjustment adjuster 680 until the cleaning unit 4 is lifted to a height at which the carriage can be inserted. Note that the order of step S102 and step S103 may be reversed.

When it is determined that the cleaning unit 4 has been lifted to a height at which the carriage can be inserted (Yes in step S104), the unit transport method inserts the carriage 700 into the lower space of the cleaning unit 4 (step S105). Specifically, as shown in FIG. 4, the worker inserts the carriage 700 into the lower space at both ends of the cleaning unit 4. In addition, the insertion place and the number of carts 700 are not limited to the present embodiment, but are arbitrary.

  Subsequently, in the unit conveying method, the cleaning unit 4 is lowered using the lifting mechanism 640 (step S106). Specifically, the worker lowers the cleaning unit 4 by rotating the operation unit 666, for example, counterclockwise using a tool or the like.

  Subsequently, in the unit transport method, the cleaning unit 4 is lowered using the height adjustment adjuster 680 (step S107). Specifically, the worker lowers the cleaning unit 4 by rotating the bolts of the two height adjustment adjusters 680 counterclockwise, for example.

  Subsequently, the unit conveying method determines whether or not the cleaning unit 4 is mounted on the carriage (step S108). When it is determined that the cleaning unit 4 is not mounted on the carriage (No at Step S108), the unit transport method returns to Step S106.

  In other words, the unit transport method is to lower the cleaning unit 4 using the lifting mechanism 640 and the height adjustment adjuster 680 until the cleaning unit 4 is mounted on the carriage. Note that the order of step S106 and step S107 may be reversed.

  When it is determined that the cleaning unit 4 is mounted on the carriage (step S108, Yes), the unit transport method uses the carriage 700 to pull out and transport the cleaning unit 4 (step S109). Specifically, the worker pulls out the cleaning unit 4 by pulling the carriage 700 and rolling the wheels 742 along the extending direction of the arm members 710 and 720.

  As described above, according to the present embodiment, by providing the adjustment member 660, the operation unit 666 for driving the elevating mechanism 640 (the third member 646) is positioned at or near the work place of the worker. Will do. For this reason, the worker can easily access the lifting mechanism 640 located at a place far from the work place. As a result, according to the present embodiment, the height of the cleaning unit 4 can be easily adjusted regardless of the size of the CMP apparatus, and as a result, the cleaning unit 4 can be easily pulled out and conveyed. Also, the load / unload unit 2, the polishing unit 3a, the polishing unit 3b, and the control unit 5 can be easily adjusted in height similarly to the cleaning unit 4, and as a result, the unit can be easily pulled out. Can be transported.

2 Load / unload unit 3 Polishing unit 3a, 3b Polishing unit 4 Cleaning unit 5 Control unit 630 Lifting device 640 Lifting mechanism 642a, 644a Opposing surface 642 First member 644 Second member 646 Third member 648 Fourth member 660 Adjustment member 662 Connection portion 664 Extension portion 666 Operation portion 670 Plate 680 Height adjustment adjuster 690 Floor surface 700 Dolly 710, 720 Arm member 730 Connection member 740 Caster member 742 Wheel

Claims (6)

A plate that supports the lower surface of at least one unit of the substrate processing apparatus configured by assembling a plurality of units;
An elevating mechanism provided between the floor on which the substrate processing apparatus is installed and the plate, and capable of adjusting the height of the at least one unit relative to the floor;
An adjusting member having an extending part extending along the plate from the elevating mechanism, and capable of operating the elevating mechanism through the extending part;
Elevating device equipped with. The lifting device of claim 1,
Further comprising a height adjustment knob provided in the lifting mechanism,
The adjustment member includes a connection portion connected to the height adjustment knob, the extension portion extending from the connection portion along the plate, and an operation portion provided in the extension portion, and the operation portion. The lifting mechanism can be operated via the height adjustment knob by an operation on
A lifting device characterized by that. The lifting device of claim 2,
The lifting mechanism is provided on the floor surface side at one end of the plate,
The lifting device further includes a height adjustment adjuster provided on the floor surface side at the other end of the plate and capable of adjusting the height of the at least one unit relative to the floor surface,
The extending portion extends from the connecting portion in the direction of the height adjusting adjuster.
A lifting device characterized by that. In the raising / lowering apparatus of any one of Claims 1-3,
The elevating mechanism is wedge-shaped between the first member and the second member, and the first member and the second member that are stacked between the floor surface and the plate and have opposing surfaces that are not horizontal to each other. A third member provided in
The height adjusting knob can adjust the distance between the first member and the second member by slidingly driving the third member.
A lifting device characterized by that. In the raising / lowering device of any one of Claims 1-4,
The lifting device is a jig that lifts and lowers the at least one unit when transporting the at least one unit using a carriage.
A lifting device characterized by that. Lifting at least one unit of a substrate processing apparatus configured by assembling a plurality of units using the lifting device according to any one of claims 1 to 5;
After the lifting step, inserting a carriage into the lower space of the at least one unit;
After the insertion step, the step of lowering the at least one unit using the lifting device according to any one of claims 1 to 5 until it is mounted on the carriage,
Drawing and transporting at least one unit mounted on the carriage using the carriage;
A unit conveying method comprising the steps of:

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