JP2015206722A - Wiring circuit board and temperature sensing element - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a wiring circuit board, etc., with which it is possible to suppress the mechanical breakdown of an insulated layer, etc., in even repetitive high temperature measurements.SOLUTION: Provided is a wiring circuit board 3 comprising an insulated circuit board 1 having a plurality of insulated layers 1a which are mutually laminated and a plurality of intercalations between the plurality of insulated layers 1a, and a plurality of meandering conductors 2, each disposed in different intercalations, which consist of platinum or a metallic material composed mainly of platinum, the plurality of meandering conductors being disposed so that those mutually adjacent in the direction of lamination intersect each other at right angles in a plane perspective.

Description

  The present invention relates to a wiring board in which platinum (including) meandering conductors are provided between a plurality of insulating layers stacked on each other, and a temperature measuring element including the wiring board.

  As a sensor for detecting a temperature in a fluid such as exhaust gas at a high temperature (for example, about several hundred to 1,000 ° C.), a sensor using a change in electric resistance of a metal material with temperature is known. As the metal material, platinum (including) is often used from the viewpoints of oxidation resistance at high temperature and temperature dependency of the resistance value.

  As a part constituting a sensor containing a metal material for temperature measurement, for example, a linear conductor made of a platinum metallized layer or a thin film layer between a plurality of laminated insulating layers made of a ceramic sintered body or the like. A wiring board provided with is known.

JP-A-11-121214

  However, in the above-described prior art wiring board and the like, with repeated use at high temperatures, a relatively large thermal stress due to a difference in thermal expansion coefficient (linear expansion coefficient) between the meandering conductor and the insulating layer is a plurality of It works repeatedly in the same direction between layers. Therefore, for example, there is a problem that mechanical destruction such as cracks in the meandering conductor or the insulating layer due to the thermal stress is likely to occur at the interface portion between the meandering conductor and the insulating layer.

  A wiring board according to an aspect of the present invention includes a plurality of insulating layers stacked on each other, and an insulating substrate having a plurality of layers between the plurality of insulating layers, and disposed between the different layers. A plurality of meander-like conductors made of (or a metal material containing platinum as a main component), and the plurality of meander-like conductors are adjacent to each other in the stacking direction so as to be orthogonal to each other in plan view. Has been placed.

  A temperature measuring element according to one aspect of the present invention includes the wiring board having the above-described configuration and a temperature measuring terminal electrically connected to the meander conductor of the wiring board.

  Since the wiring board according to one aspect of the present invention has the above-described configuration, the directions in which the straight portions of the meandering conductors are arranged between the upper and lower layers are orthogonal to each other. In other words, the directions in which the thermal stress generated between the meandering conductor and the insulating layer acts between the upper and lower layers are orthogonal to each other between the upper and lower layers. Therefore, it is suppressed that thermal stress concentrates in the same direction between a plurality of layers. Therefore, it is possible to provide a wiring board in which the occurrence of mechanical destruction such as cracks in the meandering conductor or the insulating layer is suppressed.

  According to the temperature sensing element according to one aspect of the present invention, since the wiring board having the above-described configuration is included, a temperature sensing element with high long-term reliability can be provided.

It is a disassembled perspective view which shows the wiring board and temperature sensor of embodiment of this invention. It is a plane perspective view which shows the modification of the wiring board and temperature sensor which are shown in FIG. 1 for every insulating layer. It is a disassembled perspective view which shows the other modification of the wiring board shown in FIG.

  A wiring board and a temperature sensor according to an embodiment of the present invention will be described with reference to the accompanying drawings. The distinction between the upper and lower sides in the following description is for convenience, and does not limit the upper and lower sides when a wiring board or the like is actually used.

  FIG. 1 is an exploded perspective view showing a wiring board and a temperature sensor according to an embodiment of the present invention. As shown in FIG. 1, a meander-like conductor 2 is provided on an insulating substrate 1 formed by laminating a plurality of insulating layers 1a, so that a wiring substrate 3 is basically formed. Further, a terminal 4 is provided on the wiring board 3 and a temperature measuring body 5 is basically formed. Temperature measurement is performed using the fact that the electrical resistance of the meandering conductor 2 changes according to the temperature. That is, the temperature of the environment or the like where the wiring board 3 or the like is located is calculated and detected from the measured value of the electrical resistance of the meandering conductor 2.

  The insulating substrate 1 has a flat plate shape such as a square plate shape, and is a base portion for providing the meander-like conductor 2. The insulating substrate 1 is formed of a ceramic sintered body such as an aluminum oxide sintered body, an aluminum nitride sintered body, a mullite sintered body, or a glass ceramic sintered body. The insulating substrate 1 is formed by laminating a plurality of insulating layers 1a (three layers in the example shown in FIG. 1) made of such a ceramic sintered body.

  For example, if each insulating layer 1a is made of an aluminum oxide sintered body, the insulating substrate 1 can be manufactured by the following method. First, a slurry prepared by adding and mixing an appropriate organic binder and solvent to raw powders such as aluminum oxide, silicon oxide, magnesium oxide, and calcium oxide is formed into a sheet by a doctor blade method or the like to form a ceramic green sheet. Make it. Next, after cutting these ceramic green sheets into appropriate dimensions, a plurality of these are laminated to produce a laminate. Then, the insulating substrate 1 is manufactured by baking this laminated body at a high temperature (about 1600 ° C.). Each of the plurality of ceramic green sheets becomes the insulating layer 1a.

  The meander-like conductor 2 is a conductor having a so-called meandering pattern, and a plurality of straight line portions (not indicated) arranged in parallel to each other, and folded portions that connect the ends of the adjacent straight line portions to each other ( Unsigned).

  The meandering conductor 2 is formed of platinum, which is a metal material whose electric resistance changes according to temperature, or an alloy material containing platinum as a main component. In order to detect a change according to the temperature of the electric resistance of the metal material according to the temperature change, it is preferable that the absolute value of the electric resistance of the metal material at the initial stage (so-called normal temperature of about 25 ° C.) is larger. Therefore, a metal material such as platinum is in the form of a meander (that is, a mode in which the length of the section for measuring the electrical resistance is long and effective in increasing the absolute value of the electrical resistance). In addition, meandering conductors 2 are arranged between a plurality of layers in order to facilitate downsizing of the insulating substrate 1 in plan view while further increasing the length of this section. The meandering conductors 2 adjacent in the stacking direction (vertical direction in FIG. 1) are electrically connected to each other through, for example, through conductors described later.

The reason why it is preferable that the initial electrical resistance is large as described above is as follows. That is, the change in the electrical resistance according to the temperature change of the meandering conductor 2 occurs at a constant rate regardless of the initial magnitude (absolute value) of the electrical resistance. In other words, the larger the initial electrical resistance value,
The absolute value of the change in electrical resistance with a change in temperature increases. The larger the absolute value of this change in electrical resistance, the less susceptible to noise (electric resistance fluctuation due to factors other than temperature changes). Measurement is also easier. Therefore, the meandering conductor 2 preferably has a large initial electrical resistance. Therefore, a metal material such as platinum is provided in the meander shape as described above. The number of layers between which the meandering conductors 2 are provided is two in the example of FIG. 1, but may be three or more.

Components other than platinum in the metal material containing platinum as a main component are appropriately selected for the purpose of adjusting the temperature resistance coefficient (TCR) of the linear conductor 2 and improving heat resistance. Is selected. Examples of components other than platinum include metal materials of platinum group elements such as palladium, rhodium and iridium, and gold. For example, when the linearity of the change in electrical resistance with respect to the temperature change of the linear conductor 2 is important, it is preferable that the platinum content is large.

  The metal material mainly composed of platinum contains platinum in a proportion of about 80% by mass or more. In a metal material containing platinum as a main component, platinum and other components may form an alloy or may exist as independent crystal particles. The linear conductor 2 may contain an additive other than a metal component, such as platinum or a metal material containing platinum as a main component. Examples of the additive include inorganic particles similar to those contained in the insulating substrate 1, such as aluminum oxide. The additive is added, for example, for matching the firing shrinkage rate between the linear conductor 2 and the insulating layer 1a.

  For example, the meander-like conductor 2 is prepared by applying a metal paste prepared by kneading platinum powder together with an organic solvent and a binder to each main surface of a plurality of ceramic green sheets to be a plurality of insulating layers 1a in a predetermined pattern. It can be formed by co-firing with a laminate formed by laminating a plurality of ceramic green sheets.

  As described above, the meander conductors 2 provided between the upper and lower layers are electrically connected to each other by, for example, through conductors (so-called via conductors) that penetrate the insulating layer 1a in the thickness direction. In this case, the upper and lower meander conductors are connected so as to be connected in series. That is, one linear conductor (no symbol) is formed by two upper and lower meander conductors. The electric resistance between one end (first end A) of the one linear conductor and the opposite end (second end B) is measured by, for example, an external electric circuit. This electrical resistance changes according to the temperature of the meandering conductor 2, and the temperature of the meandering conductor 2 changes according to the temperature of the environment (external temperature) where the wiring board 3 and the like are located. That is, the external temperature is detected by detecting the electrical resistance between the first and second ends A and B of the meandering conductor 2.

  In this case, it is possible to form the wiring board 3 provided with one longer linear conductor while keeping the planar area of the insulating substrate 1 small. When the length of the one linear conductor is long, the electrical resistance between both ends of the conductor becomes larger. As a result, the initial electrical resistance described above is increased, and the absolute value of the change in electrical resistance in response to a temperature change is further increased. Therefore, highly accurate temperature measurement can be easily performed.

  The external temperature is, for example, the temperature of various combustion exhaust gases, and it may be necessary to detect a high temperature of about several hundred to 1,000 ° C. Since the stability at such a high temperature and the linearity of the change in electric resistance according to the temperature are good, the meandering conductor 2 is made of platinum or a metal material containing platinum as a main component. For example, the temperature sensing element is mounted on an external substrate (not shown) including, for example, the electrical circuit for resistance detection as described above, and a portion where a temperature measurement object exists together with such an external substrate (gas flow). Mounted on the road).

Further, if the meandering conductor 2 is exposed to the outside air, the electric resistance becomes unnecessary due to adhesion of foreign matter, destruction due to accidental collision with the external substrate or other components mounted on the external substrate, etc. May change. In order to prevent this, the meandering conductor 2 is provided between the plurality of layers of the plurality of insulating layers 1a. In other words, the plurality of meander-like conductors 2 are all provided inside the insulating substrate 1 and are not exposed to the outside.

  In the wiring board 3 of the embodiment, the plurality of meander-like conductors 2 are arranged so that adjacent ones above and below are orthogonal to each other in plan perspective. In this case, the orthogonality between the meandering conductors 2 means that the respective straight portions are orthogonal to each other in plan perspective. That is, the directions in which the thermal stress generated between the meandering conductor 2 and the insulating layer 1a acts between the upper and lower layers are orthogonal to each other between the upper and lower layers. Therefore, it is suppressed that thermal stress concentrates in the same direction between a plurality of layers. Therefore, it is possible to provide the wiring board 3 in which the occurrence of mechanical breakdown such as cracks in the meandering conductor 2 or the insulating layer 1a is suppressed.

  Note that the two meander-like conductors 2 positioned between the upper and lower layers may not be strictly orthogonal to each other in plan perspective. For example, misalignment (so-called θ misalignment that rotates with each other) due to misalignment of the printing position of the metal paste that becomes the meander-like conductor 2, misalignment when the upper and lower ceramic green sheets are laminated, or the like is allowed. In addition, when other conductors (not shown) other than the meander-like conductor 2 are provided on the insulating substrate 1, the upper and lower meander-like shapes are used to ensure a distance between the other conductor and the meander-like conductor. The conductors 2 may be displaced from positions where they are strictly orthogonal to each other. Such a shift is, for example, when the angle of intersection between the straight portions of the upper and lower meander-like conductors 2 is within a range of about 90 degrees to 20 degrees in a plane perspective (that is, the angle of intersection is about 70 to 110 degrees). It is.

  Further, the upper and lower meander-like conductors 2 do not need to be strictly orthogonal to each other over their entire length, and include a parallel portion or the like as long as it is a part (for example, about several percent of the total length). It doesn't matter.

  A terminal 4 provided on the wiring board 3 is a part for connecting the meandering conductor 2 to an external electric circuit. The terminal 4 can be formed by the same method using the same metal material (platinum etc.) as the meandering conductor 2, for example. The terminal 4 in the wiring board 3 of the embodiment is a circular pattern made of platinum. The terminal 4 may have another shape, or may be formed by a lead terminal (not shown) made of gold or the like.

  Since the terminal 4 may be placed in a high-temperature environment together with the wiring substrate 3 as will be described later, the terminal 4 is made of a metal material having high oxidation resistance at high temperatures, such as platinum group metals including gold or gold. It is preferable.

  The temperature measuring body 5 of the embodiment is formed by the wiring board 3 having the above configuration and the temperature measuring terminal 4 electrically connected to the meander conductor 2 of the wiring board 3. In this embodiment, the electrical connection between the meandering conductor 2 and the terminal 4 is made by a through conductor (so-called via conductor) penetrating the insulating layer 1a in the thickness direction.

  The through conductor 6 is made of, for example, a conductor material (metal material) whose main component is the same metal material (platinum or the like) as the meandering conductor 2. Examples of such a metal material include platinum or a material mainly composed of platinum and added with an inorganic filler such as alumina. For example, when the through conductor 6 and the insulating substrate 1 are formed by simultaneous firing, the inorganic filler is for matching the shrinkage rate and shrinkage behavior of both.

The through conductor 6 is made of, for example, the same platinum metal paste as that for forming the meander-like conductor 2.
It can be formed by filling in a through-hole previously provided in the ceramic green sheet to be the insulating layer 1a and co-firing. The through hole can be provided in the ceramic green sheet by a machining method such as mechanical drilling using a metal pin or laser beam drilling. In this case, the inorganic filler particles as described above may be added to the metal paste.

  According to such a temperature measuring element 5, since the wiring board 3 having the above-described configuration is included, the temperature measuring element 5 having high long-term reliability can be provided.

  For example, in the case of a measuring instrument that measures the temperature of exhaust gas from a device having a combustion section such as an internal combustion engine (gasoline engine, diesel engine, etc.), a gas turbine, a boiler, etc. This is done as follows. That is, first, the temperature measuring body 5 is mounted on the external board including the circuit for measuring electric resistance as described above, and the terminal 4 of the temperature measuring body 5 is electrically connected to a predetermined portion of the circuit of the external board. Examples of means for electrical connection include connection means such as soldering the two or welding a lead wire (not shown) to the terminal 4. Next, the temperature sensing element 5 mounted on the external substrate is mounted in the exhaust gas flow path. In this case, it is sufficient that at least the temperature sensing element can be positioned in the exhaust gas, and other portions of the external substrate do not necessarily have to be positioned in the exhaust gas. Thereafter, the electrical resistance between the first and second end portions A and B of the temperature measuring body 5 and the linear conductor 2 included in the temperature measuring body changes according to the temperature of the exhaust gas, and this electric resistance value is an electric value. It is measured with a circuit for circuit measurement. Based on the measured electrical resistance, for example, the temperature of the linear conductor 2 from the previously measured electrical resistance-temperature relationship, that is, the temperature of the portion where the temperature measuring body 5 including the linear conductor 2 is located is calculated. Can be detected.

  In temperature detection in such a high temperature environment using the temperature measuring element 5, thermal stress is generated between the plurality of insulating layers 1a and the plurality of meander conductors 2 as described above. This thermal stress is generated in the insulating substrate 1 as a resultant force across a plurality of layers.

  On the other hand, as described above, since the upper and lower meander conductors 2 are orthogonal to each other in plan view, the thermal stress generated between the plurality of layers does not become the same direction, and the insulating layer 1a caused by the thermal stress and Mechanical destruction of the meandering conductor 2 is suppressed.

  Also in the temperature measuring element 5, like the wiring board 3, a metal material such as platinum is a meander pattern, and the pattern of the metal material is provided between a plurality of layers and connected in series with each other. Therefore, it is easy to lengthen the section in which the electrical resistance of the metal material is measured. That is, it is easy to sufficiently increase the electrical resistance in the section. For this reason, for example, the electrical resistance of the linear conductor 2 before temperature measurement (normal temperature or the like in the initial state described above) is relatively large, and the absolute value of the change in electrical resistance according to the temperature change is large. Therefore, it is possible to obtain a temperature measuring element 5 that is easy to measure with high accuracy from room temperature to a high temperature range such as about 1000 ° C.

  The line width of the meandering conductor 2 includes the temperature measurement accuracy to be detected, the temperature range, the thickness and length of the meandering conductor 2, the distance from the outer periphery of the insulating layer 1a to the meandering conductor 2, and the like. It is set as appropriate according to conditions such as conditions, productivity, and economy.

  The line width of the meandering conductor 2 may be different from other portions in a part in the length direction, for example, as in the example of FIG. In the example of FIG. 1, the line width at the folded portion is larger than the line width at the straight portion. When the line width at the folded portion is relatively large, for example, it is advantageous in reducing the relative variation in the line width at the folded portion (change in the ratio of the actual line width to the predetermined line width).

For example, the temperature range to be detected is a high temperature range of about 500 to 1000 ° C., and the meander conductor 2
Is made of platinum (so-called pure platinum having a platinum content of 99.99% by mass or more), and the thickness of the meandering conductor 2 is, for example, that of the insulating layer 1a. It is set to about 20 to 50 μm in the portion along the outer periphery. In this case, the line width of the meandering conductor 2 other than the portion along the outer periphery of the insulating layer 1a is set to about 50 to 200 μm.

  Considering such a thickness setting of the meandering conductor 2, the insulating layer 1a is preferably made of a ceramic sintered body, and the meandering conductor 2 is preferably a thick film conductor. The meandering conductor 2 in this case is formed by, for example, simultaneous firing with the insulating substrate 1 (the plurality of insulating layers 1a). If the meandering conductor 2 is a thick film conductor, it is easy to make the thickness relatively thick, such as about 10 μm or more as described above. Further, since such a relatively thick meander-like conductor 2 can be formed by simultaneous firing with the insulating substrate 1, the strength of bonding between the meander-like conductor 2 and the insulating substrate 1, and the productivity as the wiring substrate 3. Is advantageous. Moreover, the pattern of the meandering conductor 2 can be easily set only by adjusting the printing pattern of the metal paste that becomes the meandering conductor 2. Therefore, it is advantageous in terms of design freedom and productivity.

  When the insulating layer 1a is made of a ceramic sintered body and the meandering conductor 2 is a thick film conductor formed by simultaneous firing with the insulating layer 1a, the ceramic green sheet and the meandering conductor to be the insulating layer 1a. In some cases, a stress corresponding to a difference in shrinkage rate from the metal paste 2 is generated. In such a case, if the upper and lower meander-like conductors 2 (printing pattern of the metal paste) are orthogonal to each other in plan view, the possibility that the stress is generated in the same direction across a plurality of layers is effectively reduced. The Therefore, deformation such as warping of the insulating substrate 1 due to the stress is more effectively suppressed.

  FIG. 2 is a perspective plan view showing a modification of the wiring board 3 and the temperature sensing element 5 shown in FIG. 1 for each insulating layer. The two insulating layers 1a shown in FIG. 2 are stacked one above the other, and another insulating layer (not shown) is further stacked thereon to form the insulating substrate 1. In FIG. 2, the same parts as those in FIG. In FIG. 2, the terminals 4 and the through conductors 6 are omitted for easy viewing. In the example of FIG. 2, the pattern of the meander conductor 2 is different from the example of FIG. 1, and the other points are the same. This same point is omitted in the following description.

  In the example of FIG. 2, the meandering conductor 2 between one layer includes a plurality of sub meandering conductors 2A and 2B that are sequentially connected in series. The sub meander-like conductors 2A and 2B are, for example, a pattern in which the meander-like conductor 2 is divided into two on the way as shown in FIG. 1, and are connected in series to each other. Each of the sub meandering conductors 2 </ b> A and 2 </ b> B has a plurality of linear portions and a plurality of folded portions in the same manner as the meandering conductor 2. The plurality of sub meandering conductors 2A and 2B are arranged so that the respective straight portions are parallel to each other.

  In the example of FIG. 2, two sub meandering conductors 2 </ b> A and 2 </ b> B form one meandering conductor 2 on the main surfaces (interlayers) of the upper and lower insulating layers 1 a. There may be three or more sub meandering conductors. In other words, one meander conductor 2 may be composed of three or more sub meander conductors (not shown) connected to each other.

In the wiring board 3 and the temperature measurement 5 of this modification, the following advantageous effects are obtained. That is, since the meandering conductor 2 is composed of the plurality of sub meandering conductors 2A and 2B, the length of the straight portion of the meandering conductor 2 can be kept relatively short. Therefore, in one meander-like conductor 2 itself, the thermal stress generated between the meander-like conductor 2 and the insulating layer 1a can be reduced. Therefore, it is possible to form the wiring board 3 and the temperature measuring element 5 in which mechanical destruction due to the thermal stress of the insulating layer 1a and the meandering conductor 2 is more effectively suppressed.

  In order to sufficiently obtain the effect of suppressing the above-mentioned mechanical destruction, the plurality of sub meandering conductors 2A and 2B are arranged so that the straight portions of the sub meander conductors 2A and 2B are parallel to each other as described above, and the upper and lower sub meanders are The linear portions of the conductors 2A and 2B are arranged so as to be orthogonal to each other in plan perspective.

  The upper and lower auxiliary meandering conductors 2A and 2B do not need to be strictly orthogonal to each other in a plan view, and, similar to the case of the meandering conductor 2 described above, a deviation (θ Deviation) is allowed.

  In the wiring board 3 and the temperature measuring element 5 of the above-described embodiment and the modified example thereof, the insulating layer 1a and the insulating substrate 1 have a quadrangular shape, and the meandering conductor 2 has a straight portion and a plurality of folded portions. The direction in which they are arranged is parallel to the outer periphery of the insulating layer 1a. In this case, it is easy to efficiently arrange the meander-like conductor 2 in a wide range between the rectangular insulating layers 1a.

  The meandering conductor 2 may include a portion that is not parallel to the outer periphery of the insulating layer 1a. For example, if the shape of the insatiable layer 1a in a plan view is a polygonal shape other than a square shape, a circular shape, an ellipse shape, or a shape such as a combination of these figures, the outer periphery of the insulating layer 1a It is difficult to arrange the straight portions of the meandering conductor 2 in parallel. For example, in such a case, the linear portion of the meandering conductor 2 may not be parallel to the outer periphery of the insulating layer 1a.

  Further, the meander shape 2 may be provided between three or more layers. FIG. 3 is an exploded perspective view showing another modification of the wiring board and the temperature sensing element shown in FIG. In FIG. 3, the same parts as those in FIG. In the example of FIG. 3, the meandering conductor 2 is disposed between three layers. In other words, the meander-like conductor 2 is provided on the upper surface of each of the three insulating layers 1a extending vertically (in the stacking direction).

  In this case, the upper and lower meander conductors 2 may be matched with each other with the same line width, or may be different from each other. However, in order to suppress that the thermal stress generated between the upper and lower layers is partially biased and the thermal stress is partially concentrated, it is more preferable that they have the same line width.

  In addition, when the line width of the meandering conductor 2 is partially different from other parts, it is preferable that a part having a relatively large line width is provided in the folded part. Moreover, it is preferable that the part with a comparatively small line | wire width is provided in the linear part. In the straight portion, a relatively large thermal stress is likely to be generated between the straight portion and the insulating layer 1a along the extending direction. The amount (volume) of the metal material forming the meandering conductor 2 in the straight portion is relatively small. Therefore, it is suppressed that a big thermal stress arises in the direction where a straight part extends.

  In the example of FIG. 3, the three meander-like conductors 2 are arranged such that their straight portions are perpendicular to each other vertically. Thereby, the concentration of thermal stress is reduced.

In this case, it is preferable that the three meander-like conductors 2 have a longer straight portion and a smaller length than a shorter one. For example, in the example shown in FIG. 3, the insulating layer 1 a has a rectangular shape, and the interlayer (interlayer α) provided with the meandering conductor 2 extending in the straight line direction along the long side direction is straight along the short side direction. It is preferable that the number of the meander-like conductors 2 that extend is less than that of the interlayer (interlayer β). This is because a larger thermal stress is likely to occur when the straight portion is long. Since there are fewer portions with relatively large thermal stress, the magnitude of the thermal stress generated between the layers can be more effectively reduced. Further, for example, as in the example of FIG. 3, when the above-mentioned interlayer α that may cause larger thermal stress is sandwiched between the two above-mentioned layers β, the thermal stress can be more effectively reduced. You can also.

DESCRIPTION OF SYMBOLS 1 ... Insulating substrate 1a ... Insulating layer 2 ... Mander-like conductor 3 ... Wiring board 4 ... Terminal 5 ... Temperature measuring element 6 ... Through-conductor

Claims (4)

A plurality of insulating layers stacked on each other, and an insulating substrate having a plurality of layers between the plurality of insulating layers;
Each disposed between different layers, and comprising a plurality of meander conductors made of platinum or a metal material mainly composed of platinum,
The wiring board, wherein the plurality of meander conductors are arranged so that adjacent ones in the stacking direction are orthogonal to each other when seen in a plan view. 2. The wiring board according to claim 1, wherein the insulating layer is made of a ceramic sintered body, and the meandering conductor is a thick film conductor. 2. The wiring board according to claim 1, wherein the meandering conductor in one layer includes a plurality of sub meandering conductors sequentially connected in series. The wiring board according to any one of claims 1 to 3,
A temperature sensing element comprising: an electric resistance detection terminal electrically connected to each of the meander conductors.

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