JP2015203606A5

JP2015203606A5 -

Info

Publication number: JP2015203606A5
Application number: JP2014082310A
Authority: JP
Filing date: 2014-04-11
Publication date: 2017-05-25
Anticipated expiration: 2034-04-11

Description

本発明の１つの側面は、センサ基板および該センサ基板の上に光を検出するセンサ部を有するセンサパネルの前記センサ部側の面と、第２の基板の表面と、にシンチレータを蒸着してシンチレータ層を形成する工程と、前記シンチレータ層が形成された前記センサパネルをシンチレータ層が形成された前記第２の基板から分離して放射線撮像装置を取得する工程と、を含み、前記シンチレータ層を形成する工程は、前記センサ基板の側面と前記第２の基板の側面とが接触するかまたは前記シンチレータ層の厚さの２倍以下の間隙をおいて位置するように保持しながら行われることを特徴とする。 One aspect of the present invention includes the sensor portion side surface of the sensor panel having a sensor unit for detecting light on the sensor substrate and the sensor substrate and the surface of the second substrate, the scintillator is deposited Forming a scintillator layer; and separating the sensor panel on which the scintillator layer is formed from the second substrate on which the scintillator layer is formed to obtain a radiation imaging apparatus, the scintillator layer comprising: The forming step is performed while holding the sensor substrate so that the side surface of the sensor substrate and the side surface of the second substrate are in contact with each other or are positioned with a gap of twice or less the thickness of the scintillator layer. Features.

Claims

Forming said sensor portion side surface of the sensor panel having a sensor unit for detecting light on the sensor substrate and the sensor substrate, and the surface of the second substrate, a scintillator layer by depositing a scintillator on a
Separating the sensor panel on which the scintillator layer is formed from the second substrate on which the scintillator layer is formed to obtain a radiation imaging apparatus;
Including
In the step of forming the scintillator layer, the side surface of the sensor substrate and the side surface of the second substrate are in contact with each other or are held so as to be positioned with a gap less than twice the thickness of the scintillator layer. The manufacturing method of the radiation imaging device characterized by the above-mentioned.

In the step of forming the scintillator layer, the sensor panel and the second substrate are formed such that a step between the surface of the sensor panel and the surface of the second substrate is smaller than a thickness of the scintillator layer. The manufacturing method according to claim 1, wherein the holding method is held.

In the step of forming the scintillator layer, the sensor panel and the second substrate are in contact with each other so that the side surface of the sensor substrate and the side surface of the second substrate are in contact with each other. The manufacturing method according to claim 1, wherein the second substrate is held.

In a state of abutting and said second substrate and said sensor substrate, part of the previous SL side of the side surface of the sensor substrate is in contact with a portion of said side surface of said second substrate, said sensor substrate in a state where the front Symbol surface and the opposite side to the rest of the side surface of the sensor substrate and the remainder of the side surface of the second substrate to form a space tapered and arranged member of the tapered in the space of The manufacturing method according to claim 3, wherein the sensor panel and the second substrate are held.

In the step of forming the scintillator layer, the side surface of the sensor substrate and the side surface of the second substrate are arranged with a gap of 0.1 mm or less, defining the size of the gap, and the sensor substrate 3. The manufacturing method according to claim 1, wherein the sensor panel and the second substrate are held in a state in which a connection member that connects the second substrate is disposed in the gap. 4.

The step of forming the scintillator layer, according to claim 1 to 5, characterized in that for supporting the peripheral portion of the surface of the front SL side to the second substrate and the peripheral portion of the front Symbol surface of the sensor panel The manufacturing method of any one of Claims.

The step of forming the scintillator layer, pressing the part of the peripheral portion of a part and the second of said back side of the surface of the substrate of the peripheral portion in the rear of the front Symbol surface opposite side of the sensor panel The manufacturing method according to claim 6.

The step of forming the scintillator layer, and wherein the holding and the back-side surface of the second substrate before and Symbol surface and the back surface of the opposite side of the sensor panel on the base by the electrostatic chuck The manufacturing method of any one of Claims 1 thru | or 3.

The step of forming the scintillator layer, wherein, wherein for holding the said back-side surface of the second substrate before and Symbol surface on the opposite side of the back of the sensor panel on the base by the adhesive layer Item 4. The method according to any one of Items 1 to 3.

10. The manufacturing method according to claim 1, wherein the second substrate is a sensor substrate and another sensor panel including a sensor unit that detects light on the sensor substrate. .

The manufacturing method according to claim 10, wherein the sensor panel and the other sensor panel are formed on the same holding substrate, and are obtained by cutting out the holding substrate.

The manufacturing method according to claim 1, wherein the second substrate is formed of the same material as the sensor substrate.

The manufacturing method according to claim 1, wherein the second substrate has at least one of a scintillator adhesion probability and a heat capacity equal to that of the sensor substrate.

The deposition surface of the first substrate while holding the first substrate and the second substrate so that the side surface of the first substrate and the side surface of the second substrate are in contact with each other or are positioned with a gap therebetween. And forming a scintillator layer by vapor-depositing a scintillator on the vapor deposition surface of the second substrate;
Separating the first substrate on which the scintillator layer is formed from the second substrate on which the scintillator layer is formed, and obtaining a scintillator panel;
Attaching the scintillator panel to the sensor unit side of the sensor panel having a sensor substrate and a sensor unit for detecting light on the sensor substrate to obtain a radiation imaging apparatus;
Including
The method of manufacturing a radiation imaging apparatus, wherein the gap is not more than twice the thickness of the scintillator layer.

In the step of forming the scintillator layer, the step of forming the first substrate and the second substrate so that a step between the vapor deposition surface of the first substrate and the vapor deposition surface of the second substrate is smaller than the thickness of the scintillator layer. The manufacturing method according to claim 14, wherein the second substrate is held.

16. The manufacturing method according to claim 14, wherein the first substrate and the second substrate are made of the same material.

16. The manufacturing method according to claim 14, wherein the second substrate has at least one of a scintillator adhesion probability and a heat capacity equal to that of the first substrate.

Claims 1 to be manufactured by the method according to any one of 17, radiation imaging apparatus scintillator layer is characterized by having a side wall in the peripheral part of the side of the second substrate is located.

A radiation imaging apparatus according to claim 18;
A signal processing unit for processing a signal from the radiation imaging apparatus;
A display unit for displaying a signal from the signal processing unit;
A radiation source for generating radiation towards the radiation imaging device ;
A radiation imaging system comprising: