JP2015201741A - directional coupler - Google Patents

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JP2015201741A
JP2015201741A JP2014079175A JP2014079175A JP2015201741A JP 2015201741 A JP2015201741 A JP 2015201741A JP 2014079175 A JP2014079175 A JP 2014079175A JP 2014079175 A JP2014079175 A JP 2014079175A JP 2015201741 A JP2015201741 A JP 2015201741A
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conductor
ground conductor
signal line
directional coupler
flat
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JP6318792B2 (en
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秀浩 吉岡
Hidehiro Yoshioka
秀浩 吉岡
明道 廣田
Akemichi Hirota
明道 廣田
大和田 哲
Satoru Owada
哲 大和田
和宏 弥政
Kazuhiro Iyomasa
和宏 弥政
山本 和也
Kazuya Yamamoto
和也 山本
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Mitsubishi Electric Corp
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Abstract

PROBLEM TO BE SOLVED: To improve the coupling direction of a directional coupler.SOLUTION: A directional coupler includes: a coupling part composed of a main signal line conductor and a sub signal line conductor arranged in parallel to the main signal line conductor; a ground conductor which is arranged separated from the main signal conductor and the sub signal conductor; a flat ground conductor which is arranged in at least one region out of a first region between the coupling part and the ground conductor and a second region in the vicinity of its side part while mutually facing the main signal conductor; and a connection conductor which connects the flat ground conductor to the ground conduct.

Description

この発明は、主としてマイクロ波帯及びミリ波帯で使用される方向性結合器に関するものである。   The present invention relates to a directional coupler mainly used in a microwave band and a millimeter wave band.

2本の線路を接近し平行に配置して結合させた結合線路形の方向性結合器は、電力監視を行うために広く用いられる(例えば、非特許文献1参照)。方向性結合器では、反射量およびアイソレーション量が最小かつ、通過量および結合量が最大となる結合線路の特性インピーダンスZCが、結合線路における終端の負荷インピーダンスZLよりも低くなり、特性が劣化することがある。そのため、良好な特性を得られる方向性結合器が提案されている。 A coupled line type directional coupler in which two lines are arranged close to each other and coupled together is widely used for power monitoring (see, for example, Non-Patent Document 1). In the directional coupler, the characteristic impedance Z C of the coupling line that minimizes the reflection amount and the isolation amount and maximizes the passing amount and the coupling amount is lower than the load impedance Z L at the terminal end of the coupling line, and the characteristics are May deteriorate. Therefore, a directional coupler that can obtain good characteristics has been proposed.

このような方向性結合器として、接近して平行に配置した2本の線路の間隔が異なる結合線路を繋ぎ合わせたものがある(例えば、特許文献1、特許文献2参照)。このような構成の方向性結合器は、線路間隔の異なる結合線路(セクション)を有することで、結合量の周波数特性が平坦な方向性結合器、または良好な方向性となる方向性結合器を実現することに適用される。   As such a directional coupler, there is one in which coupled lines that are close to each other and arranged in parallel and having different intervals are connected (for example, see Patent Document 1 and Patent Document 2). The directional coupler having such a configuration has a coupling line (section) having a different line spacing, so that a directional coupler having a flat frequency characteristic of coupling amount or a directional coupler having good directionality can be obtained. Applied to realization.

また、接近して平行に配置した2本の線路の中間に接地導体を配置した方向性結合器がある(例えば、特許文献3参照)。このような構成の方向性結合器は、偶奇モードの通過位相速度を合わせられることから、良好な方向性を可能にする。   In addition, there is a directional coupler in which a ground conductor is arranged between two lines arranged close to each other in parallel (see, for example, Patent Document 3). The directional coupler having such a configuration enables good directionality because the passing phase speed of the even-odd mode can be matched.

特開2010−193368号公報JP 2010-193368 A 特開平9−246818号公報JP-A-9-246818 特開昭56−117401号公報JP-A-56-117401

David M. Pozar、“Microwave Engineering - Second Edition”(pp.384,John Wiley & Sons. Inc,1998年出版)David M. Pozar, “Microwave Engineering-Second Edition” (pp.384, John Wiley & Sons. Inc, published 1998)

しかしながら、従来技術(特許文献1、特許文献2)には、以下のような課題がある。このような構成の方向性結合器は、線路間隔の異なる結合線路(セクション)を有することから、方向性結合器の占有面積が増加する場合がある。さらに、四分の一波長以上の結合長が必要となることから、方向性結合器が大きくなる。   However, the conventional techniques (Patent Documents 1 and 2) have the following problems. Since the directional coupler having such a configuration has coupled lines (sections) having different line intervals, the occupying area of the directional coupler may increase. Furthermore, since a coupling length of a quarter wavelength or more is required, the directional coupler becomes large.

また、従来技術(特許文献3)には、以下のような課題がある。このような構成の方向性結合器は、結合線路間に接地導体を配置する必要があることから、結合線路の間隔を広げなければならず、疎結合になるとともに方向性結合器の占有面積が増加する。さらに、結合線路間に接地導体を配置することからも、偶奇モードのインピーダンス差が小さくなり、疎結合となる。   Further, the conventional technique (Patent Document 3) has the following problems. In the directional coupler having such a configuration, since it is necessary to dispose a ground conductor between the coupling lines, the interval between the coupling lines must be widened, and the occupying area of the directional coupler becomes loosely coupled. To increase. Further, since the ground conductor is disposed between the coupled lines, the impedance difference in the even / odd mode is reduced, resulting in loose coupling.

この発明は、このような課題を解決するためになされたもので、方向性結合器の占有面積を増加させず、また、アイソレーション特性の劣化を回避しつつ、結合特性が大きく低下することを防ぎ、良好な方向性となる方向性結合器を得ることを目的とする。   The present invention has been made to solve such a problem, and does not increase the occupied area of the directional coupler, and avoids deterioration of the isolation characteristic, while greatly reducing the coupling characteristic. An object is to obtain a directional coupler that prevents and has good directivity.

この発明に係る方向性結合器は、主信号線導体および該主信号線導体と平行に配置された副信号線導体からなる結合部と、前記主信号導体と前記副信号導体とから隔離されて配置された接地導体と、前記結合部と前記接地導体との間の第1の領域およびその側部近傍の第2の領域のうち少なくとも一方の領域に前記主信号線導体と相対向して配置された平板状接地導体と、前記平板状接地導体を前記接地導体に接続する接続導体とを備えた。   The directional coupler according to the present invention is separated from the main signal line conductor and the sub signal line conductor arranged in parallel with the main signal line conductor, and the main signal conductor and the sub signal conductor. Arranged in at least one of a grounding conductor, a first region between the coupling portion and the grounding conductor, and a second region in the vicinity of the side portion, opposite to the main signal line conductor. And a connecting conductor for connecting the flat ground conductor to the ground conductor.

この発明に係る方向性結合器によれば、一端が短絡され、もう一端が開放されている平板状接地導体を設けることにより、アイソレーション量が最小となる結合線路インピーダンスZCISOと終端の負荷インピーダンスZLを等しくすることができることから、従来の方向性結合器にて、反射量およびアイソレーション量が最小かつ、通過量および結合量が最大となる結合線路の特性インピーダンスZCが、方向性結合器の各端子に接続される終端の負荷インピーダンスZLよりも低くなり方向性が劣化した場合でも、良好な方向性となる方向性結合器を容易に得ることができるという効果がある。 According to the directional coupler according to the present invention, by providing a flat ground conductor whose one end is short-circuited and the other end is open, the coupled line impedance Z CISO and the load impedance at the terminal end are minimized. Since Z L can be made equal, the characteristic impedance Z C of the coupling line that minimizes the reflection amount and the isolation amount and maximizes the passing amount and the coupling amount in the conventional directional coupler is the directional coupling. Even when the terminal impedance is lower than the terminal load impedance Z L connected to each terminal of the device and the directionality is deteriorated, it is possible to easily obtain a directional coupler having good directionality.

この発明の実施の形態1に係る方向性結合器の一例を示す構成図である。It is a block diagram which shows an example of the directional coupler which concerns on Embodiment 1 of this invention. この発明の実施の形態1に係る方向性結合器の偶奇モードにおける各接地導体を主として流れる電流の経路を示す図である。It is a figure which shows the path | route of the electric current mainly flowing through each ground conductor in the even-odd mode of the directional coupler which concerns on Embodiment 1 of this invention. 従来例およびこの発明の実施の形態1に係る方向性結合器の偶奇モード動作時の通過位相に関するシミュレーション結果を示す図である。It is a figure which shows the simulation result regarding the passage phase at the time of the even-odd mode operation | movement of the conventional example and the directional coupler which concerns on Embodiment 1 of this invention. この発明の実施の形態1に係る他の方向性結合器の第1の変形例を示す構成図である。It is a block diagram which shows the 1st modification of the other directional coupler which concerns on Embodiment 1 of this invention. この発明の実施の形態1に係る他の方向性結合器の第2の変形例を示す構成図である。It is a block diagram which shows the 2nd modification of the other directional coupler which concerns on Embodiment 1 of this invention. この発明の実施の形態1に係る他の方向性結合器の第3の変形例を示す構成図である。It is a block diagram which shows the 3rd modification of the other directional coupler which concerns on Embodiment 1 of this invention. この発明の実施の形態1に係る他の方向性結合器の第4の変形例を示す構成図である。It is a block diagram which shows the 4th modification of the other directional coupler which concerns on Embodiment 1 of this invention. この発明の実施の形態1に係る他の方向性結合器の第5の変形例を示す構成図である。It is a block diagram which shows the 5th modification of the other directional coupler which concerns on Embodiment 1 of this invention. この発明の実施の形態1に係る他の方向性結合器の第6の変形例を示す構成図である。It is a block diagram which shows the 6th modification of the other directional coupler which concerns on Embodiment 1 of this invention. この発明の実施の形態1に係る他の方向性結合器の第7の変形例を示す構成図である。It is a block diagram which shows the 7th modification of the other directional coupler which concerns on Embodiment 1 of this invention. この発明の実施の形態1に係る他の方向性結合器の第8の変形例を示す構成図である。It is a block diagram which shows the 8th modification of the other directional coupler which concerns on Embodiment 1 of this invention. この発明の実施の形態1に係る他の方向性結合器の第9の変形例を示す構成図である。It is a block diagram which shows the 9th modification of the other directional coupler which concerns on Embodiment 1 of this invention. この発明の実施の形態1に係る他の方向性結合器の第10の変形例を示す構成図である。It is a block diagram which shows the 10th modification of the other directional coupler which concerns on Embodiment 1 of this invention. この発明の実施の形態2に係る方向性結合器の一例を示す構成図である。It is a block diagram which shows an example of the directional coupler which concerns on Embodiment 2 of this invention. この発明の実施の形態2に係る他の方向性結合器の第1の変形例を示す構成図である。It is a block diagram which shows the 1st modification of the other directional coupler which concerns on Embodiment 2 of this invention. この発明の実施の形態2に係る他の方向性結合器の第2の変形例を示す構成図である。It is a block diagram which shows the 2nd modification of the other directional coupler which concerns on Embodiment 2 of this invention. この発明の実施の形態3に係る方向性結合器の一例を示す構成図である。It is a block diagram which shows an example of the directional coupler which concerns on Embodiment 3 of this invention. この発明の実施の形態3に係る他の方向性結合器の変形例を示す構成図である。It is a block diagram which shows the modification of the other directional coupler which concerns on Embodiment 3 of this invention.

以下、この発明の方向性結合器について、実施の形態を挙げ、図面を用いて説明する。   Hereinafter, a directional coupler according to the present invention will be described with reference to the drawings by giving embodiments.

実施の形態1.
図1は、この発明の実施の形態1に係る方向性結合器の一例を示す構成図である。ここで、図1(a)は上面透視図であり、図1(b)は分解斜視図である。また、図1(c)は図1(a)におけるA1−A1’面についての断面図であり、図1(d)は図1(a)における対称面2001(B1−B1’面)についての断面図である。なお、実施の形態1に係る方向性結合器では、マイクロストリップ線路を用いている。
Embodiment 1 FIG.
1 is a block diagram showing an example of a directional coupler according to Embodiment 1 of the present invention. Here, FIG. 1A is a top perspective view, and FIG. 1B is an exploded perspective view. 1C is a cross-sectional view of the A1-A1 ′ plane in FIG. 1A, and FIG. 1D is a view of the symmetry plane 2001 (B1-B1 ′ plane) in FIG. It is sectional drawing. In the directional coupler according to Embodiment 1, a microstrip line is used.

図1(a),(b)に示すように、実施の形態1に係る方向性結合器の構造は、誘電体基板0001の上面に設けられた平板状接地導体1201と、基板0001の内層に設けられた接続導体1301と、誘電体基板0001の上層となる誘電体基板0002の上面の同一平面上に設けられた主信号線導体1101、および副信号線導体1102と、誘電体基板0001の下面に設けられた接地導体1001から形成されている。   As shown in FIGS. 1A and 1B, the structure of the directional coupler according to the first embodiment includes a flat ground conductor 1201 provided on the upper surface of the dielectric substrate 0001 and an inner layer of the substrate 0001. The connecting conductor 1301 provided, the main signal line conductor 1101 and the sub signal line conductor 1102 provided on the same plane of the upper surface of the dielectric substrate 0002 as the upper layer of the dielectric substrate 0001, and the lower surface of the dielectric substrate 0001 It is formed from the ground conductor 1001 provided in the.

また、主信号線導体1101と主信号線導体1101と電気的に結合するように近接して平行に配置された副信号線導体1102により、結合部を構成し、当該結合部と接地導体1001により結合線路を構成している。   Further, the main signal line conductor 1101 and the sub signal line conductor 1102 arranged in parallel so as to be electrically coupled to the main signal line conductor 1101 constitute a coupling portion, and the coupling portion and the ground conductor 1001 constitute the coupling portion. It constitutes a coupled line.

また、対称面2001(B1−B1’面)は、主信号線導体1101と副信号線導体1102の中間を通り、かつ主信号線導体1101からの最短距離と、副信号線導体1102からの最短距離とが常に等しくなるよう設けられている。ここでは、対称面2001(B1−B1’面)に磁気壁境界条件を適用した場合の特性インピーダンスを偶モードのインピーダンスZeとして、対称面2001(B1−B1’面)に電気壁境界条件を適用した場合の特性インピーダンスを奇モードのインピーダンスZoとして扱う。   The plane of symmetry 2001 (B1-B1 ′ plane) passes between the main signal line conductor 1101 and the sub signal line conductor 1102, and is the shortest distance from the main signal line conductor 1101 and the shortest distance from the sub signal line conductor 1102. The distance is always equal. Here, the characteristic impedance when the magnetic wall boundary condition is applied to the symmetry plane 2001 (B1-B1 ′ plane) is the impedance Ze of the even mode, and the electric wall boundary condition is applied to the symmetry plane 2001 (B1-B1 ′ plane). In this case, the characteristic impedance is treated as an odd-mode impedance Zo.

また、平板状接地導体1201は、主信号線導体1101と副信号線導体1102とからなる結合部と接地導体1001との間の領域において、対称面2001(B1−B1’面)と交わるように配置されている。   The flat ground conductor 1201 intersects the symmetry plane 2001 (B1-B1 ′ plane) in a region between the ground conductor 1001 and the coupling portion composed of the main signal line conductor 1101 and the sub signal line conductor 1102. Has been placed.

さらに、接続導体1301は、平板状接地導体1201の一端と接地導体1001とを接続するよう配置されている。ここでは、平板状接地導体1201の他の一端は開放されている。   Further, the connection conductor 1301 is disposed so as to connect one end of the flat ground conductor 1201 and the ground conductor 1001. Here, the other end of the flat ground conductor 1201 is open.

当該結合線路における反射量およびアイソレーション量が最小、かつ通過量および結合量が最大となる結合線路の特性インピーダンスZCは、各端子に接続される終端の負荷インピーダンスZLと等しくなるよう決定した場合、良好な方向性を得られる。 The characteristic impedance Z C of the coupled line that minimizes the amount of reflection and isolation in the coupled line and maximizes the amount of passage and coupling is determined to be equal to the load impedance Z L of the terminal connected to each terminal. In this case, good directionality can be obtained.

結合線路の特性インピーダンスZCと、終端の負荷インピーダンスZLとが等しくなるとき、偶モード動作時の通過位相θeと、奇モード動作時の通過位相θoとの関係は、式(1)により表される。 When the characteristic impedance Z C of the coupled line and the load impedance Z L at the end are equal, the relationship between the passing phase θe in the even mode operation and the passing phase θo in the odd mode operation is expressed by Equation (1). Is done.

Figure 2015201741
Figure 2015201741

しかし、製造上の制約等から結合線路の特性インピーダンスZCが、終端の負荷インピーダンスZLよりも低くなるとき、偶モード動作時の通過位相θeと、奇モード動作時の通過位相θoとの関係は、式(2)により表され、偶モード動作時の通過位相θeが、奇モード動作時の通過位相θoに比べ進む。 However, when the characteristic impedance Z C of the coupled line is lower than the load impedance Z L at the termination due to manufacturing restrictions, the relationship between the passing phase θe in the even mode operation and the passing phase θo in the odd mode operation Is expressed by the equation (2), and the passing phase θe in the even mode operation advances compared to the passing phase θo in the odd mode operation.

Figure 2015201741
Figure 2015201741

ここで、接続導体1301を用いて接地導体1001に接続した平板状接地導体1201を設けることにより、偶モード動作時の通過位相θeを奇モード動作時の通過位相θoに比べて大きく遅らせることができることから、偶奇モード動作時の通過位相を等しくできる。このとき、アイソレーション量が最小となる結合線路インピーダンスZCISOが、終端の負荷インピーダンスZLと等しくなることで、良好な方向性を得ることができる。 Here, by providing the flat ground conductor 1201 connected to the ground conductor 1001 using the connection conductor 1301, the passing phase θe in the even mode operation can be greatly delayed compared to the passing phase θo in the odd mode operation. Therefore, the passing phase at the time of even-odd mode operation can be made equal. At this time, since the coupled line impedance Z CISO that minimizes the amount of isolation is equal to the load impedance Z L at the terminal end, good directivity can be obtained.

次に、実施の形態1に係る方向性結合器について、偶奇モード動作時における通過位相が等しくなる理由を詳細に説明する。   Next, the reason why the passing phases in the even-odd mode operation are equal for the directional coupler according to Embodiment 1 will be described in detail.

図2は、この発明の実施の形態1に係る方向性結合器の偶奇モードにおける各接地導体を主として流れる電流の経路を示す図である。この方向性結合器の偶奇モード動作時における、主信号線導体1101、および主信号線導体1101が配置された平面と相対向した平面に配置された接地導体を流れる電流を対称面2001(B1−B1’面)より見たときの主たる電流経路を示している。   FIG. 2 is a diagram showing a path of a current mainly flowing through each ground conductor in the even / odd mode of the directional coupler according to Embodiment 1 of the present invention. During the even / odd mode operation of this directional coupler, the current flowing through the main signal line conductor 1101 and the ground conductor arranged on the plane opposite to the plane on which the main signal line conductor 1101 is arranged is symmetric plane 2001 (B1- The main current path when viewed from the (B1 ′ plane) is shown.

図2(a)は、図1(d)に示した方向性結合器において、偶モード動作時に主信号線導体1101、および主信号線導体1101が配置された平面と相対向した平面に配置された接地導体1001、もしくは接続導体1301、平板状接地導体1201を、主として流れる電流の経路を示す。また、図2(b)は、図1(d)に示した方向性結合器において、奇モード動作時に主信号線導体1101、および主信号線導体1101が配置された平面と相対向した平面に配置された接地導体1001、もしくは接続導体1301、平板状接地導体1201を、主として流れる電流の経路を示す。   FIG. 2A shows a main signal line conductor 1101 and a plane opposite to the plane on which the main signal line conductor 1101 is arranged in the directional coupler shown in FIG. A path of a current mainly flowing through the ground conductor 1001, the connection conductor 1301, and the flat ground conductor 1201 is shown. FIG. 2B shows a main signal line conductor 1101 and a plane opposite to the plane on which the main signal line conductor 1101 is arranged in the directional coupler shown in FIG. A path of a current that mainly flows through the arranged ground conductor 1001, the connection conductor 1301, or the flat ground conductor 1201 is shown.

図2(a)において、電流経路3001は、偶モード動作時に対称面2001(B1−B1’面)より見た接地導体1001、もしくは接続導体1301、平板状接地導体1201を主として流れる電流の経路を表す。   In FIG. 2A, a current path 3001 is a path of a current mainly flowing through the ground conductor 1001 or the connection conductor 1301 and the flat ground conductor 1201 viewed from the symmetry plane 2001 (B1-B1 ′ plane) during even mode operation. Represent.

図2(a)に示す偶モード動作時には、対称面2001(B1−B1’面)に磁気壁境界条件が適用されることから、主信号線導体1101と副信号線導体1102とからなるエッジ結合部に最も近接した接地導体の一つが、平板状接地導体1201となる。このとき、平板状接地導体1201は、接続導体1301を介してのみ接地導体1001に接続される。そのため、対称面2001(B1−B1’面)上で接地導体1001を流れていた電流は、接続導体1301、および平板状接地導体1201の外周に沿って主に流れ、再度、接地導体1001に流れ、電流経路3001のように主として流れる。   In the even mode operation shown in FIG. 2A, the magnetic wall boundary condition is applied to the symmetry plane 2001 (B1-B1 ′ plane), so that the edge coupling composed of the main signal line conductor 1101 and the sub signal line conductor 1102 is performed. One of the ground conductors closest to the part is a flat ground conductor 1201. At this time, the flat ground conductor 1201 is connected to the ground conductor 1001 only through the connection conductor 1301. Therefore, the current flowing through the ground conductor 1001 on the symmetry plane 2001 (B1-B1 ′ plane) mainly flows along the outer periphery of the connection conductor 1301 and the flat ground conductor 1201 and again flows into the ground conductor 1001. The current flows mainly like a current path 3001.

また、図2(b)において、電流経路3002は、奇モード動作時に対称面2001(B1−B1’面)より見た接地導体1001、もしくは接続導体1301、平板状接地導体1201を主として流れる電流の経路を表す。   In FIG. 2B, the current path 3002 is a current path mainly flowing through the ground conductor 1001 or the connection conductor 1301 and the flat ground conductor 1201 viewed from the symmetry plane 2001 (B1-B1 ′ plane) during the odd mode operation. Represents a route.

図2(b)に示す奇モード動作時には、対称面2001(B1−B1’面)に電気壁境界条件が適用されることから、主信号線導体1101と副信号線導体1102とからなるエッジ結合部に近接した接地導体、および完全導体は、平板状接地導体1201、および対称面2001(B1−B1’面)となる。このとき、平板状接地導体1201は、接続導体1301を介して接地導体1001に接続されるとともに、完全導体として扱う対称面2001(B1−B1’面)に接続される。そのため、対称面2001(B1−B1’面)上で接地導体1001に流れる電流は、主に接地導体1001以外を流れず、電流経路3002のように主として流れる。   At the time of the odd mode operation shown in FIG. 2B, the electric wall boundary condition is applied to the symmetry plane 2001 (B1-B1 ′ plane), so that edge coupling composed of the main signal line conductor 1101 and the sub signal line conductor 1102 is performed. The ground conductor close to the part and the complete conductor are a flat ground conductor 1201 and a symmetry plane 2001 (B1-B1 ′ plane). At this time, the flat ground conductor 1201 is connected to the ground conductor 1001 via the connection conductor 1301, and is also connected to a symmetrical plane 2001 (B1-B1 'plane) that is treated as a complete conductor. Therefore, the current that flows through the ground conductor 1001 on the symmetry plane 2001 (B1-B1 ′ plane) mainly flows through the current path 3002 without flowing through other than the ground conductor 1001.

つまり、図1の方向性結合器において、偶モード動作時には主として流れる電流の迂回電流経路が生じることから、偶モード動作時の通過位相θeを奇モード動作時の通過位相θoに比べて大きく遅らせることが可能となる。   In other words, in the directional coupler of FIG. 1, a bypass current path for the current that flows mainly during the even mode operation is generated, so that the passing phase θe during the even mode operation is greatly delayed compared to the passing phase θo during the odd mode operation. Is possible.

よって、偶奇モード動作時の通過位相が式(2)により表される関係となるときにおいて、偶モード動作時の通過位相θeを遅らせることで、式(1)により表される関係とすることができ、方向性が改善される。   Therefore, when the passing phase during the even / odd mode operation is represented by the equation (2), the relationship represented by the equation (1) can be obtained by delaying the passing phase θe during the even mode operation. And directionality is improved.

次に、このような効果を確認するために実施した偶奇モード動作時のシミュレーション結果を示す。図3は、従来例およびこの発明の実施の形態1に係る方向性結合器の偶奇モード動作時の通過位相に関するシミュレーション結果を示す図である。ここで、図3(a)は非特許文献1に示される従来構造による方向性結合器における偶奇モード動作時の通過位相のシミュレーション結果であり、図3(b)は図1に示した構造の方向性結合器における偶奇モード動作時の通過位相のシミュレーション結果である。図3(a)、(b)に示す2つのグラフにおいて、横軸は規格化周波数(Normalized Frequencyと表記)、縦軸は通過位相(Phaseと表記)を示している。   Next, the simulation result at the time of even-odd mode operation implemented in order to confirm such an effect is shown. FIG. 3 is a diagram showing a simulation result relating to a passing phase during the even-odd mode operation of the conventional example and the directional coupler according to Embodiment 1 of the present invention. Here, FIG. 3A is a simulation result of the passing phase at the time of even-odd mode operation in the directional coupler having the conventional structure shown in Non-Patent Document 1, and FIG. 3B is the structure shown in FIG. It is a simulation result of the passage phase at the time of even-odd mode operation in a directional coupler. In the two graphs shown in FIGS. 3A and 3B, the horizontal axis indicates a normalized frequency (denoted as Normalized Frequency), and the vertical axis indicates a passing phase (denoted as Phase).

図3においては、図1に示した対称面2001(B1−B1’面)に磁気壁境界条件を適用した場合の偶モードの通過位相を“even”として破線で示し、同対称面2001(B1−B1’面)に電気壁境界条件を適用した場合の奇モードの通過位相を“odd”として実線で示すシミュレーションには有限要素法を用いた3次元電磁界シミュレーションを適用した。従来構造の方向性結合器は、結合線路の特性インピーダンスZCが約42Ωと、各端部に接続された終端の負荷インピーダンスZL=50Ωよりも低くなる場合を仮定し設計した。ここで、アイソレーション量が最小となる結合線路インピーダンスZCISOが終端の負荷インピーダンスZLと同じ50Ωに近づくよう調整を行った。 In FIG. 3, the even-phase pass phase when the magnetic wall boundary condition is applied to the symmetry plane 2001 (B1-B1 ′ plane) shown in FIG. 1 is indicated by a broken line as “even”, and the symmetry plane 2001 (B1 A three-dimensional electromagnetic field simulation using a finite element method was applied to the simulation indicated by a solid line with the odd phase passing phase as “odd” when the electric wall boundary condition was applied to (B1 ′ plane). The directional coupler having a conventional structure was designed on the assumption that the characteristic impedance Z C of the coupled line is about 42Ω, which is lower than the load impedance Z L of the terminal connected to each end = 50Ω. Here, adjustment was performed so that the coupled line impedance Z CISO at which the amount of isolation is minimized approaches 50Ω, which is the same as the load impedance Z L at the end.

図3(a)では、偶モード動作時の通過位相が奇モード動作時の通過位相に比べ進んでおり、規格化周波数において、偶奇モード動作時の通過位相の差が0.55deg生じていることがわかる。一方、図3(b)では、偶モード動作時の通過位相と奇モード動作時の通過位相が等しく、規格化周波数において偶奇モード動作時の通過位相の差が無いことがわかる。また、図3(a)と図3(b)とを比較すると、偶モード動作時の通過位相のみが遅れて変化していることがわかる。   In FIG. 3A, the passing phase during the even mode operation is advanced as compared with the passing phase during the odd mode operation, and the difference in the passing phase during the even / odd mode operation is 0.55 deg at the normalized frequency. I understand. On the other hand, in FIG. 3B, it can be seen that the pass phase during the even mode operation and the pass phase during the odd mode operation are equal, and there is no difference in the pass phase during the even / odd mode operation at the normalized frequency. Further, comparing FIG. 3 (a) and FIG. 3 (b), it can be seen that only the passing phase during the even mode operation changes with a delay.

以上のように、実施の形態1によれば、製造上の制約等から結合線路の特性インピーダンスZCが、終端の負荷インピーダンスZLよりも低下したとき、接続導体1301を用いて接地導体1001に接続した平板状接地導体1201を、対称面2001(B1−B1’面)と交わるよう主信号線導体1101と副信号線導体1102とからなる結合部と接地導体1001との間の領域に設けることにより、方向性結合器の各終端に接続される終端の負荷インピーダンスZLと、アイソレーションが最小となる結合線路インピーダンスZCISOとを調整することで、方向性を改善することができる。各終端に接続される終端の負荷インピーダンスZLと結合線路インピーダンスZCISOとを合わせることで、偶奇モード動作時の通過位相が等しくなり、方向性が改善した方向性結合器を得ることができる。 As described above, according to the first embodiment, when the characteristic impedance Z C of the coupled line is lower than the load impedance Z L at the termination due to manufacturing restrictions or the like, the connection conductor 1301 is used to connect to the ground conductor 1001. The connected flat ground conductor 1201 is provided in an area between the ground conductor 1001 and the coupling portion composed of the main signal line conductor 1101 and the sub signal line conductor 1102 so as to cross the symmetry plane 2001 (B1-B1 ′ plane). Thus, the directivity can be improved by adjusting the load impedance Z L of the terminal connected to each terminal of the directional coupler and the coupled line impedance Z CISO that minimizes the isolation. By combining the load impedance Z L of the terminal connected to each terminal and the coupled line impedance Z CISO , the directional coupler having an improved directionality can be obtained by equalizing the passing phase during even-odd mode operation.

なお、実施の形態1で説明した方向性結合器の構成の一部を変形しても実施することができる。以下の変形例の説明に用いる方向性結合器の構成図においては、実施の形態1に係る方向性結合器の構成図(図1)で説明した同一または相当する部分について同一符号を付し、その説明を一部省略する。   Note that the present invention can also be implemented by modifying a part of the configuration of the directional coupler described in the first embodiment. In the configuration diagram of the directional coupler used in the following description of the modification, the same or corresponding parts described in the configuration diagram (FIG. 1) of the directional coupler according to the first embodiment are denoted by the same reference numerals, A part of the description is omitted.

まず、実施の形態1では、主信号線導体1101と副信号線導体1102とからなる結合部と接地導体1001との間の領域に、接続導体1301を用いて接地導体1001に接続した平板状接地導体1201を、対称面2001(B1−B1’面)と交わるよう配置されている場合について示した。ここで示した構成に限るものではなく、対称面2001(B1−B1’面)と近接した側部近傍の領域に平板状接地導体を配置してもよい。   First, in the first embodiment, a flat ground connected to the ground conductor 1001 using the connection conductor 1301 in a region between the coupling portion composed of the main signal line conductor 1101 and the sub signal line conductor 1102 and the ground conductor 1001. The case where the conductor 1201 is arranged so as to intersect with the symmetry plane 2001 (B1-B1 ′ plane) is shown. The configuration is not limited to the configuration shown here, and a flat ground conductor may be disposed in a region near the side portion close to the symmetry plane 2001 (B1-B1 'plane).

図4は、この発明の実施の形態1に係る他の方向性結合器の第1の変形例を示す構成図である。対称面2002(B1−B1’面)と近接するよう平板状接地導体を配置した場合の上面図および断面図であり、主信号線導体1101と副信号線導体1102とからなる結合部と接地導体1001との間の領域に、接続導体1301を用いて接地導体1001に接続した平板状接地導体1201を、対称面2002(B1−B1’面)と近接した側部近傍の領域であって、この対称面2002と交わらない状態で副信号線導体1102と相対向して配置した場合について示している。また、平板状接地導体1201を副信号線導体1102と相対向して配置するのではなく、主信号線導体1101と相対向して配置してもよい。このような構成に変更しても、実施の形態1と同様の効果を得ることができる。このような構成の変形は、以下の実施の形態においても同様に適用することができる。   FIG. 4 is a configuration diagram showing a first modification of another directional coupler according to Embodiment 1 of the present invention. FIG. 10 is a top view and a cross-sectional view in the case where a flat ground conductor is disposed so as to be close to a symmetry plane 2002 (B1-B1 ′ plane), and a coupling portion including a main signal line conductor 1101 and a sub signal line conductor 1102 and a ground conductor The flat ground conductor 1201 connected to the ground conductor 1001 using the connection conductor 1301 is a region near the side portion close to the symmetry plane 2002 (B1-B1 ′ plane), The case where the sub signal line conductor 1102 is arranged opposite to the symmetry plane 2002 is shown. Further, the flat ground conductor 1201 may be arranged opposite to the main signal line conductor 1101 instead of being arranged opposite to the sub signal line conductor 1102. Even if it changes to such a structure, the effect similar to Embodiment 1 can be acquired. Such a modification of the configuration can be similarly applied to the following embodiments.

また、実施の形態1では、誘電体基板0001の上層となる誘電体基板0002の上面の同一平面上に設けられた主信号線導体1101と、副信号線導体1102とからなるエッジ結合部と、誘電体基板0001の下面に設けられた接地導体1001との間の領域に、1つの接続導体(接続導体1301)と1つの平板状接地導体(平板状接地導体1201)とが配置されたマイクロストリップ線路で構成したエッジ結合形方向性結合器について示した。ここで示した構成に限るものではなく、2つ以上の接続導体、および2つ以上の平板状接地導体を配置してもよい。   Further, in the first embodiment, an edge coupling portion including a main signal line conductor 1101 and a sub signal line conductor 1102 provided on the same plane on the upper surface of the dielectric substrate 0002, which is an upper layer of the dielectric substrate 0001, A microstrip in which one connection conductor (connection conductor 1301) and one flat ground conductor (flat ground conductor 1201) are arranged in a region between the ground conductor 1001 provided on the lower surface of the dielectric substrate 0001. An edge-coupled directional coupler composed of lines was shown. It is not restricted to the structure shown here, You may arrange | position two or more connection conductors and two or more planar grounding conductors.

図5は、この発明の実施の形態1に係る他の方向性結合器の第2の変形例を示す構成図である。2つの接続導体、および2つの平板状接地導体を配置した場合の分解斜視図であり、誘電体基板0001の上層となる誘電体基板0002の上面の同一平面上に設けられた主信号線導体1101と、副信号線導体1102とからなるエッジ結合部と、誘電体基板0001の下面に設けられた接地導体1001との間の領域に、接地導体1001と相対向して平板状接地導体1201、および平板状接地導体1202とが配置されており、平板状接地導体1201は接続導体1301により接地導体1001に接続されており、平板状接地導体1202は接続導体1302により接地導体1001に接続されている場合について、マイクロストリップ線路形式で示している。このような構成に変更しても、実施の形態1と同様の効果を得ることができる。このような構成の変形は、以下の実施の形態においても同様に適用することができる。   FIG. 5 is a configuration diagram showing a second modification of another directional coupler according to Embodiment 1 of the present invention. FIG. 7 is an exploded perspective view in the case where two connection conductors and two flat ground conductors are arranged, and a main signal line conductor 1101 provided on the same plane of the upper surface of the dielectric substrate 0002 that is the upper layer of the dielectric substrate 0001. And a flat ground conductor 1201 opposite to the ground conductor 1001 in a region between the edge coupling portion composed of the sub signal line conductor 1102 and the ground conductor 1001 provided on the lower surface of the dielectric substrate 0001, and When the flat ground conductor 1202 is arranged, the flat ground conductor 1201 is connected to the ground conductor 1001 by the connecting conductor 1301, and the flat ground conductor 1202 is connected to the ground conductor 1001 by the connecting conductor 1302. Is shown in the form of a microstrip line. Even if it changes to such a structure, the effect similar to Embodiment 1 can be acquired. Such a modification of the configuration can be similarly applied to the following embodiments.

さらに、図6は、この発明の実施の形態1に係る他の方向性結合器の第3の変形例を示す構成図である。2つの接続導体、および2つの平板状接地導体を配置した場合の図5とは異なる方向性結合器の上面図および断面図であり、対称面2002(B1−B1’面)と近接するよう平板状接地導体を配置した場合の上面図および断面図であり、主信号線導体1101と副信号線導体1102とからなる結合部と接地導体1001との間の領域に、副信号線導体1102と相対向して平板状接地導体1201が配置され、主信号線導体1101と相対向して平板状接地導体1202が配置されており、平板状接地導体1201は接続導体1301により接地導体1001に接続され、平板状接地導体1202は接続導体1302により接地導体1001に接続されている場合について示している。このような構成に変更しても、実施の形態1と同様の効果を得ることができる。このような構成の変形は、以下の実施の形態においても同様に適用することができる。   Furthermore, FIG. 6 is a block diagram showing a third modification of another directional coupler according to Embodiment 1 of the present invention. FIG. 6 is a top view and a cross-sectional view of a directional coupler different from FIG. 5 in the case where two connection conductors and two flat ground conductors are arranged, and a flat plate so as to be close to a symmetry plane 2002 (B1-B1 ′ plane). FIG. 6 is a top view and a cross-sectional view in the case where a ground conductor is arranged, and is positioned relative to the sub signal line conductor 1102 in a region between the coupling portion composed of the main signal line conductor 1101 and the sub signal line conductor 1102 and the ground conductor 1001. A flat ground conductor 1201 is disposed facing the main signal line conductor 1101, and a flat ground conductor 1202 is disposed opposite to the main signal line conductor 1101. The flat ground conductor 1201 is connected to the ground conductor 1001 by a connecting conductor 1301. A case where the flat ground conductor 1202 is connected to the ground conductor 1001 by a connection conductor 1302 is shown. Even if it changes to such a structure, the effect similar to Embodiment 1 can be acquired. Such a modification of the configuration can be similarly applied to the following embodiments.

また、実施の形態1では、図1、および図4〜図6に示したように、1つの平板状接地導体と1つの接続導体とが対になり、単独または、他の1つの平板状接地導体と他の1つの接続導体とがなす対より独立して配置されている場合について示した。ここで示した構成に限るものではなく、1つの平板状接地導体と1つの接続導体との対と、他の1つの平板状接地導体と他の1つの接続導体との対とは、2つの接続導体の配置された間隔が、どちらか一方の平板状接地導体の方向性結合器における長手方向の距離よりも短ければ、各平板状接地導体の接続導体が配置されている近傍同士を接合導体により繋げていてもよい。   In the first embodiment, as shown in FIG. 1 and FIGS. 4 to 6, one flat ground conductor and one connection conductor are paired, either alone or in one other flat ground. The case where the conductor and the other connecting conductor are arranged independently of each other is shown. The present invention is not limited to the configuration shown here, and a pair of one flat ground conductor and one connection conductor and a pair of another flat ground conductor and another connection conductor include two If the distance between the connection conductors is shorter than the distance in the longitudinal direction of the directional coupler of either one of the flat ground conductors, the vicinity of the connection conductors of the respective flat ground conductors is joined to each other. It may be connected by.

図7は、この発明の実施の形態1に係る他の方向性結合器の第4の変形例を示す構成図である。2つの平板状接地導体の接続導体が配置されている近傍同士を接合導体でつなげた場合の分解斜視図であり、誘電体基板0001の上層となる誘電体基板0002の上面の同一平面上に設けられた主信号線導体1101と、副信号線導体1102とからなるエッジ結合部と、誘電体基板0001の下面に設けられた接地導体1001との間の領域に、接地導体1001と相対向して平板状接地導体1201、および平板状接地導体1202とが配置されており、平板状接地導体1201は接続導体1301により接地導体1001に接続され、平板状接地導体1202は接続導体1302により接地導体1001に接続されており、平板状接地導体1201と平板状接地導体1202とが接合導体1401によって繋がれている場合について、マイクロストリップ線路形式で示している。なお、この構成は、1つの平板状接地導体1201に複数の接続導体を配置して接地導体1001に接続するものと見ることもできる。ここで、1つの平板状接地導体1201の長手方向に配置した複数の接続導体うち、1つの平板状接地導体1201の各端点寄りのものを接続導体1301、1302とし、複数の接続導体が3つ以上であれば、これら接続導体1301、1302の間にさらに接続導体が配置されているものとする。このとき、複数の接続導体が配置された寸法として接続導体1301、1302の間の寸法をAとし、接続導体1301から平板状接地導体の開放端点の間の寸法をS1、接続導体1302から平板状接地導体の開放端点の間の寸法をS2とすれば、S1>AおよびS2>Aの少なくとも1つの寸法関係が成立するように、1つの平板状接地導体1201に複数の接続導体を配置して接地導体1001に接続する。このような構成に変更しても、実施の形態1と同様の効果を得ることができる。このような構成の変形は、以下の実施の形態においても同様に適用することができる。   FIG. 7 is a configuration diagram showing a fourth modification of another directional coupler according to Embodiment 1 of the present invention. FIG. 5 is an exploded perspective view in the case where the vicinity where the connection conductors of two flat ground conductors are arranged is connected by a joining conductor, and is provided on the same plane on the upper surface of the dielectric substrate 0002 that is the upper layer of the dielectric substrate 0001 In a region between the edge coupling portion composed of the main signal line conductor 1101 and the sub signal line conductor 1102 and the ground conductor 1001 provided on the lower surface of the dielectric substrate 0001, the ground conductor 1001 is opposed to the region. A flat ground conductor 1201 and a flat ground conductor 1202 are arranged. The flat ground conductor 1201 is connected to the ground conductor 1001 by the connection conductor 1301, and the flat ground conductor 1202 is connected to the ground conductor 1001 by the connection conductor 1302. A case where the flat ground conductor 1201 and the flat ground conductor 1202 are connected by the joint conductor 1401. It shows a microstrip line form. This configuration can also be regarded as a configuration in which a plurality of connection conductors are arranged on one flat ground conductor 1201 and connected to the ground conductor 1001. Here, among the plurality of connection conductors arranged in the longitudinal direction of one flat ground conductor 1201, the one close to each end point of the single flat ground conductor 1201 is defined as connection conductors 1301 and 1302, and there are three connection conductors. If it is above, a connection conductor shall be further arrange | positioned between these connection conductors 1301 and 1302. At this time, the dimension between the connection conductors 1301 and 1302 is A as the dimension in which the plurality of connection conductors are arranged, the dimension between the connection conductor 1301 and the open end point of the flat ground conductor is S1, and the connection conductor 1302 to the flat plate shape. If the dimension between the open end points of the ground conductor is S2, a plurality of connection conductors are arranged on one flat ground conductor 1201 so that at least one dimensional relationship of S1> A and S2> A is established. Connect to ground conductor 1001. Even if it changes to such a structure, the effect similar to Embodiment 1 can be acquired. Such a modification of the configuration can be similarly applied to the following embodiments.

また、実施の形態1では、図1、および図4〜図7に示したように、1つの平板状接地導体に対して、1つの接続導体が設けられている場合について示した。ここで示した構成に限るものではなく、2つ以上の平板状接地導体が1つの接続導体を共有し、接地導体へと接続されていてもよい。   In the first embodiment, as shown in FIG. 1 and FIGS. 4 to 7, the case where one connection conductor is provided for one flat ground conductor is shown. The configuration is not limited to that shown here, and two or more planar ground conductors may share one connection conductor and be connected to the ground conductor.

図8は、この発明の実施の形態1に係る他の方向性結合器の第5の変形例を示す構成図である。2つの平板状接地導体が1つの接続導体を共有し、接地導体へと接続されている場合の分解斜視図であり、誘電体基板0001の上層となる誘電体基板0002の上面の同一平面上に設けられた主信号線導体1101と、副信号線導体1102とからなるエッジ結合部と、誘電体基板0001の下面に設けられた接地導体1001との間の領域に、接地導体1001と相対向して平板状接地導体1201、および平板状接地導体1202とが配置されており、平板状接地導体1201の一端と平板状接地導体1202の一端とがその近傍で接続され、連結平板状接地導体1501を構成しており、連結平板状接地導体1501は、接続導体1301によって、平板状接地導体1201と平板状接地導体1202とが連結された点が、接地導体1001に接続されている場合について、マイクロストリップ線路形式で示している。なお、この構成は、1つの平板状接地導体1201に接続導体1301を配置して接地導体1001に接続するものと見ることもできる。このような構成に変更しても、実施の形態1と同様の効果を得ることができる。このような構成の変形は、以下の実施の形態においても同様に適用することができる。   FIG. 8 is a configuration diagram showing a fifth modification of another directional coupler according to Embodiment 1 of the present invention. FIG. 2 is an exploded perspective view in the case where two flat ground conductors share one connection conductor and are connected to the ground conductor, on the same plane on the upper surface of the dielectric substrate 0002 that is the upper layer of the dielectric substrate 0001. A region between the edge coupling portion including the main signal line conductor 1101 and the sub signal line conductor 1102 provided and the ground conductor 1001 provided on the lower surface of the dielectric substrate 0001 is opposed to the ground conductor 1001. The flat plate ground conductor 1201 and the flat plate ground conductor 1202 are arranged, one end of the flat plate ground conductor 1201 and one end of the flat plate ground conductor 1202 are connected in the vicinity thereof, and the connected flat plate ground conductor 1501 is connected. The connecting plate-like ground conductor 1501 is configured such that the plate-like ground conductor 1201 and the plate-like ground conductor 1202 are connected by the connecting conductor 1301. For when connected to 001, it is shown in the microstrip line form. This configuration can also be regarded as a connection conductor 1301 disposed on one flat ground conductor 1201 and connected to the ground conductor 1001. Even if it changes to such a structure, the effect similar to Embodiment 1 can be acquired. Such a modification of the configuration can be similarly applied to the following embodiments.

また、図9は、この発明の実施の形態1に係る他の方向性結合器の第6の変形例を示す構成図である。平板状接地導体1201、および平板状接地導体1202が、図8に示した実施の形態1に係る方向性結合器の短手方向に対して幅広となることによって、連結平板状接地導体1501が矩形状になった場合の分解斜視図であり、誘電体基板0001の上層となる誘電体基板0002の上面の同一平面上に設けられた主信号線導体1101と、副信号線導体1102とからなるエッジ結合部と、誘電体基板0001の下面に設けられた接地導体1001との間の領域に、図8に示した実施の形態1に係る方向性結合器の短手方向に対して幅広となった連結平板状接地導体1501が接地導体1001と相対向して配置されており、連結平板状接地導体1501は、接続導体1301によって接地導体1001に接続されている場合について、マイクロストリップ線路形式で示している。図9では連結平板状接地導体1501を矩形状としたが、任意の形状でもよい。このような構成に変更しても、実施の形態1と同様の効果を得ることができる。このような構成の変形は、以下の実施の形態においても同様に適用することができる。   FIG. 9 is a configuration diagram showing a sixth modification of another directional coupler according to Embodiment 1 of the present invention. The flat plate-like ground conductor 1201 and the flat plate-like ground conductor 1202 become wider with respect to the short direction of the directional coupler according to Embodiment 1 shown in FIG. FIG. 4 is an exploded perspective view of a case where the shape is formed, and an edge composed of a main signal line conductor 1101 and a sub signal line conductor 1102 provided on the same plane on the upper surface of the dielectric substrate 0002 as an upper layer of the dielectric substrate 0001; The area between the coupling portion and the ground conductor 1001 provided on the lower surface of the dielectric substrate 0001 is wider than the short direction of the directional coupler according to the first embodiment shown in FIG. In the case where the connecting flat plate-like ground conductor 1501 is disposed opposite to the grounding conductor 1001 and the connecting flat plate-like ground conductor 1501 is connected to the grounding conductor 1001 by the connecting conductor 1301. It is shown in the stomach cross trip line format. In FIG. 9, the connecting plate-like ground conductor 1501 has a rectangular shape, but may have an arbitrary shape. Even if it changes to such a structure, the effect similar to Embodiment 1 can be acquired. Such a modification of the configuration can be similarly applied to the following embodiments.

さらに、図10は、この発明の実施の形態1に係る他の方向性結合器の第7の変形例を示す構成図である。図9に示した実施の形態1に係る方向性結合器の接続導体1301が連結平板状接地導体1501の中央から離れた位置に配置された場合の分解斜視図であり、図8に示した実施の形態1に係る方向性結合器の短手方向に対して幅広となった平板状接地導体1201の一端と、図8に示した実施の形態1に係る方向性結合器の短手方向に対して幅広となった平板状接地導体1202の一端が、接続導体1301によって接地導体が1001に接続される位置は中央に限らず任意の位置でよい。このような構成に変更しても、実施の形態1と同様の効果を得ることができる。このような構成の変形は、以下の実施の形態においても同様に適用することができる。   Furthermore, FIG. 10 is a block diagram showing a seventh modification of another directional coupler according to Embodiment 1 of the present invention. FIG. 10 is an exploded perspective view in the case where the connection conductor 1301 of the directional coupler according to Embodiment 1 shown in FIG. 9 is disposed at a position away from the center of the connecting plate-like ground conductor 1501, and the implementation shown in FIG. 8. One end of the flat ground conductor 1201 that is wider with respect to the short direction of the directional coupler according to the first embodiment and the short direction of the directional coupler according to the first embodiment shown in FIG. The position where one end of the flat ground conductor 1202 that is wide is connected to the ground conductor 1001 by the connection conductor 1301 is not limited to the center, and may be any position. Even if it changes to such a structure, the effect similar to Embodiment 1 can be acquired. Such a modification of the configuration can be similarly applied to the following embodiments.

さらに、実施の形態1では、図9および図10に示したように、1つの接地導体、および1つの連結平板状接地導体が配置されている場合について示した。ここで示した構成に限るものではなく、2つ以上の接続導体、および2つ以上の連結平板状接地導体を配置してもよい。   Furthermore, in the first embodiment, as shown in FIGS. 9 and 10, the case where one ground conductor and one connection flat ground conductor are arranged has been described. It is not restricted to the structure shown here, You may arrange | position two or more connection conductors and two or more connection flat earth conductors.

図11は、この発明の実施の形態1に係る他の方向性結合器の第8の変形例を示す構成図である。5つの接続導体、および5つの連結平板状接地導体を配置した場合の分解斜視図であり、誘電体基板0001の上層となる誘電体基板0002の上面の同一平面上に設けられた主信号線導体1101と、副信号線導体1102とからなるエッジ結合部と、誘電体基板0001の下面に設けられた接地導体1001との間の領域に、接地導体1001と相対向して連結平板状接地導体1501〜1505が配置されており、連結平板状接地導体1501〜1505は、それぞれ接続導体1301〜1305によって接地導体1001に接続されている場合について、マイクロストリップ線路形式で示している。このような構成に変更しても、実施の形態1と同様の効果を得ることができる。このような構成の変形は、以下の実施の形態においても同様に適用することができる。   FIG. 11 is a configuration diagram illustrating an eighth modification of another directional coupler according to Embodiment 1 of the present invention. FIG. 5 is an exploded perspective view in the case where five connection conductors and five connecting flat ground conductors are arranged, and a main signal line conductor provided on the same plane on the upper surface of the dielectric substrate 0002 that is the upper layer of the dielectric substrate 0001 In a region between the edge coupling portion 1101 and the sub signal line conductor 1102 and the ground conductor 1001 provided on the lower surface of the dielectric substrate 0001, a connecting plate-like ground conductor 1501 is opposed to the ground conductor 1001. ˜ 1505 are arranged, and the connecting plate-like ground conductors 1501 to 1505 are shown in the form of microstrip lines when they are connected to the ground conductor 1001 by connecting conductors 1301 to 1305, respectively. Even if it changes to such a structure, the effect similar to Embodiment 1 can be acquired. Such a modification of the configuration can be similarly applied to the following embodiments.

さらに、実施の形態1では、図1に示すように、主信号線導体1101、および副信号線導体1102、平板状接地導体1201を直線構造とした。ここで示した構成に限るものではなく、主信号線導体1101、および副信号線路1102、平板状接地導体1201が折り曲げ構造を有する場合に用いてもよい。   Furthermore, in the first embodiment, as shown in FIG. 1, the main signal line conductor 1101, the sub signal line conductor 1102, and the flat ground conductor 1201 have a linear structure. The configuration is not limited to the configuration shown here, and the main signal line conductor 1101, the sub signal line 1102, and the flat ground conductor 1201 may be used in a bent structure.

図12は、この発明の実施の形態1に係る他の方向性結合器の第9の変形例を示す構成図である。主信号線導体1101、および副信号線路1102、平板状接地導体1201が折り曲げ構造を有する構造となっている。このような構成に変更しても、実施の形態1と同様の効果を得ることができる。このような構成の変形は、以下の実施の形態においても同様に適用することができる。   FIG. 12 is a configuration diagram illustrating a ninth modification of the other directional coupler according to Embodiment 1 of the present invention. The main signal line conductor 1101, the sub signal line 1102, and the flat ground conductor 1201 have a bent structure. Even if it changes to such a structure, the effect similar to Embodiment 1 can be acquired. Such a modification of the configuration can be similarly applied to the following embodiments.

さらに、実施の形態1では、結合線路インピーダンスZCISOと各端部に接続された終端の負荷インピーダンスZLとを等しくし、方向性を改善する場合について説明した。ここで示した構成に限るものではなく、結合線路インピーダンスZCISOを向上させるにあたって、各端部に接続された終端の負荷インピーダンスZLと比較して、高くする場合について用いてもよい。このような構成に変更しても、実施の形態1と同様の効果を得ることができる。このような構成の変形は、以下の実施の形態においても同様に適用することができる。 Furthermore, in the first embodiment, the case where the coupled line impedance Z CISO and the load impedance Z L at the terminal connected to each end are made equal to improve the directionality has been described. The present invention is not limited to the configuration shown here, and may be used for increasing the coupled line impedance Z CISO as compared with the load impedance Z L of the terminal connected to each end. Even if it changes to such a structure, the effect similar to Embodiment 1 can be acquired. Such a modification of the configuration can be similarly applied to the following embodiments.

さらに、実施の形態1では、図1に示すように、平板状接地導体1201は、対称面2001(B1−B1’面) と交わるよう、主信号線導体1101と副信号線導体1102との間と、接地導体1001との間の領域に、接地導体1001と相対向して設けられている。ここで示した構成に限るものではなく、平板状接地導体1201は、主信号線導体1101と接地導体1001との間の領域、および副信号線導体1102と接地導体1001との間の領域に、接地導体1001と相対向して配置されていてもよい。このような構成に変更しても、実施の形態1と同様の効果を得ることができる。このような構成の変形は、以下の実施の形態においても同様に適用することができる。   Further, in the first embodiment, as shown in FIG. 1, the flat ground conductor 1201 is disposed between the main signal line conductor 1101 and the sub signal line conductor 1102 so as to intersect with the symmetry plane 2001 (B1-B1 ′ plane). Are provided opposite to the ground conductor 1001 in a region between the ground conductor 1001 and the ground conductor 1001. The flat ground conductor 1201 is not limited to the configuration shown here, and the region between the main signal line conductor 1101 and the ground conductor 1001 and the region between the sub signal line conductor 1102 and the ground conductor 1001 It may be arranged opposite to the ground conductor 1001. Even if it changes to such a structure, the effect similar to Embodiment 1 can be acquired. Such a modification of the configuration can be similarly applied to the following embodiments.

さらに、実施の形態1では、図1に示すように、平板状接地導体の幅を一様とした。ここで示した構成に限るものではなく、平板状接地導体はテーパ状、または平板状接地導体の幅が一様でない任意の形状でもよい。このような構成に変更しても、実施の形態1と同様の効果を得ることができる。このような構成の変形は、以下の実施の形態においても同様に適用することができる。   Furthermore, in Embodiment 1, as shown in FIG. 1, the width of the flat ground conductor is made uniform. The configuration is not limited to the configuration shown here, and the flat ground conductor may have a tapered shape or an arbitrary shape in which the width of the flat ground conductor is not uniform. Even if it changes to such a structure, the effect similar to Embodiment 1 can be acquired. Such a modification of the configuration can be similarly applied to the following embodiments.

また、実施の形態1では、結合線路をなす主信号線導体、および副信号線導体は、ビアにより異なる層にわたって配置し用いられても良く、これと同様に平板状接地導体も異なる層にわたって配置してもよい。このような構成に変更しても、実施の形態1と同様の効果を得ることができる。このような構成の変形は、以下の実施の形態においても同様に適用することができる。   Further, in the first embodiment, the main signal line conductor and the sub signal line conductor forming the coupling line may be arranged and used across different layers depending on vias, and similarly, the flat ground conductor is arranged over different layers. May be. Even if it changes to such a structure, the effect similar to Embodiment 1 can be acquired. Such a modification of the configuration can be similarly applied to the following embodiments.

また、実施の形態1では、接地導体の一部に切り欠き(スリット)を設けて用いても良く、これと同様に平板状接地導体も切り欠きを設けて用いてもよい。   In the first embodiment, a cutout (slit) may be provided in a part of the ground conductor, and a flat ground conductor may be provided with a cutout in the same manner.

図13は、この発明の実施の形態1に係る他の方向性結合器の第10の変形例を示す構成図である。接地導体1001、および連結平板状接地導体1501に切り欠きを設けた場合の分解斜視図であり、接地導体1001に切り欠き1601を設け、連結平板状接地導体1501に切り欠き1611を設けた場合について、マイクロストリップ線路形式で示している。このような構成に変更しても、実施の形態1と同様の効果を得ることができる。このような構成の変形は、以下の実施の形態においても同様に適用することができる。   FIG. 13 is a configuration diagram illustrating a tenth modification of the other directional coupler according to Embodiment 1 of the present invention. FIG. 11 is an exploded perspective view when notches are provided in the ground conductor 1001 and the connecting flat plate ground conductor 1501, in which a notch 1601 is provided in the ground conductor 1001 and a notch 1611 is provided in the connecting plate ground conductor 1501. , Shown in microstrip line format. Even if it changes to such a structure, the effect similar to Embodiment 1 can be acquired. Such a modification of the configuration can be similarly applied to the following embodiments.

実施の形態2.
図14は、この発明の実施の形態2に係る方向性結合器の一例を示す構成図である。ここで、図14(a)は実施の形態2に係る方向性結合器の層厚方向におけるC2−C2’面についての断面図からの上面透視図であり、図14(b)は分解斜視図である。また、図14(c)は実施の形態2に係る方向性結合器の長手方向におけるA2−A2’面についての断面図であり、図14(d)は実施の形態2に係る方向性結合器の短手方向における図14(a)における対称面2002(B2−B2’面)についての断面図である。なお、実施の形態2に係る方向性結合器では、マイクロストリップ線路を用いている。図において、この発明の実施の形態1に係る方向性結合器の構成図で説明した同一または相当する部分については、同一符号を付し、その説明を一部省略する。
Embodiment 2. FIG.
FIG. 14 is a configuration diagram showing an example of a directional coupler according to Embodiment 2 of the present invention. Here, FIG. 14A is a top perspective view from a cross-sectional view of the C2-C2 ′ plane in the layer thickness direction of the directional coupler according to Embodiment 2, and FIG. 14B is an exploded perspective view. It is. FIG. 14C is a cross-sectional view taken along the A2-A2 ′ plane in the longitudinal direction of the directional coupler according to the second embodiment, and FIG. 14D is a directional coupler according to the second embodiment. It is sectional drawing about the symmetry surface 2002 (B2-B2 'surface) in Fig.14 (a) in the transversal direction of FIG. In the directional coupler according to the second embodiment, a microstrip line is used. In the figure, the same or corresponding parts described in the configuration diagram of the directional coupler according to Embodiment 1 of the present invention are denoted by the same reference numerals, and a part of the description is omitted.

図14に示した実施の形態2に係る方向性結合器の構造は、図1に示した実施の形態1に係る方向性結合器の構造と比べ、以下の点が異なる。   The structure of the directional coupler according to the second embodiment shown in FIG. 14 is different from the structure of the directional coupler according to the first embodiment shown in FIG.

誘電体基板0003を誘電体基板0002の主信号線導体1101、および副信号線導体1102が配置された面側に設け、平板状設置導体1211を誘電体基板0003の誘電体基板0002が配置された面と反対側の面に設けている。さらに、誘電体基板0004を誘電体基板0003の平板状設置導体1211が配置された面側に設け、接続導体1311を基板0004の内層に設け、地導体1002を誘電体基板0004の誘電体基板0003が配置された面と反対側の面に設けている。   The dielectric substrate 0003 is provided on the surface side of the dielectric substrate 0002 on which the main signal line conductor 1101 and the sub signal line conductor 1102 are disposed, and the plate-shaped installation conductor 1211 is disposed on the dielectric substrate 0003 of the dielectric substrate 0003. It is provided on the surface opposite to the surface. Further, the dielectric substrate 0004 is provided on the surface side of the dielectric substrate 0003 where the plate-like installation conductor 1211 is disposed, the connection conductor 1311 is provided on the inner layer of the substrate 0004, and the ground conductor 1002 is provided on the dielectric substrate 0003 of the dielectric substrate 0004. Is provided on the surface opposite to the surface on which is disposed.

その他の構造については、実施の形態1と同様であり、その説明を省略する。   Other structures are the same as those in the first embodiment, and the description thereof is omitted.

以上のように、実施の形態2によれば、ストリップ線路形式の方向性結合器の場合、誘電体基板0001の上層となる誘電体基板0002の上面の同一平面上に設けられた主信号線導体1101と、副信号線導体1102とからなるエッジ結合部と、誘電体基板0001の下面に設けられた接地導体1001との間の領域に、接続導体1301と平板状接地導体1201とを設け、誘電体基板0003の下層となる誘電体基板0002の上面の同一平面上に設けられた主信号線導体1101と、副信号線導体1102とからなるエッジ結合部と、誘電体基板0003の上層となる誘電体基板0004の上面に設けられた接地導体1002との間の領域に、接続導体1311と平板状接地導体1211とを設けることにより、方向性結合器の各終端に接続される終端の負荷インピーダンスZLと、アイソレーションが最小となる結合線路インピーダンスZCISOとを調整できるので、方向性を改善することができる。各終端に接続される終端の負荷インピーダンスZLと結合線路インピーダンスZCISOとを合わせることで、偶奇モード動作時の通過位相が等しくなり、方向性が改善した方向性結合器を得ることができる。 As described above, according to the second embodiment, in the case of a stripline type directional coupler, the main signal line conductor provided on the same plane on the upper surface of the dielectric substrate 0002, which is the upper layer of the dielectric substrate 0001. The connection conductor 1301 and the flat ground conductor 1201 are provided in a region between the edge coupling portion 1101 and the sub signal line conductor 1102 and the ground conductor 1001 provided on the lower surface of the dielectric substrate 0001. An edge coupling portion composed of a main signal line conductor 1101 and a sub signal line conductor 1102 provided on the same plane on the upper surface of the dielectric substrate 0002, which is a lower layer of the body substrate 0003, and a dielectric serving as an upper layer of the dielectric substrate 0003 By providing the connection conductor 1311 and the plate-like ground conductor 1211 in a region between the ground conductor 1002 provided on the upper surface of the body substrate 0004, each of the directional couplers A load impedance Z L of the terminal that is connected to the end, can be adjusted and a coupled line impedance Z CISO that isolation is minimized, it is possible to improve the directivity. By combining the load impedance Z L of the terminal connected to each terminal and the coupled line impedance Z CISO , the directional coupler having an improved directionality can be obtained by equalizing the passing phase during even-odd mode operation.

まず、実施の形態2では、主信号線導体1101と副信号線導体1102とからなる結合部と接地導体1001との間の領域に、接続導体1301を用いて接地導体1001に接続した平板状接地導体1201を、対称面2001(B1−B1’面)と交わるよう配置されている場合について示した。ここで示した構成に限るものではなく、対称面2001(B1−B1’面)と近接した側部近傍の領域に平板状接地導体を配置してもよい。   First, in the second embodiment, a planar ground connected to the ground conductor 1001 using the connection conductor 1301 in the region between the coupling portion composed of the main signal line conductor 1101 and the sub signal line conductor 1102 and the ground conductor 1001. The case where the conductor 1201 is arranged so as to intersect with the symmetry plane 2001 (B1-B1 ′ plane) is shown. The configuration is not limited to the configuration shown here, and a flat ground conductor may be disposed in a region near the side portion close to the symmetry plane 2001 (B1-B1 'plane).

また、実施の形態2では、主信号線導体1101と副信号線導体1102とからなる結合部と接地導体1002との間の領域に、接続導体1311を用いて接地導体1002に接続した平板状接地導体1211を、対称面2001(B1−B1’面)と交わるよう配置されている場合について示した。ここで示した構成に限るものではなく、対称面2001(B1−B1’面)と近接した側部近傍の領域に平板状接地導体を配置してもよい。   Further, in the second embodiment, a flat ground connected to the ground conductor 1002 using the connection conductor 1311 in a region between the coupling portion composed of the main signal line conductor 1101 and the sub signal line conductor 1102 and the ground conductor 1002. The case where the conductor 1211 is arranged so as to intersect with the symmetry plane 2001 (B1-B1 ′ plane) is shown. The configuration is not limited to the configuration shown here, and a flat ground conductor may be disposed in a region near the side portion close to the symmetry plane 2001 (B1-B1 'plane).

なお、実施の形態2で説明した方向性結合器の構成の一部を変形しても実施することができる。変形例として説明する。以下の変形例の説明に用いる方向性結合器の構成図においては、実施の形態2に係る方向性結合器の構成図(図14)で説明した同一または相当する部分について同一符号を付し、その説明を一部省略する。   Note that the present invention can also be implemented by modifying a part of the configuration of the directional coupler described in the second embodiment. This will be described as a modification. In the configuration diagram of the directional coupler used for the description of the following modification, the same or equivalent parts described in the configuration diagram (FIG. 14) of the directional coupler according to the second embodiment are denoted by the same reference numerals, A part of the description is omitted.

まず、実施の形態2では、図14に示したように平板状設置導体1201と平板状設置導体1211、また、接続導体1301と接続導体1311とが、それぞれ相対向するように設けられている。ここで示した構成に限るものではなく、平板状設置導体1201と平板状設置導体1211、また、接続導体1301と接続導体1311とは、相対向しないよう設けてもよい。このような構成に変更しても、実施の形態2と同様の効果を得ることができる。このような構成の変形は、この発明の実施の形態1および以下の実施の形態においても同様に適用することができる。   First, in the second embodiment, as shown in FIG. 14, the flat installation conductor 1201 and the flat installation conductor 1211, and the connection conductor 1301 and the connection conductor 1311 are provided so as to face each other. The configuration is not limited to that shown here, and the flat installation conductor 1201 and the flat installation conductor 1211, and the connection conductor 1301 and the connection conductor 1311 may be provided so as not to face each other. Even if it changes to such a structure, the effect similar to Embodiment 2 can be acquired. Such a modification of the configuration can be similarly applied to the first embodiment of the present invention and the following embodiments.

また、実施の形態2では、図14に示したように平板状設置導体1201と平板状設置導体1211とが設けられている。ここで示した構成に限るものではなく、平板状設置導体1201と平板状設置導体1211のうちどちらか一方のみ設けてもよい。このような構成に変更しても、実施の形態2と同様の効果を得ることができる。このような構成の変形は、この発明の実施の形態1および以下の実施の形態においても同様に適用することができる。   Further, in the second embodiment, as shown in FIG. 14, the flat installation conductor 1201 and the flat installation conductor 1211 are provided. It is not restricted to the structure shown here, You may provide only either one of the flat installation conductor 1201 and the flat installation conductor 1211. FIG. Even if it changes to such a structure, the effect similar to Embodiment 2 can be acquired. Such a modification of the configuration can be similarly applied to the first embodiment of the present invention and the following embodiments.

図15は、この発明の実施の形態2に係る他の方向性結合器の第1の変形例を示す構成図である。図14に示した実施の形態2に係る方向性結合器において、平板状設置導体1211、接続導体1311を取り除いた場合に相当する。このような構成に変更しても、実施の形態2と同様の効果を得ることができる。このような構成の変形は、この発明の実施の形態1および以下の実施の形態においても同様に適用することができる。   FIG. 15 is a configuration diagram showing a first modification of another directional coupler according to Embodiment 2 of the present invention. In the directional coupler according to Embodiment 2 shown in FIG. 14, this corresponds to the case where the plate-like installation conductor 1211 and the connection conductor 1311 are removed. Even if it changes to such a structure, the effect similar to Embodiment 2 can be acquired. Such a modification of the configuration can be similarly applied to the first embodiment of the present invention and the following embodiments.

図16は、この発明の実施の形態2に係る他の方向性結合器の第2の変形例を示す構成図である。図14に示した実施の形態2に係る方向性結合器において、平板状設置導体1211、接続導体1311、さらに誘電体基板0003の上層となる誘電体基板0004を取り除いた場合に対し、平板状接地導体1201および平板状接地導体1202が配置され、平板状接地導体1201は接続導体1301により接地導体1001に接続され、平板状接地導体1202は接続導体1302により接地導体1001に接続された場合に相当する。このような構成に変更しても、実施の形態2と同様の効果を得ることができる。このような構成の変形は、この発明の実施の形態1および以下の実施の形態においても同様に適用することができる。   FIG. 16 is a configuration diagram showing a second modification of another directional coupler according to Embodiment 2 of the present invention. In the directional coupler according to Embodiment 2 shown in FIG. 14, the flat grounding is obtained when the flat installation conductor 1211, the connection conductor 1311, and the dielectric substrate 0004 that is the upper layer of the dielectric substrate 0003 are removed. The conductor 1201 and the flat ground conductor 1202 are arranged, the flat ground conductor 1201 is connected to the ground conductor 1001 by the connection conductor 1301, and the flat ground conductor 1202 corresponds to the case where the connection conductor 1302 is connected to the ground conductor 1001. . Even if it changes to such a structure, the effect similar to Embodiment 2 can be acquired. Such a modification of the configuration can be similarly applied to the first embodiment of the present invention and the following embodiments.

実施の形態3.
図17は、この発明の実施の形態3に係る方向性結合器の一例を示す構成図である。ここで、図17(a)は実施の形態3に係る方向性結合器の上面透視図であり、図17(b)は分解斜視図である。また、図17(c)は実施の形態3に係る方向性結合器の長手方向におけるA3−A3’面についての断面図である。なお、実施の形態3では、マイクロストリップ線路で構成したオフセット・ブロードサイド結合形式の方向性結合器を示している。図において、この発明の実施の形態1および実施の形態2に係る方向性結合器の構成図で説明した同一または相当する部分については、同一符号を付し、その説明を一部省略する。
Embodiment 3 FIG.
FIG. 17 is a block diagram showing an example of a directional coupler according to Embodiment 3 of the present invention. Here, FIG. 17A is a top perspective view of the directional coupler according to Embodiment 3, and FIG. 17B is an exploded perspective view. Moreover, FIG.17 (c) is sectional drawing about the A3-A3 'surface in the longitudinal direction of the directional coupler which concerns on Embodiment 3. FIG. In the third embodiment, a directional coupler of an offset / broadside coupling type constituted by a microstrip line is shown. In the figure, the same or corresponding parts described in the configuration diagrams of the directional couplers according to the first and second embodiments of the present invention are denoted by the same reference numerals, and the description thereof is partially omitted.

図17に示した実施の形態3に係る方向性結合器の構造は、図1に示した実施の形態1に係る方向性結合器の構造と比べ、以下の点が異なる。   The structure of the directional coupler according to the third embodiment shown in FIG. 17 is different from the structure of the directional coupler according to the first embodiment shown in FIG.

副信号線導体1102を誘電体基板0001の上面に配置された平板状接地導体1201と同一面に設けている。さらに、平板状接地導体1201、および接続導体1301を
主信号線導体1101と接地導体1001との間の領域から、この領域の側部近傍の領域にかけて設けている。
The sub signal line conductor 1102 is provided on the same plane as the flat ground conductor 1201 disposed on the upper surface of the dielectric substrate 0001. Further, a flat ground conductor 1201 and a connection conductor 1301 are provided from a region between the main signal line conductor 1101 and the ground conductor 1001 to a region near the side of this region.

また、仮想の対称面2003(B3−B3’面)を図17(c)に示すように設ける。ここで、仮想の対称面2003(B3−B3’面)は、主信号線導体1101と副信号線導体1102の中間を通り、かつ主信号線導体1101からの最短距離と、副信号線導体1102からの最短距離とが常に等しくなるよう設けられている。この図中、例えば図1に示される対称面2001(B1−B1’面)、図14に示される対称面2002(B2−B2’面)に対して、傾斜した面として表わされる。   Further, a virtual symmetry plane 2003 (B3-B3 ′ plane) is provided as shown in FIG. Here, the imaginary symmetry plane 2003 (B3-B3 ′ plane) passes between the main signal line conductor 1101 and the sub signal line conductor 1102 and is the shortest distance from the main signal line conductor 1101 and the sub signal line conductor 1102. The shortest distance from is always equal. In this figure, for example, it is expressed as an inclined plane with respect to the symmetry plane 2001 (B1-B1 'plane) shown in FIG. 1 and the symmetry plane 2002 (B2-B2' plane) shown in FIG.

その他の構造については、実施の形態1と同様であり、その説明を省略する。   Other structures are the same as those in the first embodiment, and the description thereof is omitted.

以上のように、実施の形態3によれば、マイクロストリップ線路で構成したオフセット・ブロードサイド結合形式の方向性結合器の場合、誘電体基板0001の上層となる誘電体基板0002の上面に設けられた主信号線導体1101と、誘電体基板0001の上面に設けられた副信号線導体1102とからなるエッジ結合部と、副信号線導体1102と同一平面に設けた平板状接地導体1201と、平板状接地導体1201と誘電体基板0001の下面に設けられた接地導体1001との間の領域に、接続導体1301とを設けることにより、方向性結合器の各終端に接続される終端の負荷インピーダンスZLと、アイソレーションが最小となる結合線路インピーダンスZCISOとを調整できるので、方向性を改善することができる。各終端に接続される終端の負荷インピーダンスZLと結合線路インピーダンスZCISOとを合わせることで、偶奇モード動作時の通過位相が等しくなり、方向性が改善した方向性結合器を得ることができる。 As described above, according to the third embodiment, in the case of the offset / broadside coupling type directional coupler configured by the microstrip line, the directional coupler is provided on the upper surface of the dielectric substrate 0002 which is the upper layer of the dielectric substrate 0001. An edge coupling portion composed of the main signal line conductor 1101 and the sub signal line conductor 1102 provided on the upper surface of the dielectric substrate 0001, a flat ground conductor 1201 provided on the same plane as the sub signal line conductor 1102, and a flat plate Terminal impedance connected to each end of the directional coupler by providing a connection conductor 1301 in a region between the grounded conductor 1201 and the ground conductor 1001 provided on the lower surface of the dielectric substrate 0001. Since L and the coupled line impedance Z CISO that minimizes isolation can be adjusted, the directionality can be improved. By combining the load impedance Z L of the terminal connected to each terminal and the coupled line impedance Z CISO , the directional coupler having an improved directionality can be obtained by equalizing the passing phase during even-odd mode operation.

なお、実施の形態3で説明した方向性結合器の構成の一部を変形しても実施することができる。変形例として説明する。以下の変形例の説明に用いる方向性結合器の構成図においては、実施の形態3に係る方向性結合器の構成図(図17)で説明した同一または相当する部分について同一符号を付し、その説明を一部省略する。   Note that the present invention can also be implemented by modifying a part of the configuration of the directional coupler described in the third embodiment. This will be described as a modification. In the configuration diagram of the directional coupler used for the description of the following modified example, the same or corresponding parts described in the configuration diagram (FIG. 17) of the directional coupler according to the third embodiment are denoted by the same reference numerals, A part of the description is omitted.

まず、実施の形態3では、図17に示したように、主信号線導体1101が誘電体基板0002の上面に配置され、副信号線導体1102が誘電体基板0001の上面、かつ平板状接地導体1201と同一面に配置されている例について示した。ここで示した構成に限るものではなく、主信号線導体1101が誘電体基板0001の上面、かつ平板状接地導体1201と同一面に配置され、副信号線導体1102が誘電体基板0002の上面に配置されてもよい。その場合には、平板状接地導体1201、および接続導体1301は、副信号線導体1102と接地導体1001との間の領域から、この領域の側部近傍の領域にかけて設けてもよい。このような構成に変更しても、実施の形態3と同様の効果を得ることができる。このような構成の変形は、この発明の実施の形態1および実施の形態2においても同様に適用することができる。   First, in the third embodiment, as shown in FIG. 17, the main signal line conductor 1101 is arranged on the upper surface of the dielectric substrate 0002, the sub signal line conductor 1102 is the upper surface of the dielectric substrate 0001, and the flat ground conductor. An example is shown where 1201 is disposed on the same plane. The main signal line conductor 1101 is not limited to the configuration shown here, and is disposed on the upper surface of the dielectric substrate 0001 and on the same plane as the flat ground conductor 1201, and the sub signal line conductor 1102 is disposed on the upper surface of the dielectric substrate 0002. It may be arranged. In that case, the flat ground conductor 1201 and the connection conductor 1301 may be provided from a region between the sub signal line conductor 1102 and the ground conductor 1001 to a region near the side of this region. Even if it changes to such a structure, the effect similar to Embodiment 3 can be acquired. Such a modification of the configuration can be similarly applied to the first and second embodiments of the present invention.

また、実施の形態3では、図17に示したように、マイクロストリップ線路で構成したオフセット・ブロードサイド結合形方向性結合器の例について示した。ここで示した構成に限るものではなく、ストリップ線路で構成したオフセット・ブロードサイド結合形方向性結合器の場合でもよい。   Further, in the third embodiment, as shown in FIG. 17, an example of an offset / broadside coupled directional coupler configured by a microstrip line has been described. The present invention is not limited to the configuration shown here, and an offset / broadside coupled directional coupler configured by a strip line may be used.

図18は、この発明の実施の形態3に係る他の方向性結合器の変形例を示す構成図である。実施の形態3において、ストリップ線路形式で構成した場合について示しており、誘電体基板0003を誘電体基板0002の主信号線導体1101が配置された面側に設け、接地導体1002を誘電体基板0003の誘電体基板0002が配置された面と反対側の面側に設けている。また、平板状導体1211を誘電体基板0002の主信号線導体1101が配置された面と同一面に設け、接続導体1211を誘電体基板0003の内層に設けている。ここでも、図17と同様に仮想の対称面2003(B3−B3’面)が想定される。このとき、平板状導体1211と接続導体1311は副信号線導体1102と接地導体1002との間の領域から、この領域の側部近傍の領域にかけて配置されている。また、図17と同様に、平板状接地導体1201、および接続導体1301は、副信号線導体1102と接地導体1001との間の領域から、この領域の側部近傍の領域にかけて設けてもよい。このような構成に変更しても、実施の形態3と同様の効果を得ることができる。このような構成の変形は、この発明の実施の形態1および実施の形態2においても同様に適用することができる。   FIG. 18 is a configuration diagram showing a modification of another directional coupler according to Embodiment 3 of the present invention. In the third embodiment, a case of a stripline configuration is shown. The dielectric substrate 0003 is provided on the surface side of the dielectric substrate 0002 on which the main signal line conductor 1101 is disposed, and the ground conductor 1002 is provided on the dielectric substrate 0003. The dielectric substrate 0002 is provided on the surface opposite to the surface on which the dielectric substrate 0002 is disposed. Further, the flat conductor 1211 is provided on the same surface as the main signal line conductor 1101 of the dielectric substrate 0002, and the connection conductor 1211 is provided on the inner layer of the dielectric substrate 0003. Here, similarly to FIG. 17, a virtual symmetry plane 2003 (B3-B3 ′ plane) is assumed. At this time, the flat conductor 1211 and the connection conductor 1311 are arranged from a region between the sub signal line conductor 1102 and the ground conductor 1002 to a region near the side of this region. Similarly to FIG. 17, the flat ground conductor 1201 and the connection conductor 1301 may be provided from a region between the sub signal line conductor 1102 and the ground conductor 1001 to a region near the side portion of this region. Even if it changes to such a structure, the effect similar to Embodiment 3 can be acquired. Such a modification of the configuration can be similarly applied to the first and second embodiments of the present invention.

なお、本願発明はその発明の範囲内において、各実施の形態の自由な組み合わせ、あるいは各実施の形態の任意の構成要素の変形、もしくは各実施の形態において任意の構成要素の省略が可能である。   In the present invention, within the scope of the invention, any combination of the embodiments, or any modification of any component in each embodiment, or omission of any component in each embodiment is possible. .

0001,0002,0003,0004 誘電体基板、1101 主信号線導体、1102 副信号線導体、1001,1002 接地導体、1201,1202,1211 平板状接地導体、1301,1302,1303,1304,1305,1311 接続導体、1401 接合導体、1501,1502,1503,1504,1505 連結平板状接地導体、1601,1611 切り欠き、2001,2002、2003 対称面、2003 仮想の対称面、3001,3002 電流経路。   0001, 0002, 0003, 0004 Dielectric substrate, 1101 Main signal line conductor, 1102 Sub signal line conductor, 1001, 1002 Ground conductor, 1201, 1202, 1211 Flat ground conductor, 1301, 1302, 1303, 1304, 1305, 1311 Connecting conductor, 1401 Junction conductor, 1501, 1502, 1503, 1504, 1505 Connecting flat ground conductor, 1601, 1611 Notch, 2001, 2002, 2003 Symmetry plane, 2003 Virtual symmetry plane, 3001, 3002 Current path.

Claims (16)

主信号線導体および該主信号線導体と平行に配置された副信号線導体からなる結合部と、
前記主信号導体と前記副信号導体とから隔離されて配置された接地導体と、
前記結合部と前記接地導体との間の第1の領域およびその側部近傍の第2の領域のうち少なくとも一方の領域に前記主信号線導体と相対向して配置された平板状接地導体と、
前記平板状接地導体を前記接地導体に接続する接続導体と
を備えた方向性結合器。
A coupling portion comprising a main signal line conductor and a sub signal line conductor disposed in parallel with the main signal line conductor;
A ground conductor disposed separately from the main signal conductor and the sub signal conductor;
A planar ground conductor disposed opposite to the main signal line conductor in at least one of a first region between the coupling portion and the ground conductor and a second region in the vicinity of the side portion; ,
A directional coupler comprising a connection conductor connecting the flat ground conductor to the ground conductor.
主信号線導体および該主信号線導体と平行に配置された副信号線導体からなる結合部と、
前記主信号導体と前記副信号導体とから隔離されて配置された第1の接地導体と、
前記結合部を挟んで、前記第1の接地導体と相対向して配置された第2の接地導体と、
前記結合部と前記第1の接地導体との間の第1の領域およびその側部近傍の第2の領域のうち少なくとも1つの領域に前記主信号線導体と相対向して配置された第1の平板状接地導体と、
前記結合部と前記第2の接地導体との間の第3の領域およびその側部近傍の第4の領域のうち少なくとも1つの領域に前記副信号線導体と相対向して配置された第2の平板状接地導体と、
前記第1の平板状接地導体を前記第1の接地導体に接続する第1の接続導体と、
前記第2の平板状接地導体を前記第2の接地導体に接続する第2の接続導体と
を備えた方向性結合器。
A coupling portion comprising a main signal line conductor and a sub signal line conductor disposed in parallel with the main signal line conductor;
A first ground conductor disposed isolated from the main signal conductor and the sub signal conductor;
A second ground conductor disposed opposite to the first ground conductor across the coupling portion;
A first region disposed opposite to the main signal line conductor in at least one region of a first region between the coupling portion and the first ground conductor and a second region in the vicinity of the first region; A flat ground conductor of
A second region disposed opposite to the sub-signal line conductor in at least one of a third region between the coupling portion and the second ground conductor and a fourth region in the vicinity of the side region; A flat ground conductor of
A first connection conductor connecting the first flat ground conductor to the first ground conductor;
A directional coupler comprising: a second connecting conductor that connects the second flat ground conductor to the second ground conductor.
主信号線導体および該主信号線導体から隔離されて平行に配置された副信号線導体からなる結合部と、
前記主信号導体と前記副信号導体とから隔離されて配置された接地導体と、
前記主信号線導体と前記副信号線導体のうち前記接地導体からより離れた信号線導体と
前記接地導体との間の第5の領域およびその側部近傍の第6の領域のうち少なくとも1つの領域に前記主信号線導体と相対向して配置された平板状接地導体と、
前記平板状接地導体を前記接地導体に接続する接続導体と
を備えた方向性結合器。
A coupling portion comprising a main signal line conductor and a sub signal line conductor disposed in parallel and isolated from the main signal line conductor;
A ground conductor disposed separately from the main signal conductor and the sub signal conductor;
Of the main signal line conductor and the sub signal line conductor, at least one of a fifth area between the signal line conductor further away from the ground conductor and the ground conductor and a sixth area near the side thereof. A planar ground conductor disposed in a region opposite to the main signal line conductor;
A directional coupler comprising a connection conductor connecting the flat ground conductor to the ground conductor.
主信号線導体および該主信号線導体から隔離されて平行に配置された副信号線導体からなる結合部と、
前記主信号導体と前記副信号導体とから隔離されて配置された第1の接地導体と、
前記結合部を挟んで、前記第1の接地導体と相対向して配置された第2の接地導体と、
前記第1の接地導体からより離れた前記主信号線導体と前記第1の接地導体との間の第5の領域およびその側部近傍の第6の領域のうち少なくとも1つの領域に前記主信号線導体と相対向して配置された第1の平板状接地導体と、
前記第2の接地導体からより離れた前記副信号線導体と前記第2の接地導体との間の第7の領域およびその側部近傍の第8の領域のうち少なくとも1つの領域に前記副信号線導体と相対向して配置された第2の平板状接地導体と、
前記第1の平板状接地導体を前記第1の接地導体に接続する第1の接続導体と、
前記第2の平板状接地導体を前記第2の接地導体に接続する第2の接続導体と
を備えた方向性結合器。
A coupling portion comprising a main signal line conductor and a sub signal line conductor disposed in parallel and isolated from the main signal line conductor;
A first ground conductor disposed isolated from the main signal conductor and the sub signal conductor;
A second ground conductor disposed opposite to the first ground conductor across the coupling portion;
The main signal is provided in at least one of a fifth region between the main signal line conductor and the first ground conductor, which is further away from the first ground conductor, and a sixth region near the side thereof. A first planar ground conductor disposed opposite to the line conductor;
The sub signal is provided in at least one of a seventh region between the sub signal line conductor and the second ground conductor, which is further away from the second ground conductor, and an eighth region near the side thereof. A second planar ground conductor disposed opposite the line conductor;
A first connection conductor connecting the first flat ground conductor to the first ground conductor;
A directional coupler comprising: a second connecting conductor that connects the second flat ground conductor to the second ground conductor.
前記平板状接地導体は、その一端で前記接続導体により前記接地導体に接続され、他端が開放された
請求項1または請求項3に記載の方向性結合器。
4. The directional coupler according to claim 1, wherein the flat ground conductor is connected to the ground conductor by the connection conductor at one end thereof and the other end is opened.
前記第1の平板状接地導体は、その一端で前記第1の接続導体により前記第1の接地導体に接続され、他端が電気的に開放された
請求項2または請求項4に記載の方向性結合器。
5. The direction according to claim 2, wherein the first flat ground conductor is connected to the first ground conductor at one end by the first connecting conductor and electrically opened at the other end. Sex coupler.
前記接続導体は、前記平板状接地導体の長手方向に対応した寸法の1/2以下の寸法の範囲内に配置して前記平板状接地導体を前記接地導体に接続する複数の接続導体からなり、
前記平板状接地導体は、少なくともいずれか一端から前記複数の接続導体まで電気的に開放された寸法が前記複数の接続導体を前記平板状接地導体の長手方向に対応して配置した寸法より大きくした請求項1または請求項3に記載の方向性結合器。
The connecting conductor is composed of a plurality of connecting conductors that are arranged within a range of 1/2 or less of the dimension corresponding to the longitudinal direction of the flat ground conductor and connect the flat ground conductor to the ground conductor;
In the flat ground conductor, the dimension that is electrically open from at least one end to the plurality of connection conductors is larger than the dimension in which the plurality of connection conductors are arranged corresponding to the longitudinal direction of the flat ground conductor. The directional coupler according to claim 1 or 3.
前記第1の接続導体は、前記第1の平板状接地導体の長手方向に対応した寸法の1/2以下の寸法の範囲内に配置して前記第1の平板状接地導体を前記第1の接地導体に接続する複数の接続導体からなり、
前記第2の接続導体は、前記第2の平板状接地導体の長手方向に対応した寸法の1/2以下の寸法の範囲内に配置して前記第1の平板状接地導体を前記第2の接地導体に接続する複数の接続導体からなり、
前記第1の平板状接地導体および前記第2の平板状接地導体は、少なくともいずれか一端から前記複数の接続導体まで電気的に開放された寸法が前記複数の接続導体を前記第1の平板状接地導体の長手方向および前記第2の平板状接地導体に対応して配置した寸法より大きくした請求項2または請求項4に記載の方向性結合器。
The first connecting conductor is disposed within a range of a dimension of ½ or less of the dimension corresponding to the longitudinal direction of the first flat ground conductor, and the first flat ground conductor is disposed in the first flat conductor. It consists of multiple connection conductors connected to the ground conductor,
The second connecting conductor is disposed within a range of a dimension of ½ or less of the dimension corresponding to the longitudinal direction of the second flat ground conductor, and the first flat ground conductor is disposed in the second flat conductor. It consists of multiple connection conductors connected to the ground conductor,
The first plate-like ground conductor and the second plate-like ground conductor are electrically open from at least one end to the plurality of connection conductors, and the plurality of connection conductors are the first plate-like shape. 5. The directional coupler according to claim 2, wherein the directional coupler is larger than a length of the ground conductor and a size arranged corresponding to the second flat ground conductor.
前記接続導体および前記平板状接地導体は、前記主信号線導体の前記結合部の長手方向に対応した箇所と前記副信号線導体の前記結合部の長手方向に対応した箇所とからの距離が等しい対称面に交わるように配置された
請求項1または請求項3に記載の方向性結合器。
The connection conductor and the flat ground conductor are equal in distance from a location corresponding to the longitudinal direction of the coupling portion of the main signal line conductor and a location corresponding to the longitudinal direction of the coupling portion of the sub signal line conductor. The directional coupler according to claim 1, wherein the directional coupler is disposed so as to intersect with a plane of symmetry.
前記第1の接続導体および第1の前記平板状接地導体並びに前記第2の接続導体および第2の前記平板状接地導体は、前記主信号線導体の前記結合部の長手方向に対応した箇所と前記副信号線導体の前記結合部の長手方向に対応した箇所とからの距離が等しい対称面に交わるように配置された
請求項2または請求項4に記載の方向性結合器。
The first connection conductor, the first flat plate-like ground conductor, the second connection conductor, and the second flat plate-like ground conductor are located at locations corresponding to the longitudinal direction of the coupling portion of the main signal line conductor. 5. The directional coupler according to claim 2, wherein the directional coupler is disposed so as to intersect a plane of symmetry having the same distance from a portion corresponding to a longitudinal direction of the coupling portion of the sub signal line conductor.
前記主信号導体および前記副信号導体並びに前記平板状接地導体は、折り曲げ構造を有する請求項1または請求項3に記載の方向性結合器。   The directional coupler according to claim 1 or 3, wherein the main signal conductor, the sub signal conductor, and the flat ground conductor have a bent structure. 前記主信号導体および前記副信号導体並びに前記第1の平板状接地導体および前記第2の平板状接地導体は、折り曲げ構造を有する請求項2または請求項4に記載の方向性結合器。   5. The directional coupler according to claim 2, wherein the main signal conductor, the sub signal conductor, the first flat ground conductor, and the second flat ground conductor have a bent structure. 前記接地導体は、切り欠きを有する請求項1または請求項3に記載の方向性結合器。   The directional coupler according to claim 1, wherein the ground conductor has a notch. 前記第1の接地導体および前記第2の接地導体のうち少なくとも1つは、切り欠きを有する請求項2または請求項4に記載の方向性結合器。   The directional coupler according to claim 2 or 4, wherein at least one of the first ground conductor and the second ground conductor has a notch. 前記平板状接地導体は、切り欠きを有する請求項1または請求項3に記載の方向性結合器。   The directional coupler according to claim 1, wherein the flat ground conductor has a notch. 前記第1の平板状接地導体および前記第2の平板状接地導体のうち少なくとも1つは、切り欠きを有する請求項2または請求項4に記載の方向性結合器。   The directional coupler according to claim 2 or 4, wherein at least one of the first flat ground conductor and the second flat ground conductor has a notch.
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JPH1079608A (en) * 1996-09-03 1998-03-24 Atr Kodenpa Tsushin Kenkyusho:Kk Directional coupler

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JP2021069003A (en) * 2019-10-23 2021-04-30 学校法人慶應義塾 Communication module and communication circuit
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