JP2015201494A - Electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component capable of improving sealability of an opening which is formed by insert molding.SOLUTION: In the state where a plate part 11 of a metal conductor is supported by a supporting projection 21 within a metal mold 20, a molten resin is injected and a bottom wall 3a of a substrate 3 is formed. Therefore, an opening 3d is formed on the bottom wall 3a after molding. Around the opening 3d, a connecting resin layer 30 is interposed which is formed from an insulator resin layer 31 and an adhesive resin layer 32, and the adhesive resin layer 32 is being compatible with a synthetic resin forming the bottom wall 3a. Since the connecting resin layer 30 is present around openings 3d and 3e, sealability in peripheral portions of the openings 3d and 3e can be improved.

Description

  The present invention relates to an electronic component in which a metal conductor is inserted into a synthetic resin base constituting a housing or the like.

  Synthetic resin bases in which metal conductors are embedded are often used for housings and cases of electronic components, and this type of base is manufactured by a so-called insert molding method.

  In the electronic component described in Patent Document 1, a storage chamber is formed by a cover body in which metal terminals are embedded by insert molding and a housing. In the insert molding process for manufacturing the lid body, the resin is injection molded in the mold while the terminal is pressed by the pressing pin in the mold, and the position of the terminal is shifted in the mold by the resin pressure. It is prevented. In this molding step, pin holes corresponding to the shape of the pressing pins are formed in the molded lid.

Japanese Patent Laid-Open No. 10-55906

  In general, terminals formed from a metal plate material are plated on the surface and subjected to antiseptic treatment on the surface. Therefore, in the insert molding, the adhesion between the surface of the metal terminal and the resin constituting the lid is not so good, and there is a limit to maintaining the airtightness of the storage chamber formed by the lid and the housing.

  In particular, as described in Patent Document 1, in the structure in which the pin hole leading from the surface of the lid to the internal terminal is formed, the adhesion between the metal terminal and the lid is reduced in the peripheral portion of the pin hole. The sealing performance around the pin hole is likely to be impaired, and the possibility of liquid permeating from the periphery of the pin hole into the storage chamber is increased.

  The present invention solves the above-described conventional problems, and an object of the present invention is to provide an electronic component that can improve the sealing performance between a metal conductor and a base around an opening formed by a so-called insert molding process. It is said.

The present invention is an electronic component in which a metal conductor is embedded in a synthetic resin base,
An opening is formed in the base body so as to reach the surface of the metal conductor, and a single-layer or multi-layer connecting resin layer is formed on the entire surface of the metal conductor at least around the opening. It is formed, and the surface layer of the joining resin layer is compatible with the synthetic resin forming the base.

  In the electronic component of the present invention, the metal conductor and the base are connected and filled with the resin layer in the entire peripheral area around the opening, so that the sealing performance around the opening can be improved and formed with the base. The airtightness inside the housing can be increased.

  In the present invention, the base body is insert-molded, and the opening is formed by a support protrusion that supports the metal conductor in a mold.

  In the electronic component of the present invention, it is preferable that the surface layer of the connecting resin layer and the synthetic resin forming the base have the same main component. For example, the main component is a polyamide resin.

  By using the resin having the same system as the main component as described above, the adhesion between the connecting resin layer and the substrate can be further improved.

  In this invention, it is preferable that the surface layer of the said connection resin layer has elasticity higher than the said base | substrate.

  With this setting, even when the synthetic resin constituting the substrate contracts in the cooling process when the substrate is molded, the connecting resin layer can follow this deformation, and the adhesion between the connecting resin layer and the substrate is maintained. become able to.

As for the electronic component of this invention, it is preferable that the surface of the metal conductor in which the said connection resin layer is formed is activated.
By this activation treatment, the adhesion between the metal conductor and the connecting resin layer can be enhanced.

  In the present invention, it is preferable that the metal conductor is formed of a band-shaped metal plate material, and the connecting resin layer is formed on the entire surface of the metal plate material in the width direction.

  In the above configuration, even if the position of the opening is shifted due to tolerance, it is easy to arrange the resin layer on the entire circumference around the opening.

  In the present invention, in the structure in which the opening is formed in the base body by insert molding, since the connecting resin layer is formed between the metal conductor and the base on the entire periphery of the opening, the entire periphery of the opening is formed. For example, when the housing is formed of a base, it is possible to increase the sealing degree in the housing.

(A) is a perspective view which shows an example of the electronic component manufactured with the manufacturing method of this invention, (B) is the top view, Sectional drawing which cut | disconnected the electronic component shown in FIG. 1 (A) by the II-II line | wire, FIG. 2 is an enlarged sectional view showing a part of FIG. FIG. 3 is a partially enlarged cross-sectional view of a part IV in FIG. The partial expanded sectional view of the V section of FIG. FIG. 3 is a partially enlarged cross-sectional view of the VI part of FIG. Diagram showing the properties of the adhesive resin layer during heat treatment, A cross-sectional photograph showing the joint between the metal conductor and the substrate,

  The electronic component 1 shown in FIGS. 1A and 1B and FIG. 2 has a housing 2. The housing 2 includes a base 3 and a lid 4. The lid 4 is made of a synthetic resin material that can be bent and deformed. The base 3 is formed of a synthetic resin and has a bottom wall 3a and four side walls 3b. The base 3 has an opening surrounded by the upper end of the side wall 3 b, and this opening is closed by a lid 4, and a housing space 5 that is a sealed space is formed inside the housing 2. The housing 2 has a minute structure, and is formed in a cube or a rectangular parallelepiped so that the maximum value of one side is 5 mm or less, and further 2 mm or less.

  The detection element 6 is accommodated in the storage space 5 of the housing 2. The detection element 6 is a MEMS (Micro Electro Mechanical Systems) element, and is mainly composed of a silicon substrate. The detecting element 6 is a force sensor, and the deforming portion is bent by an external pressure, and the bending amount is detected by a change in electric charge. Since the lid body 4 is formed of a flexible resin material, the lid body 4 is deformed according to the external pressure, and the change in the internal pressure of the storage space 5 at that time is detected by the detection element 6. Therefore, the storage space 5 needs to be an airtight space cut off from outside air.

  As shown in FIGS. 1A, 1B, 2 and 3, four metal conductors 10 are embedded and fixed in the bottom wall portion 3a of the base 3 by a so-called insert molding method.

  As shown in FIGS. 2 and 3, each metal conductor 10 has a first plate portion 11 and a second plate portion 12. The first plate portion 11 extends in parallel with the bottom surface 3c of the bottom wall portion 3a, and the second plate portion 12 is bent at a substantially right angle from the first plate portion 11 and vertically upwards with respect to the bottom surface 3c. It extends. The boundary between the first plate portion 11 and the second plate portion 12 is a bent portion 15. The metal conductor 10 is integrally formed with an external terminal portion 14 that is continuous with the first plate portion 11 and an internal terminal portion 13 that is continuous with the second plate portion 12. The internal terminal portion 13 is bent at a substantially right angle from the second plate portion 12 and extends substantially parallel to the bottom surface 3c.

  In the metal conductor 10, a first plate portion 11 and a second plate portion 12 are embedded in the bottom wall portion 3 a of the base 3. The external terminal portion 14 protrudes to the side of the base 3. The other portion of the internal terminal portion 13 is embedded in the bottom wall portion 3 a with the upper surface 13 b exposed in the storage space 5. Inside the storage space 5, the upper surface 13b of the internal terminal portion 13 of the four metal conductors 10 is exposed. The detection element 6 has electrodes formed at four locations, and the electrodes and the internal terminal portions 13 are connected by solder fillets 7 in a one-to-one relationship.

  As shown in FIGS. 2 and 3, in the bottom wall portion 3a of the base 3, a first opening 3d is opened from the bottom surface 3c to the lower surface 11a of the first plate portion 11, and from the bottom surface 3c to the inside. A second opening 3 e is opened to the lower surface 13 a of the terminal portion 13.

  In the insert forming process for manufacturing the base 3, the metal conductor 10 is installed inside the mold 20 partly shown in FIGS. 5 and 6. At this time, as shown in FIG. 5, the first plate portion 11 is supported by a support protrusion 21 provided in the mold 20, and as shown in FIG. 6, the internal terminal portion 13 is a support protrusion 22. The molten resin is injected into the mold 20 while being supported. Since the metal conductor 10 is supported by the support protrusions 21 and 22, the metal conductor 10 can be accurately positioned in the cavity of the mold 20, and the base 3 can be injection-molded.

  When the molten resin injected into the mold 20 is cooled and solidified, the support protrusions 21 and 22 are retracted in the mold 20 and extracted from the bottom wall portion 3a, and the mold 20 is separated and molded. The subsequent substrate 3 is taken out. In the base 3, a first opening 3 d is formed where the support protrusion 21 is extracted, and a second opening 3 e is formed where the support protrusion 22 is extracted.

  As shown in FIG. 3, the metal conductor 10 has different surface treatment conditions depending on the location. The metal conductor 10 can be divided into sections (i), (ii), (iii), and (iv) according to the difference in the conditions.

  In the section (i) shown in FIG. 3, the same surface treatment is applied to the lower surface 11 a of the first plate portion 11, the left surface 12 a of the second plate portion 12, and the lower surface 13 a of the internal terminal portion 13. ing.

  4, FIG. 5, and FIG. 6 show the IV, V, and VI parts of FIG. 3 in an enlarged manner. As shown in each of these drawings, in the section (i), the lower surface 11a of the first plate portion 11 and the left surface 12a of the second plate portion 12 and the lower surface 13a of the internal terminal portion 13 The connecting resin layer 30 is formed. The connecting resin layer 30 includes an insulating resin layer 31 formed in close contact with the surfaces 11a, 12a, and 12a, and an adhesive resin layer 32 laminated on the insulating resin layer 31. The adhesive resin layer 32 is a surface layer of the connecting resin layer 30. As shown in FIGS. 4 and 5, only the adhesive resin layer 32 is formed on the upper surface 11 b of the first plate portion 11 and the right surface 12 b of the second plate portion 12 in the section (ii).

  In the section (i), it is necessary to improve the adhesion between the surfaces 11a, 12a and 13a of the metal conductor 10 and the insulating resin layer 31 which is the lower layer of the connecting resin layer 30, and in the section (ii), the metal conductor It is necessary to improve the adhesion between the surfaces 11b and 12b of the adhesive 10 and the adhesive resin layer 32. Therefore, activation treatment is performed on the surfaces 11a, 12a, and 13a in the section (i) and the surfaces 11b and 12b in the section (ii) in a step before the resin layers 31 and 32 are formed.

  The metal conductor 10 in the embodiment is silver-plated on both surfaces of the phosphor bronze plate, and various protective agents such as a fluorine-based sulfidation inhibitor and a rust preventive agent are applied to the surface of the silver plating. Yes. As the activation treatment, the surface of the metal plate forming the metal conductor 10 is irradiated with vacuum ultraviolet light. As a light source for vacuum ultraviolet light, an excimer UV lamp (wavelength: 172 nm) in which xenon gas is sealed is preferably used. Since the vacuum ultraviolet light is greatly attenuated in the atmosphere, the distance between the metal conductor 10 and the lamp is set close to several mm to several tens mm. When the vacuum ultraviolet light is irradiated, the organic substance on the surface of the metal conductor 10 is cut by the low wavelength ultraviolet light, and oxygen in the air between the lamp and the metal conductor 10 is decomposed to form ozone. For example, the protective agent on the surface is removed. At the same time, the polarization of the surface of the metal conductor 10 is promoted, the surface free energy is increased, and the wettability is improved.

  The insulating resin layer 31 and the adhesive resin layer 32 constituting the connecting resin layer 30 are formed by selecting resin materials having an affinity for each other. Further, after the insulating resin layer 31 is formed, the surface is irradiated with vacuum ultraviolet light to increase the surface free energy of the insulating resin layer 31, and then the adhesive resin layer 32 is formed thereon, whereby the insulating resin layer 31 is formed. The adhesion between the layer 31 and the adhesive resin layer 32 can be further increased.

  The adhesive resin layer 32 is compatible with the synthetic resin constituting the substrate 3, and the synthetic resin constituting the adhesive resin layer 32 and the substrate 3 is selected and used. In the embodiment, the synthetic resin constituting the substrate 3 is a polyamide, and nylon 9T, which is a kind of so-called engineer plastic, is used. The adhesive resin layer 32 is formed using a two-liquid mixed type adhesive resin. In the adhesive resin in the embodiment, a nylon resin and an isocyanate curing agent are mixed to form a polyamide resin, and a crosslinking reaction is caused by heat treatment.

  FIG. 7 shows the relationship between temperature rise and state change of the nylon adhesive resin. The horizontal axis represents the heating temperature, the vertical axis represents the heat change, the positive side of the vertical axis represents the exothermic reaction, and the negative side represents the endothermic reaction.

  The range of (a) shown in FIG. 7 is a process of drying the adhesive resin, and the adhesive resin is in a so-called hot melt state. When the solvent evaporates by being heated to around 109 ° C., it enters the range (b) and becomes a dry state, and the crosslinking reaction is started as the temperature rises. When the temperature further exceeds 150 ° C. or 160 ° C. and falls within the range of (c), the three-dimensional crosslinking is promoted to become water insoluble.

  The adhesive resin layer 32 is used in a state in which an adhesive resin is applied to the surface of the metal plate constituting the metal conductor 10 and heated under the temperature condition in the range shown in FIG. That is, the adhesive resin is dried under heating conditions of 110 ° C. to 150 ° C. or 110 to 160 ° C., and is used in a temporarily cured state that is not in a completely crosslinked state, that is, in a partially crosslinked state. In the insert molding method, the adhesive resin layer 32 is heated and melted by coming into contact with the molten resin injected into the mold, and the adhesive resin layer 32 and the synthetic resin forming the substrate 3 are in a compatible state. Therefore, the molded base 3 is fixed to the metal conductor 10.

  Moreover, it is preferable that the adhesive resin layer 32 has a higher elasticity than the base 3, that is, has a low elastic coefficient. If the elastic modulus of the adhesive resin layer 32 is set lower than that of the synthetic resin constituting the base body 3, even when heat shrinkage occurs in the synthetic resin constituting the base body 3 in the cooling process of insert molding, The adhesive resin layer 32 follows the deformation, and the compatible state of the adhesive resin layer 32 and the substrate 3 can be maintained.

  As described above, the insulating resin layer 31 and the adhesive resin layer 32 are formed of a resin material having an affinity and good adhesion. In the embodiment, the insulating resin layer 31 is formed of a urethane resin, and isocyanate is used as a curing agent. The nylon resin and urethane resin forming the adhesive resin layer 32 are well known to have similar chemical structures, and the insulating resin layer 31 and the adhesive resin layer 32 use the same isocyanate curing agent. doing. By selecting the resin as the insulating resin layer 31 and the adhesive resin layer 32, the adhesion between the resin layers is improved.

  The insulating resin layer 31 is not in a temporarily cured state as in the adhesive resin layer 32, but is formed in a state in which the three-dimensional crosslinking is promoted and becomes almost insoluble. That is, the adhesive resin layer 32 is formed in a pre-cured state with a low degree of cross-linking, but the insulating resin layer 31 is one in which three-dimensional cross-linking is promoted more than the adhesive resin layer 32. Therefore, the insulating resin layer 31 is used after being heated at a temperature higher than that of the adhesive resin layer 32. The heat treatment temperature of the insulating resin layer 31 is preferably, for example, 180 ° C. or higher. In the insert molding method, the adhesive resin layer 32 is compatible with the synthetic resin constituting the base 3 as described above, but the insulating resin layer 31 is completely compatible with the synthetic resin constituting the base 3. The insulating resin layer 31 remains on the surface of the metal conductor 10.

  FIG. 8 is an electron micrograph of a partial cross-section of the substrate 3 with the metal conductor 10 inserted therein. After the surface of the metal conductor 10 was activated by irradiation with vacuum ultraviolet light, the insulating resin layer 31 was formed, and after the surface of the insulating resin layer 31 was activated by irradiation with vacuum ultraviolet light, the adhesive resin layer 32 was formed. Is. This photo is 50,000x. In FIG. 8, 10 is a metal conductor and 10a is a plating layer. A structure in which the insulating resin layer 31 is in close contact with the surface of the plating layer 10 a and the adhesive resin layer 32 is in a compatible state with the synthetic resin of the substrate 3 appears.

  In the base body 3 after the insert molding, the adhesive resin layer 32 formed on the two surfaces 11 a and 11 b of the first plate portion 11 of the metal conductor 10 is in a compatible state with the synthetic resin constituting the base body 3. The adhesive resin layer 32 formed on the two surfaces 12 a and 12 b of the second plate portion 12 is compatible with the synthetic resin constituting the base 3. Therefore, it is difficult to form a gap in the close contact portion between the metal conductor 10 and the bottom wall portion 3a of the base body 3, and the airtightness of the storage space 5 inside the housing 2 shown in FIG. 2 can be improved. As a result, it is possible to reduce the possibility that a solvent such as moisture or flux or other liquid penetrates into the storage space 5 from the gap.

  In the metal conductor 10, the adhesive resin layer 32 is also formed on both surfaces of the bent portion 15 at the boundary between the first plate portion 11 and the second plate portion 12. The synthetic resin constituting the substrate 3 can be firmly fixed.

  In the insert molding method using the metal conductor 10 having the bent portion 15, the flow of the molten resin is deteriorated around the bent portion 15, so that when the resin is cooled and solidified, the sink around the bent portion 15 is called sink. Deformation is likely to occur. If the bottom wall portion 3a is thin, the resin strength tends to decrease at the portion where the bent portion 15 is embedded. However, the adhesive resin layer 32 is provided on both surfaces of the first plate portion 11 and the second plate portion 12 located on both sides of the bent portion 15, and the adhesive resin layer 32 is also provided on the surface of the bent portion 15. Therefore, the metal conductor 10 and the base 3 are firmly fixed in the region including the bent portion 15, and the problem of sink marks and the problem of strength reduction are less likely to occur.

  As shown in FIG. 4, the adhesive resin layer 32 formed on the two surfaces 11 a and 11 b of the first plate portion 11 is formed of the resin constituting the substrate 3 at the portion where the external terminal portion 14 protrudes from the substrate 3. In a compatible state, the first plate portion 11 and the base 3 are firmly fixed. Therefore, no gap is formed between the metal conductor 10 and the base body 3 at the protruding base portion of the external terminal portion 14, and the airtightness of the storage space 5 can be kept high. Furthermore, the strength of the base 3 around the protruding base portion of the external terminal portion 14 can be increased.

  Since the metal conductor 10 is cut from a metal plate (so-called hoop base material) in which the insulating resin layer 31 and the adhesive resin layer 32 are formed on two surfaces, the metal conductor 10 has the surfaces 11a, 12a, The insulating resin layer 31 and the adhesive resin layer 32 are formed on 13a, and the adhesive resin layer 32 is formed on the surfaces 11b and 12b facing upward. The side surface that serves as a cut surface during the cutting process (the side surface on which the plate thickness appears) Neither resin layer is formed. However, since the metal conductor 10 is heated in the insert molding process, the adhesion is formed on the two surfaces 11a and 11b of the plate part 11, the two surfaces 12a and 12b of the plate part 12, and the surface 13a of the plate part 13. The resin layer 32 is heated to be in a molten state, and a part of the adhesive resin 32 that is in a molten state due to the pressure of the molten resin at the time of injection molding wraps around the side surface of the metal conductor 10. As a result, the adhesive resin layer 32 is present at least partially between the side surface of the metal conductor 10 and the bottom wall portion 3a of the base 3, and between the side surface of the metal conductor 10 and the bottom wall portion 3a. It becomes difficult to form a gap, and the airtightness of the storage space 5 inside the housing 2 can be enhanced.

  In the section (iii) shown in FIG. 3, the lower surface 13 a of the internal terminal portion 13 is fixed to the synthetic resin constituting the substrate 3 by the adhesive resin layer 32. On the other hand, as shown in FIG. 6, the upper surface 13b of the internal terminal portion 13 is exposed from the bottom wall portion 3a. The upper surface 13b is not formed with the insulating resin layer 31 or the adhesive resin layer 32, and is not subjected to the activation treatment using vacuum ultraviolet light. It remains covered with the agent.

  In the section (iv), the external terminal portion 14 protrudes to the side of the base 3, but the insulating resin layer 31 and the adhesive resin layer 32 are also formed on the upper surface 14 a and the lower surface 14 b of the external terminal portion 14. Further, the activation treatment using vacuum ultraviolet light is not performed. Therefore, the surfaces 14a and 14b remain silver-plated with a protective agent such as an antisulfurizing agent.

  Therefore, the upper surface 13b of the internal terminal portion 13, the lower surface 14a and the upper surface 14b of the external terminal portion 14 can be kept in a state in which silver plating is hardly corroded.

  As shown in FIG. 5 and FIG. 6, in the step of insert-molding the base 3, the lower surface 11 a of the first plate portion 11 is supported in contact with the support protrusion 21 in the mold, and the internal terminal portion The molds and the support protrusions 21 and 22 are heated in a state where the lower surface 13a of 13 is also in contact with and supported by the support protrusion 22. At this time, the temporarily cured adhesive resin layer 32 is melted at the portion where the support protrusions 21 and 22 are in contact, and the adhesive resin layer 32 is removed at the portion where the support protrusions 21 and 22 are in contact. Moreover, the adhesive resin layer 32 is heat-processed in the range of (b) shown in FIG. 7, and adhesiveness has fallen compared with the hot-melt state of the range of (a). Therefore, the molten adhesive resin layer 32 is unlikely to adhere to the tip surfaces of the support protrusions 21 and 22.

  On the other hand, since the insulating resin layer 31 is formed in a three-dimensional cross-linked state, it does not melt due to the mold temperature, and the surface of the metal conductor 10 is the insulating resin layer even at the part where the support protrusions 21 and 22 abut. The state covered with 31 is maintained.

  In the base 3 after the insert molding, as shown in FIGS. 2 and 3, openings 3 d and 3 e that lead from the bottom surface 3 c to the metal conductor 10 are formed in a plurality of locations on the bottom wall portion 3 a of the base 3.

  As shown in FIGS. 5 and 6, around the openings 3d and 3e, the adhesive resin layer 32 serving as the surface layer of the connecting resin layer 30 and the resin constituting the substrate 3 are cured after being in a compatible state. . Therefore, the entire circumference of the openings 3d and 3e is a structure filled with the connecting resin layer 30 that is a two-layer structure of the insulating resin layer 31 and the adhesive resin layer 32. In this peripheral portion, the metal conductor 10 and the base 3 No gap is formed between the two and the sealing performance is improved. Therefore, the airtightness in the storage space 5 can be further enhanced.

  Further, the metal conductor 10 is exposed inside the openings 3d and 3e that open to the bottom surface 3c of the bottom wall 3a. However, as shown in FIGS. 5 and 6, the metal conductor 10 is formed inside the openings 3d and 3e. Since the surface is covered with the insulating resin layer 31, the insulation of the metal conductor 10 is maintained.

  Since the housing 2 is a small cube or a rectangular parallelepiped having a side of 5 mm or less and further 2 mm or less, when liquid (including a solvent such as flux) may adhere to the bottom surface 3 c of the base 3, the liquid may be in multiple locations. It becomes easy to enter the openings 3d and 3e at the same time. However, since the surface of the metal conductor 10 appearing at the bottom of the openings 3d and 3e is covered and insulated by the insulating resin layer 31, it is possible to prevent the metal conductors 10 from being short-circuited by the liquid.

  Each metal conductor 10 has a strip shape, and the horizontal direction in FIG. 1B is the longitudinal direction, and the vertical direction is the width direction. Since the connecting resin layer 30 is formed over the entire width direction of the metal conductor 10, when the metal conductor 10 is supported in the mold, between the support protrusions 21 and 22 and the metal conductor 10, Even if the positional deviation in the width direction (the vertical direction in FIG. 1B) occurs, it is easy to configure a state in which the resin layer 30 is connected to the entire periphery of the openings 3d and 3e. Further, as shown in FIGS. 5 and 6, since the connecting resin layer 30 is formed in a long range in the longitudinal direction, the left and right sides of FIG. 1B are interposed between the support protrusions 21 and 22 and the metal conductor 10. Even if a positional tolerance shift occurs in the direction, it is easy to configure a state in which the resin layer 30 is connected to the entire periphery of the openings 3d and 3e.

  In the embodiment, the connecting resin layer 30 having a two-layer structure of the insulating resin layer 31 and the adhesive resin layer 32 is formed at least around the openings 3d and 3e. A one-layered connecting resin layer having only the adhesive resin layer 32 may be formed on the side surface 11a and the lower surface 13a. In this case, an adhesive resin layer 32 is interposed between the metal conductor 10 and the base 3 around the periphery of the openings 3d and 3e, and the adhesive resin layer 32 is compatible with the synthetic resin constituting the base 3. Therefore, it is possible to improve the sealing performance around the peripheries of the openings 3d and 3e. In the above embodiment, the synthetic resin constituting the substrate 3 is described as nylon 9T, the adhesive resin constituting the adhesive resin layer 32 as nylon resin, and the resin forming the insulating resin layer 31 as urethane resin. The resins are not limited to the above combinations as long as they have compatibility and affinity with each other. For example, in addition to the same materials such as urethane-urethane, acrylic-acrylic, olefin-olefin, epoxy-epoxy, isocyanate-isocyanate, epoxy-urethane, urethane-isocyanate Combinations such as epoxy and isocyanate-isocyanate are possible. In addition, the activation treatment for promoting the polarization is not limited to the irradiation with vacuum ultraviolet light, but includes plasma treatment, UV ozone treatment, corona treatment, chemical conversion treatment, flame treatment, heat treatment, anodizing treatment, etc. Also good.

DESCRIPTION OF SYMBOLS 1 Electronic component 2 Housing 3 Base | substrate 3a Bottom wall part 3d, 3e Opening part 5 Storage space 6 Sensing element 10 Metal conductor 11 1st board part 11a Lower surface 11b Upper surface 12 Second board part 12a Left surface 12b Right surface 13 Internal terminal portion 13a Lower surface 13b Upper surface 14 External terminal portion 15 Bent portion 20 Molds 21, 22 Supporting protrusion 30 Connecting resin layer 31 Insulating resin layer 32 Adhesive resin layer

Claims (7)

In an electronic component in which a metal conductor is embedded inside a synthetic resin base,
An opening is formed in the base body so as to reach the surface of the metal conductor, and a single-layer or multi-layer connecting resin layer is formed on the entire surface of the metal conductor at least around the opening. An electronic component, wherein the electronic component is formed, and the surface layer of the connecting resin layer is compatible with a synthetic resin forming the base.   The electronic component according to claim 1, wherein the base is insert-molded, and the opening is formed by a support protrusion that supports the metal conductor in a mold.   The electronic component according to claim 1, wherein the surface layer of the connecting resin layer and the synthetic resin forming the base have the same main component.   The electronic component according to claim 3, wherein the main component is a polyamide resin.   The electronic component according to claim 1, wherein a surface layer of the connecting resin layer has higher elasticity than the base.   The electronic component according to claim 1, wherein a surface of the metal conductor on which the connecting resin layer is formed is activated.   The electronic component according to any one of claims 1 to 6, wherein the metal conductor is formed of a band-shaped metal plate material, and the connecting resin layer is formed on the entire surface of the metal plate material in the width direction.