JP2015196124A - Roll sponge holder, manufacturing method of roll sponge, substrate cleaning device, and substrate processing apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a sponge holder which enables a sponge body to be easily inserted therethrough without causing deformation of the sponge body and the occurrence of foreign objects.SOLUTION: A roll sponge 51 comprises: a sponge body 60; and a sponge holder 61. The sponge holder 61 includes: an inner core 63; an outer core 64; and holding members 65. Each holding member 65 is disposed between the sponge body and the inner core and may move between a holding position where the holding member 65 presses the sponge body 60 from the inner side to hold the sponge body 60 and a release position where the holding member 65 releases the sponge body 60. The holding member 65 includes: a taper shaped engagement part 65b which contacts with an outer periphery part of the inner core 63; and a fastening part 65a which presses the sponge body 60 from the inner side at the holding position. When the inner core 63 rotates to push up the engagement part 65b, the holding member 65 moves to the holding position.

Description

  The present invention relates to a roll sponge holder for manufacturing a roll sponge, a method for manufacturing the roll sponge, and a substrate cleaning apparatus and a substrate processing apparatus using the roll sponge.

  A roll sponge is used for scrub cleaning the surface of a semiconductor wafer. Such a roll sponge is manufactured by fixing a cylindrical sponge body to a rotating shaft. Here, if the sponge body is forcibly pushed into the rotating shaft when the sponge body is fixed, excessive stress is applied to the sponge body and kinking occurs, which leads to a decrease in cleaning performance. .

  Therefore, in the roll sponge described in Patent Document 1, a sponge body is formed of a reversible material between a wet state and a dry state, the sponge body is dried to increase rigidity, and the rotating shaft is inserted. The sponge body is fixed to the rotating shaft by returning to a wet state later.

Japanese Patent No. 3844635

  According to the technique described in Patent Document 1, although there is no possibility that the sponge body is deformed when the rotating shaft is inserted, it is necessary to dry the sponge body in order to increase rigidity. Since the state changes, the generation of foreign matter from the sponge body may be increased. As a result, foreign matters are likely to flow out from the sponge body, leading to a reduction in cleaning performance.

  The present invention has been made in view of the above circumstances, a roll sponge holder capable of easily inserting a sponge body without causing deformation of the sponge body and generation of foreign matter, a method of manufacturing a roll sponge, and It is an object of the present invention to provide a substrate cleaning apparatus and a substrate processing apparatus provided with this roll sponge.

  A roll sponge holder according to an embodiment of the present invention holds a cylindrical sponge body, and is disposed between an inner core and the sponge body and the inner core, and the sponge body is viewed from the inside. A holding member that can be moved between a holding position that presses and holds the sponge body and a release position that releases the sponge body, and a movement that moves the sponge body between the holding position and the release position. And a mechanism.

  With this configuration, it is possible to provide a holding member that can move the holding position and the release position and press the sponge body from the inside to hold it, easily without causing deformation of the sponge body or generation of foreign matter. It becomes possible to insert the sponge body.

  In the roll sponge holder configured as described above, the holding member includes a tapered engaging portion that comes into contact with an outer peripheral portion of the inner core, and a fixing portion that presses the sponge body from the inside at the holding position, The engaging portion is pushed up by the rotation of the inner core, and the holding member moves to the holding position. With this configuration, the sponge body can be reliably fixed from the inside with a simple configuration.

The roll sponge holder according to an embodiment of the present invention includes an outer core that is attached to a position between the sponge body and the inner core and supports the holding member in the release position. And With this configuration, the holding member can be reliably assembled without contacting the sponge body.

  In the roll sponge manufacturing method according to an embodiment of the present invention, an inner core is inserted inside a cylindrical sponge body, an outer core is inserted at a position between the sponge body and the inner core, and the outer sponge is inserted. The holding member is inserted into a release position that is supported by the core and does not come into contact with the sponge body, the inner core is rotated, the holding member is pushed up in the outer diameter direction, and moved to the holding position where the sponge body is pressed from the inside. It is characterized by making it. Also with this configuration, the sponge body can be easily inserted without causing deformation of the sponge body or generation of foreign matter.

  A roll sponge in which a sponge member is attached to a roll sponge holder according to an embodiment of the present invention can be used in a substrate cleaning apparatus. The substrate cleaning apparatus preferably includes the roll sponge, a drive mechanism that moves the roll sponge to a position where the roll sponge contacts the substrate and rotates the roll sponge, and a liquid supply unit that supplies a cleaning liquid to the substrate. . A semiconductor manufacturing apparatus including this substrate cleaning apparatus and a polishing apparatus for polishing a semiconductor substrate is preferable.

  According to the present invention, since the sponge body is pressed from the inside by the holding member movable to the holding position and the release position and held, the sponge body is easily deformed without causing deformation of the sponge body or generation of foreign matter. It is possible to insert the sponge body into the.

It is a top view which shows the structure of the substrate processing apparatus provided with the roll sponge which concerns on one Embodiment of this invention. It is a schematic diagram which shows an example of a washing line. It is a perspective view which shows the structure of a washing | cleaning module. It is sectional drawing of the roll sponge in a release state, (A) is sectional drawing of radial direction, (B) is sectional drawing of the longitudinal direction along the AA line. It is sectional drawing of the roll sponge in a fixed state, (A) is sectional drawing of radial direction, (B) is sectional drawing of the longitudinal direction along the BB line. It is sectional drawing which shows the manufacturing process of roll sponge.

  Hereinafter, embodiments of a substrate processing apparatus provided with a roll sponge according to the present invention will be described with reference to the drawings. In addition, the same code | symbol is attached | subjected to the component which is the same or it corresponds, and the overlapping description is abbreviate | omitted.

  FIG. 1 is a plan view showing the overall configuration of a substrate processing apparatus. The substrate processing apparatus is divided into a load / unload unit 12, a polishing unit 13, and a cleaning unit 14, which are rectangular housings. 11 is provided. Further, the substrate processing apparatus includes a control unit 15 that controls the operation of the substrate processing.

  The load / unload unit 12 includes a plurality of front load units 20, a travel mechanism 21, and two transfer robots 22. A wafer cassette for stocking a large number of wafers (substrates) is placed on the front load unit 20. The transfer robot 22 has two hands on the upper and lower sides, and moves on the traveling mechanism 21 to take out the wafer W from the wafer cassette in the front load unit 20 and send it to the polishing unit 13 and from the cleaning unit 14. An operation of returning the processed wafer to be sent back to the wafer cassette is performed.

  The polishing unit 13 is a region for polishing (planarizing) a wafer, and a plurality of (four in FIG. 1) polishing units 13A to 13D are provided and arranged along the longitudinal direction of the substrate processing apparatus. . The wafer W may be polished by any of these polishing units 13A to 13D, or may be continuously polished by a plurality of preselected polishing units.

  Each polishing unit includes a polishing table 30 to which a polishing pad having a polishing surface is attached, a top ring 31 for polishing while pressing a wafer on the polishing table 30 against the polishing pad, and a polishing liquid or dressing on the polishing pad. A polishing liquid supply nozzle 32 for supplying a liquid, a dresser 33 for dressing the polishing surface of the polishing pad, a polishing waste remaining on the polishing surface by spraying a liquid-gas mixed fluid or a mist-like liquid onto the polishing surface An atomizer 34 for washing away the abrasive grains is provided. Each polishing unit is provided with a sensor (not shown) (for example, an optical sensor or an eddy current sensor). The control unit 15 generates a monitoring signal from the signal from the sensor, and indicates the polishing status of the wafer W being polished. Monitor.

  Between the polishing unit 13 and the cleaning unit 14, first and second linear transporters 16 and 17 are provided as transfer mechanisms for transferring the wafer W. The first linear transporter 16 has a first position for receiving the wafer W from the load / unload unit 12, second and third positions for transferring the wafer W between the polishing units 13A and 13B, and a second linear transporter. It is possible to move between a fourth position for delivering the wafer W to 17.

  The second linear transporter 17 is between the fifth position for receiving the wafer W from the first linear transporter 16 and the sixth and seventh positions for transferring the wafer W between the polishing units 13C and 13D. It is supposed to be movable. Between these transporters 16 and 17, a swing transporter 35 for sending the wafer W to the cleaning unit is provided.

  As shown in FIG. 2, the cleaning unit 14 includes two primary cleaning modules 40A and 40B, two secondary cleaning modules 41A and 41B, two drying modules 42A and 42B, and the wafers between these modules. Transport robots 43 and 44 for delivery are provided, and a plurality of wafers W can be simultaneously subjected to cleaning and drying processes. The number of primary cleaning modules, secondary cleaning modules, and drying modules is not limited to two, and may be one or three or more.

  FIG. 3 is a perspective view showing the configuration of the primary cleaning module 40A. In this embodiment, the primary cleaning modules 40A and 40B and the secondary cleaning modules 41A and 41B all have the same configuration, and here, the primary cleaning module 40A will be described as an example.

  The primary cleaning module 40 </ b> A holds four rollers 50 </ b> A to 50 </ b> D that hold and rotate the wafer W, roll sponges (cleaning tools) 51 and 52 that contact the upper and lower surfaces of the wafer W, and rotate these roll sponges 51 and 52. Rotating mechanisms 53 and 54, and liquid supply portions 55 and 56 for supplying a cleaning liquid (for example, pure water) and an etching liquid (chemical solution) to the upper and lower surfaces of the wafer and the inside of the roll sponge are provided.

  The rotating mechanism 53 that rotates the upper roll sponge 51 is attached to a guide rail 57 that guides its vertical movement, and can be moved in the vertical direction along the guide rail 57 by the lifting drive mechanism 58. . Although not shown, the lower roll sponge 52 is also provided with a similar lifting drive mechanism and guide rail.

  When the wafer W is carried in and out, the roll sponges 51 and 52 are at positions separated from each other, and when the wafer W is cleaned, the roll sponges 51 and 52 move in a direction close to each other and come into contact with the upper and lower surfaces of the wafer W. The pressing force applied to the wafer W by the roll sponges 51 and 52 is adjusted by the lift drive mechanism 58.

  4 is a cross-sectional view of the roll sponge 51, FIG. 4 (A) is a cross-sectional view in the radial direction, and FIG. 4 (B) is a cross-sectional view in the longitudinal direction along the line AA in FIG. 4 (A). is there. In this embodiment, the configurations of the roll sponges 51 and 52 are the same. Here, the upper roll sponge 51 will be described as an example. The roll sponge 51 includes a hollow cylindrical sponge body 60 and a sponge holder 61 for fixing the sponge body 60 from the inside.

  In this embodiment, the sponge body 60 is integrally molded using PVA (polyvinyl alcohol) as a raw material. Although not shown in the present embodiment, a plurality of protrusions are formed on the outer peripheral surface of the sponge body 60. Is provided. The material of the sponge body 60 is not limited to PVA as long as there is no risk of scratching the surface of the wafer W. For example, PVAt (polyvinyl acetal), PVF (polyvinyl formal), polyurethane or foam Vinyl chloride may be used.

  The sponge holder 61 includes an inner core 63, an outer core 64, and a holding member 65, which are made of a fluororesin such as PTFE (polytetrafluoroethylene). The material of the sponge holder 61 is not particularly limited as long as it has a hardness that can support the sponge body 60 and can withstand twisting and friction caused by rotation during cleaning. It can be composed of hard plastic, SUS material, or vinyl chloride. In the present embodiment, the inner core 63, the outer core 64, and the holding member 65 are all made of the same material, but may be made of different materials.

  The inner core 63 has a hollow cylindrical shape and is divided into a plurality of (four in this embodiment) segments. One end of the inner core 63 is attached to the rotation mechanism 53, and the inner core 63 rotates in conjunction with driving of the rotation mechanism 53. A liquid supply unit 55 is connected to the other end of the inner core 63, and a cleaning solution and an etching solution are supplied to the hollow portion of the inner core 63. Further, the inner core 63 is formed with a plurality of liquid passage holes penetrating in the radial direction, and liquids (cleaning liquid and etching liquid) supplied from the liquid supply unit 55 along with the rotation of the inner core 63 pass therethrough. It is supplied to the sponge body 60 through the hole.

  The outer core 64 has a hollow cylindrical shape and is divided into a plurality of (four in this embodiment) segments. The inner diameter of the outer core 64 is substantially the same as or larger than the outer diameter of the inner core 63, and the outer core 64 is assembled to the inner core 63 so as to cover the outer periphery of the inner core 63. Further, the outer diameter of the outer core 64 is determined to be smaller than the inner diameter of the cylindrical sponge body 60, and no stress is applied to the sponge body 60 when the outer core 64 is assembled.

  The holding member 65 is a member for fixing the sponge body 60 to the inner core 63, and an outer substantially fan-shaped fixing part 65a and an inner substantially triangular engaging part 65b are integrally formed. In the present embodiment, four holding members 65 are provided, and the outer core 64 and the sponge body 60 are located at a release position where a part of the fixing portion 65 a enters a recess formed in the outer peripheral portion of the outer core 64. Supported in between. When the holding member 65 is in the release position, the holding member 65 and the sponge body 60 are not in contact with each other, and the sponge body 60 is in a free state that is not held by the sponge holder.

  The engaging portion 65b of the holding member 65 has an engaging surface (tapered surface) that comes into contact with the outer peripheral surface of the inner core 63. When the inner core 63 rotates in the counterclockwise direction in FIG. The engaging portion 65b is pushed out by the outer peripheral surface of the inner core 63, and the holding member 65 slides along the radial direction and moves to the holding position shown in FIG. 5 (see FIG. 5). When the holding member 65 is in the holding position, the outer peripheral surface of the fixing portion 65 a presses the inner peripheral surface of the sponge body 60, whereby the sponge body 60 is fixed to the inner core 63 via the holding member 65. The In this state, when the inner core 63 rotates in the counterclockwise direction in the figure, the sponge body 60 rotates with the holding member 65 in the counterclockwise direction in the figure.

  FIG. 6 shows a procedure for attaching the roll sponge. First, after inserting the inner core 63 into the sponge body 60 (FIG. 6A), the outer core 64 is inserted between the sponge body 60 and the inner core 63 (FIG. 6B). Next, the four holding members 65 are inserted between the sponge body 60 and the outer core 65, and supported by the outer peripheral surface of the outer core 65 at the release position (FIG. 6C).

  When the inner core 63 is rotated in this state, the outer peripheral surface of the inner core 63 comes into contact with the engaging portion 65b of the holding member 65 to push it up, the holding member 65 moves to the holding position, and the sponge from the inside. The body 60 is pressed in the radial direction (FIG. 6D). Accordingly, the sponge body 60 can be fixed to the inner core 63 without applying an excessive load in the longitudinal direction of the sponge body 60, and it is possible to prevent kinking and deformation from occurring when the sponge body 60 is fixed. It becomes. Further, since it is not necessary to dry the sponge body at the time of fixing, the generation of foreign matters accompanying the change in the surface state of the sponge body can be eliminated.

  Thereafter, a pressing ring 67 for pressing the outer core 64 and the holding member 65 is attached to the other end of the inner core 63 U (FIG. 6E), and the fixing pin 68 is inserted through the pressing ring 67. The roll sponge 51 including the sponge body 60 and the sponge holder 61 is completed (FIG. 6F). The completed roll sponge 51 is attached to the rotation mechanism 53.

  Hereinafter, an outline of the cleaning operation will be described. Wafer W is held by rollers 50A to 50D and rotated. Next, cleaning liquid is supplied from the liquid supply unit 55 to the upper and lower surfaces of the wafer and the inner core 63, and the roll sponges 51 and 52 are slidably contacted with the upper and lower surfaces of the wafer W while rotating around the axis. Scrub the top and bottom surfaces. After the scrub cleaning, the roll sponges 51 and 52 are compared with positions separated from each other, and an etching solution is supplied from the liquid supply unit 55 to the inner core 63 and the upper and lower surfaces of the wafer W, thereby etching the upper and lower surfaces of the wafer W (chemical cleaning). ) Is performed.

  In the above embodiment, the sponge member 60 is fixed by rotating the inner core having a non-uniform outer diameter to move the holding member to the holding position, but the present invention is not limited to this. For example, an elastic body such as a spring may be attached to the holding member, and the holding member may be pressed from the inside of the sponge body 60 using the biasing of the elastic body. Further, a member (for example, a balloon) that is inflated by introducing air may be attached to the inner core, and after the inner core is set, the inflating member may be inflated to press the holding member in the radial direction. By this, it is possible to realize a roll sponge holder that fixes the sponge body from the inside.

  As described above, according to the present invention, the sponge body can be easily inserted without causing deformation of the sponge body or generation of foreign matter. For example, as a roll sponge holder for cleaning a semiconductor substrate. Useful.

W Wafer 14 Cleaning section 40A, 40B Primary cleaning module 41A, 41B Primary cleaning module 51, 52 Roll sponge 60 Sponge body 61 Sponge holder 63 Inner core 64 Outer core 65 Holding member

Claims (6)

In the roll sponge holder that is used for cleaning the object to be cleaned and holds the cylindrical sponge body,
The inner core,
A holding member that is arranged between the sponge body and the inner core and is movable between a holding position for holding the sponge body by pressing the sponge body from the inside and a release position for releasing the sponge body When,
A moving mechanism for moving the sponge body between the holding position and the releasing position;
A roll sponge holder characterized by comprising:   The holding member has a taper-shaped engaging portion that comes into contact with an outer peripheral portion of the inner core, and a fixing portion that presses the sponge body from the inside at the holding position, and the engagement is performed by rotation of the inner core. The roll sponge holder according to claim 1, wherein the holding member is moved to the holding position by being pushed up.   The roll sponge holder according to claim 1 or 2, further comprising an outer core that is attached to a position between the sponge body and the inner core and supports the holding member in the release position. A method of manufacturing a roll sponge holder used for cleaning an object to be cleaned,
Insert the inner core inside the cylindrical sponge body,
Insert an outer core at a position between the sponge body and the inner core,
The holding member is inserted into a release position supported by the outer core and not in contact with the sponge body,
Rotating the inner core to push up the holding member in the outer diameter direction and move the sponge body to a holding position for pressing from the inside;
A method for producing a roll sponge holder, wherein   A roll sponge in which the sponge member is attached to the roll sponge holder according to claim 1, a drive mechanism for moving the roll sponge to a position where it abuts against a substrate and rotating the roll sponge, and a cleaning liquid on the substrate. A substrate cleaning apparatus comprising: a liquid supply unit for supplying. The said board | substrate is a semiconductor substrate, The semiconductor manufacturing apparatus provided with the board | substrate washing | cleaning apparatus of Claim 5, and the grinding | polishing apparatus which grind | polishes the said semiconductor substrate.