JP2015194642A - Method and apparatus for manufacturing flexible device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To ensure removal by laser beam irradiation in manufacturing a flexible device.SOLUTION: A manufacturing method for a flexible device including a functional layer comprises: irradiating a laminate including a transparent substrate, a resin layer 13 formed on the transparent substrate, and the functional layer formed on the resin layer 13, with first and second laser beams LB1, LB2 so that the beams enter the same region R from the transparent substrate side in first and second directions different from each other; and causing interlayer removal between the transparent substrate and the resin layer 13 or between the resin layer 13 and the functional layer.

Description

  Embodiments of the invention relate to the manufacture of flexible devices.

  In recent years, organic electroluminescence (EL) display devices and liquid crystal display devices have excellent long-term reliability and a high degree of freedom in shape, such as curved display, in addition to demands for large area and light weight. It is requested. Therefore, a flexible display device, that is, a display device using a plastic substrate made of a transparent plastic or the like as a base material instead of a glass substrate that is heavy, easily broken, and difficult to increase in area is attracting attention.

  Such a display device is obtained by the following method, for example. First, a plastic substrate is formed on a support substrate such as a glass substrate. Next, wiring, circuit elements, and the like are formed on the plastic substrate. Thereafter, the plastic substrate is irradiated with a laser beam from the support substrate side, and the plastic substrate is peeled off from the support substrate together with the wiring and circuit elements. Note that when a metal layer is provided on a supporting substrate and a plastic substrate is formed thereon, peeling by laser beam irradiation becomes easy.

JP 2011-48374 A

  The problem to be solved by the present invention is to enable reliable peeling by laser beam irradiation in the production of a flexible device.

  According to the embodiment, a method for manufacturing a flexible device including a functional layer, comprising: a transparent substrate; a resin layer formed on the transparent substrate; and the functional layer formed on the resin layer. The laminated body is irradiated with the first and second laser beams so that they are incident on the same region from the transparent substrate side in different first and second directions, respectively, and the transparent substrate and the resin A manufacturing method including causing delamination between layers or between the resin layer and the functional layer is provided.

Sectional drawing which shows roughly an example of the laminated body used in the manufacturing method which concerns on embodiment. Sectional drawing which shows schematically the irradiation of the 1st laser beam to the laminated body of FIG. Sectional drawing which shows schematically the irradiation of the 2nd laser beam to the laminated body of FIG. Sectional drawing which shows schematically the delamination produced in the laminated body of FIG. Sectional drawing which shows schematically the irradiation of the 1st laser beam to the laminated body which the particle adhered to the surface. FIG. 6 is a cross-sectional view schematically showing an example of delamination caused by irradiation with the first laser beam in FIG. 5. Sectional drawing which shows schematically irradiation of the 2nd laser beam to the laminated body of FIG. FIG. 8 is a cross-sectional view schematically showing an example of delamination caused by irradiation with the second laser beam in FIG. 7. The perspective view which shows roughly an example of irradiation of the 1st and 2nd laser beam with respect to the same area | region. The figure which shows schematically the manufacturing apparatus which concerns on embodiment.

  Hereinafter, embodiments will be described in detail with reference to the drawings. In addition, the same referential mark is attached | subjected to the component which exhibits the same or similar function through all drawings, and the overlapping description is abbreviate | omitted.

  The flexible device manufactured by the method described here is a flexible organic EL display device capable of displaying a color image, employing a top emission structure and an active matrix driving method. In this method, first, the first laminated structure 1 and the second laminated structure 2 shown in FIG. 1 are separately prepared.

  The first laminated structure 1 includes a first transparent substrate 11, a first plastic substrate 13, a circuit layer 14, and a light emitting element layer 15. In the first laminated structure 1, at least one of the circuit layer 14 and the light emitting element layer 15 is a functional layer.

  The first transparent substrate 11 plays a role of supporting part or all of the layers included in the final product in the manufacturing process of the flexible organic EL display device. The first transparent substrate 11 is not included in the flexible organic EL display device that is the final product.

  The first transparent substrate 11 is harder than the first plastic substrate 13. The first transparent substrate 11 is, for example, a glass substrate or a plastic substrate that is harder than the first plastic substrate 13.

  The first plastic substrate 13 is a resin layer formed on the first transparent substrate 11. The first plastic substrate 13 serves as a flexible substrate in the flexible organic EL display device that is the final product.

  The first plastic substrate 13 is made of a plastic such as a heat resistant polymer. As this plastic, for example, polyimide, aramid, cycloolefin, polyamideimide, polycarbonate, PMMA (polymethyl methacrylate), liquid crystal polymer, polyethersulfone, acrylic resin, and epoxy resin can be used.

  The thickness of the first plastic substrate 13 is, for example, in the range of 0.5 μm to 100 μm. If the first plastic substrate 13 is thin, the strength of the organic EL display device may be insufficient. If the first plastic substrate 13 is thick, the flexibility of the organic EL display device may be insufficient.

  The surface of the first plastic substrate 13 may be covered with a barrier layer made of an inorganic compound such as silicon oxide or silicon nitride, for example. The barrier layer prevents mass transfer from the first plastic substrate 13 to the circuit layer 14. Further, a resin layer as a planarizing film may be provided on the barrier layer. In FIG. 1, an undercoat layer 141 is drawn as a barrier layer and a planarizing film.

  The circuit layer 14 is formed on the first plastic substrate 13. The circuit layer 14 controls the supply of power to an organic EL element (not shown).

  The circuit layer 14 includes various wirings such as a power supply line, a scanning signal line, and a video signal line, an interlayer insulating film that electrically insulates these wirings from each other, and a thin film transistor used as a circuit element, for example, a driving element or a switching element. And a capacitor. In FIG. 1, a gate electrode 142, a gate insulating film 143, a semiconductor layer 144 including a channel region and source / drain regions, an etching stopper film 145, a source / drain electrode 146, and a passivation film 147 are illustrated.

  Note that although a bottom gate type thin film transistor is illustrated in FIG. 1, the thin film transistor may be a top gate type. Prior to the formation of the circuit layer 14, if contact holes are provided in the undercoat layer 141 and the first plastic substrate 13, the wiring and the external circuit are electrically connected via these contact holes. Can be connected.

  The light emitting element layer 15 is formed on the circuit layer 14. The light emitting element layer 15 includes a first electrode 152, a partition wall 151, an organic material layer 153, a second electrode 154, and a sealing layer 155. The first electrode 152, the organic material layer 153, and the second electrode 154 constitute an organic EL element, for example, an organic EL element that emits white light.

  The first electrode 152 is formed on the circuit layer 14. The first electrodes 152 are arranged corresponding to the pixels. These first electrodes 152 are electrically insulated from each other. Each first electrode 152 is electrically connected to a power supply line via one or more thin film transistors. The first electrode 152 is, for example, an anode.

  For example, the first electrode 152 is a reflective layer including a metal layer. The first electrode 152 may be a transparent conductive layer. In this case, typically, a reflective layer is provided between the first electrode 152 and the first plastic substrate 13.

  The partition wall 151 is an insulating layer formed on the circuit layer 14. The partition wall opens at the position of the first electrode 152.

  The organic layer 153 is formed on the first electrode 152. The organic layer 153 includes a light emitting layer. The organic material layer 153 is a layer other than the light emitting layer, for example, a charge transport layer such as a hole transport layer and an electron transport layer, a charge injection layer such as a hole injection layer and an electron injection layer, and a hole block layer and an electron block. A charge blocking layer such as a layer can further be included.

  The second electrode 154 is formed on the first electrode 152 and the partition wall 151. The second electrode 154 is typically a continuous film and serves as a common electrode.

  The second electrode 154 is, for example, a cathode. The second electrode 154 has visible light permeability. The light generated in the organic layer is transmitted through the second electrode 154 and used for display.

  The sealing layer 155 is formed on the second electrode 154. The sealing layer 155 plays a role of preventing moisture and the like from entering the organic EL element. As a material of the sealing layer 155, for example, silicon nitride, silicon oxide, or parylene can be used.

  On the sealing layer 155, a barrier film in which a barrier film is provided on a resin film may be attached via an adhesive. When the barrier film is used, in addition to improving the sealing ability, it is possible to suppress the organic EL element from being damaged during peeling.

  The second laminated structure 2 includes a second transparent substrate 21, a second plastic substrate 23, a planarization layer 25, a color filter layer 24, and a barrier layer 26.

  The second transparent substrate 21 is harder than the second plastic substrate 23. The second transparent substrate 21 is, for example, a glass substrate or a hard plastic substrate compared to the second plastic substrate 23.

  The second plastic substrate 23 is a resin layer formed on the second transparent substrate 21. The second plastic substrate 23 serves as a flexible substrate in the flexible organic EL display device that is the final product.

  As the material of the second plastic substrate 23, for example, the same material as described above for the first plastic substrate 13 can be used.

  The thickness of the second plastic substrate 23 is, for example, in the same range as described above for the first plastic substrate 13. If the second plastic substrate 23 is thin, the strength of the organic EL display device may be insufficient. If the second plastic substrate 23 is thick, the flexibility of the organic EL display device may be insufficient.

  The planarization layer 25 is formed on the second plastic substrate 23. The planarization layer 25 is made of, for example, a transparent resin. The planarization layer 25 provides a flat base for the color filter layer 24.

  The color filter layer 24 is formed on the planarization layer 25. The color filter layer 24 includes a blue colored layer 24B, a green colored layer 24G, a red colored layer 24R, and a black matrix 24BM. The black matrix 24BM is opened at a position corresponding to the opening of the partition wall 151. The blue colored layer 24 </ b> B, the green colored layer 24 </ b> G, and the red colored layer 24 </ b> R are disposed so as to face the opening of the partition wall 151.

  The barrier layer 26 is formed on the color filter layer 24. The barrier layer 26 is made of an inorganic compound such as silicon oxide or silicon nitride, for example.

  After preparing the 1st laminated structure 1 and the 2nd laminated structure 2 which were mentioned above, these are bonded together. Specifically, first, the adhesive 31 is applied on at least one of the sealing layer 155 of the first laminated structure 1 or the barrier layer 26 of the second laminated structure 2. Next, the first laminated structure 1 and the second laminated structure 2 are arranged so that the sealing layer 155 and the barrier layer 26 face each other with the adhesive 31 in between. Then, alignment is performed in this state, and they are bonded together.

  Here, as an example, as the adhesive 31, a photocurable or thermosetting resin having adhesiveness is used. Further, the curing of the photocurable or thermosetting resin is performed after the delamination described later is finished.

  As described above, the third laminated structure 3 including the first laminated structure 1, the second laminated structure 2, and the adhesive 31 interposed therebetween is obtained.

  Next, as shown in FIG. 2, the third stacked structure 3 is irradiated with the first laser beam LB1 from the first transparent substrate 11 side. Subsequently, as shown in FIG. 3, the second laser beam LB <b> 2 is irradiated to the third stacked structure 3 from the first transparent substrate 11 side.

  Specifically, the first laser beam LB1 is converged in the vicinity of the interface between the first transparent substrate 11 and the first plastic substrate 13 (the beam waist is positioned in the vicinity of the interface), and the first plastic substrate 13 Scan across the entire surface. Subsequently, the second laser beam LB2 is converged in the vicinity of the interface between the first transparent substrate 11 and the first plastic substrate 13 (the beam waist is positioned in the vicinity of the interface), and is applied to the entire surface of the first plastic substrate 13. Scan across. The first laser beam LB1 and the second laser beam LB2 are irradiated so that they are incident on the same region from the first transparent substrate 11 side in different first and second directions, respectively.

  Thereby, as shown in FIG. 4, delamination occurs between the first transparent substrate 11 and the first plastic substrate 13. As described above, a laminated structure 3 ′ obtained by separating the first transparent substrate 11 from the third laminated structure 3 is obtained.

  For example, an infrared laser beam, a XeCl excimer laser beam, or a YAG: THG laser beam can be used as the first laser beam LB1 and the second laser beam LB2.

  Here, the reason why the above delamination occurs due to laser beam irradiation will be described. Here, as an example, the first transparent substrate 11 is made of glass, and the first plastic substrate 13 is made of polyimide resin.

  The polyimide resin is a heat-resistant polymer having an imide group in its structure, as represented by polyamideimide, polybenzimidazole, polyimide ester, polyetherimide, polysiloxaneimide and the like. The polyimide resin can be obtained by reacting diamine and acid anhydride in the presence of a solvent to obtain a polyamic acid resin solution that is a precursor of the polyimide resin, and then imidizing the polyamic acid.

  The moisture permeability of the first transparent substrate 11 and the undercoat layer 141 relating to the solvent and water contained in the polyamic acid solution is determined by the adhesion between the first plastic substrate 13 and the first transparent substrate 11 and the first plastic substrate 13 and the undercoat layer 141. In other words, the adhesiveness with the coat layer 141 is affected. That is, a part of the water generated with the imidization of the organic solvent or the polyamic acid contained in the polyamic acid solution remains in the first plastic substrate 13. When the moisture permeability of the layer adjacent to the first plastic substrate 13 is low, the organic solvent or water remaining in the first plastic substrate 13 is concentrated in the vicinity of the interface with the adjacent layer and adjacent to the first plastic substrate 13. Reduces adhesion to the layer.

  The first transparent substrate 11 and the undercoat layer 141 have low moisture permeability. For this reason, in the third laminated structure 3, the adhesion between the first plastic substrate 13 and the first transparent substrate 11 and the adhesion between the first plastic substrate 13 and the undercoat layer 141 are both low.

  However, here, the first laser beam LB1 and the second laser beam LB2 are converged near the interface between the first transparent substrate 11 and the first plastic substrate 13 (the beam waist is positioned near the interface). Therefore, the interface between the first plastic substrate 13 and the first transparent substrate 11 is heated to a higher temperature than the interface between the first plastic substrate 13 and the undercoat layer 141, and the first plastic substrate 13 includes The organic solvent and water that are present vaporize mainly in the vicinity of the interface between the first plastic substrate 13 and the first transparent substrate 11. As a result, delamination does not occur between the first plastic substrate 13 and the undercoat layer 141, but occurs between the first plastic substrate 13 and the first transparent substrate 11.

  Next, delamination is caused between the second transparent substrate 21 and the second plastic substrate 23 by the same method as described with reference to FIGS. That is, the first laser beam LB1 is irradiated from the second transparent substrate 21 side to the laminated structure 3 '. Subsequently, the second laser beam LB2 is irradiated onto the laminated structure 3 'from the second transparent substrate 21 side.

  Specifically, the first laser beam LB1 is converged in the vicinity of the interface between the second transparent substrate 21 and the second plastic substrate 23 (the beam waist is positioned in the vicinity of the interface), and the second plastic substrate 23 Scan across the entire surface. Subsequently, the second laser beam LB2 is converged in the vicinity of the interface between the second transparent substrate 21 and the second plastic substrate 23 (the beam waist is positioned in the vicinity of the interface), and is applied to the entire surface of the second plastic substrate 13. Scan across. The first laser beam LB1 and the second laser beam LB2 are irradiated so that they are incident on the same region from the second transparent substrate 12 side in different first and second directions, respectively.

  As described above, a laminated structure 3 ″ obtained by separating the second transparent substrate 21 from the laminated structure 3 ′ is obtained.

  Thereafter, the photocurable or thermosetting resin is cured. The adhesive layer 31 formed by curing a photocurable or thermosetting resin exhibits a high barrier property.

  The reason for curing the photocurable or thermosetting resin at this stage is to avoid stress concentration on the organic EL element when delamination occurs. The organic EL element has low adhesion between layers, and when the stress is concentrated, the film peels off. The organic EL element in which film peeling has occurred does not emit light and thus becomes a dark spot. If the photo-curing or thermosetting resin is cured at this stage, the possibility of a dark spot occurring can be kept low.

  Then, a resin film is affixed on the 1st plastic substrate 13 as needed. Thereby, an organic EL element etc. are pinched | interposed with this resin film and a barrier film, and it is set as a structure strong against a bending. As described above, the flexible organic EL display device is obtained.

  According to this method, delamination can be reliably generated. This will be described with reference to FIGS. Here, delamination that occurs between the first transparent substrate 11 and the first plastic substrate 13 will be described. Further, here, the first laser beam LB1 is irradiated perpendicularly to the main surface of the first transparent substrate 11, and the second laser beam LB2 is irradiated obliquely to the main surface of the first transparent substrate 11. To do. Furthermore, in order to simplify the explanation, it is assumed that the first laser beam LB1 and the second laser beam LB2 are parallel beams.

  As shown in FIG. 5, particles P such as dust may adhere to the surface of the first transparent substrate 11. Some of the particles P block the first laser beam LB1 and cause peeling residue as shown in FIG.

The second laser beam LB2 is incident in a direction different from that of the first laser beam LB1. Therefore, the second laser beam LB2 reaches the separation remaining without being blocked by the particles P as shown in FIG. As a result, the peeling residue is removed.
Therefore, according to the above method, delamination can surely occur.

  As shown in FIG. 9, the optical paths of the first laser beam LB1 and the second laser beam LB2 that irradiate the same region R are different from each other. When the directions of the optical paths immediately before the first laser beam LB1 and the second laser beam LB2 are incident on the stacked structure 3 or 3 ′ are the first and second directions, respectively, the angles formed by the first and second directions For example, θ is greater than 0 ° and less than 180 °, and preferably within a range of 5 ° to 90 °. The angle θ is influenced by the size of the particle, the thickness of the layer, the refractive index, and the like, but if the second laser beam LB2 is irradiated to the region where the first laser beam LB1 did not reach because it was blocked by the particle. Good. When the angle θ is excessively small, the peeling residue that cannot be removed by irradiation with the second laser beam LB2 increases. If the angle θ is excessively increased, the incident angle of the first laser beam LB1 or the second laser beam LB2 increases, and a high-power laser is required.

  The first direction may be inclined or perpendicular to the incident surface of the stacked structure 3 or 3 '. Typically, the first direction is substantially perpendicular to the incident surface of the stacked structure 3 or 3 '.

  The second direction may also be inclined or perpendicular to the incident surface of the stacked structure 3 or 3 '. However, the second direction is preferably inclined with respect to the incident surface of the laminated structure 3 or 3 '. This will be described below. Here, as an example, the first transparent substrate 11 is made of glass, the first plastic substrate 13 is made of polyimide, and the second laser beam LB2 is irradiated in the air.

  For example, as shown in FIG. 5, when the third laminated structure 3 is irradiated with the first laser beam LB1 from the first transparent substrate 11 side, as shown in FIG. 7, the first transparent substrate 11, the first plastic substrate 13, In between, partial delamination occurs. In the portion where the delamination occurs, an air layer is interposed between the first transparent substrate 11 and the first plastic substrate 13.

  The first transparent substrate 11 and the first plastic substrate 13 have a higher refractive index than the air layer. Specifically, the refractive index of air is 1.0, the refractive index of glass is about 1.5, and the refractive index of polyimide is about 1.7.

  Therefore, the interface between the first transparent substrate 11 and the air layer shows a high reflectance. When the incident angle of the second laser beam LB2 is large, the interface between the first transparent substrate 11 and the air layer totally reflects the second laser beam LB2. For example, when the refractive index of the first transparent substrate 11 is 1.5, total reflection occurs when the incident angle of the second laser beam LB2 to the interface is 41.8 ° or more. In addition, when polyimide remains on the surface of the first transparent substrate 11 and a polyimide layer having a refractive index of 1.7 exists between the first transparent substrate 11 and the air layer, the polyimide layer and the air layer Total reflection occurs when the angle of incidence of the second laser beam LB2 on the interface with the laser beam is 36 ° or more.

  Therefore, when the second direction is tilted with respect to the incident surface, the elements included in the functional layer, for example, the organic EL element and the circuit element are suppressed from being damaged by the irradiation with the second laser beam LB2. Can do.

  The first plastic substrate 13 has a higher refractive index than the first transparent substrate 11. For this reason, in the region where the remaining peeling occurs, the refraction angle of the second laser beam LB2 incident on the interface between the first transparent substrate 11 and the first plastic substrate 13 is the incident angle of the second laser beam LB2 incident on the interface. Smaller than. Accordingly, delamination can be efficiently generated in the region where the peeling residue has occurred, although the second laser beam LB2 is incident obliquely.

  The irradiation with the first laser beam LB1 and the irradiation with the second laser beam LB2 may be performed simultaneously. However, as is apparent from the above description, it is preferable to perform irradiation with the second laser beam LB2 after irradiation with the first laser beam LB1.

  The delamination described above can be more efficiently generated by providing a metal layer. The metal layer absorbs the laser beam with higher efficiency than the first plastic substrate 13 and the second plastic substrate 23. Therefore, for example, a metal layer is provided between the first transparent substrate 11 and the first plastic substrate 13, and the first laser beam LB1 and the second laser beam LB2 are irradiated to the third laminated structure 3 from the first transparent substrate 11 side. Then, even a relatively low energy laser beam, such as an infrared laser beam, can easily cause delamination between the metal layer and the first plastic substrate 13.

  The center wavelength of the XeCl excimer laser beam is 308 nm, and the center wavelength of the YAG: THG laser beam is 355 nm. That is, the center wavelength of these laser beams is in a wavelength region where polyimide exhibits a high absorption rate. However, the XeCl excimer laser and the YAG: THG laser have high apparatus cost and running cost. On the other hand, an infrared laser, for example, an infrared fiber laser, is lower in apparatus cost and running cost than a XeCl excimer laser or a YAG: THG laser. Therefore, when the metal layer is provided, it is possible to reduce the laser device cost and the running cost.

  When a metal layer is used, a resin layer may be further provided on the light source side with respect to the metal layer. For example, when a resin layer and a metal layer are provided in this order between the first transparent substrate 11 and the first plastic substrate 13, the first laser beam LB 1 and the second laser beam in the third laminated structure 3 from the first transparent substrate 11 side. When the laser beam LB2 is irradiated, delamination can occur between the resin layer and the metal layer.

  When the above metal layer is not used, the first laser beam LB1 is preferably a convergent beam, as is apparent from the above description. On the other hand, the second laser beam LB2 may be a convergent beam or a parallel beam. When a parallel beam is used as the second laser beam LB2, the laser beam travels an optical path closer to the diffraction theory than when a convergent beam is used, and therefore, unexpected condensing and scattering can be prevented. Note that when the metal layer is used, the first laser beam LB1 and the second laser beam LB2 may be convergent beams or parallel beams.

  Next, a manufacturing apparatus that can be used in the above method will be described with reference to FIG. In FIG. 10, the X direction and the Y direction are parallel to the main surface of the third stacked structure 3 and perpendicular to each other. The Z direction is a direction perpendicular to the main surface of the third stacked structure 3.

  The manufacturing apparatus shown in FIG. 10 is a manufacturing apparatus for a flexible device including a functional layer. This manufacturing apparatus includes a support 51, lasers 52a and 52b, and optical systems 53a and 53b.

  The support body 51 supports the laminated structure in which delamination should occur, in this case, the third laminated structure 3. The lasers 52a and 52b output a first laser beam LB1 and a second laser beam LB2, respectively. The optical systems 53a and 53b guide the first laser beam LB1 output from the laser 52a and the second laser beam LB2 output from the laser 52b to the third stacked structure 3, respectively. Specifically, the first optical system 53a guides the first laser beam LB1 output from the laser 52a so as to scan the entire surface of the third stacked structure 3. On the other hand, the second optical system 53b guides the second laser beam LB2 output from the laser 52b so as to scan the entire surface of the third stacked structure 3. The first optical system 53a and the second optical system 53b are configured such that the first laser beam LB1 and the second laser beam LB2 enter the same region in different directions.

  The laser 52b and the optical system 53b may be omitted. In this case, for example, the first laser beam LB1 and the second laser beam LB2 are output to the laser 52a, and the first laser beam LB1 and the second laser beam LB2 are incident on the same region in different directions. Adopt the configuration to get. Alternatively, this manufacturing apparatus is provided with a drive mechanism that rotates the support 51 around an axis that intersects the Z direction. Alternatively, a configuration in which the first laser beam LB1 and the second laser beam LB2 are incident on the optical system 43a obliquely with respect to the main surface of the third stacked structure 3 is adopted, and the support 51 is placed in the Z direction in this manufacturing apparatus. A drive mechanism that rotates about an axis parallel to the axis.

  As described above, according to the embodiment, the first laser beam LB1 and the second laser beam LB2 are irradiated so that they are incident on the same region in different first and second directions, respectively. Thereby, the peeling residue resulting from the particle P can be removed. That is, according to the embodiment, it is possible to reliably perform peeling by laser beam irradiation in the manufacture of a flexible device.

  Here, the organic EL display device is exemplified as the flexible device, but the flexible device may be a display device other than the organic EL display device, for example, a liquid crystal display device. The flexible device may be a device other than the display device, for example, a light emitting device, a solar cell, or a sensor.

  Note that the present invention is not limited to the above-described embodiment as it is, and can be embodied by modifying the constituent elements without departing from the scope of the invention in the implementation stage. In addition, various inventions can be formed by appropriately combining a plurality of components disclosed in the embodiment. For example, some components may be deleted from all the components shown in the embodiment. Furthermore, constituent elements over different embodiments may be appropriately combined.

  DESCRIPTION OF SYMBOLS 1 ... 1st laminated structure, 2 ... 2nd laminated structure, 3 ... 3rd laminated structure, 3 '... laminated structure, 3 "... laminated structure, 11 ... 1st transparent substrate, 13 ... 1st plastic substrate, 14 ... circuit Layer 15, light emitting element layer 21, second transparent substrate 23, second plastic substrate 24, color filter layer, 24 B, blue colored layer, 24 BM, black matrix, 24 G, green colored layer, 24 R, red colored layer 25 ... Planarization layer, 26 ... Barrier layer, 31 ... Adhesive, 51 ... Support, 52a ... Laser, 52b ... Laser, 53a ... Optical system, 53b ... Optical system, 141 ... Undercoat layer, 142 ... Gate electrode 143, gate insulating film, 144, semiconductor layer, 145, etching stopper film, 146, source / drain electrodes, 147, passivation film, 151, barrier rib, 152, first electrode, 153,. Machine product layer, 154 ... second electrode, 155 ... sealing layer, LB1 ... first laser beam, LB2 ... second laser beam, P ... particles, R ... area.

Claims (10)

A method of manufacturing a flexible device including a functional layer,
The first and second laser beams are applied to the laminate including a transparent substrate, a resin layer formed on the transparent substrate, and the functional layer formed on the resin layer from the transparent substrate side. Irradiation is performed so that the same region is incident in different first and second directions, and delamination occurs between the transparent substrate and the resin layer or between the resin layer and the functional layer. A manufacturing method including making   The manufacturing method according to claim 1, wherein the same laser beam is irradiated to the same region after the first laser beam is irradiated.   The manufacturing method according to claim 2, wherein a convergent beam is irradiated as the first laser beam and a parallel beam is irradiated as the second laser beam.   The manufacturing method according to claim 1, wherein a convergent beam is irradiated as the first and second laser beams.   The manufacturing method according to claim 1, wherein an angle formed by the first direction and the second direction is in a range of 5 ° to 90 °.   The manufacturing method according to claim 1, wherein the first and second laser beams are ultraviolet laser beams.   The laminate further includes a metal layer interposed between the transparent substrate and the resin layer or between the resin layer and the functional layer, and the delamination is between the metal layer and the resin layer. The manufacturing method of any one of Claims 1 thru | or 5 produced by this.   The manufacturing method according to claim 7, wherein the first and second laser beams are infrared laser beams. An apparatus for manufacturing a flexible device including a functional layer,
A support that supports a laminate including a transparent substrate, a resin layer formed on the transparent substrate, and the functional layer formed on the resin layer;
One or more lasers that output first and second laser beams;
One or more optical systems for directing the first and second laser beams to the laminate so that they are incident on the same region from the transparent substrate side in different first and second directions, respectively; A manufacturing apparatus comprising: An apparatus for manufacturing a flexible device including a functional layer,
A support that supports a laminate including a transparent substrate, a resin layer formed on the transparent substrate, and the functional layer formed on the resin layer;
A laser that outputs first and second laser beams;
An optical system for directing the first and second laser beams to the laminate;
A manufacturing apparatus comprising: a driving mechanism that rotates the support so that the first and second laser beams are incident on the same region from the transparent substrate side in different first and second directions, respectively.

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