JP2015193872A - Member coated with ceramic spray coating film, and member for semiconductor manufacturing apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a member coated with a ceramic spray coating film, having an excellent corrosion resistance, excellent electrical insulation properties, and an excellent durability, and a member for a semiconductor manufacturing apparatus.SOLUTION: A member 1 coated with a ceramic spray coating film includes a densified layer 4 formed by applying a high-energy beam to a surface of a ceramic spray coating film 3 on a substrate 2. A crack suppression layer including multiple spray coating materials dispersed each other in a laminate state is provided under the densified layer 4. When a crack 6 propagating beyond the densified layer 4 in a depth direction reaches a boundary of the multiple coating materials, displacement between the spray coating materials contacting the boundary is caused, which suppresses the propagation of the crack 6 by releasing a force of the crack 6 and changing the direction of the crack.

Description

  In the present invention, the surface layer of the ceramic sprayed coating on the base material is densified by irradiation with a high energy beam to provide functions such as corrosion resistance and particle reduction, and in the depth direction of cracks generated by irradiation with a high energy beam. The present invention relates to a ceramic spray-coated member and a semiconductor manufacturing apparatus member that prevent the development of the above.

In order to improve the wear resistance and low friction of the structure, various types of sprayed coatings are formed on the surface of the structural member to form a sprayed coating coated member. Spraying method is a ceramic, a metal, a thermal spray powder material, such as during combustion flame of the combustible gas cermet, or supplying Ar, He, in the plasma jet flame which is generated by a gas such as H _2, soften or melt them This is a surface treatment technique for forming a thermal spray coating on the surface of the thermal sprayed body by spraying the surface of the thermal sprayed object at a high speed.

  With the expansion of the field of application of the thermal spray coating member, further improvement in functionality is desired for the ceramic thermal spray coating member using ceramic as the thermal spray material. One of the uses of the ceramic spray coating member is a structural member constituting a semiconductor manufacturing apparatus such as a CVD apparatus, a PVD apparatus, or a resist coating apparatus. Since processing gases containing fluorides and chlorides are often used in processing containers in semiconductor manufacturing processes, there is a problem that various members in the processing containers are corroded. Therefore, in addition to electrical insulation, members used in such manufacturing processes are required to have corrosion resistance. Further, the presence of fine particles called particles generated in the processing container affects the quality and yield of semiconductor device products. As a countermeasure against such a problem, a ceramic spray coating is formed on the surface of a member for a semiconductor manufacturing apparatus to improve electrical insulation and corrosion resistance, and to reduce generation of particles.

  However, under the condition where severe corrosive gas exists, there may be a case where a sufficient effect of corrosion resistance is not always obtained. In addition, in the manufacturing process of semiconductor devices, which continue to be miniaturized, the generation of finer-sized particles, which has not been regarded as a problem, has begun to be regarded as a problem. Therefore, the surface of the thermal spray coating formed on the substrate is irradiated with a high energy beam, and the surface coating composition is remelted and re-solidified to make the surface layer a densified layer. It is known that the effect of reducing corrosivity and particles is remarkably improved.

  For example, in Patent Document 1, as a method for producing a ceramic coating member for a semiconductor processing apparatus, a porous layer is formed by spraying an oxide of a Group 3a element of the periodic table on the surface of a base material. A technique for forming a secondary recrystallized layer by irradiating a surface layer with high energy is described. Patent Document 2 discloses a high-strength ceramic layer in which a mesh-like crack is formed by irradiating a ceramic sprayed coating with a laser beam or an electron beam to remelt and resolidify the ceramic composition on the surface of the sprayed coating. A member for a semiconductor manufacturing apparatus is provided.

JP 2007-27043 A JP 2013-095973 A

  However, as a method for manufacturing a ceramic coating member for a semiconductor processing apparatus, a porous layer is formed by spraying an oxide of group 3a element of the periodic table on the surface of the base material, and the surface layer of the porous layer is irradiated with high energy In the technique (Patent Document 1) for forming the secondary recrystallized layer by doing so, the porous layer is melted by high energy irradiation, and cracks are generated in the porous layer when the secondary recrystallized layer is formed. It is expected that. Depending on the form of the crack, there are concerns about an increase in particles, a decrease in corrosion resistance, a decrease in electrical insulation, and the like.

  For semiconductor manufacturing equipment comprising a high-strength ceramic layer in which a network-like crack is formed by irradiating a ceramic sprayed coating with a laser beam or an electron beam to remelt and resolidify the ceramic composition on the surface of the sprayed coating In the member (Patent Document 2), when the ceramic composition on the surface of the thermal spray coating is remelted and re-solidified, the size of cracks generated in a mesh shape on the surface of the thermal spray coating is controlled. However, when cracks on the deep side of the sprayed coating are formed deeply, there is a concern that the sprayed coating is damaged or the electrical insulation is significantly reduced.

  Accordingly, in view of the problems of the prior art, an object of the present invention is to provide a ceramic spray coating member and a semiconductor manufacturing apparatus member that are excellent in corrosion resistance, electrical insulation, and durability.

  In order to achieve the above objective, the following technical measures were taken. That is, the present invention relates to a ceramic sprayed coating covering member in which a densified layer is formed by irradiating the surface of a ceramic sprayed coating on a substrate with a high energy beam. A ceramic spray-coated member having a crack suppression layer made of a thermal spray material.

  Under the densified layer of the ceramic spray coating coated member of the present invention, there is a crack suppression layer that stops the progress of cracks when the densified layer is formed by irradiation with a high energy beam. Since the crack suppression layer is composed of a plurality of dispersed thermal spray materials, when a crack that has progressed beyond the densified layer in the depth direction reaches the interface of the thermal spray materials, it is in contact with this interface. Deviation between sprayed materials occurs. As a result, the crack force is released and further crack development can be stopped. By disperse | distributing the some thermal spray material in the lamination | stacking state, the direction of the crack which has progressed from the densification layer can be changed effectively. Therefore, even when irradiation with an increased energy amount of the laser beam is performed to increase the thickness of the densified layer, the progress of cracks exceeding the densified layer can be suppressed.

  By configuring the plurality of thermal spray materials with two or more kinds of ceramics including an oxide-based ceramic, the direction of cracks that have progressed to the crack suppression layer can be greatly changed.

  If at least one of the plurality of sprayed materials is formed in a substantially flat shape with a width of about 20 μm to 200 μm, it is possible to increase the effect of opening the crack force that has progressed from the densified layer, and to change the crack direction. It can be further transformed.

  By forming the crack suppression layer with a thickness of 50 μm or more, the progress of cracks can be more reliably stopped.

  It is preferable that the content rate of one of the plurality of thermal spray materials in the crack suppression layer is 3 vol% to 97 vol%. Thereby, progress of a crack can be stopped more effectively.

  The member for a semiconductor manufacturing apparatus of the present invention is a member for a semiconductor manufacturing apparatus comprising a ceramic sprayed coating member in which a ceramic sprayed coating is formed on a base material, and the ceramic sprayed coating covering portion is described above. It is a film covering member.

  Under the densified layer of the ceramic spray coating coating member constituting the member for a semiconductor manufacturing apparatus of the present invention, there is a crack suppression layer that stops the progress of cracks when the densified layer is formed by irradiation with a high energy beam. doing. Since the crack suppression layer is composed of a plurality of dispersed thermal spray materials, when a crack that has progressed beyond the densified layer in the depth direction reaches the interface of the thermal spray materials, it is in contact with this interface. Deviation between sprayed materials occurs. As a result, the crack force is released and further crack development can be stopped. By disperse | distributing the some thermal spray material in the lamination | stacking state, the direction of the crack which has progressed from the densification layer can be changed effectively. Therefore, even when irradiation with an increased energy amount of the laser beam is performed to increase the thickness of the densified layer, the progress of cracks exceeding the densified layer can be suppressed.

  According to the present invention, when irradiation with a high energy beam such as a laser is performed, even if the amount of energy is increased and the thickness of the densified layer is increased, the progress of cracks occurring in the depth direction can be suppressed. Corrosion resistance, electrical insulation and durability can be improved.

It is a cross-sectional schematic diagram of the ceramic spray-coating coating | coated member which concerns on 1st Embodiment of this invention. It is an electron micrograph of the section of the ceramic sprayed coating covering member concerning the present invention. It is a cross-sectional schematic diagram of the ceramic sprayed coating coating member which concerns on 2nd Embodiment of this invention. It is a schematic cross section which shows three examples of a ceramic spray-coating coating | coated member.

  An embodiment of the present invention will be described. FIG. 1 is a schematic cross-sectional view of a ceramic spray-coated member 1 according to the first embodiment of the present invention. The ceramic spray coating member 1 is used for various applications such as a semiconductor manufacturing apparatus, and is composed of a base material 2 and a ceramic spray coating 3 formed on the surface of the base material 2. . The ceramic sprayed coating on the substrate referred to in claim 1 means that when the ceramic sprayed coating is formed directly on the surface of the substrate, the ceramic sprayed coating is formed on the substrate via an undercoat or other layers. Both of the formed cases are included.

  Examples of the substrate 2 include metals, ceramics, cermets, polymer materials, polymer materials in which carbon fibers and ceramics are combined, and the like, and are not particularly limited. The base material 2 may be formed by forming a weld overlay, plating, another sprayed coating, or the like on the member. As an undercoat of the ceramic sprayed coating 3, welding overlay, plating, and another sprayed coating may be provided.

  The surface layer of the ceramic sprayed coating 3 is a densified layer 4 formed by irradiating a high energy beam, and the lower layer (the lower layer in FIG. 1) is a crack suppressing layer for suppressing the progressing cracks. 5

  The ceramic sprayed coating before irradiation with a high energy beam will be described. The ceramic sprayed coating here corresponds to the ceramic sprayed coating 3 in FIG. The ceramic sprayed coating contains at least one oxide-based ceramic and is formed by spraying a plurality of sprayed materials made of two or more kinds of ceramics. The thickness of the ceramic sprayed coating is preferably in the range of 50 μm to 4000 μm. If the thickness is less than 50 μm, the uniformity of the film is lowered and the film functions such as corrosion resistance and electrical insulation resistance cannot be fully exhibited. If the thickness exceeds 4000 μm, the mechanical properties of the film are affected by the residual stress inside the film. Strength will fall.

  As a combination of the ceramic spray materials constituting the ceramic spray coating, it is preferable that the ceramic spray coating is formed of two or more kinds of ceramics including an oxide ceramic. Specific examples of the ceramic spray material are selected from the group of Ni, Cr, Co, Al, Ta, Y, W, Nb, V, Ti, B, Si, Mo, Zr, Fe, Hf, La, and Ni. Examples thereof include elemental elements or oxide-based ceramics, nitride-based ceramics, fluoride-based ceramics, carbide-based ceramics, boride-based ceramics, etc., or a mixture thereof.

Specific examples of the oxide-based ceramic include Al ₂ O ₃ , HfO ₂ , La ₂ O ₃ , Al ₂ O ₃ .SiO ₂ , NiO, ZrO ₂ .SiO _2, TiO ₂ , SiO ₂ , Cr ₂ O ₃ , _{ZrO 2, Y 2 O 3,} MgO, CaO and the like. Examples of the nitride ceramic include TiN, TaN, AlN, BN, Si ₃ N ₄ , HfN, NbN, YN, ZrN, Mg ₃ N ₂ , and Ca ₃ N ₂ . Examples of the fluoride ceramic include LiF, CaF ₂ , BaF ₂ , YF ₃ , AlF ₃ , ZrF ₄ MgF _{2 and the} like. Examples of the carbide ceramic include TiC, WC, TaC, B ₄ C, SiC, HfC, ZrC, VC, Cr ₃ C _{2 and the} like. Examples of the boride-based ceramic include TiB ₂ , ZrB ₂ , HfB ₂ , VB ₂ , TaB ₂ , NbB ₂ , W ₂ B ₅ , CrB ₂ , and LaB ₆ .

  In order to form a ceramic sprayed coating, for example, a plurality of ceramic sprayed powders are mixed in advance, and the ceramic sprayed powder is injected into a flame gun frame using a single material supply device. As another method, different thermal spray powders are put in each of a plurality of material supply apparatuses, and different thermal spray powders are simultaneously injected into the frame of the thermal spray gun using this apparatus to perform thermal spraying.

  Examples of the thermal spraying method for forming the ceramic sprayed coating include atmospheric plasma spraying, reduced pressure plasma spraying, water plasma spraying, high-speed flame spraying, gas flame spraying, and explosion spraying. In particular, the plasma spraying method using electric energy as a heat source is a film that uses argon, hydrogen, nitrogen, or the like as a plasma generation source, and has a high heat source temperature and a high flame speed. Is suitable for a thermal spraying method for forming the ceramic thermal spray coating 3.

  As the raw material powder for forming the ceramic sprayed coating, a powder having a particle size range of about 5 μm to 80 μm is used. When thermal spraying is performed using a ceramic powder in this particle size range, thermal spraying can be performed in a substantially flat shape with a width of about 20 μm to 200 μm. If the powder particle size is smaller than 5 μm, the fluidity of the powder is lowered and stable supply cannot be achieved, and the thickness of the film tends to be non-uniform. If the particle size exceeds 80 μm, the film is formed without being completely melted. This is not preferable because it is excessively porous and the film quality becomes rough. The film forming conditions by these respective thermal spraying methods may be appropriately set according to the base material, raw material powder, film thickness, manufacturing environment, and the like.

  The densified layer 4 is formed by irradiating the surface layer of the ceramic sprayed coating with a high energy beam. The lower layer of the densified layer 4 is a crack suppression layer 5 that has not been densified. By remelting and resolidifying the surface layer of the ceramic sprayed coating, the boundary between different ceramic sprayed structures constituting the ceramic sprayed coating is reduced, and the densified layer 4 has a very dense coating structure. The average porosity of the densified layer 4 is preferably less than 5%, and more preferably less than 2%.

  The thickness of the densified layer 4 is preferably about 10 μm to 200 μm from the surface. If the thickness is less than 10 μm, the effect of forming the densified layer 4 is small. If the thickness exceeds 200 μm, the effect of forming the densified layer 4 is saturated, and the residual stress of the remelted and resolidified surface layer is excessive. As a result, the impact resistance against external force is reduced.

  The high energy beam for obtaining the densified layer 4 refers to a laser beam, an electron beam, or the like. The high energy beam is irradiated by scanning the surface of the ceramic sprayed coating formed on the substrate 2 with a laser beam or an electron beam. There are a method of scanning a high energy beam with a galvano scanner or a method of fixing a scanning object on an XY stage and moving it in the X and Y directions. The scanning conditions may be adjusted as appropriate so as to satisfy the required thickness and porosity.

In the laser beam irradiation, a CO ₂ gas laser or a YAG laser is preferably used. As the laser beam irradiation conditions, laser output: 0.01 to 1 kW, laser beam area: 0.01 to 250 mm ² , and irradiation speed: 1 to 100 mm / s are recommended. As the electron beam irradiation conditions, irradiation atmosphere: 10 to 0.0005 Pa, irradiation power: 0.1 to 8 kW, irradiation speed: 1 to 30 m / s are recommended. What is necessary is just to adjust irradiation conditions suitably so that the thickness and porosity required for the densified layer 4 may be satisfied under these conditions.

  Since the densified layer 4 has a very dense structure compared to the surface layer of the ceramic sprayed coating before irradiation with a high energy beam, the mechanical strength can be improved and the corrosion resistance and particle reduction effect can be improved. it can.

  In general, when a densified layer is formed by irradiation with a high energy beam, cracks are generated due to shrinkage when the surface layer of the ceramic sprayed coating is remelted and resolidified. When the crack progresses too deeply in the direction of the film depth, the film functions such as corrosion resistance and withstand voltage are lowered. In the present embodiment, the crack suppression layer 5 that stops the growth of the crack 6 is present under the densified layer 4. The term “under the densified layer 4” in the present embodiment means that the layer exists immediately below the densified layer 4, and does not mean that the layer exists below the densified layer 4 via any layer. It is essential that the crack suppression layer 5 exists at a position in contact with the densified layer 4.

  The crack suppressing layer 5 is obtained as a lower layer of the densified layer 4 when the ceramic sprayed coating 3 is sprayed and then a high energy beam is irradiated to form the densified layer 4 on the upper layer side of the ceramic sprayed coating 3. It is a thing. Therefore, the crack suppression layer 5 includes at least one oxide ceramic and is made of a plurality of thermal spray materials made of two or more kinds of ceramics.

  The crack suppression layer 5 is a layer obtained by spraying a plurality of thermal spray materials, and the plurality of thermal spray materials are dispersed in the crack suppression layer 5 in a laminated state. Due to the presence of the crack suppression layer 5, the direction of the crack 6 that has progressed to the crack suppression layer 5 can be largely changed, and the progress of the crack 6 in the deep direction can be reliably stopped.

When the plurality of thermal spray materials of the crack suppression layer 5 include at least one oxide ceramic, thermal spraying properties are improved, and coating functions such as corrosion resistance and voltage resistance are improved. When a thermal spray material having a high yield, such as Al ₂ O ₃ , TiO ₂ , or Y ₂ O ₃ , is selected, it is advantageous in engineering. At least one of the plurality of thermal spray materials having a laminated structure in the crack suppression layer 5 is formed in a substantially flat shape with a width of about 20 μm to 200 μm. The width here refers to the length along the left-right direction in FIG. If at least one of the plurality of sprayed materials is smaller than 20 μm, the progress of the cracks 6 cannot be greatly changed. Therefore, the effect of suppressing the progress of the cracks 6 is small. A crack is generated, and the effect of stopping the progress of the crack 6 in the depth direction is reduced.

  The thickness of the crack suppression layer 5 is preferably 40 μm or more, and more preferably 100 μm or more. By setting it as such thickness, the progress to the deep part direction of the crack 6 can be stopped more reliably. If the thickness of the crack suppression layer 5 is thinner than 40 μm, the crack 6 may progress in the deep direction beyond the crack suppression layer 5.

  The content of the laminated coating composed of one of the plurality of thermal spray materials in the crack suppression layer 5 is preferably 3 vol% to 97 vol%, and more preferably 10 vol% to 90 vol%. By setting it as such a content rate, the progress to the deep part direction of the crack 6 can be stopped more reliably. When this content rate is smaller than 3 vol% or larger than 97 vol%, the area of the interface between the plurality of thermal spray materials included in the crack suppression layer 5 becomes small. For this reason, the crack 6 cannot reach the interface, and the effect of suppressing the progress of the crack 6 in the deep direction may be lost.

  As described above, under the densified layer 4 of the ceramic sprayed coating member 1 of the present embodiment, the crack suppression layer 5 that stops the progress of cracks when the densified layer 4 is formed by irradiation with a high energy beam. The crack suppression layer 5 is formed of a plurality of dispersed thermal spray materials. Therefore, when the crack 6 that has progressed beyond the densified layer 4 in the depth direction reaches the interface of the plurality of thermal spray materials, the thermal spray materials that are in contact with the interface are displaced. Therefore, the force of the crack 6 is released, and further development of the crack 6 can be stopped. By disperse | distributing the some thermal spray material in the lamination | stacking state, the direction of the crack 6 which has advanced from the densification layer 4 can be changed effectively.

  Accordingly, even if the thickness of the densified layer 4 is increased by performing irradiation with an increased energy amount of the laser beam, the progress of the cracks 6 exceeding the densified layer 4 can be suppressed. Thereby, when performing irradiation with a high energy beam such as a laser beam, even if the amount of energy is increased and the thickness of the densified layer 4 is increased, the progress of cracks occurring in the deep direction can be suppressed. Corrosion resistance, electrical insulation and durability can be improved.

FIG. 2 is an electron micrograph of a cross section of the ceramic sprayed coating member according to the present invention. In this ceramic sprayed coating member, Al ₂ O ₃ and Y ₂ O ₃ are mixed at a content of 50 vol% to form a sprayed powder, and this sprayed powder is sprayed onto an Al substrate by plasma spraying. In this example, a densified layer is formed by further irradiating a 0.03 kw CO ₂ laser beam. The thickness of the ceramic sprayed coating is about 400 μm, and the thickness of the densified layer is about 50 μm. Each thermal spray material that forms a laminated structure in the crack suppression layer, which is the lower layer of the densified layer, is approximately flat with a width of about 20 μm to 200 μm. It can be seen that the cracks that have progressed to the densified layer stop at the crack suppression layer immediately below.

The present invention will be described in more detail with reference to examples. The present invention is not limited to the following examples. A 50 mm × 50 mm × 10 mm aluminum (A5052) material is used as a base material, a ceramic sprayed coating is formed on the base material by a plasma spraying method, and a laser irradiation condition (scanning speed) using a 0.03 kw CO ₂ laser. And the like were appropriately set to form a densified layer. The samples of Examples 1 to 11 and Comparative Examples 1 to 5 were manufactured by changing the thermal spray material, the content of each thermal spray material, the flat width of the thermal spray material after thermal spraying, and the thickness of the crack suppression layer. It was evaluated whether it penetrated the layer. The results are shown in Table 1. In each Example, it was recognized that the progress to the deep part of the crack was suppressed.

  FIG. 3 is a schematic cross-sectional view of the ceramic spray-coated member 10 according to the second embodiment of the present invention. In the first embodiment, the coating on the substrate 2 has a two-layer structure consisting of the crack suppression layer 5 and the densified layer 4, but in this embodiment, the coating on the substrate 11 is composed of the dielectric layer 12, the crack suppression layer 13, and A three-layer structure composed of the densified layer 14 is employed. In the ceramic sprayed coating member 10 of the present embodiment, a sprayed coating constituting the dielectric layer 12 is formed on the substrate 11, and further, a ceramic sprayed coating 15 made of a plurality of sprayed materials is formed on the surface of the dielectric layer 12. . Thereafter, the surface of the ceramic spray coating 15 made of a plurality of thermal spray materials is irradiated with a high energy beam to form the densified layer 14 on the surface layer of the ceramic spray coating 15. In this way, the crack suppression layer 13 is formed under the densified layer 14 to suppress the development of the crack 16.

  The present invention is not limited to the above embodiments and examples. The application target of the ceramic spray coating member is not limited, and for example, a member for a semiconductor manufacturing apparatus may be configured by the ceramic spray coating member according to the present invention. In this case, the durability of the semiconductor manufacturing apparatus member can be significantly improved.

  FIG. 4 is a schematic cross-sectional view showing three examples of a ceramic spray coating member. 4A shows the untreated member 20 in which the densified layer is not formed, and FIGS. 4A1 to 4A3 show the thickness of the densified layer 21 by adjusting the energy amount of the high energy beam. This is an example in which is changed. In the untreated member 20 not irradiated with the high energy beam shown in FIG. 4A, a ceramic sprayed coating 23 made of a plurality of sprayed materials is formed on the base material 22, and another ceramic sprayed coating is further formed on the surface thereof. 24 is formed.

  In the example of FIG. 4 (a1), the other ceramic sprayed coating region becomes the densified layer 21, and further the densified layer 21 slightly penetrates into the region of the ceramic sprayed coating 23 made of a plurality of sprayed materials. It is a member. The example of FIG. 4 (a2) is a ceramic sprayed coating-coated member in which only the other ceramic sprayed coating region is the densified layer 21. The example of FIG. 4 (a3) is a ceramic spray coating member in which a part of the other ceramic spray coating region becomes the densified layer 21 and the other ceramic spray coating 24 region remains. Therefore, in this example, the crack suppression layer 23, the other ceramic sprayed coating 24, and the densified layer 21 are formed on the base material 22 in this order. That is, in order to achieve the object of the present invention, it is sufficient that a crack suppressing layer in which a plurality of ceramic sprayed materials are dispersed exists under a densified layer formed by irradiation with a high energy beam. The upper film structure is not limited.

DESCRIPTION OF SYMBOLS 1 Ceramic spray coating coating | coated member 2 Base material 3 Ceramic spray coating 4 Densification layer 5 Crack suppression layer 6 Crack

Claims (6)

In the ceramic sprayed coating coated member in which the surface of the ceramic sprayed coating on the substrate is irradiated with a high energy beam to form a densified layer,
A ceramic sprayed coating-coated member comprising a crack suppressing layer made of a plurality of sprayed materials dispersed in a laminated state under the densified layer.   2. The ceramic spray-coated member according to claim 1, wherein the plurality of thermal spray materials are composed of two or more kinds of ceramics including an oxide-based ceramic.   3. The ceramic spray-coated member according to claim 1, wherein at least one of the plurality of sprayed materials is formed in a substantially flat shape with a width of about 20 μm to 200 μm.   The ceramic sprayed coating-coated member according to claim 1, wherein the crack suppression layer is formed with a thickness of 50 μm or more.   The ceramic sprayed coating member according to any one of claims 1 to 4, wherein a content of one of the plurality of sprayed materials in the crack suppression layer is 3 vol% to 97 vol%. A member for a semiconductor manufacturing apparatus comprising a ceramic sprayed coating covering member in which a ceramic sprayed coating is formed on a substrate,
The said ceramic sprayed coating coating part is a ceramic sprayed coating coating member in any one of Claims 1-5, The member for semiconductor manufacturing apparatuses characterized by the above-mentioned.