JP2015193149A - Method of manufacturing woody member, and woody member - Google Patents
Method of manufacturing woody member, and woody member Download PDFInfo
- Publication number
- JP2015193149A JP2015193149A JP2014072454A JP2014072454A JP2015193149A JP 2015193149 A JP2015193149 A JP 2015193149A JP 2014072454 A JP2014072454 A JP 2014072454A JP 2014072454 A JP2014072454 A JP 2014072454A JP 2015193149 A JP2015193149 A JP 2015193149A
- Authority
- JP
- Japan
- Prior art keywords
- wooden
- laser
- minimum processing
- surface layer
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Finished Plywoods (AREA)
Abstract
Description
本発明は、木質部材の製造方法及び木質部材、より詳細には溝を有する木質部材の製造方法及び溝を有する木質部材に関するものである。 The present invention relates to a method for manufacturing a wooden member and a wooden member, and more particularly to a method for manufacturing a wooden member having a groove and a wooden member having a groove.
従来、Ｖ溝を有する板状の木質部材を、このＶ溝に沿って折り曲げて角を形成し、家具、建材などのコーナーや周り縁等の表面化粧材として使用している。このような木質部材を製造する方法として、木製合板などの基板にプラスチックシートを貼着した化粧板を用意し、Ｖカッターを用いて、化粧板を切削加工してＶ溝を形成する方法が提案されている（特許文献１参照）。 Conventionally, a plate-like wooden member having a V-groove is bent along the V-groove to form a corner, and is used as a surface decorative material for corners and surrounding edges of furniture and building materials. As a method for manufacturing such a wood member, a method is proposed in which a decorative board in which a plastic sheet is attached to a substrate such as a wooden plywood is prepared, and a V groove is formed by cutting the decorative board using a V cutter. (See Patent Document 1).
しかし、特許文献１に記載された方法では、Ｖ溝を形成するための切削加工の際に、Ｖカッターやルーター等の切削工具がプラスチックシートに達すると、プラスチックシートが破損してしまうおそれがある。 However, in the method described in Patent Document 1, when a cutting tool such as a V cutter or a router reaches the plastic sheet during the cutting process for forming the V groove, the plastic sheet may be damaged. .
また、基板が木質材料から形成されている場合、含水率のばらつきや木目によって、基板の切削されやすさにばらつきが生じやすい。そのため、溝の深さを一定に形成することが困難であるという問題があった。 In addition, when the substrate is made of a wood material, the substrate is likely to be easily cut due to variations in moisture content or grain. For this reason, there is a problem that it is difficult to form the groove with a constant depth.
さらに、Ｖカッターやルーター等の切削工具を用いて切削加工する場合、刃の固定などの調整に時間がかかる。また、使用後は、刃先の研磨等のメンテナンスが必要となり、煩雑な手間がかかる。 Further, when cutting is performed using a cutting tool such as a V-cutter or a router, it takes time to adjust the fixing of the blade. In addition, after use, maintenance such as polishing of the blade edge is required, which is troublesome.
本発明は上記の点に鑑みてなされたものであり、切削工具を用いずに、木質基材と表面層とを備える板材に、所定の深さの溝を容易に形成することができる木質部材の製造方法及び木質部材を提供することを目的とする。 The present invention has been made in view of the above points, and without using a cutting tool, a wooden member capable of easily forming a groove having a predetermined depth in a plate material including a wooden substrate and a surface layer. An object of the present invention is to provide a manufacturing method and a wooden member.
本発明に係る木質部材の製造方法は、第一面及び第二面を備える板状の木質基材と、前記第一面を覆う表面層とを備える板材に、前記第二面で開口する溝を形成する工程を含む木質部材の製造方法であって、
前記第二面にレーザを、このレーザが前記表面層を貫通しないように照射することで、前記溝を形成することを特徴とするものである。
The manufacturing method of the wooden member which concerns on this invention is a groove | channel opened on said 2nd surface in the board | plate material provided with the plate-shaped wooden base material provided with a 1st surface and a 2nd surface, and the surface layer which covers said 1st surface. A method for manufacturing a wooden member including a step of forming
The groove is formed by irradiating the second surface with a laser so that the laser does not penetrate the surface layer.
上記の木質部材の製造方法では、前記表面層の最小の加工エネルギーは、前記木質基材の最小の加工エネルギーよりも大きく、
前記レーザのエネルギーは、前記木質基材の最小の加工エネルギー以上であり、前記表面層の最小の加工エネルギーよりも小さいことが好ましい。
In the manufacturing method of the wooden member, the minimum processing energy of the surface layer is larger than the minimum processing energy of the wooden substrate,
The energy of the laser is preferably equal to or greater than the minimum processing energy of the wood substrate and smaller than the minimum processing energy of the surface layer.
上記の木質部材の製造方法では、前記板材は、前記木質基材と前記表面層との間に接着層を備え、
前記接着層の最小の加工エネルギーは、前記木質基材の最小の加工エネルギーよりも大きく、
前記レーザのエネルギーは、前記木質基材の最小の加工エネルギー以上であり、前記接着層の最小の加工エネルギーよりも小さいことが好ましい。
In the manufacturing method of the wooden member, the plate member includes an adhesive layer between the wooden base material and the surface layer,
The minimum processing energy of the adhesive layer is greater than the minimum processing energy of the wood substrate,
The energy of the laser is preferably equal to or higher than the minimum processing energy of the wood substrate and smaller than the minimum processing energy of the adhesive layer.
上記の木質部材の製造方法では、前記板材は、前記木質基材と前記表面層との間に保護層を備え、
前記第二面における前記保護層と重なる位置に、前記レーザを照射し、
前記保護層の最小の加工エネルギーは、前記木質基材の最小の加工エネルギーよりも大きく、
前記レーザのエネルギーは、前記木質基材の最小の加工エネルギー以上であり、前記保護層の最小の加工エネルギーよりも小さいことが好ましい。
In the manufacturing method of the wooden member, the plate member includes a protective layer between the wooden substrate and the surface layer,
Irradiating the laser to a position overlapping the protective layer on the second surface,
The minimum processing energy of the protective layer is greater than the minimum processing energy of the wooden substrate,
The energy of the laser is preferably equal to or higher than the minimum processing energy of the wood substrate and smaller than the minimum processing energy of the protective layer.
上記の木質部材の製造方法では、前記レーザの照射中、前記表面層を冷却することが好ましい。 In the method for manufacturing a wood member, it is preferable that the surface layer is cooled during the laser irradiation.
本発明に係る木質部材は、第一面及び第二面を備える板状の木質基材と、前記第一面を覆う表面層と、前記木質基材と前記表面層との間にある保護層と、前記第二面の前記保護層と重なる位置で開口する溝とを備え、
前記保護層の発火点は、前記木質基材の発火点よりも高いことを特徴とするものである。
The wooden member according to the present invention includes a plate-shaped wooden substrate having a first surface and a second surface, a surface layer covering the first surface, and a protective layer between the wooden substrate and the surface layer. And a groove that opens at a position overlapping the protective layer on the second surface,
The ignition point of the protective layer is higher than the ignition point of the wooden substrate.
本発明によれば、切削工具を用いずに、木質基材と表面層とを備える板材に、所定の深さの溝を容易に形成することができる。 ADVANTAGE OF THE INVENTION According to this invention, the groove | channel of predetermined depth can be easily formed in the board | plate material provided with a wooden base material and a surface layer, without using a cutting tool.
以下、本発明の実施の形態を説明する。
（第一の実施形態）
図１Ｃに、第一の実施形態に係る製造方法で得られた木質部材１の一例を示す。木質部材１は、第一面３１及び第二面３２を備える板状の木質基材３と、第一面３１を覆う表面層４と、第二面３２で開口する溝５とを備える。表面層４は木質基材３の第一面３１の全面に設けられていてよい。溝５の底部６では、表面層４が露出していてもよく、底部６が木質基材３にあり表面層４に達していなくてもよい。溝５の深さは、木質基材３の厚みと同じであってもよく、木質基材３の厚みよりも浅くてもよい。
Embodiments of the present invention will be described below.
(First embodiment)
FIG. 1C shows an example of the wooden member 1 obtained by the manufacturing method according to the first embodiment. The wooden member 1 includes a plate-shaped wooden substrate 3 having a first surface 31 and a second surface 32, a surface layer 4 that covers the first surface 31, and a groove 5 that opens on the second surface 32. The surface layer 4 may be provided on the entire first surface 31 of the wooden substrate 3. At the bottom 6 of the groove 5, the surface layer 4 may be exposed, or the bottom 6 may be on the wooden substrate 3 and not reach the surface layer 4. The depth of the groove 5 may be the same as the thickness of the wooden substrate 3 or may be shallower than the thickness of the wooden substrate 3.
図１Ａ〜図１Ｃに、第一の実施形態に係る製造方法の一例を示す。第一の実施形態に係る製造方法は、第一面３１及び第二面３２を備える板状の木質基材３と、第一面３１を覆う表面層４とを備える板材２に、第二面３２で開口する溝５を形成する工程を含む。第二面３２にレーザを、このレーザが表面層４を貫通しないように照射することで、溝５を形成する。 1A to 1C show an example of the manufacturing method according to the first embodiment. The manufacturing method according to the first embodiment includes a plate-like wooden substrate 3 having a first surface 31 and a second surface 32, and a plate material 2 having a surface layer 4 covering the first surface 31. A step of forming a groove 5 opening at 32. The groove 5 is formed by irradiating the second surface 32 with a laser so that the laser does not penetrate the surface layer 4.
第一の実施形態では、まず、図１Ａのように、第一面３１及び第二面３２を備える板状の木質基材３と、第一面３１を覆う表面層４とを備える板材２を用意する。板材２は、例えば、木質基材３と表面層４とを接着剤で接着することにより、形成することができる。 In the first embodiment, first, as shown in FIG. 1A, a plate material 2 including a plate-like woody base material 3 including a first surface 31 and a second surface 32 and a surface layer 4 covering the first surface 31. prepare. The board | plate material 2 can be formed by adhere | attaching the wooden base material 3 and the surface layer 4 with an adhesive agent, for example.
次に、図１Ｂのように、第二面３２にレーザを照射すると共に、第二面３２上のレーザの照射位置を移動させることで、溝５を形成する。レーザは、表面層４を貫通しないように照射する。板材２にレーザを照射すると、板材２を溶融及び蒸発させて、溝５を形成することができる。レーザを用いることで、板材２に、所定の深さの溝５を容易に形成することができる。 Next, as shown in FIG. 1B, the second surface 32 is irradiated with laser, and the laser irradiation position on the second surface 32 is moved to form the groove 5. The laser is irradiated so as not to penetrate the surface layer 4. When the plate material 2 is irradiated with a laser, the plate material 2 can be melted and evaporated to form the grooves 5. By using a laser, the groove 5 having a predetermined depth can be easily formed in the plate 2.
木質基材３の材料としては、木質系材料が挙げられる。木質系材料としては、例えば、木材、集成材、合板、パーティクルボード、中比重繊維板（ＭｅｄｉｕｍＤｅｎｓｉｔｙ Ｆｉｂｅｒｂｏａｒｄ、ＭＤＦ）等の木質繊維板などが挙げられる。木質基材３の材料は、合成樹脂材料に木粉や無機フィラーなどを含有させた複合材を、板状に加工した木質系材料でもよい。木質基材３の厚みは、例えば、１〜１０ｍｍの範囲内である。 An example of the material of the wooden substrate 3 is a wooden material. Examples of the wood-based material include wood fiber boards such as wood, laminated wood, plywood, particle board, medium density fiber board (MDF), and the like. The material of the wood substrate 3 may be a wood material obtained by processing a composite material in which a synthetic resin material contains wood powder, an inorganic filler, or the like into a plate shape. The thickness of the wooden substrate 3 is in the range of 1 to 10 mm, for example.
レーザは適宜選択され、例えば、ＣＯ２レーザが挙げられる。木質基材３の材料である木質系材料は、ＣＯ２レーザの吸収率が高い。そのため、ＣＯ２レーザである場合、木質基材３におけるレーザの反射及び透過が低減され、レーザ加工の効率が向上する。 The laser is appropriately selected, and examples thereof include a CO 2 laser. The wood material which is the material of the wood substrate 3 has a high CO 2 laser absorption rate. Therefore, in the case of a CO 2 laser, the reflection and transmission of the laser beam on the wooden substrate 3 are reduced, and the efficiency of laser processing is improved.
表面層４としては、例えば、シート状の化粧用の材料が挙げられる。第一の実施形態では、表面層４の最小の加工エネルギーは、木質基材３の最小の加工エネルギーよりも大きいことが好ましい。本明細書では、ある材料の加工エネルギーとは、その材料をレーザ加工することができるレーザのエネルギーを意味する。また、本明細書では、材料の最小の加工エネルギーとは、その材料をレーザ加工することができるレーザのエネルギーの最小値を意味する。なお、レーザ加工とは、ある材料にレーザを照射することで、その材料を熔融及び蒸発させることである。 Examples of the surface layer 4 include a sheet-like cosmetic material. In the first embodiment, the minimum processing energy of the surface layer 4 is preferably larger than the minimum processing energy of the wooden substrate 3. In this specification, the processing energy of a material means the energy of a laser capable of laser processing the material. In this specification, the minimum processing energy of a material means the minimum value of the energy of a laser that can laser process the material. The laser processing is to melt and evaporate a material by irradiating the material with a laser.
本明細書では、木質基材３内に、最小の加工エネルギーのばらつきが存在する場合、木質基材３の最小の加工エネルギーは、木質基材３内の最小の加工エネルギーの最大値で規定する。木質基材３内に、最小の加工エネルギーのばらつきが存在する場合とは、１枚の木質基材３において、場所によって最小の加工エネルギーが異なる場合である。場所によって最小の加工エネルギーが異なる１枚の木質基材３において、最小の加工エネルギーが最も高い場所の値が、その木質基材３の最小の加工エネルギーである。木質基材３内に、最小の加工エネルギーのばらつきが存在する木質基材３としては、例えば、含水率が異なっている部分があったり、木目がある木質系材料が挙げられる。木質基材３の最小の加工エネルギーとは、含水率や木目等の影響を受けずに、木質基材３を加工することができる最小の加工エネルギーともいえる。 In the present specification, when there is a minimum processing energy variation in the wood base material 3, the minimum processing energy of the wood base material 3 is defined by the maximum value of the minimum processing energy in the wood base material 3. . The case where the minimum processing energy variation exists in the wooden base material 3 is a case where the minimum processing energy varies depending on the location in one wooden base material 3. The value of the place where the minimum processing energy is the highest in one wooden base material 3 having the minimum processing energy depending on the location is the minimum processing energy of the wooden base material 3. Examples of the wood base material 3 in which the variation in the minimum processing energy exists in the wood base material 3 include a part having a different moisture content or a wood type material having a grain. The minimum processing energy of the wooden substrate 3 can be said to be the minimum processing energy that can process the wooden substrate 3 without being affected by the moisture content, grain, or the like.
木質基材３の最小の加工エネルギーと表面層４の最小の加工エネルギーの差は、木質基材３の厚み、レーザの種類等に応じて、適宜設定される。例えば、木質基材３の厚みは、厚ければ厚いほど、レーザ加工で生じる熱が放熱されにくくなり、木質基材３に熱が蓄積されやすくなる。木質基材３に熱が蓄積されると、木質基材３と表面層４との境界において、表面層４の温度が上昇しやすくなる。よって、木質基材３の厚みが厚いほど、木質基材３の最小の加工エネルギーと表面層４の最小の加工エネルギーの差は大きくすることが好ましい。また、例えば、レーザは、パルス幅が長ければ長いほど、木質基材３のレーザ照射部分の周囲にレーザの熱が伝わりやすくなる。レーザの熱が伝わりやすい場合、木質基材３と表面層４との境界において、表面層４に熱が伝わりやすくなる。よって、レーザのパルス幅が長ければ長いほど、木質基材３の最小の加工エネルギーと表面層４の最小の加工エネルギーの差は大きくすることが好ましい。 The difference between the minimum processing energy of the wooden substrate 3 and the minimum processing energy of the surface layer 4 is appropriately set according to the thickness of the wooden substrate 3, the type of laser, and the like. For example, as the thickness of the wooden base material 3 increases, heat generated by laser processing is less likely to be dissipated and heat is more likely to accumulate in the wooden base material 3. When heat is accumulated in the wooden substrate 3, the temperature of the surface layer 4 easily rises at the boundary between the wooden substrate 3 and the surface layer 4. Therefore, it is preferable that the difference between the minimum processing energy of the wooden base material 3 and the minimum processing energy of the surface layer 4 increases as the thickness of the wooden base material 3 increases. Further, for example, the longer the pulse width of the laser, the easier it is for the heat of the laser to be transmitted around the laser irradiated portion of the wooden substrate 3. When the heat of the laser is easily transmitted, the heat is easily transmitted to the surface layer 4 at the boundary between the wooden substrate 3 and the surface layer 4. Therefore, the longer the laser pulse width, the greater the difference between the minimum processing energy of the wood substrate 3 and the minimum processing energy of the surface layer 4.
木質基材３よりも最小の加工エネルギーが大きい材料としては、木質基材３よりも発火点が高い材料が挙げられる。木質基材３よりも発火点が高い材料として、例えば、紙、布が挙げられる。具体的には、木質基材３の材料が、発火点が２５０℃である木材である場合、表面層４としては、発火点が２５０℃よりも高い材料を選択することができる。発火点が２５０℃よりも高い材料としては、例えば、発火点４５０℃程度の模造紙や、発火点５００℃程度の木綿や、発火点３５０〜４５０℃のポリエチレン（ＰＥ）、発火点３００〜４４０℃のポリプロピレンが挙げられる。 Examples of the material having a minimum processing energy larger than that of the wooden substrate 3 include materials having a higher ignition point than the wooden substrate 3. Examples of the material having a higher ignition point than the wooden base material 3 include paper and cloth. Specifically, when the material of the wooden substrate 3 is wood having an ignition point of 250 ° C., a material having an ignition point higher than 250 ° C. can be selected as the surface layer 4. Examples of the material having an ignition point higher than 250 ° C include, for example, imitation paper having an ignition point of about 450 ° C, cotton having an ignition point of about 500 ° C, polyethylene (PE) having an ignition point of 350 to 450 ° C, and an ignition point of 300 to 440. Polypropylene at 0 ° C. can be mentioned.
また、第一の実施形態では、レーザのエネルギーは、木質基材３の最小の加工エネルギー以上であり、表面層４の最小の加工エネルギーよりも小さいことが好ましい。本明細書では、レーザのエネルギーは、板材２に照射中のレーザのエネルギーを意味する。 In the first embodiment, the energy of the laser is preferably equal to or higher than the minimum processing energy of the wooden substrate 3 and smaller than the minimum processing energy of the surface layer 4. In this specification, the energy of the laser means the energy of the laser that is irradiating the plate 2.
表面層４の最小の加工エネルギーを、木質基材３の最小の加工エネルギーよりも大きくすると共に、レーザのエネルギーを上記の範囲内にすることにより、レーザ加工を、木質基材３と表面層４の境界で停止させやすくなる。このため、木質基材３をレーザ加工すると共に、表面層４をレーザ加工しないようにすることができ、レーザが表面層４を貫通せずに溝５を形成しやすくなる。また、深さが一定の溝５を形成しやすくなる。 By making the minimum processing energy of the surface layer 4 larger than the minimum processing energy of the wood base material 3 and making the energy of the laser within the above range, the laser processing is performed by the wood base material 3 and the surface layer 4. It becomes easy to stop at the boundary. For this reason, the wood substrate 3 can be laser processed and the surface layer 4 can be prevented from being laser processed, so that the laser beam can be easily formed without penetrating the surface layer 4. Moreover, it becomes easy to form the groove 5 having a constant depth.
図１Ｂのように、レーザの照射中、表面層４を冷却することが好ましい。すなわち、溝５を形成する際、表面層４を冷却しながら板材２をレーザ加工することが好ましい。表面層４のうち、溝５を形成する箇所と重なる部分が、少なくとも冷却されていることが好ましい。溝５を形成する箇所と重なる部分とは、平面視において溝５を形成する箇所と重なる部分である。本明細書では、平面視とは、木質部材１の厚み方向に見ることを意味する。 As shown in FIG. 1B, the surface layer 4 is preferably cooled during laser irradiation. That is, when forming the groove 5, it is preferable to laser-process the plate member 2 while cooling the surface layer 4. It is preferable that at least a portion of the surface layer 4 that overlaps with a portion where the groove 5 is formed is cooled. The portion that overlaps with the portion where the groove 5 is formed is a portion that overlaps with the portion where the groove 5 is formed in plan view. In this specification, the plan view means viewing in the thickness direction of the wooden member 1.
表面層４を冷却する方法としては、例えば、図１Ｂのように表面層４に冷却プレート９を接触させる方法、及び表面層４に冷風を吹きつける方法（図示せず）が挙げられる。冷却プレート９としては、例えば、銅板、及び水冷式の放熱板が挙げられる。レーザ照射中に、表面層４が冷却されていることにより、表面層４の温度が上昇しにくくなり、表面層４がよりレーザ加工されにくくなる。レーザ照射後に、冷却を停止し、図１Ｃのような木質部材１が得られる。 Examples of the method for cooling the surface layer 4 include a method of bringing the cooling plate 9 into contact with the surface layer 4 as shown in FIG. 1B and a method of blowing cool air to the surface layer 4 (not shown). Examples of the cooling plate 9 include a copper plate and a water-cooled heat radiating plate. Since the surface layer 4 is cooled during laser irradiation, the temperature of the surface layer 4 is unlikely to rise, and the surface layer 4 is more difficult to be laser processed. After the laser irradiation, the cooling is stopped, and the wood member 1 as shown in FIG. 1C is obtained.
表面層４の厚みは、０．０１〜１ｍｍの範囲内であることが好ましい。この範囲であれば、溝５に沿って、木質部材１を折り曲げやすくすることができる。 The thickness of the surface layer 4 is preferably in the range of 0.01 to 1 mm. Within this range, the wooden member 1 can be easily bent along the groove 5.
第一の実施形態に係る製造方法により、図２Ａのような、木質部材１が得られる。溝５の断面形状は、適宜設定され、例えば、図１Ｃのように、台形などの矩形状であってよく、図２Ａのように三角形状や、弧状であってもよい。溝５の底部６は、面状であっても、線状であってもよい。また、複数の溝５が、溝５の長手方向と直交する方向に連なることで溝５の集合体を形成していてもよい。この場合でも、図２Ｂのように、溝５の集合体に沿って、木質部材１を折り曲げることができる。なお、溝５の断面形状とは、溝５自体の長手方向に直交する断面の形状をいう。 The wooden member 1 as shown in FIG. 2A is obtained by the manufacturing method according to the first embodiment. The cross-sectional shape of the groove 5 is appropriately set, and may be, for example, a rectangular shape such as a trapezoid as shown in FIG. 1C, or may be a triangular shape or an arc shape as shown in FIG. 2A. The bottom 6 of the groove 5 may be planar or linear. The plurality of grooves 5 may be continuous in a direction orthogonal to the longitudinal direction of the grooves 5 to form an aggregate of the grooves 5. Even in this case, the wood member 1 can be bent along the aggregate of the grooves 5 as shown in FIG. 2B. In addition, the cross-sectional shape of the groove | channel 5 means the shape of the cross section orthogonal to the longitudinal direction of the groove | channel 5 itself.
図２Ｂのように、木質部材１は、溝５に沿って折り曲げられ、例えば、芯材１０のコーナー等の表面化粧材として使用される。レーザ加工により、木質部材１の溝５及びその周辺が焼けて変色することがあるが、使用時には変色した箇所は内側にあるので、外側からは見えず、外観を損なうおそれはない。
（第二の実施形態）
図３Ｃに、第二の実施形態に係る製造方法で得られた木質部材１ａの一例を示す。木質部材１ａは、第一面３１ａ及び第二面３２ａを備える板状の木質基材３ａと、第一面３１ａを覆う表面層４ａと、第二面３２ａで開口する溝５ａとを備える。木質部材１ａは、木質基材３ａと表面層４ａとの間に接着層７を備える。表面層４ａ及び接着層７は、木質基材３ａの第一面３１ａの全面に設けられていてよい。溝５ａの底部６ａでは、接着層７が露出していてもよく、底部６ａが木質基材３ａにあり接着層７に達していなくてもよい。溝５ａの深さは、木質基材３ａの厚みと同じであってもよく、木質基材３ａの厚みよりも浅くてもよい。
As shown in FIG. 2B, the wooden member 1 is bent along the groove 5 and used as a surface decorative material such as a corner of the core member 10. Although the groove 5 of the wooden member 1 and the periphery thereof may be burnt and discolored by laser processing, the discolored portion is on the inner side during use, so that it cannot be seen from the outer side and there is no possibility of damaging the appearance.
(Second embodiment)
FIG. 3C shows an example of the wooden member 1a obtained by the manufacturing method according to the second embodiment. The wooden member 1a includes a plate-like wooden base material 3a having a first surface 31a and a second surface 32a, a surface layer 4a covering the first surface 31a, and a groove 5a opened at the second surface 32a. The wooden member 1a includes an adhesive layer 7 between the wooden substrate 3a and the surface layer 4a. The surface layer 4a and the adhesive layer 7 may be provided on the entire first surface 31a of the wooden substrate 3a. At the bottom portion 6a of the groove 5a, the adhesive layer 7 may be exposed, or the bottom portion 6a does not have to reach the adhesive layer 7 on the wooden base material 3a. The depth of the groove 5a may be the same as the thickness of the wooden substrate 3a, or may be shallower than the thickness of the wooden substrate 3a.
図３Ａ〜図３Ｃに、第二の実施形態に係る製造方法の一例を示す。第二の実施形態に係る製造方法は、第一面３１ａ及び第二面３２ａを備える板状の木質基材３ａと、第一面３１ａを覆う表面層４ａとを備える板材２ａに、第二面３２ａで開口する溝５ａを形成する工程を含む。第二面３２ａにレーザを、このレーザが表面層４ａを貫通しないように照射することで、溝５ａを形成する。第二の実施形態では、板材２ａは、木質基材３ａと表面層４ａとの間に接着層７を備える。 3A to 3C show an example of the manufacturing method according to the second embodiment. In the manufacturing method according to the second embodiment, a plate-like wooden substrate 3a having a first surface 31a and a second surface 32a, and a plate material 2a having a surface layer 4a covering the first surface 31a, a second surface Forming a groove 5a opened at 32a. The groove 5a is formed by irradiating the second surface 32a with laser so that the laser does not penetrate the surface layer 4a. In 2nd embodiment, the board | plate material 2a is equipped with the contact bonding layer 7 between the wooden base material 3a and the surface layer 4a.
第二の実施形態では、まず、図３Ａのように、第一面３１ａ及び第二面３２ａを備える板状の木質基材３ａと、第一面３１ａを覆う表面層４ａと、木質基材３ａと表面層４ａとの間に接着層７とを備える板材２ａを用意する。接着層７は、木質基材３ａと表面層４ａとを接着するための層である。板材２ａは、木質基材３ａと表面層４ａとを、接着層７で接着することにより、形成することができる。 In 2nd embodiment, first, like FIG. 3A, the plate-shaped wooden base material 3a provided with the 1st surface 31a and the 2nd surface 32a, the surface layer 4a which covers the 1st surface 31a, and the wooden base material 3a A plate material 2a having an adhesive layer 7 between the surface layer 4a and the surface layer 4a is prepared. The adhesive layer 7 is a layer for adhering the wood substrate 3a and the surface layer 4a. The plate material 2a can be formed by bonding the wood base 3a and the surface layer 4a with the adhesive layer 7.
次に、図３Ｂのように、第二面３２ａにレーザを照射すると共に、第二面３２ａ上のレーザ照射位置を移動させることで、溝５ａを形成する。図３Ｂのように、レーザの照射中、表面層４ａを冷却していることが好ましい。表面層４ａを冷却する方法としては、第一の実施形態と同様の方法が挙げられ、例えば、表面層４ａに冷却プレート９ａを接触させる方法である。表面層４ａを冷却することにより、接着層７も冷却することができる。レーザ照射中に、接着層７が冷却されていることにより、接着層７の温度が上昇しにくくなることで、接着層７がよりレーザ加工されにくくなる。レーザ照射後に、冷却を停止し、図３Ｃのような木質部材１が得られる。 Next, as shown in FIG. 3B, the second surface 32a is irradiated with laser, and the laser irradiation position on the second surface 32a is moved to form the groove 5a. As shown in FIG. 3B, the surface layer 4a is preferably cooled during laser irradiation. Examples of the method for cooling the surface layer 4a include the same method as in the first embodiment. For example, the surface layer 4a is brought into contact with the cooling plate 9a. The adhesive layer 7 can also be cooled by cooling the surface layer 4a. Since the adhesive layer 7 is cooled during the laser irradiation, the temperature of the adhesive layer 7 is hardly increased, and thus the adhesive layer 7 is more difficult to be laser processed. After the laser irradiation, the cooling is stopped, and the wood member 1 as shown in FIG. 3C is obtained.
第二の実施形態では、接着層７の最小の加工エネルギーは、木質基材３ａの最小の加工エネルギーよりも大きい。また、第二の実施形態では、レーザのエネルギーは、木質基材３ａの最小の加工エネルギー以上であり、接着層７の最小の加工エネルギーよりも小さい。接着層７の最小の加工エネルギーを木質基材３よりも大きくすると共に、レーザのエネルギーを上記の範囲内にすることにより、レーザ加工を、木質基材３ａと接着層７の境界で停止させやすくなる。このため、木質基材３ａをレーザ加工すると共に、接着層７をレーザ加工しないようにすることができ、レーザが表面層４ａを貫通せずに溝５ａを形成しやすくなる。また、深さが一定の溝５ａを形成しやすくなる。 In the second embodiment, the minimum processing energy of the adhesive layer 7 is larger than the minimum processing energy of the wooden substrate 3a. Moreover, in 2nd embodiment, the energy of a laser is more than the minimum processing energy of the wooden base material 3a, and is smaller than the minimum processing energy of the contact bonding layer 7. FIG. By making the minimum processing energy of the adhesive layer 7 larger than that of the wood base material 3 and making the laser energy within the above range, laser processing can be easily stopped at the boundary between the wood base material 3 a and the adhesive layer 7. Become. For this reason, the wood substrate 3a can be laser processed and the adhesive layer 7 can be prevented from laser processing, and the laser can easily form the groove 5a without penetrating the surface layer 4a. Moreover, it becomes easy to form the groove 5a having a constant depth.
木質基材３ａの最小の加工エネルギーと接着層７の最小の加工エネルギーの差は、木質基材３ａの厚み、レーザの種類等に応じて、適宜設定される。例えば、木質基材３ａの厚みが厚いほど、木質基材３ａの最小の加工エネルギーと接着層７の最小の加工エネルギーの差は大きくすることが好ましい。また、例えば、レーザのパルス幅が長ければ長いほど、木質基材３ａの最小の加工エネルギーと接着層７の最小の加工エネルギーの差は大きくすることが好ましい。 The difference between the minimum processing energy of the wooden substrate 3a and the minimum processing energy of the adhesive layer 7 is appropriately set according to the thickness of the wooden substrate 3a, the type of laser, and the like. For example, it is preferable that the difference between the minimum processing energy of the wooden base material 3a and the minimum processing energy of the adhesive layer 7 increases as the thickness of the wooden base material 3a increases. For example, the longer the pulse width of the laser, the larger the difference between the minimum processing energy of the wooden substrate 3a and the minimum processing energy of the adhesive layer 7.
接着層７の材料としては、最小の加工エネルギーが木質基材３ａよりも大きい接着剤が挙げられる。最小の加工エネルギーが木質基材３ａよりも大きい接着剤を形成する材料としては、例えば、発火点が木質基材３ａよりも高い材料が挙げられる。発火点が木質基材３ａよりも高い材料としては、例えば、エポキシ樹脂が挙げられる。一般的に、エポキシ樹脂は、発火点が５３０〜５４０℃程度であるため、木質基材３ａよりも発火点が高い。接着層７の厚みは、例えば、０．０１〜１ｍｍの範囲内である。 Examples of the material of the adhesive layer 7 include an adhesive having a minimum processing energy larger than that of the wood substrate 3a. Examples of a material that forms an adhesive having a minimum processing energy larger than that of the wooden substrate 3a include a material having a higher ignition point than that of the wooden substrate 3a. As a material whose ignition point is higher than that of the wooden substrate 3a, for example, an epoxy resin can be cited. Generally, since an epoxy resin has an ignition point of about 530 to 540 ° C., the ignition point is higher than that of the wooden base material 3a. The thickness of the adhesive layer 7 is, for example, in the range of 0.01 to 1 mm.
第二の実施形態では、表面層４ａの最小の加工エネルギーは、木質基材３ａよりも大きく、レーザのエネルギーよりも大きいことが好ましい。これにより、もし仮に接着層７の厚みが一定でなく、薄くなっている部分があり、レーザが接着層７を貫通した場合であっても、表面層４ａを貫通せずに、溝５ａを形成しやすくなる。木質基材３ａよりも最小の加工エネルギーが大きい表面層４ａの材料としては、第一の実施形態の表面層４と同様の材料が挙げられる。
（第三の実施形態）
図４Ｃに、第三の実施形態に係る製造方法で得られた木質部材１ｂの一例を示す。木質部材１ｂは、第一面３１ｂ及び第二面３２ｂを備える板状の木質基材３ｂと、第一面３１ｂを覆う表面層４ｂと、木質基材３ｂと表面層４ｂとの間にある保護層８と、第二面３２ｂの保護層８と重なる位置で開口する溝５ｂとを有する。表面層４ｂは木質基材３ｂの第一面３１ｂの全面に設けられていてよい。溝５ｂの底部６ｂでは、保護層８が露出していてもよく、底部６ｂが木質基材３ｂにあり保護層８に達していなくてもよい。溝５ｂの深さは、木質基材３ｂの厚みと同じであってもよく、木質基材３ｂの厚みよりも浅くてもよい。
In 2nd embodiment, it is preferable that the minimum processing energy of the surface layer 4a is larger than the wooden base material 3a, and larger than the energy of a laser. Thereby, if the thickness of the adhesive layer 7 is not constant and there is a thinned portion, even if the laser penetrates the adhesive layer 7, the groove 5a is formed without penetrating the surface layer 4a. It becomes easy to do. Examples of the material of the surface layer 4a having a minimum processing energy larger than that of the wooden substrate 3a include the same materials as those of the surface layer 4 of the first embodiment.
(Third embodiment)
FIG. 4C shows an example of the wooden member 1b obtained by the manufacturing method according to the third embodiment. The wooden member 1b includes a plate-shaped wooden substrate 3b having a first surface 31b and a second surface 32b, a surface layer 4b covering the first surface 31b, and a protection between the wooden substrate 3b and the surface layer 4b. It has the layer 8 and the groove | channel 5b opened in the position which overlaps with the protective layer 8 of the 2nd surface 32b. The surface layer 4b may be provided on the entire first surface 31b of the wooden substrate 3b. At the bottom 6b of the groove 5b, the protective layer 8 may be exposed, or the bottom 6b may be on the wooden substrate 3b and not reach the protective layer 8. The depth of the groove 5b may be the same as the thickness of the wooden substrate 3b, or may be shallower than the thickness of the wooden substrate 3b.
図４Ａ〜図４Ｃに、第三の実施形態に係る製造方法の一例を示す。第三の実施形態に係る製造方法は、第一面３１ｂ及び第二面３２ｂを備える板状の木質基材３ｂと、第一面３１ｂを覆う表面層４ｂとを備える板材２ｂに、第二面３２ｂで開口する溝５ｂを形成する工程を含む。第二面３２ｂにレーザを、このレーザが表面層４ｂを貫通しないように照射することで、溝５ｂを形成する。第三の実施形態では、板材２は、木質基材３と表面層４との間に保護層８を備える。 4A to 4C show an example of the manufacturing method according to the third embodiment. In the manufacturing method according to the third embodiment, a plate-like wooden substrate 3b having a first surface 31b and a second surface 32b, and a plate material 2b having a surface layer 4b covering the first surface 31b, a second surface Forming a groove 5b opened at 32b. The groove 5b is formed by irradiating the second surface 32b with a laser so that the laser does not penetrate the surface layer 4b. In the third embodiment, the plate member 2 includes a protective layer 8 between the wooden substrate 3 and the surface layer 4.
第三の実施形態では、まず、図４Ａのように、第一面３１ｂ及び第二面３２ｂを備える板状の木質基材３ｂと、第一面３１ｂを覆う表面層４ｂと、木質基材３ｂと表面層４ｂとの間に保護層８とを備える板材２ｂを用意する。板材２ｂは、例えば、木質基材３ｂと保護層８と表面層４ｂとを接着剤で接着することにより、形成することができる。 In 3rd embodiment, first, like FIG. 4A, the plate-shaped wooden base material 3b provided with the 1st surface 31b and the 2nd surface 32b, the surface layer 4b which covers the 1st surface 31b, and the wooden base material 3b A plate material 2b having a protective layer 8 between the surface layer 4b and the surface layer 4b is prepared. The board | plate material 2b can be formed by adhere | attaching the wooden base material 3b, the protective layer 8, and the surface layer 4b with an adhesive agent, for example.
次に、図４Ｂのように、第二面３２ｂにレーザを照射すると共に、第二面３２ｂ上のレーザ照射位置を移動させることで、溝５ｂを形成する。図４Ｂのように、レーザの照射中、表面層４ｂを冷却していることが好ましい。表面層４ｂを冷却する方法としては、第一の実施形態と同様の方法が挙げられ、例えば、表面層４ｂに冷却プレート９ｂを接触させる方法である。表面層４ｂを冷却することにより、保護層８も冷却することができる。レーザ照射中に、保護層８が冷却されていることにより、保護層８の温度が上昇しにくくなり、保護層８がよりレーザ加工されにくくなる。レーザ照射後に、冷却を停止し、図４Ｃのような木質部材１が得られる。 Next, as shown in FIG. 4B, the second surface 32b is irradiated with laser, and the laser irradiation position on the second surface 32b is moved to form the groove 5b. As shown in FIG. 4B, the surface layer 4b is preferably cooled during laser irradiation. As a method for cooling the surface layer 4b, the same method as that of the first embodiment can be mentioned. For example, the cooling plate 9b is brought into contact with the surface layer 4b. The protective layer 8 can also be cooled by cooling the surface layer 4b. The cooling of the protective layer 8 during laser irradiation makes it difficult for the temperature of the protective layer 8 to rise, and the protective layer 8 becomes more difficult to be laser processed. After the laser irradiation, the cooling is stopped, and the wood member 1 as shown in FIG. 4C is obtained.
保護層８は、木質基材３ｂよりもレーザ加工されにくい層である。第三の実施形態では、保護層８の最小の加工エネルギーは、木質基材３ｂの最小の加工エネルギーよりも大きい。また、第三の実施形態では、レーザのエネルギーは、木質基材３ｂの最小の加工エネルギー以上であり、保護層８の最小の加工エネルギーよりも小さい。保護層８の最小の加工エネルギーを木質基材３ｂよりも大きくすると共に、レーザのエネルギーを上記の範囲内にすることにより、レーザ加工を、木質基材３ｂと保護層８の境界で停止させやすくなる。このため、木質基材３ｂをレーザ加工すると共に、保護層８をレーザ加工しないようにすることができ、レーザが表面層４ｂを貫通せずに溝５ｂを形成しやすくなる。また、深さが一定の溝５ｂを形成しやすくなる。 The protective layer 8 is a layer that is harder to be laser processed than the wooden substrate 3b. In the third embodiment, the minimum processing energy of the protective layer 8 is larger than the minimum processing energy of the wooden substrate 3b. In the third embodiment, the energy of the laser is equal to or higher than the minimum processing energy of the wooden substrate 3 b and is smaller than the minimum processing energy of the protective layer 8. By making the minimum processing energy of the protective layer 8 larger than that of the wooden substrate 3b and making the laser energy within the above range, laser processing can be easily stopped at the boundary between the wooden substrate 3b and the protective layer 8. Become. For this reason, the wood substrate 3b can be laser processed and the protective layer 8 can be prevented from laser processing, and the laser can easily form the groove 5b without penetrating the surface layer 4b. Moreover, it becomes easy to form the groove 5b having a constant depth.
木質基材３ｂの最小の加工エネルギーと保護層８の最小の加工エネルギーの差は、木質基材３ｂの厚み、レーザの種類等に応じて、適宜設定される。例えば、木質基材３ｂの厚みが厚いほど、木質基材３ｂの最小の加工エネルギーと保護層８の最小の加工エネルギーの差は大きくすることが好ましい。また、例えば、レーザのパルス幅が長ければ長いほど、木質基材３ｂの最小の加工エネルギーと保護層８の最小の加工エネルギーの差は大きくすることが好ましい。 The difference between the minimum processing energy of the wooden substrate 3b and the minimum processing energy of the protective layer 8 is appropriately set according to the thickness of the wooden substrate 3b, the type of laser, and the like. For example, it is preferable that the difference between the minimum processing energy of the wooden base material 3b and the minimum processing energy of the protective layer 8 increases as the thickness of the wooden base material 3b increases. For example, the longer the pulse width of the laser, the greater the difference between the minimum processing energy of the wooden substrate 3b and the minimum processing energy of the protective layer 8.
保護層８の材料は、例えば、木質基材３ｂの種類、及びレーザの種類に応じて適宜選択される。最小の加工エネルギーが木質基材３ｂよりも大きい材料としては、例えば、レーザの反射率が高い材料、及び発火点が木質基材３ｂよりも高い材料が挙げられる。レーザの反射率が高い材料としては、例えば金属が挙げられる。金属としては、例えば、銅、アルミニウム、鉄などが挙げられる。この中でも、アルミニウムがより好ましい。アルミニウムは、金属の中でもレーザの反射率が比較的高く、また、安価であるため好ましい。 The material of the protective layer 8 is appropriately selected according to, for example, the type of the wooden substrate 3b and the type of laser. Examples of the material having a minimum processing energy larger than that of the wooden substrate 3b include a material having a high laser reflectance and a material having a higher ignition point than that of the wooden substrate 3b. Examples of the material having a high laser reflectivity include metals. Examples of the metal include copper, aluminum, and iron. Among these, aluminum is more preferable. Aluminum is preferable among metals because it has a relatively high laser reflectivity and is inexpensive.
発火点が木質基材３ｂよりも高い材料としては、例えば、鉄及びアルミニウム等の金属、紙、布が挙げられる。具体的には、木質基材３ｂの材料が、発火点が２５０℃である木材である場合、保護層８としては、発火点が２５０℃よりも高い材料を選択することができる。発火点が２５０℃よりも高い材料としては、例えば、発火点４５０℃程度の模造紙や、発火点５００℃程度の木綿や、発火点３５０〜４５０℃のポリエチレン、発火点３００℃〜４４０℃のポリプロピレンが挙げられる。 Examples of the material whose ignition point is higher than that of the wooden substrate 3b include metals such as iron and aluminum, paper, and cloth. Specifically, when the material of the wooden substrate 3b is wood having an ignition point of 250 ° C., a material having an ignition point higher than 250 ° C. can be selected as the protective layer 8. Examples of materials having an ignition point higher than 250 ° C include, for example, imitation paper having an ignition point of about 450 ° C, cotton having an ignition point of about 500 ° C, polyethylene having an ignition point of 350 to 450 ° C, and an ignition point of 300 ° C to 440 ° C. A polypropylene is mentioned.
保護層８は、少なくとも溝５ｂが形成される箇所に設けられる。保護層８は、木質基材３ｂと表面層４ｂとの間において、平面視で、少なくとも溝５ｂの底部６ｂが形成される箇所と重なる位置に設けられることが好ましい。保護層８は、木質基材３ｂと表面層４ｂとの間において、第一面３１ｂ上の全体に渡って設けられていてもよい。保護層８の厚みは、０．０１〜１ｍｍの範囲内であることが好ましい。この範囲であれば、溝５ｂにおいて、木質部材１ｂを折り曲げやすくすることができる。 The protective layer 8 is provided at least where the groove 5b is formed. It is preferable that the protective layer 8 is provided between the wooden base material 3b and the surface layer 4b at a position overlapping at least a portion where the bottom portion 6b of the groove 5b is formed in a plan view. The protective layer 8 may be provided over the entire first surface 31b between the wooden substrate 3b and the surface layer 4b. The thickness of the protective layer 8 is preferably in the range of 0.01 to 1 mm. Within this range, the wood member 1b can be easily bent in the groove 5b.
第三の実施形態では、表面層４ｂの材料は、最小の加工エネルギーが木質基材３ｂよりも大きい材料であることが好ましい。これにより、もし仮に保護層８の厚みが一定でなく、薄くなっている部分があり、レーザが保護層８を貫通した場合であっても、表面層４ｂを貫通せずに、溝５ｂを形成しやすくなる。木質基材３ｂよりも最小の加工エネルギーが大きい表面層４ｂの材料としては、第一の実施形態の表面層４と同様の材料が挙げられる。 In the third embodiment, the material of the surface layer 4b is preferably a material having a minimum processing energy larger than that of the wood substrate 3b. Thereby, if the thickness of the protective layer 8 is not constant and there is a thinned portion, even if the laser penetrates the protective layer 8, the groove 5b is formed without penetrating the surface layer 4b. It becomes easy to do. Examples of the material of the surface layer 4b having a minimum processing energy larger than that of the wooden substrate 3b include the same materials as those of the surface layer 4 of the first embodiment.
第三の実施形態に係る製造方法により、図４Ｃのような木質部材１ｂが得られる。木質部材１ｂは、第一面３１ｂ及び第二面３２ｂを備える板状の木質基材３ｂと、第一面３１ｂを覆う表面層４ｂと、木質基材３ｂと表面層４ｂとの間にある保護層８と、第二面３２ｂの保護層８と重なる位置で開口する溝５ｂとを備える。保護層８の発火点は、木質基材３ｂの発火点よりも高いことが好ましい。 The wood member 1b as shown in FIG. 4C is obtained by the manufacturing method according to the third embodiment. The wooden member 1b includes a plate-shaped wooden substrate 3b having a first surface 31b and a second surface 32b, a surface layer 4b covering the first surface 31b, and a protection between the wooden substrate 3b and the surface layer 4b. The layer 8 and the groove | channel 5b opened in the position which overlaps with the protective layer 8 of the 2nd surface 32b are provided. The ignition point of the protective layer 8 is preferably higher than the ignition point of the wooden substrate 3b.
以下、本発明を実施例によって具体的に説明する。 Hereinafter, the present invention will be specifically described by way of examples.
板状の木質基材として厚み２．５ｍｍのＭＤＦ、表面層として厚み０．１ｍｍのポリエチレン（ＰＥ）を用意した。木質基材と表面層とを接着剤で接着し、板材を形成した。前記板材に対し、エネルギー２０〜５０Ｗ程度のＣＯ２レーザを照射し、溝を形成した。レーザ加工は、木質基材と表面層の境界で停止し、レーザが表面層を貫通することなく溝を形成することができた。この方法によって得られた木質部材を図５Ａ及び図５Ｂに示す。レーザ加工により、木質部材の溝及びその周辺が焼けて変色していた。 MDF with a thickness of 2.5 mm was prepared as a plate-like woody substrate, and polyethylene (PE) with a thickness of 0.1 mm was prepared as a surface layer. The wood substrate and the surface layer were bonded with an adhesive to form a plate material. The plate material was irradiated with a CO 2 laser having an energy of about 20 to 50 W to form a groove. The laser processing stopped at the boundary between the wooden substrate and the surface layer, and the grooves could be formed without the laser penetrating the surface layer. The wood member obtained by this method is shown in FIGS. 5A and 5B. Due to the laser processing, the groove of the wooden member and its periphery were burned and discolored.
１、１ａ、１ｂ 木質部材
２、２ａ、２ｂ 板材
３、３ａ、３ｂ 木質基材
４、４ａ、４ｂ 表面層
５、５ａ、５ｂ 溝
７ 接着層
８ 保護層
３１、３１ａ、３１ｂ 第一面
３２、３２ａ、３２ｂ 第二面
1, 1a, 1b Wood member 2, 2a, 2b Plate material 3, 3a, 3b Wood substrate 4, 4a, 4b Surface layer 5, 5a, 5b Groove 7 Adhesive layer 8 Protective layer 31, 31a, 31b First surface 32, 32a, 32b Second side
Claims (6)
前記第二面にレーザを、このレーザが前記表面層を貫通しないように照射することで、前記溝を形成することを特徴とする木質部材の製造方法。 A method for producing a wooden member, comprising a step of forming a groove that opens on the second surface in a plate material including a plate-shaped wooden substrate having a first surface and a second surface and a surface layer covering the first surface. Because
The method of manufacturing a wood member, wherein the groove is formed by irradiating the second surface with a laser so that the laser does not penetrate the surface layer.
前記レーザのエネルギーは、前記木質基材の最小の加工エネルギー以上であり、前記表面層の最小の加工エネルギーよりも小さいことを特徴とする請求項１に記載の木質部材の製造方法。 The minimum processing energy of the surface layer is greater than the minimum processing energy of the wooden substrate,
2. The method for manufacturing a wooden member according to claim 1, wherein the energy of the laser is equal to or higher than a minimum processing energy of the wooden base material and is smaller than a minimum processing energy of the surface layer.
前記接着層の最小の加工エネルギーは、前記木質基材の最小の加工エネルギーよりも大きく、
前記レーザのエネルギーは、前記木質基材の最小の加工エネルギー以上であり、前記接着層の最小の加工エネルギーよりも小さいことを特徴とする請求項１又は２に記載の木質部材の製造方法。 The plate material includes an adhesive layer between the wooden substrate and the surface layer,
The minimum processing energy of the adhesive layer is greater than the minimum processing energy of the wood substrate,
3. The method for manufacturing a wooden member according to claim 1, wherein the energy of the laser is equal to or greater than a minimum processing energy of the wooden base material and is smaller than a minimum processing energy of the adhesive layer.
前記第二面における前記保護層と重なる位置に、前記レーザを照射し、
前記保護層の最小の加工エネルギーは、前記木質基材の最小の加工エネルギーよりも大きく、
前記レーザのエネルギーは、前記木質基材の最小の加工エネルギー以上であり、前記保護層の最小の加工エネルギーよりも小さいことを特徴とする請求項１乃至３のいずれか一項に記載の木質部材の製造方法。 The plate material includes a protective layer between the wooden substrate and the surface layer,
Irradiating the laser to a position overlapping the protective layer on the second surface,
The minimum processing energy of the protective layer is greater than the minimum processing energy of the wooden substrate,
4. The wood member according to claim 1, wherein the energy of the laser is equal to or greater than a minimum processing energy of the wood base material and is smaller than a minimum processing energy of the protective layer. Manufacturing method.
前記保護層の発火点は、前記木質基材の発火点よりも高いことを特徴とする木質部材。 A plate-like woody substrate having a first surface and a second surface, a surface layer covering the first surface, a protective layer between the woody substrate and the surface layer, and the second surface With a groove that opens at a position overlapping the protective layer,
The wood member, wherein the ignition point of the protective layer is higher than the ignition point of the wood substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014072454A JP2015193149A (en) | 2014-03-31 | 2014-03-31 | Method of manufacturing woody member, and woody member |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014072454A JP2015193149A (en) | 2014-03-31 | 2014-03-31 | Method of manufacturing woody member, and woody member |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2015193149A true JP2015193149A (en) | 2015-11-05 |
Family
ID=54432671
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014072454A Pending JP2015193149A (en) | 2014-03-31 | 2014-03-31 | Method of manufacturing woody member, and woody member |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2015193149A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2022108382A (en) * | 2021-01-13 | 2022-07-26 | 大和ツキ板産業株式会社 | Manufacturing method for decorative material |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS583809A (en) * | 1981-06-30 | 1983-01-10 | 松下電工株式会社 | Manufacture of decorative veneer |
| JPS6048305A (en) * | 1983-08-26 | 1985-03-16 | 大建工業株式会社 | Decorative material |
| WO1991011329A1 (en) * | 1990-01-24 | 1991-08-08 | Erpe-Ernst Pelz-Vertriebs Gmbh & Co. Kg | Process for the material-removal treatment of laminated workpieces and laminate thus made |
| JPH0412834A (en) * | 1990-04-28 | 1992-01-17 | Kanzaki Paper Mfg Co Ltd | Processing method for adhesive sheet |
| US5190791A (en) * | 1990-10-19 | 1993-03-02 | Mercedes-Benz Ag | Infrared radiation process for a high contrast in the natural grain of a naturally pale wood |
| JPH1015917A (en) * | 1996-06-26 | 1998-01-20 | Marutama Sangyo Kk | Production of decorative panel for fixture material |
| WO1998048989A1 (en) * | 1997-04-30 | 1998-11-05 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Method for modifying wooden surfaces |
| JP2004525010A (en) * | 2001-05-17 | 2004-08-19 | メラー アーヒム | Method for producing a three-dimensionally bendable surface element |
| JP2011076991A (en) * | 2009-10-01 | 2011-04-14 | Seiren Co Ltd | Processing method by laser irradiation |
-
2014
- 2014-03-31 JP JP2014072454A patent/JP2015193149A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS583809A (en) * | 1981-06-30 | 1983-01-10 | 松下電工株式会社 | Manufacture of decorative veneer |
| JPS6048305A (en) * | 1983-08-26 | 1985-03-16 | 大建工業株式会社 | Decorative material |
| WO1991011329A1 (en) * | 1990-01-24 | 1991-08-08 | Erpe-Ernst Pelz-Vertriebs Gmbh & Co. Kg | Process for the material-removal treatment of laminated workpieces and laminate thus made |
| JPH0412834A (en) * | 1990-04-28 | 1992-01-17 | Kanzaki Paper Mfg Co Ltd | Processing method for adhesive sheet |
| US5190791A (en) * | 1990-10-19 | 1993-03-02 | Mercedes-Benz Ag | Infrared radiation process for a high contrast in the natural grain of a naturally pale wood |
| JPH1015917A (en) * | 1996-06-26 | 1998-01-20 | Marutama Sangyo Kk | Production of decorative panel for fixture material |
| WO1998048989A1 (en) * | 1997-04-30 | 1998-11-05 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Method for modifying wooden surfaces |
| JP2004525010A (en) * | 2001-05-17 | 2004-08-19 | メラー アーヒム | Method for producing a three-dimensionally bendable surface element |
| JP2011076991A (en) * | 2009-10-01 | 2011-04-14 | Seiren Co Ltd | Processing method by laser irradiation |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2022108382A (en) * | 2021-01-13 | 2022-07-26 | 大和ツキ板産業株式会社 | Manufacturing method for decorative material |
| JP7321539B2 (en) | 2021-01-13 | 2023-08-07 | 大和ツキ板産業株式会社 | Decorative material manufacturing method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2003334812A5 (en) | ||
| JP2006068816A5 (en) | ||
| MY147341A (en) | Laser processing method and semiconductor chip | |
| JP2008068319A5 (en) | ||
| JP2003334675A5 (en) | ||
| ES2557326T3 (en) | Procedure for manufacturing a panel, in particular a floor panel, and panel, in particular floor panel | |
| JP2015193149A (en) | Method of manufacturing woody member, and woody member | |
| JP2017124554A (en) | Wrapping decorative sheet and method | |
| JP6219487B2 (en) | Method for producing lapping decorative board | |
| JP2007320163A (en) | Decorative plate material and its manufacturing method | |
| JP7152729B2 (en) | Manufacturing method of laser processed product | |
| JP2022177314A5 (en) | Protruding corner material manufacturing method | |
| JP2009291885A (en) | Trimming die base material and its method for manufacturing | |
| JP4798052B2 (en) | Method for producing decorative veneer flooring | |
| JP5764744B2 (en) | Wood flooring | |
| JP6592412B2 (en) | Wooden board | |
| JP7186475B1 (en) | Manufacturing method of plywood for wooden patterns | |
| JP2017024301A (en) | Method of manufacturing veneer, veneer piece, veneer, and veneer decorative board | |
| JP2015010384A (en) | Wooden flooring | |
| JP2021154671A (en) | Substrate for wrapping decorative sheet and wrapping decorative sheet | |
| JP2012086523A (en) | Method of manufacturing laminate building material | |
| JPS6056320B2 (en) | Equipment cabinet and its manufacturing method | |
| JP2021154670A (en) | Substrate for wrapping decorative sheet and wrapping decorative sheet | |
| JP2007083400A (en) | Postforming processing material | |
| JP4208391B2 (en) | Manufacturing method of panel base material for floor heating |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20161207 |
|
| RD02 | Notification of acceptance of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7422 Effective date: 20170124 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20170824 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20170912 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20171113 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20180403 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20180604 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20181204 |