JP2015179067A5 - Hairspring manufacturing method and hairspring - Google Patents
Hairspring manufacturing method and hairspring Download PDFInfo
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- JP2015179067A5 JP2015179067A5 JP2015009349A JP2015009349A JP2015179067A5 JP 2015179067 A5 JP2015179067 A5 JP 2015179067A5 JP 2015009349 A JP2015009349 A JP 2015009349A JP 2015009349 A JP2015009349 A JP 2015009349A JP 2015179067 A5 JP2015179067 A5 JP 2015179067A5
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- hairspring
- crystal structure
- predetermined
- region
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000004519 manufacturing process Methods 0.000 title claims 7
- 230000001681 protective Effects 0.000 claims description 10
- 210000003135 Vibrissae Anatomy 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 5
- 238000009966 trimming Methods 0.000 claims description 4
- 238000005530 etching Methods 0.000 claims description 3
- 238000001039 wet etching Methods 0.000 claims description 2
- 238000005259 measurement Methods 0.000 claims 2
- 230000001678 irradiating Effects 0.000 claims 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005755 formation reaction Methods 0.000 description 1
Description
一部の所定領域は、ひげ玉の貫通孔を挟み接続部と対向する領域であってもよい。 Some of the predetermined area may be an area facing the connecting portion sandwiched holes beard ball.
また、レーザ照射工程の後に、ひげぜんまいをエッチング液に浸漬させてエッチングするウェットエッチング工程を設けるようにしてもよい。Further, after the laser irradiation process, a wet etching process may be provided in which the hairspring is immersed in an etching solution for etching.
また、ひげぜんまいと結晶構造の異なる保護膜を形成する保護膜形成工程と、保護膜を部分的に除去するトリミング工程と、を備えるようにしてもよい。Moreover, you may make it provide the protective film formation process which forms the protective film from which a balance spring and a crystal structure differ, and the trimming process which removes a protective film partially.
本発明のひげぜんまいは、回転軸体と嵌合するための貫通孔を有するひげ玉と、ひげ玉と接続部で接続し、貫通孔を中心にしてひげ玉に巻回されるコイル形状のぜんまい部と、を備える、所定の結晶構造を有する材料からなるひげぜんまいであって、一部の所定領域の結晶構造は、他の領域の結晶構造と異なっていることを特徴とする。The hairspring of the present invention is a hairspring having a through-hole for fitting to a rotating shaft body, a coil-shaped spring that is connected to the whiskball at a connection portion and wound around the hairball around the through-hole. And a balance spring made of a material having a predetermined crystal structure, wherein the crystal structure of some predetermined regions is different from the crystal structure of other regions.
一部の所定領域は、ひげ玉の貫通孔を挟み前記接続部と対向する領域であってもよい。A part of the predetermined region may be a region facing the connection part with the through hole of the whisker ball interposed therebetween.
一部の所定領域をひげ玉の貫通孔を中心とした角度θで表したとき、θは、180度以下であることが望ましい。When a part of the predetermined region is expressed by an angle θ with the through hole of the whisker ball as the center, θ is desirably 180 degrees or less.
さらに、角度θは、約90度であることが望ましい。Further, the angle θ is preferably about 90 degrees.
また、一部の所定領域の結晶構造が晶質であり、他の領域の結晶構造が非晶質であってもよい。Further, the crystal structure of some predetermined regions may be crystalline, and the crystal structure of other regions may be amorphous.
また、一部の所定領域の結晶構造が非晶質であり、他の領域の結晶構造が晶質であってもよい。Further, the crystal structure of some predetermined regions may be amorphous, and the crystal structure of other regions may be crystalline.
ひげぜんまいと結晶構造の異なる保護膜を、ひげぜんまいの表面に設け、保護膜が除去されたトリミング領域を有していてもよい。A protective film having a crystal structure different from that of the hairspring may be provided on the surface of the hairspring, and the trimming region from which the protective film is removed may be provided.
Claims (12)
歩度を測定する歩度測定工程と、
前記ぜんまい部の一部の所定領域にレーザを照射するレーザ照射工程と、
を有することを特徴とするひげぜんまいの製造方法。 A whisker having a through-hole for fitting with a rotating shaft body, a coil-shaped mainspring part that is connected to the whistle by a connecting part and is wound around the whisker around the through-hole. A method for manufacturing a hairspring, which is obtained by processing a material having a predetermined crystal structure,
A rate measuring process for measuring the rate;
A laser irradiation step of irradiating a predetermined region of the mainspring part with a laser;
A method of manufacturing a hairspring.
ことを特徴とする請求項1に記載のひげぜんまいの製造方法。 The special predetermined area, the manufacturing method of the hairspring as claimed in claim 1, characterized in that a region facing the connecting portion sandwiching the through hole of the beard ball.
ことを特徴とする請求項1又は2に記載のひげぜんまいの製造方法。 3. The hairspring of claim 1, wherein the laser irradiation step changes the crystal structure of the predetermined region to amorphous or crystalline based on a measurement result of the rate measurement step. Production method.
ことを特徴とする請求項1から3のいずれか1つに記載のひげぜんまいの製造方法。 The method of manufacturing a hairspring according to any one of claims 1 to 3 , further comprising a wet etching step of immersing the hairspring in a predetermined etching solution after the laser irradiation step.
前記保護膜を部分的に除去するトリミング工程と、を備える
ことを特徴とする請求項1から4のいずれか1つに記載のひげぜんまいの製造方法。 A protective film forming step of forming a protective film having a crystal structure different from that of the hairspring;
The method of manufacturing a hairspring according to any one of claims 1 to 4, further comprising a trimming step of partially removing the protective film .
一部の所定領域の結晶構造は、他の領域の結晶構造と異なっているThe crystal structure of some predetermined regions is different from the crystal structure of other regions
ことを特徴とするひげぜんまい。The hairspring is characterized by that.
ことを特徴とする請求項6に記載のひげぜんまい。The hairspring according to claim 6.
ことを特徴とする請求項7に記載のひげぜんまい。The hairspring according to claim 7.
ことを特徴とする請求項8に記載のひげぜんまい。The hairspring according to claim 8, wherein:
ことを特徴とする請求項6から9のいずれか1つに記載のひげぜんまい。The hairspring according to any one of claims 6 to 9, wherein
ことを特徴とする請求項6から9のいずれか1つに記載のひげぜんまい。The hairspring according to any one of claims 6 to 9, wherein
ことを特徴とする請求項6から11のいずれか1つに記載のひげぜんまい。The hairspring according to any one of claims 6 to 11, wherein
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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JP2015009349A JP6486697B2 (en) | 2014-02-26 | 2015-01-21 | Hairspring manufacturing method and hairspring |
Applications Claiming Priority (3)
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JP2014035230 | 2014-02-26 | ||
JP2014035230 | 2014-02-26 | ||
JP2015009349A JP6486697B2 (en) | 2014-02-26 | 2015-01-21 | Hairspring manufacturing method and hairspring |
Publications (3)
Publication Number | Publication Date |
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JP2015179067A JP2015179067A (en) | 2015-10-08 |
JP2015179067A5 true JP2015179067A5 (en) | 2018-01-11 |
JP6486697B2 JP6486697B2 (en) | 2019-03-20 |
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Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
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EP3181515A1 (en) * | 2015-12-15 | 2017-06-21 | CSEM Centre Suisse d'Electronique et de Microtechnique SA - Recherche et Développement | Composite timepiece and method for manufacturing same |
EP3181938B1 (en) * | 2015-12-18 | 2019-02-20 | CSEM Centre Suisse d'Electronique et de Microtechnique SA - Recherche et Développement | Method for manufacturing a hairspring with a predetermined stiffness by removing material |
EP3181939B1 (en) * | 2015-12-18 | 2019-02-20 | CSEM Centre Suisse d'Electronique et de Microtechnique SA - Recherche et Développement | Method for manufacturing a hairspring with predetermined stiffness by adding material |
EP3181940B2 (en) * | 2015-12-18 | 2023-07-05 | CSEM Centre Suisse d'Electronique et de Microtechnique SA - Recherche et Développement | Method for manufacturing a hairspring with a predetermined stiffness by localised removal of material |
JP6690973B2 (en) * | 2016-03-18 | 2020-04-28 | セイコーインスツル株式会社 | Precision parts manufacturing method |
JP6819285B2 (en) * | 2016-12-28 | 2021-01-27 | 工機ホールディングス株式会社 | Cutting machine |
JP6895331B2 (en) * | 2017-07-04 | 2021-06-30 | イーグル工業株式会社 | mechanical seal |
EP3543795A1 (en) | 2018-03-20 | 2019-09-25 | Patek Philippe SA Genève | Method for manufacturing silicon clock components |
EP3543796A1 (en) * | 2018-03-21 | 2019-09-25 | Nivarox-FAR S.A. | Method for manufacturing a silicon hairspring |
EP4310598A1 (en) * | 2022-07-18 | 2024-01-24 | Richemont International S.A. | Method for monitoring and manufacturing timepiece hairsprings |
Family Cites Families (7)
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CH692532A5 (en) * | 1997-10-21 | 2002-07-15 | Ebauchesfabrik Eta Ag | A method of making a balance spring for a horological movement. |
TW497015B (en) * | 2000-12-07 | 2002-08-01 | Ebauchesfabrik Eta Ag | Method for adjusting the oscillation frequency of a sprung balance for a mechanical timepiece |
EP1519250B1 (en) * | 2003-09-26 | 2010-06-30 | Asulab S.A. | Thermally compensated balance-hairspring resonator |
TWI438588B (en) * | 2006-03-24 | 2014-05-21 | Eta Sa Mft Horlogere Suisse | Micro-mechanical part made of insulating material and method of manufacturing the same |
EP2284629A1 (en) * | 2009-08-13 | 2011-02-16 | ETA SA Manufacture Horlogère Suisse | Thermocompensated mechanical resonator |
EP2597536A1 (en) * | 2011-11-25 | 2013-05-29 | CSEM Centre Suisse d'Electronique et de Microtechnique SA - Recherche et Développement | Improved spiral spring and method for manufacturing said spiral spring |
JP2013197856A (en) * | 2012-03-19 | 2013-09-30 | Seiko Instruments Inc | Piezoelectric vibration piece, piezoelectric vibrator, oscillator, electronic apparatus, and wave clock |
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