JP2015178542A - Polyimide precursor composition, method for manufacturing polyimide molded body, and polyimide molded body - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a polyimide precursor composition excellent in storage stability.SOLUTION: In the polyimide precursor composition, a resin having a repeating unit represented by the following general formula (I), an organic amine compound, and a nonionic surfactant are dissolved in a water-based solvent including water. In the general formula (I), A represents a tetravalent organic group, and B represents a divalent organic group.

Description

  The present invention relates to a polyimide precursor composition, a method for producing a polyimide molded body, and a polyimide molded body.

A polyimide resin is a material having high durability and excellent heat resistance, and is widely used for electronic materials.
As a method for producing a molded article of polyimide resin, a polyimide precursor composition obtained by dissolving a precursor polyamic acid in an aprotic polar solvent such as N-methyl-2-pyrrolidone (NMP) is formed on a substrate. A method for producing a polyimide molded body by applying, drying and imidizing by heat treatment is known (for example, see Patent Document 1).

  Also, in the production of polyimide precursor compositions, the polyimide precursor resin is polymerized in an aprotic polar solvent such as NMP, the polyimide precursor resin is taken out by reprecipitation method, and then dissolved in water by the action of an amine salt. It is also known to go through a process (see, for example, Patent Documents 2 to 5).

  Examples of the solvent for dissolving polyamic acid include NMP, dimethylacetamide (DMAc), dimethylformamide (DMF), dimethylsulfoxide (DMSO), and γ-butyrolactone (γ-BL) (for example, non-patent literature). 1).

  On the other hand, as an aprotic polar solvent, a water-soluble alcohol solvent compound and / or a water-soluble ether solvent compound is used. Specifically, in a mixed solvent of tetrahydrofuran (THF) and methanol, or THF and water. It is known that a polyimide precursor composition is obtained without precipitation by adding a tertiary amine to a reaction system in a mixed solvent (see, for example, Patent Document 6).

  It is also known to obtain a water-based polyimide precursor composition by polymerizing a polyimide precursor in water in the presence of imidazole having a specific structure as an amine compound (see, for example, Patent Document 7).

U.S. Pat. No. 4,238,528 Japanese Patent Laid-Open No. 08-120077 Japanese Patent Laid-Open No. 08-015519 JP 2003-13351 A JP 08-059832 A JP 08-157599 A JP 2012-036382 A

Journal of Polymer Science. Macromolecular Reviews, Vol.11, P164 (1976)

  The subject of this invention is providing the polyimide precursor composition excellent in the storage stability.

  In order to achieve the above object, the following invention is provided.

The invention according to claim 1
A polyimide precursor composition in which a resin having a repeating unit represented by the following general formula (I), an organic amine compound, and a nonionic surfactant are dissolved in an aqueous solvent containing water.

(In general formula (I), A represents a tetravalent organic group, and B represents a divalent organic group.)

The invention according to claim 2
The nonionic surfactant is a surfactant represented by the following general formula (II-1), the following general formula (II-2), the following general formula (II-3), and the following general formula (II-4). The polyimide precursor composition according to claim 1, which is at least one selected from the group consisting of agents.

(In General Formulas (II-1) to (II-4), R ¹ , R ² , R ³ , and R ⁴ each independently represent a substituted or unsubstituted organic group having 8 or more carbon atoms. A ³ , and ^{a 4,} .N1 shows the polysaccharide independently, n2, and n4, the .m4 showing a 1 to 10 each independently integers, indicating an integer of 1 to 5.

The invention according to claim 3
The polyimide precursor composition according to claim 1 or 2, wherein the nonionic surfactant has a molecular weight of 250 or more.

The invention according to claim 4
The polyimide precursor composition according to claim 1, wherein the organic amine compound is a tertiary amine compound.

The invention according to claim 5
The polyimide precursor composition according to any one of claims 1 to 4, wherein the resin is a resin synthesized from an aromatic tetracarboxylic dianhydride and an aromatic diamine compound.

The invention according to claim 6
The polyimide precursor composition according to claim 1, wherein the resin contains a resin having an amino group at a terminal.

The invention according to claim 7 provides:
The manufacturing method of the polyimide molded body which heat-processes and shape | molds the polyimide precursor composition of any one of Claims 1-6.

The invention according to claim 8 provides:
The polyimide molded body manufactured by the manufacturing method of the polyimide molded body of Claim 7.

According to the invention which concerns on Claim 1, 2, or 3, compared with the case where a nonionic surfactant is not included, the polyimide precursor composition excellent in storage stability is provided.
According to the invention which concerns on Claim 4, compared with the case where an organic amine compound is a primary or secondary amine compound, the polyimide precursor composition excellent in film forming property is provided.
According to the invention which concerns on Claim 5, compared with the case where a nonionic surfactant is not included, even if it applies the resin synthesize | combined using the aromatic monomer, the polyimide precursor composition excellent in storage stability Is provided.
According to the invention which concerns on Claim 6, compared with the case where it has a carboxyl group in all the terminals of resin, the polyimide precursor composition excellent in film forming property is provided.

  According to the invention concerning Claim 7 or 8, the manufacturing method of the polyimide molded body excellent in surface smoothness, or the polyimide molded body obtained by it is provided.

  Hereinafter, embodiments of the present invention will be described in detail.

<Polyimide precursor composition>
The polyimide precursor composition according to the present embodiment includes an aqueous solvent containing water, a resin having a repeating unit represented by the general formula (I) (hereinafter referred to as “specific polyimide precursor”), and an organic amine compound. And a nonionic surfactant are dissolved in the composition. That is, the specific polyimide precursor, the organic amine compound, and the nonionic surfactant are contained in the composition in a state dissolved in an aqueous solvent. In addition, melt | dissolution shows the state which the residue of melt | dissolution does not confirm visually.

  The polyimide precursor composition according to this embodiment is excellent in storage stability (hereinafter also referred to as “pot life”). The reason is not clear, but is presumed to be as follows.

  First, in the polyimide precursor composition according to the present embodiment, if the organic amine compound is dissolved in the aqueous solvent, the specific polyimide precursor (its carboxyl group) is amine-chlorinated with the amine compound. For this reason, the solubility with respect to the aqueous solvent of a specific polyimide precursor is improved, and the polyimide precursor composition containing an organic amine compound has high film forming property, and is suitable as a composition for polyimide molded object formation.

  However, the polyimide precursor composition tends to aggregate the molecular chains of the polyimide precursor and easily cause viscosity fluctuations or gelation over time. In particular, this phenomenon tends to occur when the solid content of the polyimide precursor is increased.

  In contrast, when a nonionic surfactant is dissolved together with an organic amine compound in an aqueous solvent, the nonionic surfactant loosens the specific polyimide precursor slowly by hydrogen bonding with the carboxyl group of the specific polyimide precursor. Qualify. For this reason, aggregation of molecular chains of the specific polyimide precursor is suppressed, and viscosity variation or gelation is hardly caused.

  Therefore, it is estimated that the polyimide precursor composition according to this embodiment is excellent in storage stability. Furthermore, even if the solid content of the specific polyimide precursor is increased, it is presumed that the storage stability is excellent.

  And the polyimide smooth body shape | molded using the polyimide precursor composition which concerns on this embodiment increases surface smoothness. In addition, various properties such as mechanical properties, heat resistance, electrical properties, and solvent resistance are enhanced. Moreover, since the polyimide precursor composition is excellent in storage stability, the coating performance of the polyimide precursor composition is easily maintained, and variations in the quality of the polyimide molded body are also suppressed.

  In the polyimide precursor composition according to this embodiment, the specific polyimide precursor, the organic amine compound, and the nonionic surfactant are dissolved in the aqueous solvent. Corrosion of the material is suppressed. This is presumably because the acidity of the carboxyl group of the specific polyimide precursor is suppressed by the basicity of the organic amine compound in which it coexists.

  In the polyimide precursor composition according to this embodiment, in general formula (I), a specific polyimide precursor (for example, A represents a tetravalent aromatic organic group and B represents a divalent aromatic organic group) , A resin synthesized from an aromatic tetracarboxylic dianhydride and an aromatic diamine compound) is usually difficult to dissolve in a solvent, but an aqueous solvent is applied as a solvent, and a specific polyimide is used for this. The precursor dissolves in a state salified with an organic amine compound. For this reason, even if it is a case where an aromatic polyimide precursor is applied as a specific polyimide precursor, film forming property is high and it is excellent in environmental suitability.

  In the polyimide precursor composition according to this embodiment, an aqueous solvent containing water is applied as a solvent. For this reason, the polyimide precursor composition which concerns on this embodiment is excellent in environmental suitability. Moreover, when shape | molding a polyimide molded body using the polyimide precursor composition which concerns on this embodiment, reduction of the heating temperature for solvent distillation and shortening of heating time are implement | achieved.

In the polyimide precursor composition according to the present embodiment, since an aqueous solvent containing water is applied as a solvent, an aprotic polar solvent is not included as the solvent, or the amount thereof is reduced.
The aprotic polar solvent is a solvent having a boiling point of 150 ° C. or higher and 300 ° C. or lower and a dipole moment of 3.0D or higher and 5.0D or lower. Specific examples of the aprotic polar solvent include N-methyl-2-pyrrolidone (NMP), N, N-dimethylformamide (DMF), N, N-dimethylacetamide (DMAc), dimethyl sulfoxide (DMSO), Hexamethylene phosphoramide (HMPA), N-methylcaprolactam, N-acetyl-2-pyrrolidone and the like can be mentioned.

  The aprotic polar solvent represented by N-methyl-2-pyrrolidone (NMP) has a high boiling point of 150 ° C. or higher, and the solvent in the composition remains in the molded body even after the drying step in the production of the polyimide molded body. Often remains. If this aprotic polar solvent remains in the polyimide molded body, it causes reorientation of the polymer chain of the polyimide precursor and impairs the packing properties of the polymer chain, resulting in a decrease in the mechanical strength of the resulting polyimide molded body. May cause.

On the other hand, the aprotic polar solvent is not contained in the solvent, or the amount thereof is reduced, so that the aprotic polar solvent is not contained in the obtained polyimide molded body or the amount thereof is reduced. Reduced. As a result, the polyimide molded body by the polyimide precursor composition according to the present embodiment is suppressed from lowering in mechanical strength.
And the polyimide resin molding which was excellent in various characteristics, such as heat resistance, an electrical property, and solvent resistance, in addition to mechanical strength because the solvent does not contain an aprotic polar solvent, or the quantity is reduced. Is easy to obtain.

  In the polyimide precursor composition according to the present embodiment, the specific polyimide precursor as the polyimide precursor is not a low molecular compound, and also introduces a bent chain and an aliphatic cyclic structure into the primary structure between the polymer chains. Instead of a structure that lowers the interaction force of the solvent and increases the solubility in the solvent, an aqueous solvent is applied as the solvent, and the specific polyimide precursor (its carboxyl group) is dissolved by amine conversion with an organic amine compound. Yes. For this reason, it does not cause a decrease in the mechanical strength of the polyimide molded body caused by lowering the molecular weight of the polyimide precursor seen in the method for improving solubility in the conventional polyimide precursor resin, and changing the molecular structure of the polyimide precursor The polyimide precursor is water-solubilized.

  Hereinafter, each component of the polyimide precursor composition according to the present embodiment will be described.

(Specific polyimide precursor)
The specific polyimide precursor is a resin (polyamic acid) having a repeating unit represented by the general formula (I). The imidization rate of the specific polyimide precursor is preferably 0.2 or less.

(In general formula (I), A represents a tetravalent organic group, and B represents a divalent organic group.)

Here, in the general formula (I), the tetravalent organic group represented by A is a residue obtained by removing four carboxyl groups from a tetracarboxylic dianhydride as a raw material.
On the other hand, the divalent organic group represented by B is a residue obtained by removing two amino groups from a diamine compound as a raw material.

  That is, the specific polyimide precursor having a repeating unit represented by the general formula (I) is a polymer of tetracarboxylic dianhydride and a diamine compound.

  The tetracarboxylic dianhydride includes both aromatic and aliphatic compounds, but is preferably an aromatic compound. That is, in the general formula (I), the tetravalent organic group represented by A is preferably an aromatic organic group.

  Examples of the aromatic tetracarboxylic acid include pyromellitic dianhydride, 3,3 ′, 4,4′-benzophenone tetracarboxylic dianhydride, 3,3 ′, 4,4′-biphenylsulfone tetracarboxylic acid. Acid dianhydride, 1,4,5,8-naphthalenetetracarboxylic dianhydride, 2,3,6,7-naphthalenetetracarboxylic dianhydride, 3,3 ′, 4,4′-biphenyl ether tetra Carboxylic dianhydride, 3,3 ′, 4,4′-dimethyldiphenylsilane tetracarboxylic dianhydride, 3,3 ′, 4,4′-tetraphenylsilane tetracarboxylic dianhydride, 1,2, 3,4-furantetracarboxylic dianhydride, 4,4′-bis (3,4-dicarboxyphenoxy) diphenyl sulfide dianhydride, 4,4′-bis (3,4-dicarboxyphenoxy) Diphenylsulfone dianhydride, 4,4′-bis (3,4-dicarboxyphenoxy) diphenylpropane dianhydride, 3,3 ′, 4,4′-perfluoroisopropylidenediphthalic dianhydride, 3, 3 ', 4,4'-biphenyltetracarboxylic dianhydride, 2,3,3', 4'-biphenyltetracarboxylic dianhydride, bis (phthalic acid) phenylphosphine oxide dianhydride, p-phenylene- Bis (triphenylphthalic acid) dianhydride, m-phenylene-bis (triphenylphthalic acid) dianhydride, bis (triphenylphthalic acid) -4,4′-diphenyl ether dianhydride, bis (triphenylphthalic acid) ) -4,4′-diphenylmethane dianhydride and the like.

  Examples of the aliphatic tetracarboxylic dianhydride include butanetetracarboxylic dianhydride, 1,2,3,4-cyclobutanetetracarboxylic dianhydride, 1,3-dimethyl-1,2,3,4. -Cyclobutanetetracarboxylic acid, 1,2,3,4-cyclopentanetetracarboxylic dianhydride, 2,3,5-tricarboxycyclopentylacetic acid dianhydride, 3,5,6-tricarboxynorbonane-2- Acetic dianhydride, 2,3,4,5-tetrahydrofurantetracarboxylic dianhydride, 5- (2,5-dioxotetrahydrofural) -3-methyl-3-cyclohexene-1,2-dicarboxylic dianhydride Products, aliphatic or alicyclic tetracarboxylic dianhydrides such as bicyclo [2,2,2] -oct-7-ene-2,3,5,6-tetracarboxylic dianhydride; a, 4,5,9b-Hexahydro-2,5-dioxo-3-furanyl) -naphtho [1,2-c] furan-1,3-dione, 1,3,3a, 4,5,9b-hexahydro -5-methyl-5- (tetrahydro-2,5-dioxo-3-furanyl) -naphtho [1,2-c] furan-1,3-dione, 1,3,3a, 4,5,9b-hexahydro Aliphatic tetracarboxylic dianhydrides having an aromatic ring such as -8-methyl-5- (tetrahydro-2,5-dioxo-3-furanyl) -naphtho [1,2-c] furan-1,3-dione Etc.

  Among these, the tetracarboxylic dianhydride is preferably an aromatic tetracarboxylic dianhydride, specifically, for example, pyromellitic dianhydride, 3,3 ′, 4,4′-biphenyl. Tetracarboxylic dianhydride, 2,3,3 ′, 4′-biphenyltetracarboxylic dianhydride, 3,3 ′, 4,4′-biphenyl ether tetracarboxylic dianhydride, 3,3 ′, 4 , 4′-benzophenonetetracarboxylic dianhydride is preferable, and pyromellitic dianhydride, 3,3 ′, 4,4′-biphenyltetracarboxylic dianhydride, 3,3 ′, 4,4 ′ -Benzophenone tetracarboxylic dianhydride is good, especially 3,3 ', 4,4'-biphenyltetracarboxylic dianhydride.

In addition, tetracarboxylic dianhydride may be used individually by 1 type, and may be used together in combination of 2 or more types.
Moreover, when using together and using 2 or more types, you may use together aromatic tetracarboxylic acid or aliphatic tetracarboxylic acid, respectively, or may combine aromatic tetracarboxylic acid and aliphatic tetracarboxylic acid.

  On the other hand, a diamine compound is a diamine compound having two amino groups in the molecular structure. Examples of diamine compounds include aromatic and aliphatic compounds, but aromatic compounds are preferred. That is, in the general formula (I), the divalent organic group represented by B is preferably an aromatic organic group.

Examples of the diamine compound include p-phenylenediamine, m-phenylenediamine, 4,4′-diaminodiphenylmethane, 4,4′-diaminodiphenylethane, 4,4′-diaminodiphenyl ether, 4,4′-diaminodiphenyl sulfide. 4,4′-diaminodiphenylsulfone, 1,5-diaminonaphthalene, 3,3-dimethyl-4,4′-diaminobiphenyl, 5-amino-1- (4′-aminophenyl) -1,3,3 -Trimethylindane, 6-amino-1- (4'-aminophenyl) -1,3,3-trimethylindane, 4,4'-diaminobenzanilide, 3,5-diamino-3'-trifluoromethylbenzanilide 3,5-diamino-4′-trifluoromethylbenzanilide, 3,4′-diaminodiphenyl ether, , 7-diaminofluorene, 2,2-bis (4-aminophenyl) hexafluoropropane, 4,4′-methylene-bis (2-chloroaniline), 2,2 ′, 5,5′-tetrachloro-4 , 4'-diaminobiphenyl, 2,2'-dichloro-4,4'-diamino-5,5'-dimethoxybiphenyl, 3,3'-dimethoxy-4,4'-diaminobiphenyl, 4,4'-diamino -2,2'-bis (trifluoromethyl) biphenyl, 2,2-bis [4- (4-aminophenoxy) phenyl] propane, 2,2-bis [4- (4-aminophenoxy) phenyl] hexafluoro Propane, 1,4-bis (4-aminophenoxy) benzene, 4,4′-bis (4-aminophenoxy) -biphenyl, 1,3′-bis (4-aminophenoxy) benzene, 9,9-bi (4-aminophenyl) fluorene, 4,4 ′-(p-phenyleneisopropylidene) bisaniline, 4,4 ′-(m-phenyleneisopropylidene) bisaniline, 2,2′-bis [4- (4-amino- Aromatic diamines such as 2-trifluoromethylphenoxy) phenyl] hexafluoropropane, 4,4′-bis [4- (4-amino-2-trifluoromethyl) phenoxy] -octafluorobiphenyl; diaminotetraphenylthiophene, etc. An aromatic diamine having two amino groups bonded to the aromatic ring and a hetero atom other than the nitrogen atom of the amino group; 1,1-metaxylylenediamine, 1,3-propanediamine, tetramethylenediamine, penta Methylenediamine, octamethylenediamine, nonamethylenediamine, 4,4-diaminohe Data diamine, 1,4-diaminocyclohexane, isophorone diamine, tetrahydrodicyclopentadiene cyclopentadienylide diamine, hexahydro-4,7-meth Noin mite range diamine, tricyclo [6,2,1,0 ^2.7] Examples thereof include aliphatic diamines such as undecylenedimethyl diamine and 4,4′-methylene bis (cyclohexylamine), and alicyclic diamines.

  Among these, as the diamine compound, an aromatic diamine compound is good, and specifically, for example, p-phenylenediamine, m-phenylenediamine, 4,4′-diaminodiphenylmethane, 4,4′-diaminodiphenyl ether, 3,4′-diaminodiphenyl ether, 4,4′-diaminodiphenyl sulfide, and 4,4′-diaminodiphenyl sulfone are preferable, and 4,4′-diaminodiphenyl ether and p-phenylenediamine are particularly preferable.

  In addition, a diamine compound may be used individually by 1 type, and may be used together in combination of 2 or more types. Moreover, when using together and using 2 or more types, you may use together an aromatic diamine compound or an aliphatic diamine compound, respectively, or may combine an aromatic diamine compound and an aliphatic diamine compound.

The specific polyimide precursor may be a resin having an imidization rate of 0.2 or less. That is, the specific polyimide precursor may be a resin partially imidized.
Specifically, examples of the specific polyimide precursor include a resin having a repeating unit represented by General Formula (I-1), General Formula (I-2), and General Formula (I-3).

In General Formula (I-1), General Formula (I-2), and General Formula (I-3), A represents a tetravalent organic group, and B represents a divalent organic group. In addition, A and B are synonymous with A and B in general formula (I).
l represents an integer of 1 or more, m and n each independently represents 0 or an integer of 1 or more, and satisfies the relationship of (2n + m) / (2l + 2m + 2n) ≦ 0.2.

In general formulas (I-1) to (I-3), l represents an integer of 1 or more, preferably an integer of 1 to 200, more preferably an integer of 1 to 100. m and n each independently represents an integer of 0 or 1 or more, but preferably each independently represents 0 or an integer of 1 to 200, more preferably 0 or an integer of 1 to 100.
L, m, and n satisfy the relationship of (2n + m) / (2l + 2m + 2n) ≦ 0.2, preferably (2n + m) / (2l + 2m + 2n) ≦ 0.15, more preferably (2n + m) / ( 2l + 2m + 2n) ≦ 0.10.

Here, “(2n + m) / (2l + 2m + 2n)” is the total number of bonding parts (2n + m) in which the imide ring is closed in the bonding part of the specific polyimide precursor (reaction part of tetracarboxylic dianhydride and diamine compound). The ratio to the number of coupled parts (2l + 2m + 2n) is shown. That is, “(2n + m) / (2l + 2m + 2n)” represents the imidization ratio of the specific polyimide precursor.
The specific polyimide precursor is specified by setting the imidization ratio (value of “(2n + m) / (2l + 2m + 2n)”) to 0.2 or less (preferably 0.15 or less, more preferably 0.10 or less). Inducing gelation and precipitation separation of the polyimide precursor is suppressed.

  The imidation ratio (value of “(2n + m) / (2l + 2m + 2n)”) of the specific polyimide precursor is measured by the following method.

-Measurement of imidization rate of polyimide precursor-
-Preparation of polyimide precursor sample (i) A polyimide precursor composition to be measured is applied on a silicone wafer in a film thickness range of 1 µm to 10 µm to prepare a coating film sample.
(Ii) The coating film sample is immersed in tetrahydrofuran (THF) for 20 minutes to replace the solvent in the coating film sample with tetrahydrofuran (THF). The solvent to be immersed is not limited to THF, and can be selected from solvents that do not dissolve the polyimide precursor and are miscible with the solvent component contained in the polyimide precursor composition. Specifically, alcohol solvents such as methanol and ethanol, and ether compounds such as dioxane can be used.
(Iii) A coating film sample is taken out from THF, N2 gas is sprayed and removed to THF adhering to the coating film sample surface. Under a reduced pressure of 10 mmHg or less, the film sample is dried for 12 hours or more in the range of 5 ° C. or more and 25 ° C. or less to prepare a polyimide precursor sample.

-Preparation of 100% imidized standard sample (iv) Similarly to the above (i), a polyimide precursor composition to be measured is applied on a silicone wafer to prepare a coating film sample.
(V) The coating film sample is heated at 380 ° C. for 60 minutes to carry out an imidization reaction to produce a 100% imidized standard sample.

Measurement and analysis (Measurement example and analysis example of polyimide precursor sample consisting of 4,4′-diaminodiphenyl ether and 3,3 ′, 4,4′-biphenyltetracarboxylic dianhydride)
(Vi) Using a Fourier transform infrared spectrophotometer (FT-730, manufactured by Horiba, Ltd.), infrared absorption spectra of a 100% imidized standard sample and a polyimide precursor sample are measured. Aromatic ring-derived absorption peak near 1500 cm ^-1 and 100% imidization standard sample (Ab ratio 'for (1500cm ^-1)), absorption peaks derived from an imide bond in the vicinity of ^{1780cm -1 (Ab' (1780cm -1} )) I '(100) is obtained.
In the same manner (vii), was measured for the polyimide precursor sample, relative to the aromatic ring derived absorption peak near ^{1500cm -1 (Ab (1500cm-1} )), absorption peaks derived from imide bond near 1780 cm ^-1 (Ab ( 1780 cm ⁻¹ )) ratio I (x) is determined.

And the imidation rate of a polyimide precursor is computed based on the following formula using each measured absorption peak I '(100) and I (x).
Formula: Imidation ratio of polyimide precursor = I (x) / I ′ (100)
Formula: I ′ (100) = (Ab ′ (1780 cm ⁻¹ )) / (Ab ′ (1500 cm ⁻¹ ))
Formula: I (x) = (Ab (1780 cm ⁻¹ )) / (Ab (1500 cm ⁻¹ ))

  In addition, the measurement of the imidation rate of this polyimide precursor is applied to the measurement of the imidation rate of an aromatic polyimide precursor. When measuring the imidation ratio of the aliphatic polyimide precursor, a peak derived from a structure having no change before and after the imidation reaction is used as an internal standard peak instead of the absorption peak of the aromatic ring.

-Terminal amino group of polyimide precursor-
The specific polyimide precursor may include a polyimide precursor (resin) having an amino group at a terminal, preferably a polyimide precursor having an amino group at all terminals.
In order to give an amino group to the molecular terminal of the polyimide precursor, for example, it is realized by adding the molar equivalent of the diamine compound used in the polymerization reaction in excess of the molar equivalent of tetracarboxylic dianhydride. . The molar equivalent ratio between the diamine compound and the tetracarboxylic dianhydride is preferably in the range of 1.0001 or more and 1.2 or less, more preferably 1 in terms of the molar equivalent of the tetracarboxylic acid. The range is from 0.001 to 1.2.
If the molar equivalent ratio of the diamine compound to tetracarboxylic dianhydride is 1.0001 or more, the effect of the amino group at the molecular end is great, and good dispersibility is obtained. If the molar equivalent ratio is 1.2 or less, the molecular weight of the obtained polyimide precursor is large. For example, when a film-like polyimide molded body is obtained, sufficient film strength (tear strength, tensile strength) is obtained. It is easy to obtain.

  The terminal amino group of a specific polyimide precursor is detected by making trifluoroacetic anhydride (react quantitatively with respect to an amino group) act on a polyimide precursor composition. That is, the terminal amino group of the specific polyimide precursor is amidated with trifluoroacetic acid. After the treatment, the specific polyimide precursor is purified by reprecipitation or the like to remove excess trifluoroacetic anhydride and trifluoroacetic acid residue. About the specific polyimide precursor after a process, the amount of terminal amino groups of a specific polyimide precursor is measured by quantifying with a nuclear magnetic resonance (NMR) method.

The number average molecular weight of the specific polyimide precursor may be from 1,000 to 100,000, more preferably from 5,000 to 50,000, and still more preferably from 10,000 to 30,000.
When the number average molecular weight of the specific polyimide precursor is within the above range, a decrease in the solubility of the specific polyimide precursor in the solvent is suppressed, and film forming properties are easily secured. In particular, when a specific polyimide precursor containing a resin having an amino group at the terminal is applied, if the molecular weight is low, the abundance of terminal amino groups is increased and affected by the coexisting organic amine compound in the polyimide precursor composition. Although the solubility tends to decrease, the decrease in solubility can be suppressed by setting the range of the number average molecular weight of the specific polyimide precursor within the above range.
In addition, the specific polyimide precursor of the target number average molecular weight is obtained by adjusting the molar equivalent ratio of a tetracarboxylic dianhydride and a diamine compound.

The number average molecular weight of the specific polyimide precursor is measured by gel permeation chromatography (GPC) method under the following measurement conditions.
Column: Tosoh TSKgel α-M (7.8 mm ID × 30 cm)
Eluent: DMF (dimethylformamide) / 30 mM LiBr / 60 mM phosphoric acidFlow rate: 0.6 mL / min
・ Injection volume: 60 μL
・ Detector: RI (differential refractive index detector)

  The content (concentration) of the specific polyimide precursor may be 0.1% by mass or more and 40% by mass or less, preferably 0.5% by mass or more and 25% by mass or less, based on the total polyimide precursor composition. More preferably, it is 1 mass% or more and 20 mass% or less.

(Organic amine compound)
An organic amine compound is a compound that functions as an imidization accelerator while amine-chlorinating a specific polyimide precursor (its carboxyl group) to increase its solubility in a solvent.
The organic amine compound is preferably a water-soluble compound. Here, water-soluble means that the target substance dissolves 1% by mass or more in water at 25 ° C.

Examples of organic amine compounds include primary amine compounds, secondary amine compounds, and tertiary amine compounds.
Among these, as the organic amine compound, at least one selected from a secondary amine compound and a tertiary amine compound (particularly a tertiary amine compound) is preferable. When a tertiary amine compound or a secondary amine compound is applied as the organic amine compound (particularly a tertiary amine compound), the solubility of the specific polyimide precursor in the solvent is likely to be increased, and the film forming property is easily improved. The storage stability of the polyimide precursor composition is likely to be improved.

  Moreover, as an organic amine compound, the polyvalent amine compound more than bivalence other than a monovalent amine compound is also mentioned. When a polyvalent amine compound having two or more valences is applied, a pseudo-crosslinked structure is easily formed between molecules of the specific polyimide precursor, and the storage stability of the polyimide precursor composition is easily improved.

Examples of the primary amine compound include methylamine, ethylamine, n-propylamine, isopropylamine, 2-ethanolamine, 2-amino-2-methyl-1-propanol, and the like.
Examples of the secondary amine compound include dimethylamine, 2- (methylamino) ethanol, 2- (ethylamino) ethanol, morpholine, and the like.
Examples of the tertiary amine compound include 2-dimethylaminoethanol, 2-diethylaminoethanol, 2-dimethylaminopropanol, triethylamine, picoline, methylmorpholine, and ethylmorpholine.

  Examples of the polyvalent amine compound include isoquinolines (amine compounds having an isoquinoline skeleton), pyridines (amine compounds having a pyridine skeleton), pyrimidines (amine compounds having a pyrimidine skeleton), and pyrazines (amines having a pyrazine skeleton). Compound), piperazines (amine compounds having a piperazine skeleton), triazines (amine compounds having a triazine skeleton), imidazoles (amine compounds having an imidazole skeleton), polyaniline, polypyridine, polyamine and the like.

  Among these, the organic amine compound is preferably a compound having a boiling point of 60 ° C. or higher (preferably 60 ° C. or higher and 200 ° C. or lower, more preferably 70 ° C. or higher and 150 ° C. or lower). When the boiling point of the organic amine compound is 60 ° C. or higher, the organic amine compound is prevented from volatilizing from the polyimide precursor composition during storage, and the decrease in the solubility of the specific polyimide precursor in the solvent is easily suppressed.

The organic amine compound may be contained in an amount of 50 mol% to 500 mol%, preferably 80 mol% to 250 mol%, more preferably 100 mol, based on the carboxyl group contained in the specific polyimide precursor. % Or more and 200 mol% or less.
When the content of the organic amine compound is within the above range, the solubility of the specific polyimide precursor in the solvent is likely to increase, and the film forming property is easily improved. Moreover, it becomes easy to improve the storage stability of the polyimide precursor composition.

(Nonionic surfactant)
A nonionic surfactant is a compound which does not show ionicity even when dissolved in a solvent and has surface activity.
Nonionic surfactants include, for example, polyoxyalkylene alkyl ether, polyoxyalkylene alkenyl ether, polyoxyalkylene alkyl phenyl ether, polyoxyalkylene alkenyl phenyl ether, fatty acid ester, fatty acid diester, polyoxyalkylene fatty acid ester, polyoxy Well-known surfactants such as alkylene fatty acid diesters, sugar esters, polyalkylene adducts of sugar esters, alkanolamides and the like can be mentioned.

  As the nonionic surfactant, from the viewpoint of storage stability, in particular, the following general formula (II-1), the following general formula (II-2), the following general formula (II-3), and the following general formula (II) And at least one selected from the group consisting of surfactants represented by -4).

In general formulas (II-1) to (II-4), R ¹ , R ² , R ³ , and R ⁴ each independently represent a substituted or unsubstituted organic group having 8 or more carbon atoms. A ³ and A ⁴ each independently represent a polysaccharide. n1, n2, and n4 each independently represent an integer of 1 or more and 10 or less. m4 represents an integer of 1 to 5.

In general formula (II), examples of the organic group represented by R ¹ , R ² , R ³ , and R ⁴ include a substituted or unsubstituted alkyl group having 8 to 22 carbon atoms, and 8 to 22 carbon atoms. A substituted or unsubstituted alkenyl group, a substituted or unsubstituted alkylphenyl group having 8 to 22 carbon atoms, a substituted or unsubstituted alkenylphenyl group having 8 to 22 carbon atoms, a substituted or unsubstituted group having 8 to 22 carbon atoms And substituted aryl groups.

As an unsubstituted alkyl group having 8 to 22 carbon atoms, an alkyl group having 10 to 22 carbon atoms is preferable, and an alkyl group having 12 to 22 carbon atoms is more preferable. The unsubstituted alkyl group having 8 to 22 carbon atoms may be linear, branched or cyclic, preferably linear or branched, and more preferably linear.
As an unsubstituted alkenyl group having 8 to 22 carbon atoms, an alkenyl group having 10 to 22 carbon atoms is preferable, and an alkenyl group having 12 to 22 carbon atoms is more preferable. The alkenyl group may be a group having one or two double bonds in a carbon-carbon bond. The alkenyl group may be linear, branched, or cyclic, and is preferably linear or branched, more preferably linear.
In addition, as a substituent substituted by an alkyl group and an alkenyl group, an aryl group (for example, phenyl group etc.) etc. are mentioned, for example.

The substituted or unsubstituted alkylphenyl group having 8 to 22 carbon atoms is preferably a phenyl group substituted with a substituted or unsubstituted alkyl group having 10 to 22 carbon atoms (preferably 12 to 22 carbon atoms).
The unsubstituted alkenylphenyl group having 8 to 22 carbon atoms is preferably a phenyl group substituted with a substituted or unsubstituted alkenyl group having 10 to 22 carbon atoms (preferably 12 to 22 carbon atoms).
The alkyl group and alkenyl group substituted on the phenyl group may be linear, branched or cyclic, preferably linear or branched, and more preferably linear. Further, the unsubstituted alkenyl group is preferably a group having one or two double bonds in a carbon-carbon bond.
In addition, as an alkyl group substituted by a phenyl group, and a substituent substituted by an alkenyl group, an aryl group (for example, phenyl group etc.) etc. are mentioned, for example.

In the general formulas (II-1) to (II-4), examples of the polysaccharide represented by A ³ and A ⁴ include glycerin, polyglycerin, sorbitol, sorbitol, sorbitan, and sucrose. Among these, sorbitan is preferable as the polysaccharide.

In general formulas (II-1) to (II-4), n1, n2, and n4 each preferably represent an integer of 1 to 10, and preferably an integer of 1 to 10.
m4 preferably represents an integer of 1 to 5, and preferably an integer of 1 to 3.

In particular, as the surfactant represented by the general formula (II-1), R ¹ is a substituted or unsubstituted alkyl group having 8 to 22 carbon atoms, or a substituted or unsubstituted alkenyl group having 8 to 22 carbon atoms. It is preferable that it is surfactant which shows group and n1 shows the integer of 1-10.

As the surfactant represented by the general formula (II-2), R ² is a substituted or unsubstituted alkyl group having 8 to 22 carbon atoms, and a substituted or unsubstituted alkenyl group having 8 to 22 carbon atoms. N2 is preferably a surfactant exhibiting an integer of 1 or more and 10 or less.

As the surfactant represented by the general formula (II-3), R ³ is a substituted or unsubstituted alkyl group having 8 to 22 carbon atoms, or a substituted or unsubstituted alkenyl group having 8 to 22 carbon atoms. indicated, it is preferred that a ³ is sorbitol, or a surfactant showing a sorbitan.

As the surfactant represented by the general formula (II-4), R ⁴ is a substituted or unsubstituted alkyl group having 8 to 22 carbon atoms, and a substituted or unsubstituted alkenyl group having 8 to 22 carbon atoms. shown, a ⁴ represents sorbitol or sorbitan, n4 represents 1 to 10, it is preferable m4 is a surfactant represents an integer of 3.

Specific examples of the surfactant represented by the general formula (II-1) include, for example, polyoxyethylene oleyl ether, polyoxyethylene lauryl ether, polyoxyethylene cetyl ether, polyoxyethylene stearyl ether, and polyoxyethylene octyl. Examples include dodecyl ether, polyoxyethylene myristol ether, polyoxyethylene tribenzyl phenyl ether, polyoxyethylene distyrenated phenyl ether, and the like.
Specific examples of the surfactant represented by the general formula (II-2) include polyethylene glycol monooleate, polyethylene glycol monolaurate, polyethylene glycol monostearate, and polyethylene glycol distearate.
Specific examples of the surfactant represented by the general formula (II-3) include, for example, sorbitan monooleate, sorbitan monolaurate, sorbitan monopalmitate, sorbitan monostearate, sorbitan distearate, sorbitan sesquiole. Eate.
Specific examples of the surfactant represented by the general formula (II-4) include, for example, polyoxyethylene sorbitan monolaurate, polyoxyethylene sorbitan monostearate, polyoxyethylene sorbitan tristearate, polyoxyethylene sorbitan. Examples include monooleate and polyoxyethylene triisostearate.
However, specific examples of the surfactant are not limited thereto.

  From the viewpoint of storage stability, the molecular weight of the nonionic surfactant is preferably 250 or more, more preferably 300 or more, and still more preferably 400 or more. However, when the nonionic surfactant is a low molecular compound, the molecular weight of the nonionic surfactant is preferably 500 or less. On the other hand, when the nonionic surfactant is a polymer compound, the molecular weight of the nonionic surfactant is preferably 1000 or less.

The molecular weight of the nonionic surfactant is a weight average molecular weight. The measuring method of a weight average molecular weight is as follows.
The weight average molecular weight of the nonionic surfactant is measured by a gel permeation chromatography (GPC) method under the following measurement conditions.
Column: Tosoh TSKgel α-M (7.8 mm ID × 30 cm)
Eluent: CH ₃ CN / water = 50/50
・ Flow rate: 0.5mL / min
・ Injection volume: 10 μl
・ Detector: RI (suggested refractive index detector)

The nonionic surfactant may be contained in an amount of 0.0001% by mass to 0.5% by mass, preferably 0.001% by mass to 0.1% by mass, based on the entire polyimide precursor composition. More preferably, the content is 0.005% by mass or more and 0.05% by mass or less.
When the content of the nonionic surfactant is within the above range, the storage stability is easily increased.

  Here, the ratio between the organic amine compound and the nonionic surfactant (mass ratio: organic amine compound / nonionic surfactant) is 2/1 or more and 30 / from the point of storage stability of the polyimide precursor composition. It may be 1 or less, preferably 5/1 or more and 25/1 or less, more preferably 10/1 or more and 20/1 or less.

(Aqueous solvent)
The aqueous solvent is an aqueous solvent containing water. The aqueous solvent preferably contains at least 70% by mass of water. Examples of water include distilled water, ion exchange water, ultrafiltration water, and pure water.

  Water is contained in an aqueous solvent in an amount of 70 to 100% by mass, preferably 80 to 100% by mass, more preferably 90 to 100% by mass, and includes a solvent other than water. It is particularly preferred not to.

In addition, when a solvent other than water is contained as the aqueous solvent, for example, a water-soluble organic solvent is preferably used.
Examples of the water-soluble organic solvent include a water-soluble ether solvent, a water-soluble ketone solvent, a water-soluble alcohol solvent, and the like. Here, water-soluble means that the target substance dissolves 1% by mass or more in water at 25 ° C.

  The water-soluble organic solvent may be used alone, but when two or more are used in combination, for example, a combination of a water-soluble ether solvent and a water-soluble alcohol solvent, a water-soluble ketone solvent and a water-soluble alcohol A combination with a solvent, a combination of a water-soluble ether solvent, a water-soluble ketone solvent and a water-soluble alcohol solvent may be mentioned.

  The water-soluble ether solvent is a water-soluble solvent having an ether bond in one molecule. Examples of the water-soluble ether solvent include tetrahydrofuran (THF), dioxane, trioxane, 1,2 dimethoxyethane, diethylene glycol dimethyl ether, diethylene glycol diethyl ether, and the like. Among these, tetrahydrofuran and dioxane are preferable as the water-soluble ether solvent.

  The water-soluble ketone solvent is a water-soluble solvent having a ketone group in one molecule. Examples of the water-soluble ketone solvent include acetone, methyl ethyl ketone, and cyclohexanone. Among these, acetone is preferable as the water-soluble ketone solvent.

  The water-soluble alcohol solvent is a water-soluble solvent having an alcoholic hydroxyl group in one molecule. Examples of the water-soluble alcohol solvent include methanol, ethanol, 1-propanol, 2-propanol, tert-butyl alcohol, ethylene glycol, 1,2-propanediol, 1,3-propanediol, 1,3-butanediol, 1,4-butanediol, 2,3-butanediol, 1,5-pentanediol, 2-butene-1,4-diol, 2-methyl-2,4-pentanediol, glycerin, 2-ethyl-2- Examples include hydroxymethyl-1,3-propanediol and 1,2,6-hexanetriol. Among these, methanol, ethanol, 2-propanol, and ethylene glycol are preferable as the water-soluble alcohol solvent.

  When a solvent other than water is contained as the aqueous solvent, the solvent used in combination may have a boiling point of 160 ° C. or lower, preferably 40 ° C. or higher and 150 ° C. or lower, more preferably 50 ° C. or higher and 120 ° C. or lower. When the boiling point of the solvent used in combination is in the above range, the solvent hardly remains in the polyimide molded body, and a polyimide molded body having high mechanical strength is easily obtained.

  Here, the range in which the specific polyimide precursor is dissolved in the solvent is controlled by the water content, the type and amount of the organic amine compound. In a range where the water content is low, the specific polyimide precursor is easily dissolved in a region where the addition amount of the organic amine compound is small. On the other hand, in a range where the water content is high, the specific polyimide precursor is easily dissolved in a region where the amount of the organic amine compound added is large. In addition, when the organic amine compound includes a hydroxyl group and has high hydrophilicity, the specific polyimide precursor is easily dissolved in a region having a high water content.

(Other additives)
The polyimide precursor composition according to the present embodiment may contain various fillers for the purpose of imparting various functions such as conductivity and mechanical strength to a polyimide molded body produced using the polyimide precursor composition. In addition, a catalyst for promoting imidization reaction, a leveling material for improving film forming quality, and the like may be included.

Examples of the conductive material added to impart conductivity include conductivity (for example, volume resistivity of less than 10 ⁷ Ω · cm, the same shall apply hereinafter) or semi-conductivity (for example, volume resistivity of 10 ⁷ Ω · cm to 10 ¹³ Ω). -Cm or less, the same applies hereinafter), and is selected according to the purpose of use.
Examples of the conductive agent include carbon black (for example, acidic carbon black having a pH of 5.0 or less), metal (for example, aluminum or nickel), metal oxide (for example, yttrium oxide, tin oxide, etc.), ion conductive material (for example, titanium). Potassium oxide, LiCl, etc.), conductive polymers (eg, polyaniline, polypyrrole, polysulfone, polyacetylene, etc.).
These conductive materials may be used alone or in combination of two or more.
In the case where the conductive material is in the form of particles, the primary particle diameter is less than 10 μm, preferably 1 μm or less.

  Examples of the filler added for improving the mechanical strength include particulate materials such as silica powder, alumina powder, barium sulfate powder, titanium oxide powder, mica and talc. In addition, in order to improve the water repellency and releasability of the surface of the polyimide molded body, a fluororesin powder such as polytetrafluoroethylene (PTFE) or tetrafluoroethylene perfluoroalkyl vinyl ether copolymer (PFA) is added. Also good.

  As the catalyst for promoting the imidization reaction, a dehydrating agent such as an acid anhydride, an acid catalyst such as a phenol derivative, a sulfonic acid derivative, or a benzoic acid derivative may be used.

  What is necessary is just to select content of another additive according to the intended purpose of the polyimide molded body to manufacture.

<Method for producing polyimide precursor composition>
Although it does not specifically limit as a manufacturing method of the polyimide precursor composition which concerns on this embodiment, The manufacturing method shown to following (1) or (2) is mentioned. In addition, a nonionic surfactant is added in the process of the manufacturing method shown to the following (1) or (2).

(1): A step of polymerizing tetracarboxylic dianhydride and a diamine compound in an aqueous solvent containing water to form a resin (hereinafter referred to as “polyimide precursor”) (hereinafter referred to as “polymerization step”). And a step of adding an organic amine compound to the aqueous solvent in which the resin is formed (hereinafter referred to as “amine chlorination step”) after the resin is formed.
In addition, in the manufacturing method shown to (1), you may have the process (henceforth a "solvent replacement process") which substitutes a solvent or changes a solvent composition after a superposition | polymerization process as needed.

  In the production method shown in (1), after a polyimide precursor is produced in an aqueous solvent containing water, an organic amine compound is added to the solvent, and amine chloride of the polyimide precursor (its carboxyl group) is performed.

  In the production method shown in (1), since the organic amine compound is added after the polyimide precursor is generated (the organic amine compound is not added in the polymerization step), the production of the polyimide precursor by the organic amine compound is inhibited (in the polymerization reaction). Inhibition) is suppressed.

  Here, in the production method shown in (1), the nonionic surfactant is added to the composition during any of the polymerization step, the amine chlorination step, and the solvent substitution step. Moreover, you may add a nonionic surfactant in a composition after implementing all the processes.

  Hereinafter, each process of the manufacturing method shown to (1) is demonstrated. In addition, since each material used is the same as that of what was demonstrated with the polyimide precursor composition which concerns on the said this embodiment, description is abbreviate | omitted.

(Polymerization process)
In the polymerization step, a tetracarboxylic dianhydride and a diamine compound are polymerized in an aqueous solvent containing water to produce a polyimide precursor.

The reaction temperature during the polymerization reaction of the polyimide precursor is, for example, preferably from 0 ° C. to 70 ° C., preferably from 10 ° C. to 60 ° C., more preferably from 20 ° C. to 55 ° C. By setting the reaction temperature to 0 ° C. or higher, the reaction heat generated by the polymerization reaction is removed to promote the progress of the polymerization reaction, the time required for the reaction is shortened, and the productivity is easily improved. On the other hand, when the reaction temperature is 70 ° C. or lower, the progress of the imidization reaction occurring in the molecule of the generated polyimide precursor is suppressed, and precipitation or gelation associated with a decrease in solubility of the polyimide precursor is easily suppressed.
The time during the polymerization reaction of the polyimide precursor is preferably in the range of 1 hour to 24 hours depending on the reaction temperature.

(Amine chloride process)
In the amine chlorination step, after the polyimide precursor is generated, an organic amine compound is added to the solvent, and amine chlorination of the polyimide precursor (its carboxyl group) is performed. Thereby, the solubility with respect to the solvent of a polyimide precursor increases.

  In the amine chlorination step, water as a solvent may be added.

(Solvent replacement process)
The solvent replacement step is, for example, to change the solvent composition in the solution after the generation of the polyimide precursor, to stabilize the polyimide precursor composition to be manufactured, to dissolve the polyimide precursor to be generated, and to adjust the solid content concentration, etc. As done.
The solvent replacement step is performed by adding water or other solvent or removing the target solvent. Removal of the solvent includes a method of distilling off the solvent by heating and decompression (distillation method), and a reprecipitation method of separating and removing the solvent after adding water to precipitate the polyimide precursor. . The removal of the solvent may be performed in combination with a distillation method and a reprecipitation method.
Either the solvent replacement step or the solvent composition change step and the amine chlorination step may be performed first. Moreover, you may perform both processes in parallel.
In addition, a solvent substitution process is a process which does not need to be implemented after the production | generation of a polyimide precursor, if it is not necessary to change the solvent composition in a solution.

  Here, when implementing a solvent substitution process, it is good for an amine chlorination process to implement the following 1st amine chlorination processes or a 2nd amine chlorination process.

-Primary amine chlorination step-
In the first amine chlorination step, after the polyimide precursor is generated, water is added to the solvent, the polyimide precursor and the solvent are separated, a part of the separated solvent is removed, and the remainder is water and organic. Add the amine compound.

Specifically, for example, in the first amine chlorination step, when water is excessively added to the solvent after the polyimide precursor is generated, the solubility of the polyimide precursor is reduced and precipitated, resulting in the polyimide precursor and the solvent. And are separated. The amount of water added to the solvent is, for example, preferably 10% by mass to 300% by mass (preferably 50% by mass to 200% by mass) with respect to the total solvent.
If a polyimide precursor and a solvent isolate | separate, a polyimide precursor will settle and a supernatant will become a solvent and a part of solvent after a separation will be removed by removing this supernatant liquid. The removal of a part of the solvent is not limited to the removal of the supernatant liquid, and may be performed by filtration or the like.
Then, when an organic amine compound (for example, an aqueous solution in which the organic amine compound is dissolved) is added to the remainder together with water as a solvent, solvent substitution is performed and amine chloride of the polyimide precursor (its carboxyl group) is performed.
When a 1st amine chlorination process is performed, it will become easy to obtain a highly pure polyimide precursor composition.

-Secondary amine chlorination step-
In the second amine chlorination step, after producing the polyimide precursor, the organic amine compound is added to the remainder after part of the solvent is distilled off or while part of the solvent is distilled off.

Specifically, for example, in the second amine chlorination step, after a polyimide precursor is generated, a part of the solvent is distilled off by heating and reducing the pressure. This evaporation of the solvent is mainly an evaporation of the organic solvent. And after distilling off this solvent or adding some organic amine compounds while distilling off a part of the solvent, the solvent composition is changed and amine chloride of the polyimide precursor (its carboxyl group) is carried out. . In addition, when adding an organic amine compound, you may also add water as a solvent.
When the second amine chlorination step is performed, a solvent-substituted polyimide precursor composition is easily obtained in a simple step without passing through the precipitation of the polyimide precursor.

(2): A step of polymerizing tetracarboxylic dianhydride and a diamine compound in an aqueous solvent containing water in the presence of an organic amine compound to produce a resin (hereinafter referred to as “polyimide precursor”) ( (Hereinafter referred to as “polymerization step”).
In addition, in the manufacturing method shown in (2), you may have the process (henceforth a "solvent replacement process") which substitutes a solvent or changes a solvent composition after a superposition | polymerization process as needed.

  In the production method shown in (2), the formation of a polyimide precursor in the presence of an organic amine compound in an aqueous solvent that does not contain an aprotic polar solvent or at least the content of the aprotic polar solvent is reduced. I do.

  Here, in the production method shown in (2), the nonionic surfactant is added to the composition during either the polymerization step or the solvent replacement step. Moreover, you may add a nonionic surfactant in a composition after implementing all the processes.

  In the production methods shown in (1) and (2), as the solvent, an aprotic polar solvent that causes a decrease in the mechanical strength of the polyimide molded body is not used, or the amount of the aprotic polar solvent used is as follows. Reduced. For this reason, in the manufacturing method shown to (1) and (2), the polyimide precursor composition from which the polyimide molded body with high mechanical strength is obtained is manufactured. Moreover, in the manufacturing method shown to (1) and (2), in addition to mechanical strength, the polyimide precursor composition which is easy to obtain the polyimide molded object excellent in various characteristics, such as heat resistance, an electrical property, and solvent resistance, is obtained. Manufactured.

  Furthermore, in the manufacturing method shown in (1) and (2), since the aqueous solvent containing water is applied as a solvent, productivity is also high and a polyimide precursor composition is manufactured. In particular, when solvent replacement is performed, excessive heating is not necessary, and thermal imidization of the generated polyimide precursor is easily suppressed.

<Polyimide molded body and production method thereof>
The method for producing a polyimide molded body according to the present embodiment is a method for producing a polyimide molded body in which the polyimide precursor composition according to the present embodiment (hereinafter, also referred to as “specific polyimide precursor composition”) is heat-treated. It is.

  Specifically, the method for producing a polyimide molded body according to the present embodiment includes, for example, a step of applying a specific polyimide precursor composition on an object to be coated to form a coating film (hereinafter referred to as “coating film forming step”). And a step of forming a polyimide resin layer by heating the coating film (hereinafter referred to as “heating step”).

(Coating film formation process)
First, an object to be coated is prepared. This to-be-coated object is selected according to the use of the polyimide molded body to manufacture.
Specifically, when a liquid crystal alignment film is produced as a polyimide molded body, examples of the object to be coated include various substrates applied to liquid crystal elements, such as silicon substrates, glass substrates, or metal or alloy films on these surfaces. And a substrate on which is formed.
Further, when a passivation film is manufactured as a polyimide molded body, examples of the object to be coated include a semiconductor substrate on which an integrated circuit is formed, a wiring substrate on which wiring is formed, a printed board on which electronic components and wiring are provided, and the like. Selected.
Moreover, when manufacturing an electric wire coating material as a polyimide molded body, as an object to be coated, for example, various electric wires (wires made of metal such as anodized copper, hard copper, oxygen-free copper, chromium ore, aluminum, or an alloy, bar material) Or a plate material). In addition, when shape | molding and processing a polyimide molded object in a tape shape, and utilizing this as a tape-shaped electric wire coating | covering material which winds around an electric wire, various planar substrates or cylindrical base | substrates are utilized as a to-be-coated object.
Moreover, when manufacturing an adhesive film as a polyimide molded object, the various molded object (for example, various electrical components, such as a semiconductor chip, a printed circuit board, etc.) used as adhesion object is mentioned, for example.

Next, the specific polyimide precursor composition is applied to an object to be coated to form a coating film of the specific polyimide precursor composition.
The coating method of the specific polyimide precursor composition is not particularly limited, and examples thereof include various coating methods such as spray coating, spin coating, roll coating, bar coating, slit die coating, and inkjet coating. .

(Heating process)
Next, a drying process is performed with respect to the coating film of a specific polyimide precursor composition. By this drying treatment, a dry film (dried film before imidization) is formed.
The heating conditions for the drying treatment are, for example, from 80 ° C. to 200 ° C. for 10 minutes to 60 minutes, and the higher the temperature, the shorter the heating time. It is also effective to apply hot air during heating. During heating, the temperature may be increased stepwise or increased without changing the speed.

Next, imidization treatment is performed on the dried film. Thereby, a polyimide resin layer is formed.
As heating conditions for the imidization treatment, for example, heating is performed at 150 ° C. or higher and 400 ° C. or lower (preferably 200 ° C. or higher and 300 ° C. or lower) for 20 minutes or longer and 60 minutes or shorter. Is done. In the heating reaction, before reaching the final temperature of heating, it is preferable to heat by gradually increasing the temperature stepwise or at a constant rate.

  A polyimide molded body is formed through the above steps. And as needed, a polyimide molded object is taken out from a to-be-coated object, and a post-process is given.

<Polyimide molded product>
The polyimide molded body according to the present embodiment is a polyimide molded body obtained by the method for manufacturing a polyimide molded body according to the present embodiment. Examples of the polyimide molded body include various polyimide molded bodies such as a liquid crystal alignment film, a passivation film, a wire coating material, and an adhesive film. Other polyimide moldings include, for example, flexible electronic substrate films, copper-clad laminate films, laminate films, electrical insulation films, porous films for fuel cells, separation films, heat resistant coatings, IC packages, resist films, and planarization films Examples thereof include a microlens array film and an optical fiber coating film.
Examples of the polyimide molded body include a belt member. Examples of the belt member include a drive belt, a belt for an electrophotographic image forming apparatus (for example, an intermediate transfer belt, a transfer belt, a fixing belt, and a conveyance belt).
That is, the method for producing a polyimide molded body according to the present embodiment can be applied to the methods for producing various polyimide molded bodies exemplified above.

The polyimide molded body according to the present embodiment contains an aqueous solvent, an organic amine compound, and a nonionic surfactant contained in the specific polyimide precursor composition.
The aqueous solvent contained in the polyimide molded body according to this embodiment is 1 ppb or more and less than 1% in the polyimide molded body. The amount of the aqueous solvent contained in the polyimide molded body is determined by a gas chromatography method with respect to a gas component generated by heating the polyimide molded body. Moreover, also about the quantity of the organic amine compound and nonionic surfactant contained in a polyimide molded object, the gas component which generate | occur | produces by heating a polyimide molded object is quantified by the gas chromatography method.

  Examples will be described below, but the present invention is not limited to these examples. In the following description, “part” and “%” are all based on mass unless otherwise specified.

<Example 1>
[Preparation of polyimide precursor composition (A-1), (A-2)]
-Polymerization process-
A flask equipped with a stirring bar, a thermometer, and a dropping funnel was charged with 360 g of tetrahydrofuran (hereinafter referred to as THF) and 40 g of water. 41.23 g (205.92 mmol) of 4,4′-diaminodiphenyl ether (hereinafter referred to as ODA: molecular weight 200.24) was added while passing dry nitrogen gas. Stirring while maintaining the solution temperature at 30 ° C., 58.77 g (199.75 mmol) of 3,3 ′, 4,4′-biphenyltetracarboxylic dianhydride (hereinafter referred to as BPDA: molecular weight 294.22) Was gradually added. After confirming the dissolution of the diamine compound and tetracarboxylic dianhydride, the reaction was further carried out for 24 hours while maintaining the reaction temperature at 30 ° C. It was 70 Pas when the viscosity of the polyimide precursor solution (solid content 20% by mass) was measured by the method described later.
In addition, the imidation ratio of the produced | generated polyimide precursor was 0.02, and as a result of the measurement of the amount of terminal amino groups as stated above, it had an amino group at at least one terminal.

-Amine chloride process-
While stirring the polyimide precursor solution obtained in the polymerization step, 35.62 g (399.5 mmol) of dimethylaminoethanol (hereinafter referred to as DMAEt: molecular weight 89.14: organic amine compound) and 400 g of water were added. Thereby, the polyimide precursor aqueous solution in which the polyimide precursor was water-solubilized by amine chloride was obtained.
In the obtained polyimide precursor aqueous solution, 0.01% by mass with respect to the polyimide precursor composition from which polyoxyethylene oleyl ether “trade name Emulgen 404 (manufactured by Kao Corporation): nonionic surfactant” can be obtained. This solution was used as a polyimide precursor resin composition (A-1). The composition of the obtained polyimide precursor resin composition (A-1) is as follows.
-Composition of polyimide precursor resin composition (A-1)-
Solid content: 10% (solid content ratio as polyimide)
Solvent composition ratio: THF / water = 360 g / 440 g

-Solvent replacement step-
While stirring the polyimide precursor resin composition (A-1), the pressure is reduced at 10 mmHg / 30 ° C., and a part of THF is distilled off to obtain a polyimide precursor resin composition (A-2) having the following composition. It was.
-Composition of polyimide precursor resin composition (A-2)-
・ Viscosity: 50 Pas
Solid content: 13.0% (solid content ratio as polyimide)
Solvent composition ratio: THF / water = 6/94

  Each measurement is as follows.

(Viscosity measurement method)
The viscosity was measured using an E-type rotational viscometer under the following conditions.
・ Measuring device: E-type rotational viscometer TV-20H (Toki Sangyo Co., Ltd.)
・ Measurement probe: No. Type 3 rotor 3 ° × R14
・ Measurement temperature: 22 ℃

(Solid content measurement method)
The solid content was measured under the following conditions using a differential thermothermal gravimetric simultaneous measurement apparatus. In addition, solid content was measured as a solid content rate as a polyimide with the measured value of 380 degreeC.
・ Measuring device: Differential thermothermal gravimetric simultaneous measuring device TG / DTA6200 (Seiko Instruments Inc.)
・ Measurement range: 20 ° C to 400 ° C · Temperature increase rate: 20 ° C / min

(Solvent composition, water content in the solvent)
The moisture content in the polyimide precursor composition was measured under the following conditions using a coulometric titration type automatic moisture measuring device (Karl Fischer). The amount of water in the solvent was calculated by removing the resin content contained in the sample from the measured value. This determined the solvent composition.
・ Measuring device: Coulometric titration type automatic moisture measuring device (Karl Fischer) CA-07 (Mitsubishi Chemical Corporation)
Sample volume: 10 μl

<Evaluation>
The storage stability of the obtained polyimide precursor compositions (A-1) and (A-2) was evaluated. Moreover, it formed into a film using the polyimide precursor composition (A-1) and (A-2), produced the film, and evaluated the coating stability and film forming property.

(Storage stability)
Immediately after the preparation of the polyimide precursor compositions (A-1) and (A-2) and after storage for 20 days at room temperature (25 ° C.), the liquidity and viscosity were examined.

(Coating stability)
Using the polyimide precursor compositions (A-1) and (A-2), a film was formed by the following operation. The coating film immediately after coating was evaluated for (1) surface unevenness / pattern and (2) repellency.
Application method: A bar coating method using an application blade in which a spacer is provided so that the application thickness is 100 μm.
・ Coating substrate: 1.1 mmt glass plate ・ Drying temperature: 60 ° C. × 10 minutes ・ Baking temperature: 250 ° C. × 30 minutes

(1) Surface unevenness / pattern The presence or absence of surface unevenness / pattern generated on the surface of the coating film was evaluated. The evaluation criteria are as follows.
A: No surface unevenness or pattern is observed.
○: Surface unevenness and a pattern can be slightly confirmed on a part of the coating film surface (less than 10% of the coating film surface area).
(Triangle | delta): Surface unevenness and a pattern can be confirmed in a part of coating-film surface.
X: Surface unevenness and a pattern are uniformly generated on the surface of the coating film (10% or more of the coating film surface area).

(2) Repelling Presence or absence of repelling generated on the coating film surface was evaluated. The evaluation criteria are as follows.
A: No occurrence of repellency is observed.
○: A slight surface repellency can be confirmed on a part of the coating film surface (less than 5% of the coating film surface area).
Δ: Repelling can be confirmed on a part of the coating surface.
X: Repelling occurs uniformly on the surface of the coating film (15% or more of the coating film surface area).
(Film forming property)
Using the polyimide precursor compositions (A-1) and (A-2), a film was formed by the following operation. The film-forming film was evaluated for (3) void marks and (4) surface unevenness / pattern.

(3) Void traces The presence or absence of void traces on the film-forming film surface was evaluated. The evaluation criteria are as follows.
A: No void mark is observed.
◯: 1 or more and less than 10 void traces can be confirmed on the film forming film surface.
Δ: Ten or more void marks less than 50 are scattered on the surface of the film forming film.
X: Innumerable void traces are uniformly generated on the surface of the film forming film.

(4) Surface unevenness / pattern:
The presence or absence of surface irregularities and patterns generated on the surface of the film-forming film body was evaluated. The evaluation criteria are as follows.
A: No surface unevenness or pattern is observed.
○: Surface unevenness and a pattern can be slightly confirmed on a part of the film-forming film surface (less than 10% of the film-forming film surface area).
(Triangle | delta): Surface unevenness and a pattern can be confirmed in a part of film forming film surface.
X: Surface unevenness and a pattern are uniformly generated on the surface of the film-forming film (10% or more of the surface area of the film-forming film).

<Examples 2 to 6>
[Preparation of polyimide precursor compositions (A-3) to (A-7)]
A polyimide precursor composition (A-3) was prepared in the same manner as in Example 1 except that the conditions of the polymerization process, amine chlorination process, and solvent replacement process of the polyimide precursor composition were changed to the conditions described in Table 1 below. ) To (A-7) were produced.
And after evaluating about storage stability similarly to Example 1, it formed into a film and evaluated about coating stability and film forming property. The evaluation results are shown in Table 1.

<Comparative Example 1>
[Preparation of polyimide precursor compositions (X-1) and (X-2)]
A flask equipped with a stir bar, thermometer and dropping funnel was charged with 400 g of N-methyl-2-pyrrolidone (hereinafter referred to as NMP). While passing dry nitrogen gas, 41.23 g (205.92 mmol) of ODA was added. Stirring was performed while maintaining the solution temperature at 30 ° C., and 58.77 g (199.75 mmol) of BPDA was gradually added. After confirming the dissolution of the diamine compound and tetracarboxylic dianhydride, the reaction was further carried out for 24 hours while maintaining the reaction temperature at 30 ° C. It was 160 Pas when the viscosity of the polyimide precursor solution (solid content 20 mass%) was measured by the above-mentioned method.
In the obtained polyimide precursor aqueous solution, 0.01% by mass with respect to the polyimide precursor composition from which polyoxyethylene oleyl ether “trade name Emulgen 404 (manufactured by Kao Corporation): nonionic surfactant” can be obtained. This solution was used as polyimide precursor composition (X-1).
And after evaluating about storage stability similarly to Example 1, it formed into a film and evaluated about coating stability and film forming property. The evaluation results are shown in Table 2.

  In addition, the obtained polyimide precursor composition (X-1) and (A-1) obtained in Example 1 were each stored in the environment of 50 degreeC for 24 hours. Let (X-1) after storage be (X-2). When the liquids of (X-2) and (A-1) were compared, (A-1) was stable with the resin dissolved in a nearly uniform state, but (X-2) had the resin deposited. I have. When the storage temperature is 50 ° C., it is considered that the resin has precipitated due to the progress of imidization.

<Comparative Example 2>
[Preparation of polyimide precursor composition (X-3)]
A polyimide precursor composition (X-3) was prepared in the same manner as the polyimide precursor composition (A-2) of Example 1 except that polyoxyethylene oleyl ether (nonionic surfactant) was not added. did. When the solution property of (X-3) after storage for 20 days at room temperature (25 ° C.) was confirmed, it was gelled. The cause is considered to be that the viscosity was gradually increased because the surfactant was not added.

<Example 7>
[Preparation of polyimide precursor composition (B-1)]
-Polymerization process-
A flask equipped with a stir bar, thermometer, and dropping funnel was charged with 900 g of water. Here, 27.28 g (252.27 mmol) of p-phenylenediamine (hereinafter referred to as PDA: molecular weight 108.14) and 50.00 g (494.32) of methylmorpholine (hereinafter referred to as MMO: organic amine compound). Mmol) and stirred for 10 minutes at 20 ° C. to disperse. To this solution, polyoxyethylene oleyl ether “trade name Emulgen 404 (manufactured by Kao Corporation): nonionic surfactant” was added in an amount of 0.01% by mass relative to the polyimide precursor composition obtained. . Further, 72.72 g (247.16 mmol) of 3,3 ′, 4,4′-biphenyltetracarboxylic dianhydride (hereinafter referred to as BPDA: molecular weight 294.22) was added to this solution, and the reaction temperature was 20 While maintaining at ° C., the mixture was stirred for 24 hours for dissolution and reaction to obtain an aqueous polyimide precursor solution (B-1).
And after evaluating about storage stability similarly to Example 1, it formed into a film and evaluated about coating stability and film forming property. The evaluation results are shown in Table 3.
In addition, the imidation ratio of the produced | generated polyimide precursor was 0.02, and as a result of the measurement of the amount of terminal amino groups as stated above, it had an amino group at least at the terminal.

<Examples 8 to 22>
[Preparation of polyimide precursor compositions (B-2) to (B-16)]
Except having changed the conditions of the polymerization process of a polyimide precursor composition into the conditions of Table 3-Table 5, it carried out similarly to Example 7, and polyimide precursor composition (B-2)-(B-16). ) Was produced.
And after evaluating about storage stability similarly to Example 1, it formed into a film and evaluated about coating stability and film forming property. The evaluation results are shown in Tables 3 to 5.
In addition, the polyimide precursor produced | generated in Example 22 did not contain an amino group terminal as a result of the measurement of the amount of terminal amino groups as stated above, and all the terminals have a carboxyl group.

<Comparative Example 3>
[Preparation of polyimide precursor composition (Y-1)]
-Polymerization process-
A flask equipped with a stir bar, thermometer, and dropping funnel was charged with 900 g of NMP. To this, 27.28 g (252.27 mmol) of PDA was added, and the mixture was stirred at 20 ° C. for 10 minutes to be dispersed. To this solution, 72.72 g (247.16 mmol) of BPDA was added and dissolved and reacted by stirring for 24 hours while maintaining the reaction temperature at 20 ° C. to obtain a polyimide precursor aqueous solution.
In the obtained polyimide precursor aqueous solution, 0.01% by mass with respect to the polyimide precursor composition from which polyoxyethylene oleyl ether “trade name Emulgen 404 (manufactured by Kao Corporation): nonionic surfactant” can be obtained. This solution was used as a polyimide precursor composition (Y-1).
And after evaluating about storage stability similarly to Example 1, it formed into a film and evaluated about coating stability and film forming property. The evaluation results are shown in Table 2.

  In addition, the obtained polyimide precursor composition (Y-1) and (B-1) obtained in Example 7 were each stored in the environment of 50 degreeC for 24 hours. Let (Y-1) after storage be (Y-2). When the liquids of (Y-2) and (B-1) were compared, (A-1) was dissolved and stable in a nearly uniform state, but (Y-2) was precipitated with resin. I have. When the storage temperature is 50 ° C., it is conceivable that the resin has precipitated due to the progress of imidization.

<Comparative Example 4>
[Preparation of polyimide precursor composition (Y-3)]
-Polymerization process-
A flask equipped with a stir bar, thermometer, and dropping funnel was charged with 900 g of water. To this, 27.28 g (252.27 mmol) of PDA and 51.03 g (504.54 mmol) of MMO were added and dispersed by stirring at 20 ° C. for 10 minutes. To this solution, 72.72 g (247.16 mmol) of BPDA was added and dissolved and reacted by stirring for 24 hours while maintaining the reaction temperature at 20 ° C. to obtain a polyimide precursor composition (Y-3). .
When the solution properties of (Y-3) after storage for 20 days at room temperature (25 ° C.) were confirmed, it was gelled, so it was not possible to evaluate the coating stability and film forming property.

<Comparative Example 5>
[Preparation of polyimide precursor composition (Y-4)]
A polyimide precursor composition (Y-4) was produced in the same manner as in Example 7 except that the conditions for the polymerization step of the polyimide precursor composition were changed to the conditions shown in Table 6.
And after evaluating about storage stability similarly to Example 1, it formed into a film and evaluated about coating stability and film forming property. The evaluation results are shown in Table 6.

<Comparative Example 6>
[Preparation of polyimide precursor composition (Y-5)]
A polyimide precursor composition (Y-5) was produced in the same manner as in Example 7 except that the conditions for the polymerization step of the polyimide precursor composition were changed to the conditions shown in Table 6.
When the properties of the solution (Y-5) after storage for 20 days at room temperature (25 ° C.) were confirmed, it was gelled, and thus the coating stability and film forming properties could not be evaluated.

<Comparative Example 7>
[Preparation of polyimide precursor composition (Y-6)]
A polyimide precursor composition (Y-6) was produced in the same manner as in Example 7 except that the conditions for the polymerization step of the polyimide precursor composition were changed to the conditions described in Table 6.
And after evaluating about storage stability similarly to Example 1, it formed into a film and evaluated about coating stability and film forming property. The evaluation results are shown in Table 6.

From the above results, it can be seen that in this example, better results were obtained for the storage stability evaluation of the polyimide precursor composition than in the comparative example.
Moreover, in the present Example, it turns out that the favorable result was obtained also about the application | coating stability and film forming property of a polyimide precursor composition compared with the comparative example.

  The abbreviations in Tables 1 to 6 are as follows. In Tables 1 to 6, “-” means not added or not implemented.

Tetracarboxylic dianhydride: “BPDA” (3,3 ′, 4,4′-biphenyltetracarboxylic dianhydride), “PMDA” (pyromellitic dianhydride), “BTDA” (benzophenone tetracarboxylic) Acid dianhydride), “CBDA” (cyclobutane-1,2: 3,4-tetracarboxylic dianhydride)
-Diamine compound: "ODA"(4,4'-diaminodiphenyl ether), "PDA" (p-phenylenediamine)

  Organic amine compound: DMAEt (dimethylaminoethanol: tertiary amine compound: boiling point bp 133 ° C. to 134 ° C.), γ-Pyc (γ-picoline: tertiary amine compound: boiling point bp 145 ° C.), MMO (methylmorpholine: tertiary amine Compound), 1-methylpiperidine (tertiary amine compound: molecular weight 99.17), N, N-dimethylpiperazine (tertiary amine compound: molecular weight 114.19), 1-methylpyrrolidine (tertiary amine compound: molecular weight 85. 15), morpholine (secondary amine compound: molecular weight 87.1)

  Surfactant (nonionic surfactant): POE-OE (polyoxyethylene oleyl ether “trade name Emulgen 404 (manufactured by Kao Corporation)”), PEG-MO (polyethylene glycol monooleate “trade name Emanon 4110”) (Manufactured by Kao Corporation) ”), Sor-MO (Sorbitan monooleate“ Trade name New Call 80 (manufactured by Nippon Emulsifier Co., Ltd.) ”), POE-Sor-ML (Polyoxyethylene sorbitan monolaurate“ Product ” Name Leo Doll Super TW-L120 (manufactured by Kao Corporation) ")

  Solvent: THF (tetrahydrofuran: water-soluble ether solvent: boiling point bp 67 ° C.), NMP (N-methyl-2-pyrrolidone)

  In this example, the “treatment rate” in the amine chlorination step or the polymerization step is the amount of organic amine compound (mol%) relative to the theoretical amount of carboxyl groups contained in the polyimide precursor. Here, the theoretical amount of the carboxyl group indicates a value obtained by doubling the molar amount of tetracarboxylic acid contained in the polyimide precursor.

Claims (8)

A polyimide precursor composition in which a resin having a repeating unit represented by the following general formula (I), an organic amine compound, and a nonionic surfactant are dissolved in an aqueous solvent containing water.


(In general formula (I), A represents a tetravalent organic group, and B represents a divalent organic group.) The nonionic surfactant is a surfactant represented by the following general formula (II-1), the following general formula (II-2), the following general formula (II-3), and the following general formula (II-4). The polyimide precursor composition according to claim 1, which is at least one selected from the group consisting of agents.

(In General Formulas (II-1) to (II-4), R ¹ , R ² , R ³ , and R ⁴ each independently represent a substituted or unsubstituted organic group having 8 or more carbon atoms. A ³ , and ^{a 4,} .N1 shows the polysaccharide independently, n2, and n4, the .m4 showing a 1 to 10 each independently integers, indicating an integer of 1 to 5.   The polyimide precursor composition according to claim 1 or 2, wherein the nonionic surfactant has a molecular weight of 250 or more.   The polyimide precursor composition according to claim 1, wherein the organic amine compound is a tertiary amine compound.   The polyimide precursor composition according to any one of claims 1 to 4, wherein the resin is a resin synthesized from an aromatic tetracarboxylic dianhydride and an aromatic diamine compound.   The polyimide precursor composition according to claim 1, wherein the resin contains a resin having an amino group at a terminal.   The manufacturing method of the polyimide molded body which heat-processes and shape | molds the polyimide precursor composition of any one of Claims 1-6.   The polyimide molded body manufactured by the manufacturing method of the polyimide molded body of Claim 7.