JP2015177165A - Front opening shipping box and manufacturing method therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a front opening shipping box (FOSB) which allows for smooth insertion of a semiconductor wafer.SOLUTION: In a FOSB1 including a housing 2 capable of housing a plurality of semiconductor wafers 5, a lid 4 capable of sealing the semiconductor wafers in the housing, and a guide 3 formed of a plurality of protrusions protruding, at intervals, from the inner wall of the housing, and capable of isolating each semiconductor wafer, and transferring the semiconductor wafer, the housing is formed of polycarbonate resin, and the guide is formed of aromatic polyether ketone resin at least in a part of the contact surface with the semiconductor wafer. The housing and guide may be integrated by welding.

Description

  The present invention relates to a front opening shipping box (FOSB) for transporting a semiconductor wafer such as a silicon wafer and a method for manufacturing the same.

  Semiconductors represented by silicon are used in all electronic products that symbolize the modern world, such as personal computers, smartphones, and tablet computers. First, they are manufactured as large-sized semiconductor wafers (silicon wafers). A small IC chip is cut out from and used. Therefore, it is necessary to transport the semiconductor wafer to the process of cutting out the semiconductor wafer. However, since the semiconductor wafer is very disliked by the adhesion of impurities, it is transported in a plastic closed container called a front opening shipping box (FOSB). As a plastic constituting FOSB, a polycarbonate resin is widely used because it has high strength and an internal state can be visually recognized due to high transparency.

  FIG. 1 is a schematic perspective view for explaining a method of accommodating a semiconductor wafer in a front opening shipping box (FOSB). As shown in FIG. 1, the structure of the front opening shipping box 1 is composed of a housing part (case) 2 that can accommodate a semiconductor wafer 5 and a lid part 4 that can seal the housing part. The casing 2 is spaced from the lid 2 toward the bottom 2a of the casing facing the lid 2 on the inner wall so that a large number of semiconductor wafers can be accommodated at intervals. And a guide portion 3 composed of a plurality of protrusions extending in parallel with each other. The semiconductor wafer 5 is inserted in the direction of the arrow in FIG. 1 along a groove formed between adjacent guide portions, and is accommodated in the housing. The plurality of accommodated semiconductor wafers are supported at their outer edges (end portions) by adjacent guide portions (only one semiconductor wafer is shown in FIG. 1), and are separated by the guide portions without contacting each other. Yes.

  Such FOSB is formed of polycarbonate because it is excellent in strength and transparency, but polycarbonate has low slidability. For this reason, in the conventional FOSB, when the semiconductor wafer is inserted, the semiconductor wafer is caught on the guide part, or the semiconductor part is not inserted in parallel with the guide part in the guide part having a slight clearance, and is inclined with respect to the guide part. And easy to insert. Further, as described above, since semiconductor wafers are extremely reluctant to mix impurities, the insertion work into FOSB has been mechanized, and it has not been easy to find abnormalities at the time of insertion. Furthermore, since the larger the semiconductor wafer, the more efficiently the chip can be cut out, the size tends to increase year by year, and the increase in size and weight makes the problem of the sliding property of the guide portion more serious. It was.

  On the other hand, since it is the guide part that affects the slidability of the semiconductor wafer, if it is a general-purpose resin case, this guide part is formed of a different kind of resin material having excellent slidability and an adhesive is used. The problem can be easily solved by combining them by bonding or fitting (mechanical fitting). However, in semiconductor wafers that do not like impurities, the residue of volatile solvents contained in the adhesive can cause serious quality problems. These methods could not be employed because they may occur and contaminate the semiconductor. In addition to bonding and fitting using adhesives, compounding by insert molding or the like is also conceivable, but polycarbonate is not considered a very suitable material for compounding with different resins by insert molding or the like. However, it was a difficult problem for those skilled in the art. For example, Nikkei Material & Technology No. 144 (1994) (Non-Patent Document 1) discloses the relationship shown in Table 1 below for combinations of two-color molding.

  As is apparent from Table 1, the polycarbonate resin and the resin having good adhesion were both resins having low slidability.

  Japanese Patent Publication No. 6-38413 (Patent Document 1) discloses a wafer processing container in the production of an integrated circuit chip molded from a polyether ether ketone resin. This document describes that this container is a stable container that contains a silicon wafer and does not generate distortion or cracking even when processed in a high temperature liquid bath or a liquid bath containing a corrosive chemical substance. Has been.

  However, this document does not describe any slidability with respect to FOSB or silicon wafer. Further, this container is not a hermetically sealed container because the entire container is made of polyetheretherketone resin, has low moldability and economy, and is processed in a liquid bath.

Japanese Patent Publication No. 6-38413 (Claim 1, first column, line 6 to third column, line 3, example)

Nikkei Material & Technology No.144 (1994)

  Accordingly, an object of the present invention is to provide a FOSB that can smoothly insert and stably transport a semiconductor wafer without generating contaminants of the semiconductor wafer, and is excellent in transparency and strength, and a method for manufacturing the same. There is.

  Another object of the present invention is to provide a FOSB that can be manufactured with high moldability and productivity even in a large size and a manufacturing method thereof.

  As a result of intensive studies to achieve the above-mentioned problems, the present inventors have found that the guide part of the front opening shipping box (FOSB) in which the casing part is formed of polycarbonate resin is formed on at least a part of the contact surface with the semiconductor wafer. The present inventors have found that a semiconductor wafer can be smoothly inserted by forming with an aromatic polyetherketone resin, thereby completing the present invention.

That is, the FOSB of the present invention protrudes from the inner wall of the housing part with a housing part capable of accommodating a plurality of semiconductor wafers, a lid part capable of sealing the semiconductor wafer to the housing part, and the inner wall of the housing part. A FOSB formed with a plurality of protrusions and capable of isolating each of the semiconductor wafers, and for transporting the semiconductor wafer, wherein the housing part includes a polycarbonate resin, and the guides The portion includes an aromatic polyether ketone resin in at least a part of the contact surface with the semiconductor wafer. The housing part and the guide part may be integrated by welding. The aromatic polyether ketone resin may be a polyether ether ketone resin. The aromatic polyether ketone resin may have a melt viscosity of 170 Pa · s or less under conditions of a temperature of 400 ° C. and a shear rate of 1216 seconds− ¹ . In the FOSB of the present invention, the casing portion has a substantially rectangular parallelepiped shape or a substantially rectangular parallelepiped shape, and the guide portions protrude oppositely on both sides of the inner walls of the opposing casing portions, and each inner wall You may form in the some protrusion part extended in the direction orthogonal to a cover part at intervals. In particular, this protrusion may be formed of an aromatic polyether ketone resin at least at the end on the lid side and the end on the bottom side of the casing.

  The present invention also includes a method for manufacturing the FOSB including a welding step of welding the housing and the guide. In the welding step, the housing part and the guide part may be heat-sealed by overmolding.

  In the present invention, since the guide portion of the front opening shipping box (FOSB) is formed of the aromatic polyether ketone resin at least at a part of the contact surface with the semiconductor wafer, the semiconductor wafer can be smoothly inserted. Therefore, even when the size of the semiconductor wafer is 12 inches or more, it can be smoothly inserted and stored, and the semiconductor wafer can be transported safely or stably even at a mechanized production site. In addition, since it can be welded to the casing formed of polycarbonate resin, the semiconductor wafer can be stably conveyed without generating contaminants of the semiconductor wafer, and it is excellent in transparency and strength. Furthermore, when an aromatic polyether ketone resin having a specific melt viscosity is used, FOSB can be produced with high moldability and productivity even in a large size. In particular, molding defects can be suppressed, and the bonding strength between the guide portion and the housing portion can be improved under mild conditions.

FIG. 1 is a schematic perspective view for explaining a method of accommodating a semiconductor wafer in a front opening shipping box (FOSB). FIG. 2 is a cross-sectional view (a cross-sectional view in a direction perpendicular to the longitudinal direction of the guide portion) of the FOSB manufactured in Example 15. FIG. 3 is a cross-sectional view (a cross-sectional view in a direction parallel to the longitudinal direction of the guide portion) of the FOSB produced in Example 15. FIG. 4 is a cross-sectional view (a cross-sectional view in a direction perpendicular to the longitudinal direction of the guide portion) of FOSB produced in Example 16.

[Front opening shipping box (FOSB)]
As shown in FIG. 1, the FOSB of the present invention includes a housing portion 2 that can accommodate a plurality of semiconductor wafers 5, a lid portion 4 that can seal the semiconductor wafer 5 in the housing portion 2, and And a guide portion 3 formed with a plurality of protrusions protruding from the inner wall of the housing portion 2 at regular intervals (equal intervals) and capable of isolating each of the semiconductor wafers.

(Case)
The shape of the housing portion can be selected according to the shape of the semiconductor wafer, and is not particularly limited as long as it can accommodate semiconductor wear and can be sealed in combination with the lid portion (box shape or bag shape having an opening). . The planar shape of the semiconductor wafer is, for example, a quadrangular shape such as a square shape or a rectangular shape, a circular shape, or the like, and is generally a substantially circular shape such as a perfect circle shape. Examples of the shape (outer shape) of the housing include a substantially polygonal shape such as a substantially rectangular parallelepiped shape and a substantially rectangular parallelepiped shape, a substantially cylindrical shape, a substantially semicylindrical shape, and a substantially hemispherical shape. Of these, a substantially rectangular shape or a substantially rectangular parallelepiped shape is widely used.

  The housing part is formed of a resin capable of sealing the semiconductor wafer accommodated therein, and the internal semiconductor wafer can be visually recognized. From the point which is excellent in, polycarbonate resin is included.

Polycarbonate resins include aromatic polycarbonates based on bisphenols. Examples of bisphenols include biphenols such as dihydroxybiphenyl, bis (hydroxyaryl) alkanes such as bisphenol A, bisphenol F, and bisphenol AD, and bis (hydroxyaryl) cycloalkanes such as bis (hydroxyphenyl) cyclohexane. Di (hydroxyphenyl) ethers such as 4,4'-di (hydroxyphenyl) ether, di (hydroxyphenyl) ketones such as 4,4'-di (hydroxyphenyl) ketone, di (hydroxyphenyl) such as bisphenol S And bisphenol fluorenes such as sulfoxides, bis (hydroxyphenyl) sulfones, and 9,9-bis (4-hydroxyphenyl) fluorene. These bisphenols may be C _2-4 alkylene oxide adducts. These bisphenols can be used alone or in combination of two or more.

The polycarbonate resin may be a polyester carbonate resin copolymerized with a dicarboxylic acid component (such as an aliphatic, alicyclic or aromatic dicarboxylic acid or an acid halide thereof). These polycarbonate resins can be used alone or in combination of two or more. Preferred polycarbonate resins are resins based on bis (hydroxyphenyl) C _1-6 alkanes, for example, bisphenol A type polycarbonate resins.

  The number average molecular weight of the polycarbonate resin is not particularly limited. For example, in gel permeation chromatography (GPC), the number average molecular weight can be selected from a range of about 10,000 to 500,000 in terms of polystyrene, for example, 12,000 to 100,000, preferably 13,000 to 50,000 ( In particular, it is about 15000-30000). If the molecular weight of the polycarbonate resin is too small, the strength of the housing portion is lowered, and if the molecular weight is too large, the moldability tends to be lowered.

  The glass transition temperature of polycarbonate resin is about 130-280 degreeC, for example, Preferably it is about 135-250 degreeC, More preferably, it is about 140-200 degreeC. If the glass transition temperature of the polycarbonate resin is too low, the strength of the housing portion is lowered, and if the glass transition temperature is too high, the moldability tends to be lowered.

  In the present specification, the glass transition temperature point can be measured by, for example, differential scanning calorimetry (DSC).

  The housing part may be a single layer formed of polycarbonate resin, or may be a laminate of a layer formed of polycarbonate resin and a layer formed of other transparent resin. The laminate is, for example, a laminate of a first layer formed of polycarbonate resin and a second layer formed of the same aromatic polyetherketone resin as the guide portion, and the second layer is the guide portion. The laminated body arrange | positioned on the side which contacts with may be sufficient.

  In addition to the resin component, the case is filled with conventional additives such as stabilizers (antioxidants, UV absorbers, light-resistant stabilizers, heat stabilizers, etc.), flame retardants, flame retardant aids, filling It may contain additives, plasticizers, impact modifiers, reinforcing agents, dispersants, antistatic agents, antibacterial agents, etc., but it contains substantially no additives from the viewpoint of suppressing contamination of the semiconductor wafer. Is preferred.

(Guide part)
A guide portion for supporting the semiconductor wafer is formed on the inner wall of the housing portion. The guide part is formed of a plurality of protrusions protruding at intervals from the inner wall of the housing part, and each of the plurality of semiconductor wafers can be isolated. In other words, the guide portion only needs to be formed by a plurality of protrusions that can be supported without bringing a plurality of semiconductor wafers housed inside the housing portion into contact with each other. In the case of a rectangular semiconductor wafer, the semiconductor wafer is usually isolated by supporting opposite ends. The plurality of protrusions may be a plurality of protrusions extending in a direction (substantially perpendicular) to the opening (lid) from the viewpoint that the semiconductor wafer can be stably held and the handleability is excellent.

  In particular, when the casing is in the shape of a substantially rectangular parallelepiped or a substantially rectangular parallelepiped, as shown in FIG. 1, the guides protrude oppositely on both sides of the inner walls of the opposing casing and are spaced from each other in the inner walls. It may be formed of a plurality of protrusions extending in a direction orthogonal to the lid portion. As shown in FIG. 1, the shape of each protrusion is not limited to a shape that extends continuously in a direction orthogonal to the lid (opening), but is formed intermittently (partially) in a direction orthogonal to the lid. It may be a shaped shape. Among these, a shape that continuously extends in a direction orthogonal to the lid is preferable from the viewpoint that the semiconductor wafer can be stably held. Moreover, the shape of the protrusion part extending continuously is not limited to a uniform width, and may be a non-uniform width. For example, the lid part side (opening part side) and / or the bottom part side of the casing part is wide. It may be formed. In other words, the planar shape of the protrusion is not limited to the continuous rectangular shape shown in FIG. 1, and may be, for example, a shape in which the central part is formed with a narrow width and the lid part side and the bottom part side are formed with a wide width. May be.

  The width of the protrusion (particularly, the width of the protrusion that extends continuously in the direction orthogonal to the lid (opening)) can be appropriately selected according to the size of the semiconductor wafer, and is, for example, 5 to 100 mm, preferably 10 to 10 mm. It is about 50 mm, more preferably about 20 to 40 mm.

  The guide part includes an aromatic polyether ketone resin in at least a part of the contact surface with the semiconductor wafer.

Aromatic polyetherketone resins (polyaryletherketone resins) usually contain a repeating unit composed of an arylene group, an ether group [—O—], and a carbonyl group [—C (═O) —]. There are many cases. Although it does not restrict | limit especially as such resin, For example, the repeating unit represented by either of following formula (a1)-(a5) may be included.
[—Ar—O—Ar—C (═O) —] (a1)
[-Ar-O-Ar-C (= O) -Ar-C (= O)-] (a2)
[-Ar-O-Ar-O-Ar-C (= O)-] (a3)
[—Ar—O—Ar—C (═O) —Ar—O—Ar—C (═O) —Ar—C (═O) —] (a4)
[-Ar-O-Ar-O-Ar-C (= O) -Ar-C (= O)-] (a5)
(In the formula, Ar represents a divalent aromatic hydrocarbon ring group which may have a substituent).

Examples of the divalent aromatic hydrocarbon ring group represented by Ar include a C _6-10 arylene group such as a phenylene group (such as o-, m- or p-phenylene group) and a naphthylene group, a biphenylene group (2 , 2'-biphenylene group, 3,3'-biphenylene, 4,4'-biphenylene group) bicycloalkyl _{C 6-10} arylene group such as, o-, terpolymers _{C 6,} such as m- or p- terphenylene Examples thereof include a _-10 arylene group. These aromatic hydrocarbon ring groups are substituted with, for example, a halogen atom, an alkyl group (a linear or branched C _1-4 alkyl group such as a methyl group), a haloalkyl group, a hydroxyl group, an alkoxy group ( A linear or branched C _1-4 alkoxy group such as a methoxy group), a mercapto group, an alkylthio group, a carboxyl group, a sulfo group, an amino group, an N-substituted amino group, a cyano group, etc. Good. In the repeating units (a1) to (a5), the types of Ar may be the same as or different from each other.

  Preferred Ar is a phenylene group (for example, p-phenylene group) or a biphenylene group (for example, 4,4'-biphenylene group).

  Examples of the resin having the repeating unit (a1) include polyetherketone resin (for example, “PEEK-HT” manufactured by Victrex). Examples of the resin having the repeating unit (a2) include polyether ketone ketone resin (for example, “PEKK” manufactured by Arkema + Oxford Performance Material). Examples of the resin having the repeating unit (a3) include polyether ether ketone resins (for example, “VICTREX PEEK” manufactured by Victrex, “Vestakeep (registered trademark)” manufactured by Evonik, “Vestakeep-J” manufactured by Daicel Evonik, Solvay Advanced Polymers "Ketaspire (registered trademark)"), polyether-diphenyl-ether-phenyl-ketone-phenyl resin (for example, "Kadel (registered trademark)" manufactured by Solvay Advanced Polymers) and the like can be exemplified. Examples of the resin having the repeating unit (a4) include polyether ketone ether ketone ketone resin (for example, “VICTREX ST” manufactured by Victrex). Examples of the resin having the repeating unit (a5) include polyether ether ketone ketone resin (PEEK).

  In the repeating unit composed of an arylene group, an ether group and a carbonyl group, the ratio of the ether segment (E) to the ketone segment (K) is, for example, the former / the latter (E / K) = 0.5 / 1 2/1, preferably about 1/1 to 2/1. The ether segment imparts flexibility to the molecular chain, and the ketone segment imparts rigidity to the molecular chain, so the more the ether segment, the faster the crystallization rate and the higher the crystallinity that can ultimately be reached. As the number of segments increases, the glass transition temperature and melting point tend to increase.

  Among aromatic polyetherketone resins, aromatic polyetherketone resins having any one of repeating units (a1) to (a3), in particular, have a high glass transition temperature and melting point, and are excellent in the balance between decomposition temperature and processing temperature. From the viewpoint, an aromatic polyether ketone resin (for example, polyether ether ketone resin) having the repeating unit (a3) is preferable.

  As the aromatic polyether ketone resin, the above-mentioned commercially available products may be used, and conventional methods (for example, a method of condensing an aromatic diol component and an aromatic dihalide component, an aromatic monohalide monool component as a self A synthetic product obtained by a method using a nucleophilic substitution reaction such as a condensation method may be used.

  Examples of the aromatic diol component include dihydroxybenzene (such as hydroquinone) and dihydroxybenzophenone (such as 4,4'-dihydroxybenzophenone). Examples of the aromatic dihalide component include dihalobenzophenone (such as 4,4'-difluorobenzophenone and 4,4'-dichlorobenzophenone). Examples of the aromatic monohalide monool component include halo-hydroxybenzophenone (such as 4-fluoro-4'-hydroxybenzophenone).

  The condensation reaction may be performed in the presence of a base and / or a solvent. Examples of the base include alkali metal salts such as alkali metal carbonates such as (anhydrous) potassium carbonate. Examples of the solvent include high boiling point solvents such as diphenyl sulfone and sulfolane. The reaction temperature may be, for example, about 150 to 400 ° C, preferably about 200 to 350 ° C.

  The reaction product can be separated and purified by conventional separation means such as filtration, concentration, crystallization, chromatography and the like. The reaction product may be washed and dried as necessary. Examples of the cleaning solvent include water, alcohols (such as methanol and ethanol), ketones (such as acetone), and mixed solvents thereof. Further, the solid reaction product may be pulverized or classified to adjust the particle size.

  The terminal group (such as a halogen atom) of the reaction product may be modified with, for example, an alkali sulfonate group (such as a lithium sulfonate group, a sodium sulfonate group, or a potassium sulfonate group) from the viewpoint of adjusting the crystallization temperature. .

The melt viscosity of the aromatic polyetherketone resin may be 400 Pa · s or less (preferably 300 Pa · s or less, more preferably 200 MPa or less) under the conditions of a temperature of 400 ° C. and a shear rate of 1216 seconds− ^1. From the point of property, it is 170 MPa or less (for example, 10-170 MPa), Preferably it is 30-130 MPa, More preferably, it is about 50-120 MPa (especially 80-110 MPa). If the melt viscosity is too large (for example, exceeding 300 Pa · s), the moldability is deteriorated, and molding is likely to occur due to molding under a large FOSB or severe conditions. The strength tends to decrease. The melt viscosity can be measured using a conventional apparatus such as a capillary rheometer.

  The number average molecular weight of the aromatic polyether ketone resin is not particularly limited. For example, in gel permeation chromatography (GPC), it may be 40000 or less in terms of polystyrene, for example, 10,000 to 40,000, preferably 20000. It is about 40,000, more preferably about 30000-40000 (particularly 30000-35000). If the molecular weight is too large, the moldability is likely to be reduced, and the adhesive strength with the casing is also likely to be reduced.

  In the guide portion having the shape, the aromatic polyether ketone resin may be included in at least a part of the contact surface with the semiconductor wafer, and the other part is formed of the aromatic polyether ketone resin. Alternatively, it may be formed of a resin other than the aromatic polyetherketone resin. In the guide portion, the site formed with the aromatic polyether ketone resin is not particularly limited, but it is preferable that at least the end portion on the lid side is formed with the aromatic polyether ketone resin. In particular, when the casing is in the shape of a substantially rectangular parallelepiped or a substantially rectangular parallelepiped, at least the end on the lid side and the end on the bottom side of the casing are formed of an aromatic polyether ketone resin. It is preferable.

  The ratio of the region formed of the aromatic polyether ketone resin in the entire contact surface with the semiconductor wafer in the guide portion is, for example, 10% or more, preferably 15% or more, more preferably 20% or more (particularly 25%). In the case where it is formed at the end on the lid side and the end on the bottom side of the casing, for example, even if it is about 20 to 50% (especially 25 to 40%), high slidability Can be expressed. If the area ratio of the region formed of the aromatic polyether ketone resin is too small, the slidability is lowered.

  As other resin, the transparent resin (especially polycarbonate resin) which forms a housing | casing part is preferable from the point of joining strength with a housing | casing part.

  The guide portion may also contain a conventional additive in addition to the resin component, but it is preferable that the guide portion substantially does not contain an additive from the viewpoint of suppressing contamination of the semiconductor wafer. In particular, the guide portion is made of fluororesin (polytetrafluoroethylene (PTFE), tetrafluoroethylene / perfluoroalkylpinyl ether copolymer (PFA), tetrafluoroethylene / hexafluoropropylene copolymer, from the viewpoint of slidability. (FEP) etc.) may be included at a ratio of about 5 to 20% by weight with respect to the aromatic polyetherketone resin, but it is possible to suppress contamination of the semiconductor wafer due to slidability and generation of wear. It is preferable that the contact surface with the semiconductor wafer is substantially formed of only an aromatic polyether ketone resin.

  The housing part and the guide part are integrated by welding by a manufacturing method described later. Therefore, since no adhesive is present, the semiconductor wafer is not contaminated by the adhesive and is welded. Therefore, the semiconductor wafer is not contaminated by wear powder generated during fitting.

(Cover)
The opening of the housing part is provided with a lid part for sealing the housing part containing the semiconductor wafer. The lid portion only needs to be able to seal the semiconductor wafer in the housing portion, and may be a conventional method, for example, a lid portion that is sealed using an engagement means via packing or the like.

  The material of the lid is not particularly limited, but is usually formed of a transparent resin (particularly polycarbonate resin) that forms the casing. The lid portion may also contain a conventional additive in addition to the transparent resin.

[FOSB manufacturing method]
The FOSB of the present invention is obtained by a manufacturing method including a welding step of welding (or fusing) a casing portion and a guide portion.

  In the welding step, examples of the welding (fusion) method include overmolding, laser welding, high frequency welding, and vibration welding. Of these methods, the FOSB housing itself has a large width and depth of 30 to 50 cm, and the number of guides is usually 25 on one side (50 on both sides). Therefore, a method of heat-sealing by overmolding by insert molding using injection molding is preferable.

  As a method of thermal fusion by overmolding, for example, when the guide part is formed only with an aromatic polyetherketone resin, after the casing part is molded with polycarbonate resin, the obtained casing part is replaced with another mold. It may be a method in which an aromatic polyetherketone resin is overmolded by injection molding, and when the guide part is formed of a composite of polycarbonate resin and aromatic polyetherketone resin, a part of the guide part After molding the molded body with polycarbonate resin, insert the resulting molded body, overmold the aromatic polyetherketone resin to produce a guide part as a composite molded body, and then insert this composite molded body further. Alternatively, the casing portion may be formed by overmolding with a polycarbonate resin. In any of the methods according to the present invention, when the aromatic polyether ketone resin having the above-described melt viscosity is used, a FOSB having a high bonding strength between the guide portion and the housing portion can be easily produced.

  In the injection molding by overmolding, the injection pressure is, for example, about 5 to 150 MPa, preferably about 10 to 100 MPa, and more preferably about 20 to 80 MPa. When the injection pressure is too low, the bonding strength between the guide portion and the housing portion is reduced, and when it is too high, the housing portion (for example, the housing portion formed of polycarbonate resin) is likely to be deformed. In the present invention, the guide portion is formed of the aromatic polyether ketone resin having the above-described melt viscosity, so that it is as low as 50 MPa or less (for example, about 5 to 40 MP, preferably 10 to 30 MPa, more preferably about 15 to 25 MPa). Even with the injection pressure, a FOSB with practically no problem in the bonding strength between the guide portion and the housing portion can be obtained.

  The injection speed is, for example, about 10 to 200 mm / second, preferably about 15 to 150 mm / second, and more preferably about 20 to 100 mm / second. If the injection speed is too low, the bonding strength between the guide portion and the housing portion decreases, and if it is too high, the housing portion is likely to be deformed. In the present invention, the guide portion is formed of the above-described aromatic polyether ketone resin having melt viscosity, so that it is 50 mm / second or less (for example, 5 to 40 mm / second, preferably 10 to 30 mm / second, more preferably 15 mm). Even at a low injection speed (about 25 mm / sec), FOSB can be obtained in which the bonding strength between the guide portion and the housing portion has no practical problem.

  The mold temperature may be 220 ° C. or lower, for example, 50 to 220 ° C., preferably 80 to 200 ° C., more preferably about 100 to 180. If the mold temperature is too high, the housing part is likely to be deformed.

  The lid can also be manufactured by a conventional method such as injection molding.

  Hereinafter, the present invention will be described in more detail based on examples, but the present invention is not limited to these examples. Abbreviations of materials used in Examples and Comparative Examples are as follows, and FOSBs obtained in Examples and Comparative Examples were evaluated by the following items.

[material]
1000G: PEEK (polyetheretherketone), “Vesta Keep (registered trademark) 1000G” manufactured by Daicel-Evonik Co., Ltd.
2000G: “PESTAKEEP 2000G” manufactured by PEEK, Daicel Evonik Co., Ltd.
3300G: “PESTAKEEP 3300G” manufactured by PEEK, Daicel Evonik Co., Ltd.
ZV7402: PEEK, manufactured by Daicel Evonik Co., Ltd. “Vesta Keep-J ZV7402”
Polycarbonate: “Panlite L-1225Z 100” manufactured by Teijin Chemicals Ltd.

[Melt viscosity]
The PEEK used in the examples was measured using a capillary rheometer (“Capillograph 1D” manufactured by Toyo Seiki Seisakusho Co., Ltd.) under the conditions of a temperature of 400 ° C. and a shear rate of 1216 seconds− ¹ .

[Adhesive strength]
Based on a tensile test (50 mm / min) based on ISO 527-1 / -2, using a universal testing machine ("RTA-1T" manufactured by Orientec Co., Ltd.), an ISO dumbbell piece formed of polycarbonate and The adhesion strength (tensile rupture strength) with the molded body formed of PEEK resin was measured. When the tensile strength at break is 30 MPa or more, the bond strength is excellent in durability as FOSB.

[Insertability of silicon wafer]
Five silicon wafers with a diameter of 300 mm and a thickness of 1.5 mm are randomly inserted into the FOSBs obtained in the examples and comparative examples, and the silicon wafers can be smoothly inserted along the guide portion without being inclined. The test of counting the number of sheets was performed 20 times. That is, the number of times the silicon wafer could be smoothly inserted into the FOSB was measured in a total of 100 trials (5 × 20).

Examples 1-14
A dumbbell piece conforming to ISO 527-1 / -2 is made of polycarbonate resin, using an injection molding machine (“Roboshot S-2000 i-100B” manufactured by FANUC CORPORATION), cylinder temperature: 290 ° C., mold temperature: 100 Molding was performed under the conditions of ° C., injection speed: 60 mm / second, injection pressure: 30 MPa, and the obtained dumbbell pieces were divided into two at equal intervals using a nipper. One dumbbell piece was again inserted into the mold and overmolded under the conditions shown in Table 2 to obtain a composite molded body. Table 2 shows the results of measuring the adhesive strength of the obtained composite molded body.

  As is clear from the results of Table 2, in Examples 1 to 7 using PEEK having a low melt viscosity, composite molded bodies having high adhesive strength were obtained compared to Examples 8 to 14 using PEEK having a high melt viscosity. Obtained.

Example 15
Using an injection molding machine (Robotshot S-2000 i-100B), the casing is molded from polycarbonate under the conditions of cylinder temperature: 290 ° C, mold temperature: 100 ° C, injection speed: 60mm / sec, injection pressure: 30MPa. After that, it was inserted again into the mold, and the guide part was overmolded with PEEEK (1000G) under the same conditions as in Example 1 to produce the FOSB (only the housing part and the guide part) shown in FIGS. . The FOSB 1 has a substantially rectangular housing portion 2 with an internal size of 300 mm × 330 mm × 600 mm, and six pairs of guide portions 3 (width 30 mm × length) formed on the opposing inner walls of the housing portion 2 at equal intervals. 350 mm × thickness 5 mm).

Example 16
As shown in FIG. 4, PEEK (1000G) has a guide portion including an end portion 3a (length 50 mm) on the opening side of the housing portion and an end portion 3c (length 50 mm) on the bottom side of the housing portion. And the central portion 3b was formed of polycarbonate to produce FOSB1. As a molding method, after molding the center part of the guide part with polycarbonate under the conditions of cylinder temperature: 290 ° C., mold temperature: 100 ° C., injection speed: 60 mm / second, injection pressure: 30 MPa using an injection molding machine, After the obtained molded body was inserted into a mold, PEEK (1000G) was overmolded under the same conditions as in Example 1 to produce a guide part as a composite molded body. Furthermore, this composite molded body is inserted into a mold, and the casing is molded by overmolding with polycarbonate under the conditions of cylinder temperature: 290 ° C., mold temperature 100 ° C., injection speed: 60 mm / second, injection pressure: 30 MPa. did.

Comparative Example 1
FOSB was produced in the same manner as in Example 1 except that polycarbonate was used instead of PEEK as the resin for forming the guide portion.

  Table 3 shows the results of evaluating the insertability of the silicon wafer for the FOSBs obtained in Examples 15 to 16 and Comparative Example 1.

  As is clear from the results in Table 3, in all of the examples, the silicon wafer could be inserted smoothly, whereas in the comparative example, 27% of the silicon wafer could not be inserted smoothly.

  The FOSB of the present invention can be used for transporting a semiconductor wafer such as a silicon wafer.

DESCRIPTION OF SYMBOLS 1 ... Front opening shipping box 2 ... Housing | casing part 3 ... Guide part 4 ... Cover part 5 ... Semiconductor wafer

Claims (8)

  A housing portion that can accommodate a plurality of semiconductor wafers, a lid portion that can seal the semiconductor wafer to the housing portion, and a plurality of protrusions that protrude from the inner wall of the housing portion, A front opening shipping box for transporting the semiconductor wafer, wherein the housing portion includes polycarbonate resin, and the guide portion is a semiconductor wafer. A front opening shipping box containing an aromatic polyetherketone resin on at least a part of the contact surface with the surface.   The front opening shipping box according to claim 1, wherein the casing and the guide are integrated by welding.   The front opening shipping box according to claim 1 or 2, wherein the aromatic polyether ketone resin is a polyether ether ketone resin. The front opening shipping box according to any one of claims 1 to 3, wherein the aromatic polyetherketone resin has a melt viscosity of 170 Pa · s or less under conditions of a temperature of 400 ° C and a shear rate of 1216 sec- ¹ .   The housing part has a substantially rectangular parallelepiped shape or a substantially rectangular parallelepiped shape, and the guide part protrudes oppositely on both sides of the inner wall of the opposing housing part, and is orthogonal to the lid part at intervals between the inner walls. The front opening shipping box according to any one of claims 1 to 4, wherein the front opening shipping box is formed of a plurality of protrusions extending in a direction to be moved.   6. The front opening shipping box according to claim 5, wherein the protrusion is formed of an aromatic polyether ketone resin at least at the end on the lid side and the end on the bottom side of the casing.   The manufacturing method of the front opening shipping box of any one of Claims 1-6 including the welding process of welding a housing | casing part and a guide part.   The manufacturing method according to claim 7, wherein in the fusing step, the casing portion and the guide portion are thermally fused by overmolding.

Images