JP2015176968A - Light emitting device, manufacturing method for the same, light source for illumination and lighting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a light emitting device, etc. that can be enhanced in productivity by efficiently coating a sealing material.SOLUTION: A light emitting device 100 has a board 10, a first light emitting element array 21 and a second light emitting element array 22 each of which is constructed by connecting, in series, plural LED chips which contain red LED chips 20r and blue LED chips 20b and are packaged on the board 10, the first and second light emitting element arrays 21 and 22 being connected to each other in parallel, and a first sealing member 30a for sealing red LED chips 20r contained in a first light emitting element array 21 and red LED chips 20r contained in a second light emitting element array 22 over the first light emitting element array 21 and the second light emitting element array 22.

Description

  The present invention relates to a light-emitting device in which a light-emitting element mounted on a substrate is sealed with a light-transmitting resin.

  BACKGROUND Semiconductor light-emitting elements such as light emitting diodes (LEDs) are widely used in various lighting devices such as lighting applications and display applications as high-efficiency and space-saving light sources.

  Further, a COB (Chip On Board) type light emitting module (light emitting device) in which an LED mounted on a substrate is sealed with a translucent resin is known (for example, see Patent Document 1).

  As a method of applying a translucent resin in manufacturing such a light emitting device, there is a line coating method. In the line coating method, the dispenser is moved along the array of LEDs mounted on the substrate while discharging a predetermined amount of translucent resin from the dispenser.

JP 2011-146640 A

  By the way, in the light emitting device as described above, in order to improve the color rendering properties of light emitted from the light emitting device, a plurality of types of LEDs having different emission colors are used, and furthermore, different sealing members (translucent members) are used for each type of LED. May be applied. In such a case, it is difficult to efficiently apply the sealing member by the above-described line application method.

  Therefore, the present invention provides a light emitting device and the like whose productivity has been improved by efficiently applying a sealing member.

  A light-emitting device according to one embodiment of the present invention includes a substrate and a plurality of light-emitting elements mounted on the substrate including a first light-emitting element and a second light-emitting element having different emission colors, which are each connected in series. A first light emitting element array and a second light emitting element array connected in parallel to each other, and the first light emitting element included in the first light emitting element array and the first light emitting element included in the second light emitting element array. And a first sealing member for sealing across the first light emitting element array and the second light emitting element array.

  Furthermore, you may provide the 2nd sealing member which seals said 2nd light emitting element along the light emitting element row | line | column to which the said 2nd light emitting element belongs.

  Further, the second light emitting element included in the first light emitting element array and the second light emitting element included in the second light emitting element array are further divided into the first light emitting element array and the second light emitting element array. You may provide the 2nd sealing member sealed over.

  The first light emitting element may emit red light, and the second light emitting element may emit blue light.

  The first light emitting element may be a red LED having a peak wavelength of an emission spectrum of 600 nm to 645 nm, and the second light emitting element may be a blue LED having a peak wavelength of an emission spectrum of 430 nm to 500 nm. .

  The first sealing member may be a translucent resin material that does not include a phosphor, and the second sealing member may be a translucent resin material that includes a phosphor.

  The second sealing member may be a translucent resin material in which a phosphor is added to the first sealing member.

  The peak wavelength of the emission spectrum of the phosphor contained in the second sealing member may be 530 nm or more and 570 nm or less.

  The first sealing member may be a silicone resin that does not include a phosphor, and the second sealing member may be a translucent silicone resin that includes a phosphor.

  Each of the first light emitting element array and the second light emitting element array includes a plurality of the first light emitting elements, and each of the first light emitting element array and the second light emitting element array The first light emitting element may not be adjacent to the other first light emitting elements.

  In the method for manufacturing a light emitting device according to any one of the above aspects, the first light emitting element included in the first light emitting element array and the first light emitting element included in the second light emitting element array A first step of sealing across the element row and the second light emitting element row; and a second step of sealing the second light emitting element with the second sealing member.

  The first sealing member is a translucent resin material that does not include a phosphor, and the second sealing member is a translucent resin material that includes a phosphor, and the first step includes It may be performed after the second step.

  An illumination light source according to an aspect of the present invention includes the light-emitting device according to any one of the above aspects.

  An illumination device according to one embodiment of the present invention includes the light-emitting device according to any one of the above embodiments.

  ADVANTAGE OF THE INVENTION According to this invention, the light-emitting device etc. with which productivity was improved can be implement | achieved by apply | coating a sealing member efficiently.

FIG. 1 is an external perspective view of the light emitting device according to Embodiment 1. FIG. FIG. 2 is a plan view of the light emitting device according to the first embodiment. FIG. 3 is a cross-sectional view of the light emitting device taken along line AA in FIG. FIG. 4 is a flowchart of the method for manufacturing the light emitting device according to the first embodiment. FIG. 5 is a diagram for explaining a method of sealing an LED chip. FIG. 6 is a plan view of a light emitting device in which the arrangement of a plurality of LED chips is different. FIG. 7 is a plan view of a light emitting device in which blue LED chips are collectively sealed across a plurality of light emitting element arrays. 8 is a cross-sectional view of the light emitting device taken along the line BB in FIG. FIG. 9 is a plan view of a light emitting device in which a plurality of LED chips are connected through wiring provided on a substrate. FIG. 10 is a cross-sectional view of the light emitting device taken along the line CC of FIG. FIG. 11 is a diagram showing a schematic configuration of the light bulb shaped lamp according to the second embodiment. FIG. 12 is a cross-sectional view of the lighting apparatus according to Embodiment 3. FIG. 13 is an external perspective view of the lighting device and its peripheral members according to Embodiment 3.

  Hereinafter, a light-emitting device and the like according to embodiments will be described with reference to the drawings. Each embodiment described below shows one specific example of the present invention. Therefore, the numerical values, shapes, materials, components, arrangement positions and connection forms of components shown in the following embodiments are merely examples, and are not intended to limit the present invention. Therefore, among the constituent elements in the following embodiments, constituent elements that are not described in the independent claims indicating the highest concept of the present invention are described as optional constituent elements.

  Each figure is a schematic diagram and is not necessarily shown strictly. Moreover, in each figure, the same code | symbol is attached | subjected to the substantially same structure, and the overlapping description may be abbreviate | omitted or simplified.

(Embodiment 1)
First, the first embodiment will be described.

[Light emitting device]
Hereinafter, the structure of the light-emitting device according to Embodiment 1 will be described with reference to the drawings. FIG. 1 is an external perspective view of the light emitting device according to Embodiment 1. FIG. FIG. 2 is a plan view of light-emitting device 100 according to Embodiment 1. FIG. FIG. 3 is a cross-sectional view of the light emitting device taken along line AA in FIG. Note that the bonding wires are not shown in FIG. 1, and the arrangement of the bonding wires is different between FIGS. 2 and 3 for explanation.

  As shown in FIGS. 1 to 3, the light-emitting device 100 includes a substrate 10, a first light-emitting element array 21, a second light-emitting element array 22, and a third light-emitting element composed of a plurality of LED chips mounted on the substrate 10. Each of the element rows 23 is provided.

  Each light emitting element array is a light emitting element array extending in the Y direction, and includes a plurality of red LED chips 20r and a plurality of blue LED chips 20b. As shown in FIG. 2, one light emitting element row has three red LED chips 20r and seven blue LED chips 20b. That is, in the plurality of light emitting element arrays included in the light emitting device 100, the number of red LED chips 20r and the number of blue LED chips 20b included in one light emitting element array are the same as the number of red LED chips 20r included in other light emitting element arrays. The number and the number of blue LED chips 20b are the same. The red LED chip 20r is an example of a first light emitting element, and the blue LED chip 20b is an example of a second light emitting element.

  The LED chips constituting one light emitting element array are arranged in a straight line in the Y direction (longitudinal direction of the rectangular substrate 10). As shown in FIG. 2, the LED chips included in each light emitting element array are mounted so that their positions in the X direction (the short direction of the rectangular substrate 10) are aligned. That is, a plurality of LED chips are mounted on the substrate 10 in a matrix.

  As shown in FIGS. 2 and 3, in one light emitting element row, the cathode electrode of one LED chip is connected to the anode electrode of the LED chip adjacent to the LED chip by a bonding wire 50. That is, one light emitting element row is constituted by a plurality of LED chips (electrically) connected in series.

  In addition, the anode electrode (or cathode electrode) of the LED chip located at the end of each light emitting element array is connected to the wiring 40 a (or wiring 40 b) provided on the substrate 10 by the bonding wire 50. The wiring 40a and the wiring 40b are supplied with electric power for causing each light emitting element row to emit light. That is, each light emitting element row | line | column with which the light-emitting device 100 is provided is connected (electrically) in parallel.

  In addition, as a metal material of the wiring 40a, the wiring 40b, and the bonding wire 50, for example, Au (gold), silver (Ag), copper (Cu), or the like is employed.

  In each light emitting element row, the blue LED chip 20b is sealed along the light emitting element row to which the blue LED chip 20b belongs (along the Y direction) by the second sealing member 30b. On the other hand, the red LED chip 20r is collectively sealed across the respective light emitting element rows by the first sealing member 30a.

  The first sealing member 30a is formed of, for example, a transparent resin, and the red light emitted from the red LED chip 20r is emitted from the first sealing member 30a to the outside without being subjected to wavelength conversion (color conversion). Is done.

  Moreover, the 2nd sealing member 30b is formed with resin containing yellow fluorescent substance as a wavelength conversion material, for example, and the blue light discharge | released from blue LED chip 20b passes the 2nd sealing member 30b. Is converted to white light.

  Thus, the color rendering property of the light emitted from the light emitting device 100 is improved by adding the red light from the red LED chip 20r to the white light generated by the combination of the blue LED chip 20b and the yellow phosphor. Is done.

  As described above, the light emitting device 100 according to Embodiment 1 is an LED module having a so-called COB (Chip On Board) structure in which the LED chip is directly mounted on the substrate 10. Hereinafter, each component of the light emitting device 100 will be described.

[substrate]
The substrate 10 is, for example, a metal base substrate or a ceramic substrate. The substrate 10 may be a resin substrate having a resin as a base material.

  As the ceramic substrate, an alumina substrate made of aluminum oxide (alumina), an aluminum nitride substrate made of aluminum nitride, or the like is employed. As the metal base substrate, for example, an aluminum alloy substrate, an iron alloy substrate, a copper alloy substrate, or the like having an insulating film formed on the surface is employed. As the resin substrate, for example, a glass epoxy substrate made of glass fiber and epoxy resin is employed.

  As the substrate 10, for example, a substrate having a high light reflectance (for example, a light reflectance of 90% or more) may be employed. By adopting a substrate having a high light reflectance as the substrate 10, the light emitted from the LED chip can be reflected on the surface of the substrate 10. As a result, the light extraction efficiency of the light emitting device 100 is improved. An example of such a substrate is a white ceramic substrate based on alumina.

  On the other hand, a light-transmitting substrate having a high light transmittance may be employed as the substrate 10. By adopting a translucent substrate as the substrate 10, the light emitted from the LED chip is transmitted through the inside of the substrate 10 and is emitted from the surface (back surface) on which the LED chip is not mounted. Examples of such a substrate include a transparent ceramic substrate made of polycrystalline alumina or aluminum nitride, a transparent glass substrate made of glass, a crystal substrate made of crystal, a sapphire substrate made of sapphire, or a transparent resin substrate made of a transparent resin material. Illustrated.

  In the first embodiment, the substrate 10 is rectangular, but may be other shapes such as a circle.

[LED and sealing member]
The plurality of light emitting elements mounted on the substrate 10 include a plurality of red LED chips 20r and a plurality of blue LED chips 20b.

  Each of the red LED chip 20r and the blue LED chip 20b is a bare chip that emits monochromatic visible light. As the red LED chip 20r, for example, a semiconductor light emitting element made of an AlGaInP-based material and having a central wavelength (peak wavelength of emission spectrum) of about 600 nm to 645 nm is employed.

  As the blue LED chip 20b, for example, a gallium nitride based semiconductor light emitting element made of an InGaN based material and having a center wavelength (peak wavelength of emission spectrum) of 430 nm to 500 nm is employed.

  As described above, in Embodiment 1, the red LED chip 20r is collectively sealed across the plurality of light emitting element rows by the first sealing member 30a, and the blue LED chip 20b is the second sealing member. 30b is sealed along the light emitting element row to which the blue LED chip 20b belongs. In other words, the red LED chip 20r is sealed by the first sealing member 30a formed in a shape extending in a direction intersecting the light emitting element array when seen in plan, and the blue LED chip 20b is seen when seen in plan. It is sealed by a second sealing member 30b formed in a shape extending along the light emitting element row.

  The first sealing member 30a is made of a translucent resin material such as silicone resin, and transmits light from the red LED chip 20r to be emitted to the outside. That is, the first sealing member 30a does not have a function of wavelength conversion (color conversion). The first sealing member 30a increases the luminous efficiency of the red LED chip 20r by relaxing the refractive index (reducing total reflection generated when light is emitted from the red LED chip 20r into the air), and the red color It is arranged for the purpose of protecting the LED chip 20r.

  The second sealing member 30b is made of a translucent resin material containing yellow phosphor particles. For example, a silicone resin is used as the translucent resin material. As yellow phosphor particles, for example, yttrium, aluminum, garnet (YAG) yellow phosphor particles are employed.

  With this configuration, part of the blue light emitted from the blue LED chip 20b is converted into yellow light by the yellow phosphor particles contained in the second sealing member 30b. The center wavelength of yellow light (the peak wavelength of the emission spectrum) is, for example, not less than 530 nm and not more than 570 nm.

  Then, the blue light that has not been absorbed by the yellow phosphor particles and the yellow light that has been wavelength-converted by the yellow phosphor particles are diffused and mixed in the second sealing member 30b, whereby the second sealing member 30b is emitted as white light.

  In Embodiment 1, the translucent resin material constituting the first sealing member 30a and the translucent resin material (resin material portion excluding the phosphor) constituting the second sealing member 30b are as follows: Are substantially the same (both are silicone resins). That is, the second sealing member 30b is a translucent resin material in which a phosphor is added to the first sealing member 30a. Thus, by sharing the translucent resin material constituting the first sealing member 30a and the translucent resin material constituting the second sealing member 30b, the cost of the material can be reduced. .

  A light diffusing material such as silica may be dispersed in each of the first sealing member 30a and the second sealing member 30b. The first sealing member 30a and the second sealing member 30b are not necessarily formed of a resin material, and are formed of an inorganic material such as a low-melting glass or a sol-gel glass in addition to an organic material such as a fluorine resin. May be.

  In the first embodiment, the ratio of the number of red LED chips 20r and the blue LED chip 20b mounted on the substrate 10 is 3: 7, but the ratio of the numbers is not limited to this. Typically, the ratio of the number of red LED chips 20r and blue LED chips 20b is set to about 1: k (1 ≦ k ≦ 2). That is, the number of red LED chips 20r mounted on the substrate 10 is set to be equal to or less than the number of blue LED chips 20b mounted on the substrate 10.

  In the first embodiment, as shown in FIG. 2, in one light emitting element row, one red LED chip 20r is not adjacent to another red LED chip 20r. That is, the red LED chips 20r are not continuously arranged in the Y direction of FIG. Further, the red LED chip 20r included in one light emitting element row is not adjacent to the red LED chip 20r included in the light emitting element row adjacent to the light emitting element row. That is, the red LED chips 20r are not continuously arranged in the X direction of FIG.

  In addition, as shown in FIG. 3, the second sealing member 30b is higher than the first sealing member 30a in the portion where the first sealing member 30a and the second sealing member 30b are adjacent (Z direction). + Side). That is, in the light emitting device 100, there is a portion where the first sealing member 30a overlaps the second sealing member 30b. This is because in the first embodiment, in the manufacture of the light emitting device 100, the second sealing member 30b is applied after the second sealing member 30b is applied and the blue LED chip 20b is sealed.

  When the first sealing member 30a is applied before the second sealing member 30b, the blue LED chip 20b is completely covered with the second sealing member 30b due to the presence of the first sealing member 30a applied first. May not be sealed. In such a case, there is a possibility that the blue light emitted from the blue LED chip 20b does not pass through the second sealing member 30b but passes through only the first sealing member 30a and is emitted to the outside.

  Here, as described above, since the first sealing member 30a does not have a wavelength conversion function, the light emitting device is caused by blue leakage light that passes through only the first sealing member 30a and is emitted to the outside. There is a possibility that a color shift of white light emitted from 100 (color shift with respect to a design value) may occur.

  On the other hand, if the first sealing member 30a is applied after the blue LED chip 20b is sealed by the second sealing member 30b as in the first embodiment, the color due to the blue leakage light as described above The occurrence of deviation can be suppressed.

[Method for Manufacturing Light Emitting Device]
Next, a method for manufacturing the light emitting device 100 will be described with reference to FIG. FIG. 4 is a flowchart of a method for manufacturing the light emitting device 100.

  In manufacturing the light emitting device 100, first, the red LED chip 20r and the blue LED chip 20b are mounted on the substrate 10 (S101). Next, the blue LED chip 20b is individually sealed in a dot shape by the second sealing member 30b (S102). After all the blue LED chips 20b are sealed, the red LED chips 20r are individually sealed in dots by the first sealing member 30a (S103).

  Here, the LED chip sealing method will be described in detail with reference to FIG. FIG. 5 is a diagram for explaining a method of sealing an LED chip. In addition, although the following description demonstrates the example which apply | coats the 2nd sealing member 30b to the blue LED chip 20b using the dispenser 60, it is the same also when apply | coating the 1st sealing member 30a to the red LED chip 20r. is there.

  First, as shown in FIG. 5A, the tip of the nozzle of the dispenser 60 is disposed immediately above the blue LED chip 20b mounted on the substrate 10 (substantially the central region of the light emitting surface).

  Next, as shown in FIG. 5B, the second sealing member 30b is discharged from the dispenser 60 onto the blue LED chip 20b. Then, as shown in FIG. 5C, the nozzle tip of the dispenser 60 is moved to a position directly above the adjacent blue LED chip 20b while discharging the second sealing member 30b.

  The movement direction of the dispenser 60 at this time is the arrangement direction (Y direction) of the light emitting element rows in the first embodiment. In addition, when the 1st sealing member 30a is apply | coated to the red LED chip 20r, the moving direction of the dispenser 60 is a direction (direction which cross | intersects Y direction) which cross | intersects the row direction of a light emitting element row | line | column.

  When the application of the second sealing member 30b is completed, the dispenser 60 is lifted as shown in FIG.

  Although the application order of the sealing member with respect to a some LED chip is not specifically limited, In Embodiment 1, it applies as follows as an example.

  The dispenser 60 first applies the second sealing member 30b in the order of the first light emitting element array 21, the second light emitting element array 22, and the third light emitting element array 23.

  Specifically, the dispenser 60 first applies the second sealing member 30b to the plurality of blue LED chips 20b included in the first light emitting element array 21 in order from the end in the Y direction. Specifically, the nozzle tip of the dispenser 60 moves in the Y direction from one end to the other end of the first light emitting element array 21 while discharging the second sealing member 30b. At this time, the tip of the nozzle of the dispenser 60 discharges the second sealing member 30b when positioned above the blue LED chip 20b, but when the nozzle tip is positioned above the red LED chip 20r, the second sealing member 30b. Do not discharge.

  As a result, only the blue LED chip 20b included in the first light emitting element array 21 is sealed by the second sealing member 30b.

  The dispenser 60 is similar to the plurality of blue LED chips 20b included in the second light emitting element array 22 and the third light emitting element array 23 after the application of the second sealing member 30b in the first light emitting element array 21 is completed. The second sealing member 30b is applied in this order from the end in the Y direction.

  After finishing the application of all the blue LED chips 20b on the substrate 10, the dispenser 60 applies the first sealing member 30a.

  Specifically, the dispenser 60 applies the first sealing member 30a in a substantially broken line shape connecting the three red LED chips 20r arranged at positions closest to the wiring 40a in each light emitting element row. At this time, the nozzle tip of the dispenser 60 moves across each light emitting element row so as to pass over the three red LED chips 20r to be coated while discharging the first sealing member 30a. As a result, the first sealing member 30a is formed in a shape such as an inequality sign (<) across each light emitting element array (see FIG. 2). Thereafter, the first sealing member 30a is applied to the other red LED chips 20r (such as the red LED chip 20r disposed at the position closest to the wiring 40b in each light emitting element row) by the same method.

  In addition, depending on arrangement | positioning of the red LED chip 20r, it is possible to apply | coat the 1st sealing member 30a in substantially linear shape (line shape). For example, when each light emitting element row (first light emitting element row 21a, second light emitting element row 22a, and third light emitting element row 23a) is provided as in the light emitting device 100a shown in FIG. The stop member 30a can be applied in a line.

  In the first embodiment, the first sealing member 30a is applied after the second sealing member 30b is applied in order to suppress the occurrence of the color shift due to the blue leakage light as described above (see FIG. 4), the second sealing member 30b may be applied after the first sealing member 30a is applied.

[Effects]
As described above, the light emitting device 100 includes the substrate 10, the first light emitting element array 21, and the second light emitting element array 22. Each of the first light-emitting element array 21 and the second light-emitting element array 22 is configured by connecting a plurality of LED chips mounted on the substrate 10 including the red LED chip 20r and the blue LED chip 20b in series. Further, the first light emitting element array 21 and the second light emitting element array 22 are connected in parallel.

  Then, the light emitting device 100 converts the red LED chip 20r included in the first light emitting element array 21 and the red LED chip 20r included in the second light emitting element array 22 into the first light emitting element array 21 and the second light emitting element array 22. The first sealing member 30a is provided to be sealed across.

  Conventionally, the red LED chips 20r distributed on the substrate 10 are individually sealed. On the other hand, according to such application | coating of the 1st sealing member 30a, the red LED chip 20r disperse | distributed and arrange | positioned on the board | substrate 10 can be sealed collectively. That is, the first sealing member 30a can be efficiently applied. Such application of the first sealing member 30a is particularly effective in configurations such as the light emitting devices 100 and 100a in which one red LED chip 20r is not adjacent to another red LED chip 20r.

  Moreover, when the 1st sealing member 30a was apply | coated along the light emitting element row | line | column conventionally, the 1st sealing member 30a was not provided between the light emitting element row | line | columns. On the other hand, in the light emitting device 100, the first sealing member 30a is disposed between the light emitting element rows and the light emitting element rows, and the first sealing member 30a functions as a light guide member. For this reason, in the light emitting device 100, red light emitted from the red LED chip 20r can be guided between the light emitting element rows, and the light emitting device 100 as a whole has improved color mixing of red light (color). Unevenness is reduced).

[Modification 1]
In the said Embodiment 1, the blue LED chip 20b which comprises each light emitting element row | line | column was sealed along the light emitting element row | line | column to which the said blue LED chip 20b belongs by the 2nd sealing member 30b. However, the blue LED chips 20b may be collectively sealed across a plurality of light emitting element rows.

  Hereinafter, Modification Example 1 of the light-emitting device 100 according to Embodiment 1 will be described. FIG. 7 is a plan view of a light emitting device in which blue LED chips 20b are collectively sealed across a plurality of light emitting element arrays. 8 is a cross-sectional view of the light emitting device taken along the line BB in FIG. In the following description, descriptions of substantially the same components as the light emitting device 100 are omitted.

  7 and 8, the light emitting device 100b includes a first light emitting element array 21b, a second light emitting element array 22b, and a third light emitting element array 23b.

  The blue LED chip 20b included in each light emitting element row is sealed across the light emitting element row by the second sealing member 30b. Specifically, a total of three blue LED elements, one from each light emitting element, are collectively sealed in a substantially polygonal line by the first sealing member 30a as described in FIG. The two blue LED chips 20b closest to the wiring 40a in each of the first light emitting element array 21b and the third light emitting element array 23b, and the blue LED chip 20b closest to the wiring 40b in the second light emitting element array 22b are The first sealing member 30a is individually applied.

  In such a light emitting device 100b, the second sealing member 30b is disposed between the light emitting element rows, and the second sealing member 30b functions as a light guide member. For this reason, in the light-emitting device 100, the blue light emitted from the blue LED chip 20b can be guided between the light-emitting element rows and the light-emitting device rows, and the luminance unevenness is reduced as a whole of the light-emitting device 100b. Can play.

  Note that the blue LED chip 20b may be sealed by other methods such as being individually sealed in a dot shape by the second sealing member 30b.

[Modification 2]
In the first embodiment, the plurality of LED chips mounted on the substrate 10 including the red LED chip 20r and the blue LED chip 20b are connected in series by the chip to chip with the bonding wires 50. However, the plurality of LED chips may be connected via wiring (metal film) provided on the substrate 10.

  Hereinafter, Modification 2 of the light emitting device 100 according to Embodiment 1 will be described. FIG. 9 is a plan view of a light-emitting device in which a plurality of LED chips are connected through wiring provided on the substrate 10. FIG. 10 is a cross-sectional view of the light emitting device taken along the line CC of FIG. In the following description, descriptions of substantially the same components as the light emitting device 100 are omitted.

  As shown in FIGS. 9 and 10, the light emitting device 100c includes a first light emitting element array 21c, a second light emitting element array 22c, and a third light emitting element array 23c.

  In the light emitting device 100c, in one light emitting element row, the cathode electrode of one LED chip (first LED chip) is provided between the LED chip and the adjacent LED chip (second LED chip). It is connected to the wiring 40c by a bonding wire 50. The wiring 40c and the anode electrode of the second LED chip are connected by a bonding wire 50. That is, in the light emitting device 100a, one light emitting element array is configured by a plurality of LED chips connected in series (electrically) via wiring provided on the substrate 10.

  As shown in FIGS. 9 and 10, the LED chip located at the end of each light emitting element array is connected to a wiring 40 a (or wiring 40 b) provided on the substrate 10 by a bonding wire 50. The wiring 40a and the wiring 40b are supplied with electric power for causing each light emitting element row to emit light.

  In each light emitting element row, the blue LED chip 20b is sealed along the light emitting element row to which the blue LED chip 20b belongs (along the Y direction) by the second sealing member 30b. On the other hand, the red LED chip 20r is collectively sealed across the respective light emitting element rows by the first sealing member 30a.

  Also in such a light emitting device 100c, since the first sealing member 30a is applied across the light emitting element rows, even if the red LED chips 20r are dispersed and arranged, the first One sealing member 30a is applied. In addition, the color mixture of red light is improved (color unevenness is reduced) in the entire light emitting device 100c.

  Further, in the configuration in which a plurality of LED chips are connected via the wiring 40c provided on the substrate 10 as in the light emitting device 100c, the blue LED chip 20b is also collectively sealed across each light emitting element array. May be.

(Embodiment 2)
Next, the structure of the light bulb shaped lamp 150 according to Embodiment 2 will be described with reference to FIG.

  FIG. 11 is a diagram showing a schematic configuration of the light bulb shaped lamp 150 according to the second embodiment.

  A light bulb shaped lamp 150 shown in FIG. 11 is an example of a light source for illumination, and includes the light emitting device 100 according to the first embodiment.

  The light bulb shaped lamp 150 includes a translucent globe 151, a light emitting device 100 as a light source, a housing 156 that houses a drive circuit that supplies power to the light emitting device 100, and a base 158 that receives power from the outside. .

  The AC power received by the base 158 is converted into DC power by the drive circuit and supplied to the light emitting device 100. Note that when DC power is supplied to the base 158, the drive circuit may not have a function of converting DC to AC.

  In the second embodiment, the light emitting device 100 is supported by the support column 153 and is disposed at the center of the globe 151. The column 153 is a metal rod provided so as to extend from the vicinity of the opening of the globe 151 toward the inside of the globe 151.

  Specifically, the support column 153 is connected to a support plate 154 disposed in the vicinity of the opening of the globe 151.

  The light emitting device 100 may be directly supported by the support plate 154 instead of the support column 153. That is, the light emitting device 100 may be attached to the surface of the support plate 154 on the globe 151 side.

  The globe 151 is a translucent cover that transmits light from the light emitting device 100 to the outside. Note that the globe 151 in Embodiment 2 is made of a material that is transparent to the light from the light emitting device 100. As such a glove 151, for example, a glass bulb (clear bulb) made of silica glass that is transparent to visible light is employed.

  In this case, the light emitting device 100 accommodated in the globe 151 can be viewed from the outside of the globe 151.

  Note that the globe 151 is not necessarily transparent to visible light, and the globe 151 may have a light diffusion function. For example, a milky white light diffusing film may be formed by applying a resin or a white pigment containing a light diffusing material such as silica or calcium carbonate to the entire inner surface or outer surface of the globe 151. Further, the material of the globe 151 is not limited to a glass material, and a resin material such as a synthetic resin such as acrylic (PMMA) or polycarbonate (PC) may be used.

  Further, the shape of the globe 151 is not particularly limited. For example, when the light emitting device 100 is directly supported by the support plate 154 (when the support column 153 is not provided), a hemispherical globe 151 may be employed.

  The light bulb shaped lamp 150 includes the light emitting device 100 according to Embodiment 1, thereby reducing color unevenness and improving productivity.

  In the second embodiment, the light bulb shaped lamp 150 is exemplified as the illumination light source including the light emitting device 100 according to the first embodiment. However, the illumination light source including the light emitting device 100 is realized as a straight tube lamp. Also good.

  The light-emitting lamp 100 (illumination light source) may employ the light-emitting device 100a, the light-emitting device 100b, or the light-emitting device 100c described in Embodiment 1 instead of the light-emitting device 100.

(Embodiment 3)
Next, lighting device 200 according to Embodiment 3 will be described with reference to FIGS. 12 and 13.

  FIG. 12 is a cross-sectional view of lighting apparatus 200 according to Embodiment 3.

  FIG. 13 is an external perspective view of lighting apparatus 200 and its peripheral members according to Embodiment 3.

  As shown in FIG. 12 and FIG. 13, the lighting device 200 according to Embodiment 3 is a downlight or the like that irradiates light downward (such as a corridor or a wall) by being embedded in a ceiling of a house or the like, for example. This is an embedded illumination device.

  The illumination device 200 includes the light emitting device 100 according to the first embodiment. The lighting device 200 further includes a substantially bottomed tubular instrument body configured by combining the base 210 and the frame body part 220, and a reflector 230 and a translucent panel 240 disposed in the instrument body. Is provided.

  The base 210 is a mounting base to which the light emitting device 100 is attached and a heat sink that dissipates heat generated in the light emitting device 100. Base 210 is formed in a substantially cylindrical shape using a metal material, and is made of aluminum die casting in the third embodiment.

  A plurality of radiating fins 211 projecting upward are provided on the upper portion (ceiling side portion) of the base portion 210 at regular intervals along one direction. Thereby, the heat generated in the light emitting device 100 can be efficiently dissipated.

  The frame body part 220 has a substantially cylindrical cone part 221 having a reflection surface on the inner surface, and a frame body part 222 to which the cone part 221 is attached. The cone portion 221 is formed using a metal material, and can be manufactured by drawing or press-molding an aluminum alloy or the like, for example. The frame main body 222 is formed of a hard resin material or a metal material. The frame body part 220 is fixed by attaching the frame body body part 222 to the base part 210.

  The reflection plate 230 is an annular frame-shaped (funnel-shaped) reflection member having an internal reflection function. The reflector 230 can be formed using a metal material such as aluminum. The reflector 230 may be formed of a hard white resin material instead of a metal material.

  The translucent panel 240 is a translucent member having light diffusibility and translucency. The translucent panel 240 is a flat plate disposed between the reflection plate 230 and the frame body portion 220, and is attached to the reflection plate 230. The translucent panel 240 can be formed in a disk shape with a transparent resin material such as acrylic or polycarbonate.

  Note that the lighting device 200 may not include the translucent panel 240. By not providing the translucent panel 240, the luminous flux of light emitted from the lighting device 200 can be improved.

  As shown in FIG. 13, the lighting device 200 is connected to a lighting device 250 that supplies lighting power to the light emitting device 100 and a terminal block 260 that relays AC power from a commercial power source to the lighting device 250. .

  The lighting device 250 and the terminal block 260 are fixed to a mounting plate 270 provided separately from the instrument body. The mounting plate 270 is formed by bending a rectangular plate member made of a metal material. The lighting device 250 is fixed to the lower surface of one end portion in the longitudinal direction, and the terminal block 260 is mounted on the lower surface of the other end portion. Fixed. The mounting plate 270 is connected to a top plate 280 fixed to the upper part of the base 210 of the instrument body.

  The illumination device 200 includes the light-emitting device 100 according to Embodiment 1, so that color unevenness is reduced and productivity is improved.

  In the third embodiment, the downlight is exemplified as the lighting device 200 including the light emitting device 100 according to the first embodiment. However, the lighting device including the light emitting device 100 is another lighting device such as a spotlight or a ceiling light. It may be realized as.

  Further, instead of the light emitting device 100, the lighting device 200 may employ the light emitting device 100a, the light emitting device 100b, or the light emitting device 100c described in Embodiment 1.

(Other embodiments)
As mentioned above, although the light-emitting device which concerns on this invention, its manufacturing method, the light source for illumination, and the illuminating device was demonstrated based on Embodiment 1-3, this invention is not limited to these embodiment. Absent.

  For example, although the light emitting device according to the above embodiment emits white light by the combination of the blue LED chip 20b and the yellow phosphor, the configuration for emitting white light is not limited thereto.

  For example, this may be combined with the blue LED chip 20b using a phosphor-containing resin containing a red phosphor and a green phosphor. Alternatively, an ultraviolet LED chip that emits ultraviolet light having a shorter wavelength than the blue LED chip 20b, and blue phosphor particles that emit blue light, red light, and green light when excited mainly by ultraviolet light, green You may combine a fluorescent substance particle and a red fluorescent substance particle.

  Further, in the light emitting device according to the above embodiment, the light emitting element array is configured by arranging a plurality of LED chips in a straight line, but is not limited to such a configuration. For example, the light emitting element array may be configured by arranging a plurality of LED chips in an arc shape.

  Further, the number of light emitting element arrays and the number of LED chips included in the light emitting element arrays are not particularly limited. For example, the light emitting element row may include an LED chip (third light emitting element) having a different emission color from any of the red LED chip 20r and the blue LED chip 20b.

  Moreover, in the said embodiment, the LED chip was illustrated as a light emitting element used for a light-emitting device. However, other types of solid-state light emitting elements such as a semiconductor light emitting element such as a semiconductor laser or an EL element such as an organic EL (Electro Luminescence) or an inorganic EL may be employed as the light emitting element included in the light emitting device.

  In addition, it is realized by variously conceiving various modifications conceived by those skilled in the art to each embodiment, or by arbitrarily combining the components and functions in each embodiment without departing from the spirit of the present invention. This form is also included in the present invention.

10 Substrate 20r Red LED chip (first light emitting element)
20b Blue LED chip (second light emitting element)
21, 21a, 21b, 21c First light emitting element row 22, 22a, 22b, 22c Second light emitting element row 23, 23a, 23b, 23c Third light emitting element row 30a First sealing member 30b Second sealing member 40a, 40b, 40c Wiring 50 Bonding wire 60 Dispenser 100, 100a, 100b, 100c Light emitting device 150 Light bulb shaped lamp (light source for illumination)
151 Globe 153 Post 154 Support plate 156 Housing 158 Base 200 Illumination device 210 Base 211 Radiation fin 220 Frame body 221 Cone portion 222 Frame body main body 230 Reflector plate 240 Translucent panel 250 Lighting device 260 Terminal block 270 Mounting plate 280 Top Board

Claims (14)

A substrate,
A plurality of light emitting elements mounted on the substrate, each including a first light emitting element and a second light emitting element having different emission colors, are connected in series to form a first light emitting element array and a second light emitting element array connected in parallel to each other. A light emitting element array;
The first light emitting element included in the first light emitting element array and the first light emitting element included in the second light emitting element array are sealed across the first light emitting element array and the second light emitting element array. A light emitting device comprising: a first sealing member that performs. The light emitting device according to claim 1, further comprising a second sealing member that seals the second light emitting element along a light emitting element array to which the second light emitting element belongs. Further, the second light-emitting element included in the first light-emitting element array and the second light-emitting element included in the second light-emitting element array span the first light-emitting element array and the second light-emitting element array. The light emitting device according to claim 1, further comprising a second sealing member for sealing. The first light emitting element emits red light,
The light emitting device according to claim 1, wherein the second light emitting element emits blue light. The first light emitting element is a red LED having a peak wavelength of an emission spectrum of 600 nm to 645 nm,
The light emitting device according to claim 4, wherein the second light emitting element is a blue LED having a peak wavelength of an emission spectrum of 430 nm to 500 nm. The first sealing member is a translucent resin material that does not contain a phosphor,
The light emitting device according to claim 1, wherein the second sealing member is a translucent resin material including a phosphor. The light emitting device according to claim 6, wherein the second sealing member is a translucent resin material in which a phosphor is added to the first sealing member. The light emitting device according to claim 6 or 7, wherein a peak wavelength of an emission spectrum of the phosphor contained in the second sealing member is not less than 530 nm and not more than 570 nm. The first sealing member is a silicone resin containing no phosphor,
The light emitting device according to claim 7, wherein the second sealing member is a translucent silicone resin containing a phosphor. Each of the first light emitting element array and the second light emitting element array includes a plurality of the first light emitting elements,
The said 1st light emitting element row | line | column and each said 2nd light emitting element row | line | column WHEREIN: One said 1st light emitting element is not adjacent to said other said 1st light emitting element. Light emitting device. It is a manufacturing method of the light emitting device according to any one of claims 1 to 10,
The first light emitting element included in the first light emitting element array and the first light emitting element included in the second light emitting element array are sealed across the first light emitting element array and the second light emitting element array. The first step to
And a second step of sealing the second light emitting element with the second sealing member. The first sealing member is a translucent resin material that does not contain a phosphor,
The method for manufacturing a light-emitting device according to claim 11, wherein the second sealing member is a translucent resin material including a phosphor. The first step is performed after the second step. An illumination light source comprising the light-emitting device according to claim 1. An illumination device comprising the light emitting device according to claim 1.

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