JP2015165490A5 - - Google Patents

Claims (14)

An anisotropic conductive film having a first connection layer and a second connection layer formed on one side thereof,
The first connection layer is a photopolymerization resin layer;
The second connection layer is a heat or photocation, anion or radical polymerizable resin layer;
Conductive particles for anisotropic conductive connection are arranged in a single layer on the second connection layer side surface of the first connection layer,
An anisotropic conductive film, wherein fine irregularities are provided on the surface of the first connection layer opposite to the second connection layer. An anisotropic conductive film having a first connection layer and a second connection layer formed on one side thereof,
The first connection layer is a photopolymerization resin layer;
The second connection layer is a heat or photocation, anion or radical polymerizable resin layer;
Conductive particles for anisotropic conductive connection are provided on the second connection layer side surface of the first connection layer in a single layer at regular intervals,
Fine irregularities are provided on the surface of the first connection layer opposite to the second connection layer.
An anisotropic conductive film characterized by that. The anisotropic conductive film according to claim 1 or 2, wherein the fine irregularities are provided in a regular pattern. The anisotropic conductive film according to any one of claims 1 to 3, wherein an average distance from the bottom of the concave portion of the fine unevenness to the apex of the convex portion is 1/50 to 10 times the average particle diameter of the conductive particles. The anisotropic conductive film according to any one of claims 1 to 4 , wherein the pitch of the fine uneven pattern is 1/50 to 10 times the average particle diameter of the conductive particles. First connection layer, anisotropy according to any one of claims 1 to 5, which is a photo-radical polymerization resin layer formed by photo-radical polymerization of a radical photopolymerizable resin layer containing acrylate compound and a photo-radical polymerization initiator Conductive film. First connection layer, further, anisotropic conductive film according to any one of claims 1 to 6 which contains an epoxy compound and a thermal or photo cationic or anionic polymerization initiator. The second connection layer is a heat containing an epoxy compound and heat or a photocation or anion polymerization initiator, or a heat or photocation or anion polymerizable resin layer, or a heat containing an acrylate compound and a heat or radical polymerization initiator, or the anisotropic conductive film according to any one of claims 1 to 7, which is a radical photopolymerizable resin layer. When the second connection layer is a heat or photocation or anion polymerizable resin layer containing an epoxy compound and heat or a photocation or anion polymerization initiator, further contains an acrylate compound and a heat or photoradical polymerization initiator The anisotropic conductive film according to claim 8 . It is a manufacturing method of the anisotropic conductive film of Claim 1, Comprising: The following processes (A)-(D):
Step (A)
Forming a photopolymerizable resin layer having fine irregularities on one surface using a master having fine irregularities formed thereon;
Process (B)
A step of arranging conductive particles in a single layer on the other side of the photopolymerizable resin layer provided with fine irregularities on one side;
Process (C)
The photopolymerizable resin layer in which the conductive particles are arranged is irradiated with ultraviolet rays to cause a radical photopolymerization reaction, thereby forming a first connection layer in which fine irregularities are provided on one side and the conductive particles are fixed on the other side. Step; and step (D)
The manufacturing method which has the process of forming the 2nd connection layer which consists of a heat | fever or a photocation, an anion, or a radical polymerizable resin layer in the other surface of the 1st connection layer to which the electroconductive particle was fix | immobilized. The manufacturing method of Claim 10 which performs the ultraviolet irradiation of a process (B) from the side in which the electrically conductive particle of the photopolymerizable resin layer arranged. It is a manufacturing method of the anisotropic conductive film of Claim 1, Comprising: The following processes (AA)-(EE):
Process (AA)
Forming a photopolymerizable resin layer having fine irregularities on one surface using a master having fine irregularities formed thereon;
Process (BB)
A step of arranging conductive particles in a single layer on the other side of the photopolymerizable resin layer provided with fine irregularities on one side;
Process (CC)
The photopolymerizable resin layer in which the conductive particles are arranged is subjected to a photopolymerization reaction by irradiating ultraviolet rays to form a temporary first connection layer in which fine irregularities are provided on one side and the conductive particles are temporarily fixed on the other side. The step of:
Process (DD)
Forming a second connection layer comprising a thermal cation, anion, or radical polymerizable resin layer on the conductive particle side surface of the temporary first connection layer; and step (EE)
The manufacturing method which has a process which carries out photopolymerization reaction by irradiating a temporary 1st connection layer by irradiating an ultraviolet-ray from the opposite side to a 2nd connection layer, and main-hardens a temporary 1st connection layer, and forms a 1st connection layer. The manufacturing method of Claim 12 which performs the ultraviolet irradiation of a process (CC) from the side in which the electrically conductive particle of the photopolymerizable resin layer arranged. Connection structure connected anisotropic conductive first electronic component in the anisotropic conductive film to the second electronic component according to any of claims 1-9.