JP2015163440A - Liquid ejection head and liquid ejection device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a liquid ejection head achieving a reduction in size and a reduction in costs and being capable of easily and highly reliably bonding a flexible wiring board and a head substrate together, and further to provide a liquid ejection device.SOLUTION: A liquid ejection head comprises: a head unit 2 comprising a head main body ejecting ink, a flow passage formation member having an introduction port 44a introduced with the ink supplied to the head main body and a wiring board electrically connected to the head main body; a head substrate 300 having a first terminal row 310 electrically connected to the wiring board; and a downstream flow passage member having a first flow-in port 610 communicating with the introduction port 44a of the head unit 2. As viewed in a plan view, the introduction port 44a of the head unit 2 is disposed so as to overlap with the first terminal row 310 of the head substrate 300, and the first flow-in port 610 is disposed so as not to overlap with the first terminal row 310.

Description

  The present invention relates to a liquid ejecting head and a liquid ejecting apparatus, and more particularly to an ink jet recording head and an ink jet recording apparatus that eject ink as a liquid.

  A typical example of a liquid ejecting head that ejects liquid is an ink jet recording head that ejects ink droplets. As the ink jet recording head, for example, a head main body having a nozzle opening for ejecting ink, a flow path forming member having an introduction port through which ink supplied to the head main body is introduced, and the head main body are electrically connected. A head unit having a flexible wiring substrate such as a COF substrate, a relay member that holds the head unit, and a head substrate has been proposed (for example, see Patent Document 1).

  The head main body is held on one side (liquid ejection surface) side of the relay member, and the head substrate is held on the other side. The relay member is provided with an insertion hole through which the COF substrate is inserted and an ink flow path communicating with the introduction port. The head substrate is provided with an insertion hole through which the COF substrate is inserted and a mounting region, and the COF substrate through which the slit is inserted is bent and electrically connected to the mounting region.

JP 2012-81644 A

  Here, when the head main body and the head unit are further reduced in size and cost, the distance between the COF substrate connected to the head main body and the introduction port becomes narrower. As described above, the COF substrate is bent and mounted on the mounting region of the head substrate.

  If the head body inlet and the flow path of the relay member communicating with the inlet are extended to the head substrate side in parallel with the COF substrate, the COF substrate is bent at the inlet opening on the head substrate side of the relay member. This overlaps with the mounted portion and the mounting area of the head substrate connected thereto. For this reason, for example, it is necessary to provide a notch in the mounting area of the COF substrate and the head substrate so that the inflow port of the relay member is exposed, or to divide the COF substrate and the mounting area.

When notches are provided in the COF substrate and mounting area, or when the COF and mounting area are divided, the COF substrate and mounting area must be expanded by the area provided with the notches, and the head body and head unit can be reduced in size. I can't figure it out. Further, since the COF substrate and the mounting area must be electrically connected over a plurality of locations, the mounting process becomes complicated, and further, the connection reliability may be reduced.
Such a problem is not limited to the ink jet recording head, and similarly exists in a liquid ejecting head that ejects another liquid.

  In view of such circumstances, the present invention provides a liquid ejecting head and a liquid ejecting apparatus capable of easily and highly reliably connecting a flexible wiring board and a head substrate while reducing the size and cost. The purpose is to do.

An aspect of the present invention that solves the above problems includes a head main body having a nozzle opening for ejecting liquid, a flow path forming member having an inlet that is stacked on the head main body and into which the liquid supplied to the head main body is introduced, And a head unit including a flexible wiring board, one end of which is electrically connected to the head body, and the flexible wiring led out from the head unit, disposed so that the plate surface faces the head unit. A head substrate having a mounting region electrically connected to the other end of the substrate; and disposed between the head unit and the head substrate, and the liquid flows into the head substrate from a side opposite to the head unit. A relay member having an inflow port communicating with the introduction port, and in front view in a direction in which the head unit and the head substrate are stacked, In the liquid ejecting head, the introduction port of the head unit is disposed so as to overlap the mounting region of the head substrate, and the inflow port of the relay member is disposed without overlapping the mounting region. .
In this aspect, even if the introduction port overlaps the flexible wiring board and the mounting area in plan view, it is possible to form a flow path for introducing the liquid into the head unit while avoiding these. As a result, the flexible wiring board can be electrically connected to the mounting region without being divided, so that the mounting process is simplified and the flexible wiring board and the head board are mounted. Connection to the area can be performed more reliably, and the connection reliability can be improved. Furthermore, since the introduction port can be arranged at a position overlapping the mounting area in plan view, an increase in the size of the head unit can be suppressed and downsizing can be achieved.

  Here, the relay member has an outflow port connected to the introduction port, and the flow is led out from the inside to the outside of the mounting region in the plan view between the inflow port and the outflow port. It is preferable to have a path. According to this, even if the introduction port overlaps the mounting region in plan view, the inflow port and the introduction port located at positions that do not overlap the mounting region communicate with each other, and the liquid can be circulated.

  The relay member includes a first member, and a second member disposed between the first member and the head unit, and the first member supports the head substrate and the first member. It is preferable to form the flow path between two members. According to this, the flow path which connects the inflow port in the position which does not overlap with a mounting area | region and an introduction port can be comprised from at least 2 member, and the cost concerning the member which comprises the said flow path is reduced. be able to.

  Moreover, it is preferable that the said flow path is extended in the horizontal direction. According to this, it is possible. The height of the liquid jet head in the direction crossing the horizontal direction can be reduced.

According to another aspect of the invention, a liquid ejecting apparatus includes the liquid ejecting head according to the above aspect.
According to this aspect, a liquid ejecting apparatus that can achieve a reduction in size and cost and can easily and reliably connect a flexible wiring substrate and a head substrate is provided.

FIG. 3 is an exploded perspective view of the head unit according to the first embodiment. FIG. 3 is a plan view of the head unit according to the first embodiment. FIG. 3 is a cross-sectional view of the head unit according to the first embodiment. FIG. 3 is an exploded perspective view of the recording head according to the first embodiment. FIG. 3 is a plan view of the recording head according to the first embodiment. It is sectional drawing to which the principal part of FIG. 5 was expanded. It is sectional drawing to which the principal part of FIG. 6 was expanded. 6 is a plan view of a second downstream flow path member (second member) according to Embodiment 1. FIG. 3 is a plan view of a first downstream flow path member (first member) according to Embodiment 1. FIG. 3 is a plan view of the recording head substrate according to Embodiment 1. FIG. FIG. 3 is an enlarged plan view of a main part of the head substrate according to the first embodiment. 1 is a schematic diagram illustrating an example of an ink jet recording apparatus.

<Embodiment 1>
Hereinafter, the present invention will be described in detail based on embodiments. An ink jet recording head is an example of a liquid ejecting head, and is also simply referred to as a recording head.
First, an example of a head unit provided in the recording head according to the present embodiment will be described. FIG. 1 is an exploded perspective view of a head unit according to the present embodiment, FIG. 2 is a plan view of the head unit, and FIG. 3 is a cross-sectional view taken along line AA ′ of the head unit.

  The head unit 2 includes a head main body 11, a flow path forming member 40 fixed to one side of the head main body 11, and a flexible wiring board (hereinafter simply referred to as a wiring board) electrically connected to the head main body 11. A plurality of members such as 121).

  The head body 11 includes a flow path forming substrate 10, a communication plate 15 provided on one side of the flow path forming substrate 10, and a nozzle plate provided on the opposite surface side of the communication plate 15 from the flow path forming substrate 10. 20, a protective substrate 30 provided on the side opposite to the communication plate 15 of the flow path forming substrate 10, and a compliance substrate 45 provided on the surface side of the communication plate 15 on which the nozzle plate 20 is provided.

For the flow path forming substrate 10, a metal such as stainless steel or Ni, a ceramic material typified by ZrO ₂ or Al ₂ O ₃ , a glass ceramic material, an oxide such as MgO, LaAlO ₃ , or the like can be used. In the present embodiment, the flow path forming substrate 10 is made of a silicon single crystal substrate. This flow path forming substrate 10 is anisotropically etched from one side so that the pressure generating chambers 12 partitioned by the plurality of partition walls are arranged in parallel with a plurality of nozzle openings 21 through which ink is ejected. Side by side.

  Hereinafter, this direction is referred to as a direction in which the pressure generating chambers 12 are arranged side by side or a first direction X. Further, the flow path forming substrate 10 is provided with a plurality of rows in which the pressure generation chambers 12 are arranged in parallel in the first direction X, and in this embodiment, two rows. Hereinafter, a direction in which a plurality of rows of the pressure generating chambers 12 are arranged is referred to as a second direction Y. Furthermore, a direction that intersects the first direction X and the second direction Y is referred to as an ink droplet (droplet) ejection direction, or a third direction Z. The third direction is a direction in which the head unit and the head substrate described in the claims are stacked. In this embodiment, the relationship between the directions (X, Y, Z) is orthogonal to facilitate understanding of the explanation, but the arrangement relationship of the components should not necessarily be limited to the orthogonal relationship. To mention.

  Further, the flow path forming substrate 10 has an opening area narrower than that of the pressure generation chamber 12 on one end portion side in the second direction Y of the pressure generation chamber 12, and the flow path resistance of ink flowing into the pressure generation chamber 12. A supply path or the like for providing the above may be provided.

  A communication plate 15 and a nozzle plate 20 are stacked in the third direction Z on one side of the flow path forming substrate 10 (in the third direction Z, -Z direction). That is, the recording head 1 includes a nozzle plate 20 having a communication plate 15 provided on one surface of the flow path forming substrate 10 and a nozzle opening 21 provided on the opposite surface side of the communication plate 15 from the flow path forming substrate 10. It comprises.

  The communication plate 15 is provided with a nozzle communication path 16 that communicates the pressure generation chamber 12 and the nozzle opening 21. The communication plate 15 has a larger area than the flow path forming substrate 10, and the nozzle plate 20 has a smaller area than the flow path forming substrate 10. By providing the communication plate 15 in this manner, the nozzle opening 21 of the nozzle plate 20 and the pressure generating chamber 12 can be separated from each other, so that the ink in the pressure generating chamber 12 is contained in the ink generated by the ink near the nozzle opening 21. Less susceptible to thickening due to moisture evaporation. Further, since the nozzle plate 20 only needs to cover the opening of the nozzle communication path 16 that communicates the pressure generating chamber 12 and the nozzle opening 21, the area of the nozzle plate 20 can be made relatively small, and the cost can be reduced. be able to.

Further, the communication plate 15 is provided with a first manifold portion 17 that constitutes a part of the manifold 100 and a second manifold portion 18 (throttle channel, orifice channel).
The first manifold portion 17 is provided through the communication plate 15 in the thickness direction (the stacking direction of the communication plate 15 and the flow path forming substrate 10 (third direction Z)). The second manifold portion 18 is provided to open to the nozzle plate 20 side of the communication plate 15 without penetrating the communication plate 15 in the thickness direction.

  Further, the communication plate 15 is provided with a supply communication passage 19 that communicates with one end portion in the second direction Y of the pressure generation chamber 12 for each pressure generation chamber 12. The supply communication path 19 communicates the second manifold portion 18 and the pressure generation chamber 12.

  As the communication plate 15, a metal such as stainless steel or nickel (Ni), or a ceramic such as zirconium (Zr) can be used. The communication plate 15 is preferably made of a material having the same linear expansion coefficient as the flow path forming substrate 10. That is, when a material having a linear expansion coefficient significantly different from that of the flow path forming substrate 10 is used as the communication plate 15, the flow path forming substrate 10 and the communication plate 15 are warped by being heated or cooled. In this embodiment, by using the same material as the flow path forming substrate 10 as the communication plate 15, that is, a silicon single crystal substrate, it is possible to suppress the occurrence of warping due to heat, cracking due to heat, peeling, and the like.

  In the nozzle plate 20, nozzle openings 21 communicating with the pressure generation chambers 12 through the nozzle communication passages 16 are formed. Such nozzle openings 21 are arranged in parallel in the first direction X, and two rows of nozzle openings 21 arranged in parallel in the first direction X are formed in the second direction Y. Also, the surface of the nozzle plate 20 that ejects ink droplets, that is, the surface opposite to the pressure generation chamber 12 is referred to as a liquid ejection surface 20a.

  As such a nozzle plate 20, for example, a metal such as stainless steel (SUS), an organic material such as a polyimide resin, a silicon single crystal substrate, or the like can be used. In addition, by using a silicon single crystal substrate as the nozzle plate 20, the linear expansion coefficients of the nozzle plate 20 and the communication plate 15 are made equal, and the occurrence of warpage due to heating or cooling, cracks due to heat, peeling, and the like are suppressed. can do.

  On the other hand, a diaphragm 50 is formed on the surface of the flow path forming substrate 10 opposite to the communication plate 15. In the present embodiment, an elastic film 51 made of silicon oxide provided on the flow path forming substrate 10 side and an insulator film 52 made of zirconium oxide provided on the elastic film 51 are provided as the diaphragm 50. I made it. The liquid flow path such as the pressure generation chamber 12 is formed by anisotropically etching the flow path forming substrate 10 from one side (the side where the nozzle plate 20 is bonded). The other surface of the liquid flow path is defined by the elastic film 51.

  On the diaphragm 50 of the flow path forming substrate 10, a piezoelectric actuator 130 having a first electrode 60, a piezoelectric layer 70, and a second electrode 80, which is a pressure generating unit of this embodiment, is provided. Here, the piezoelectric actuator 130 refers to a portion including the first electrode 60, the piezoelectric layer 70, and the second electrode 80. In general, one of the electrodes of the piezoelectric actuator 130 is used as a common electrode, and the other electrode is patterned for each pressure generating chamber 12. In the present embodiment, the first electrode 60 is continuously provided across the plurality of piezoelectric actuators 130 to be a common electrode, and the second electrode 80 is independently provided for each piezoelectric actuator 130 to be an individual electrode. Of course, there is no problem even if it is reversed for the convenience of the drive circuit and wiring. In the above-described example, the diaphragm 50 includes the elastic film 51 and the insulator film 52. However, the present invention is not limited to this. For example, the vibration film 50 includes the elastic film 51 and the insulating film. Any one of the body films 52 may be provided, and the elastic film 51 and the insulator film 52 are not provided as the vibration plate 50, and only the first electrode 60 acts as the vibration plate. Also good. Further, the piezoelectric actuator 130 itself may substantially double as a diaphragm.

The piezoelectric layer 70 is made of an oxide piezoelectric material having a polarization structure. For example, the piezoelectric layer 70 can be made of a perovskite oxide represented by the general formula ABO ₃ , and can be made of a lead-based piezoelectric material containing lead or non-lead. A lead-based piezoelectric material or the like can be used.

  Furthermore, each second electrode 80 that is an individual electrode of the piezoelectric actuator 130 is drawn from the vicinity of the end opposite to the supply communication path 19 and extended to the diaphragm 50. For example, One end portions of lead electrodes 90 made of gold (Au) or the like are connected to each other.

  Further, a wiring substrate 121 provided with a drive circuit 120 for driving the piezoelectric actuator 130 is connected to the other end of the lead electrode 90. As the wiring substrate 121, a flexible sheet-like substrate such as a COF substrate can be used.

  On one surface of the wiring substrate 121, a second terminal row 123 is formed in which a plurality of second terminals 122 that are electrically connected to first terminals 311 of the head substrate 300 to be described later are arranged in parallel. That is, an example of one end of the flexible wiring board described in the claims is a portion connected to the lead electrode 90, and an example of the other end of the flexible wiring board is the second terminal row 123. A plurality of second terminals 122 of the present embodiment are arranged in parallel along the first direction X to form a second terminal row 123. Note that the driver circuit 120 is not necessarily provided on the wiring board 121. That is, the wiring board 121 is not limited to the COF board, and may be FFC, FPC, or the like.

  A protective substrate 30 having substantially the same size as the flow path forming substrate 10 is bonded to the surface of the flow path forming substrate 10 on the piezoelectric actuator 130 side. The protective substrate 30 has a holding portion 31 that is a space for protecting the piezoelectric actuator 130. The holding unit 31 has a concave shape that opens to the flow path forming substrate 10 side without penetrating the protective substrate 30 in the third direction Z that is the thickness direction. In addition, the holding unit 31 is provided independently for each column configured by the piezoelectric actuators 130 arranged in parallel in the first direction X. That is, the holding unit 31 is provided so as to accommodate the rows of the piezoelectric actuators 130 arranged in parallel in the first direction X, and each row of the piezoelectric actuators 130, that is, two in parallel in the second direction Y. Has been. Such a holding part 31 should just have the space of the grade which does not inhibit the motion of the piezoelectric actuator 130, and the said space may be sealed or may not be sealed.

  The protective substrate 30 has a through hole 32 penetrating in the third direction Z, which is the thickness direction. The through-hole 32 is provided across the first direction X, which is the direction in which the plurality of piezoelectric actuators 130 are arranged, between the two holding portions 31 arranged in parallel in the second direction Y. That is, the through hole 32 is an opening having a long side in the direction in which the plurality of piezoelectric actuators 130 are arranged. The other end of the lead electrode 90 extends so as to be exposed in the through hole 32, and the lead electrode 90 and the wiring substrate 121 are electrically connected in the through hole 32.

  As such a protective substrate 30, it is preferable to use substantially the same material as the coefficient of thermal expansion of the flow path forming substrate 10, for example, glass, ceramic material, etc. In this embodiment, the same material as the flow path forming substrate 10 is used. The silicon single crystal substrate was used. Moreover, the joining method of the flow path forming substrate 10 and the protective substrate 30 is not particularly limited. For example, in the present embodiment, the flow path forming substrate 10 and the protective substrate 30 are joined via an adhesive (not shown). Has been.

  The head unit 2 having such a configuration includes a flow path forming member 40 that defines a manifold 100 that communicates with the plurality of pressure generating chambers 12 together with the head body 11. The flow path forming member 40 has substantially the same shape as the communication plate 15 described above in a plan view, and is bonded to the protective substrate 30 and is also bonded to the communication plate 15 described above. Specifically, the flow path forming member 40 has a recess 41 having a depth in which the flow path forming substrate 10 and the protective substrate 30 are accommodated on the protective substrate 30 side. The concave portion 41 has an opening area larger than the surface of the protective substrate 30 bonded to the flow path forming substrate 10. The opening surface on the nozzle plate 20 side of the recess 41 is sealed by the communication plate 15 in a state where the flow path forming substrate 10 and the like are accommodated in the recess 41. As a result, the third manifold portion 42 is defined by the flow path forming member 40 and the head body 11 on the outer periphery of the flow path forming substrate 10. The first manifold portion 17 and the second manifold portion 18 provided on the communication plate 15, and the third manifold portion 42 defined by the flow path forming member 40 and the head body 11, the manifold according to this embodiment. 100 is configured. That is, the manifold 100 includes the first manifold portion 17, the second manifold portion 18, and the third manifold portion 42. Further, the manifold 100 of the present embodiment is disposed on both outer sides of the two rows of pressure generating chambers 12 in the second direction Y, and two manifolds provided on both outer sides of the two rows of pressure generating chambers 12. 100 are provided independently so as not to communicate with each other in the head unit 2. That is, one manifold 100 is provided in communication for each row of pressure generation chambers 12 (rows arranged in parallel in the first direction X) of the present embodiment. In other words, a manifold 100 is provided for each nozzle group. Of course, the two manifolds 100 may communicate with each other.

  As described above, the flow path forming member 40 is a member that forms a flow path (manifold 100) of ink supplied to the head body 11, and has an introduction port 44 that communicates with the manifold 100. That is, the introduction port 44 is an opening serving as an inlet for introducing the ink supplied to the head main body 11 into the manifold 100.

  The flow path forming member 40 is provided with a connection port 43 that communicates with the through hole 32 of the protective substrate 30 and through which the wiring substrate 121 is inserted. The other end portion of the wiring board 121 extends in the penetrating direction of the through hole 32 and the connection port 43, that is, in the third direction Z and opposite to the ink droplet ejection direction.

  In addition, as a material of such a flow path formation member 40, resin, a metal, etc. can be used, for example. Incidentally, the flow path forming member 40 can be mass-produced at low cost by molding a resin material.

  A compliance substrate 45 is provided on the surface of the communication plate 15 where the first manifold portion 17 and the second manifold portion 18 open. The compliance substrate 45 has substantially the same size as the communication plate 15 described above in a plan view, and is provided with a first exposure opening 45a that exposes the nozzle plate 20. The compliance substrate 45 seals the opening on the liquid ejection surface 20a side of the first manifold portion 17 and the second manifold portion 18 in a state where the nozzle plate 20 is exposed by the first exposed opening portion 45a. That is, the compliance substrate 45 defines a part of the manifold 100.

  In this embodiment, the compliance substrate 45 includes a sealing film 46 and a fixed substrate 47. The sealing film 46 is made of a flexible film-like thin film (for example, a thin film having a thickness of 20 μm or less formed of polyphenylene sulfide (PPS) or the like), and the fixed substrate 47 is made of stainless steel (SUS) or the like. It is made of a hard material such as metal. Since the region of the fixed substrate 47 facing the manifold 100 is an opening 48 that is completely removed in the thickness direction, one surface of the manifold 100 is sealed only with a flexible sealing film 46. The compliance portion 49 is a flexible portion. In the present embodiment, one compliance portion 49 is provided corresponding to one manifold 100. That is, in this embodiment, since the two manifolds 100 are provided, the two compliance portions 49 are provided on both sides in the second direction Y with the nozzle plate 20 interposed therebetween.

  In the head unit 2 having such a configuration, when ink is ejected, the ink is taken in through the introduction port 44 and the flow path is filled with ink from the manifold 100 to the nozzle opening 21. Thereafter, according to a signal from the drive circuit 120, a voltage is applied to each piezoelectric actuator 130 corresponding to the pressure generating chamber 12, so that the diaphragm 50 is flexibly deformed together with the piezoelectric actuator 130. As a result, the pressure in the pressure generating chamber 12 is increased and ink droplets are ejected from the predetermined nozzle openings 21.

  The recording head 1 having such a head unit 2 will be described in detail. 4 is an exploded perspective view of the recording head according to the present embodiment, FIG. 5 is a plan view of the recording head according to the present embodiment, FIG. 6 is a cross-sectional view taken along the line BB ′ of FIG. 6 is an enlarged cross-sectional view of the main part of FIG. 6, FIG. 8 is a plan view of the second downstream flow path member, FIG. 9 is a plan view of the first downstream flow path member, and FIG. 10 is a plan view of the head substrate. FIG. In FIG. 5, illustration of the seal member 230 and the upstream flow path member 210 is omitted.

  As shown in FIGS. 4 to 10, the recording head 1 includes four head units 2, a flow path member 200 that holds the head unit 2 and includes a relay member that supplies ink to the head unit 2, and a flow path member. 200 and a head substrate 300 held by 200.

  The flow path member 200 includes an upstream flow path member 210, a downstream flow path member 220 that is an example of a relay member, and a seal member 230 that is disposed between the upstream flow path member 210 and the downstream flow path member 220. To do.

  The upstream flow path member 210 has an upstream flow path 500 that serves as an ink flow path. In the present embodiment, the upstream flow path member 210 is configured by laminating a first upstream flow path member 211, a second upstream flow path member 212, and a third upstream flow path member 213 in the third direction Z. ing. Each of these members is provided with a first upstream flow path 501, a second upstream flow path 502, and a third upstream flow path 503, which are connected to form an upstream flow path 500.

  In addition, the upstream flow path member 210 is not limited to such an aspect, and may be a single member or a plurality of two or more members. Further, the stacking direction of the plurality of members constituting the upstream flow path member 210 is not particularly limited, and may be the first direction X and the second direction Y.

  The first upstream flow path member 211 has a connection part 214 connected to a liquid holding means such as an ink tank or an ink cartridge in which ink (liquid) is held on the side opposite to the downstream flow path member 220. In this embodiment, the connecting portion 214 protrudes in a needle shape. Note that a liquid holding unit such as an ink cartridge may be directly connected to the connection unit 214, or a liquid holding unit such as an ink tank may be connected via a supply pipe such as a tube.

  A first upstream flow path 501 is provided in the first upstream flow path member 211. The first upstream flow path 501 opens at the top surface of the connection portion 214 and extends in the third direction Z or orthogonal to the third direction Z depending on the position of the second upstream flow path 502 described later. Direction, that is, a flow path extending in a plane including the first direction X and the second direction Y. In addition, a guide wall 215 for positioning the liquid holding portion is provided around the connection portion 214 of the first upstream flow path member 211.

  The second upstream flow path member 212 has a second upstream flow path 502 that is fixed to the opposite side of the connection portion 214 of the first upstream flow path member 211 and communicates with the first upstream flow path 501. A first liquid reservoir 502 a having an inner diameter wider than that of the second upstream channel 502 is provided on the downstream side of the second upstream channel 502 (on the third upstream channel member 213 side).

  The third upstream flow path member 213 is provided on the opposite side of the second upstream flow path member 212 from the first upstream flow path member 211. The third upstream flow path member 213 is provided with a third upstream flow path 503. The opening part of the third upstream channel 503 on the second upstream channel 502 side is a second liquid reservoir 503a that is widened in accordance with the first liquid reservoir 502a. A filter 216 for removing bubbles and foreign matters contained in the ink is provided at the opening of the second liquid reservoir 503a (between the first liquid reservoir 502a and the second liquid reservoir 503a). As a result, the ink supplied from the second upstream channel 502 (first liquid reservoir 502a) is supplied to the third upstream channel 503 (second liquid reservoir 503a) via the filter 216.

  The third upstream flow path 503 is branched into two on the downstream side (opposite side to the second upstream flow path) from the second liquid reservoir 503a, and the third upstream flow path 503 is the third upstream flow path. The member 213 is opened as a first discharge port 504A and a second discharge port 504B on the surface on the downstream flow path member 220 side. Hereinafter, when the first outlet 504A and the second outlet 504B are not distinguished, they are referred to as outlets 504.

  That is, the upstream flow path 500 corresponding to one connection portion 214 includes a first upstream flow path 501, a second upstream flow path 502, and a third upstream flow path 503, and the upstream flow path 500 is a downstream flow path member. The two outlets 504 (the first outlet 504A and the second outlet 504B) are opened on the 220 side. In other words, the two outlets 504 (the first outlet 504A and the second outlet 504B) are provided in communication with a common flow path.

  A third protrusion 217 that protrudes toward the downstream flow channel member 220 is provided on the downstream flow channel member 220 side of the third upstream flow channel member 213. The third protrusion 217 is provided for each third upstream flow path 503, and the discharge port 504 is opened at the distal end surface of the third protrusion 217.

  The first upstream flow channel member 211, the second upstream flow channel member 212, and the third upstream flow channel member 213 provided with such an upstream flow channel 500 are integrally laminated by, for example, an adhesive or welding. ing. The first upstream flow channel member 211, the second upstream flow channel member 212, and the third upstream flow channel member 213 can be fixed with screws, clamps, or the like. In order to suppress the leakage of ink (liquid) from the connection portion up to 503, it is preferable to join with an adhesive or welding.

  In the present embodiment, four connection portions 214 are provided in one upstream flow path member 210, and four independent upstream flow paths 500 are provided in one upstream flow path member 210. Each upstream flow channel 500 is supplied with ink corresponding to each of the four head units 2. One upstream flow path 500 is branched into two, and communicates with a downstream flow path 600 described later, and is connected to each of the two inlets 44 of the head unit 2.

  In this embodiment, the upstream flow channel 500 is divided into two at the downstream side (downstream flow channel member 220 side) from the filter 216. However, the present invention is not limited to this, and the downstream side from the filter 216. The upstream flow channel 500 may be branched into three or more. One upstream flow channel 500 may not be branched downstream of the filter 216.

  The downstream flow path member 220 is an example of a relay member that has a downstream flow path 600 that is joined to the upstream flow path member 210 and communicates with the upstream flow path 500. The downstream flow path member 220 according to the present embodiment includes a first downstream flow path member 240 that is an example of a first member and a second downstream flow path member 250 that is an example of a second member.

  The downstream flow path member 220 includes a downstream flow path 600 that serves as an ink flow path. The downstream flow path 600 according to the present embodiment includes two types of downstream flow paths 600A and downstream flow paths 600B having different shapes.

  The first downstream flow path member 240 is a member formed in a substantially flat plate shape. The second downstream flow channel member 250 is provided with a first storage portion 251 as a recess on the surface on the upstream flow channel member 210 side and a second storage portion 252 as a recess on the surface opposite to the upstream flow channel member 210. It is a member.

  The 1st accommodating part 251 is taken as the magnitude | size of the grade in which the 1st downstream flow path member 240 is accommodated. Further, the second accommodating portion 252 has a size that accommodates the four head units 2. The second accommodating portion 252 according to the present embodiment can accommodate four head units 2.

  A plurality of first protrusions 241 are formed on the surface of the first downstream flow path member 240 on the upstream flow path member 210 side. Each first protrusion 241 is provided to face the third protrusion 217 provided with the first discharge port 504 </ b> A among the third protrusions 217 provided in the upstream flow path member 210. In the present embodiment, four first protrusions 241 are provided.

  The first downstream flow path member 240 is provided with a first flow path 601 that penetrates in the third direction Z and opens at the top surface of the first protrusion 241 (the surface facing the upstream flow path member 210). It has been. The third protrusion 217 and the first protrusion 241 are joined via the seal member 230, and the first outlet 504A and the first flow path 601 are in communication.

  The first downstream flow path member 240 is formed with a plurality of second through holes 242 penetrating in the third direction Z. Each of the second through holes 242 is formed at a position where the second protrusion 253 formed in the second downstream flow path member 250 is inserted. In the present embodiment, four second through holes 242 are provided.

  Further, the first downstream flow path member 240 is formed with a plurality of first insertion holes 243 through which the wiring board 121 electrically connected to the head unit 2 is inserted. Specifically, each first insertion hole 243 penetrates in the third direction Z and communicates with the second insertion hole 255 of the second downstream flow path member 250 and the third insertion hole 302 of the head substrate 300. It is formed as follows. In the present embodiment, four first insertion holes 243 are provided corresponding to the respective wiring boards 121 provided in the four head units 2.

  The first downstream flow path member 240 is provided with a support portion 245 that protrudes toward the head substrate 300 in a region facing the first terminal row 310 that is an example of a mounting region of the head substrate 300. The support portion 245 supports the head substrate 300 on the top surface (the surface facing the head substrate 300). The support portion 245 according to the present embodiment is formed to have the same shape and the same position as the first terminal row 310 of the head substrate in plan view. Further, a total of four support portions 245 are formed in accordance with the number of first terminal rows 310. Furthermore, each support part 245 is formed so that each top surface may become flush.

Such a support portion 245 supports the side of the head substrate 300 opposite to the first terminal row 310. When the second terminal row 123 is joined to the first terminal row 310, a force such as a heat tool is applied to the first terminal row 310 of the head substrate 300 from the upstream flow path member 210 side. However, since the first terminal row 310 is supported by the support portion 245, it is possible to keep the first terminal row 310 flat because it is suppressed from being bent or bent by pressing with the tool. The connection with the second terminal row 123 can be made satisfactory without a gap.
Although not particularly illustrated, a portion for supporting the head substrate 300 corresponding to the support portion 245 may be provided in the second downstream flow path member 250.

  A plurality of second protrusions 253 are formed on the bottom surface of the first housing part 251 in the second downstream flow path member 250. Each second protrusion 253 is provided to face the third protrusion 217 provided with the second discharge port 504 </ b> B among the third protrusions 217 provided in the upstream flow path member 210. In the present embodiment, four second protrusions 253 are provided. In addition, the second downstream flow path member 250 penetrates in the third direction Z, and is open to the top surface of the second protrusion 253 and the bottom surface of the second storage portion 252 (the surface facing the head unit 2). A flow path 600B is provided. The 3rd projection part 217 and the 2nd projection part 253 are joined via seal member 230, and the 2nd discharge port 504B and downstream flow path 600B are connecting.

  The second downstream flow path member 250 is formed with a plurality of third flow paths 603 penetrating in the third direction Z. Each third flow path 603 is open to the bottom surfaces of the first storage portion 251 and the second storage portion 252. In the present embodiment, four third flow paths 603 are provided.

  A plurality of groove portions 254 that are continuous with the third flow path 603 are formed on the bottom surface of the first housing portion 251 of the second downstream flow path member 250. The groove portion 254 constitutes the second flow channel 602 by being sealed by the first downstream flow channel member 240 housed in the first housing portion 251. That is, the second flow path 602 is a flow path defined by the groove portion 254 and the surface of the first downstream flow path member 240 on the second downstream flow path member 250 side. The second flow path 602 corresponds to a flow path provided between the first member and the second member described in the claims.

  Further, the second downstream flow path member 250 is formed with a plurality of second insertion holes 255 through which the wiring board 121 electrically connected to the head unit 2 is inserted. Specifically, each second insertion hole 255 is formed so as to penetrate in the third direction Z and communicate with the first insertion hole 243 of the first downstream flow path member 240 and the connection port 43 of the head unit 2. ing. In the present embodiment, four second insertion holes 255 are provided corresponding to the respective wiring boards 121 provided in the four head units 2.

  The downstream flow path 600A is formed by communicating the first flow path 601, the second flow path 602, and the third flow path 603 described above. Here, the second flow path 602 is formed by sealing a groove formed on one surface of the first downstream flow path member 240 with the second downstream flow path member 250. By joining the first downstream flow path member 240 and the second downstream flow path member 250, the second flow path 602 can be easily formed in the downstream flow path member 220.

  The second channel 602 is an example of a channel extending in the horizontal direction. That the second flow path 602 extends in the horizontal direction means that the extending direction of the second flow path 602 includes a component (vector) in the first direction X or the second direction Y. Say. Since the second flow path 602 extends in the horizontal direction, the height of the recording head 1 in the third direction Z can be reduced. If the second flow path 602 is inclined with respect to the horizontal direction, the height of the recording head 1 is slightly required.

  Incidentally, the extending direction of the second flow path 602 is a direction in which the ink (liquid) in the second flow path 602 flows. Therefore, the second flow path 602 is provided in the horizontal direction (a direction orthogonal to the third direction Z), but also in the third direction Z and the horizontal direction (the first direction X and the second direction Y). In-plane direction). In the present embodiment, the first flow path 601 and the third flow path 603 are provided along the third direction Z, and the second flow path 602 is provided along the horizontal direction (second direction Y). Note that the first flow path 601 and the third flow path 603 may be provided in a direction intersecting the third direction Z.

  Of course, the downstream flow path 600A is not limited to this, and a flow path other than the first flow path 601, the second flow path 602, and the third flow path 603 may exist. Further, the downstream flow path 600A is not composed of the first flow path 601, the second flow path 602, and the third flow path 603, but may be composed of a single flow path.

  As described above, the downstream flow path 600B is formed as a through hole penetrating the second downstream flow path member 250 in the third direction Z. Of course, the downstream flow path 600B is not limited to such an embodiment, and for example, it may be formed along a direction intersecting the third direction Z, or a plurality of flow paths may be formed like the downstream flow path 600A. It may be configured to communicate.

  One such downstream flow path 600 </ b> A and one downstream flow path 600 </ b> B is formed for each head unit 2. That is, the downstream channel member 220 is provided with a total of four sets of the downstream channel 600A and the downstream channel 600B.

  Of the openings at both ends of the downstream flow path 600A, the opening of the first flow path 601 that communicates with the first discharge port 504A is defined as the first inlet 610, and the opening of the third flow path 603 that opens to the second accommodating portion 252. Is the first outlet 611.

  Of the openings at both ends of the downstream flow path 600B, the opening of the downstream flow path 600B that communicates with the second discharge port 504B is referred to as the second inlet 620, and the opening of the downstream flow path 600B that opens to the second accommodating portion 252 is the first. Two outlets 621 are provided. Hereinafter, when the downstream flow path 600A and the downstream flow path 600B are not distinguished, they are referred to as the downstream flow path 600.

  A plurality of head units 2, in the present embodiment, four head units 2 are accommodated in the second accommodating portion 252 of the downstream flow path member 220. In one head unit 2, nozzle rows are formed side by side in the second direction Y (see FIGS. 1 and 2), and four head units 2 are arranged in the second direction Y in the recording head 1. It is installed side by side. Thereafter, the first direction X, the second direction Y, and the third direction Z of the head unit 2 are the same as the first direction X, the second direction Y, and the third direction Z of the recording head 1, respectively. Indicates.

  Each head unit 2 is provided with two introduction ports 44. The first outlet 611 and the second outlet 621 of the downstream channel 600 (downstream channel 600A and downstream channel 600B) are provided in the downstream channel member 220 in accordance with the position where each inlet 44 opens. .

  The inlets 44 of the head unit 2 are aligned so as to communicate with the first outlet 611 and the second outlet 621 of the downstream flow path 600 that is opened at the bottom surface of the second housing portion 252. The head unit 2 is fixed to the second housing portion 252 with an adhesive 227 provided around each introduction port 44. In this way, the head unit 2 is fixed to the second housing portion 252, so that the first outlet 611 and the second outlet 621 of the downstream flow path 600 communicate with the inlet 44, and ink is supplied to the head unit 2. It comes to be supplied.

  The head substrate 300 is placed on the surface of the downstream flow channel member 220 on the upstream flow channel member 210 side. The head substrate 300 is a member to which a wiring substrate 121 is connected and a circuit for controlling the ejection operation and the like of the recording head 1 and electrical components such as resistors are mounted via the wiring substrate 121.

  A first terminal row 310 in which a plurality of first terminals 311 to which the second terminal row 123 of the wiring board 121 is electrically connected is arranged in parallel is formed on the surface of the head substrate 300 on the upstream flow path member 210 side. ing. A plurality of first terminals 311 of this embodiment are arranged in parallel along the first direction X to form a first terminal row 310. In the present embodiment, the first terminal row 310 is an example of a mounting region that is electrically connected to the wiring board 121.

  The head substrate 300 is formed with a plurality of third insertion holes 302 through which the wiring substrate 121 electrically connected to the head unit 2 is inserted. Specifically, each third insertion hole 302 is formed so as to penetrate in the third direction Z and communicate with the first insertion hole 243 of the first downstream flow path member 240. In the present embodiment, four third insertion holes 302 are provided corresponding to the respective wiring boards 121 provided in the four head units 2.

  Further, the head substrate 300 is provided with a third through hole 301 penetrating in the third direction Z. The third through hole 301 is inserted through the first protrusion 241 of the first downstream flow path member 240 and the second protrusion 253 of the second downstream flow path member 250. In the present embodiment, a total of eight third through holes 301 are provided so as to face the first protrusion 241 and the second protrusion 253.

  The shape of each third through hole 301 formed in the head substrate 300 is not limited to the above-described aspect. For example, a common through hole through which the first protrusion 241 and the second protrusion 253 are inserted may be used as the insertion hole. That is, the head substrate 300 is formed with an insertion hole, a notch or the like so as not to interfere with the connection between the downstream flow path 600 of the downstream flow path member 220 and the upstream flow path 500 of the upstream flow path member 210. Just do it.

  A seal member 230 is provided between the head substrate 300 and the upstream flow path member 210. As a material of the seal member 230, a material (elastic material) that has liquid resistance to an ink or the like used in the recording head 1 and is elastically deformable, such as rubber or elastomer, can be used. .

  The seal member 230 is a plate-like member in which a communication path 232 that penetrates in the third direction Z and a fourth protrusion 231 that protrudes toward the downstream flow path member 220 are formed. In the present embodiment, eight communication paths 232 and fourth protrusions 231 are formed corresponding to each upstream flow path 500 and downstream flow path 600.

  An annular first recess 233 into which the third protrusion 217 is inserted is provided on the upstream flow path member 210 side of the seal member 230. The first recess 233 is provided at a position facing the fourth protrusion 231.

  The fourth protruding portion 231 protrudes toward the downstream flow channel member 220 and is provided at a position facing the first protruding portion 241 and the second protruding portion 253 of the downstream flow channel member 220. A second recess 234 into which the first protrusion 241 and the second protrusion 253 are inserted is provided on the top surface of the fourth protrusion 231 (the surface facing the downstream flow path member 220).

  The communication path 232 penetrates the seal member 230 in the third direction Z, has one end opening in the first recess 233 and the other end opening in the second recess 234. Then, a fourth projection is formed between the tip surface of the third projection 217 inserted into the first recess 233 and the tip surfaces of the first projection 241 and the second projection 253 inserted into the second recess 234. The portion 231 is held in a state where a predetermined pressure is applied in the third direction Z. Therefore, the upstream flow path 500 and the downstream flow path 600 are communicated in a sealed state via the communication path 232.

  A cover head 400 is attached to the downstream flow path member 220 on the second housing portion 252 side.

  The cover head 400 is a member that is fixed to the downstream flow path member 220 to which the head unit 2 is fixed, and is provided with a second exposure opening 401 that exposes the nozzle opening 21. In the present embodiment, the second exposure opening 401 has a size that exposes the nozzle plate 20, that is, substantially the same opening as the first exposure opening 45 a of the compliance substrate 45.

  The cover head 400 is bonded to the side of the compliance substrate 45 opposite to the communication plate 15 and seals the space of the compliance portion 49 opposite to the flow path (manifold 100). By covering the compliance portion 49 with the cover head 400 in this manner, the compliance portion 49 can be prevented from being destroyed even when a recording medium such as paper comes into contact. In addition, it is possible to suppress the ink (liquid) from adhering to the compliance portion 49, and to wipe the ink (liquid) adhering to the surface of the cover head 400 with, for example, a wiper blade. It is possible to suppress contamination with ink or the like adhering to the ink. Although not particularly illustrated, the space between the cover head 400 and the compliance unit 49 is open to the atmosphere. Of course, the cover head 400 may be provided independently for each head unit 2.

  As described above, the recording head 1 is configured by laminating the downstream flow path member 220 holding the head unit 2, the head substrate 300, the seal member 230, and the upstream flow path member 210 in this order. That is, the upstream flow path member 210 and the downstream flow path member 220 are joined with the head substrate 300 and the seal member 230 interposed therebetween.

  Note that the downstream flow path member 220 is joined to the upstream flow path member 210 in addition to the direct contact between the upstream flow path member 210 and the downstream flow path member 220. It includes a case where other parts are interposed between the flow path member 220 and indirectly assembled.

  Although not particularly illustrated, when the upstream flow path member 210 and the downstream flow path member 220 are joined, a space capable of accommodating the head substrate 300 and the seal member 230 is formed between the members. The head substrate 300 placed on the surface of the downstream passage member 220 on the upstream passage member 210 side, and the seal member 230 placed on the surface of the head substrate 300 on the upstream passage member 210 side are in the space. Contained.

  The head substrate 300 is provided with connectors 320 on both end sides in the second direction Y. The connector 320 is connected to a circuit or the like provided on the head substrate 300 and is connected to an external wiring (not shown). The connector 320 is exposed to the outside from a connector connection port 257 in which a wall portion 256 protruding to the upstream flow channel member 210 side of the second downstream flow channel member 250 is partially cut out.

  In addition, each first insertion hole 243, second insertion hole 255, and third insertion hole 302 communicate with each other to form one insertion hole through which one wiring board 121 is inserted. The wiring board 121 connected to the head unit 2 is inserted through such an insertion hole, and one end of the wiring board 121 inserted through the third insertion hole 302 is bent toward the first terminal row 310 of the head substrate 300.

  The first terminal row 310 provided on the head substrate 300 is electrically connected to the second terminal row 123 provided on the wiring board 121. That is, each first terminal 311 and each second terminal 122 are electrically connected. There is no particular limitation on the connection mode of the first terminal 311 and the second terminal 122. For example, welding such as solder connection, anisotropic conductive adhesive (ACP, ACF), non-conductive adhesive (NCP, Electrical connection can be achieved by crimping with NCF) or the like interposed.

  In this way, by bending the wiring substrate 121 and electrically connecting it to the head substrate 300, the height of the wiring substrate 121 in the third direction Z can be reduced, and the third direction of the recording head 1 can be reduced. Z can be reduced in size.

  Further, as described above, in the recording head 1, the first protrusion 241 provided in the first downstream flow path member 240 is inserted through the third through hole 301 of the head substrate 300, and the first flow path 601 is the seal member. The first discharge port 504 </ b> A communicates with the communication path 323 of 230. Thus, a series of channels including the upstream channel 500, the first discharge port 504A, and the downstream channel 600A is formed.

  Similarly, the second protrusion 253 provided in the second downstream flow path member 250 is inserted through the second through hole 242 provided in the first downstream flow path member 240 and the third through hole 301 of the head substrate 300. The downstream flow path 600B communicates with the second discharge port 504B through the communication path 323 of the seal member 230. Thus, a series of channels including the upstream channel 500, the second outlet 504B, and the downstream channel 600B is formed.

  In the recording head 1 having such a configuration, when ink is ejected, the ink supplied from the connection portion 214 is supplied to the head unit 2 via the upstream flow path 500 and the downstream flow path 600. Then, an external control signal is transmitted to the head substrate 300, and ink is ejected by the head unit 2 in accordance with the control signal as described above.

  Here, referring to FIG. 11, the first terminal row 310 which is an example of a mounting region where the wiring substrate 121 is mounted on the head substrate 300, the first inlet 610 which is the opening at both ends of the downstream flow path 600, and the first The arrangement with the outlet 611 will be described. FIG. 11 is an enlarged plan view of the main part of the head substrate 300 viewed along the third direction Z from the upstream flow path member 210 side.

  As shown in the figure, the head unit 2 is provided with two inlets 44. Each of the two inlets 44 is also referred to as an inlet 44a and an inlet 44b. One inlet 44b is connected to the second outlet 621 of the downstream channel 600B, and the second inlet 620 is connected directly to the upstream channel 500 along the vertical direction (third direction Z) as it is. (See FIG. 6). That is, the introduction port 44b does not overlap the wiring substrate 121 bent on the head substrate 300 or the first terminal row 310 connected to the wiring substrate 121 in plan view.

  However, the other introduction port 44a overlaps the wiring substrate 121 bent on the head substrate 300 and the first terminal row 310 (mounting region) connected to the wiring substrate 121 in a plan view. On the other hand, the first inlet 610 serving as an inlet for the ink supplied to the downstream flow path 600A does not overlap the wiring board 121 and the first terminal row 310 connected thereto in plan view.

  The third channel 603 and the introduction port 44b are connected via the first inlet 610, the first channel 601 and the second channel 602 which do not overlap with the first terminal row 310 in a plane. That is, even if the introduction port 44b and the third flow path 603 connected thereto are overlapped with the wiring board 121 and the first terminal row 310, a flow path for introducing ink into the head unit 2 is formed avoiding these. be able to.

  If the third flow path 603 connected to the introduction port 44 a is provided along the third direction Z and is connected to the upstream flow path 500, it overlaps the wiring board 121 and the first terminal row 310, and thus the wiring board 121. In addition, it is necessary to prevent the connection between the third flow path 603 and the upstream flow path 500 by partially cutting the first terminal row 310 or dividing it by a plurality of members.

  However, in the recording head 1 according to this embodiment, it is not necessary to divide the wiring board 121 and the first terminal row 310. As a result, the wiring board 121 can be electrically connected to the first terminal array 310 integrally, so that the mounting process is simplified, and the second terminal array 123 of the wiring board 121 and the first terminal array 300 of the head substrate 300 are simplified. Connection to the one-terminal array 310 can be performed more reliably, and the connection reliability can be improved.

  Here, it is assumed that, for example, the introduction port 44a is arranged close to the right in the second direction Y in the figure so as not to overlap the first terminal row 310 in plan view. In this case, since the introduction port 44a and the first terminal row 310 do not overlap, the reliability of the connection described above can be ensured.

  However, the introduction port 44a is moved away from the wiring board 121, and the width of the head unit 2 in the second direction Y is increased. That is, the head unit 2 is increased in size.

  According to the recording head 1 according to the present embodiment, since the introduction port 44a can be arranged at a position overlapping the first terminal row 310, an increase in the size of the head unit 2 can be suppressed and downsizing can be achieved. it can.

  Moreover, the 2nd flow path 602 is an example of the flow path derived | led-out toward the outer side from the inner side of the mounting area | region in planar view between the inflow port described in a claim, and an outflow port. That is, the second flow path 602 according to the present embodiment is an example of a mounting region between the first inflow port 610 and the first outflow port 611 in the plan view of the head substrate 300 along the third direction Z. The first terminal row 310 is led out from the inside to the outside. The inner side of the first terminal row 310 refers to a position that overlaps the first terminal row 310 in plan view, and the outer side of the first terminal row 310 refers to a position that does not overlap the first terminal row 310 in plan view.

By providing the second flow path 602 in this way, even if the introduction port 44a overlaps the first terminal row 310 in plan view, the first flow at a position that does not overlap the first terminal row 310. The ink can be circulated by communicating the inlet 610 and the inlet 44a.
The second flow path 602 does not need to be led out from the inside of the first terminal row 310 along the second direction Y, and may be along any direction.

<Other embodiments>
As mentioned above, although one Embodiment of this invention was described, the basic composition of this invention is not limited to what was mentioned above.

  For example, the recording head 1 according to the first embodiment includes not only the downstream flow path member 220 that is an example of the relay member but also the upstream flow path member 210 and includes the flow path member 200. It is not limited to an aspect. For example, the recording head may be provided with only the relay member without including the upstream flow channel member 210, or may include a member constituting a flow channel other than the upstream flow channel member 210 and the downstream flow channel member 220. .

  In addition, the downstream flow path member 220 that is an example of the relay member includes the first downstream flow path member 240 as an example of the first member and the second downstream flow path member 250 as an example of the second member. It is not limited to such an aspect. For example, the relay member may be composed of an integral member or may be composed of three or more members.

  The first downstream flow path member 240 is provided with a support portion 245, and the head substrate 300 is supported by the support portion 245. However, the present invention is not limited to such a mode. For example, the surface of the first downstream flow path member 240 accommodated in the first accommodation portion 251 and the surface of the second downstream flow path member 250 (surface other than the first accommodation portion 251) are flush with each other. The head substrate 300 may be supported as a whole. Further, the head substrate 300 may be supported only by the first downstream flow path member 240.

  Although one head substrate 300 is provided in common to the four head units 2, the present invention is not limited to such a mode. For example, a plurality of head substrates 300 may be provided for each head unit 2.

  Although the thin film type piezoelectric actuator 130 has been described as the pressure generating means for causing the pressure change in the pressure generating chamber 12, the present invention is not particularly limited thereto. For example, the thickness formed by a method such as attaching a green sheet. A film-type piezoelectric actuator, a longitudinal vibration-type piezoelectric actuator in which piezoelectric materials and electrode forming materials are alternately stacked to expand and contract in the axial direction can be used. Also, as a pressure generating means, a heating element is arranged in the pressure generating chamber, and droplets are discharged from the nozzle opening by bubbles generated by the heat generated by the heating element, or static electricity is generated between the diaphragm and the electrode. Thus, a so-called electrostatic actuator that discharges liquid droplets from the nozzle openings by deforming the diaphragm by electrostatic force can be used.

  The recording head 1 of Embodiment 1 constitutes a part of an ink jet recording head unit having an ink flow path communicating with an ink cartridge or the like, and is mounted on an ink jet recording apparatus. FIG. 12 is a schematic view showing an example of the ink jet recording apparatus.

  In the ink jet recording apparatus I, the recording head 1 is detachably provided with a cartridge 9 constituting an ink supply means, and the carriage 3 on which the recording head 1 is mounted is along a carriage shaft 5 attached to the apparatus main body 4. It is provided so as to be movable in the axial direction (main scanning direction).

  Then, the driving force of the driving motor 6 is transmitted to the carriage 3 via a plurality of gears and a timing belt 7 (not shown), so that the carriage 3 on which the recording head 1 is mounted is moved along the carriage shaft 5. On the other hand, the apparatus main body 4 is provided with a conveyance roller 8 as a conveyance unit so that the recording sheet S, which is a recording medium such as paper, is conveyed by the conveyance roller 8 in the sub-scanning direction orthogonal to the main scanning direction. It has become. Note that the conveyance means for conveying the recording sheet S is not limited to the conveyance roller, and may be a belt, a drum, or the like.

  In the inkjet recording apparatus I described above, the recording head 1 is mounted on the carriage 3 and moved in the main scanning direction. However, the present invention is not particularly limited thereto. For example, the recording head 1 is fixed, The present invention can also be applied to a so-called line type recording apparatus that performs printing only by moving a recording sheet S such as paper in the sub-scanning direction.

  In the above-described example, the ink jet recording apparatus I has a configuration in which the cartridge 9 which is a liquid storage unit is mounted on the carriage 3, but is not particularly limited thereto. For example, a liquid storage unit such as an ink tank is used. The storage unit and the recording head 1 may be connected to each other via a supply pipe such as a tube by being fixed to the apparatus main body 4. Further, the liquid storage means may not be mounted on the ink jet recording apparatus.

  Furthermore, the present invention is intended for a wide range of liquid jet heads in general, for example, for manufacturing recording heads such as various ink jet recording heads used in image recording apparatuses such as printers, and color filters such as liquid crystal displays. The present invention can also be applied to a coloring material ejecting head, an organic EL display, an electrode material ejecting head used for forming electrodes such as an FED (field emission display), a bioorganic matter ejecting head used for biochip manufacturing, and the like.

I ink jet recording apparatus (liquid ejecting apparatus), 1 recording head (liquid ejecting head), 2 head unit, 20 nozzle plate, 20a liquid ejecting surface, 21 nozzle opening, 44 inlet, 100 manifold, 120 drive circuit, 121 wiring Substrate (flexible wiring substrate), 130 piezoelectric actuator, 200 flow path member, 210 upstream flow path member, 220 downstream flow path member, 230 seal member, 240 first downstream flow path member (first member), 250 second Downstream channel member (second member), 300 head substrate, 310 first terminal row (mounting area), 500 upstream channel, 600 downstream channel, 610 first inlet (inlet), 611 first outlet ( Outlet)

Claims (5)

A head main body having a nozzle opening for ejecting liquid, a flow path forming member having an introduction port through which liquid supplied to the head main body is stacked, and one end electrically connected to the head main body A head unit comprising a flexible wiring board,
A head substrate having a mounting region that is disposed so that the plate surface faces the head unit and is electrically connected to the other end of the flexible wiring substrate led out from the head unit;
A relay member disposed between the head unit and the head substrate, and having an inflow port through which the liquid flows into the head substrate from a side opposite to the head unit and communicates with the introduction port;
In the plan view from the direction in which the head unit and the head substrate are stacked, the introduction port of the head unit is arranged to overlap the mounting region of the head substrate, and the inlet of the relay member is the mounting A liquid ejecting head characterized by being arranged without overlapping an area. The liquid ejecting head according to claim 1,
The relay member has an outflow port connected to the introduction port, and has a flow path led out from the inside to the outside of the mounting region in the plan view between the inflow port and the outflow port. A liquid jet head characterized by that. The liquid ejecting head according to claim 2,
The relay member includes a first member, and a second member disposed between the first member and the head unit,
The first member supports the head substrate and constitutes the flow path between the first member and the second member. In the liquid ejecting head according to claim 2 or 3,
The liquid jet head, wherein the flow path extends in a horizontal direction.   A liquid ejecting apparatus comprising the liquid ejecting head according to claim 1.

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