JP2015153708A - Insulation structure of terminal block and method of manufacturing printed board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To solve such a problem that production and attachment to a printed board of an insulating paper are troublesome, when using an insulating paper in the insulation structure of a terminal block, to cause cost increase.SOLUTION: An insulation structure between terminal blocks is arranged on a printed wiring board 2. Between the terminal blocks, a plurality of printed wiring boards 2, each having a surface composed of an insulating material excepting the foot 8, are arranged as the boards 5 for insulation. A conductive foil 10 is provided on the surface of the foot 8 at at least two places, and the foot 8 provided with the conductive foil 10 is inserted into a through hole 6 of the printed wiring board 2, and fixed by soldering. A slit insertion part 9, formed between the feet 8 of the boards 5 for insulation, is inserted into a slit 7 formed in the printed wiring board 2.

Description

  The present invention relates to a structure for securing an insulation distance by sandwiching an insulator between two conductors, and more particularly to an insulation for a terminal block mounted on a printed wiring board and a noise countermeasure structure.

  In order to achieve electrical insulation, it is necessary to secure an insulation distance, that is, both a spatial distance and a creepage distance. The clearance is the shortest distance between the two conductors, and the creepage distance (creepage.distance) is the shortest distance along the surface of the insulator between the two conductive portions.

  In particular, for printed wiring boards that require high-density mounting of electronic components, such as when mounting electrical conductors such as terminal blocks on printed wiring boards, ensure a sufficient insulation distance without isolation by insulators. It is difficult to secure. Therefore, there is a case where a plurality of conductors are separated by an insulating paper or an insulating sheet to secure an insulating distance.

  Patent document 1 is mentioned as a prior art of the above insulation. Patent Document 1 discloses a technique of an insulating structure that makes it possible to ensure insulation on both the front and back surfaces of a single insulating plate by providing an opening in a printed wiring board and inserting an insulating plate therethrough.

  Also, high-frequency circuits, logic circuits, etc. using electronic circuit components on printed wiring boards use weak currents, so electromagnetic shield covers that are susceptible to external noise such as electromagnetic waves and block noise intrusion are required. There is a case. Further, as an electromagnetic shielding method for electronic circuit components having a high radiation level, the electronic circuit components on the printed circuit board may be covered with a shield cover. Patent document 2 is mentioned as such a prior art. Patent Document 2 discloses a printed circuit board in which a ground pattern is formed on the peripheral side surface of an element, a conductive mouth-shaped grounding member mounted on the printed circuit board, and a mouth-shaped grounding member and a spring-like contact portion in a shield cover. A technique of a shield structure constituted by a box-shaped member having an opening on one side is disclosed.

  However, the insulation structure and the shield structure as described above are difficult to adopt for the terminal block of the power input portion of the inverter formed on the printed wiring board.

  Here, a constraint condition in the case of applying to the terminal block of the power input portion of the inverter configured on the printed wiring board will be described.

  For example, when the circuit 101 shown in FIG. 10 is an inverter composed of a single printed board, and the noise filter 103 can be optionally provided in the power input unit 102, the terminal blocks 104 are arranged three by three. When there is no noise filter, the terminal block may be short-circuited with a copper bar, and when a noise filter is used, it may be pulled out with an electric wire.

  A specific example of the terminal block portion of the noise filter connection in such a case and the restriction on the arrangement will be described. 11 shows the terminal block 104, (A) is a plan view, (B) is a front view, and (C) is a side view. FIG. 12 is an explanatory diagram showing an arrangement state of the terminal block 104, and is subject to the following restrictions in arranging the terminal block 104.

Restriction of terminal block arrangement (1) Since the main circuit portion of the inverter is a high voltage (440 V or the like), it is necessary to ensure insulation according to the standard to which the product complies. When a terminal block as shown in FIG. 11 is used in order to reduce the arrangement space and cost, the terminal blocks between adjacent phases are more than a certain level as shown in FIG. 12 in order to secure an insulation distance. It is necessary to increase the distance D1.
(2) The role of the noise filter is provided in order to prevent the noise generated in the switching portion of the inverter from returning to the power input side and having an adverse effect. Therefore, as shown in FIG. 12, the terminal block of the input part of the noise filter and the terminal block of the output part need to be separated from each other by a certain distance D2 as shown in FIG.

  However, a small-capacity inverter product composed of a single printed board must be downsized, and the space for arranging the terminal block must be as small as possible. For this reason, the distance D1 , D2 cannot be taken large.

Therefore, conventionally, the following methods have been adopted in order to ensure insulation and the effect of the noise filter.
(1) Conventional Method of Ensuring Insulation As shown in FIG. 13, the insulating paper 111 is arranged between the terminal blocks 104 and the terminal blocks are arranged close to each other to reduce the size. As shown in the development view of FIG. 14A, the insulating paper 111 is formed in a rectangular shape, and first and second fixing portions to the printed circuit board are provided at one corner in the longitudinal direction. 112, 113 are formed. A mounting hole 114 for inserting a screw or a screw is formed at the center of the first and second fixing portions 112 and 113. The first and second fixing portions 112 and 113 are formed in a substantially square shape by a cut portion 115 and a bent portion 116. Then, as shown in FIG. 14B, the cut portions 115 and the bent portions 116 are used to be bent at substantially right angles in opposite directions. Then, as shown in FIG. 13, the first and second fixing portions 112 and 113 are overlapped on the printed circuit board, and the mounting holes 114 provided in the first and second fixing portions 112 and 113 and the printed circuit board 117 are formed. The positions of the provided screw holes and rivet holes (not shown) are aligned, and the insulating paper 111 is attached to the printed circuit board with screws and rivets 118.
(2) Method of Securing Shielding As shown in FIG. 15, it is possible to place the terminal blocks close to each other by providing a conductive shield plate 119 between the terminal blocks to suppress noise propagation.

Japanese Patent Publication No. 7-70797 JP 2001-24375 A

Incidentally, as shown in FIG. 13, the method of reducing the terminal block interval using the insulating paper 111 has the following problems.
(1) Since the insulating paper 111 is used, initial costs such as a mold cost for forming the insulating paper are separately required, and the insulating paper becomes expensive.
(2) Further, in order to attach the insulating paper 111 to the printed circuit board 117, a part of the insulating paper 111 is cut and raised to form the first and second fixing portions 112 and 113, and these first and second fixings are made. The parts 112 and 113 are superposed on the printed circuit board 117, and the screw holes and screw holes provided in the first and second fixing parts are aligned with the screw holes and rivet holes provided in the printed circuit board to Since the insulating paper 111 must be attached to the printed circuit board with rivets or the like, the number of assembly steps increases. Also, a large space is required on the printed circuit board in order to form mounting holes (not shown) for screws and resin rivets.

Further, in order to secure the shield, as shown in FIG. 15, when the shield plate 119 is provided between the terminal blocks to suppress the propagation of noise and the terminal blocks are arranged close to each other, the shield plate 119 is electrically conductive. When using a material having a property, there is a problem that insulation between phases cannot be obtained.
The present invention has been made to solve the problems of the conventional example.

The present invention is an insulating structure of a terminal block disposed on a printed wiring board,
Between the terminal blocks, a printed wiring board whose surface excluding the foot is made of an insulating material is disposed as an insulating board,
Conductive foil is provided on the surface of at least two of the feet, and the feet provided with the conductive foil are inserted into the through holes of the printed wiring board and fixed by soldering.
The space between the legs of the insulating printed board is inserted into a slit formed in the printed wiring board.

(1) Since a printed circuit board is used as an insulating substrate, the conventional insulating paper is not necessary.
(2) Since a printed circuit board is used as an insulating substrate instead of insulating paper, it is possible to mount and fix together with other components by providing a soldering pattern on the printed circuit board. The assembly cost can be reduced as compared with the case of using rivets or the like.
(3) Since no screws or resin rivets are used for assembly, the number of parts can be reduced.
(4) The space required for fixing can be reduced as compared with the case where screws or resin rivets are used for assembly.

Explanatory drawing of 1st Embodiment. Explanatory drawing of the state which removed the board | substrate for insulation. Sectional drawing of a through-hole part. Explanatory drawing of the modification of 1st Embodiment. Explanatory drawing of 2nd Embodiment. Explanatory drawing of the state which removed the board | substrate for shielding. Explanatory drawing of 3rd Embodiment. Explanatory drawing of the state which removed the insulated substrate and the board | substrate for a shield. Explanatory drawing which shows the manufacturing method of this invention. The circuit diagram which shows an example of the inverter circuit which provided the nozzle filter. (A) is a top view of a terminal block, (B) is a front view of a terminal block, (C) is a side view of a terminal block. Explanatory drawing which shows the restrictions at the time of arrange | positioning a terminal block. Explanatory drawing which shows the conventional problem. (A) is a development view of conventional insulating paper, (B) is a perspective view of a state where the foot is bent. Explanatory drawing which shows a problem at the time of using a shield board.

  1 to 3 show an insulating structure 1 of a terminal block according to a first embodiment. As shown in FIG. 1, the terminal block insulation structure 1 includes three-phase input side terminal blocks 3u, 3v, 3w and an inverter side terminal blocks 4u, 4v, 4w on a printed wiring board 2. The insulating substrate 5 is arranged between the terminal blocks for each phase.

  FIG. 2 shows a state where the insulating substrate 5 is removed from the printed wiring board 2. The printed wiring board 2 includes a through hole 6 for attaching the insulating substrate 5 and a slit 7 for inserting the lower end portion of the insulating substrate 5.

  The insulating substrate 5 is formed in a substantially rectangular shape, and has a plurality of legs 8 to be attached to the printed wiring board 2 on one side, and is inserted into the slits 7 between the legs 8. A slit insertion portion 9.

  The insulating substrate 5 is covered with an insulating material except for the surface of the foot 8, and the surface covered with the insulating material is formed in substantially the same manner as the printed wiring board 2. Conductive foil (copper foil) 10 that is not covered with an insulating material is provided on the surface of at least two of the plurality of legs 8. A conductive foil (copper foil) 11 is also provided on the inner surface of the through hole 6. In the insulating substrate 5 of the first embodiment, there is no portion provided with conductive foil (copper foil) other than the foot portion 8.

  Therefore, if the foot 8 of the insulating substrate 5 is inserted into the through hole 6 of the printed wiring board 2, the conductive foil (copper foil) 10 provided on the surface of the foot 8 and the conductive provided on the inner surface of the through hole 6. The foils (copper foils) 11 are in contact with each other, and the slit insertion portions 9 between the foot portions 8 are naturally inserted into the slits 7.

  Then, by attaching the feet 8 to the solder 12, the insulating substrate 5 is attached and fixed between the terminal blocks of the respective phases to insulate the respective phases.

The terminal block insulation structure 1 of the first embodiment is configured as described above and has the following effects.
(1) By attaching the insulating substrate 5 between the terminal blocks of each phase, the insulation distance between the phases, that is, the spatial distance and the creepage distance, bypass the insulating substrate 5 and the terminal blocks are close to each other. Insulation is ensured.
(2) Since the conductive foil (copper foil) 10 and the conductive foil (copper foil) 11 are provided on the surface of the foot 8 and the inner surface of the through-hole 6, respectively, the printed wiring board is obtained by soldering in a flow solder bath. 2 can be mounted with the terminal block and the insulating substrate 5 at the same time. Therefore, the insulating paper assembling step by manual operation in a separate process is not required as in the case of using insulating paper, and the assembling cost can be reduced.
(3) Fixing screws, resin rivets, and the like, which are necessary for insulating paper, are not necessary, and the number of parts can be reduced to reduce costs.
(4) Since a screw, a resin rivet, etc. are unnecessary, the space required for fixing can be reduced.
(5) Since a printed circuit board is used for the insulating substrate 5, the initial cost for one substrate can be suppressed by integrally forming the insulating substrate 5 on the printed circuit board. In addition, the cost increase of the substrate unit price due to the expansion of the substrate area can reduce the manufacturing unit cost compared to the conventional insulating structure using insulating paper.

  FIG. 4 shows a modification of the insulating structure 1 of the terminal block of the first embodiment. In this example, the length L of the slit insertion portion 9 of the insulating substrate 5 is lengthened so that the lower end of the insulating substrate 5 protrudes more from the lower surface of the printed wiring board 2 to increase the insulating distance and to achieve the insulating effect. The case of improvement is shown. Other configurations are the same as those in the basic example, and thus redundant description is omitted. Similarly, the insulating substrate 5 has no portion other than the foot 8 to which conductive foil (copper foil) is applied.

  5 and 6 show an insulating structure 1 of a terminal block according to the second embodiment. In the second embodiment, an insulating substrate (hereinafter referred to as a shielding substrate) 5A is arranged between the input side terminal blocks 3u, 3v, 3w and the inverter side terminal blocks 4u, 4v, 4w. The case where the space is shielded is shown. FIG. 5 shows a state where the shielding substrate 5A is attached, and FIG. 6 shows a state where the shielding substrate 5A is removed.

  As shown in FIG. 6, the printed wiring board 2 includes a through hole 6A for attaching the shielding substrate 5A and a slit 7A for inserting the lower end portion of the shielding substrate 5A. The through hole 6A includes a conductive foil (copper foil) 11 on the inner surface. The conductive foil (copper foil) 11 is connected to a frame ground (earth) (not shown) via a land 13 connected to the inner peripheral surface and a wiring pattern 14 on the printed wiring board 2.

  On the other hand, the shielding substrate 5A is formed in a substantially rectangular shape like the insulating substrate 5 of the first embodiment, and a plurality of legs 8A for attaching to the printed wiring board 2 on one side, A slit insertion portion 9A is provided between the legs 8A and inserted into the slit 7A.

  Conductive foil (copper foil) 10 is provided on the surface of at least two foot portions 8A among the plurality of foot portions 8A. The foot 8A is inserted into the through hole 6A, and the conductive foil (copper foil) 10A on the surface thereof is connected to the conductive foil (copper foil) 11 and the land 13 provided on the inner periphery of the through hole 6A. The

  In the second embodiment, the shielding substrate 5A uses a printed board having three or more layers, and a copper foil is provided on the entire inner layer portion.

  The shield substrate 5A is provided with a through hole 15 for electrically connecting the overlapped inner layer and outer layer copper foil, and the inner layer and the outer layer are electrically connected.

  Therefore, if the foot portion 8A of the shielding substrate 5A is inserted into the through hole 6A of the printed wiring board 2, the conductive foil (copper foil) 10 provided on the surface of the foot portion 8 and the inner surface of the through hole 6A as described above. Conductive foils (copper foils) 11 provided on each other are in contact with each other, and the shield substrate 5A is connected to a frame ground (earth) via the connector 13 and the wiring pattern 14, and a slit insertion portion between the foot portions 8A. 9A is naturally inserted into the slit 7A.

  Then, by soldering the foot portion 8A, the shielding substrate 5A is attached and fixed between the terminals, and at the same time, shields between the two.

The terminal block of the second embodiment is configured as described above and has the following effects.
(1) Since the shielding substrate 5A is provided with the shielding conductive foil (copper foil) on the inner layer, the insulation of the surface can be secured, and it is difficult to secure with the conventional conductive shielding plate. Insulation can also be secured.
(2) Since the shielding substrate 5A is attached between adjacent terminal blocks, electromagnetic coupling between the terminal blocks is cut off, and noise propagation is suppressed. For this reason, the effect of the noise filter is ensured even if the terminal blocks are arranged close to each other. In particular, by connecting the shielding substrate 5A to the frame ground (earth) with the wiring pattern 14, the noise blocking effect of the shielding substrate 5A can be improved.
(3) Since the conductive foil (copper foil) 10A is provided on the surface of the foot 8A and the conductive foil (copper foil) 11 is provided on the inner surface of the through hole 6A, as in the case of the first embodiment, the terminal block And the shielding substrate 5A can be simultaneously mounted in the flow solder bath.

  Although not shown, in the second embodiment as well, in the same manner as in the first embodiment, the length L of the slit insertion portion 9A of the shield substrate 5A is lengthened and the lower end of the shield substrate 5A is printed wiring. By projecting more from the lower surface of the substrate 2, the shielding effect can be improved. Other configurations are the same as in the case of the first embodiment, and a duplicate description is omitted.

  7 and 8 show an insulating structure 1 of a terminal block according to the third embodiment. 3rd Embodiment shows the case where both the board | substrate 5 for insulation and the board | substrate 5A for shielding are used, FIG. 7 shows the state which attached the board | substrate 5 for insulation and the board | substrate 5A for shielding to the printed wiring board 2, 8 shows a state in which the insulating substrate 5 and the shielding substrate 5A are removed.

  The insulating substrate 5 is formed in substantially the same manner as the insulating substrate 5 of the first embodiment, and a cut portion 16 is formed in the central portion on the opposite side to the foot portion 8 side.

  The shielding substrate 5A is formed in substantially the same manner as the shielding substrate 5A of the second embodiment, and a pair of cut portions 17 are formed in the vicinity of the central portion on the same side as the foot portion 8A. Yes.

  The notches 16 and 17 are for crossing the insulating substrate 5 and the shield substrate 5A, and are obtained by adding the depth L1 of the notch 16 and the depth L2 of the notch 17 (L1 + L2). ) Is formed to have substantially the same value as the height H of the insulating substrate 5 and the shielding substrate 5A.

  Next, an example of a method for assembling the insulating substrate 5 and the shielding substrate 5A to the printed wiring board 2 will be described. In assembling, first, the insulating substrate 5 is arranged between the terminal blocks of each phase on the printed wiring board 2. The insulating substrate 5 is arranged by inserting the foot 8 of the insulating substrate 5 into the through hole 6 of the printed wiring board 2 and soldering 12. By inserting the foot 8 into the through hole 6, the conductive foil (copper foil) 10 provided on the surface of the foot 8 and the conductive foil (copper foil) 11 provided on the inner surface of the through hole 6 are in contact with each other for insulation. The board 5 stands on the printed wiring board 2. In addition, the slit insertion portion 9 between the foot portions 8 is also automatically inserted into the slit 7.

  Next, the shielding substrate 5A is disposed between the input side terminal blocks 3u, 3v, 3w and the inverter side terminal blocks 4u, 4v, 4w. The shield substrate 5A is arranged such that the shield substrate 5A intersects the insulating substrate 5 at the positions of the notches 16 and 17, and the foot portion 8A of the shield substrate 5A is connected to the through hole 6A of the printed wiring board 2. Insert into and solder.

  By inserting the foot portion 8A into the through hole 6A, the conductive foil (copper foil) 10A provided on the surface of the foot portion 8A and the conductive foil (copper foil) 11 provided on the inner surface of the through hole 6A are in contact with each other, The shielding substrate 5A is connected to a frame ground (earth) via the land 13 and the wiring pattern 14. In addition, the slit insertion portion 9A between the foot portions 8A is naturally inserted into the slit 7A.

The terminal block of the third embodiment is configured as described above, and has the following effects.
(1) Since the insulating substrate 5 is disposed between the terminal blocks of each phase, the space distance and creepage distance, which are the insulating distances between the terminal blocks, bypass the insulating substrate 5, so that the terminal blocks are arranged close to each other. Even in this case, insulation is ensured. In addition, since the shielding substrate 5A is disposed between the input-side terminal and the inverter-side terminal, electromagnetic coupling between the terminal blocks is cut off, and noise propagation is suppressed. Therefore, even when the terminal blocks are arranged close to each other, the effect of the noise filter is ensured.
(2) The insulating substrate 5 and the shielding substrate 5A can be assembled in an intersecting manner by fitting the cutting portion 17 to the cutting portion 16 of the insulating substrate 5 and the shielding substrate 5A. In particular, the notch 16 of the insulating substrate 5 is provided on the side opposite to the foot 8, and the notch 17 of the shielding substrate 5A is provided on the side opposite to the foot 8A. When assembling the circuit board 5 and the shielding board 5A to the printed wiring board 2, first, the insulating board 5 is assembled to the printed wiring board 2 and then covered with the insulating board 5 from above the shielding board 5A. Can be assembled to the printed circuit board 2.
(3) Also in the third embodiment, as in the case of the second embodiment, by increasing the length of the portion inserted into the slit 7A of the printed wiring board 2 of the shielding board 5A, the printed wiring board 2 can be secured on the back side (the back side of the terminal block mounting surface). The back side of the terminal block mounting surface also needs to ensure a shielding action depending on the terminal block installation situation, and the shielding effect can be secured by changing the length of the insertion part of the shielding substrate 5A as necessary. There is.
(4) In particular, by inserting the shielding substrate 5A between the input part and the output part of the terminal block and passing the insertion part through the back side of the terminal block mounting surface, each terminal is also provided on the back side of the terminal block mounting surface. Since a shield function can be provided between the input and output of the base, the shield can be secured on both the front surface and the back surface of the printed wiring board 2.

FIG. 9 shows an example of a method for manufacturing the insulating substrate 5 and the shielding substrate 5A.
In this manufacturing method, an inverter is mounted. The insulating structure of the terminal block of the first to third embodiments is formed on the side portion of the printed wiring board 2 on which the terminal block is mounted, and is integrally formed with the insulating substrate 5 and the shield. The board 5A is formed, and before mounting the components, the insulating board 5 and the shielding board 5A are divided from the printed wiring board 2, and the insulating board 5 and the shielding board 5A are assembled to the printed wiring board 2. . In FIG. 9, 18 is a cut line for separating the printed wiring board 2 from the insulating substrate 5 and the shielding substrate 5A, and is formed by a V-shaped cut or the like.

  According to this manufacturing method, since the printed wiring board 2, the insulating substrate 5 and the shielding substrate 5A can be manufactured at the same time, the manufacturing cost can be reduced.

  Of course, the printed circuit board 2, the insulating substrate 5, and the shielding substrate 5A may be manufactured separately without adopting the above method. The manufacturing method of this invention is applied to the insulation structure of the terminal block of 1st-3rd embodiment.

DESCRIPTION OF SYMBOLS 1 ... Terminal block insulation structure 2 ... Printed wiring board 2
3u, 3v, 3w ... Input side terminals 4u, 4v, 4w ... Output side terminals 5 ... Insulating substrate 5A ... Shielding substrate 6, 6A ... Through hole 7, 7A ... Slit 8, 8A ... Foot 9, 9A ... Slit insertion part 10, 11 ... Conductive foil (copper foil)
DESCRIPTION OF SYMBOLS 12 ... Solder layer 13 ... Land 14 ... Wiring pattern 15 ... Through hole 16, 17 ... Cut part 18 ... Cut line

Claims (5)

An insulating structure of a terminal block arranged on a printed wiring board,
Between the terminal blocks, a printed wiring board whose surface excluding the foot is made of an insulating material is disposed as an insulating board,
Conductive foil is provided on the surface of at least two of the feet, and the feet provided with the conductive foil are inserted into the through holes of the printed wiring board and fixed by soldering.
An insulating structure for a terminal block, wherein a leg portion of the insulating printed board is inserted into a slit formed in the printed wiring board. The terminal block insulation structure according to claim 1, wherein the terminal block disposed on the printed wiring board is a terminal block of a power input unit of an inverter circuit configured on the printed wiring board. The insulation structure of the terminal block according to claim 1 or 2, wherein a space between the legs of the insulating printed board inserted into the slit of the printed wiring board protrudes toward the back side of the printed wiring board. . The insulating substrate is a printed circuit board having at least three layers,
Built-in conductive foil on the entire inner layer part,
The insulating structure for a terminal block according to any one of claims 1 to 3, further comprising a through hole for electrically connecting the conductive foil of the inner layer portion and the conductive foil of the surface of the foot portion. 5. The insulating substrate according to claim 1, wherein the insulating substrate is divided and manufactured from one printed wiring board together with the printed wiring board on which the inverter circuit is configured. A method for manufacturing a printed circuit board.

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