JP2015146353A - Arithmetic processing unit and information processing unit - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a standardized cooling method.SOLUTION: An arithmetic processing unit includes an arithmetic circuit and a cooling section. The arithmetic circuit executes arithmetic processing. The cooling section has a flow channel to flow cooling fluid through therein, is formed with an inflow opening and an outflow opening for the fluid, being led to the flow channel, and integrated with the arithmetic circuit.

Description

  Embodiments described herein relate generally to an arithmetic processing device and an information processing device.

  In recent years, CPUs (Central Processing Units) mounted on motherboards of various information processing apparatuses such as PCs (Personal Computers), workstations, and servers have been designed to improve their computing power. For this reason, the heat generation amount of the CPU tends to increase year by year.

  On the other hand, conventionally, the cooling of the CPU mounted on the information processing apparatus is not the manufacturer of the CPU, but the manufacturer of the information processing apparatus. For example, each PC manufacturer uniquely depends on the CPU mounted on the PC. We are doing thermal design. For example, a PC manufacturer cools a CPU by attaching fins to the CPU and attaching a cooling unit that performs air cooling with a fan to the CPU.

  However, such thermal design is not easy, and each PC manufacturer is currently searching for the best cooling method by performing thermal analysis by simulation or repeating trial manufacture in some cases. In other words, at present, it has been impossible to present a standardized CPU cooling method to the manufacturer of the information processing apparatus.

JP 2011-138232 A

  The problem to be solved by the present invention is to provide an arithmetic processing device and an information processing device capable of presenting a standardized cooling method.

  The arithmetic processing apparatus according to the embodiment includes an arithmetic circuit and a cooling unit. The arithmetic circuit performs arithmetic processing. The cooling unit includes a flow path through which a cooling fluid flows, and an inlet and an outlet of the fluid with respect to the flow path are attached to be integrated with the arithmetic circuit.

FIG. 1 is a diagram illustrating a configuration example of a CPU chip according to the present embodiment. FIG. 2 is a diagram illustrating another configuration example of the CPU chip according to the present embodiment. FIG. 3 is a diagram (1) illustrating a modification of the pipe formed in the cooling unit. FIG. 4 is a diagram (2) illustrating a modification of the pipe formed in the cooling unit. FIG. 5 is a diagram illustrating an example of the cooling method of the CPU chip according to the present embodiment. FIG. 6 is a diagram illustrating a configuration example of an information processing apparatus including the CPU chip according to the present embodiment.

  Hereinafter, embodiments of an arithmetic processing device will be described in detail with reference to the accompanying drawings.

(Embodiment)
The arithmetic processing device according to the present embodiment is mounted on various information processing devices such as a PC (Personal Computer), a workstation, a server, and the like, and a CPU that is an electronic circuit that functions as a central arithmetic processing device in the information processing device. (Central Processing Unit) chip. Specifically, the CPU chip according to the present embodiment is configured as described below in order to be able to present a standardized cooling method.

  FIG. 1 is a diagram illustrating a configuration example of a CPU chip according to the present embodiment. As illustrated in FIG. 1, the CPU chip 10 according to the present embodiment includes a CPU 11 and a cooling unit 12.

  The CPU 11 is an arithmetic circuit that performs arithmetic processing. That is, the CPU 11 is a circuit similar to a conventionally manufactured and sold CPU. For example, in the CPU 11, semiconductor elements are integrated at a high density on a substrate, and a plurality of pins for connecting to a motherboard is formed on the surface opposite to the integration surface. In the configuration example described below, the arithmetic circuit is an electronic circuit such as an MPU (Micro Processing Unit), a GPU (Graphics Processing Unit), an ASIC (Application Specific Integrated Circuit), or an FPGA (Field Programmable Gate Array). Even if applicable.

  And the cooling part 12 has the pipe 121 which is a flow path through which the fluid for cooling flows inside, as shown in FIG. The pipe 121 is formed of a material that is unlikely to leak fluid. For example, the pipe 121 is a stainless steel channel. Here, the pipe 121 is formed inside the cooling unit 12 so that the entire CPU 11 is cooled by the fluid. For example, the pipe 121 illustrated in FIG. 1 substantially covers the cross section by a path that moves in the horizontal direction while reciprocating in the vertical direction in one cross section parallel to the contact surface between the cooling unit 12 and the CPU 11. It is formed inside the cooling unit 12 so as to flow.

  As shown in FIG. 1, a fluid inlet 122 and an outlet 123 for the pipe 121 are attached to the cooling unit 12. A pipe (hose) for connecting the tank and the CPU chip 10 to be described later is attached to the inflow port 122 and the outflow port 123. The inlet 122 and the outlet 123 shown in FIG. 1 are attached to the same side surface of the cooling unit 12.

  Below, the case where water is used as said cooling fluid is demonstrated. In addition, this embodiment may be a case where an electrically insulating fluid is used as the cooling fluid.

  In the CPU chip 10 according to the present embodiment, as shown in FIG. 1, the cooling unit 12 is integrated with the CPU 11 that is an arithmetic circuit. Specifically, the cooling unit 12 is integrated with the CPU 11 so that the CPU chip 10 can be attached to the motherboard as a general-purpose CPU using a socket corresponding to the CPU 11. For example, the cooling unit 12 can support and fix the pipe 121 inside, the inlet 122 and the outlet 123 can be attached to the side surface, and is configured using a housing that is molded so as to enclose the CPU 11. The cooling unit 12 may be integrally formed with the CPU 11.

  As described above, the CPU chip 10 illustrated in FIG. 1 includes an arithmetic processing unit in which the cooling unit 12 serving as a cooling device that cools when a fluid (for example, water) flows through the pipe 121 and the CPU 10 are formed into chips. It is.

  Here, this embodiment may be a case where the cooling unit 12 further includes at least one of a fin and a pin inside. FIG. 2 is a diagram illustrating another configuration example of the CPU chip according to the present embodiment. The CPU chip 10 'illustrated in FIG. 2 is configured in substantially the same manner as the CPU chip 10 described with reference to FIG. However, unlike the CPU chip 10 illustrated in FIG. 1, the CPU chip 10 ′ illustrated in FIG. 2 has fins 124 attached to the inside of the cooling unit 12.

  For example, as shown in FIG. 2, in addition to the cooling pipe 121, five fins 124 are attached inside the cooling unit 12 of the CPU chip 10 ′ in order to improve cooling efficiency. As shown in FIG. 2, each of the five fins 124 is arranged in the vertical direction so as to be sandwiched between the forward path and the return path of the pipe 121 that reciprocates in the vertical direction. The fins 124 can be arranged in any number as long as they can be arranged inside the cooling unit 12. Further, the fins 124 can be arranged in any direction inside the cooling unit 12 as long as the cooling efficiency can be improved. In addition, this embodiment may be a case where a fin is attached on a pin, or a case where only a pin is attached in order to improve cooling efficiency.

  Further, the cooling pipe is not limited to the pipe 121 illustrated in FIGS. 1 and 2. Specifically, the cooling pipe according to the present embodiment may be formed inside the cooling unit 12 so that the fluid flows substantially covering each of a plurality of cross sections. In the present embodiment, the cooling unit 12 may include a plurality of pipes, and an inlet and an outlet may be attached to each pipe. 3 and 4 are diagrams showing modifications of the pipe formed in the cooling unit.

  FIG. 3 shows a single path that moves in the horizontal direction while reciprocating the three sections of the first, second, and third stages parallel to the contact surface between the cooling unit 12 and the CPU 11. It is the figure which expand | deployed the pipe 121A formed in the inside of the cooling unit 12 to 1 cross section so that a fluid may flow covering the cross section substantially. In practice, the pipe 121A illustrated in FIG. 3 travels through a connection flow path between a flow path that travels through the first-stage cross section and a flow path that travels through the second-stage cross section, and a second-stage cross section. Folded in each of the connection flow paths between the flow path and the flow path running through the third-stage cross section, and stored in the cooling unit 12.

  In addition, the pipe 121a shown in FIG. 4 is provided inside the cooling unit 12 so that the fluid flows substantially covering the cross section by a path that moves in the horizontal direction while reciprocating the cross section of the first stage in the vertical direction. It is formed. In addition, the pipe 121b shown in FIG. 4 is provided inside the cooling section 12 so that the fluid flows substantially covering the cross section by a path that moves in the horizontal direction while reciprocating the cross section of the second stage in the vertical direction. It is formed. In addition, the pipe 121c shown in FIG. 4 is provided inside the cooling unit 12 so that the fluid flows substantially covering the cross section through a path that moves in the horizontal direction while reciprocating the cross section of the third stage in the vertical direction. It is formed. And in the case shown in FIG. 4, an inflow port and an outflow port are attached to the pipe 121a, the pipe 121b, and the pipe 121c, respectively.

  The configuration example shown in FIGS. 3 and 4 can further improve the cooling effect of the CPU 11 by the fluid. In the present embodiment, the travel path of the cooling pipe can be formed in any number of stages in one or more directions as long as the entire CPU 11 can be cooled by the fluid. For example, the pipe 121A has a path that moves in the horizontal direction while reciprocating in the vertical direction in each of the first and third sections, and the second section moves in the vertical direction while reciprocating in the horizontal direction. It may be formed in a path.

  The CPU manufacturer can present a standardized cooling method by manufacturing the CPU chip illustrated in FIGS. For example, the CPU manufacturer can describe the standard cooling conditions for the CPU chip 10 in the specifications of the CPU chip 10. FIG. 5 is a diagram illustrating an example of the cooling method of the CPU chip according to the present embodiment.

  “CPU Type A (without Fin)” illustrated in FIG. 5 indicates the CPU chip 10 illustrated in FIG. Further, “CPU Type B (with Fin)” illustrated in FIG. 5 indicates the CPU chip 10 ′ illustrated in FIG. 2. In addition, FIG. 5 illustrates a cooling condition when water having a water temperature of 20 ° C. or less flows in the pipe 121. Further, the “necessary flow rate” shown in FIG. 5 indicates a flow rate required for cooling the temperature of the CPU chip 10 to 20 ° C. or less according to the load (usage rate) of the CPU chip 10.

  FIG. 5 shows that the required flow rate when the load (usage rate) of the CPU chip 10 is “25% or less” is “x1 cc / min”. FIG. 5 shows that the pressure difference between the inlet 122 and the outlet 123 may be “y1 Pa” in order to be “x1 cc / min”.

  FIG. 5 shows that the required flow rate when the load (usage rate) of the CPU chip 10 is “greater than 25% and 50% or less” is “x2 cc / min”. Further, FIG. 5 shows that the pressure difference between the inflow port 122 and the outflow port 123 may be “y2 Pa” in order to achieve “x2 cc / min”.

  Further, FIG. 5 shows that the required flow rate when the load (usage rate) of the CPU chip 10 is “greater than 50% and equal to or less than 100%” is “x3 cc / min”. FIG. 5 shows that the pressure difference between the inlet 122 and the outlet 123 may be “y3 Pa” in order to achieve “x3 cc / min”.

  On the other hand, FIG. 5 shows that the required flow rate when the load (usage rate) of the CPU chip 10 ′ is “25% or less” is “x4 cc / min”. FIG. 5 shows that the pressure difference between the inflow port 122 and the outflow port 123 may be “y4 Pa” in order to achieve “x4 cc / min”.

  Further, FIG. 5 shows that the required flow rate when the load (usage rate) of the CPU chip 10 ′ is “greater than 25% and 50% or less” is “x5 cc / min”. FIG. 5 shows that the pressure difference between the inflow port 122 and the outflow port 123 may be “y5 Pa” in order to achieve “x5 cc / min”.

  Further, FIG. 5 shows that the required flow rate when the load (usage rate) of the CPU chip 10 ′ is “greater than 50% and equal to or less than 100%” is “x6 cc / min”. FIG. 5 shows that the pressure difference between the inflow port 122 and the outflow port 123 may be “y6 Pa” in order to achieve “x6 cc / min”.

  The cooling conditions illustrated in FIG. 5 can be described in the specifications by the CPU manufacturer by manufacturing a chip in which the CPU 11 and the cooling unit 12 are integrated as described above. Conventionally, the CPU cooling device is manufactured so that it can be attached to various CPUs for general purposes. For this reason, conventionally, information processing device manufacturers have purchased a CPU cooling device and a CPU from different manufacturers, and performed complex thermal design based on the specifications of the purchased CPU cooling device and the purchased CPU specifications. Thus, an information processing apparatus having a target processing capability has been manufactured.

  On the other hand, in the present embodiment, the CPU manufacturer manufactures the CPU chip 10 and the CPU chip 10 ′ in which the CPU 11 and the cooling unit 12 are integrated, thereby illustrating the information processing apparatus manufacturer in FIG. 5. A standardized cooling method can be presented.

  Thereby, an information processing device manufacturer such as a PC can manufacture an information processing device based on an optimum cooling method with reference to the specification illustrated in FIG. 5 without performing complicated thermal design. .

  The information processing apparatus includes a CPU chip 10 and a CPU chip 10 ′ in which the CPU 11 and the cooling unit 12 are integrated. The information processing apparatus further includes a pump that is connected to the inlet 122 and the outlet 123 via a pipe (hose) and changes the flow rate of the fluid in the pipe 121 according to the usage rate of the CPU 10. FIG. 6 is a diagram illustrating a configuration example of an information processing apparatus including the CPU chip according to the present embodiment.

  FIG. 6 illustrates a server as an information processing apparatus according to the present embodiment. For example, as shown in FIG. 6, the CPU chip 10 is attached to the motherboard 20 and mounted on the server main body 100. Here, as illustrated in FIG. 6, an inflow port 101 and an outflow port 102 are attached to the side surface of the server main body 100. The inlet 122 and the inlet 101 are connected by a hose, and the outlet 123 and the outlet 102 are connected by a hose.

  As shown in FIG. 6, a pump 200 is installed in the vicinity of the server main body 100. The pump 200 is provided with an outlet 202 and an inlet 203. Outflow port 202 and inflow port 101 are connected by a hose, and inflow port 203 and outflow port 102 are connected by a hose.

  Although not shown, the pump 200 has a tank for storing water, a cooler for keeping the temperature of the water stored in the tank at 20 ° C. or less, and a drive for returning the water stored in the tank in the flow path. Part.

  The pump 200 has a control circuit 201 as shown in FIG. The control circuit 201 is an electronic circuit composed of, for example, a microcomputer and a memory. In this memory, for example, a necessary flow rate corresponding to the load of the CPU chip 10 shown in FIG. 5 is stored. The control circuit 201 acquires the usage rate (load) of the CPU 11. For example, the server main body 100 is equipped with a basic input / output system (BIOS) that is connected to the CPU chip 10 and can detect the load state of the CPU 11. For example, the BIOS notifies the control circuit 201 of the usage rate of the CPU 11 by wireless communication.

  And the control circuit 201 performs control which changes the flow volume of the fluid discharged | emitted from the pump 200 according to the acquired usage rate. For example, when the usage rate of the CPU 11 is 45%, the control circuit 201 controls the drive unit so as to be “x2 cc / min”.

  That is, the manufacturer of the information processing device sets the information related to the cooling method illustrated in FIG. 5 in the control circuit 201 so that the CPU chip 10 (CPU 11) mounted on the server main body 100 is always 20 ° C. or lower. Server can be designed. In other words, in this embodiment, the manufacturer of the information processing apparatus can greatly reduce the labor of desk study in the first thermal design.

  In the present embodiment, the control circuit 201 may perform control to change the flow rate of the fluid flowing out from the pump 200 as a result by changing and controlling the pressure difference according to the usage rate. Further, the present embodiment may be a case where a function as the control circuit 201 is added to the BIOS. Further, the present embodiment may be a case where the pump 200 is built in the server main body 100.

  Further, the present embodiment may be a case where a plurality of CPU chips according to the present embodiment are mounted on the server main body 100. In such a case, the CPU chips are connected in series by a hose and connected to the pump 200. When a plurality of CPU chips having different specifications (for example, the CPU chip 10 and the CPU chip 10 ′) are mounted, the control circuit 201 is preferably set to control the flow rate according to the largest necessary flow rate. is there.

  Moreover, this embodiment may be a case where the pump 200 is installed in each CPU chip when a plurality of CPU chips according to this embodiment are mounted. In the present embodiment, as illustrated in FIG. 4, when a CPU chip having a plurality of pipes is used, the pump 200 may be installed in each pipe.

  In any case, as compared with the conventional case, the manufacturer of the information processing apparatus can easily perform the thermal design with reference to the specifications of the CPU chip.

  In the above description, the electronic circuit integrated with the cooling unit 12 is an arithmetic circuit. However, in the present embodiment, the electronic circuit integrated with the cooling unit 12 may be an electronic circuit as a storage device such as a semiconductor memory element. Such a memory chip can be mounted on an information processing apparatus after being connected in series with a CPU chip, for example.

  As described above, according to the present embodiment, a standardized cooling method can be presented.

  Although several embodiments of the present invention have been described, these embodiments are presented by way of example and are not intended to limit the scope of the invention. These embodiments can be implemented in various other forms, and various omissions, replacements, and changes can be made without departing from the spirit of the invention. These embodiments and their modifications are included in the scope and gist of the invention, and are also included in the invention described in the claims and the equivalents thereof.

10 CPU chip 11 CPU
12 Cooling part 121 Pipe 122 Inlet 123 Outlet

Claims (6)

An arithmetic circuit for performing arithmetic processing;
A cooling unit that has a flow path in which a cooling fluid flows, and in which an inflow port and an outflow port of the fluid with respect to the flow path are attached and integrated with the arithmetic circuit;
An arithmetic processing apparatus comprising:   The arithmetic processing apparatus according to claim 1, wherein the cooling unit further includes at least one of a fin and a pin inside.   The arithmetic processing apparatus according to claim 1, wherein the flow path is formed inside the cooling unit so that the entire arithmetic circuit is cooled by the fluid.   The arithmetic processing apparatus according to claim 1, wherein the cooling unit includes a plurality of the flow paths, and an inflow port and an outflow port are attached to each flow path. An arithmetic processing unit having a flow path through which a cooling fluid flows, and a cooling unit to which an inlet and an outlet of the fluid are attached to the flow path are integrated with an arithmetic circuit that performs arithmetic processing; ,
A pump that is connected to the inflow port and the outflow port through a pipe and changes the flow rate of the fluid in the flow path according to the usage rate of the arithmetic circuit;
An information processing apparatus comprising: A control unit that obtains a usage rate of the arithmetic circuit and performs control to change a flow rate of the fluid flowing out of the pump according to the obtained usage rate;
The information processing apparatus according to claim 5, further comprising:

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