JP2015145054A - Composite substrate polishing method and composite substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a composite substrate polishing method where the prevention effect of outer periphery sagging is stably obtained without making difference in each polishing and to provide a composite substrate.SOLUTION: A support substrate 14 side of a composite substrate 10 joining a piezoelectric substrate 12 and a support substrate 14 is attached to the rear surface of a substrate carrier 126 via a suede sheet 130. The substrate carrier 126 is pressed toward a polishing surface plate 122 so that the piezoelectric substrate 12 is brought into contact with the polishing surface plate 122 to which a suede pad 132 adheres. The piezoelectric substrate 12 is polished by rotating the substrate carrier 126 and the polishing surface plate 122 while supplying a slurry containing colloidal silica to the suede pad 132. The suede pad 132 and the suede sheet 130 are deformed by the composite substrate 10 when the substrate carrier 126 is pressed toward the polishing surface plate 122.

Description

  The present invention relates to a composite substrate polishing method and a composite substrate.

  Conventionally, a composite substrate for an acoustic wave device in which a support substrate and a piezoelectric substrate are joined is known. Examples of the acoustic wave device include a composite substrate in which a comb-shaped electrode capable of exciting a surface acoustic wave is provided on the surface of a piezoelectric substrate. If a support substrate having a thermal expansion coefficient smaller than that of the piezoelectric substrate is used, a change in the size of the piezoelectric substrate when the temperature changes is suppressed, so that a change in frequency characteristics of the acoustic wave device is suppressed.

  In order to flatten the surface of the composite substrate on the piezoelectric substrate side, chemical mechanical polishing (CMP) is widely performed. CMP is a technology that increases the mechanical polishing effect by the relative movement between the polishing agent and the substrate by the surface chemical action of the polishing agent itself or the chemical components contained in the polishing liquid, and obtains a smooth polished surface at high speed. is there. A polishing apparatus for performing CMP includes a disk-like and large-diameter polishing surface plate to which a polishing pad is attached, a disk-like and small-diameter substrate carrier, and a pipe for supplying polishing slurry to the polishing pad. Yes. In order to polish the composite substrate, first, the support substrate side of the composite substrate is attached to the substrate carrier. Then, the substrate carrier is pressed against the polishing surface plate so that the piezoelectric substrate contacts the polishing surface plate to which the polishing pad is attached, and the substrate carrier and the polishing surface plate are rotated while supplying the polishing slurry to the polishing pad. Let

  In order to flatten the piezoelectric substrate, CMP is performed using a urethane pad as a polishing pad and a slurry containing colloidal silica as a polishing slurry, and then a suede pad is used as a polishing pad to remove damage to the piezoelectric substrate. Then, CMP is performed. Suede pads are softer than urethane pads. Therefore, when CMP is performed using a suede pad, the suede pad may be pushed and depressed by the piezoelectric substrate, and the outer peripheral edge of the piezoelectric substrate may be excessively polished to cause the outer periphery to be flattened, which may impair flattening. In Patent Document 1, a retainer ring is disposed at a position surrounding the substrate in order to prevent such drooping of the outer periphery.

JP 2008-302464 A

  However, in the outer periphery drooping prevention technique using the retainer ring, not only the substrate but also the retainer ring is simultaneously scraped during the polishing, so that there is a problem that the effect obtained for each polishing is different.

  The present invention has been made to solve the above-described problems, and has as its main object to stably obtain the peripheral sagging prevention effect without being different for each polishing.

  In order to achieve the above-mentioned main object, the composite substrate polishing method of the present invention employs the following means.

The first composite substrate polishing method of the present invention comprises:
The support substrate side of the composite substrate obtained by bonding the piezoelectric substrate and the support substrate is attached to a substrate carrier, and the substrate carrier is attached to the polishing surface plate so that the piezoelectric substrate contacts the polishing surface plate to which a polishing pad is attached. A method of polishing a composite substrate, wherein the piezoelectric substrate is polished by rotating the substrate carrier and the polishing platen while pressing toward the polishing pad while supplying a polishing slurry to the polishing pad,
A suede pad is used as the polishing pad, the support substrate side of the composite substrate is attached to the substrate carrier via an elastic sheet, and the suede pad and the elastic sheet move the substrate carrier toward the polishing surface plate. When pressed, it is deformed by the composite substrate.

  In this composite substrate polishing method, a suede pad is used as a polishing pad, and the support substrate side of the composite substrate is attached to the substrate carrier via an elastic sheet. Then, the substrate carrier is pressed toward the polishing surface plate so that the piezoelectric substrate contacts the polishing surface plate with the suede pad attached, and the substrate carrier and the polishing surface plate are rotated while supplying the polishing slurry to the polishing pad. Let Thereby, the piezoelectric substrate of the composite substrate is polished and thinned. During polishing, the suede pad is depressed by the composite substrate, but the elastic sheet acts as a cushion, so that the amount of recess of the suede pad is reduced compared to the case where the composite substrate is attached to the substrate carrier without using the elastic sheet. . The outer periphery of the piezoelectric substrate (overpolishing of the outer periphery) tends to increase as the dent amount of the suede pad increases. Here, since the amount of the recess is relaxed, it is possible to prevent the outer periphery from sagging. Further, since the elastic sheet contracts to prevent the outer periphery from sagging, there is no possibility that the elastic sheet is scraped during polishing unlike the retainer ring. Therefore, the outer periphery drooping prevention effect is stably obtained without being different for each polishing.

  In the first composite substrate polishing method of the present invention, the elastic sheet may be a sheet having an elastic modulus close to that of a suede pad. If it carries out like this, since the deformation | transformation condition of a polishing pad and an elastic sheet is the same grade, it is easy to acquire the effect of this invention. Alternatively, the elastic sheet may be the same material as the suede pad. In this case, since the polishing pad and the elastic sheet are the same, the effect of the present invention can be obtained more easily.

  The first composite substrate of the present invention is a composite substrate obtained by the above-described polishing method for the first composite substrate. This composite substrate has a thin piezoelectric substrate whose outer periphery is suppressed.

The second composite substrate polishing method of the present invention comprises:
A support substrate side of a composite substrate obtained by bonding a piezoelectric substrate and a support substrate is directly attached to a substrate carrier, and the substrate carrier is placed on the polishing platen so that the piezoelectric substrate contacts a polishing platen to which a polishing pad is attached. A method of polishing a composite substrate, wherein the piezoelectric substrate is polished by rotating the substrate carrier and the polishing surface plate while pressing the substrate toward the polishing pad while supplying a polishing slurry to the polishing pad,
A suede pad is used as the polishing pad, and a composite substrate in which the thickness of the piezoelectric substrate is gradually increased from the central portion toward the outer peripheral portion is used.

  In this composite substrate polishing method, a suede pad is used as a polishing pad, and a composite substrate in which the thickness of the piezoelectric substrate is gradually increased from the central portion toward the outer peripheral portion is used. Then, the substrate carrier is pressed toward the polishing surface plate so that the piezoelectric substrate contacts the polishing surface plate with the suede pad attached, and the substrate carrier and the polishing surface plate are rotated while supplying the polishing slurry to the polishing pad. Let Thereby, the piezoelectric substrate of the composite substrate is polished and thinned. During polishing, the suede pad is depressed by the composite substrate, so that the outer peripheral portion of the piezoelectric substrate is excessively polished. However, since the outer peripheral portion of the piezoelectric substrate before polishing is thicker than the central portion, the outer peripheral portion is excessively polished during polishing, so that there is no difference in thickness between the outer peripheral portion and the central portion after polishing. It becomes flat. As described above, since the outer peripheral edge is prevented by changing the thickness between the outer peripheral portion and the central portion of the piezoelectric substrate, it is not scraped during polishing unlike the retainer ring. Therefore, the outer periphery drooping prevention effect is stably obtained without being different for each polishing.

  In the second composite substrate polishing method according to the present invention, the composite substrate in which the thickness of the piezoelectric substrate is gradually increased from the central portion toward the outer peripheral portion is formed on the support substrate side of the composite substrate that was originally flat. The substrate carrier is pressed against the polishing surface plate so that the piezoelectric substrate comes into contact with the polishing surface plate attached to the substrate carrier, and a urethane pad is adhered thereto, and the central portion of the composite substrate is positioned more than the outer peripheral portion. You may make it obtain by rotating the said substrate carrier and the said polishing surface plate, supplying polishing slurry to the said urethane pad in the state pressed strongly. In this way, a composite substrate in which the thickness of the piezoelectric substrate is gradually increased from the central portion toward the outer peripheral portion can be produced relatively easily. Alternatively, instead of pressing the central portion of the composite substrate more strongly than the outer peripheral portion, the substrate carrier and the polishing platen so that a part of the outer peripheral portion of the composite substrate that was originally flat plate protrudes from the polishing surface plate. The relative position may be adjusted. Also in this case, a composite substrate in which the thickness of the piezoelectric substrate is gradually increased from the central portion toward the outer peripheral portion can be produced relatively easily.

  The second composite substrate of the present invention is a composite substrate obtained by the above-described polishing method for the second composite substrate.

The perspective view of the composite substrate 10 before grinding | polishing. The perspective view of the composite substrate 50 after grinding | polishing. Explanatory drawing of the method of grind | polishing the piezoelectric substrate 12 of the composite substrate 10 before grinding | polishing, and obtaining the composite substrate 50. FIG. Explanatory drawing of the grinding | polishing apparatus 120. FIG. Explanatory drawing of the method of grind | polishing the piezoelectric substrate 12 of the composite substrate 10 before grinding | polishing, and obtaining the composite substrate 50. FIG. Explanatory drawing of another method for obtaining the composite substrate 30. FIG.

[First Embodiment]
FIG. 1 is a perspective view of the composite substrate 10 before polishing, and FIG. 2 is a perspective view of the composite substrate 50 after polishing. The composite substrate 10 before polishing includes a piezoelectric substrate 12 and a support substrate 14. The composite substrate 50 after polishing is obtained by polishing and thinning the piezoelectric substrate 12 of the composite substrate 10 before polishing.

  The piezoelectric substrate 12 is a substrate capable of propagating elastic waves. As the material of the piezoelectric substrate 12, lithium tantalate (LT), lithium niobate (LN), lithium niobate-lithium tantalate solid solution single crystal, crystal, lithium borate, zinc oxide, aluminum nitride, langasite (LGS) ), Langate (LGT) and the like. Of these, LT or LN is preferred. This is because LT and LN have a high propagation speed of surface acoustic waves and a large electromechanical coupling coefficient, and are therefore suitable as acoustic wave devices for high frequencies and wideband frequencies. The size of the piezoelectric substrate 12 is, for example, 50 to 150 mm in diameter and 0.1 to 50 μm in thickness. Table 1 shows thermal expansion coefficients of typical materials used for the piezoelectric substrate 12.

  The support substrate 14 is a substrate that supports the piezoelectric substrate 12, and is bonded to the back surface of the piezoelectric substrate 12 by direct bonding or via an organic adhesive layer. Examples of the material of the support substrate 14 include silicon, sapphire, aluminum nitride, alumina, borosilicate glass, quartz glass, LT, LN, lithium niobate-lithium tantalate solid solution single crystal, lithium borate, LGS, and quartz. It is done. The support substrate 14 preferably has a smaller thermal expansion coefficient than the piezoelectric substrate 12. By making the support substrate 14 have a smaller thermal expansion coefficient than that of the piezoelectric substrate 12, the change in size of the piezoelectric substrate 12 when the temperature changes is suppressed, and the composite substrate 10 is used as an elastic wave device. The temperature change of the frequency characteristic can be suppressed. For example, when the material of the piezoelectric substrate 12 is LT or LN, the material of the support substrate 14 is preferably silicon, sapphire, aluminum nitride, alumina, or the like.

  Next, the manufacturing procedure of the composite substrate 10 before polishing will be described. First, a piezoelectric substrate 12 having a thickness of 100 to 1000 μm and a support substrate 14 having a thickness of 100 to 1000 μm are prepared, and both are bonded by direct bonding or bonded via an organic adhesive layer to produce a composite substrate 10. In the case of bonding by direct bonding, first, the bonding surfaces of the piezoelectric substrate 12 and the support substrate 14 are activated, and then both the substrates 12 and 14 are pressed with the bonding surfaces facing each other. The bonding surface is activated by, for example, irradiation of an ion beam of an inert gas (such as argon) to the bonding surface, or irradiation of plasma or a neutral atom beam. On the other hand, when bonding through an organic adhesive layer, for example, an epoxy resin or an acrylic resin is used as the organic adhesive layer.

  Next, a method of obtaining the composite substrate 50 by polishing the piezoelectric substrate 12 of the composite substrate 10 before polishing will be described below with reference to FIG. FIG. 3 is an explanatory diagram showing a polishing procedure of the composite substrate 10. First, a piezoelectric substrate 12 having a thickness of 100 to 1000 μm and a support substrate 14 having a thickness of 100 to 1000 μm are prepared, and both are bonded by direct bonding or bonded via an organic adhesive layer to produce a composite substrate 10 (FIG. 3 (a)). In the case of bonding by direct bonding, first, the bonding surfaces of the piezoelectric substrate 12 and the support substrate 14 are activated, and then both the substrates 12 and 14 are pressed with the bonding surfaces facing each other. The bonding surface is activated by, for example, irradiation of an ion beam of an inert gas (such as argon) to the bonding surface, or irradiation of plasma or a neutral atom beam. On the other hand, when bonding through an organic adhesive layer, for example, an epoxy resin or an acrylic resin is used as the organic adhesive layer.

  Subsequently, the piezoelectric substrate 12 of the composite substrate 10 is ground by a grinder so as to have a thickness of several tens of μm. Further, the piezoelectric substrate 12 is polished by CMP to reduce the thickness (see FIG. 3B). CMP is performed using a polishing apparatus 120 shown in FIG. The polishing apparatus 120 includes a disk-shaped, large-diameter polishing surface plate 122, a disk-shaped, small-diameter substrate carrier 126, and a pipe 129 that supplies a slurry containing an abrasive onto the polishing surface plate 122. The polishing surface plate 122 has a shaft 122a at the center of the back surface, and rotates when the shaft 122a is rotationally driven by a drive motor (not shown). The polishing surface plate 122 has a urethane pad 124 attached to the surface. The substrate carrier 126 has a shaft 126a at the center of the upper surface, and rotates when the shaft 126a is rotationally driven by a drive motor (not shown). The substrate carrier 126 is disposed at a position shifted from the center of the polishing surface plate 122. The pipe 129 is disposed in the vicinity of the substrate carrier 126 and serves to supply a slurry containing an abrasive to the urethane pad 124. A method of using the polishing apparatus 120 will be described. First, the support substrate 14 side of the composite substrate 10 is fixed to the lower surface of the substrate carrier 126 using wax. Next, while the piezoelectric substrate 12 of the composite substrate 10 is in contact with the urethane pad 124, the polishing surface plate 122 and the substrate carrier 126 are rotated while the diamond slurry is supplied from the pipe 129 to the urethane pad 124. Thereby, the piezoelectric substrate 12 is further thinned.

  Subsequently, final finishing of the piezoelectric substrate 12 is performed (see FIGS. 3C and 3D). That is, the composite substrate 10 is removed from the substrate carrier 126 and the suede sheet 130 is attached to the substrate carrier 126. Then, after sufficiently spraying pure water on the suede sheet 130, the support substrate 14 side of the composite substrate 10 is pressed against the suede sheet 130. As a result, the composite substrate 10 is held on the substrate carrier 126 via the suede sheet 130. Further, the urethane pad 124 is replaced with a suede pad 132. Then, the polishing surface plate 122 and the substrate carrier 126 are axially rotated while supplying slurry containing colloidal silica from the pipe 129 to the suede pad 132. Thereby, damage to the piezoelectric substrate 12 can be removed.

  In the final finish, the suede pad 132 is depressed by the composite substrate 10, but the suede sheet 130 serves as a cushion, so that the suede pad 132 is compared with the case where the composite substrate 10 is attached to the substrate carrier 126 without the suede sheet 130. The amount of dent 132 is reduced. The outer periphery of the piezoelectric substrate 12 (overpolishing of the outer periphery) tends to increase as the dent amount of the suede pad 132 increases. Here, since the amount of the recess is relaxed, it is possible to prevent the outer periphery from sagging. Note that the role of the suede sheet 130 is to absorb the stress locally applied to the outer peripheral portion of the composite substrate 10.

  According to this embodiment described above in detail, in the final finishing, the suede sheet 130 is recessed to reduce the amount of depression of the suede pad 132 and prevent the outer periphery of the piezoelectric substrate 12 from being bent. There is no such thing as scraping. Therefore, the outer periphery drooping prevention effect is stably obtained without being different for each polishing.

  Further, since the suede pad 132 and the suede sheet 130 are made of the same material, the above-described effects can be easily obtained.

  In the above-described embodiment, before the final finishing, the urethane pad 124 is replaced with the suede pad 132 while the composite substrate 10 is attached to the substrate carrier 126, and the slurry containing colloidal silica is supplied to the suede pad 132. However, further polishing may be performed, and then final finishing may be performed. In the final finish, as described above, the composite substrate 10 is removed from the substrate carrier 126, the composite substrate 10 is attached to the substrate carrier 126 via the suede sheet 130, and the piezoelectric substrate is supplied while supplying slurry containing colloidal silica to the suede pad 132. 12 is polished. Even if it does in this way, the effect similar to embodiment mentioned above is acquired.

[Second Embodiment]
In the second embodiment, the composite substrate 10 before polishing shown in FIG. 1 is polished by a method different from that of the first embodiment. The polishing procedure will be described below with reference to FIG.

  First, a piezoelectric substrate 12 having a thickness of 100 to 1000 μm and a support substrate 14 having a thickness of 100 to 1000 μm are prepared, and both are bonded by direct bonding or bonded via an organic adhesive layer to produce a composite substrate 10 (FIG. 5 (a)). Since this point is the same as that of the first embodiment, detailed description is omitted.

  Subsequently, the piezoelectric substrate 12 of the composite substrate 10 is ground with a grinder so as to have a thickness of several tens of μm. Further, the piezoelectric substrate 12 is polished by CMP, and the thickness of the piezoelectric substrate 12 is increased from the central portion 12b toward the outer peripheral portion 12a. A composite substrate 30 that is gradually thickened is obtained (see FIGS. 5B and 5C). CMP is performed using the polishing apparatus 120 shown in FIG. 4 as in the first embodiment. First, the support substrate 14 side of the composite substrate 10 is fixed to the lower surface of the substrate carrier 126 using wax. Next, while the piezoelectric substrate 12 of the composite substrate 10 is in contact with the urethane pad 124, the polishing surface plate 122 and the substrate carrier 126 are rotated while the diamond slurry is supplied from the pipe 129 to the urethane pad 124. At this time, a ring-shaped weight 128 is placed on the central portion of the substrate carrier 126 so that the pressing force at the central portion of the substrate carrier 126 is larger than that of the outer peripheral portion. By doing so, the thickness of the piezoelectric substrate 12 gradually increases from the central portion 12b toward the outer peripheral portion 12a. In this case, since the stress due to the weight 128 applied to the central portion of the composite substrate 10 is sufficiently larger than the local stress applied to the peripheral portion of the composite substrate 10, the outer periphery can be ignored.

  Subsequently, final finishing of the piezoelectric substrate 12 is performed (see FIGS. 5D and 5E). That is, with the composite substrate 30 attached to the substrate carrier 126, the weight 128 is removed and the urethane pad 124 is replaced with the suede pad 132. Then, the polishing surface plate 122 and the substrate carrier 126 are axially rotated while supplying slurry containing colloidal silica from the pipe 129 to the suede pad 132. Thereby, damage to the piezoelectric substrate 12 can be removed.

  In the final finishing, since the suede pad 132 is depressed by the composite substrate 30, the outer peripheral portion of the piezoelectric substrate 12 is excessively polished. However, since the outer peripheral portion 12a of the piezoelectric substrate 12 before polishing is thicker than the central portion 12b, the outer peripheral portion 12a is excessively polished during polishing, resulting in a difference in thickness between the outer peripheral portion 12a and the central portion 12b after polishing. Disappears and becomes flat.

  According to the present embodiment described in detail above, since the outer periphery is prevented by changing the thickness of the outer peripheral portion 12a and the central portion 12b of the piezoelectric substrate 12 before final finishing polishing, it is being polished like a retainer ring. There is no such thing as scraping. Therefore, the outer periphery drooping prevention effect is stably obtained without being different for each polishing.

  Further, the composite substrate 30 in which the thickness of the piezoelectric substrate 12 is gradually increased from the central portion 12b toward the outer peripheral portion 12a can be manufactured relatively easily. Instead of performing the CMP by placing the weight 128 on the center of the substrate carrier 126, as shown in FIG. 6, a part of the outer peripheral portion of the composite substrate 10 protrudes from the polishing surface plate 122 to which the urethane pad 124 is attached. Thus, CMP may be performed in a state where the relative position between the substrate carrier 126 and the polishing surface plate 122 is adjusted. Also in this case, the composite substrate 30 can be manufactured relatively easily.

[Example 1]
An LT substrate having a diameter of 4 inches and a thickness of 250 μm and a Si substrate having a diameter of 4 inches and a thickness of 230 μm were prepared. First, an epoxy resin was applied to the surface of the Si substrate with a spin coater (rotation speed: 1000 rpm) so as to have a film thickness of 1 μm. Then, the LT substrate was bonded to the Si substrate via an epoxy resin, and the resin was cured in an oven at 150 ° C. to obtain a composite substrate. The surface of the LT substrate opposite to the bonding surface with the Si substrate was ground with a grinder, so that the thickness of the LT substrate was 25 μm. Subsequently, the polishing apparatus 120 shown in FIG. 4 is prepared, the Si substrate side of the composite substrate is attached to the substrate carrier 126 with wax, a urethane pad 124 is placed on the polishing surface plate 122, and a diamond slurry (particle size 1 μm) is used. The LT substrate was lapped. After lapping, the composite substrate was removed from the substrate carrier 126, and the suede sheet 130 was attached to the substrate carrier 126. Then, after sufficiently spraying pure water on the suede sheet 130, the Si substrate side of the composite substrate was pressed against the suede sheet 130. As a result, the composite substrate was held on the substrate carrier 126 via the suede sheet 130. In addition, the urethane pad 124 was replaced with a suede pad 132. Then, the polishing surface plate 122 and the substrate carrier 126 were axially rotated while supplying the slurry containing colloidal silica from the pipe 129 to the suede pad 132, and the LT substrate was finally finished (damage removal). The final finishing was performed until the polishing amount at the center portion of the LT substrate became 5 μm. At this time, the polishing amount on the outer periphery of the LT substrate was 4.7 μm. That is, the difference between the inner and outer circumferences of the LT substrate after final finishing was 0.3 μm, which was a very small value.

[Example 2]
In the same manner as in Example 1, a composite substrate was obtained in which the LT substrate was bonded to the Si substrate via an epoxy resin. The surface of the LT substrate opposite to the bonding surface with the Si substrate was ground with a grinder, so that the thickness of the LT substrate was 25 μm. Subsequently, the polishing apparatus 120 shown in FIG. 4 was prepared, the composite substrate was attached to the substrate carrier 126 with wax, the urethane pad 124 was placed on the polishing surface plate 122, and lapping was performed using a diamond slurry (particle size 1 μm). . At this time, a weight 128 having a weight of 50 g was placed on the central portion of the substrate carrier 126 so that the pressing force at the central portion of the substrate carrier 126 was larger than that of the outer peripheral portion. As a result, the thickness of the LT substrate gradually increased from the central portion toward the outer peripheral portion. There was a difference in thickness of 3.6 μm between the center portion and the outer peripheral portion of the LT substrate. Subsequently, with the composite substrate attached to the substrate carrier 126, the weight 128 was removed, and the urethane pad 124 was replaced with the suede pad 132. Then, the polishing surface plate 122 and the substrate carrier 126 were axially rotated while supplying the slurry containing colloidal silica from the pipe 129 to the suede pad 132, and the LT substrate was finally finished (damage removal). The final finishing was performed until the polishing amount of the outer peripheral portion of the LT substrate became 4 μm. At this time, the polishing amount of the center portion of the LT substrate was 0.1 μm and was hardly polished. The difference between the inner and outer circumferences of the LT substrate after final finishing was 0.3 μm, which was a very small value.

[Comparative Example 1]
The composite substrate was polished in the same procedure as in Example 1 except that the step of attaching the suede sheet 130 to the substrate carrier 126 was omitted. When the thickness of the LT substrate was measured, the target value was 5 μm in the central portion, but the outer peripheral portion was 3.8 μm, and a difference of 1 μm or more from the central portion was obtained. From the results of the above Examples and Comparative Examples, the effect of the present invention was confirmed.

DESCRIPTION OF SYMBOLS 10 Composite substrate, 12 Piezoelectric substrate, 12a Outer peripheral part, 12b Center part, 14 Support substrate, 30 Composite substrate, 50 Composite substrate, 120 Polishing device, 122 Polishing surface plate, 122a Shaft, 124 Urethane pad, 126 Substrate carrier, 126a Shaft 128 weight, 129 pipe, 130 suede sheet, 132 suede pad.

Claims (6)

The support substrate side of the composite substrate obtained by bonding the piezoelectric substrate and the support substrate is attached to a substrate carrier, and the substrate carrier is attached to the polishing surface plate so that the piezoelectric substrate contacts the polishing surface plate to which a polishing pad is attached. A method of polishing a composite substrate, wherein the piezoelectric substrate is polished by rotating the substrate carrier and the polishing platen while pressing toward the polishing pad while supplying a polishing slurry to the polishing pad,
A suede pad is used as the polishing pad, the support substrate side of the composite substrate is attached to the substrate carrier via an elastic sheet, and the suede pad and the elastic sheet move the substrate carrier toward the polishing surface plate. Deformed by the composite substrate when pressed,
A method for polishing a composite substrate. The elastic sheet is a sheet having an elastic modulus close to that of the suede pad, or a sheet made of the same material as the suede pad.
The method for polishing a composite substrate according to claim 1.   A composite substrate obtained by the composite substrate polishing method according to claim 1. A support substrate side of a composite substrate obtained by bonding a piezoelectric substrate and a support substrate is directly attached to a substrate carrier, and the substrate carrier is placed on the polishing platen so that the piezoelectric substrate contacts a polishing platen to which a polishing pad is attached. A method of polishing a composite substrate, wherein the piezoelectric substrate is polished by rotating the substrate carrier and the polishing surface plate while pressing the substrate toward the polishing pad while supplying a polishing slurry to the polishing pad,
A suede pad is used as the polishing pad, and the composite substrate is one in which the thickness of the piezoelectric substrate is gradually increased from the central portion toward the outer peripheral portion,
A method for polishing a composite substrate. The composite substrate in which the thickness of the piezoelectric substrate is gradually increased from the central portion toward the outer peripheral portion was attached to the substrate carrier with the support substrate side of the composite substrate that was originally flat, and the urethane pad was attached. The substrate carrier is pressed toward the polishing surface plate so that the piezoelectric substrate contacts the polishing surface plate, and the center portion of the composite substrate is pressed more strongly than the outer peripheral portion or one of the outer peripheral portions of the composite substrate. The substrate carrier and the polishing platen are rotated while supplying the polishing slurry to the urethane pad in a state where the relative position between the substrate carrier and the polishing platen is adjusted so that the portion protrudes from the polishing platen. Get by,
The method for polishing a composite substrate according to claim 4.   A composite substrate obtained by the composite substrate polishing method according to claim 4 or 5.

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