JP2015141733A - Light unit and projection type video display device employing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a light unit which attains power saving by reducing resistance of an open measure circuit to a predetermined number of light sources in a central part among a plurality of light sources, and a projection type video display device employing the same.SOLUTION: The light unit includes: a plurality of light sources 12 disposed in a lattice shape; a substrate 112 connecting the light sources 12 arranged side by side on the same row electrically in series; and an open measure circuit which is disposed in an outer peripheral part of the plurality of light sources 12 and connected with a predetermined number of light sources 12 electrically in parallel among the plurality of light sources 12 connected electrically in series. In the open measure circuit, a current is not conducted while no open defect occurs in the predetermined number of light sources 12, and a current is conducted if an open defect occurs in at least any one light source 12 among the predetermined number of light sources 12. The substrate 112 includes a partial series connection part for connecting the predetermined number of light sources 12 on neighboring rows electrically in series, and the partial series connection part is connected with the open measure circuit electrically in parallel.

Description

  The present disclosure relates to a light source device using a plurality of solid state light sources. The present invention also relates to a projection display apparatus that generates image light using light emitted from the light source device and projects the image light onto a screen.

  Conventionally, a high-intensity high-pressure mercury lamp has been frequently used as a light source in a projection display apparatus. The high-pressure mercury lamp has a problem that the life of the light source is short and the maintenance becomes complicated. Instead of the high-pressure mercury lamp, it is proposed to use a solid light source such as a light emitting diode (LED) or a laser as the light source of the projection display. ing.

  Solid-state light sources have a longer life than high-pressure mercury lamps and have high light utilization efficiency due to their high directivity. Further, a wide color reproduction range can be realized by the monochromaticity.

  However, since the amount of light emitted from a single solid light source is small, a light source device in which a plurality of solid light sources are arranged densely has been proposed. (For example, Patent Document 1)

JP 2012-089601 A

  The LED, which is a solid-state light source of this light source device, has a plurality of LEDs arranged in a grid and each LED is electrically connected in series.

  And when a disconnection arises in at least 1 LED, since each LED is electrically connected in series, there exists a possibility that all LED may turn off.

  On the other hand, in Patent Document 1, at least one LED is connected by connecting an LED disconnection countermeasure bypass element as an open countermeasure circuit that conducts when each LED is disconnected in parallel to each LED. Even when disconnection occurs, the problem that all LEDs are turned off is solved.

  However, in the configuration of Patent Document 1, an open countermeasure circuit is electrically connected in parallel to each LED. Therefore, as many open countermeasure circuits as the number of solid state light sources are required.

  As a countermeasure, as shown in FIG. 16, open countermeasure circuits Y1 and Y2 are connected in parallel to a predetermined number (four) of solid-state light sources X1 and X2 arranged in the same line in series. As a result, the number of open countermeasure circuits is suppressed, and even when a disconnection occurs in at least one solid light source of the predetermined number (four), all (16 A configuration that prevents the solid state light source from being turned off can be considered.

  In order to connect an open countermeasure circuit in parallel to a predetermined number of solid light sources electrically connected in series, a predetermined number of solid light sources X1 at the outer peripheral portion among a plurality of solid light sources arranged in a lattice shape. Since the open countermeasure circuit Y1 can be arranged close to the corresponding solid-state light source X1, the distance of the lead wire Z1 to the open countermeasure circuit Y1 can be shortened.

  However, among the plurality of solid-state light sources arranged in a lattice shape, the open countermeasure circuit Y2 can be arranged close to the corresponding solid-state light source X2 with respect to the predetermined number of solid-state light sources X2 in the center. Absent.

  For this reason, since the distance of the lead wire Z2 to the open countermeasure circuit Y2 becomes long and the resistance of the open countermeasure circuit increases, the power increases when a current flows through the open countermeasure circuit Y2. There are drawbacks.

  The present disclosure is for solving the above-described problem, and uses a light source device that reduces power by reducing resistance of an open countermeasure circuit with respect to a predetermined number of light sources in a central portion among a plurality of light sources, and uses the same. An object of the present invention is to provide a projection display apparatus.

  The light source device according to the present disclosure includes a plurality of light sources arranged in a lattice shape, a substrate that electrically connects the light sources arranged in the same row in series, and an outer periphery of the plurality of light sources. An open countermeasure circuit electrically connected in parallel with a predetermined number of light sources among the plurality of light sources connected in series, wherein the predetermined number of light sources does not cause an open defect. In some cases, there is no current conduction, and the current conducts when at least one of the predetermined number of light sources has an open defect, and the substrate includes the predetermined number of light sources on adjacent rows. Are connected in series, and the partial series connection is electrically connected to the open circuit in parallel.

  Power saving can be achieved by reducing the resistance of the open countermeasure circuit with respect to the light source at the center of the plurality of light sources.

1 is an external perspective view of a projection display apparatus according to the present disclosure. It is a block diagram explaining the structure of the projection type video display apparatus concerning this indication. It is a schematic diagram explaining the optical structure of the projection type video display apparatus concerning this indication. It is an appearance perspective view of a 1st embodiment of a light source device concerning this indication. It is a disassembled perspective view of 1st Embodiment of the light source device which concerns on this indication. It is a rear view explaining composition of a 1st embodiment of a flexible printed circuit board concerning this indication. It is a mimetic diagram explaining the pattern of the flexible printed circuit board of a 1st embodiment concerning this indication. It is explanatory drawing of a structure of an open countermeasure circuit. It is a perspective view explaining composition of a 1st embodiment of a heat sink concerning this indication. It is a rear view explaining the composition of a 2nd embodiment of the flexible printed circuit board concerning this indication. It is a schematic diagram explaining the pattern of the flexible printed circuit board of 2nd Embodiment which concerns on this indication. It is a rear view explaining the composition of a 3rd embodiment of the flexible printed circuit board concerning this indication. It is a schematic diagram explaining the pattern of the flexible printed circuit board of 3rd Embodiment which concerns on this indication. It is a rear view explaining the composition of a 4th embodiment of the flexible printed circuit board concerning this indication. It is a schematic diagram explaining the pattern of the flexible printed circuit board of 4th Embodiment which concerns on this indication. It is a schematic diagram explaining the pattern of the open countermeasure circuit of the flexible printed circuit board of background art.

  Hereinafter, embodiments will be described in detail with reference to the drawings as appropriate. However, more detailed description than necessary may be omitted. For example, detailed descriptions of already well-known matters and repeated descriptions for substantially the same configuration may be omitted. This is to avoid the following description from becoming unnecessarily redundant and to facilitate understanding by those skilled in the art.

The applicant provides the accompanying drawings and the following description in order for those skilled in the art to fully understand the present disclosure, and is not intended to limit the subject matter described in the claims. Absent.
(Configuration of projection display device)
A configuration of the projection display apparatus 100 of the present disclosure will be described with reference to FIGS. 1 and 2. FIG. 1 is an external perspective view of the projection display apparatus 100. As shown in FIG. 1, the projection display apparatus 100 projects image light generated according to an image input signal onto a screen 500.

  FIG. 2 is a block diagram illustrating a configuration of the projection display apparatus 100. The projection display apparatus 100 includes a light source unit 10, a video generation unit 50 that generates video light in response to a video input signal, a light guide optical system 70 that guides light from the light source unit 10 to the video generation unit 50, A projection optical system 80 that projects the generated image light onto the screen 500 and a control unit 90 that controls the light source unit 10 and the image generation unit 50 are included.

As will be described in detail later, the light source unit 10 includes a semiconductor laser 12 and causes the phosphor to emit light using light from the semiconductor laser 12 as excitation light. The light guide optical system 70 includes optical members such as various lenses, mirrors, and rod integrators, and guides the light emitted from the light source unit 10 to the video generation unit 50. The video generation unit 50 uses an element such as a digital micromirror device (hereinafter abbreviated as DMD) or a liquid crystal panel, and spatially modulates light according to a video input signal to generate video light. The projection optical system 80 is configured by an optical member such as a lens or a mirror, and magnifies and projects spatially modulated light.
(Optical configuration of the projection display)
FIG. 3 is a schematic diagram for explaining an optical configuration of the projection display apparatus 100 using three DMDs.

  The light source unit 10 includes a plurality of blue semiconductor lasers 12, one light source holder 14 on which the plurality of semiconductor lasers 12 are mounted, and a heat sink 16 disposed on the back surface of the light source holder 14. The plurality of semiconductor lasers 12 are provided with lenses 20 corresponding to the respective semiconductor lasers 12, and blue (B) light emitted from the semiconductor lasers 12 is transmitted by the lenses 20, 22, 24 and the diffusion plate 26. , Collimated light and coherence are reduced.

  After passing through the diffusing plate 26, the light incident on the dichroic mirror 28 is directly used as light used to generate green (G) light and red (R) color light and blue (B) light by the phosphor. Separated from the light used. The cutoff wavelength of the dichroic mirror 28 is set in the vicinity of the wavelength of the B light emitted from the semiconductor laser 12. The dichroic mirror 28 separates light to be reflected and transmitted at a desired ratio according to the component ratio in the polarization direction of the light emitted from the semiconductor laser 12.

  The blue (B) light reflected from the dichroic mirror 28 (mainly, the S-polarized component of the blue (B) light) is applied to the phosphor wheel 32 via the condenser lens 30. The phosphor wheel 32 includes an aluminum substrate 36 having a phosphor layer 34 formed on the surface and a motor 38. The light converted into yellow (Ye) light by the phosphor layer 34 using blue (B) light as excitation light is reflected by the aluminum substrate 36 toward the dichroic mirror 28 side. The condenser lens 30 has a function of condensing blue (B) light incident on the phosphor wheel 32 and parallelizing yellow (Ye) light emitted from the phosphor wheel 32. Yellow (Ye) light emitted from the phosphor wheel 32 passes through the dichroic mirror 28.

  On the other hand, the blue (B) light (mainly, the P-polarized component of the B light) transmitted through the dichroic mirror 28 is applied to the diffuse reflector 44 via the quarter-wave plate 40 and the condenser lens 42. The quarter-wave plate 40 has a function of converting P-polarized blue (B) light into circularly-polarized light. The light incident on the diffuse reflector 44 is further reduced in coherence and reflected to the dichroic mirror 28 side.

  The condenser lens 42 has a function of condensing the blue (B) light incident on the diffuse reflection plate 44 and making the blue (B) light emitted from the diffuse reflection plate 44 parallel light. The quarter-wave plate 40 has a function of converting circularly polarized light reflected toward the dichroic mirror 28 into S-polarized light. The blue (B) light converted to S-polarized light is reflected by the dichroic mirror 28 and is combined with yellow (Ye) light transmitted through the dichroic mirror 28 to become white light.

  The synthesized white light is condensed by the condenser lens 72 and enters the rod integrator 74. The light incident on the rod integrator 74 is reflected a plurality of times inside the rod, so that the light intensity distribution is made uniform. The light emitted from the rod integrator 74 is collected by the relay lens 76, reflected by the mirror 78, passes through the field lens 52, and enters the total reflection prism 54.

  The total reflection prism 54 is composed of two prisms, and a thin air layer is formed on the adjacent surfaces of the prisms. The air layer totally reflects light incident at an angle greater than the critical angle. The light incident on the total reflection prism 54 via the field lens 52 is reflected by the total reflection surface S and enters the color prism 56.

Color prism 56 consists of three prisms, the proximity surface of each prism, blue (B) light reflection dichroic mirror surface DM _B and the red (R) light reflection dichroic mirror surface DM _R is formed. The light incident on the color prism 56, the blue (B) by the dichroic mirror surface DM _R of the light reflection dichroic mirror surface DM _B and the red (R) light reflection, blue (B) light, red (R) light and green (G) Separated into light.

Cutoff wavelength of the dichroic mirror surface DM _R, within the wavelength band of the generated yellow (Ye) light source unit 10, the red (R) so that the light and green (G) light has a desired light amount ratio Set to Blue (B) light, red (R) light, and green (G) light are incident on DMDs 58, 60, and 62, respectively. DMDs 58, 60, and 62 deflect micromirrors (not shown) in accordance with video input signals, and make light (video light) incident on the projection optical system 80 and light traveling outside the effective area of the projection optical system 80 ( Unnecessary light) and image light is generated.

  The generated image light passes through the color prism 56 again. In the process of passing through the color prism 56, the separated blue (B) light, red (R) light, and green (G) light are combined and enter the total reflection prism 54. Since the light incident on the total reflection prism 54 is incident on the total reflection surface S at a critical angle or less, it is transmitted and incident on the projection optical system 80. In this way, the image light is projected on the screen 500.

The light source unit 10 includes a plurality of solid state light sources (semiconductor lasers 12), and emits white light with high efficiency and good white balance. Therefore, it is possible to realize a projection-type image display device 100 having a long life and high brightness. In addition, since the DMDs 58, 60, and 62 are used for the image generation unit 50, the projection image display apparatus 100 having higher light resistance and heat resistance than the liquid crystal panel can be configured. Further, since three DMDs are used, color reproduction is good and a bright and high-definition projected image can be obtained.
(Configuration of light source device)
(First embodiment)
The configuration of the light source device 110 including the semiconductor laser 12 will be described with reference to FIGS.

  4 is an external perspective view of the light source device 110 including the semiconductor laser 12, and FIG. 5 is an exploded perspective view of the light source device 110. Here, the light emitting side of the semiconductor laser 12 is the front side and the opposite side is the back side.

  As shown in FIG. 5, the light source device 110 is arranged on the back side of the plurality of semiconductor lasers 12, one light source holder 14 on which the plurality of semiconductor lasers 12 are mounted in a lattice shape, and the light source holder 14. Heat sink 16.

  Between the light source holder 14 and the heat sink 16, a flexible printed circuit board (hereinafter abbreviated as FPC) 112 that electrically connects a plurality of semiconductor lasers 12 in series, lead wires 114 of the semiconductor laser 12, and light source holding. An insulator 111 for reliably insulating the body 14 is inserted. In the present disclosure, the semiconductor laser 12 includes 16 semiconductor lasers 12 arranged in 4 rows × 4 columns and is held by the light source holder 14.

The semiconductor laser 12 has two lead wires 114. When assembling, the lead wire 114 of the semiconductor laser 12 is inserted into the through hole 15 provided in the light source holder 14 from the front side (left side in the drawing). The insulator 111 is attached from the back side (right side of the drawing) so as to be fitted into the light source holder 14 and the lead wire 114. The lead wire 114 protruding from the insulator 111 is connected to the FPC 112, and power is supplied to each semiconductor laser 12 through the FPC 112.
(Configuration of FPC and open countermeasure circuit)
A configuration of the FPC 112 according to the first embodiment will be described with reference to FIGS. 6 and 7. In the following description, the top, bottom, left, and right refer to the upper, lower, left, and right sides in the drawing, respectively, the row in the horizontal (left and right in the drawing) direction is the row, and the row in the vertical (up and down in the drawing) direction is the column. And

  FIG. 6 is a view of the FPC 112 as viewed from the back side, and FIG. 7 is a schematic diagram of a power supply circuit in the FPC 112. In the FPC 112, a conductive wire 119 is disposed on an insulating film base (see FIG. 7), and the conductive wire 119 forms a power supply circuit for supplying power to each semiconductor laser 12.

  The power supply circuit includes a connecting portion 118 extending in the row direction connecting the adjacent semiconductor lasers 12 in series, a left end bridging portion 113 extending in the column direction connecting the adjacent lasers 12 in series at the left end of the FPC 112, and a right end of the FPC 112. The right end bridge portion 114 extending in the column direction for connecting the adjacent lasers 12 in series and the center bridge portion 115 extending in the column direction for connecting the adjacent lasers 12 in series at the center of the FPC 112 are provided. The left end bridging portion 113, the right end bridging portion 114, and the central bridging portion 115 are formed so as to be substantially orthogonal to the connecting portion 118.

  Furthermore, the power supply circuit includes an external connection unit 122 that connects the light source device 110 and an external power supply source.

  The conductive wire 119 of the FPC 112 is also covered with the same kind of film base material except for the laser terminal portion 126 of the connecting portion 118 connected to the lead wire 114 of the semiconductor laser 12 and the terminal end of the external connecting portion 122. . That is, the conducting wire 119 is sandwiched between insulating film base materials, and the FPC 112 has flexibility.

  In each of the regions surrounded by the left end bridging portion 113, the right end bridging portion 114, the central bridging portion 115, the connection portion 118, and the open countermeasure circuit described later, unnecessary film base materials are removed to form openings. Although details will be described later, when assembled, the opening becomes an area where the light source holder 14 and the heat sink 16 come into contact with each other.

  Since each semiconductor laser 12 is electrically connected in series, if at least one of the semiconductor lasers 12 fails in an open state, all the semiconductor lasers 12 are turned off. Therefore, in the present disclosure, an open countermeasure circuit as a bypass circuit is electrically connected in parallel with a predetermined number of units (four in the present embodiment) of the semiconductor lasers 12.

  An upper open countermeasure circuit 116A for the four semiconductor lasers 12 in the uppermost row is formed above the connection portion 118 in the uppermost row. The upper open countermeasure circuit 116 </ b> A is formed by drawing the conductive wire 119 upward from both ends of the connection portion 118 in the uppermost row and separating it from the connection portion 118 in the uppermost row. Further, a lower open countermeasure circuit 116B for the four semiconductor lasers 12 in the lowermost row is formed below the connection portion 118 in the lowermost row. The lower open countermeasure circuit 116 </ b> B is formed by drawing the conductive wire 119 downward from both ends of the connection portion 118 in the lowermost row and separating from the connection portion 118 in the lowermost row.

  A left open countermeasure circuit 116 </ b> C for the four semiconductor lasers 12 on the left side of the central bridge portion 115 is formed adjacent to the left end bridge portion 113. Further, a right open countermeasure circuit 116D for the four semiconductor lasers 12 on the right side of the central bridge portion 115 is formed adjacent to the right end bridge portion 114.

  In a normal state, that is, in a state where the semiconductor laser 12 has no failure in the open state, the current flowing from the external connection portion 122 first flows two semiconductor lasers 12 in the second row from right to left, and then the central bridge. After passing through the part 115 to the connection part 118 in the third row, two semiconductor lasers 12 in the third line flow from left to right, and then to the connection part 118 in the lowermost row through the right end bridging part 114. After the four semiconductor lasers 12 in the lowermost row flow from right to left, the left end bridging portion 113 moves to the connection portion 118 in the third row, and two semiconductor lasers 12 in the third row flow from left to right. After passing through the central bridge portion 115 to the connection portion 118 on the second row, two semiconductor lasers 12 on the second row flow from right to left, and then connect to the first row through the left end bridge portion 113. Move to section 118. Then, the four semiconductor lasers 12 in the connection part 118 in the first row flow from the left to the right, and then flow to the external connection part 122.

  The open countermeasure circuit is composed of an electronic component 117 such as an antifuse element shown in FIG. 8, for example, and is electrically connected to the four semiconductor lasers 12 in parallel. In the normal state, since the electronic component 117 is in a high resistance state, a current flows through the four semiconductor lasers 12 and the semiconductor lasers 12 are turned on.

  As shown in FIG. 8, when at least one of the four semiconductor lasers 12 electrically connected in parallel with the open countermeasure circuit 116 fails in an open state, a high voltage is applied to the electronic component 117. Take it. Since the electronic component 117 has a characteristic of changing from a high resistance state to a low resistance state when a high voltage is applied, at least one of the four semiconductor lasers 12 electrically connected in parallel with the open countermeasure circuit 116 is used. When the semiconductor laser 12 fails in the open state, the four semiconductor lasers 12 are turned off and a current flows through the open countermeasure circuit 116.

  Therefore, the power supply path to the light source device 110 is not interrupted, and the light source device 110 can be prevented from being turned off due to a failure in the open state of one semiconductor laser 12.

  Further, in the present disclosure, by providing the central bridging portion 115, the adjacent semiconductor lasers 12 can be connected in series in the column direction. Therefore, the left open countermeasure circuit 116C or the right open countermeasure circuit 116D can be configured with the shortest conductor. Can be connected in parallel.

  Therefore, even when the semiconductor laser 12 in the center portion fails in the open state, the power of the light source device 110 can be saved.

  Further, since the central bridging portion 115 is formed orthogonal to the connection portion 118, the central bridging portion 115 can be formed in the shortest time, and the conductive wire 119 on the central bridging portion 115 can be wired in the shortest time. it can.

In this embodiment, the left open countermeasure circuit 116C and the right open countermeasure circuit 116D correspond to the open countermeasure circuit according to the present disclosure.
(Description of heat sink)
FIG. 9 is a perspective view of the heat sink 16. The heat sink 16 is formed of a metal having good thermal conductivity such as aluminum or copper. Further, on one surface (front surface) of the heat sink 16, a concave portion 130 provided so as not to interfere with the lead wire 114 and the FPC 112 of the semiconductor laser 12 and a convex portion that contacts the light source holder 14 when the light source device is assembled. 132 is formed. A plurality of fins 134 are provided on the other surface (back surface) of the heat sink 16 so that heat can be efficiently radiated by air sent by a fan (not shown).

  The connection portion 118 and the central bridging portion 115 of the FPC 112 are fitted into the recess 130 of the heat sink 16. The convex portion 132 is designed with a size smaller than the size of each opening of the FPC 112 so as not to interfere with the FPC 112. By fitting the convex portion 132 of the heat sink 16 into the opening of the FPC 112, the light source holder 14 and the heat sink 16 come into contact with each other, and the heat generated by the semiconductor laser 12 can be transmitted to the heat sink 16.

When assembled, the FPC 112 is disposed between the light source holding part 14 and the heat sink 16.
(Second Embodiment)
A configuration of the FPC 212 according to the second embodiment will be described with reference to FIGS. 10 and 11. In the present disclosure, the description will mainly focus on differences from the first embodiment. FIG. 10 is a view of the FPC 212 viewed from the back side, and FIG. 11 is a schematic diagram of a power supply circuit in the FPC 212. The semiconductor lasers 12 are arranged in 3 rows × 3 columns, and the semiconductor lasers 12 are electrically connected in series.

  The FPC 212 has an odd number of rows in which the semiconductor lasers 12 are arranged, and thus has a configuration in which a connecting conductor portion 218A in which the semiconductor lasers 12 are not arranged is arranged on the uppermost row of the connecting portions 218. Further, the adjacent first and second semiconductor lasers 12 in the central column and the leftmost column are electrically connected in series by the central bridging portion 215, respectively.

  The current flowing from the external connection part 222 enters the uppermost connection part 218 of 3 rows × 3 columns in which the semiconductor lasers 12 are disposed, flows through the rightmost semiconductor laser 12 from right to left, and then passes through the central bridge part. It moves to the connection part 218 of the 2nd row through 215.

  Then, after flowing the semiconductor laser 12 at the right end of the connecting portion 218 in the second row from the left to the right, the three semiconductor lasers 12 at the connecting portion 218 in the lowermost row passed through the right end bridging portion 214 from the right to the left. After that, the left end bridge portion 213 is passed to the connection portion 218 in the second row.

  Then, after two semiconductor lasers 12 in the connection part 218 in the second row flow from left to right, the semiconductor lasers 12 arranged in the uppermost row are moved to the uppermost connection part 218 through the central bridging part 215. After two pieces flow from right to left, they flow to the external connection part 222 through the connection conductor part 218A.

  A right open countermeasure circuit 216 </ b> A for the two semiconductor lasers 12 on the right side of the central bridge portion 215 is formed adjacent to the right end bridge portion 214.

  Also, a lower open countermeasure circuit 216B for the three semiconductor lasers 12 at the bottom row is formed downward from the connection portion 218 at the bottom row and separated from the connection portion 218 at the bottom row.

  Further, a left open countermeasure circuit 216 </ b> C for the four semiconductor lasers 12 on the left side of the central bridge portion 215 is formed adjacent to the left end bridge portion 213.

In the present embodiment, the right open countermeasure circuit 216A and the left open countermeasure circuit 216C correspond to the open countermeasure circuit according to the present disclosure.
(Third embodiment)
A configuration of the FPC 312 according to the third embodiment will be described with reference to FIGS. 12 and 13. In the present disclosure, the description will mainly focus on differences from the second embodiment. FIG. 12 is a view of the FPC 312 as viewed from the back side, and FIG. 13 is a schematic diagram of a power supply circuit in the FPC 312. The semiconductor lasers 12 are arranged in 3 rows × 3 columns, and the semiconductor lasers 12 are electrically connected in series.

  Since the FPC 312 also has an odd number of rows in which the semiconductor lasers 12 are arranged, the connection conductor portion 318A in which the semiconductor lasers 12 are not arranged is arranged on the uppermost row of the connection portions 318. In addition, the semiconductor laser 12 at the left end of the uppermost connection portion 318 and the semiconductor laser 12 at the center of the second row connection portion 318 are electrically connected in series, and the semiconductor laser 12 at the center of the uppermost connection portion 318 is connected to the second row. A central bridging portion 315 that electrically connects the semiconductor laser 12 at the right end of the eye connection portion 318 in series is provided.

  Further, a left open countermeasure circuit 216 </ b> C for the four semiconductor lasers 12 on the left side of the central bridge portion 315 is formed adjacent to the left end bridge portion 213.

  The current flowing from the external connection portion 322 enters the connection portion 318 in the uppermost row of 3 rows × 3 columns in which the semiconductor lasers 12 are disposed, and flows through the two semiconductor lasers 12 on the right side from the right to the left. It moves to the connection part 318 of the second row through the bridging part 315.

  Then, after flowing through the semiconductor laser 12 at the right end of the connection portion 318 in the second row, the three semiconductor lasers 12 at the connection portion 318 in the bottom row pass through the right end bridging portion 314 and then flow from right to left. It moves to the connection part 318 in the second row through the part 313.

  Then, the current that flows from the left to the right through the two semiconductor lasers 12 arranged in the connection portion 318 in the second row passes through the central bridge portion 315 and moves to the connection portion 318 in the uppermost row, and is arranged in the uppermost row. After flowing through the leftmost semiconductor laser 12, it flows to the external connection portion 322 through the connection conductor portion 318 </ b> A.

  A right open countermeasure circuit 316A for the three semiconductor lasers 12 on the right side of the central bridge portion 315 is formed adjacent to the right end bridge portion 314.

  Further, a lower open countermeasure circuit 316B for the three semiconductor lasers 12 is formed below the lowermost connection portion 318 and separated from the lowermost connection portion 318.

  Further, a left open countermeasure circuit 316C for the three semiconductor lasers 12 on the left side of the central bridge portion 315 is formed adjacent to the left end bridge portion 313.

  That is, three open countermeasure circuits are provided corresponding to the same number of units of the semiconductor laser 12.

In the present embodiment, the right open countermeasure circuit 316A and the left open countermeasure circuit 316C correspond to the open countermeasure circuit according to the present disclosure.
(Fourth embodiment)
A configuration of the FPC 412 according to the fourth embodiment will be described with reference to FIGS. 14 and 15. In the present embodiment, the description will be mainly focused on differences from the first embodiment and the second embodiment.

  FIG. 14 is a view of the FPC 412 as seen from the back side, and FIG. 15 is a schematic diagram of a power supply circuit in the FPC 412. Semiconductor lasers 12 are arranged in 10 rows × 4 columns.

  As shown in FIG. 15, the semiconductor lasers 12 in the central two columns excluding the uppermost row and the lowermost row are electrically connected in series by the semiconductor lasers 12 adjacent to each other in the column direction and the central bridging portion 415.

  In addition, two rows of semiconductor lasers 12 at both ends are electrically connected in series to the semiconductor lasers 12 adjacent in the column direction by a left end bridging portion 413 and a right end bridging portion 414, respectively. An upper open countermeasure circuit 416A for the uppermost four semiconductor lasers 12 is formed above the connection portion 418 in the uppermost row. Further, a lower open countermeasure circuit 416B for the four semiconductor lasers 12 in the lowermost row is formed below the connection portion 418 in the lowermost row.

  A total of four left open countermeasure circuits 416C for the four semiconductor lasers 12 on the left side of the central bridge portion 415 are formed on the left side of each central bridge portion 415 adjacent to the left end bridge portion 413. Also, a total of four right open countermeasure circuits 416D for the four semiconductor lasers 12 on the right side of the central bridge portion 415 are formed on the right side of each central bridge portion 415 adjacent to the right end bridge portion 414.

  The current flowing in from the external connection portion 422 flows from the right to the left through the four semiconductor lasers 12 arranged in the uppermost row, and then passes through the left end bridging portion 413 to the connection portion 418 in the second row. The two left semiconductor lasers 12 arranged in the eye connection part 418 flow from the left to the right, and then move to the left side connection part 418 in the third row through the central bridge part 415.

  Then, the two left semiconductor lasers 12 of the connection part 418 in the third row flow from right to left, and then move to the left connection part 418 in the fourth row through the left end bridging part 413.

  In this way, the current that has flowed downward through the semiconductor lasers 12 arranged in the left two columns sequentially flows from the left to the right through the four semiconductor lasers arranged in the connecting portion 418 in the bottom row, and then the right end bridging portion 414. And flows into the right side connection portion 418 of the ninth row, and flows through the semiconductor lasers 12 arranged in the right two columns. The current flowing in the right two rows flows upward through the central bridge portion 415. In this way, the current that has flowed through the two right-hand columns of the semiconductor lasers 12 sequentially flows to the external connection portion 422.

In the present embodiment, the left open countermeasure circuit 416C and the right open countermeasure circuit 416D correspond to the open countermeasure circuit according to the present disclosure.
(Action / Effect)
As described above, the light source device of the present disclosure can shorten the length of the lead wire from the power supply circuit to the light source to the open countermeasure circuit unit, and thus is unnecessary in a light source using a plurality of light sources with an open countermeasure circuit. It is possible to provide a power-saving light source device that suppresses generation of a large impedance.

Further, by using this light source device, it is possible to provide a projection display apparatus that saves power in the entire apparatus.
(Other application)
As described above, an embodiment has been described as an example of implementation in the present disclosure. However, the present disclosure is not limited to this, and can also be applied to embodiments in which changes, replacements, additions, omissions, and the like have been made as appropriate.

  In the above-described embodiment, the substrate in which the aligned semiconductor lasers are electrically connected in series in the row direction has been described in the prior art. However, the present invention is not limited thereto, and the aligned semiconductor lasers are electrically connected in series in the column direction. The configuration of the present disclosure can also be applied to the substrate to be used.

  In the above-described embodiment, the description has been made using the 3 chip DMD projection display apparatus. However, it may be 1 chip or a projection display apparatus using a liquid crystal panel.

  In the above-described embodiment, the projection optical system 80 is assumed to be composed of a plurality of lenses, but may be a projection optical system composed of a lens and a mirror, or may be a projection optical system composed of a plurality of mirrors. .

  In the above-described embodiment, the semiconductor laser is used as a member that receives power supply by the FPC. However, the present disclosure is not limited thereto, and an open countermeasure circuit is provided for each of a plurality of light sources, and power is supplied by the FPC. Applicable if it is received.

  In the above-described embodiment, the concave portion and the convex portion for fitting the FPC and the insulator are provided on the heat sink side, but the concave portion and the convex portion may be provided on the light source holder side.

  In the above embodiment, the flexible FPC has been described, but a hard substrate may be used.

  In the above-described embodiment, all the light sources arranged in one light source holder are connected in series. For example, a plurality of light source groups in which a predetermined number of light sources are connected in series are connected in parallel. It may be a light source device arranged on the light source holder. In this case, the open countermeasure circuit configuration of the present disclosure may be applied to each series-connected light source group unit.

  In the above-described embodiment, since the electronic components arranged on the open countermeasure circuit generate heat, the necessity for cooling may arise. At this time, the heat of the electronic component can be cooled by bending the open countermeasure circuit portion exposed from the heat sink toward the heat sink and directly or indirectly contacting the heat sink. Or you may make an electronic component contact a heat sink directly or indirectly by enlarging the external dimension of a heat sink.

  In the above-described embodiment, the open countermeasure circuit and the left and right end bridging portions are exposed from the light source holder or the cooling member, but the external dimensions of the light source holder or the cooling member are increased and appropriate recesses are provided. Therefore, the open countermeasure circuit may be completely covered with the light source holder and the heat sink. Alternatively, only the left and right end bridging portions may be completely covered.

  In the above-described embodiment, the open countermeasure circuit according to the present disclosure provided adjacent to the left and right end bridging portions is arranged at substantially the same position in the vertical direction as each corresponding central bridging portion. The effect of the present disclosure can be obtained even if the position is shifted in the vertical direction within the range of the end bridge portion.

  In the above-described embodiment, the open countermeasure circuit has been described as a form that becomes low resistance when a high voltage is applied. However, the present invention is not limited to this, and a switching element that detects an open failure of the semiconductor laser 12 and changes the current path is provided. You may comprise.

  In the above-described embodiment, the open countermeasure circuits 116A, 116B, 216B, 316B, 416A, 416B and the connecting conductor portions 218A, 318A give priority to the cooling of the semiconductor laser 12, and therefore, the top of the connecting portions 118, 218, 318, 418. However, the present invention is not limited to this, and it may be provided adjacent to the connection portion of the uppermost row or the lowermost row in the same manner as the right end or left end open countermeasure circuit.

  As described above, the embodiment considered as the best mode is provided by the attached drawings and the detailed description. This is provided to illustrate the subject matter recited in the claims to those skilled in the art by reference to specific embodiments. Therefore, various modifications, replacements, additions, omissions, and the like can be made to the above-described embodiments within the scope of the claims or an equivalent scope thereof.

  The present disclosure is applicable to a light source device in which a plurality of light sources are connected in series. Specifically, the present invention can be applied to a light source device in which a plurality of semiconductor lasers are connected in series, and a projection display apparatus using this light source device.

12 Semiconductor laser (light source)
112, 212, 312, 412 FPC (substrate)
115 Central cross-linking part (cross-linking part)
116C Left open countermeasure circuit (Open countermeasure circuit)
116D Right open countermeasure circuit (open countermeasure circuit)
119 Conductor 215 Central cross-linking part (cross-linking part)
216C Left open countermeasure circuit (open countermeasure circuit)
315 Central cross-linking part (cross-linking part)
316A Right open countermeasure circuit (open countermeasure circuit)
316C Left open countermeasure circuit (open countermeasure circuit)
415 Central cross-linking part (cross-linking part)
416C Left open countermeasure circuit (open countermeasure circuit)
416D Right open countermeasure circuit (open countermeasure circuit)

Claims (5)

A plurality of light sources arranged in a grid,
A board for electrically connecting the light sources arranged on the same line in series;
An open countermeasure circuit that is arranged on the outer periphery of the plurality of light sources and electrically connected in parallel with a predetermined number of light sources among the plurality of light sources electrically connected in series;
The open countermeasure circuit is a circuit that does not conduct current when the predetermined number of light sources does not cause an open failure, and conducts current when at least one of the predetermined number of light sources causes an open failure. And
The substrate is provided with a partial series connection that electrically connects the predetermined number of light sources on adjacent rows in series,
The light source device, wherein the partial series connection portion is electrically connected in parallel with the open countermeasure circuit.   2. The substrate according to claim 1, wherein a bridge portion that connects light sources on adjacent rows in a column direction is formed on the substrate, and the partial series connection portions are formed on the left and right sides of the bridge portion. Light source device. A plurality of light sources arranged in a grid,
A substrate for electrically connecting the light sources arranged in the same row in series;
An open countermeasure circuit that is arranged on the outer periphery of the plurality of light sources and electrically connected in parallel with a predetermined number of light sources among the plurality of light sources electrically connected in series;
The open countermeasure circuit is a circuit that does not conduct current when the predetermined number of light sources does not cause an open failure, and conducts current when at least one of the predetermined number of light sources causes an open failure. And
The substrate is provided with a partial series connection for electrically connecting the predetermined number of light sources on adjacent rows in series,
The light source device, wherein the partial series connection portion is electrically connected in parallel with the open countermeasure circuit.   The bridge | crosslinking part which connects the light source on an adjacent column to a row direction is formed in the said board | substrate, The said partial series connection part is formed in the upper and lower sides of the said bridge | bridging part, The Claim 3 characterized by the above-mentioned. Light source device. A light source device, a video generation unit that generates video light in response to a video input signal, a light guide optical system that guides light from the light source device to the video generation unit, a projection optical system that projects the video light, In a projection display apparatus comprising:
5. The projection type image display device according to claim 1, wherein the light source device is the light source device according to claim 1.

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