JP2015135985A - ceramic capacitor - Google Patents
ceramic capacitor Download PDFInfo
- Publication number
- JP2015135985A JP2015135985A JP2015051795A JP2015051795A JP2015135985A JP 2015135985 A JP2015135985 A JP 2015135985A JP 2015051795 A JP2015051795 A JP 2015051795A JP 2015051795 A JP2015051795 A JP 2015051795A JP 2015135985 A JP2015135985 A JP 2015135985A
- Authority
- JP
- Japan
- Prior art keywords
- ceramic
- strip
- capacitor
- pair
- shaped metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
Description
本発明は、電子機器の電源回路等に用いられるセラミックコンデンサに関する。 The present invention relates to a ceramic capacitor used for a power supply circuit of an electronic device.
種々の電子機器において、電源回路等の大電流回路にセラミックコンデンサが用いられている。図７に示すように、特許文献１には、外部端子を備えたセラミックコンデンサの一例が開示されている。具体的には、一部が端面１１５に露出するような態様でセラミック内に内部電極（図示省略）が配設された構造を有するコンデンサ素子１１１と、コンデンサ素子１１１の端面１１５に露出した内部電極と導通するように、コンデンサ素子１１１の端面１１５にはんだ１１８により接合された、金属線材からなる外部端子１１７と、を具備する面実装型セラミックコンデンサ１１０である。該セラミックコンデンサ１１０においては、電子機器等に用いられる汎用のリード線からなる金属線材を曲げ加工した外部端子１１７を用いることで、金属板からなる外部端子を備えた従来のセラミックコンデンサ（図示省略）に比較して、形状や寸法の変更が容易である。 In various electronic devices, ceramic capacitors are used in large current circuits such as power supply circuits. As shown in FIG. 7, Patent Document 1 discloses an example of a ceramic capacitor having an external terminal. Specifically, the capacitor element 111 having a structure in which internal electrodes (not shown) are disposed in the ceramic in such a manner that a part is exposed on the end face 115, and the internal electrode exposed on the end face 115 of the capacitor element 111. The surface mount type ceramic capacitor 110 is provided with an external terminal 117 made of a metal wire joined to the end face 115 of the capacitor element 111 with solder 118 so as to be electrically connected to the capacitor element 111. In the ceramic capacitor 110, a conventional ceramic capacitor having an external terminal made of a metal plate (not shown) is used by using an external terminal 117 formed by bending a metal wire made of a general-purpose lead wire used in an electronic device or the like. Compared to the above, it is easy to change the shape and dimensions.
上述の金属板からなる外部端子を備えた従来のセラミックコンデンサにおいては、外部端子の変形や振動に伴う応力がコンデンサ素子に作用した際に、セラミック素体にひび割れが生じる虞がある。また、金属線材を曲げ加工して外部端子として用いた背景技術に記載のセラミックコンデンサ１１０においては、外部端子として充分な断面積を確保することが難しいため、振動等により外部端子が変形して周囲の電子部品との距離が接近したり、大電流を印加した際に外部端子に発熱が生じて電子機器の消費電力が増大したりする等の課題がある。 In the conventional ceramic capacitor provided with the external terminal which consists of the above-mentioned metal plate, when the stress accompanying a deformation | transformation and a vibration of an external terminal acts on a capacitor | condenser element, there exists a possibility that a ceramic body may crack. In addition, in the ceramic capacitor 110 described in the background art in which a metal wire is bent and used as an external terminal, it is difficult to ensure a sufficient cross-sectional area as the external terminal. There are problems such that the distance from the electronic component is close, or heat is generated in the external terminal when a large current is applied, increasing the power consumption of the electronic device.
本発明は、外部端子の変形や振動に伴う応力がセラミックコンデンサ素子のセラミック誘電体層に局部的に作用してセラミック素体にひび割れが生じるのを抑制することが可能なセラミックコンデンサを提供することを目的とする。 The present invention provides a ceramic capacitor capable of suppressing the occurrence of cracks in a ceramic body due to local stress acting on a ceramic dielectric layer of a ceramic capacitor element caused by deformation or vibration of an external terminal. With the goal.
本発明は、（１）セラミック誘電体層と、セラミック誘電体層を挟んで互いに対向する内部電極本体及び内部電極本体から交互に導出される引き出し部を備える内部電極と、を有し、幅寸法および長さ寸法に比べて厚さ寸法が小さい平板形状のセラミック素体と、セラミック素体の互いに対向する一対の端面にそれぞれ形成され内部電極の引き出し部に導電接続された帯状の一対の外部電極と、を備えるコンデンサ素子と、 コンデンサ素子の外部電極にそれぞれロウ材を介して導電固着された複数の帯状の金属板と、前記複数の金属板の長手方向の複数箇所に互いに離間してそれぞれロウ材を介して導電固着されかつそれぞれ先端部の近傍で相互に連結された少なくとも一対の金属端子と、を備える。（以下、本発明の第１の技術手段と称する。） The present invention includes (1) a ceramic dielectric layer, an internal electrode body facing each other across the ceramic dielectric layer, and an internal electrode provided with lead-out portions alternately led out from the internal electrode body, and having a width dimension And a flat ceramic body having a thickness smaller than the length, and a pair of strip-like external electrodes formed on a pair of opposing end faces of the ceramic body and electrically connected to the lead-out portion of the internal electrode A plurality of strip-shaped metal plates that are conductively fixed to the external electrodes of the capacitor elements via brazing materials, and are spaced apart from each other at a plurality of positions in the longitudinal direction of the plurality of metal plates. And at least a pair of metal terminals that are conductively fixed via a material and connected to each other in the vicinity of the tip. (Hereinafter referred to as the first technical means of the present invention.)
また、上記セラミックコンデンサの主要な形態の一つは、第１の技術手段に加えてさらに、（２）帯状の金属板は４２アロイ、インバー、コバールのうちのいずれか１種からなり、帯状の金属板に導電固着される金属端子は銅からなる。（以下、本発明の第２の技術手段と称する。） In addition to the first technical means, one of the main forms of the ceramic capacitor is (2) the belt-shaped metal plate is made of any one of 42 alloy, invar, and kovar, The metal terminal conductively fixed to the metal plate is made of copper. (Hereinafter referred to as the second technical means of the present invention.)
また、上記セラミックコンデンサの他の主要な形態の一つは、第１の技術手段に加えてさらに、（３）帯状の金属板の線膨張係数はセラミック誘電体層の線膨張係数より小さい。（以下、本発明の第３の技術手段と称する。） In addition to the first technical means, one of the other main forms of the ceramic capacitor is (3) the linear expansion coefficient of the strip-shaped metal plate is smaller than the linear expansion coefficient of the ceramic dielectric layer. (Hereinafter referred to as the third technical means of the present invention.)
また、上記セラミックコンデンサの他の主要な形態の一つは、（４）第１の技術手段に加えてさらに、厚さ方向に複数のコンデンサ素子を備え、各コンデンサ素子はそれぞれ独立した帯状の金属板を介して金属端子に導電固着されている。（以下、本発明の第４の技術手段と称する。） In addition to the first technical means, (4) in addition to the first technical means, the ceramic capacitor further includes a plurality of capacitor elements in the thickness direction, and each capacitor element is an independent band-shaped metal. It is conductively fixed to the metal terminal via the plate. (Hereinafter referred to as the fourth technical means of the present invention.)
上記第１の技術手段による作用は次の通りである。すなわち、セラミックコンデンサが、平板形状のセラミック素体と、セラミック素体にそれぞれ形成された帯状の一対の外部電極と、を備えるコンデンサ素子と、コンデンサ素子の外部電極に導電固着された少なくとも一対の帯状の金属板と、金属板の長手方向の複数箇所に互いに離間してそれぞれロウ材を介して導電固着された少なくとも一対の金属端子と、を備えるので、金属端子の変形や振動に伴う応力が前記帯状の金属板を介して金属板の長手方向に分散され、コンデンサ素子の帯状の外部電極の全体に亘って、緩和された状態で伝達される。このため、金属端子の変形に伴う応力がセラミック誘電体層に局部的に作用してセラミック素体にひび割れが生じるのを防止することができる。 The operation of the first technical means is as follows. That is, a ceramic capacitor includes a plate-shaped ceramic body and a pair of strip-shaped external electrodes formed on the ceramic body, and at least a pair of strip-shaped conductively fixed to the external electrodes of the capacitor element. The metal plate and at least a pair of metal terminals electrically conductively fixed to each other at a plurality of locations in the longitudinal direction of the metal plate, respectively, so that stress caused by deformation or vibration of the metal terminal is It is dispersed in the longitudinal direction of the metal plate via the band-shaped metal plate, and is transmitted in a relaxed state over the entire band-shaped external electrode of the capacitor element. For this reason, it can prevent that the stress accompanying a deformation | transformation of a metal terminal acts locally on a ceramic dielectric material layer, and a crack arises in a ceramic body.
上記第２の技術手段による作用は次の通りである。すなわち、前記帯状の金属板は４２アロイ、インバー、コバールのうちのいずれか１種からなり、前記帯状の金属板に導電固着される金属端子は銅からなるので、印加された電流は、体積抵抗率が１．７１μΩ・ｃｍと良好な銅からなる金属端子の中を複数経路で通過する。また、銅に比べて体積抵抗率がやや高い４２アロイ、インバー、コバールのうちのいずれか１種からなる帯状の金属板の中をその厚さ方向に通過する。このため、大電流を印加した際の発熱を抑制することができる。 The operation of the second technical means is as follows. That is, the strip-shaped metal plate is made of any one of 42 alloy, invar, and kovar, and the metal terminal conductively fixed to the strip-shaped metal plate is made of copper. It passes through a metal terminal made of copper with a good rate of 1.71 μΩ · cm through a plurality of paths. Moreover, it passes in the thickness direction through the band-shaped metal plate which consists of any one of 42 alloy, Invar, and Kovar whose volume resistivity is a little higher than copper. For this reason, heat generation when a large current is applied can be suppressed.
上記第３の技術手段による作用は次の通りである。すなわち、フロー半田付け等による加熱冷却時に、線膨張係数の大きな基板や金属端子に起因する応力が線膨張係数の小さい帯状の金属板で一旦減衰され、緩和された後に、コンデンサ素子の外部電極を介してセラミック素体に伝達される。このため、セラミック誘電体層と金属端子との線膨張係数の差に起因する応力によってセラミック素体にひび割れが生じるのを防止することができる。 The operation of the third technical means is as follows. That is, during heating and cooling by flow soldering or the like, after the stress caused by a substrate or metal terminal having a large linear expansion coefficient is once attenuated and relaxed by a strip-shaped metal plate having a small linear expansion coefficient, the external electrode of the capacitor element is To the ceramic body. For this reason, it is possible to prevent the ceramic body from being cracked due to the stress caused by the difference in the coefficient of linear expansion between the ceramic dielectric layer and the metal terminal.
上記第４の技術手段による作用は次の通りである。すなわち、コンデンサ素子毎に帯状の金属板による長手方向への応力分散のメカニズムが独立して働く。このため、上下のコンデンサ素子間で温度環境が異なった場合でも、温度環境の差に起因する金属端子と帯状の金属板との間の応力の発生が抑制される。 The operation of the fourth technical means is as follows. That is, the mechanism of stress distribution in the longitudinal direction by the strip-shaped metal plate works independently for each capacitor element. For this reason, even when the temperature environment differs between the upper and lower capacitor elements, the occurrence of stress between the metal terminal and the strip-shaped metal plate due to the difference in temperature environment is suppressed.
本発明のセラミックコンデンサは、金属端子の変形や振動に伴う応力が帯状の金属板を介して該金属板の長手方向に分散され、コンデンサ素子の帯状の外部電極の全体に亘って、緩和された状態で伝達されるので、金属端子の変形に伴う応力がセラミック誘電体層に局部的に作用してセラミック素体にひび割れが生じるのを防止することができる。 In the ceramic capacitor of the present invention, the stress accompanying deformation and vibration of the metal terminal is dispersed in the longitudinal direction of the metal plate through the strip-shaped metal plate, and is relaxed over the entire strip-shaped external electrode of the capacitor element. Therefore, it is possible to prevent the stress accompanying the deformation of the metal terminal from acting locally on the ceramic dielectric layer and causing cracks in the ceramic body.
次に、本発明のセラミックコンデンサの第１の実施形態について、図１〜図３を参照して説明する。図１は本実施形態のセラミックコンデンサ１０を示す外観斜視図である。図２はセラミックコンデンサ１０の内部構造を説明するための分解斜視図である。図３はセラミックコンデンサ１０の内部構造を説明するための図１のＡ−Ａ線における縦断面図である。 Next, a first embodiment of the ceramic capacitor of the present invention will be described with reference to FIGS. FIG. 1 is an external perspective view showing a ceramic capacitor 10 of the present embodiment. FIG. 2 is an exploded perspective view for explaining the internal structure of the ceramic capacitor 10. FIG. 3 is a longitudinal sectional view taken along the line AA of FIG. 1 for explaining the internal structure of the ceramic capacitor 10.
本実施形態のセラミックコンデンサ１０は、平板状のセラミック素体１２と、セラミック素体１２の互いに対向する一対の端面にそれぞれ形成された帯状の一対の外部電極１５，１５と、を備えるコンデンサ素子１１と、コンデンサ素子１１の外部電極１５，１５に導電固着された一対の帯状の金属板１６，１６と、帯状の金属板１６，１６の長手方向の複数箇所に互いに離間してそれぞれ導電固着された複数の金属端子１７，１７と、を備える。 具体的には、セラミック素体１２は、複数のセラミック誘電体層１３，１３と、誘電体層１３，１３を挟んで互いに対向する内部電極本体１４ａ，１４ａ及び内部電極本体１４ａ，１４ａから交互に延出された引き出し部１４ｂ，１４ｂを備える内部電極１４，１４と、を有し、その外観は幅寸法および長さ寸法に比べて厚さ寸法が小さい平板状を呈している。 一対の外部電極１５，１５は、セラミック素体１２の互いに対向する一対の端面にそれぞれ形成されて、セラミック素体１２の内部電極１４，１４の引き出し部１４ｂ，１４ｂに導電接続されており、その外観は帯状を呈する。 一対の帯状の金属板１６，１６は、コンデンサ素子１１の外部電極１５，１５にロウ材１８ａ，１８ａによりそれぞれ導電固着されている。本実施形態においては、コンデンサ素子１１の一対の外部電極１５，１５のそれぞれに対し、それぞれ１つの帯状の金属板１６が導電固着されている。 複数の金属端子１７，１７は、コンデンサ素子側の基端部１７ａと、基板等の実装箇所に半田付けされる先端部１７ｂと、基端部１７ａと先端部１７ｂとの間に設けられた屈曲部１７ｃとを有する。複数の金属端子１７，１７は、それぞれ基端部１７ａ，１７ａが帯状の金属板１６，１６の長手方向の複数箇所に互いに離間してそれぞれロウ材１８ｂ，１８ｂにより導電固着されており、セラミックコンデンサ１０全体としてＤＩＰ（デュアルインラインパッケージ）状の外観を有する。本実施形態においては、１つの帯状の金属板１６に対し、その長手方向の１３箇所に１３本の金属端子１７，１７が互いに離間してそれぞれ導電固着されている。 The ceramic capacitor 10 according to the present embodiment includes a flat ceramic body 12 and a pair of strip-like external electrodes 15 and 15 formed on a pair of opposing end surfaces of the ceramic body 12, respectively. And a pair of strip-shaped metal plates 16 and 16 that are conductively fixed to the external electrodes 15 and 15 of the capacitor element 11 and are electrically conductively fixed at a plurality of positions in the longitudinal direction of the strip-shaped metal plates 16 and 16, respectively. A plurality of metal terminals 17, 17. Specifically, the ceramic body 12 is alternately composed of a plurality of ceramic dielectric layers 13, 13 and internal electrode bodies 14a, 14a and internal electrode bodies 14a, 14a facing each other across the dielectric layers 13, 13. Internal electrodes 14 and 14 each having extended lead portions 14b and 14b, and the appearance of the electrodes 14 and 14 is a flat plate having a thickness dimension smaller than a width dimension and a length dimension. The pair of external electrodes 15 and 15 are respectively formed on a pair of opposing end faces of the ceramic body 12 and are electrically connected to the lead portions 14b and 14b of the internal electrodes 14 and 14 of the ceramic body 12 and Appearance is strip-shaped. The pair of strip-shaped metal plates 16 and 16 are conductively fixed to the external electrodes 15 and 15 of the capacitor element 11 by brazing materials 18a and 18a, respectively. In the present embodiment, one band-shaped metal plate 16 is conductively fixed to each of the pair of external electrodes 15, 15 of the capacitor element 11. The plurality of metal terminals 17 and 17 include a base end portion 17a on the capacitor element side, a tip end portion 17b soldered to a mounting portion such as a substrate, and a bent portion provided between the base end portion 17a and the tip end portion 17b. Part 17c. The plurality of metal terminals 17 and 17 are electrically conductively fixed by brazing materials 18b and 18b, respectively, with base end portions 17a and 17a being spaced apart from each other at a plurality of positions in the longitudinal direction of the strip-shaped metal plates 16 and 16, respectively. 10 as a whole has a DIP (dual in-line package) appearance. In the present embodiment, 13 metal terminals 17, 17 are electrically conductively fixed to one strip-shaped metal plate 16 at 13 positions in the longitudinal direction, spaced apart from each other.
また、本実施形態のセラミックコンデンサ１０においては、帯状の金属板１６，１６が、４２アロイ、インバー、コバールのうちのいずれか１種からなり、複数の金属端子１７，１７が銅からなる。より詳細には、ＪＩＳ規格のＣ１０２０、Ｃ１１００のうちの何れか１種からなる。 In the ceramic capacitor 10 of the present embodiment, the strip-shaped metal plates 16 and 16 are made of any one of 42 alloy, Invar, and Kovar, and the plurality of metal terminals 17 and 17 are made of copper. More specifically, it consists of any one of JIS standards C1020 and C1100.
また、本実施形態のセラミックコンデンサ１０においては、帯状の金属板１６，１６の線膨張係数がセラミック誘電体層１３，１３の線膨張係数より小さい。 Further, in the ceramic capacitor 10 of the present embodiment, the linear expansion coefficient of the strip-shaped metal plates 16 and 16 is smaller than the linear expansion coefficient of the ceramic dielectric layers 13 and 13.
次に、本発明の第２の実施形態のセラミックコンデンサ２０について、図４を参照して説明する。図４は本実施形態のセラミックコンデンサ２０の外観斜視図である。なお、先の第１の実施形態と共通する箇所には同じ符号を付した。 本実施形態のセラミックコンデンサ２０は、平板状のセラミック素体１２と、セラミック素体１２の互いに対向する一対の端面にそれぞれ形成された帯状の一対の外部電極１５，１５と、を備えるコンデンサ素子１１と、コンデンサ素子１１の外部電極１５，１５に導電固着された一対の帯状の金属板１６，１６と、帯状の金属板１６，１６の長手方向の複数箇所に互いに離間してそれぞれ導電固着された一対の金属端子２７，２７と、を備える。 Next, a ceramic capacitor 20 according to a second embodiment of the present invention will be described with reference to FIG. FIG. 4 is an external perspective view of the ceramic capacitor 20 of the present embodiment. In addition, the same code | symbol was attached | subjected to the location which is common in previous 1st Embodiment. The ceramic capacitor 20 according to the present embodiment includes a flat ceramic body 12 and a pair of strip-like external electrodes 15 and 15 formed on a pair of opposing end surfaces of the ceramic body 12, respectively. And a pair of strip-shaped metal plates 16 and 16 that are conductively fixed to the external electrodes 15 and 15 of the capacitor element 11 and are electrically conductively fixed at a plurality of positions in the longitudinal direction of the strip-shaped metal plates 16 and 16, respectively. A pair of metal terminals 27, 27.
本実施形態のセラミックコンデンサ２０は、
金属端子として、基端部２７ａおよび屈曲部２７ｃを有する複数の端子片がそれぞれ先端部２７ｂ、２７ｂの近傍で連結部２７ｄ、２７ｄにより相互に連結された一体型の一対の金属端子２７，２７を備える点で、先の第１の実施形態と異なる。 本実施形態によれば、複数の端子片がそれぞれ先端部２７ｂ、２７ｂの近傍で連結部２７ｄ、２７ｄにより相互に連結された一体型の金属端子２７を用いているので、セラミックコンデンサの組み立て時に帯状の金属板と金属端子との導電固着を容易かつばらつきなく行うことができ、安定生産に好適な構造である。 その他の構成については、先の第１の実施形態と同様であるため、説明を省略する。
The ceramic capacitor 20 of the present embodiment is
As the metal terminals, a plurality of terminal pieces having a base end portion 27a and a bent portion 27c are connected to each other by connecting portions 27d and 27d in the vicinity of the distal end portions 27b and 27b, respectively. It is different from the first embodiment in that it is provided. According to the present embodiment, since the plurality of terminal pieces use the integrated metal terminals 27 that are connected to each other by the connecting portions 27d and 27d in the vicinity of the tip portions 27b and 27b, respectively, The metal plate and the metal terminal can be easily and uniformly adhered to each other, and the structure is suitable for stable production. Since other configurations are the same as those in the first embodiment, the description thereof is omitted.
次に、本発明の第３の実施形態のセラミックコンデンサ３０について、図５を参照して説明する。図５は本実施形態のセラミックコンデンサ３０の外観斜視図である。なお、先の第１の実施形態と共通する箇所には同じ符号を付した。 本実施形態のセラミックコンデンサ３０は、平板状のセラミック素体１２と、セラミック素体１２の互いに対向する一対の端面にそれぞれ形成された帯状の一対の外部電極１５，１５と、を備えるコンデンサ素子１１と、コンデンサ素子１１の外部電極１５，１５に導電固着された２対の帯状の金属板３６，３６と、帯状の金属板３６，３６の長手方向の複数箇所に互いに離間してそれぞれ導電固着された複数の金属端子３７，３７と、を備える。 Next, a ceramic capacitor 30 according to a third embodiment of the present invention will be described with reference to FIG. FIG. 5 is an external perspective view of the ceramic capacitor 30 of the present embodiment. In addition, the same code | symbol was attached | subjected to the location which is common in previous 1st Embodiment. The ceramic capacitor 30 of the present embodiment includes a flat ceramic body 12 and a pair of strip-like external electrodes 15 and 15 formed on a pair of opposing end faces of the ceramic body 12, respectively. And two pairs of strip-shaped metal plates 36, 36 that are conductively fixed to the external electrodes 15, 15 of the capacitor element 11, and a plurality of longitudinal portions of the strip-shaped metal plates 36, 36 that are electrically conductively spaced apart from each other. A plurality of metal terminals 37, 37.
本実施形態のセラミックコンデンサ３０は、コンデンサ素子１１の一対の外部電極１５，１５のそれぞれに対し、帯状の２枚の金属板３６，３６がそれぞれ導電固着されている。また、それぞれの帯状の金属板３６，３６に対し、その長手方向の６箇所に６本の金属端子３７，３７が互いに離間してそれぞれ導電固着されている点で、先の第１の実施形態と異なる。 In the ceramic capacitor 30 of this embodiment, two strip-shaped metal plates 36 and 36 are conductively fixed to the pair of external electrodes 15 and 15 of the capacitor element 11, respectively. Further, the first embodiment described above is that the six metal terminals 37 and 37 are electrically conductively fixed to the strip-shaped metal plates 36 and 36 at six positions in the longitudinal direction thereof, respectively. And different.
本実施形態によれば、コンデンサ素子１１の一対の外部電極１５，１５のそれぞれに対し、長手方向の２箇所に、帯状の２枚の金属板３６，３６が互いに離間してそれぞれ導電固着されているので、セラミック誘電体層１３，１３の線膨張係数と帯状の金属板３６，３６の線膨張係数との差に起因する応力を軽減することができ、温度環境の変化が厳しい条件下での使用に好適な構造である。 その他の構成については、先の第１の実施形態と同様であるため、説明を省略する。 According to the present embodiment, the two strip-shaped metal plates 36 and 36 are electrically conductively fixed at two locations in the longitudinal direction with respect to each of the pair of external electrodes 15 and 15 of the capacitor element 11. Therefore, the stress caused by the difference between the linear expansion coefficient of the ceramic dielectric layers 13 and 13 and the linear expansion coefficient of the strip-shaped metal plates 36 and 36 can be reduced, and the change of the temperature environment is under severe conditions. It is a structure suitable for use. Since other configurations are the same as those in the first embodiment, the description thereof is omitted.
次に、本発明の第４の実施形態のセラミックコンデンサ４０について、図６を参照して説明する。図６は本実施形態のセラミックコンデンサ４０の外観斜視図である。 本実施形態のセラミックコンデンサ４０は、平板状のセラミック素体４２と、セラミック素体４２の互いに対向する一対の端面にそれぞれ形成された帯状の一対の外部電極４５，４５と、を備えるコンデンサ素子４１，４１を厚さ方向に複数備え、コンデンサ素子４１，４１の外部電極４５，４５にそれぞれ導電固着された帯状の金属板４６，４６と、帯状の金属板４６，４６の長手方向の複数箇所に互いに離間してそれぞれ導電固着された複数の金属端子４７，４７と、を備える。 Next, a ceramic capacitor 40 according to a fourth embodiment of the present invention will be described with reference to FIG. FIG. 6 is an external perspective view of the ceramic capacitor 40 of the present embodiment. The ceramic capacitor 40 according to this embodiment includes a flat ceramic body 42 and a pair of strip-shaped external electrodes 45 and 45 formed on a pair of opposing end surfaces of the ceramic body 42, respectively. , 41 in the thickness direction, and in a plurality of locations in the longitudinal direction of the strip-shaped metal plates 46, 46 that are conductively fixed to the external electrodes 45, 45 of the capacitor elements 41, 41, respectively. A plurality of metal terminals 47, 47 which are electrically conductively fixed apart from each other.
本実施形態のセラミックコンデンサ４０は、厚さ方向に配列された複数のコンデンサ素子４１，４１の一対の外部電極４５，４５のそれぞれに対し、それぞれ１つの帯状の金属板４６，４６が導電固着されている。また、複数の金属端子４７，４７がそれぞれ屈曲部を有さない短冊状の外観を有しており、厚さ方向に配列された複数のコンデンサ素子４１，４１は、それぞれ独立した帯状の金属板を介して、互いに共通する複数の金属端子４７，４７に導電接続されている点で先の第１の実施形態と異なる。 In the ceramic capacitor 40 of the present embodiment, one band-shaped metal plate 46, 46 is conductively fixed to each of the pair of external electrodes 45, 45 of the plurality of capacitor elements 41, 41 arranged in the thickness direction. ing. Further, the plurality of metal terminals 47 and 47 have a strip-like appearance each having no bent portion, and the plurality of capacitor elements 41 and 41 arranged in the thickness direction are independent band-shaped metal plates. This is different from the first embodiment in that it is conductively connected to a plurality of metal terminals 47, 47 that are common to each other.
本実施形態によれば、厚さ方向に配列された複数のコンデンサ素子を備え、コンデンサ素子毎に帯状の金属板による長手方向への応力分散のメカニズムが独立して働く。このため、上下のコンデンサ素子間で温度環境が異なった場合でも、温度環境の差に起因する金属端子と帯状の金属板との間の応力の発生が抑制される。大電流回路や過酷な環境下での使用に適した構造である。 その他の構成については、先の第１の実施形態と同様であるため、説明を省略する。 According to the present embodiment, a plurality of capacitor elements arranged in the thickness direction are provided, and the mechanism of stress distribution in the longitudinal direction by the strip-shaped metal plate works independently for each capacitor element. For this reason, even when the temperature environment differs between the upper and lower capacitor elements, the occurrence of stress between the metal terminal and the strip-shaped metal plate due to the difference in temperature environment is suppressed. The structure is suitable for use in large current circuits and harsh environments. Since other configurations are the same as those in the first embodiment, the description thereof is omitted.
次に、上記各部の好ましい実施形態について説明する。尚、コンデンサ素子の帯状の外部電極に沿う方向を幅寸法、外部電極と直交するセラミック素体の端面に沿う方向を長さ寸法、セラミック素体の内部電極と直交する方向を厚さ寸法とする。 Next, a preferred embodiment of each part will be described. The direction along the strip-shaped external electrode of the capacitor element is the width dimension, the direction along the end face of the ceramic body orthogonal to the external electrode is the length dimension, and the direction orthogonal to the internal electrode of the ceramic body is the thickness dimension. .
上記セラミックコンデンサに用いるコンデンサ素子としては、幅寸法Ｗ及び長さ寸法Ｌに比べて厚さ寸法Ｔが小さい平板形状を成すことが好ましい。コンデンサ素子の外形寸法は、例えばＬ＝２１．０ｍｍ、Ｗ＝２１．０ｍｍ、Ｈ＝４．５ｍｍである。 The capacitor element used for the ceramic capacitor preferably has a flat plate shape having a thickness dimension T smaller than the width dimension W and the length dimension L. The external dimensions of the capacitor element are, for example, L = 21.0 mm, W = 21.0 mm, and H = 4.5 mm.
上記セラミック誘電体層としては、特に規定はないが、チタン酸バリウム（ＢａＴｉＯ３）系セラミックのほか、Ｂａの一部をＣａやＳｒで置換するとともにＴｉの一部をＺｒで置換した（Ｂａ，Ｃａ，Ｓｒ）（Ｔｉ，Ｚｒ）Ｏ３系セラミック等の中から使用電子回路の耐電圧特性や温度特性等を考慮して適宜選択して用いることが好ましい。尚、チタン酸バリウム（ＢａＴｉＯ３）からなるセラミック誘電体層の線膨張係数は例えば特開平１０−１０１３６１に記載されているように約１２．５×１０−６／℃である。また、セラミック誘電体層の厚さは例えば３〜１００μｍである。 The ceramic dielectric layer is not particularly defined, but in addition to barium titanate (BaTiO 3 ) -based ceramics, a part of Ba is replaced with Ca and Sr and a part of Ti is replaced with Zr (Ba, It is preferable to appropriately select and use a Ca, Sr) (Ti, Zr) O 3 based ceramic or the like in consideration of a withstand voltage characteristic, a temperature characteristic, etc. Incidentally, the linear expansion coefficient of the ceramic dielectric layer made of barium titanate (BaTiO 3 ) is, for example, about 12.5 × 10 −6 / ° C. as described in JP-A-10-101361. The thickness of the ceramic dielectric layer is, for example, 3 to 100 μm.
上記内部電極としては、Ａｇ，Ａｇ−Ｐｄ、Ｐｄ，Ｃｕ等の貴金属もしくはこれらの合金や、Ｎｉ，Ａｌ等の卑金属の中から適宜選択して使用することが好ましい。内部電極の厚さは例えば０．４〜２．０μｍである。 The internal electrode is preferably selected from a noble metal such as Ag, Ag-Pd, Pd, or Cu, or an alloy thereof, or a base metal such as Ni or Al. The thickness of the internal electrode is, for example, 0.4 to 2.0 μm.
上記外部電極としては、特に規定はないが、セラミック誘電体層や内部電極層からなるセラミック素体と同時焼成可能な電極材料を用いてもよいし、また焼成により得られたセラミック素体の端面に塗布・焼付けにより形成することが可能な電極材料を用いてもよい。上記同時焼成可能な電極材料としては、内部電極と同様な金属もしくは合金を主成分とするものが好ましい。また、塗布・焼付けにより形成することが可能な電極材料としては、ＡｇまたはＡｇ合金を主成分とするものが好ましい。 また、上記外部電極はセラミック素体の互いに対向する一対の端面に帯状に形成されることが好ましいが、帯状に限定するものではなく、一対の端面に隣接する端面や上下の主面に回り込み部分を有するものであってもよい。 The external electrode is not particularly defined, but an electrode material that can be fired simultaneously with a ceramic body made of a ceramic dielectric layer or an internal electrode layer may be used, or an end face of the ceramic body obtained by firing. Alternatively, an electrode material that can be formed by coating and baking may be used. As the electrode material that can be fired at the same time, an electrode material mainly composed of the same metal or alloy as that of the internal electrode is preferable. Moreover, as an electrode material that can be formed by coating and baking, an electrode material mainly composed of Ag or an Ag alloy is preferable. In addition, the external electrode is preferably formed in a band shape on a pair of opposite end surfaces of the ceramic body, but is not limited to the band shape, and is a portion that wraps around an end surface adjacent to the pair of end surfaces or upper and lower main surfaces. It may have.
上記帯状の金属板の材質としては、４２アロイ、インバー、コバールのうちのいずれか１種からなることが好ましい。４２アロイ（４２Ｎｉ−Ｆｅ）の線膨張係数は、約４．３×１０−６／℃、体積抵抗率は約７０μΩ・ｃｍである。上記帯状の金属板の幅および長さは、コンデンサ素子の外部電極の幅および長さと同等もしくはこれより小さいことが好ましい。また、帯状の金属板の厚さは、１５０μｍ〜８００μｍが好ましく。３００μｍ〜５００μｍがより好ましい。 上記帯状の金属板の寸法は、例えば、幅２．５ｍｍ、長さ３０ｍｍ、厚さ４００μｍである。 The material of the band-shaped metal plate is preferably composed of any one of 42 alloy, Invar, and Kovar. The 42 alloy (42Ni—Fe) has a linear expansion coefficient of about 4.3 × 10 −6 / ° C. and a volume resistivity of about 70 μΩ · cm. The width and length of the strip-shaped metal plate are preferably equal to or smaller than the width and length of the external electrode of the capacitor element. The thickness of the strip-shaped metal plate is preferably 150 μm to 800 μm. 300 μm to 500 μm is more preferable. The strip-shaped metal plate has, for example, a width of 2.5 mm, a length of 30 mm, and a thickness of 400 μm.
上記金属端子の材質としては、銅が好ましく、より具体的には、ＪＩＳ規格のＣ１０２０、Ｃ１１００のうちの何れか１種からなることが好ましい。銅（Ｃ１０２０，Ｃ１１００）の線膨張係数は、１７．７×１０−６／℃、体積抵抗率は約１．７１μΩ・ｃｍである。上記金属端子の形状としては、特に限定はない。 As the material of the metal terminal, copper is preferable, and more specifically, it is preferably made of any one of JIS standard C1020 and C1100. Copper (C1020, C1100) has a linear expansion coefficient of 17.7 × 10 −6 / ° C. and a volume resistivity of about 1.71 μΩ · cm. The shape of the metal terminal is not particularly limited.
外部電極と帯状の金属板との導電固着や帯状の金属板と金属端子との導電固着に用いるロウ材としては、銀ロウ、ＢＡｇ−８、ＢＡｇ−１８、ＢＡｇ−２１等を用いることが好ましい。 Silver solder, BAg-8, BAg-18, BAg-21, or the like is preferably used as the brazing material used for conductive fixation between the external electrode and the strip-shaped metal plate or conductive fixation between the strip-shaped metal plate and the metal terminal. .
次に、本発明のセラミックコンデンサの一実施例について、図１〜図３を参照して説明する。まず、ＢａＴｉＯ３系セラミックの材料粉末にバインダー及び溶剤を添加・混合してセラミックグリーンシートを作成した。次に、得られたグリーンシート上に、Ｎｉを主成分とする内部電極材料ペーストを塗布して、内部電極本体と内部電極本体から延出された引き出し部とを有する内部電極パターンを形成した。 次に、得られた内部電極パターン付きのセラミックグリーンシートを引き出し部が交互に突出するように重ね、その上下に内部電極を有さないグリーンシートを積層し、圧着した後、コンデンサ素子単位に切断し、４００℃で脱バインダー処理した後、１３５０℃で焼成して、幅３５ｍｍ、長さ３５ｍｍ、厚さ４．５ｍｍの平板形状のセラミック素体１２を得た。 次に、得られたセラミック素体１２の内部電極１４の引き出し部１４ｂが露出する互いに対向する一対の端面にそれぞれＣｕを主成分とする外部電極用材料ペーストを転写法により塗布し、焼付処理して帯状の一対の外部電極１５，１５を形成してコンデンサ素子１１を得た。 次に、得られたコンデンサ素子１１の帯状の外部電極１５，１５と、これに対向するように幅１．５ｍｍ、長さ７ｍｍ、厚さ４００μｍの銅（ＪＩＳ：Ｃ１０１０）からなる端子片をクランク状にプレス成形して得られた複数の金属端子１７，１７を外部電極１５の長手方向に沿って２．５ｍｍ間隔で互いに離間した状態に図示省略した保持手段で保持し、両主面に銀系のロウ材を塗布した幅２．５ｍｍ、長さ３０ｍｍ、厚さ４００μｍの４２アロイ（４２Ｎｉ−Ｆｅ）からなる帯状の金属板を間に挟み、８２０℃の窒素雰囲気中で加熱して外部電極と帯状の金属板、および帯状の金属板と金属端子とをそれぞれ導電固着して、本発明の実施例のセラミックコンデンサ１０を得た。 Next, an embodiment of the ceramic capacitor of the present invention will be described with reference to FIGS. First, a ceramic green sheet was prepared by adding and mixing a binder and a solvent to a material powder of BaTiO 3 ceramic. Next, an internal electrode material paste containing Ni as a main component was applied onto the obtained green sheet to form an internal electrode pattern having an internal electrode body and a lead portion extending from the internal electrode body. Next, the obtained ceramic green sheets with internal electrode patterns are stacked so that the lead-out portions protrude alternately, and green sheets without internal electrodes are stacked on top and bottom of the ceramic green sheets, and after pressure bonding, cut into capacitor element units. After debinding at 400 ° C., firing was performed at 1350 ° C. to obtain a plate-shaped ceramic body 12 having a width of 35 mm, a length of 35 mm, and a thickness of 4.5 mm. Next, an external electrode material paste containing Cu as a main component is applied by a transfer method to a pair of opposed end faces where the lead portions 14b of the internal electrode 14 of the obtained ceramic body 12 are exposed, and is baked. A capacitor element 11 was obtained by forming a pair of strip-like external electrodes 15 and 15. Next, the strip-like external electrodes 15 and 15 of the obtained capacitor element 11 and a terminal piece made of copper (JIS: C1010) having a width of 1.5 mm, a length of 7 mm, and a thickness of 400 μm so as to be opposed thereto are cranked. A plurality of metal terminals 17, 17 obtained by press-molding into a shape are held by holding means (not shown) in a state of being separated from each other at intervals of 2.5 mm along the longitudinal direction of the external electrode 15, and silver on both main surfaces A strip-shaped metal plate made of 42 alloy (42Ni-Fe) having a width of 2.5 mm, a length of 30 mm, and a thickness of 400 μm coated with a brazing material is sandwiched and heated in a nitrogen atmosphere at 820 ° C. to external electrodes And the band-shaped metal plate, and the band-shaped metal plate and the metal terminal were respectively conductively fixed to obtain the ceramic capacitor 10 of the example of the present invention.
上記で得られた本発明の実施例のセラミックコンデンサ１０について、ＦＲ−４（ガラス・エポキシ）からなる回路基板にフロー半田により実装した後、たわみ試験を行なった後、セラミックコンデンサのセラミック素体を目視外観検査して、セラミック素体のひび割れの発生の有無を調べた。 上記試験の結果、本発明の実施例のセラミックコンデンサにおいては、１００個中でひび割れが発生したものは見出されたかった。 The ceramic capacitor 10 of the embodiment of the present invention obtained above was mounted on a circuit board made of FR-4 (glass / epoxy) by flow soldering, then subjected to a deflection test, and then the ceramic body of the ceramic capacitor was mounted. A visual appearance inspection was conducted to check for cracks in the ceramic body. As a result of the above test, in the ceramic capacitor of the example of the present invention, it was desired to find no ceramic capacitor in which 100 cracks occurred.
電子機器の電源回路等において、大電流化に対応可能なセラミックコンデンサとして好適である。 It is suitable as a ceramic capacitor that can cope with a large current in a power circuit of an electronic device.
１０，２０，３０，４０：セラミックコンデンサ １１，４１：コンデンサ素子 １２，４２：セラミック素体 １３：セラミック誘電体層 １４：内部電極 １４ａ：内部電極本体 １４ｂ：引き出し部 １５，４５：外部電極 １６，３６，４６：帯状の金属板 １７，２７，３７，４７：金属端子 １８，１８ａ，１８ｂ：ロウ材 DESCRIPTION OF SYMBOLS 10, 20, 30, 40: Ceramic capacitor 11, 41: Capacitor element 12, 42: Ceramic body 13: Ceramic dielectric layer 14: Internal electrode 14a: Internal electrode main body 14b: Lead-out part 15, 45: External electrode 16, 36, 46: Band-shaped metal plates 17, 27, 37, 47: Metal terminals 18, 18a, 18b: Brazing material
Claims (4)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015051795A JP5876177B2 (en) | 2015-03-16 | 2015-03-16 | Ceramic capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015051795A JP5876177B2 (en) | 2015-03-16 | 2015-03-16 | Ceramic capacitor |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013250753A Division JP5716078B2 (en) | 2013-12-04 | 2013-12-04 | Ceramic capacitor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2015135985A true JP2015135985A (en) | 2015-07-27 |
| JP5876177B2 JP5876177B2 (en) | 2016-03-02 |
Family
ID=53767598
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015051795A Active JP5876177B2 (en) | 2015-03-16 | 2015-03-16 | Ceramic capacitor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5876177B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111063544A (en) * | 2018-10-16 | 2020-04-24 | 株式会社村田制作所 | Laminated ceramic electronic component |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0935987A (en) * | 1995-07-17 | 1997-02-07 | Murata Mfg Co Ltd | Ceramic capacitor |
| JPH11233370A (en) * | 1998-02-09 | 1999-08-27 | Tdk Corp | Ceramic capacitor |
| JP2000182887A (en) * | 1998-12-18 | 2000-06-30 | Murata Mfg Co Ltd | Multilayer ceramic capacitor |
| JP2000306764A (en) * | 1999-04-23 | 2000-11-02 | Murata Mfg Co Ltd | Ceramic electronic component and production thereof |
| JP2002057063A (en) * | 2000-08-11 | 2002-02-22 | Murata Mfg Co Ltd | Multilayer ceramic electronic component |
| US6924967B1 (en) * | 2004-04-30 | 2005-08-02 | Alan Devoe | Noninterdigitated mounting for interdigitated stacked capacitor and method |
| WO2006022257A1 (en) * | 2004-08-25 | 2006-03-02 | Murata Manufacturing Co., Ltd. | Ceramic electronic component |
| WO2006126352A1 (en) * | 2005-05-23 | 2006-11-30 | Murata Manufacturing Co., Ltd. | Ceramic electronic component and method for manufacturing same |
-
2015
- 2015-03-16 JP JP2015051795A patent/JP5876177B2/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0935987A (en) * | 1995-07-17 | 1997-02-07 | Murata Mfg Co Ltd | Ceramic capacitor |
| JPH11233370A (en) * | 1998-02-09 | 1999-08-27 | Tdk Corp | Ceramic capacitor |
| JP2000182887A (en) * | 1998-12-18 | 2000-06-30 | Murata Mfg Co Ltd | Multilayer ceramic capacitor |
| JP2000306764A (en) * | 1999-04-23 | 2000-11-02 | Murata Mfg Co Ltd | Ceramic electronic component and production thereof |
| JP2002057063A (en) * | 2000-08-11 | 2002-02-22 | Murata Mfg Co Ltd | Multilayer ceramic electronic component |
| US6924967B1 (en) * | 2004-04-30 | 2005-08-02 | Alan Devoe | Noninterdigitated mounting for interdigitated stacked capacitor and method |
| WO2006022257A1 (en) * | 2004-08-25 | 2006-03-02 | Murata Manufacturing Co., Ltd. | Ceramic electronic component |
| WO2006126352A1 (en) * | 2005-05-23 | 2006-11-30 | Murata Manufacturing Co., Ltd. | Ceramic electronic component and method for manufacturing same |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111063544A (en) * | 2018-10-16 | 2020-04-24 | 株式会社村田制作所 | Laminated ceramic electronic component |
Also Published As
| Publication number | Publication date |
|---|---|
| JP5876177B2 (en) | 2016-03-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP7223814B2 (en) | CERAMIC ELEMENT AND METHOD OF MANUFACTURING CERAMIC ELEMENT | |
| JP5857847B2 (en) | Ceramic electronic components | |
| CN108054008B (en) | Multilayer ceramic capacitor | |
| KR102076145B1 (en) | Multi-layered ceramic electronic part, board for mounting the same and manufacturing method thereof | |
| KR102018307B1 (en) | Multi-layered ceramic capacitor and board for mounting the same | |
| KR20160097818A (en) | Multilayer ceramic electronic component and board having the same | |
| JP2015035571A (en) | Multilayer ceramic capacitor and board for mounting multilayer ceramic capacitor thereon | |
| KR101031111B1 (en) | Complex Ceramic Chip Component capable for surface-mounting | |
| JP6962305B2 (en) | Multilayer ceramic electronic components | |
| JP2014053598A (en) | Electronic component | |
| CN104576051A (en) | Ceramic electronic component | |
| JP2005252104A (en) | Laminated ceramic capacitor | |
| JP2012151175A (en) | Ceramic electronic component, ceramic electronic component mounting structure, and ceramic electronic component manufacturing method | |
| JP2009170706A (en) | Multilayer electronic component | |
| JP5876177B2 (en) | Ceramic capacitor | |
| JP5716078B2 (en) | Ceramic capacitor | |
| JP5432061B2 (en) | Ceramic capacitor | |
| JP2001015371A (en) | Chip-type ceramic electronic component and manufacture thereof | |
| JP2007234820A (en) | Ceramic electronic component | |
| JP6240775B2 (en) | Multilayer device having external connections and method for manufacturing a multilayer device having external connections | |
| KR20220095541A (en) | Multilayered capacitor and board for mounting the same | |
| JP6424460B2 (en) | Multilayer ceramic capacitor and method of manufacturing the same | |
| JP2006310618A (en) | Ceramic electronic component and its manufacturing method | |
| JP6657947B2 (en) | Electronic components | |
| JP7394292B2 (en) | laminated electronic components |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20151215 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20160105 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20160120 |
|
| R150 | Certificate of patent or registration of utility model |
Ref document number: 5876177 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |