JP2015133702A - 懸架されたストリップ線路アンテナ駆動システムのためのシステムおよび方法 - Google Patents
懸架されたストリップ線路アンテナ駆動システムのためのシステムおよび方法 Download PDFInfo
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- 238000000034 method Methods 0.000 title claims abstract description 22
- 230000008878 coupling Effects 0.000 claims description 2
- 238000010168 coupling process Methods 0.000 claims description 2
- 238000005859 coupling reaction Methods 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 10
- 239000004020 conductor Substances 0.000 description 7
- 238000005476 soldering Methods 0.000 description 5
- 239000002184 metal Substances 0.000 description 4
- YFSLABAYQDPWPF-UHFFFAOYSA-N 1,2,3-trichloro-4-(2,3,5-trichlorophenyl)benzene Chemical compound ClC1=CC(Cl)=C(Cl)C(C=2C(=C(Cl)C(Cl)=CC=2)Cl)=C1 YFSLABAYQDPWPF-UHFFFAOYSA-N 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 230000002457 bidirectional effect Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
- H01P3/08—Microstrips; Strip lines
- H01P3/081—Microstriplines
- H01P3/084—Suspended microstriplines
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/002—Protection against seismic waves, thermal radiation or other disturbances, e.g. nuclear explosion; Arrangements for improving the power handling capability of an antenna
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/0006—Particular feeding systems
- H01Q21/0075—Stripline fed arrays
- H01Q21/0081—Stripline fed arrays using suspended striplines
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
- H05K1/0251—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance related to vias or transitions between vias and transmission lines
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
- H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
- H01Q1/246—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for base stations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/50—Structural association of antennas with earthing switches, lead-in devices or lightning protectors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Details Of Aerials (AREA)
- Variable-Direction Aerials And Aerial Arrays (AREA)
Abstract
Description
[0013]以下の詳細な説明では、本明細書の一部を形成し、特有の例示的な実施形態として示される添付の図に参照がなされる。しかし、他の実施形態が利用されてよく、論理的、機械的、および電気的変更が加えられてよいことを理解されたい。さらに、図および本明細書に提示された方法は、個々のステップが実施され得る順序を限定するものとして解釈されるものではない。したがって、以下の詳細な説明は、限定的な意味としてとらえられるものではない。
[0032]実施例3は、少なくとも1つの導電層の1つまたは複数の開口部を介して第1の回路板を第2の回路板に接続する少なくとも1つのはんだ付け可能なピンをさらに備える、実施例2のアンテナ用の給電構造体を含む。
[0034]実施例5は、少なくとも1つの導電層に接続された避雷針をさらに備える、実施例1から4のいずれかのアンテナ配列用の給電構造体を含む。
[0036]実施例7は、接続器が少なくとも1つの回路にそれを介して結合される開口部の直径が、接続器を少なくとも1つの回路に結合する結合器の直径に比例し、それにより、接続器の特性インピーダンスが、少なくとも1つの回路の特性インピーダンスにほぼ整合する、実施例1から6のいずれかのアンテナ配列用の給電構造体を含む。
[0039]実施例10は、少なくとも1つの導電層の1つまたは複数内の開口部を介して第1の回路板を第2の回路板に接続する少なくとも1つのはんだ付け可能なピンをさらに備える、実施例9の方法を含む。
[0041]実施例12は、避雷針を少なくとも1つの導電層に接続するステップをさらに含む、実施例8から11のいずれかの方法を含む。
[0043]実施例14は、接続器が少なくとも1つの回路にそれを介して結合される開口部の直径が、接続器を少なくとも1つの回路に結合する結合器の直径に比例し、それにより、接続器の特性インピーダンスが、少なくとも1つの回路の特性インピーダンスにほぼ整合する、実施例8から13のいずれかの方法を含む。
[0046]実施例17は、導電材料内の開口部を介して第1の回路板を第2の回路板に接続する少なくとも1つのはんだ付け可能なピンをさらに備える、実施例16のアンテナ配列用の駆動網を含む。
[0048]実施例19は、導電材料に接続された避雷針をさらに備える、実施例15から18のいずれかのアンテナ配列用の駆動網を含む。
[0050]特有の実施形態が本明細書において図示され説明されてきたが、同じ目的を達成するように算出された任意の配置が、図示された特有の実施形態に対して代用され得ることが、当業者によって理解されるであろう。したがって、本発明は、特許請求の範囲およびその等価物によってのみ限定されることが明白に意図される。
110 ストリップ線路給電網
112 給電入力/出力構成要素
114 出力分配網
120 アンテナ配列
130 多層プリント回路板
140 支持体
150 ベイ
160 放射要素
200 給電構造体
212 回路板
214 回路
215 距離
216 導電層
217 厚さ
218 誘電体
219 直径
221 直径
220 接続器
222 開口部
224 結合器
229 短絡部材
300 アンテナ配列用の給電構造体
312 回路板
316a、316c 底部導電層
323 避雷針
400 アンテナ配列用の給電構造体
412a 第1の回路板
412b 第2の回路板
416b 中間導電層
423 直径
426 はんだ付け可能なピン
428 はんだ付け
431 穴
433 穴
500 アンテナ配列用の給電構造体
502 ブロック
504 ブロック
506 ブロック
612a 回路板
612b 第2の回路板
612c 回路板
616a 導電層
616b 中間導電層
616c 底部導電層
620 接続器
623 避雷針
626 はんだ付け可能なピン
628 はんだ付け
632 ねじおよびナット
D1 2つの導電層の表面間の距離
D2 結合器の直径
D3 穴の直径
d1 回路板の厚さ
d2 開口部の直径
d3 ピンの直径
Claims (3)
- アンテナ配列用の給電構造体であって、
少なくとも1つの回路板(212)であって、
少なくとも1つの回路(214)が、前記少なくとも1つの回路板(212)上に形成される、少なくとも1つの回路板(212)と、
少なくとも1つの導電層(216)であって、
前記少なくとも1つの回路板(212)が、前記少なくとも1つの導電層(216)に装着され、
前記少なくとも1つの導電層(216)が、誘電体(218)によって前記少なくとも1つの回路(214)から分離され、前記少なくとも1つの回路(214)が前記少なくとも1つの導電層(216)から絶縁されるように前記少なくとも1つの回路板(212)と接触する、少なくとも1つの導電層(216)と、
前記少なくとも1つの導電層(216)内の開口部(222)を介して前記少なくとも1つの回路(214)に結合される、少なくとも1つの接続器(224)とを備える、アンテナ配列用の給電構造体。 - 前記少なくとも1つの導電層(216)に接続された避雷針(323)をさらに備える、請求項1に記載のアンテナ配列用の給電構造体。
- アンテナ配列用の給電構造体を構築するための方法であって、
少なくとも1つの回路板を提供するステップであって、
少なくとも1つの回路が、前記少なくとも1つの回路板(502)上に形成される、ステップと、
前記少なくとも1つの回路板を少なくとも1つの導電層に装着するステップであって、
前記少なくとも1つの導電層が、誘電体によって前記少なくとも1つの回路から分離され、前記回路が前記少なくとも1つの導電層(504)から絶縁されるように前記少なくとも1つの回路板と接触する、ステップと、
前記少なくとも1つの導電層(506)内の開口部を介して少なくとも1つの接続器を前記少なくとも1つの回路に結合する、ステップとを含む、方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14/155,920 | 2014-01-15 | ||
US14/155,920 US9408306B2 (en) | 2014-01-15 | 2014-01-15 | Antenna array feeding structure having circuit boards connected by at least one solderable pin |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2015133702A true JP2015133702A (ja) | 2015-07-23 |
JP6604724B2 JP6604724B2 (ja) | 2019-11-13 |
Family
ID=52232120
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Application Number | Title | Priority Date | Filing Date |
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JP2015004001A Active JP6604724B2 (ja) | 2014-01-15 | 2015-01-13 | 懸架されたストリップ線路アンテナ駆動システムのためのシステムおよび方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US9408306B2 (ja) |
EP (1) | EP2897216B1 (ja) |
JP (1) | JP6604724B2 (ja) |
RU (1) | RU2673059C2 (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2954594B1 (en) | 2013-02-08 | 2022-01-12 | Honeywell International Inc. | Integrated stripline feed network for linear antenna array |
US9728855B2 (en) | 2014-01-14 | 2017-08-08 | Honeywell International Inc. | Broadband GNSS reference antenna |
US10347961B2 (en) * | 2016-10-26 | 2019-07-09 | Raytheon Company | Radio frequency interconnect systems and methods |
US11043727B2 (en) | 2019-01-15 | 2021-06-22 | Raytheon Company | Substrate integrated waveguide monopulse and antenna system |
CN110994165B (zh) * | 2019-11-21 | 2022-04-12 | 东南大学 | 一种高隔离度悬置微带线平衡馈电的双极化宽带天线阵列 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4383226A (en) * | 1979-03-29 | 1983-05-10 | Ford Aerospace & Communications Corporation | Orthogonal launcher for dielectrically supported air stripline |
JPS6346804A (ja) * | 1986-08-14 | 1988-02-27 | Matsushita Electric Works Ltd | 平面アンテナの製造方法 |
JPH1188016A (ja) * | 1997-09-05 | 1999-03-30 | Japan Radio Co Ltd | トリプレート型平面アンテナ |
JP2009267502A (ja) * | 2008-04-22 | 2009-11-12 | Hitachi Cable Ltd | アンテナ装置 |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4262265A (en) | 1979-03-29 | 1981-04-14 | Ford Aerospace & Communications Corporation | Side-launch transition for air stripline conductors |
FR2544920B1 (fr) | 1983-04-22 | 1985-06-14 | Labo Electronique Physique | Antenne plane hyperfrequences a reseau de lignes a substrat completement suspendu |
US5061943A (en) | 1988-08-03 | 1991-10-29 | Agence Spatiale Europenne | Planar array antenna, comprising coplanar waveguide printed feed lines cooperating with apertures in a ground plane |
RU2062536C1 (ru) * | 1993-12-14 | 1996-06-20 | Евгений Александрович Соколов | Двухдиапазонная совмещенная антенная решетка |
US5471181A (en) | 1994-03-08 | 1995-11-28 | Hughes Missile Systems Company | Interconnection between layers of striplines or microstrip through cavity backed slot |
US6621469B2 (en) | 1999-04-26 | 2003-09-16 | Andrew Corporation | Transmit/receive distributed antenna systems |
US6366185B1 (en) | 2000-01-12 | 2002-04-02 | Raytheon Company | Vertical interconnect between coaxial or GCPW circuits and airline via compressible center conductors |
US6727777B2 (en) | 2001-04-16 | 2004-04-27 | Vitesse Semiconductor Corporation | Apparatus and method for angled coaxial to planar structure broadband transition |
US20040048420A1 (en) * | 2002-06-25 | 2004-03-11 | Miller Ronald Brooks | Method for embedding an air dielectric transmission line in a printed wiring board(PCB) |
US6965279B2 (en) | 2003-07-18 | 2005-11-15 | Ems Technologies, Inc. | Double-sided, edge-mounted stripline signal processing modules and modular network |
DE102004063784A1 (de) | 2004-06-14 | 2006-07-13 | Alexandro Lisitano | Modulare Antennenanlage |
EP1886381B1 (en) | 2005-05-31 | 2014-10-22 | Powerwave Technologies Sweden AB | Beam adjusting device |
DE102005063234B4 (de) | 2005-12-19 | 2007-08-30 | Fuß, Torsten, Dr.-Ing. | Tragkonstruktion zum Aufbau von Antennenmasten und dergleichen |
RU57973U8 (ru) * | 2006-06-28 | 2007-02-10 | Федеральное государственное унитарное предприятие научно-исследовательский институт космического приборостроения | Апертурно-запитываемая микрополосковая антенна с широкой диаграммой направленности |
RU68191U1 (ru) * | 2007-06-22 | 2007-11-10 | Федеральное государственное унитарное предприятие "Российский научно-исследовательский институт космического приборостроения" | Антенное устройство базовой станции беспроводной мобильной связи |
WO2010135862A1 (zh) | 2009-05-26 | 2010-12-02 | 华为技术有限公司 | 一种天线装置 |
RU2400880C1 (ru) * | 2009-10-27 | 2010-09-27 | Открытое акционерное общество "Московское конструкторское бюро "Компас" | Печатная антенна |
RU118474U1 (ru) * | 2010-12-13 | 2012-07-20 | Сергей Геннадьевич Сычугов | Широкополосная полосковая антенна с двойной поляризацией |
US9054403B2 (en) * | 2012-06-21 | 2015-06-09 | Raytheon Company | Coaxial-to-stripline and stripline-to-stripline transitions including a shorted center via |
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2014
- 2014-01-15 US US14/155,920 patent/US9408306B2/en active Active
-
2015
- 2015-01-08 EP EP15150542.7A patent/EP2897216B1/en active Active
- 2015-01-13 JP JP2015004001A patent/JP6604724B2/ja active Active
- 2015-01-13 RU RU2015100200A patent/RU2673059C2/ru not_active IP Right Cessation
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4383226A (en) * | 1979-03-29 | 1983-05-10 | Ford Aerospace & Communications Corporation | Orthogonal launcher for dielectrically supported air stripline |
JPS6346804A (ja) * | 1986-08-14 | 1988-02-27 | Matsushita Electric Works Ltd | 平面アンテナの製造方法 |
JPH1188016A (ja) * | 1997-09-05 | 1999-03-30 | Japan Radio Co Ltd | トリプレート型平面アンテナ |
JP2009267502A (ja) * | 2008-04-22 | 2009-11-12 | Hitachi Cable Ltd | アンテナ装置 |
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JP6604724B2 (ja) | 2019-11-13 |
RU2015100200A (ru) | 2016-08-10 |
US20150201494A1 (en) | 2015-07-16 |
EP2897216B1 (en) | 2017-06-21 |
RU2015100200A3 (ja) | 2018-08-31 |
EP2897216A1 (en) | 2015-07-22 |
RU2673059C2 (ru) | 2018-11-22 |
US9408306B2 (en) | 2016-08-02 |
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