JP2015133234A - Heat tool, and thermocompression device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a heat tool or the like capable of suppressing the warpage of a head part during heating.SOLUTION: A heat tool includes: a head part 21 in contact with an intermediate body 100 at a head surface 21a; a ceramic heater 22 which is provided on an under surface of the head part 21, which has a heating resistor 22b, and which expands by heat generation of the heating resistor 22b; a holder 23 which is provided on an under surface of the ceramic heater 22 and whose expansion amount is smaller than that of the ceramic heater 22 during heat generation of the ceramic heater 22; a stage 24 which is provided on an under surface of the holder 23; and a heating part 25 which heats the stage 24.

Description

  The present invention relates to a heat tool and a thermocompression bonding apparatus for thermocompression bonding a thermocompression bonding object.

  Conventionally, a pressure heater including a head for pressing an object to be heated placed on the upper surface, a ceramic heater that contacts the lower surface of the head and heats the head, and a holder that holds the ceramic heater is known. ing. In the press heater, when the ceramic heater generates heat, the temperature of the ceramic heater becomes higher than that of the holder, and therefore the ceramic heater expands more than the holder. For this reason, the holder and the ceramic heater are warped in a convex shape on the ceramic heater side, that is, the upper side, and as a result, the head is warped in a convex shape on the upper side. Therefore, the flatness of the upper surface of the head is ensured during heating by making the upper surface of the head a concave curved surface at room temperature (see Patent Document 1).

JP-A-2005-050835

  Conventional press heaters are designed to ensure the flatness of the upper surface of the head even if the head warps convexly when heated by processing the upper surface of the head into a concave curved surface in advance. It did not suppress the warpage of the head.

  An object of the present invention is to provide a heat tool and a thermocompression bonding apparatus that can suppress warping of the head portion during heating.

  The heat tool of the present invention is provided on the surface on the second direction side opposite to the first direction of the head portion, the head portion contacting the thermocompression bonding object on the surface on the first direction side, and has a heating element, A first thermal expansion portion that expands due to heat generated by the heat generating element and a surface on the second direction side of the first thermal expansion portion, and when the first thermal expansion portion generates heat, the expansion amount is smaller than that of the first thermal expansion portion. It is provided with the intermediate part, the 2nd thermal expansion part provided in the surface by the side of the 2nd direction of an intermediate part, and the heating part which heats a 2nd thermal expansion part.

When the first thermal expansion part generates heat, the first thermal expansion part expands more than the intermediate part. For this reason, if the heat tool does not include the second thermal expansion portion, the bimetallic effect between the intermediate portion and the first thermal expansion portion provided on the surface in the first direction when the first thermal expansion portion generates heat. Accordingly, the intermediate portion and the first thermal expansion portion are warped in a convex shape toward the first direction. As a result, the head portion provided on the surface of the first thermal expansion portion on the first direction side warps in a convex shape on the first direction side.
On the other hand, according to this structure, a 2nd thermal expansion part can be expanded by heating the 2nd thermal expansion part provided in the surface by the side of the 2nd direction of the intermediate part with a heating part. Therefore, it is suppressed that a middle part and the 1st thermal expansion part warp in convex shape to the 1st direction side by a bimetal effect. Accordingly, it is possible to suppress warping of the head portion during heating.

  In this case, a first temperature detection unit that detects the temperature of the first thermal expansion unit, a second temperature detection unit that detects the temperature of the second thermal expansion unit, and the first thermal expansion detected by the first temperature detection unit. It is preferable to further include a control unit that controls the power supply unit that supplies power to the heating unit based on the temperature of the unit and the temperature of the second thermal expansion unit detected by the second temperature detection unit.

  According to this configuration, the temperature of the second thermal expansion unit is controlled so that the expansion amount of the second thermal expansion unit becomes equal to the expansion amount of the first thermal expansion unit when the first thermal expansion unit generates heat. be able to. For this reason, the curvature of the head part at the time of a heating can be suppressed more effectively.

In this case, the second thermal expansion part preferably has a thermal expansion coefficient of 15 × 10 ⁻⁶ (1 / K) or more.

According to this structure, compared with the case where the thermal expansion coefficient of a 2nd thermal expansion part is less than 15 * 10 < ^-6 > (1 / K), a 2nd expansion part expands with a small heating amount. For this reason, the energy required for the heating part to heat the second thermal expansion part can be reduced.

  In this case, the first thermal expansion part further includes a ceramic base, and the ceramic base preferably has a thermal conductivity of 50 (W / m · K) or more.

  According to this configuration, heat generated from the heating element is efficiently transmitted to the head portion as compared with the case where the thermal conductivity of the ceramic substrate is less than 50 (W / m · K). Therefore, the head part can be efficiently heated by the first thermal expansion part.

  In this case, the intermediate part preferably has a thermal conductivity of 35 (W / m · K) or less.

  According to this configuration, it is possible to suppress the heat generated from the heating element from escaping to the second thermal expansion portion side as compared with the case where the thermal conductivity of the intermediate portion is greater than 35 (W / m · K). Therefore, the head part can be efficiently heated by the first thermal expansion part.

  A thermocompression bonding apparatus according to the present invention includes the above heat tool and a tool driving unit that causes the heat tool to press a thermocompression object.

  According to this structure, the thermocompression bonding object can be heated in a state where the thermocompression bonding object is pressed uniformly by providing the heat tool that can suppress the warp of the head part during heating.

  In this case, before the thermocompression bonding object is pressed by the heat tool, the heating element of the first thermal expansion part is set in a non-heated state and the heat compression object is pressed by the heat tool. The body is preferably heated.

  According to this configuration, the thermocompression bonding object is not heated before the thermocompression bonding object is pressed. For this reason, before pressing a thermocompression bonding object, even when it is better not to heat a thermocompression bonding object, a thermocompression bonding object part can be favorably thermocompression bonded.

It is sectional drawing of the head intermediate body which is a thermocompression bonding target object. It is a figure which shows the wiring pulled out from the piezoelectric element of the head intermediate body. It is a flexible printed circuit board which is a thermocompression bonding object, Comprising: (a) is a side view, (b) is a top view. It is a block diagram of the thermocompression bonding apparatus provided with the heat tool which concerns on one Embodiment of this invention. It is a heat tool which concerns on related technology, Comprising: (a) is the figure at the time of normal temperature, (b) is a figure at the time of a heating. It is the heat tool which concerns on this embodiment, Comprising: (a) is the figure at the time of normal temperature, (b) is a figure at the time of a heating.

Hereinafter, an embodiment of a thermocompression bonding apparatus including a heat tool according to the present invention will be described with reference to the accompanying drawings. The thermocompression bonding apparatus according to the present embodiment is used, for example, in an inkjet head manufacturing process. More specifically, in the inkjet head, flexible printed circuits (FPC: Flexible Printed Circuits) on which drive circuits are mounted are used. , For bonding using a thermosetting adhesive.
In the following, description will be made using “up”, “down”, “left”, “right”, “front”, and “rear” shown in the drawings, but these directions are for convenience of explanation, and the present invention is implemented. Is not limited to these directions.

First, the head intermediate body and FPC, which are thermocompression bonding objects, will be described. The head intermediate means an ink jet head before the FPC is bonded.
As shown in FIG. 1, the head intermediate 100 includes a nozzle plate 102 in which a plurality of nozzles 101 from which ink droplets are ejected are provided in two rows on the left and right sides, and a flow path forming substrate 103 connected to the upper surface of the nozzle plate 102. And a diaphragm 105 connected to the upper surface of the flow path forming substrate 103 and displaced by driving the plurality of piezoelectric elements 104, and a reservoir forming substrate 107 connected to the upper surface of the diaphragm 105 and forming the reservoir 106. I have. An FPC 200 is provided above the reservoir forming substrate 107.

  A plurality of cavities 108 are formed by a space surrounded by the flow path forming substrate 103 having a plurality of partition walls, the nozzle plate 102, and the diaphragm 105. The plurality of nozzles 101 and the plurality of cavities 108 correspond one to one. The plurality of cavities 108 and the plurality of piezoelectric elements 104 correspond one to one. Between the left and right reservoir forming substrates 107, a groove-like wiring row region 109 extending in the front-rear direction is formed.

  In the ink jet head in which the head intermediate body 100 and the FPC 200 are joined, the ink sent from the ink supply unit (not shown) is once introduced into the reservoir 106 and further fills the internal flow path to the nozzle 101. . A drive circuit 203 (described later) selectively applies a voltage to the plurality of piezoelectric elements 104 based on a command from an external controller (not shown) to displace the piezoelectric elements 104 and the diaphragm 105. As a result, the internal pressure of each cavity 108 changes, and ink droplets are ejected from each nozzle 101.

  As shown in FIG. 2, the wiring 111 is drawn from each piezoelectric element 104 in the wiring row region 109.

  As shown in FIG. 3, the FPC 200 is called a COF (Chip on Film), and is mounted on the flexible FPC base material 201, the conductive pattern 202 formed on the FPC base material 201, and the conductive pattern 202. The drive circuit 203 is provided. The leading end portion of the conductive pattern 202 is a conductive portion 204 that is joined to the wiring 111 on the head intermediate body 100 side.

Then, the thermocompression bonding apparatus of this embodiment is demonstrated.
As shown in FIG. 4, the thermocompression bonding apparatus 1 includes an upper heat tool 10 and a lower heat tool 20 that face each other in the vertical direction, and an elevating mechanism 30 that raises and lowers the upper heat tool 10.
The lifting mechanism 30 is an example of a “tool drive unit” in the claims.

The upper heat tool 10 and the lower heat tool 20 are configured in the same manner, and the head portions 11 and 21 in contact with the FPC 200 or the head intermediate body 100, ceramic heaters 12 and 22 for heating the head portions 11 and 21, and ceramic Holders 13 and 23 for holding the heaters 12 and 22, stages 14 and 24 attached to the lifting mechanism 30 or the support frame 40, and heating units 15 and 25 built in the stages 14 and 24 are provided. In the upper heat tool 10, a ceramic heater 12 is provided on the upper surface of the head portion 11, a holder 13 is provided on the upper surface of the ceramic heater 12, and a stage 14 is provided on the upper surface of the holder 13. In the lower heat tool 20, a ceramic heater 22 is provided on the lower surface of the head portion 21, a holder 23 is provided on the lower surface of the ceramic heater 22, and a stage 24 is provided on the lower surface of the holder 23.
The ceramic heaters 12 and 22 are examples of the “first thermal expansion portion” in the claims. The holders 13 and 23 are examples of the “intermediate portion” in the claims. The stages 14 and 24 are examples of the “second thermal expansion portion” in the claims. The elevating mechanism 30 is an example of the “tool drive unit” in the claims.

Furthermore, the upper heat tool 10 and the lower heat tool 20, respectively, are heater temperature sensors 16 and 26 that detect the temperatures of the ceramic heaters 12 and 22, stage temperature sensors 17 and 27 that detect the temperatures of the stages 14 and 24, and Control circuits 18 and 28 for controlling the ceramic heaters 12 and 22 and the heating units 15 and 25 are provided.
The heater temperature sensors 16 and 26 are examples of the “first temperature detector” in the claims. The stage temperature sensors 17 and 27 are examples of the “second temperature detection unit” in the claims. The control circuits 18 and 28 are examples of the “control unit” in the claims.

  The head parts 11 and 21, the ceramic heaters 12 and 22, the holders 13 and 23, and the stages 14 and 24 are each formed in a plate shape having a thickness of, for example, several millimeters. The head portions 11 and 21 and the ceramic heaters 12 and 22, the ceramic heaters 12 and 22 and the holders 13 and 23, and the holders 13 and 23 and the stages 14 and 24 are joined to each other. These joining modes are not particularly limited. For example, various joining modes such as joining using an adhesive, mechanical joining such as screw fastening, joining utilizing firing shrinkage, and the like can be taken.

  The dimensions of the upper heat tool 10 and the lower heat tool 20 in the horizontal direction in the figure, that is, the tool width is, for example, 0.1 mm to 1.0 mm. Moreover, the dimension of the upper heat tool 10 and the lower heat tool 20 in the front-rear direction (direction perpendicular to the paper surface) of the drawing, that is, the tool length is, for example, 25 mm to 35 mm. These dimensions are appropriately changed according to the sizes of the FPC 200 and the head intermediate body 100 that are thermocompression bonding objects.

As for the head part 11 of the upper heat tool 10, the lower surface which touches FPC200, ie, the head surface 11a, is formed flat. Similarly, the head portion 21 of the lower heat tool 20 has a flat upper surface in contact with the head intermediate body 100, that is, a head surface 21a. The head portions 11 and 21 are preferably made of a material having a thermal conductivity of 50 (W / m · K) or more. As a result, the head portions 11 and 21 can transfer heat from the ceramic heaters 12 and 22 to the head intermediate body 100 and the FPC 200 as compared with a case where the thermal conductivity is made of a material having a thermal conductivity of less than 50 (W / m · K). Can be efficiently transmitted to a thermosetting adhesive (not shown) sandwiched between the two.
As a material having a thermal conductivity of 50 (W / m · K) or more, for example, high thermal conductive ceramics or cemented carbide can be used. For example, aluminum nitride (AlN) or silicon carbide (SiC) can be suitably used as the high thermal conductive ceramic.

The ceramic heaters 12 and 22 include ceramic bases 12a and 22a and heating resistors 12b and 22b built in the ceramic bases 12a and 22a. Although the heat_generation | fever temperature of the ceramic heaters 12 and 22 is suitably changed according to the kind of thermosetting adhesive, it is 100-350 degreeC, for example.
The heating resistors 12b and 22b are examples of the “heating element” in the claims.

The ceramic bases 12a and 22a are preferably made of a material having a thermal conductivity of 50 (W / m · K) or more, like the head portions 11 and 21. Thereby, compared with the case where the ceramic bases 12a and 22a are comprised with the material whose heat conductivity is less than 50 (W / m * K), the heat | fever generate | occur | produced from the heating resistors 12b and 22b is the head part 11, 21 is transmitted efficiently. Therefore, the head portions 11 and 21 can be efficiently heated by the ceramic heaters 12 and 22.
As the heating resistors 12b and 22b, for example, a refractory metal such as tungsten (W) or molybdenum (Mo) can be used.

The holders 13 and 23 are preferably made of a material having a thermal conductivity of 35 (W / m · K) or less. As a result, the heat generated from the heating resistors 12b and 22b is transferred to the stage 14 and 24 side compared to the case where the holders 13 and 23 are made of a material having a thermal conductivity larger than 35 (W / m · K). Escape to is suppressed. That is, the holders 13 and 23 function as a heat insulating material. Therefore, the head portions 11 and 21 can be efficiently heated by the heating resistors 12b and 22b. As a material having a thermal conductivity of 35 (W / m · K) or less, for example, low thermal conductive ceramics and various alloys can be used. As the low thermal conductive ceramic, for example, silicon nitride (SiN), alumina (Al ₂ O ₃ ), zirconia (ZrO ₂ ), mullite (3Al ₂ O ₃ .2SiO ₂ ) can be suitably used.

The stages 14 and 24 are preferably made of a material having a thermal expansion coefficient of 15 × 10 ⁻⁶ (1 / K) or more. Thereby, the stages 14 and 24 expand | swell with a small heating amount compared with the case where it is comprised with the material whose thermal expansion coefficient is less than 15 * 10 < ^-6 > (1 / K). Therefore, when the stage 24 is heated so that the heating units 15 and 25 are equal to the expansion amount of the ceramic heater 22 (details will be described later), the heating units 15 and 25 heat the stages 14 and 24. It is possible to reduce the energy required for this, for example, electric energy. As a material of 15 × 10 ⁻⁶ (1 / K) or more, for example, stainless steel such as SUS303 and SUS304 can be preferably used.

  The stage 14 of the upper heat tool 10 is attached to the attachment portion of the elevating mechanism 30 so that it can be freely thermally expanded in the longitudinal direction of the stage 14. For example, the stage 14 is fixed to the mounting portion of the elevating mechanism 30 with a screw or the like at a substantially central portion in the longitudinal direction of the stage 14 so as to be freely thermally expandable on both sides thereof. Similarly, the stage 24 of the lower heat tool 20 is attached to the attachment portion of the support frame 40 so that it can be freely thermally expanded in the longitudinal direction of the stage 24.

  The heating units 15 and 25 are composed of various heaters, and heat the stages 14 and 24 by generating heat based on control by the control circuits 18 and 28. Note that the heating units 15 and 25 are not limited to being built in the stages 14 and 24, and may be provided outside the stages 14 and 24.

  As the heater temperature sensors 16 and 26 and the stage temperature sensors 17 and 27, for example, thermocouples can be used. The heater temperature sensors 16 and 26 detect the temperature of the ceramic heaters 12 and 22 and output the detected temperature, that is, the voltage value or current value corresponding to the temperature of the ceramic heaters 12 and 22 to the control circuits 18 and 28. . Similarly, the stage temperature sensors 17 and 27 detect the temperatures of the stages 14 and 24 and output the detected temperatures to the control circuits 18 and 28.

  The control circuits 18 and 28 control the heat generation of the ceramic heaters 12 and 22, and the temperature of the ceramic heaters 12 and 22 detected by the heater temperature sensors 16 and 26 and the stage temperature sensors 17 and 27, as will be described in detail later. Based on the detected temperatures of the stages 14 and 24, the power supply units 19 and 29 for energizing the heating units 15 and 25 are controlled.

  The elevating mechanism 30 is composed of, for example, a cylinder. By lowering the upper heat tool 10 by the lifting mechanism 30, the upper heat tool 10 and the lower heat tool 20 press the head intermediate body 100 and the FPC 200 in the vertical direction. Further, the upper heat tool 10 is raised by the elevating mechanism 30 so that the pressure applied by the upper heat tool 10 and the lower heat tool 20 is released.

  The thermocompression bonding apparatus 1 configured as described above first presses the head intermediate body 100 and the FPC 200 that overlap each other with the upper heat tool 10 and the lower heat tool 20 via the thermosetting adhesive. Thereby, the wiring 111 of the head intermediate body 100 and the conduction portion 204 of the FPC 200 come into contact with each other. In this state, the ceramic heaters 12 and 22 of the upper heat tool 10 and the lower heat tool 20 generate heat, and the thermosetting adhesive sandwiched between the head intermediate body 100 and the FPC 200 via the head parts 11 and 21. Heat. Thereby, the thermosetting resin is cured, and the head intermediate body 100 and the FPC 200 are joined.

  The heating method using the upper heat tool 10 and the lower heat tool 20 is not particularly limited. For example, a constant heat method in which the upper heat tool 10 and the lower heat tool 20 are always in a heat-generating state may be used. Among them, it is preferable to use a pulse heat method. That is, before the head intermediate body 100 and the FPC 200 are pressed by the upper heat tool 10 and the lower heat tool 20, the heating resistors 12b and 22b of the ceramic heaters 12 and 22 are brought into a non-heated state, and the upper and lower heat tools 10 and 10 are heated. In a state where the head intermediate body 100 and the FPC 200 are pressed by 20, it is preferable that the heating resistors 12b and 22b of the ceramic heaters 12 and 22 are temporarily heated. Thereby, it can suppress that a thermosetting adhesive hardens | cures before the wiring 111 of the head intermediate body 100 and the junction part of FPC200 contact.

  With reference to FIGS. 5 and 6, warpage suppression of the head portions 11 and 21 in the upper heat tool 10 and the lower heat tool 20 will be described. In the following, the lower heat tool 20 will be described, but the same applies to the upper heat tool 10.

In the lower heat tool 20 configured as described above, since the holder 23 has a heat insulating function, the ceramic heater 22 becomes hotter than the holder 23 when the ceramic heater 22 generates heat. For this reason, the expansion amount of the holder 23 is smaller than the expansion amount of the ceramic heater 22 when the ceramic heater 22 generates heat.
When the ceramic base 22a of the ceramic heater 22 is made of aluminum nitride ceramics and the holder 23 is made of silicon nitride ceramics, the thermal expansion coefficient is 2.4 to 4.0 × 10 ⁻ respectively. ⁶ (1 / K), 3.0 to 3.5 × 10 ⁻⁶ (1 / K), which are substantially equivalent.

  Therefore, if the lower heat tool 20 does not include the stage 24, the holder 23 and the ceramic heater 22 are caused by the bimetal effect of the holder 23 and the ceramic heater 22 provided on the upper surface thereof when the ceramic heater 22 generates heat. Warps upward in a convex shape. As a result, the head portion 21 provided on the upper surface of the ceramic heater 22 warps in a convex shape upward (see FIG. 5B). In this case, the head intermediate body 100 and the FPC 200 cannot be uniformly pressurized during heating by the ceramic heater 22, and therefore, the conductive portion between the wiring 111 of the head intermediate body 100 and the FPC 200 particularly at both ends in the longitudinal direction of the head section 21. There is a possibility that a conduction failure may occur with the terminal 204.

  On the other hand, in the lower heat tool 20 of this embodiment, the stage 24 can be expanded by providing the stage 24 on the lower surface of the holder 23 and heating the stage 24 by the heating unit 25. Therefore, it is suppressed that the holder 23 and the ceramic heater 22 warp upward due to the bimetal effect. Therefore, the warp of the head portion 21 during heating can be suppressed (see FIG. 6B).

  Further, the control circuit 28 controls the power supply unit 29 based on the temperature of the ceramic heater 22 detected by the heater temperature sensor 26 and the temperature of the stage 24 detected by the stage temperature sensor 27.

Specifically, for example, the ceramic base 22a of the ceramic heater 22 is made of aluminum nitride ceramics, and the stage 24 is made of SUS304, and the coefficient of thermal expansion is 3.0 × 10 ⁻⁶ ( 1 / K) and 17.5 × 10 ⁻⁶ (1 / K). In practice, the coefficient of thermal expansion varies depending on the temperature, but here, for convenience of explanation, it is assumed that the coefficient of thermal expansion is constant regardless of the temperature. The lengths of the ceramic heater 22 and the stage 24 are both 30 mm.

It is assumed that the temperature of the ceramic heater 22 detected by the heater temperature sensor 26 is 160 ° C. In this case, the control circuit 28 calculates the expansion amount (ΔL1) of the ceramic heater 22 based on, for example, 25 ° C. as follows.
ΔL1 = 30 × 10 ⁻³ × 3.0 × 10 ⁻⁶ × (160−25) = 12.15 × 10 ⁻⁶ (m)

Subsequently, the control circuit 28 calculates the target temperature (T2) of the stage 24 as follows so that the expansion amount (ΔL2) of the stage 24 becomes equal to the expansion amount (ΔL1) of the ceramic heater 22.
T2 = {ΔL1 / (30 × 10 ⁻³ × 17.5 × 10 ⁻⁶ )} + 25≈48

  The control circuit 28 compares the calculated target temperature of the stage 24 (T2: about 48 ° C.) with the temperature of the stage 24 detected by the stage temperature sensor 27 so that the temperature of the stage 24 approaches the target temperature. The power supply unit 29 is controlled to control the voltage and current supplied to the heating unit 25.

  Thus, in the lower heat tool 20 of this embodiment, the control circuit 28 is based on the temperature of the ceramic heater 22 detected by the heater temperature sensor 26 and the temperature of the stage 24 detected by the stage temperature sensor 27. By controlling the heating unit 25, the temperature of the stage 24 is controlled so that the expansion amount (ΔL2) of the stage 24 becomes equal to the expansion amount (ΔL1) of the ceramic heater 22 when the ceramic heater 22 generates heat. can do. For this reason, the curvature of the head part 21 at the time of a heating can be suppressed more effectively.

  As described above, according to the upper heat tool 10 and the lower heat tool 20 of this embodiment, it is possible to suppress warping of the head portions 11 and 21 during heating. For this reason, according to the thermocompression bonding apparatus 1 of the present embodiment, the head intermediate body 100 and the FPC 200 can be heated while the head intermediate body 100 and the FPC 200 are pressed uniformly. Therefore, it is possible to suppress the occurrence of a conduction failure between the wiring 111 of the head intermediate body 100 and the conduction portion 204 of the FPC 200.

  And since the curvature of the head parts 11 and 21 at the time of a heating can be suppressed, in order to ensure the flatness of the head surfaces 11a and 21a, it is not necessary to process the head surfaces 11a and 21a into a concave curved surface beforehand. In the present embodiment, as described above, it is preferable to perform the pulse heating method as the heating method. In this case, first, the head intermediate body 100 and the FPC 200 are pressed by the upper heat tool 10 and the lower heat tool 20 before heating. Even in this case, the head intermediate body 100 and the FPC 200 can be uniformly pressed by the head surfaces 11a and 21a formed flat.

  In the present embodiment, the case where the head intermediate body 100 and the FPC 200 are joined as an example of the thermocompression bonding object has been described as an example. However, the present invention is not limited thereto, and for example, a wiring board such as a display panel substrate. And FPC 200 can also be applied.

  1: thermocompression bonding apparatus, 10: upper heat tool, 11: head part, 11a: head surface, 12: ceramic heater, 12b: heating resistor, 13: holder, 14: stage, 15: heating part, 20: upper heat Tool: 21: Head part, 21a: Head surface, 22: Ceramic heater, 22b: Heating resistor, 23: Holder, 24: Stage, 25: Heating part, 100: Head intermediate, 200: FPC

Claims (7)

A head portion in contact with the thermocompression bonding object on the surface in the first direction;
A first thermal expansion portion that is provided on a surface on the second direction side opposite to the first direction of the head portion, includes a heating element, and expands due to heat generated by the heating element;
An intermediate portion that is provided on a surface of the first thermal expansion portion on the second direction side and has a smaller expansion amount than the first thermal expansion portion when the first thermal expansion portion generates heat;
A second thermal expansion portion that is provided on a surface of the intermediate portion on the second direction side and expands by heating;
A heating unit for heating the second thermal expansion unit;
A heat tool characterized by comprising A first temperature detection unit for detecting the temperature of the first thermal expansion unit;
A second temperature detection unit for detecting the temperature of the second thermal expansion unit;
A power supply for energizing the heating unit based on the temperature of the first thermal expansion unit detected by the first temperature detection unit and the temperature of the second thermal expansion unit detected by the second temperature detection unit A control unit for controlling the unit,
The heat tool according to claim 1, further comprising: 3. The heat tool according to claim 1, wherein the second thermal expansion portion has a thermal expansion coefficient of 15 × 10 ⁻⁶ (1 / K) or more. The first thermal expansion portion further includes a ceramic substrate,
The heat tool according to any one of claims 1 to 3, wherein the ceramic base has a thermal conductivity of 50 (W / m · K) or more.   5. The heat tool according to claim 1, wherein the intermediate portion has a thermal conductivity of 35 (W / m · K) or less. The heat tool according to any one of claims 1 to 5,
A tool drive unit for pressing the thermocompression bonding object to the heat tool;
A thermocompression bonding apparatus characterized by comprising:   Before the thermocompression bonding object is pressed by the heat tool, the heating element of the first thermal expansion portion is set to a non-heat generating state, and the thermocompression bonding object is pressed by the heat tool. The thermocompression bonding apparatus according to claim 6, wherein the heating element of the expansion portion is set in a heat generation state.

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