JP2015116667A - Laminate, method for manufacturing laminate, and method for processing substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent detection failure of a notch part of a laminate.SOLUTION: A substrate 10 and a support plate 20 are laminated on each other through an adhesive layer 30 so that at least a part of a first notch 11 and at least a part of a second notch 21 overlap with each other. A portion of the substrate 10 facing the second notch 21 of the support plate 20 is provided with an adhesive layer receiving part 12 that receives the adhesive layer 30 flowing toward the second notch 21 when the substrate 10 and the support plate 20 are laminated on each other.

Description

  The present invention relates to a laminate, a method for manufacturing a laminate, and a substrate processing method.

  In recent years, with the enhancement of functions of mobile phones, digital AV devices, IC cards, and the like, there is an increasing demand for miniaturization, thinning, and high integration of semiconductor silicon chips. For example, a system-in-package (SiP) in which multiple semiconductor chips are mounted in a single semiconductor package makes the mounted chips smaller, thinner and more integrated, and electronic devices have higher performance and smaller size. In addition, it has become a very important technology for realizing weight reduction. In order to meet such demands for thinning and high integration, not only conventional wire bonding technology, but also through electrode technology that stacks chips with through electrodes and forms bumps on the back of the chip I need it.

  By the way, in the manufacture of semiconductor chips, the semiconductor wafer itself is thin and fragile, and the circuit pattern is uneven, so that it is easily damaged when an external force is applied during conveyance to the grinding process or dicing process. Therefore, a wafer handling system has been developed that maintains the strength of the wafer and prevents the occurrence of cracks and warpage of the wafer by bonding a plate made of glass, hard plastic or the like called a support plate to the wafer to be ground. . Since the wafer strength can be maintained by the wafer handling system, the transport of the thinned semiconductor wafer can be automated.

  The wafer and the support plate are bonded together using an adhesive tape, a thermoplastic resin, an adhesive, or the like. After thinning the wafer to which the support plate is attached, the support plate is peeled from the substrate before dicing the wafer.

  For example, in Patent Document 1, a semiconductor substrate having a first notch and a support substrate having a second notch are bonded together so that the notches overlap each other, and then the support substrate is bonded. In addition, a method for manufacturing a semiconductor device is described in which the surface of the semiconductor substrate opposite to the surface facing the support substrate is processed.

  Patent Document 2 describes an edge trimming method for cutting an outer peripheral edge of a workpiece using a cutting device.

JP 2009-87970 A (published April 23, 2009) JP 2013-149822 A (released on August 1, 2013)

  When manufacturing a laminate in which at least a part of the first notch portion of the substrate and the second notch portion of the support overlap each other so that the substrate and the support are bonded via an adhesive layer The adhesive layer between the substrate and the support extends to the end of the outer peripheral portion between the substrate and the support.

  Thereby, an adhesive bond layer protrudes in the part which the 1st notch part and 2nd notch part of a laminated body mutually overlap. For this reason, for example, when the orientation of the laminated body is specified by the optical alignment apparatus, there is a possibility that a detection failure of the cutout portion of the laminated body may occur.

  Patent Document 1 does not disclose anything about a method for preventing a detection failure of a cutout portion of a laminate due to an adhesive layer protruding from a portion where the first cutout portion and the second cutout portion overlap each other.

  Patent Document 2 does not disclose any method for preventing the adhesive layer from protruding in a portion where the first cutout portion and the second cutout portion overlap each other.

  This invention is made | formed in view of such a situation, The objective is to provide the laminated body which can prevent the detection failure of a notch part.

  In order to solve the above problems, a laminate according to the present invention is obtained by laminating a substrate having a first notch and a support having a second notch via an adhesive layer. The substrate and the support are laminated via an adhesive layer so that at least a part of the first cutout part and at least a part of the second cutout part overlap each other. The adhesive layer that flows toward the second notch when the substrate and the support are stacked on a portion of the substrate facing the second notch of the support. The adhesive layer receiving part which receives is provided.

  According to the present invention, it is possible to prevent the detection failure of the notched portion of the laminate.

It is a figure explaining the outline of the layered product concerning one embodiment of the present invention, and the conventional layered product. It is a figure explaining the outline of the manufacturing method of the laminated body which concerns on one Embodiment of this invention, and the processing method of a board | substrate. It is a figure explaining the outline of the laminated body which concerns on the modification of this invention.

  A laminate according to the present invention is a laminate obtained by laminating a substrate having a first notch and a support having a second notch via an adhesive layer, and the substrate And the support are laminated via an adhesive layer so that at least a part of the first notch and at least a part of the second notch overlap each other, and the support on the substrate An adhesive layer receiving portion that receives the adhesive layer that flows toward the second notch when the substrate and the support are stacked is disposed at a portion facing the second notch of the body. It is characterized by being provided.

  According to the above configuration, when the substrate and the support are attached via the adhesive layer so that the first notch and the second notch overlap each other, the first notch and the second notch The adhesive layer that flows toward the adhesive layer can be received in the adhesive layer receiving portion. Thereby, it can prevent that an adhesive bond layer extends to a 2nd notch part. Therefore, in the subsequent process, it is possible to prevent the detection failure of the notch portion, and it is possible to accurately detect the orientation of the laminated body.

<Laminate>
The laminated body which concerns on one Embodiment of this invention is demonstrated in detail using FIG. (A)-(c) of FIG. 1 is a figure explaining the outline of the laminated body 50 which concerns on one Embodiment of this invention.

  As shown in FIGS. 1A and 1B, a stacked body 50 according to an embodiment of the present invention includes a substrate 10 having a first notch (first notch) 11 and a second notch (first notch). 2 is a laminated body 50 in which a support plate (support) 20 provided with two cut-out portions) 21 is laminated via an adhesive layer 30, and the substrate 10 and the support plate 20 At least a part of the notch 11 and at least a part of the second notch 21 are laminated via an adhesive layer 30 so as to overlap each other, and the second notch 21 of the support plate 20 in the substrate 10 An adhesive layer receiving portion 12 that receives the adhesive layer 30 that flows toward the second notch 21 when the substrate 10 and the support plate 20 are stacked is provided at the facing portion.

  As a result, the adhesive layer 30 that flows toward the second notch 21 when the substrate 10 and the support plate 20 are attached via the adhesive layer 30 so that the first notch 11 and the second notch 21 overlap each other. Can be received in the adhesive layer receiving portion 12. For this reason, it can prevent that the adhesive bond layer 30 extends to the 2nd notch 21 ((b) of FIG. 1). Therefore, it is possible to prevent a detection failure of the second notch 21 in the subsequent process, and to accurately detect the orientation of the stacked body 50 ((c) in FIG. 1).

[Substrate 10]
The substrate 10 is attached to the support plate 20 via the adhesive layer 30. As the substrate 10, for example, an arbitrary substrate such as a wafer substrate, a ceramic substrate, a thin film substrate, or a flexible substrate can be used.

  Further, the substrate 10 is formed with a first notch 11, an adhesive layer receiving portion 12, and an edge trimming portion 13 ((b) of FIG. 3).

  The first notch 11 is a notch formed in the outer peripheral portion of the substrate 10 and is used to specify the orientation of the substrate 10. Thereby, for example, the orientation of the substrate 10 can be specified using an optical alignment device (FIG. 1A and FIG. 3A).

  The edge trimming portion 13 is a step portion formed at an end portion of the outer peripheral portion of the substrate 10 excluding the first notch 11 and the adhesive layer receiving portion 12. By forming the edge trimming portion 13 on the substrate 10, it is possible to prevent the end portion of the circuit formed on the substrate 10 from being damaged in the subsequent process (FIG. 3B).

  The adhesive layer receiving portion 12 includes a stepped portion obtained by cutting out the peripheral portion of the first notch 11 in the direction from the outer periphery of the substrate 10 toward the center point of the substrate. Thus, when the substrate 10 and the support plate 20 are stacked via the adhesive layer 30, the adhesive layer 30 that flows from the center point of the substrate 10 toward the second notch 21 can be received in the stepped portion. ((B) in FIG. 1).

  Here, the step portion of the adhesive layer receiving portion 12 is 0.3 mm or more and 2.0 mm or less from the tip 11a of the first notch 11 in the direction from the outer periphery of the substrate 10 toward the center point of the substrate 10. It is preferable to be formed by cutting in that direction at a depth within the range of 0.5 mm, and to be formed by cutting in that direction at a depth within the range of 0.5 mm or more and 0.15 mm or less. Is more preferable. That is, the trim depth a in the direction from the outer periphery of the substrate 10 of the adhesive layer receiving portion 12 shown in FIG. 1B toward the center point of the substrate 10 is the notch depth c to the tip 11a of the first notch 11. More preferably, it is deep within a range of 0.3 mm or more and 2.0 mm or less. The trim depth a of the adhesive layer receiving portion 12 is cut out from the notch depth c of the first notch 11 at a depth within the range of 0.5 mm or more and 1.5 mm or less, whereby the adhesive layer The adhesive layer 30 in which the receiving portion 12 flows toward the second notch 21 of the support plate 20 can be suitably received.

  Further, the step portion of the adhesive layer receiving portion 12 has a peripheral edge of the first cutout portion within a range of 0.05 mm or more and 0.375 mm or less from the plane portion of the substrate 10 in the thickness direction of the substrate 10. It is preferable that the portion is formed by cutting out, and it is formed by cutting out the peripheral portion of the first cutout portion within a range of 0.1 mm or more and 0.25 mm or less from the plane portion of the substrate 10. More preferably. In other words, the trim height b in the thickness direction of the substrate 10 from the flat portion of the substrate 10 shown in FIG. 1B is preferably in the range of 0.05 mm or more and 0.375 mm or less. When the trim height b is in the range of 0.05 mm or more and 0.375 mm or less, the step portion of the adhesive layer receiving portion 12 can sufficiently receive the adhesive layer 30, and the support plate 20 It is possible to prevent the adhesive layer 30 from extending to the second notch. Further, by leaving the first notch 11 without cutting all of the first notch 11, the substrate 10 and the support plate 20 are connected to each other so that at least a part of the first notch 11 and at least a part of the second notch 21 are mutually connected. The stacked body 50 can be stacked so as to overlap.

  Thereby, in the laminated body 50, the adhesive layer 30 is received by the adhesive layer receiving portion 12 of the substrate 10 as shown in FIG. For this reason, it is possible to prevent the adhesive layer 30 from extending to the second notch 21 of the support plate 20. For this reason, if the substrate 10 of the laminated body 50 is thinned to the thinning line shown in FIG. 1B, when the light is irradiated to the second notch 21 by the optical alignment device, the second notch protrudes to the second notch. The light is not blocked by the adhesive layer 30 ((c) in FIG. 1). Therefore, it is possible to accurately detect the orientation of the stacked body 50 using the second notch 21 in a later process.

  On the other hand, the adhesive layer receiving portion is not formed on the substrate 10 of the conventional laminate 52 shown in FIGS. Here, the edge trimming portion 17 is formed in the laminated body 52, and the trim depth c of the edge trimming portion 17 of the substrate 15 is notch depth a up to the tip 16 a of the first notch 16 in the substrate 15. Shallower than. For this reason, when the first notch 16 of the substrate 15 and the second notch 21 of the support plate 20 are laminated via the adhesive layer 30, the adhesive layer 30 is only the tip 16a of the first notch 16 in the substrate 15. First, the support plate 20 extends beyond the tip 21a of the second notch 21 to the second notch 21 ((e) of FIG. 1). For this reason, even if the substrate 15 is thinned down to the thinning line, the adhesive layer extending beyond the tip 21a of the second notch 21 in the support plate 20 to the outer peripheral portion of the support plate 20 protrudes ((f in FIG. 1). )). Therefore, when the second notch 21 is irradiated with light by the optical alignment device, the adhesive layer 30 protruding to the second notch 21 blocks the light, thereby causing a detection failure in the direction of the stacked body 52 (see FIG. 1 (c)).

[Support plate 20]
The support plate 20 is a support member that supports the substrate 10 and only needs to have a strength necessary for preventing the substrate 10 from being damaged or deformed during processes such as thinning, conveyance, and mounting. . From the above viewpoint, a support plate, for example, one made of glass, silicon, or acrylic resin can be used.

  Further, the support plate 20 has a second notch 21 ((a) in FIG. 1 and (e) in FIG. 3).

  The second notch 21 is a notch formed in the outer peripheral portion of the support plate 20 and is used for specifying the orientation of the support plate 20. Thereby, for example, the orientation of the support plate 20 can be specified using an optical alignment device. In addition, the support plate 20 is stacked on the substrate 10 so that the second notch 21 and at least a part of the first notch 11 of the substrate 10 overlap each other, whereby the orientation of the substrate 10 in the stacked body 50 is changed by the optical alignment device. Can be identified.

[Adhesive layer 30]
The adhesive layer 30 is a layer formed by an adhesive used for attaching the substrate 10 and the support plate 20.

  As the adhesive, for example, various adhesives known in the art such as acrylic, novolak, naphthoquinone, hydrocarbon, polyimide, elastomer, etc. are used as the adhesive constituting the adhesive layer 30 according to the present invention. It can be used. Hereinafter, the composition of the resin contained in the adhesive layer 30 in the present embodiment will be described.

  The resin contained in the adhesive layer 30 is not particularly limited as long as it has adhesiveness, for example, a hydrocarbon resin, an acrylic-styrene resin, a maleimide resin, an elastomer resin, or a combination thereof. Can be mentioned.

  The glass transition temperature (Tg) of the adhesive varies depending on the type and molecular weight of the resin, and a compound such as a plasticizer for the adhesive. The type and molecular weight of the resin contained in the adhesive can be appropriately selected according to the type of the substrate and the support, but the Tg of the resin used for the adhesive is in the range of −60 ° C. or higher and 200 ° C. or lower. The inside is preferable, and the inside of the range of −25 ° C. or higher and 150 ° C. or lower is more preferable. When the Tg of the resin used for the adhesive is within a range of −60 ° C. or more and 200 ° C. or less, the adhesive force of the adhesive layer 30 can be suitably reduced without requiring excessive energy for cooling. . Moreover, you may adjust Tg of the adhesive bond layer 30 by mix | blending a plasticizer, resin of a low polymerization degree, etc. suitably.

  The glass transition temperature (Tg) can be measured using, for example, a known differential scanning calorimeter (DSC).

(Hydrocarbon resin)
The hydrocarbon resin is a resin that has a hydrocarbon skeleton and is obtained by polymerizing a monomer composition. As the hydrocarbon resin, cycloolefin polymer (hereinafter sometimes referred to as “resin (A)”), and at least one resin selected from the group consisting of terpene resin, rosin resin and petroleum resin (hereinafter referred to as “resin (A)”). Resin (B) ”), and the like, but is not limited thereto.

  The resin (A) may be a resin obtained by polymerizing a monomer component containing a cycloolefin monomer. Specific examples include a ring-opening (co) polymer of a monomer component containing a cycloolefin monomer, and a resin obtained by addition (co) polymerization of a monomer component containing a cycloolefin monomer.

  Examples of the cycloolefin monomer contained in the monomer component constituting the resin (A) include bicyclic compounds such as norbornene and norbornadiene, tricyclic compounds such as dicyclopentadiene and dihydroxypentadiene, tetracyclododecene, and the like. Tetracyclics, pentacyclics such as cyclopentadiene trimers, heptacyclics such as tetracyclopentadiene, or alkyl (methyl, ethyl, propyl, butyl, etc.) substitutions of these polycyclics, alkenyls (vinyl, etc.) Substitution, alkylidene (ethylidene, etc.) substitution, aryl (phenyl, tolyl, naphthyl, etc.) substitution, etc. are mentioned. Among these, norbornene-based monomers selected from the group consisting of norbornene, tetracyclododecene, and alkyl-substituted products thereof are particularly preferable.

  The monomer component constituting the resin (A) may contain another monomer copolymerizable with the above-described cycloolefin-based monomer, and preferably contains, for example, an alkene monomer. Examples of the alkene monomer include ethylene, propylene, 1-butene, isobutene, 1-hexene, α-olefin and the like. The alkene monomer may be linear or branched.

  Moreover, it is preferable from a viewpoint of high heat resistance (low thermal decomposition and thermal weight reduction property) to contain a cycloolefin monomer as a monomer component which comprises resin (A). The ratio of the cycloolefin monomer to the whole monomer component constituting the resin (A) is preferably 5 mol% or more, more preferably 10 mol% or more, and further preferably 20 mol% or more. preferable. Further, the ratio of the cycloolefin monomer to the whole monomer component constituting the resin (A) is not particularly limited, but is preferably 80 mol% or less from the viewpoint of solubility and stability over time in a solution, More preferably, it is 70 mol% or less.

  Moreover, you may contain a linear or branched alkene monomer as a monomer component which comprises resin (A). The ratio of the alkene monomer to the whole monomer component constituting the resin (A) is preferably 10 to 90 mol%, more preferably 20 to 85 mol% from the viewpoint of solubility and flexibility. 30 to 80 mol% is more preferable.

  The resin (A) is a resin having no polar group, such as a resin obtained by polymerizing a monomer component composed of a cycloolefin monomer and an alkene monomer, at high temperatures. It is preferable for suppressing generation of gas.

  The polymerization method and polymerization conditions for polymerizing the monomer components are not particularly limited, and may be set as appropriate according to conventional methods.

  Examples of commercially available products that can be used as the resin (A) include “TOPAS” manufactured by Polyplastics Co., Ltd., “APEL” manufactured by Mitsui Chemicals, Inc., “ZEONOR” and “ZEONEX” manufactured by Zeon Corporation. And “ARTON” manufactured by JSR Corporation.

  The glass transition temperature (Tg) of the resin (A) is preferably 60 ° C. or higher, and particularly preferably 70 ° C. or higher. When the glass transition temperature of the resin (A) is 60 ° C. or higher, softening of the adhesive layer 30 can be further suppressed when the laminate is exposed to a high temperature environment.

  The resin (B) is at least one resin selected from the group consisting of terpene resins, rosin resins and petroleum resins. Specifically, examples of the terpene resin include terpene resins, terpene phenol resins, modified terpene resins, hydrogenated terpene resins, hydrogenated terpene phenol resins, and the like. Examples of the rosin resin include rosin, rosin ester, hydrogenated rosin, hydrogenated rosin ester, polymerized rosin, polymerized rosin ester, and modified rosin. Examples of petroleum resins include aliphatic or aromatic petroleum resins, hydrogenated petroleum resins, modified petroleum resins, alicyclic petroleum resins, coumarone-indene petroleum resins, and the like. Among these, hydrogenated terpene resins and hydrogenated petroleum resins are more preferable.

  Although the softening point of resin (B) is not specifically limited, It is preferable that it is 80-160 degreeC. When the softening point of the resin (B) is 80 ° C. or higher, the laminate can be suppressed from being softened when exposed to a high temperature environment, and adhesion failure does not occur. On the other hand, when the softening point of the resin (B) is 160 ° C. or less, the peeling rate when peeling the laminate is good.

  Although the weight average molecular weight of resin (B) is not specifically limited, It is preferable that it is 300-3,000. When the weight average molecular weight of the resin (B) is 300 or more, the heat resistance is sufficient, and the degassing amount is reduced under a high temperature environment. On the other hand, when the weight average molecular weight of the resin (B) is 3,000 or less, the peeling rate when peeling the laminate is good. In addition, the weight average molecular weight of resin (B) in this embodiment means the molecular weight of polystyrene conversion measured by gel permeation chromatography (GPC).

  In addition, you may use what mixed resin (A) and resin (B) as resin. By mixing, heat resistance and peeling speed are improved. For example, as a mixing ratio of the resin (A) and the resin (B), (A) :( B) = 80: 20 to 5545 (mass ratio) is a peeling rate, heat resistance in a high temperature environment, And is excellent in flexibility.

(Acrylic-styrene resin)
Examples of the acrylic-styrene resin include a resin obtained by polymerization using styrene or a styrene derivative and (meth) acrylic acid ester as monomers.

  Examples of the (meth) acrylic acid ester include a (meth) acrylic acid alkyl ester having a chain structure, a (meth) acrylic acid ester having an aliphatic ring, and a (meth) acrylic acid ester having an aromatic ring. . Examples of the (meth) acrylic acid alkyl ester having a chain structure include an acrylic long-chain alkyl ester having an alkyl group having 15 to 20 carbon atoms and an acrylic alkyl ester having an alkyl group having 1 to 14 carbon atoms. . As acrylic long-chain alkyl esters, acrylic or methacrylic acid whose alkyl group is n-pentadecyl group, n-hexadecyl group, n-heptadecyl group, n-octadecyl group, n-nonadecyl group, n-eicosyl group, etc. Examples include alkyl esters. The alkyl group may be branched.

  Examples of the acrylic alkyl ester having an alkyl group having 1 to 14 carbon atoms include known acrylic alkyl esters used in existing acrylic adhesives. For example, an alkyl group of acrylic acid or methacrylic acid in which the alkyl group is a methyl group, ethyl group, propyl group, butyl group, 2-ethylhexyl group, isooctyl group, isononyl group, isodecyl group, dodecyl group, lauryl group, tridecyl group, etc. Examples include esters.

  Examples of (meth) acrylic acid ester having an aliphatic ring include cyclohexyl (meth) acrylate, cyclopentyl (meth) acrylate, 1-adamantyl (meth) acrylate, norbornyl (meth) acrylate, isobornyl (meth) acrylate, and tricyclodecanyl. (Meth) acrylate, tetracyclododecanyl (meth) acrylate, dicyclopentanyl (meth) acrylate and the like can be mentioned, and isobornyl methacrylate and dicyclopentanyl (meth) acrylate are more preferable.

  The (meth) acrylic acid ester having an aromatic ring is not particularly limited. Examples of the aromatic ring include a phenyl group, a benzyl group, a tolyl group, a xylyl group, a biphenyl group, a naphthyl group, and an anthracenyl group. A phenoxymethyl group, a phenoxyethyl group, and the like. The aromatic ring may have a chain or branched alkyl group having 1 to 5 carbon atoms. Specifically, phenoxyethyl acrylate is preferable.

(Maleimide resin)
Examples of maleimide resins include N-methylmaleimide, N-ethylmaleimide, Nn-propylmaleimide, N-isopropylmaleimide, Nn-butylmaleimide, N-isobutylmaleimide, N-sec as monomers. -Butylmaleimide, N-tert-butylmaleimide, Nn-pentylmaleimide, Nn-hexylmaleimide, Nn-heptylmaleimide, Nn-octylmaleimide, N-laurylmaleimide, N-stearylmaleimide, etc. Male having an aliphatic hydrocarbon group such as maleimide having an alkyl group, N-cyclopropylmaleimide, N-cyclobutylmaleimide, N-cyclopentylmaleimide, N-cyclohexylmaleimide, N-cycloheptylmaleimide, N-cyclooctylmaleimide A resin obtained by polymerizing an aromatic maleimide having an aryl group such as N, N-phenylmaleimide, Nm-methylphenylmaleimide, N-o-methylphenylmaleimide, and Np-methylphenylmaleimide. It is done.

  For example, a cycloolefin copolymer that is a copolymer of a repeating unit represented by the following chemical formula (1) and a repeating unit represented by the following chemical formula (2) can be used as the resin of the adhesive component.

(In chemical formula (2), n is 0 or an integer of 1 to 3)
As such cycloolefin copolymer, APL 8008T, APL 8009T, APL 6013T (all manufactured by Mitsui Chemicals, Inc.) and the like can be used.

(Elastomer)
The elastomer preferably contains a styrene unit as a constituent unit of the main chain, and the “styrene unit” may have a substituent. Examples of the substituent include an alkyl group having 1 to 5 carbon atoms, an alkoxy group having 1 to 5 carbon atoms, an alkoxyalkyl group having 1 to 5 carbon atoms, an acetoxy group, and a carboxyl group. Further, the content of the styrene unit is more preferably in the range of 14 wt% or more and 50 wt% or less. Furthermore, the elastomer preferably has a weight average molecular weight in the range of 10,000 to 200,000.

  If the content of the styrene unit is in the range of 14% by weight or more and 50% by weight or less, and the weight average molecular weight of the elastomer is in the range of 10,000 or more and 200,000 or less, the hydrocarbon solvent described later Therefore, the adhesive layer can be removed more easily and quickly. Further, since the content of the styrene unit and the weight average molecular weight are within the above ranges, a resist solvent (eg, PGMEA, PGME, etc.), acid (hydrogen fluoride) exposed when the wafer is subjected to a resist lithography process. Acid, etc.) and alkali (TMAH etc.).

  In addition, you may further mix the (meth) acrylic acid ester mentioned above with the elastomer.

  Further, the content of styrene units is more preferably 17% by weight or more, and more preferably 40% by weight or less.

  A more preferable range of the weight average molecular weight is 20,000 or more, and a more preferable range is 150,000 or less.

  As the elastomer, various elastomers can be used as long as the content of styrene units is in the range of 14% by weight to 50% by weight and the weight average molecular weight of the elastomer is in the range of 10,000 to 200,000. Can be used. For example, polystyrene-poly (ethylene / propylene) block copolymer (SEP), styrene-isoprene-styrene block copolymer (SIS), styrene-butadiene-styrene block copolymer (SBS), styrene-butadiene-butylene-styrene block copolymer (SBBS). And hydrogenated products thereof, styrene-ethylene-butylene-styrene block copolymer (SEBS), styrene-ethylene-propylene-styrene block copolymer (styrene-isoprene-styrene block copolymer) (SEPS), styrene-ethylene-ethylene- Propylene-styrene block copolymer (SEEPS), styrene-ethylene-ethylene-propylene-styrene block copolypropylene in which styrene block is reactively crosslinked -(Septon V9461 (manufactured by Kuraray Co., Ltd.), Septon V9475 (manufactured by Kuraray Co., Ltd.)), Septon V9827 (Co., Ltd., which has a reactive polystyrene-based hard block) Kuraray)), polystyrene-poly (ethylene-ethylene / propylene) block-polystyrene block copolymer (SEEPS-OH: terminal hydroxyl group modification), and the like. What has content and weight average molecular weight of the styrene unit of an elastomer in the above-mentioned range can be used.

  Of the elastomers, hydrogenated products are more preferable. If it is a hydrogenated product, the stability to heat is improved, and degradation such as decomposition and polymerization hardly occurs. Moreover, it is more preferable from the viewpoint of solubility in hydrocarbon solvents and resistance to resist solvents.

  Further, among elastomers, those having both ends of a styrene block polymer are more preferable. This is because styrene having high thermal stability is blocked at both ends, thereby exhibiting higher heat resistance.

  More specifically, the elastomer is more preferably a hydrogenated product of a block copolymer of styrene and conjugated diene. Stability against heat is improved, and degradation such as decomposition and polymerization hardly occurs. Moreover, higher heat resistance is exhibited by blocking styrene having high thermal stability at both ends. Furthermore, it is more preferable from the viewpoint of solubility in hydrocarbon solvents and resistance to resist solvents.

  Examples of commercially available products that can be used as an elastomer included in the adhesive that constitutes the adhesive layer 30 include “Kepte's“ Septon ”(trade name),“ Kuraray ”“ Hibler ”(trade name), Asahi Kasei Corporation Examples include “Tuftec (trade name)” manufactured by the company, “Dynalon (trade name)” manufactured by JSR Corporation, and the like.

  The content of the elastomer contained in the adhesive constituting the adhesive layer 30 is preferably within the range of 50 parts by weight or more and 99 parts by weight or less, with the total amount of the adhesive composition being 100 parts by weight, for example, 60 parts by weight. As described above, the range of 99 parts by weight or less is more preferable, and the range of 70 parts by weight or more and 95 parts by weight or less is most preferable. By setting it within these ranges, the wafer and the support can be suitably bonded together while maintaining the heat resistance.

  A plurality of types of elastomers may be mixed. That is, the adhesive constituting the adhesive layer 30 may include a plurality of types of elastomers. It is sufficient that at least one of the plurality of types of elastomers includes a styrene unit as a constituent unit of the main chain. Further, at least one of the plurality of types of elastomers has a styrene unit content in the range of 14 wt% or more and 50 wt% or less, or a weight average molecular weight of 10,000 or more and 200,000 or less. If it is within the range, it is within the scope of the present invention. Moreover, when the adhesive agent which comprises the adhesive bond layer 30 contains several types of elastomer, you may adjust so that content of a styrene unit may become in said range as a result of mixing. For example, Septon 4033 of Septon (trade name) manufactured by Kuraray Co., Ltd. having a styrene unit content of 30% by weight and Septon 2063 of Septon (trade name) having a styrene unit content of 13% by weight is 1 weight ratio. When mixed in a one-to-one relationship, the styrene content with respect to the total elastomer contained in the adhesive is 21 to 22% by weight, and therefore 14% by weight or more. For example, when a styrene unit of 10% by weight and 60% by weight are mixed at a weight ratio of 1: 1, it becomes 35% by weight and falls within the above range. The present invention may be in such a form. Moreover, it is most preferable that the plurality of types of elastomers included in the adhesive constituting the adhesive layer 30 all contain styrene units within the above range and have a weight average molecular weight within the above range.

  Note that the adhesive layer 30 is preferably formed using a resin other than a photocurable resin (for example, a UV curable resin). By using a resin other than the photocurable resin, it is possible to prevent a residue from remaining around the minute unevenness of the supported substrate after the adhesive layer 30 is peeled or removed. In particular, the adhesive constituting the adhesive layer 30 is preferably not soluble in any solvent but soluble in a specific solvent. This is because the adhesive layer 30 can be removed by dissolving in a solvent without applying physical force to the substrate 10. When removing the adhesive layer 30, the adhesive layer 30 can be easily removed without damaging or deforming the substrate 10 even from the substrate 10 having a reduced strength.

(Diluted solvent)
As a diluent solvent used when forming the adhesive layer 30, for example, hexane, heptane, octane, nonane, methyloctane, decane, undecane, dodecane, tridecane, etc., linear hydrocarbon, carbon number 4 to 15 Branched hydrocarbons such as cyclohexane, cycloheptane, cyclooctane, naphthalene, decahydronaphthalene, tetrahydronaphthalene and other cyclic hydrocarbons, p-menthane, o-menthane, m-menthane, diphenylmenthane, 1,4- Terpin, 1,8-terpine, bornin, norbornane, pinan, tsujang, karan, longifolene, geraniol, nerol, linalool, citral, citronellol, menthol, isomenthol, neomenthol, α-terpineol, β-terpineol, γ-terpineo Terpinen-1-ol, terpinen-4-ol, dihydroterpinyl acetate, 1,4-cineole, 1,8-cineole, borneol, carvone, yonon, tuyon, camphor, d-limonene, l-limonene, Terpene solvents such as dipentene; lactones such as γ-butyrolactone; ketones such as acetone, methyl ethyl ketone, cyclohexanone (CH), methyl-n-pentyl ketone, methyl isopentyl ketone, 2-heptanone; ethylene glycol, diethylene glycol, propylene Polyhydric alcohols such as glycol and dipropylene glycol; S such as ethylene glycol monoacetate, diethylene glycol monoacetate, propylene glycol monoacetate or dipropylene glycol monoacetate A compound having a ter bond, a compound having an ether bond such as a monoalkyl ether such as monomethyl ether, monoethyl ether, monopropyl ether, monobutyl ether or monophenyl ether of the polyhydric alcohol or the compound having an ester bond, etc. Derivatives of polyhydric alcohols (in these, propylene glycol monomethyl ether acetate (PGMEA) and propylene glycol monomethyl ether (PGME) are preferred); cyclic ethers such as dioxane, methyl lactate, ethyl lactate (EL) , Esters such as methyl acetate, ethyl acetate, butyl acetate, methoxybutyl acetate, methyl pyruvate, ethyl pyruvate, methyl methoxypropionate, ethyl ethoxypropionate; anisole, ethyl Nji ether, cresyl methyl ether, diphenyl ether, dibenzyl ether, and phenetole, the aromatic organic solvent such as butyl phenyl ether.

(Other ingredients)
The adhesive constituting the adhesive layer 30 may further contain other miscible materials as long as the essential characteristics are not impaired. For example, various conventional additives such as additional resins, plasticizers, adhesion aids, stabilizers, colorants, thermal polymerization inhibitors and surfactants for improving the performance of the adhesive may be further used. it can.

[Modification]
The laminate according to the present embodiment is not limited to the above embodiment. For example, as a modification, the stacked body 51 includes the substrate 10 and the above-described substrate in such a manner that the first notch (first notch) 11 ′ is located closer to the center point of the substrate 10 ′ than the second notch 21. The support plate 20 is laminated, and the adhesive layer receiving portion can be configured to be positioned outside the second notch 21 as viewed from the center point of the substrate 10 ′ with respect to the first notch 11 ′. ((A) and (b) of FIG. 2).

  In the case of the above configuration, the adhesive layer receiving portion is formed at a portion of the substrate 10 ′ facing the second notch 21 of the support plate 20, that is, the notched surface of the first notch 11 ′ of the substrate 10 ′. The

  Here, the tip 11 ′ a of the first notch 11 ′ of the substrate 10 ′ is located closer to the center point of the substrate 10 ′ than the tip 21 a of the second notch 21 in the support plate 20. Even if the trim depth a in the substrate 10 ′ is shallow, the notch depth c is deeper than the tip 21 a of the second notch 21 of the support plate 20. Thus, when the substrate 10 ′ and the support plate 20 are laminated via the adhesive layer 30, the adhesive layer 30 is moved to the second notch 21 before the adhesive layer 30 extends to the second notch 21. Can accept. For this reason, it can prevent that the adhesive bond layer 30 extends to the 2nd notch 21 ((b) of FIG. 2).

  Thereafter, if the substrate 10 ′ of the multilayer body 51 is thinned, the light is blocked by the adhesive layer 30 protruding to the second notch when the second alignment notch 21 is irradiated with light by the optical alignment device. No ((c) in FIG. 2). Therefore, the orientation of the stacked body 50 can be detected using the second notch 21.

  Further, as an example, a layer other than the adhesive layer may be further formed between the substrate and the support plate in the laminated body as long as the attachment is not hindered. For example, a separation layer that is altered by irradiation with light may be formed between the support plate and the adhesive layer. Since the separation layer is formed, the substrate and the support plate can be easily separated by irradiating light after processes such as thinning, transporting, and mounting of the substrate.

<Manufacturing method of laminated board>
Next, the manufacturing method of the laminated body 50 which concerns on one Embodiment of this invention using FIG. 3 is demonstrated in detail. FIG. 3 is a diagram for explaining the outline of the manufacturing method of the laminate 50 and the substrate processing method according to this embodiment.

  As shown to (a)-(f) of FIG. 3, the manufacturing method of the laminated body 50 which concerns on this embodiment is a board | substrate which forms the adhesive bond layer receiving part 12 with which the laminated body 50 which concerns on this invention is equipped with the board | substrate 10. FIG. Processing step (FIGS. 1A and 1B) and an adhesive layer forming step (FIG. 3) for forming the adhesive layer 30 on the surface of the substrate 10 on which the adhesive layer receiving portion 12 is formed. (C)), an adhesive layer outer peripheral portion removing step (FIG. 3 (d)) for removing the outer peripheral portion of the adhesive layer 30 formed on the substrate 10, and the first notch (notch). Part) 11 and the support plate (support) 20 through the adhesive layer 30 such that at least part of the second part 11 and at least part of the second notch 21 are overlapped with each other. And a laminating step ((f) in FIG. 1) for laminating.

[Substrate processing process]
As shown in FIGS. 3A and 3B, in the substrate processing step, the adhesive layer receiving portion 12 included in the laminate 50 according to the present invention is formed on the substrate 10. Here, in the substrate processing step, the adhesive layer receiving portion 12 is formed by cutting out the peripheral portion of the first notch 11 of the substrate 10.

  The adhesive layer receiving part 12 has a trim depth a of 0.3 mm or more and 2.0 mm or less from the tip 11a of the first notch 11 shown in FIG. It is preferable to form the substrate by cutting out the substrate so as to obtain a depth within the range. Further, the substrate 10 may be formed by cutting out the substrate 10 so that the trim height b is in the range of 0.05 mm or more and 0.375 mm or less in the thickness direction of the substrate 10 from the planar portion of the substrate 10.

  In order to cut out the peripheral portion of the first notch 11 of the substrate 10, for example, a known cutting device used for dicing can be used. Further, the position of the blade of the cutting device is adjusted so as to cut from the flat portion of the substrate 10 to a predetermined trim height b, and the first notch 11 is cut so as to cut the peripheral portion of the first notch 11 in the substrate 10. Then, the adhesive layer receiving portion 12 may be cut to a predetermined trim depth a by moving it toward the center point of the substrate 10.

  In the substrate processing step, as an example, the substrate 10 may be processed so that the first notch 11 ′ of the substrate 10 is larger than the second notch 21 of the support plate. Thus, the first notch 11 ′ of the substrate 10 ′ can be positioned closer to the center point of the substrate 10 than the second notch 21. Thereby, the substrate 10 ′ used for the stacked body 51 which is a modified example of the present embodiment can be formed.

[Adhesive layer forming step]
Next, as shown in FIG. 3C, in the adhesive layer forming step, the adhesive layer 30 is formed on the surface of the substrate 10 on the side where the adhesive layer receiving portion 12 is formed.

  In the adhesive layer forming step, the adhesive layer 30 can be formed by a method such as spin coating, dipping, roller blade, spray coating, slit coating, or the like. The adhesive layer 30 is formed by, for example, attaching a film (so-called double-sided tape) in which the adhesive is applied on both sides in advance to the substrate 10 instead of directly applying the adhesive to the substrate 10. May be.

  Here, the thickness of the adhesive layer 30 may be set as appropriate according to the types of the substrate 10 and the support plate 20 to be attached, the processing applied to the substrate 10 after being attached, and the like. Here, the thickness of the adhesive layer 30 is preferably in the range of 10 μm or more and 150 μm or less, and more preferably in the range of 15 μm or more and 100 μm or less. If the thickness of the adhesive layer 30 is in the range of 10 μm or more and 150 μm or less, the substrate 10 and the support plate 20 can be attached without forming a gap between the substrate 10 and the support plate 20. . Further, it is possible to prevent an excessive adhesive layer from flowing into the adhesive layer receiving portion 12 of the substrate 10.

[Adhesive layer outer peripheral part removal step]
Next, as shown in FIG. 3D, in the adhesive layer outer peripheral portion removing step, the outer peripheral portion of the adhesive layer 30 formed on the substrate 10 is removed. Thereby, when the board | substrate 10 and the support plate 20 are bonded together in the subsequent lamination process, it can suppress suitably that the adhesive bond layer 30 protrudes from the laminated body 50. FIG. In addition, the adhesive layer 30 applied up to the first notch 11 can be suitably removed.

  In one example, when the film thickness of the adhesive layer 30 is 50 μm, for example, the width of the adhesive layer 30 is 2 mm or less, preferably 0.5 mm or more and 0.8 mm or less from the edge of the outer peripheral portion of the substrate. It is preferable to remove the outer peripheral portion on the substrate 10. Thereby, it can suppress suitably that the adhesive bond layer 30 protrudes from the laminated body 50 in a lamination process.

  A method for removing the adhesive layer 30 formed on the outer peripheral portion on the substrate 10 may be a known method, and is not particularly limited. For example, a solution is sprayed on the outer peripheral portion of the adhesive layer 30. Alternatively, the solution may be supplied using a dispensing nozzle. Further, spraying, supplying, etc. of the solution may be performed while rotating the substrate 10.

  The solution for the adhesive layer 30 may be appropriately selected according to the type of the adhesive, and is not particularly limited. For example, the solvent used as the dilution solvent described above can be used. And cyclic hydrocarbons (terpenes) such as branched hydrocarbons having 4 to 15 carbon atoms, monoterpenes and diterpenes can be preferably used.

[Lamination process]
Next, as shown in FIG. 3F, in the stacking step, the substrate 10 and the support plate are arranged so that at least a part of the first notch 11 and at least a part of the second notch 21 overlap each other. 20 are laminated through the adhesive layer 30 ((f) of FIG. 3). Thereby, the laminated body 50 is laminated | stacked so that the adhesive bond layer receiving part 12 may be provided in the site | part facing the 2nd notch 21 of the support plate 20 in the board | substrate 10. FIG. Here, in the stage before lamination, the first notch 11 provided in the substrate 10 remains without being thinned. For this reason, the first notch 11 can be optically detected by an optical alignment device provided in the sticking device. Therefore, the substrate 10 and the support plate 20 can be attached without causing a detection failure between the first notch 11 and the second notch 21.

  Further, when the substrate 10 and the support plate 20 are pasted through the adhesive layer 30 so that the first notch 11 and the second notch 21 overlap each other, the substrate 10 and the support plate 20 flow toward the first notch 11 and the second notch 21. The adhesive layer 30 to be received can be received in the adhesive layer receiving portion 12. Thereby, it is possible to prevent the adhesive layer 30 from extending to the second notch 21. Accordingly, it is possible to prevent a detection failure of the second notch 21 in a later process. Therefore, the orientation of the stacked body 50 can be detected accurately.

<Substrate processing method>
A substrate processing method according to an embodiment of the present invention will be described in more detail with reference to FIG. In the processing method of the substrate 10 according to the present embodiment, after the laminate manufacturing process ((a) to (f) in FIG. 3) for manufacturing the laminate 50 according to the present invention and the laminate manufacturing process, the substrate And a thinning step ((g) in FIG. 3) of thinning by grinding.

[Thinning process]
As shown in FIG. 3G, in the thinning process, the substrate 10 of the stacked body 50 is ground to a desired thickness by a grinding device such as a grinder. Here, in the thinning step, for example, the substrate 10 in the stacked body 50 is ground to the thinning line shown in FIG. For this reason, the 2nd notch 21 of the support plate 20 can prevent blocking | interrupting the light irradiated with an optical alignment apparatus ((c) of FIG. 1). The thinning step is a step for thinning the substrate 10 and can be performed without specifying the orientation of the stacked body 50. Therefore, even if the adhesive layer 30 protrudes to the first notch 11, the substrate 10 is thinned by the thinning process, so that the second notch 21 can be detected in the subsequent process. For this reason, the direction of the laminated body 50 can be detected accurately.

[Other processes]
After the thinning process, a circuit is formed on the substrate 10 by performing various processes such as a photolithography process. For this reason, the laminated body 50 is conveyed to another apparatus in order to perform various processes. Here, since the adhesive layer 30 does not extend to the second notch 21 in the stacked body 50, the orientation of the stacked body 50 can be accurately specified by the second notch 21. Therefore, in various processes, a circuit can be formed on the surface of the substrate 10 in the stacked body 50 in an appropriate direction.

  The present invention is not limited to the above-described embodiments, and various modifications are possible within the scope shown in the claims, and embodiments obtained by appropriately combining technical means disclosed in different embodiments. Is also included in the technical scope of the present invention.

  The present invention can be widely used, for example, in a manufacturing process of a miniaturized semiconductor device.

10 substrate 10 'substrate 11 first notch (first notch)
11 '1st notch (1st notch part)
12 Adhesive Layer Receptor 20 Support Plate (Support)
21 Second notch (second notch)
30 Adhesive layer 50 Laminated body 51 Laminated body

Claims (7)

A laminate comprising a substrate having a first notch and a support having a second notch stacked via an adhesive layer,
The substrate and the support are laminated via an adhesive layer so that at least a part of the first notch and at least a part of the second notch overlap each other,
Adhesion for receiving the adhesive layer that flows toward the second notch when the substrate and the support are stacked on a portion of the substrate facing the second notch of the support. A laminate comprising an agent layer receiving portion.   2. The laminate according to claim 1, wherein the adhesive layer receiving portion includes a stepped portion obtained by cutting out a peripheral portion of the first cutout portion in a direction from the outer periphery of the substrate toward the center point of the substrate. body.   The step portion is cut out in the direction at a depth within a range of 0.3 mm or more and 2.0 mm or less from the tip of the first cutout portion in a direction from the outer periphery of the substrate toward the center point of the substrate. The laminate according to claim 2, wherein the laminate is formed.   The step portion is formed by cutting out a peripheral portion of the first notch portion within a range of 0.05 mm or more and 0.375 mm or less from a planar portion of the substrate in the thickness direction of the substrate. The laminate according to claim 2 or 3, wherein   The substrate and the support are laminated so that the first cutout portion is positioned closer to the center point side of the substrate than the second cutout portion, and the adhesive layer receiving portion is formed of the second cutout portion. The laminate according to claim 1, wherein the laminated body is located outside the first cutout portion as viewed from the center point of the substrate. On the substrate, a substrate processing step for forming an adhesive layer receiving portion provided in the laminate according to any one of claims 1 to 4,
An adhesive layer forming step of forming the adhesive layer on the surface of the substrate on which the adhesive layer receiving portion is formed;
An adhesive layer outer peripheral portion removing step of removing the outer peripheral portion of the adhesive layer formed on the substrate;
A laminating step of laminating the substrate and the support via an adhesive layer so that at least a part of the first notch and at least a part of the second notch overlap each other. A method for producing a laminate, characterized by comprising: A laminate manufacturing process for manufacturing a laminate by the laminate manufacturing method according to claim 6;
And a thinning step of thinning the substrate by grinding after the laminate manufacturing step.