JP2015107451A - Electrospray device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electrospray device which enables a substrate and an earth plate to be easily separated from each other.SOLUTION: An electrospray device 100 deposits a solution material sprayed from a nozzle 1 on a substrate 200 as a thin film and includes an earth plate 2 which contacts with the substrate 200 to ground the substrate 200 during formation of the thin film. Multiple protruding parts 2b are provided on a surface 2a of the earth plate 2 with which the substrate 200 contacts.

Description

  The present invention relates to an electrospray apparatus, and more particularly to an electrospray apparatus that deposits a solution material sprayed from a nozzle as a thin film on a substrate.

  Conventionally, an electrospray apparatus that deposits a solution material sprayed from a nozzle as a thin film on a substrate is known (see, for example, Patent Document 1).

  Patent Document 1 discloses an electrospray apparatus including a flat substrate mounting portion on which a substrate is mounted and a nozzle that sprays a solution material in a state where a voltage is applied to the substrate. This electrospray apparatus is configured such that a voltage is applied to a substrate placed on the substrate placing portion. Then, the solution material flies from the nozzle to the substrate by the electric field generated between the substrate and the nozzle, so that the solution material is deposited on the substrate as a thin film. Note that the surface of the flat substrate mounting portion is formed into a flat surface.

JP 2012-135704 A

  However, in the conventional electrospray apparatus as described in Patent Document 1, charges may be accumulated on the substrate even after the thin film is formed, and the substrate and the substrate mounting portion having a flat surface. Due to the electrostatic force between the substrate and the substrate, the substrate is attracted to the substrate mounting portion (state of the electrostatic chuck). In this case, there is a problem that it may be difficult to separate the substrate and the substrate mounting portion (earth plate).

  The present invention has been made to solve the above-described problems, and one object of the present invention is to provide an electrospray apparatus capable of easily separating a substrate and a ground plate. .

  In order to achieve the above object, an electrospray apparatus according to a first aspect of the present invention is an electrospray apparatus that deposits a solution material sprayed from a nozzle as a thin film on a substrate, and contacts the substrate when the thin film is formed. An earth plate for grounding the substrate is provided, and a plurality of convex portions are provided on the surface of the earth plate that contacts the substrate.

  In the electrospray apparatus according to the first aspect, as described above, the surface on which the substrate of the ground plate contacts is flat by providing a plurality of convex portions on the surface of the ground plate on which the substrate contacts. Unlike the case, since the contact area between the ground plate and the substrate (plural protrusions) can be reduced, the electrostatic force between the substrate and the ground plate is reduced even when the substrate is charged. be able to. Thereby, a board | substrate and an earth plate can be pulled apart easily.

  In the electrospray apparatus according to the first aspect, preferably, the contact area where the plurality of convex portions and the substrate are in contact is 1% or more and 5% or less of the area of the region overlapping the substrate of the ground plate. Here, when the contact area is smaller than 1% of the area of the region overlapping the substrate of the earth plate, the contact area between one convex portion and the substrate becomes too small, and therefore the substrate in contact with the convex portion Stress may concentrate on the part, and as a result, the substrate may be damaged. Also, if the contact area is larger than 5% of the area of the ground plate that overlaps the substrate, the electrostatic force between the substrate and the ground plate increases, so the substrate and the ground plate can be pulled easily. There are cases where it cannot be separated. Therefore, in the present invention, the contact area where the plurality of convex portions and the substrate contact each other is set to be 1% or more and 5% or less of the area of the ground plate that overlaps the substrate, thereby suppressing the substrate from being damaged. However, the substrate and the ground plate can be easily separated.

  In the electrospray device according to the first aspect, preferably, the height of the plurality of convex portions from the surface of the ground plate is not less than 100 μm and not more than 500 μm. Here, when the height of the plurality of convex portions from the surface of the ground plate is smaller than 100 μm, the substrate may be bent and the substrate may come into contact with the concave portions between the adjacent convex portions. In this case, since the contact area between the ground plate and the substrate becomes large, it may be difficult to separate the substrate and the ground plate. Further, when the height of the plurality of convex portions from the surface of the ground plate is larger than 500 μm, the distance between the substrate and the ground plate (the concave portion between the convex portions) is large, resulting in local In particular, there is a case where an electric field is not generated between the nozzle and the substrate (portion corresponding to the concave portion of the ground plate) (the electric field is weak). For this reason, variation (coating unevenness) may occur in the thickness of the thin film formed on the substrate. Therefore, in the present invention, by setting the height of the plurality of convex portions from the surface of the earth plate to 100 μm or more and 500 μm or less, it is possible to suppress the occurrence of variation (unevenness in coating) in the thickness of the thin film formed on the substrate. However, the substrate and the ground plate can be easily separated.

  In the electrospray device according to the first aspect described above, preferably, the plurality of convex portions are provided so as to be distributed over the entire region overlapping the substrate of the ground plate. With this configuration, unlike the case where a plurality of convex portions are provided in a part of the region of the ground plate that overlaps the substrate, the occurrence of bias in the strength of the electric field between the nozzle and the substrate is suppressed. can do. Thereby, it can suppress effectively that dispersion | variation (coating unevenness) arises in the thickness of the thin film formed in a board | substrate.

  In the electrospray apparatus according to the first aspect, preferably, the surface of the ground plate that contacts the substrate is curved in a convex shape, and the ground plate is curved when the thin film is formed. It is configured to come into contact with a plurality of convex portions of the ground plate in a state curved in a convex shape so as to follow the surface. If comprised in this way, after a thin film is formed, the board | substrate and an earth plate can be pulled apart more easily by the restoring force which eliminates the state which the board | substrate curved and returns to a flat state.

  The electrospray apparatus according to the first aspect preferably further includes a static elimination unit that neutralizes static electricity generated between the ground plate and the substrate. According to this structure, after the thin film is formed, the substrate and the ground plate can be more easily separated by removing static electricity generated between the ground plate and the substrate by the static eliminating unit.

  An electrospray apparatus according to a second aspect of the present invention includes an earth plate that contacts a substrate when the thin film is formed and grounds the substrate, and a surface of the earth plate that contacts the substrate is curved in a convex shape. The earth plate is configured to come into contact with the earth plate when the thin film is formed in a state where the substrate is curved in a convex shape so as to follow the curved surface of the earth plate. If comprised in this way, after formation of a thin film, a board | substrate and an earth plate can be easily pulled apart by the force which eliminates the state which the board | substrate curved and returns to a flat state.

  According to the present invention, the substrate and the ground plate can be easily separated as described above.

1 is an overall view showing a schematic configuration of an electrospray apparatus according to a first embodiment of the present invention. It is a top view of the earth plate of the electrospray apparatus by 1st Embodiment of this invention. FIG. 4 is an enlarged plan view of the ground plate shown in FIG. 3. FIG. 4 is an enlarged side view of the ground plate shown in FIG. 3. It is a general view which shows the structure of the outline of the electrospray apparatus by 2nd Embodiment of this invention. It is a general view which shows the structure of the outline of the electrospray apparatus by the modification of 2nd Embodiment of this invention. It is a general view which shows the structure of the outline of the electrospray apparatus by 3rd Embodiment of this invention.

  DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments embodying the present invention will be described below with reference to the drawings.

(First embodiment)
With reference to FIGS. 1-4, the structure of the electrospray apparatus 100 by 1st Embodiment is demonstrated.

  As shown in FIG. 1, the electrospray apparatus 100 includes a nozzle 1, a ground plate 2, a mask 3, and an elevating unit 4. A substrate 200 is disposed between the earth plate 2 and the mask 3. FIG. 1 is a diagram showing a schematic configuration of the electrospray apparatus 100, and the number of convex portions 2b of the earth plate 2 described later is smaller than the actual number for simplification.

  The nozzle 1 is configured to spray the solution material from below (Z2 direction) to above (Z1 direction) while a voltage is applied to the solution material. The solution material sprayed from the nozzle 1 is configured to be deposited on the substrate 200 as a thin film (not shown).

  The earth plate 2 is made of, for example, a metal plate and has a flat plate shape. The earth plate 2 is configured to contact the substrate 200 and ground the substrate 200 when the thin film is formed (state shown in FIG. 1). Here, in the first embodiment, as shown in FIG. 2, a plurality of convex portions 2 b are provided on the surface 2 a (on the surface 2 a on the Z2 direction side) with which the substrate 200 of the earth plate 2 contacts. . The plurality of convex portions 2b are formed, for example, by cutting the surface of the flat earth plate 2. As shown in FIG. 3, the convex part 2b is formed in the substantially square shape (1 mm x 1 mm) which has the length L whose 1 side is 1 mm in planar view. The contact area where the plurality of protrusions 2b and the substrate 200 are in contact is 1% or more and 5% or less of the area of the region of the ground plate 2 that overlaps the substrate 200 (region A surrounded by the dotted line in FIG. 2). It is. Specifically, in the first embodiment, the contact area where the plurality of protrusions 2b (the upper surface of the protrusion 2b) and the substrate 200 are in contact is 4 times the area of the region A that overlaps the substrate 200 of the earth plate 2. %.

  As shown in FIG. 4, the height h of the convex portion 2b from the surface of the earth plate 2 (height h from the concave portion 2c between the adjacent convex portions 2b) is not less than 100 μm and not more than 500 μm. Specifically, in the first embodiment, the convex portion 2b has a height h of 300 μm.

  As shown in FIG. 3, the plurality of convex portions 2 b are provided so as to be distributed over the entire region (region A surrounded by a dotted line in FIG. 2) that overlaps the substrate 200 of the earth plate 2. . Specifically, the plurality of convex portions 2 b are arranged in a matrix (substantially uniform) in a region A that overlaps the substrate 200 of the earth plate 2. In addition, the plurality of convex portions 2b are arranged adjacent to each other with a distance d of 5 mm or more and 10 mm or less in the X direction and the Y direction in plan view. In the first embodiment, the plurality of convex portions 2b are arranged adjacent to each other with a distance d of 5 mm.

  Further, as shown in FIG. 1, the mask 3 is disposed between the substrate 200 and the nozzle 1. Further, the mask 3 is configured such that both end portions of the mask 3 are supported by the lifting unit 4 and are lifted and lowered together with the lifting and lowering unit 4. The mask 3 is configured to be pressed together with the substrate 200 to the earth plate 2 side (Z1 direction side) by the elevating unit 4. The mask 3 is provided with an opening 3a so that a thin film is deposited on the portion of the substrate 200 exposed from the opening 3a.

  Next, with reference to FIG. 1, the operation | movement at the time of deposition of the thin film of the electrospray apparatus 100 is demonstrated.

  First, the mask 3 with the substrate 200 placed on the upper surface is raised by the elevating unit 4 so that the substrate 200 is brought into contact with the earth plate 2 (the state shown in FIG. 1 is reached). Next, in a state where the substrate 200 is in contact with the earth plate 2, the solution material is sprayed from the nozzle 1 through the mask 3 to form a thin film on the substrate 200. After the formation of the thin film, the elevating unit 4 is lowered, so that the substrate 200 is separated from the earth plate 2 together with the mask 3. Since the plurality of convex portions 2b are provided on the surface 2a of the earth plate 2 with which the substrate 200 contacts, the contact area is reduced correspondingly, and the electrostatic force between the earth plate 2 and the substrate 200 is reduced. . As a result, the substrate 200 is easily pulled away from the earth plate 2.

  Next, effects of the first embodiment will be described.

  In the first embodiment, as described above, by providing the plurality of convex portions 2b on the surface 2a with which the substrate 200 of the earth plate 2 contacts, the surface 2a with which the substrate 200 of the earth plate 2 contacts is flat. Since the contact area between the ground plate 2 (plural protrusions 2b) and the substrate 200 can be reduced, the substrate 200 and the ground plate 2 can be connected even when the substrate 200 is charged. The electrostatic force between the two can be reduced. Thereby, the board | substrate 200 and the earth plate 2 can be pulled apart easily.

  In the first embodiment, as described above, the contact area where the plurality of protrusions 2b and the substrate 200 are in contact is 1% to 5% of the area of the region A overlapping the substrate 200 of the earth plate 2. To. Here, when the contact area is smaller than 1% of the area of the region A that overlaps the substrate 200 of the earth plate 2, the contact area between the one protrusion 2b and the substrate 200 becomes too small. Stress concentrates on the portion of the substrate 200 that contacts 2b, and as a result, the substrate 200 may be damaged. Further, when the contact area is larger than 5% of the area A of the area A that overlaps the substrate 200 of the earth plate 2, the electrostatic force between the substrate 200 and the earth plate 2 becomes large, so that the substrate 200 and the earth are grounded. The plate 2 may not be easily separated. Therefore, in the first embodiment, by making the contact area where the plurality of protrusions 2b and the substrate 200 contact each other be 1% or more and 5% or less of the area of the region A overlapping the substrate 200 of the earth plate 2, The substrate 200 and the earth plate 2 can be easily separated while suppressing the substrate 200 from being damaged.

  In the first embodiment, as described above, the height h of the plurality of convex portions 2b from the surface of the earth plate 2 is set to 100 μm or more and 500 μm or less. Here, when the height h from the surface of the ground plate 2 of the plurality of convex portions 2b is smaller than 100 μm, the substrate 200 is bent and the substrate 200 comes into contact with the concave portions 2c between the adjacent convex portions 2b. There is. In this case, since the contact area between the earth plate 2 and the substrate 200 becomes large, it may be difficult to separate the substrate 200 and the earth plate 2. When the height h of the plurality of convex portions 2b from the surface of the earth plate 2 is larger than 500 μm, the distance between the substrate 200 and the earth plate 2 (the concave portion 2c between the convex portions 2b) is large. As a result, there is a case where an electric field is not locally generated between the nozzle 1 and the substrate 200 (a portion corresponding to the recess 2c of the earth plate 2) (the electric field is weak). For this reason, variation (coating unevenness) may occur in the thickness of the thin film formed on the substrate 200. Therefore, in the first embodiment, the thickness h of the plurality of convex portions 2b from the surface of the earth plate 2 is set to 100 μm or more and 500 μm or less, thereby varying the thickness of the thin film formed on the substrate 200 (coating unevenness). It is possible to easily separate the substrate 200 and the ground plate 2 while suppressing the occurrence of.

  In the first embodiment, as described above, the plurality of convex portions 2 b are provided so as to be distributed over the entire region A overlapping the substrate 200 of the earth plate 2. Thereby, unlike the case where the plurality of convex portions 2b are provided in a part of the region A overlapping the substrate 200 of the earth plate 2, the electric field strength between the nozzle 1 and the substrate 200 is uneven. Can be suppressed. As a result, it is possible to effectively suppress variation (coating unevenness) in the thickness of the thin film formed on the substrate 200.

(Second Embodiment)
Next, the configuration of the electrospray apparatus 101 according to the second embodiment will be described with reference to FIG. In the second embodiment, unlike the first embodiment in which the ground plate has a flat plate shape, the ground plate is curved in a convex shape.

  As shown in FIG. 5, the electrospray apparatus 101 includes a nozzle 1, a ground plate 21, a mask 3, and an elevating unit 4. Here, in 2nd Embodiment, the surface 21a of the side which contacts the board | substrate 200 of the earth plate 21 is curving convexly toward the downward direction (arrow Z2 direction). Specifically, the surface 21a of the earth plate 21 is formed in a catenary curve shape (curved shape when hung with both ends of a rope or the like) when viewed from the Y direction (direction perpendicular to the paper surface).

  Further, the surface 21a of the ground plate 21 on the side in contact with the substrate 200 is configured to have a curvature radius of R3000 mm or more and R30000 mm or less. Specifically, from the state where the surface 21a of the ground plate 21 is flat, the central portion of the surface 21a of the ground plate 21 is curved downwardly in a range W in the range W of 0.5 mm or more and 5 mm or less. It is configured. In the second embodiment, the width of the earth plate 21 in the X direction is 350 mm. In this case, the bending amount (W) at R3000 mm is about 5 mm, and the bending amount (W) at R30000 mm is about 0.5 mm. It becomes.

  Also, a plurality of convex portions 21b are provided on the surface 21a of the ground plate 21 with which the substrate 200 contacts, as in the first embodiment (see FIG. 2). The earth plate 21 is configured to come into contact with the plurality of convex portions 21b of the earth plate 21 in a state in which the substrate 200 is curved so as to follow the curved surface 21a of the earth plate 21 when the thin film is formed. Has been. In addition, the magnitude | size, the shape, and arrangement | positioning state of the convex part 21b of 2nd Embodiment are the same as that of the said 1st Embodiment (refer FIG. 2). Other configurations of the second embodiment are the same as those of the first embodiment.

  Next, effects of the second embodiment will be described.

  In the second embodiment, as described above, the surface 21a on the side of the earth plate 21 that contacts the substrate 200 is curved in a convex shape, and the substrate 200 is grounded when the thin film is formed on the earth plate 21. It is configured so as to come into contact with the plurality of convex portions 21b of the earth plate 21 in a state curved in a convex shape so as to follow the curved surface 21a. Thereby, after the thin film is formed, the substrate 200 and the earth plate 21 can be more easily separated by the restoring force that cancels the curved state of the substrate 200 and returns to the flat state as the mask 3 is lowered.

(Modification of the second embodiment)
Next, a configuration of an electrospray apparatus 101a according to a modification of the second embodiment will be described with reference to FIG. In the modification of the second embodiment, unlike the second embodiment in which a plurality of convex portions are provided on the surface on which the substrate of the ground plate that is curved in a convex shape contacts, the substrate of the ground plate contacts. There are no protrusions on the surface.

  As shown in FIG. 6, the electrospray apparatus 101 a includes a nozzle 1, a ground plate 31, a mask 3, and an elevating unit 4. The surface 31a of the ground plate 31 on the side in contact with the substrate 200 is curved in a convex shape downward (in the direction of arrow Z2). Moreover, in the modification of 2nd Embodiment, on the surface 31a with which the board | substrate 200 of the earth plate 31 contacts, a convex part is not provided but it is formed in flat surface shape. When the thin film is formed, the substrate 200 is configured to come into contact with the surface 31a of the earth plate 31 in a convexly curved state so as to follow the curved surface 31a of the earth plate 31. In addition, the other structure and effect of the modification of 2nd Embodiment are the same as that of the said 2nd Embodiment.

(Third embodiment)
Next, the configuration of the electrospray apparatus 102 according to the third embodiment will be described with reference to FIG. In the third embodiment, an ionizer is provided in addition to the configuration of the first embodiment. Note that the ionizer has a function of ionizing air and neutralizing static electricity with the generated ions.

  As shown in FIG. 7, the electrospray apparatus 102 includes a nozzle 1, a ground plate 2, a mask 3, and an elevating unit 4. Here, in the third embodiment, an ionizer 5 for removing static electricity generated between the ground plate 2 and the substrate 200 is provided below the ground plate 2 (substrate 200, mask 3). The ionizer 5 is an example of the “static elimination unit” in the present invention. The ionizer 5 is configured to be driven after the thin film is formed so as to remove static electricity generated between the earth plate 2 and the substrate 200. The remaining configuration of the third embodiment is similar to that of the aforementioned first embodiment.

  Next, effects of the third embodiment will be described.

  In the third embodiment, as described above, the ionizer 5 for removing static electricity generated between the ground plate 2 and the substrate 200 is provided. Thus, after the thin film is formed, the substrate 200 and the earth plate 2 can be more easily separated by removing static electricity generated between the earth plate 2 and the board 200 by the ionizer 5.

  The embodiments and examples disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is shown not by the above description of the embodiments and examples but by the scope of claims for patent, and includes all modifications within the meaning and scope equivalent to the scope of claims for patent.

  For example, in the first to third embodiments, an example in which the convex portion is formed in a substantially square shape (1 mm × 1 mm) having a length of one side in a plan view is shown. The present invention is not limited to this. For example, the convex portion may be formed in a substantially square shape having a length of one side other than 1 mm (for example, 0.3 mm) in plan view. In this case, the contact area where the plurality of protrusions and the substrate come into contact is about 0.36% of the area of the region of the earth plate that overlaps the substrate.

  In the first to third embodiments, the example in which the plurality of convex portions are arranged so as to be adjacent to each other with a space of 5 mm or more and 10 mm or less in plan view is shown. Is not limited to this. For example, the interval between adjacent convex portions may be less than ½ of the diameter of a region (substantially circular region) where the solution material sprayed from the nozzle is applied onto the substrate. In addition, when the space | interval between adjacent convex parts is 1/2 or more of a diameter, the strength of the electric field produced between a nozzle and a board | substrate may arise locally, and in this case, it forms in a board | substrate. Variation (coating unevenness) occurs in the thickness of the thin film.

  Moreover, in the said 1st-3rd embodiment, although the substantially square-shaped convex part was shown in planar view on the surface which the board | substrate of an earth plate contacts, this invention is not limited to this. . For example, the convex portion may have a shape (for example, a circular shape) other than a substantially square shape in plan view.

  Moreover, in the said 1st-3rd embodiment, although the several convex part showed the example arrange | positioned in the matrix form on the surface which the board | substrate of an earth plate contacts, this invention is not limited to this. . For example, the convex portions may be arranged in a staggered pattern other than a matrix.

  Moreover, in the said 1st-3rd embodiment, the several convex part showed the example provided so that it might be distributed substantially uniformly (matrix form) in the whole area | region which overlaps with the board | substrate of a ground plate. However, the present invention is not limited to this. For example, you may arrange | position a some convex part in the state which is not substantially uniform (non-uniform | heterogenous state) to such an extent that the coating nonuniformity of a thin film does not arise.

  Moreover, although the said 1st-3rd embodiment showed the example in which the some convex part was formed by cutting the surface of an earth plate, this invention is not limited to this. For example, the plurality of convex portions may be formed by sandblasting or shot peening the surface of the earth plate.

  Moreover, in the said 1st-3rd embodiment, although the solution material was sprayed from the nozzle toward the upper direction from the downward direction, this invention is not limited to this. For example, the solution material may be sprayed from a nozzle from above to below. Alternatively, the solution material may be sprayed from the nozzle in the lateral direction.

  In the third embodiment, in addition to the configuration of the electrospray device of the first embodiment, an example is shown in which an ionizer for removing static electricity generated between the ground plate and the substrate is provided. The invention is not limited to this. For example, an ionizer may be provided in addition to the configuration of the electrospray apparatus of the second embodiment.

1 Nozzle 2, 21, 31 Earth plate 2a, 21a Surface 2b, 21b Convex part 5 Ionizer (static elimination part)
100, 101, 101a, 102 Electrospray apparatus 200 Substrate A Area h Height

Claims (7)

An electrospray apparatus for depositing a solution material sprayed from a nozzle as a thin film on a substrate,
An earth plate for contacting the substrate and grounding the substrate during the formation of the thin film;
An electrospray apparatus, wherein a plurality of convex portions are provided on a surface of the ground plate that contacts the substrate.   2. The electrospray apparatus according to claim 1, wherein a contact area where the plurality of protrusions and the substrate are in contact is 1% or more and 5% or less of an area of the ground plate overlapping the substrate.   The electrospray apparatus according to claim 1 or 2, wherein a height of the plurality of convex portions from a surface of the earth plate is 100 µm or more and 500 µm or less.   The electrospray apparatus according to any one of claims 1 to 3, wherein the plurality of convex portions are provided so as to be distributed over an entire region of the earth plate that overlaps the substrate. The surface of the earth plate that contacts the substrate is curved in a convex shape,
The ground plate is configured to contact the plurality of convex portions of the ground plate in a state where the substrate is curved in a convex shape so as to follow the curved surface of the ground plate when the thin film is formed. The electrospray apparatus according to any one of claims 1 to 4.   The electrospray apparatus according to any one of claims 1 to 5, further comprising a static elimination unit that neutralizes static electricity generated between the ground plate and the substrate. An electrospray apparatus for depositing a solution material sprayed from a nozzle as a thin film on a substrate,
An earth plate for contacting the substrate and grounding the substrate during the formation of the thin film;
The surface of the earth plate that contacts the substrate is curved in a convex shape,
The electrospray apparatus is configured such that, when the thin film is formed, the ground plate is in contact with the ground plate in a state in which the substrate is curved in a convex shape so as to follow the curved surface of the ground plate.

Images