JP2015094647A - Thermal air flowmeter - Google Patents
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- JP2015094647A JP2015094647A JP2013233620A JP2013233620A JP2015094647A JP 2015094647 A JP2015094647 A JP 2015094647A JP 2013233620 A JP2013233620 A JP 2013233620A JP 2013233620 A JP2013233620 A JP 2013233620A JP 2015094647 A JP2015094647 A JP 2015094647A
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- 238000009423 ventilation Methods 0.000 claims abstract description 23
- 239000011347 resin Substances 0.000 claims abstract description 11
- 229920005989 resin Polymers 0.000 claims abstract description 11
- 239000012530 fluid Substances 0.000 claims abstract description 8
- 239000010409 thin film Substances 0.000 claims abstract description 5
- 239000004065 semiconductor Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 3
- 239000011521 glass Substances 0.000 claims description 2
- 238000005259 measurement Methods 0.000 description 9
- 239000002390 adhesive tape Substances 0.000 description 6
- 238000001514 detection method Methods 0.000 description 6
- 238000002485 combustion reaction Methods 0.000 description 5
- 238000004891 communication Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000356 contaminant Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000446 fuel Substances 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
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Abstract
Description
本発明は被測定気体の流量を計測する流量計に係り、特に、内燃機関の吸入空気量を計測する熱式空気流量計に関する。 The present invention relates to a flow meter for measuring a flow rate of a gas to be measured, and more particularly to a thermal air flow meter for measuring an intake air amount of an internal combustion engine.
気体流量を計測する熱式空気流量計は、流量を計測するための流量検出部を備え、前記流量検出部と計測対象である気体との間で熱伝達を行うことにより、気体の流量を計測するように構成されている。熱式空気流量計が計測する流量は、様々な装置において重要な制御パラメータとして広く使用されている。熱式空気流量計の特徴は、他方式の流量計に比べ相対的に高い精度で気体流量、例えば質量流量を計測できることである。 A thermal air flow meter that measures the gas flow rate has a flow rate detection unit for measuring the flow rate, and measures the gas flow rate by transferring heat between the flow rate detection unit and the gas to be measured. Is configured to do. The flow rate measured by the thermal air flow meter is widely used as an important control parameter in various apparatuses. A feature of the thermal air flow meter is that a gas flow rate, for example, a mass flow rate can be measured with relatively high accuracy compared to other types of flow meters.
しかし、さらなる気体流量計測精度の向上が望まれている。例えば、内燃機関を搭載した車両では、省燃費の要望や排気ガス浄化の要望が非常に高い。これらの要望に応えるには、内燃機関の主要パラメータである吸入空気量の計測高精度化、高速応答化が求められている。内燃機関に導かれる吸入空気量を計測する熱式空気流量計は、吸入空気量の一部を取り込む副通路と前記副通路に配置されたセンサチップを備え、センサチップに備えられる前記流量検出部が被計測気体との間で熱伝達を行うことにより、前記副通路を流れる被計測気体の状態を計測して、前記内燃機関に導かれる吸入空気量を表す電気信号を出力する。上記センサチップは半導体マシニング技術により形成された部分的な空洞部及び薄膜部を有する。上記薄膜部をダイアフラムと呼び、ダイアフラム上に流量検出部を形成することで熱式空気流量計の応答速度の更なる高速化が可能となる。しかし、ダイアフラム上に配置された抵抗体に応力がかかると、ピエゾ効果により抵抗値が変化するため、流量計測時の誤差要因となる。流量計測時にダイアフラムの表裏面に圧力差が生じると、ダイアフラムに応力が発生する。そのため、ダイアフラム表裏面の圧力差を抑制する技術が必要となる。このような技術は、例えば特許文献１に開示されている。 However, further improvement in gas flow rate measurement accuracy is desired. For example, a vehicle equipped with an internal combustion engine has a very high demand for fuel saving and exhaust gas purification. In order to meet these demands, there is a need for highly accurate measurement and high-speed response of the intake air amount, which is a main parameter of an internal combustion engine. A thermal air flow meter for measuring an intake air amount led to an internal combustion engine includes a sub-passage that takes in a part of the intake air amount and a sensor chip disposed in the sub-passage, and the flow rate detection unit provided in the sensor chip Performs a heat transfer with the gas to be measured, thereby measuring the state of the gas to be measured flowing through the auxiliary passage and outputting an electric signal representing the amount of intake air guided to the internal combustion engine. The sensor chip has a partial cavity and a thin film formed by a semiconductor machining technique. The thin film portion is called a diaphragm, and the response speed of the thermal air flow meter can be further increased by forming a flow rate detection portion on the diaphragm. However, when a stress is applied to the resistor arranged on the diaphragm, the resistance value changes due to the piezo effect, which becomes an error factor when measuring the flow rate. If a pressure difference occurs between the front and back surfaces of the diaphragm during flow rate measurement, stress is generated in the diaphragm. Therefore, a technique for suppressing the pressure difference between the diaphragm front and back surfaces is required. Such a technique is disclosed in Patent Document 1, for example.
特許文献１に記載の技術は、センサチップを搭載する基板裏面に開口部を設け、ダイアフラム裏面の空洞部を上記開口部を介して副通路に接続する。そして、ダイアフラム表面は流量測定のために副通路内に設けられている。そのため、ダイアフラム表裏面の圧力差を低減することができる。しかし、上記構造では、上記開口部及び接続部は副通路内に晒されており、副通路内には汚損物が飛来してくるため、上記開口部に汚損物が到達し、長期的には上記開口部の開口面積を減少させる課題がある。さらに、ダイアフラム表面の気流が開口部を介してダイアフラム裏面に流入し、ダイアフラム裏面空洞部に空気の乱れを生じさせる。これにより、ダイアフラムに形成された流量検出部に温度変化が発生し、計測精度を低下させるおそれがある。 In the technique described in Patent Document 1, an opening is provided on the back surface of the substrate on which the sensor chip is mounted, and the cavity on the back surface of the diaphragm is connected to the sub-passage through the opening. The surface of the diaphragm is provided in the auxiliary passage for measuring the flow rate. Therefore, the pressure difference between the diaphragm front and back surfaces can be reduced. However, in the above structure, the opening and the connecting portion are exposed in the sub-passage, and the contaminants come into the sub-passage. There is a problem of reducing the opening area of the opening. Furthermore, the airflow on the diaphragm surface flows into the diaphragm back surface through the opening, causing air disturbance in the diaphragm back surface cavity. As a result, a temperature change occurs in the flow rate detection unit formed in the diaphragm, which may reduce the measurement accuracy.
本発明の目的は、計測精度の高い熱式空気流量計を提供することである。 An object of the present invention is to provide a thermal air flow meter with high measurement accuracy.
上記目的を達成するために、本発明の熱式空気流量計は、被計測流体の一部を取り込む副通路と、半導体基板に形成された空洞部と前記空洞部を覆うように形成された薄膜部からなるダイアフラムとを有し前記副通路に配置され前記被計測流体の流量を計測するセンサチップと、前記センサチップにより検出した流体流量を電気信号に変換する回路部と、前記回路部と電気的に接続され外部に信号を出力するコネクタを有するコネクタ部と、前記センサチップ及び前記回路部を支持する筐体と、を備える熱式空気流量計において、前記センサチップが実装され、前記空洞部を連通する空気通路が複数形成された換気用のプレートを備え、 前記センサチップ及び前記プレートの表面は、前記センサチップのダイアフラム及び前記プレートの一部が露出するように樹脂でモールドされ、前記空洞部と前記モールドパッケージの外部とが前記複数の空気通路で連通され、前記複数の空気通路は、前記モールドパッケージの外部を連結する出口開口部で合流することを特徴とする。 In order to achieve the above object, a thermal air flow meter of the present invention includes a sub-passage for taking a part of a fluid to be measured, a cavity formed in a semiconductor substrate, and a thin film formed so as to cover the cavity A sensor chip that is arranged in the sub-passage to measure the flow rate of the fluid to be measured, a circuit unit that converts the fluid flow rate detected by the sensor chip into an electrical signal, and the circuit unit In a thermal air flow meter comprising a connector part having a connector that is connected to the outside and outputs a signal to the outside, and a housing that supports the sensor chip and the circuit part, the sensor chip is mounted, and the cavity part A plate for ventilation in which a plurality of air passages communicating with each other are formed, and the sensor chip and the surface of the plate are one of the diaphragm of the sensor chip and the plate. And the cavity and the outside of the mold package communicate with each other through the plurality of air passages, and the plurality of air passages merge at an outlet opening that connects the outside of the mold package. It is characterized by doing.
本発明によれば、計測精度の高い熱式空気流量計を提供することが可能となる。 According to the present invention, it is possible to provide a thermal air flow meter with high measurement accuracy.
以下、本発明の実施例について図を用いて説明する。 Embodiments of the present invention will be described below with reference to the drawings.
まず初めに熱式空気流量計の第１実施例について説明する。図１はセンサアセンブリ１０形成前の実装部品の平面図であり、図２はセンサアセンブリ１０形成後の平面図、図３は図２上のＡ−Ａ断面図である。図１に示すように、センサアセンブリ１０はリードフレーム１、換気プレート２、ＬＳＩ３、センサチップ４を備えており、図２に示すように、これらが第１樹脂２４で覆われている。具体的な製造方法は、まず、リードフレーム１上に換気プレート２を接着テープ５で接着し、さらに換気プレート２上にＬＳＩ３とセンサチップ４を接着テープ６、接着テープ７で接着する。なお、この換気プレート２には、ガラスを用いても樹脂を用いても構わない。次に、ＬＳＩ３とセンサチップ４の間、及びＬＳＩ３とリードフレーム１の間をワイヤボンディングにより金線８、９を用いて電気的に結線する。これらを第１樹脂２４によって樹脂封止し、センサアセンブリ１０が完成する。流量検出時は、図２の矢印方向もしくは反対方向から空気がセンサチップ４の流量検出部を有するダイアフラム２７上に流入することで流量を測定する。 First, a first embodiment of the thermal air flow meter will be described. FIG. 1 is a plan view of a mounted part before the sensor assembly 10 is formed, FIG. 2 is a plan view after the sensor assembly 10 is formed, and FIG. 3 is a cross-sectional view taken along line AA in FIG. As shown in FIG. 1, the sensor assembly 10 includes a lead frame 1, a ventilation plate 2, an LSI 3, and a sensor chip 4, and these are covered with a first resin 24 as shown in FIG. 2. Specifically, first, the ventilation plate 2 is bonded to the lead frame 1 with the adhesive tape 5, and the LSI 3 and the sensor chip 4 are bonded to the ventilation plate 2 with the adhesive tape 6 and the adhesive tape 7. The ventilation plate 2 may be made of glass or resin. Next, between the LSI 3 and the sensor chip 4 and between the LSI 3 and the lead frame 1 are electrically connected using gold wires 8 and 9 by wire bonding. These are sealed with the first resin 24 to complete the sensor assembly 10. At the time of detecting the flow rate, the flow rate is measured by air flowing into the diaphragm 27 having the flow rate detecting portion of the sensor chip 4 from the direction of the arrow in FIG.
図４は、センサアセンブリ１０の製造工程において、実装部品を上金型１６と下金型１５でクランプしたときの断面図である。金型クランプ後、第１樹脂２４を金型内に流し込むことでセンサアセンブリ１０を作製する。上記上金型１６および下金型１５は、センサチップ４のダイアフラム部２７および、換気プレート２の出口開口１７の上部及び下部をピンで挟むことによって樹脂封止時の樹脂の流入を防ぐ。これにより、センサアセンブリ１０は部分的に露出する構造となる。 FIG. 4 is a cross-sectional view when the mounting component is clamped by the upper mold 16 and the lower mold 15 in the manufacturing process of the sensor assembly 10. After the mold clamping, the sensor assembly 10 is manufactured by pouring the first resin 24 into the mold. The upper mold 16 and the lower mold 15 prevent the inflow of resin at the time of resin sealing by sandwiching the upper part and the lower part of the diaphragm part 27 of the sensor chip 4 and the outlet opening 17 of the ventilation plate 2 with pins. As a result, the sensor assembly 10 is partially exposed.
図５は、副通路１２を含む筐体１１にセンサアセンブリ１０を実装したときの正面図であり、図６は図５上のＢ−Ｂ部断面図である。上記筐体１１は主通路を流れる空気をセンサチップ４に導くための副通路１２とセンサアセンブリ１０の保持部２０、２１（副通路の側壁となる）と前記リードフレーム１の保持部１４を備えており、第２樹脂からなる筐体１１形成と同時にセンサアセンブリ１０が固定される。この際、流量検出部を有するセンサチップ４は空気流量を測定する必要があるため、上記副通路１２中に配置される。換気プレート２の出口開口１７は、センサチップ４と副通路２１を挟んで反対側に形成され、筐体１１に形成された連通溝１８によって副通路と接続する。 5 is a front view when the sensor assembly 10 is mounted on the housing 11 including the sub-passage 12, and FIG. 6 is a cross-sectional view taken along the line BB in FIG. The housing 11 includes a sub-passage 12 for guiding the air flowing through the main passage to the sensor chip 4, holding parts 20 and 21 of the sensor assembly 10 (becomes side walls of the sub-passage), and a holding part 14 of the lead frame 1. The sensor assembly 10 is fixed simultaneously with the formation of the housing 11 made of the second resin. At this time, the sensor chip 4 having the flow rate detection unit needs to measure the air flow rate, and thus is disposed in the sub-passage 12. The outlet opening 17 of the ventilation plate 2 is formed on the opposite side across the sensor chip 4 and the auxiliary passage 21, and is connected to the auxiliary passage by a communication groove 18 formed in the housing 11.
図７は上記換気プレート２の正面図であり、図８は図７上のＣ−Ｃ部断面図及びＤ−Ｄ部断面図である。図７、図８に示すとおり換気プレート２は複数の空気通路１３を有している。さらに、上記複数の空気通路１３は出口開口１７で合流する。 FIG. 7 is a front view of the ventilation plate 2, and FIG. 8 is a cross-sectional view taken along the line CC and a cross-sectional view taken along the line DD in FIG. As shown in FIGS. 7 and 8, the ventilation plate 2 has a plurality of air passages 13. Further, the plurality of air passages 13 merge at the outlet opening 17.
次に、上記第１実施例による作用効果について説明する。センサアセンブリ１０において、センサチップ４の空洞部２８が外気と接続していないと、流量計測時にダイアフラム２７の表裏面に圧力差が生じるため、測定誤差が大きくなる。また、上記圧力差を低減するために、空洞部２８を副通路内で外気と接続させると、開口部に汚損物が到達し、開口部及び空気通路が閉塞する可能性がある。本実施例では、換気プレート２に形成した空気通路１３を用いてセンサチップ４の空洞部２８を副通路の外側に形成した換気プレート２の出口開口１７と接続しており、出口開口１７は筐体１１の連通溝１８を介して副通路と間接的に接続している。連通溝１８が十分小さければ、副通路に流入する汚損物が出口開口１７に到達することを抑制することができる。これにより、出口開口１７の閉塞を抑制することができ、ダイアフラム２７表裏面の圧力差発生を抑制することができる。 Next, the function and effect of the first embodiment will be described. In the sensor assembly 10, if the cavity 28 of the sensor chip 4 is not connected to the outside air, a pressure difference is generated between the front and back surfaces of the diaphragm 27 during flow rate measurement, resulting in a large measurement error. In addition, if the cavity 28 is connected to the outside air in the sub-passage in order to reduce the pressure difference, a fouling substance may reach the opening and the opening and the air passage may be blocked. In this embodiment, the air passage 13 formed in the ventilation plate 2 is used to connect the cavity 28 of the sensor chip 4 to the outlet opening 17 of the ventilation plate 2 formed outside the auxiliary passage. The body 11 is indirectly connected to the auxiliary passage via the communication groove 18 of the body 11. If the communication groove 18 is sufficiently small, it is possible to prevent the contaminants flowing into the sub passage from reaching the outlet opening 17. Thereby, obstruction | occlusion of the exit opening 17 can be suppressed and the pressure difference generation | occurrence | production of the diaphragm 27 front and back can be suppressed.
また、空気通路１３を複数本備えることで、万一、製造時もしくは実環境使用時に片方の空気通路１３が閉塞したとしても、もう片方の空気通路１３でダイアフラム２７表裏面の圧力差の発生を抑制可能であり、空気通路１３の閉塞に対してロバストな構造となる。さらに、複数の空気通路１３が出口開口１７で合流することにより、複数の空気通路１３内の圧力差を無くすことができるため、空気通路１３内の空気の流れを抑制することができる。これにより、センサチップ４の空洞部２８内の空気の流れを抑制することができ、流量測定精度を高精度に維持することができる。 Also, by providing a plurality of air passages 13, even if one air passage 13 is blocked during manufacturing or actual environment use, the pressure difference between the front and back surfaces of the diaphragm 27 is generated in the other air passage 13. The structure can be suppressed and is robust against the blockage of the air passage 13. Furthermore, since the plurality of air passages 13 merge at the outlet opening 17, pressure differences in the plurality of air passages 13 can be eliminated, so that the flow of air in the air passage 13 can be suppressed. Thereby, the flow of the air in the cavity 28 of the sensor chip 4 can be suppressed, and the flow rate measurement accuracy can be maintained with high accuracy.
次に、本発明の他の一実施例である実施例２について図９〜図１１を用いて説明する。 Next, Example 2 which is another Example of this invention is demonstrated using FIGS. 9-11.
実施例１と異なる構成は、図１１に示す通り、換気プレート２の空気通路１３をセンサチップ４搭載部の外側に形成した点である。本構成でも先の実施例と同等の作用効果を奏することは言うまでもない。 The configuration different from the first embodiment is that the air passage 13 of the ventilation plate 2 is formed outside the sensor chip 4 mounting portion as shown in FIG. Needless to say, this configuration also achieves the same effects as the previous embodiments.
次に、本発明の他の一実施例である実施例２について図１２〜図１４を用いて説明する。 Next, Example 2 which is another Example of this invention is demonstrated using FIGS. 12-14.
先の実施例と異なる構成は、図１４に示すとおり、換気プレート２に設けられる空気通路１３を３本有する構造とした点である。本構成でも先の実施例１と同等の作用効果を奏することは言うまでもない。 A different configuration from the previous embodiment is that it has a structure having three air passages 13 provided in the ventilation plate 2 as shown in FIG. Needless to say, this configuration also achieves the same effects as the first embodiment.
以上、本発明の実施形態について詳述したが、本発明は、前記の実施形態に限定されるものではなく、特許請求の範囲に記載された本発明の精神を逸脱しない範囲で、種々の設計変更を行うことができるものである。例えば、前記した実施の形態は本発明を分かりやすく説明するために詳細に説明したものであり、必ずしも説明した全ての構成を備えるものに限定されるものではない。また、ある実施形態の構成の一部を他の実施形態の構成に置き換えることが可能であり、また、ある実施形態の構成に他の実施形態の構成を加えることも可能である。さらに、各実施形態の構成の一部について、他の構成の追加・削除・置換をすることが可能である。 Although the embodiments of the present invention have been described in detail above, the present invention is not limited to the above-described embodiments, and various designs can be made without departing from the spirit of the present invention described in the claims. It can be changed. For example, the above-described embodiment has been described in detail for easy understanding of the present invention, and is not necessarily limited to one having all the configurations described. Further, a part of the configuration of an embodiment can be replaced with the configuration of another embodiment, and the configuration of another embodiment can be added to the configuration of an embodiment. Furthermore, it is possible to add, delete, and replace other configurations for a part of the configuration of each embodiment.
１…リードフレーム
２…換気プレート
３…ＬＳＩ
４…センサチップ
５…接着テープ
６…接着テープ
７…接着テープ
８…金線
９…金線
１０…センサアセンブリ
１１…筐体
１２…副通路
１３…空気通路
１４…保持部
１５…下金型
１６…上金型
１７…出口開口
１８…連通部
２０…保持部
２１…保持部
２４…第１樹脂
２６…空気
２７…ダイアフラム部
２８…空洞部
1 ... Lead frame 2 ... Ventilation plate 3 ... LSI
DESCRIPTION OF SYMBOLS 4 ... Sensor chip 5 ... Adhesive tape 6 ... Adhesive tape 7 ... Adhesive tape 8 ... Gold wire 9 ... Gold wire 10 ... Sensor assembly 11 ... Housing 12 ... Sub-passage 13 ... Air passage 14 ... Holding part 15 ... Lower die 16 ... Upper mold 17 ... Exit opening 18 ... Communication part 20 ... Holding part 21 ... Holding part 24 ... First resin 26 ... Air 27 ... Diaphragm part 28 ... Cavity part
Claims (4)
前記センサチップが実装され、前記空洞部を連通する空気通路が複数形成された換気用のプレートを備え、
前記センサチップ及び前記プレートの表面は、前記センサチップのダイアフラム及び前記プレートの一部が露出するように樹脂でモールドされ、
前記空洞部と前記モールドパッケージの外部とが前記複数の空気通路で連通され、
前記複数の空気通路は、前記モールドパッケージの外部を連結する出口開口部で合流することを特徴とする熱式空気流量計。 A sub-passage for taking a part of the fluid to be measured; a diaphragm formed of a hollow portion formed in a semiconductor substrate; and a thin film portion formed so as to cover the cavity. A sensor chip that measures the flow rate of the fluid, a circuit unit that converts the fluid flow rate detected by the sensor chip into an electrical signal, a connector unit that has a connector that is electrically connected to the circuit unit and outputs a signal to the outside, In a thermal air flow meter comprising a sensor chip and a housing that supports the circuit unit,
The sensor chip is mounted, and includes a ventilation plate in which a plurality of air passages communicating with the cavity are formed,
The sensor chip and the surface of the plate are molded with resin so that the diaphragm of the sensor chip and a part of the plate are exposed,
The hollow portion and the outside of the mold package communicate with each other through the plurality of air passages,
The thermal air flowmeter, wherein the plurality of air passages merge at an outlet opening connecting the outside of the mold package.
前記出口開口部は、前記副通路外に備えられることを特徴とする熱式空気流量計。 The thermal air flow meter according to claim 1,
The thermal air flowmeter, wherein the outlet opening is provided outside the sub-passage.
前記空洞部は、前記空気通路及び前記出口開口部を介し前記副通路と連通する通路を備えたことを特徴とする熱式空気流量計。 In the thermal type air flow meter according to claim 1 or 2,
The thermal air flowmeter, wherein the hollow portion includes a passage communicating with the auxiliary passage through the air passage and the outlet opening.
前記換気プレートは、ガラスもしくは樹脂で形成されることを特徴とする熱式空気流量計。 In the thermal-type air flowmeter in any one of Claims 1-3,
The ventilation plate is made of glass or resin, and is a thermal air flow meter.
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