JP2015093415A - Fine structure molding die and fine structure molding method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a fine structure molding method capable of manufacturing a fine structure transfer-molded with high accuracy, and a die capable of performing the fine structure molding method.SOLUTION: The fine structure molding method includes transfer-molding a fine structure by using: a lower die in which a lower die base part controlled at a constant temperature holds a lower molding die having a lower stamper held through a thermal insulation; and an upper die in which an upper die base part controlled at a constant temperature holds an upper molding die having an upper stamper held through a thermal insulation. The origin parts of the lower and upper molding dies holding the lower and upper stampers and related to heating or cooling the same are immovably fixed, while allowing the other portions to be freely thermally-deformed, and in this state, fine structures formed on the lower and upper stampers are transfer-molded on a molten resin applied on the lower stamper.

Description

  In the present invention, a molten resin is applied to a stamper having a fine structure, and the resin is pressed by a lower mold and an upper mold, and is transferred and molded with high accuracy with little positional displacement and deformation distortion of the fine structure on the front and back surfaces. The present invention relates to a microstructure forming mold for manufacturing a microstructure and a microstructure forming method.

  The fine structure is used for a microlens array, a light guide plate, and the like, and the finer structure is required, and a thin plate-like body having a fine structure on the front and back surfaces is required. Such a fine structure having a fine structure on the front and back surfaces is liable to cause displacement and deformation of the fine structure on the front and back surfaces at the time of transfer molding, and high-precision transfer molding is not easy. In order to perform high-precision transfer molding, it is important to use a mold having a uniform temperature distribution, and various molds for making the temperature distribution uniform have been proposed.

  However, focusing on the fact that the positional shift and deformation distortion of the microstructure during transfer molding are caused by the deformation of the mold caused by injection molding or mold clamping in addition to the non-uniform temperature distribution, A cavity part having a molding surface for molding a resin, a temperature control part for adjusting the temperature of the cavity part, and disposed between the cavity part and the temperature control part, the cavity part and the There has been proposed a resin molding die including a template having a base material made of a material having higher thermal conductivity and rigidity than both base materials of the temperature control unit.

  In addition to the non-uniform temperature distribution of the cavity mold, in Patent Document 2, the cavity mold is bolted to the heat insulating plate, so that the expansion and contraction associated with heating and cooling of the cavity mold is restricted, and the cavity mold is A mold apparatus that focuses on deformation has been proposed. That is, in a pair of molds having a target surface for obtaining a molded body, at least one mold holds a target surface constituent member that forms the target surface and the target surface constituent member from the target surface side. And a mold apparatus comprising a cavity mold having both a heating means and a cooling means, and a main mold for holding the cavity mold, wherein the heating means and the cooling means are each the object to the cavity mold. The cavity mold is arranged symmetrically in an in-plane direction parallel to the surface and in a direction perpendicular to the target surface, and the cavity mold is fastened and held to the main mold at one substantially central portion in a plane parallel to the target surface. There has been proposed a mold apparatus including a support bar and a pressing jig that presses a peripheral edge of the cavity mold against the main mold.

JP 2010-82995 JP 2010-89327 A

  The resin molding die described in Patent Document 1 is intended to reduce the amount of deformation of the die caused by injection molding or clamping by using a die made of a material having high thermal conductivity and rigidity. Yes. The mold apparatus described in Patent Document 2 does not restrain the thermal deformation of the cavity mold by fastening and holding the cavity mold to the main mold with only one support rod screwed to the center of the bottom surface. Is intended. Since the distortion caused by the variation in the temperature distribution of the cavity mold is doubled by restraining the thermal deformation of the cavity mold, the mold apparatus described in Patent Document 2 is preferable for performing transfer molding with higher accuracy.

  However, there is a certain limit in suppressing the amount of variation in the temperature distribution of the fine structure portion of the mold, and considering that there are various forms of fine structures, in order to perform more accurate transfer molding, The mold apparatus described in Patent Document 2 is insufficient. There is a need for a mold that can further reduce the amount of deformation or distortion of the fine structure portion during the transfer molding operation and finely adjust the position of the fine structure portion.

  In view of the above-described conventional problems and requirements, the present invention provides a microstructured metal mold capable of producing a microstructure that is highly accurately transferred and molded with less positional displacement and deformation distortion of the microstructures on the front and back surfaces. It is an object to provide a mold and a method for forming a microstructure.

  The microstructure molding die according to the present invention includes a molding die L in which a stamper L having a microstructure L is held, a heating and cooling means L, a heat insulating member L, and a mother controlled to a constant temperature in contact therewith. The lower mold attached to the mounting plate L via the mold L, and the mold U holding the stamper U having the fine structure U are provided with heating and cooling means U and are in contact with the heat insulating member U. A surface of the resin applied to the stamper L by the lower mold and the upper mold. The upper mold is attached to the mounting plate U via a master mold U controlled at a constant temperature. A microstructure forming mold for manufacturing a microstructure having a microstructure L and a microstructure U transferred on the back surface, wherein the molding L is rigidly connected to the lower mold in the normal direction And has a connecting rod L that penetrates the inside of the heat insulating member L and the matrix L. The mother die L has an XY direction adjusting means L that can adjust the origin position of the molding die L via the connecting rod L, and can restrain the molding die L at the adjusted origin position, In the upper mold, the mold U is rigidly connected thereto and extends in the normal direction, and has a connecting rod U penetrating through the inside of the heat insulating member U and the matrix U, and the matrix U is XY direction adjusting means U is provided that can adjust the origin position of the molding die L via the connecting rod L and restrain the molding die U to the adjusted origin position.

  In the above invention, the XY direction adjusting means L includes a push bolt that is screwed into the mother die L and abuts against the connecting rod L, and a lock nut that fixes the push bolt to the mother die L. U may include a push bolt that is screwed to the mother die U and abuts the connecting rod U, and a lock nut that fixes the push bolt to the mother die U.

  Further, the connecting rods L and U have connecting rod rotation angle adjusting means L and U that can adjust the rotation angles L and U around the axes and can fix the adjusted rotation angles. can do.

  The connecting rods L and U are preferably fixed to the mounting plate L or U in such a state that a bending force is not generated on them and a tensile force is applied. In this case, the tensile force may be 500-1500N.

  The heating and cooling means L has a cooling path that circulates in a plane parallel to the mounting surface of the stamper L, and heating elements are arranged in a row so as to sandwich the cooling path. The cooling path may be provided in a plane parallel to the mounting surface of the stamper U, and the heating elements may be arranged in a row so as to sandwich the cooling path.

  The microstructure forming method according to the present invention includes a lower mold base in which a lower mold base held at a constant temperature holds a lower mold holding a lower stamper through a heat insulating material, and a constant temperature. The held upper mold base is a microstructure forming method in which a microstructure is transferred and molded by an upper mold formed by holding an upper mold in which an upper stamper is held via a heat insulating material. The bottom center portion of the lower mold is defined as the lower origin portion, and the bottom center portion of the upper mold is defined as the upper origin portion. After first aligning the lower origin portion and the upper origin portion, the lower origin portion Other than fixing the part to the lower mold base, it is fixed to the lower mold base without mechanical restraint, and the upper origin is fixed to the upper mold base. Fixed to the upper mold base without any restraint, and then a molten resin was applied to the lower stamper Said lower die and closing said upper die, a fine structure having said lower stamper and the upper stamper is performed by transferring the molded front and back surfaces of the coated resin.

  In the fine structure forming method, the alignment of the upper origin portion and the lower origin portion is performed by moving the lower origin portion in a plane including the lower origin portion or the upper origin portion including the upper origin portion. This can be done by carrying out equilibrium movement in the plane.

  According to the present invention, it is possible to manufacture a fine structure that is transferred and molded with high accuracy with little positional displacement and deformation distortion of the fine structures on the front and back surfaces.

It is a schematic diagram explaining the microstructure formation method which concerns on this invention. It is a schematic diagram which shows the partial cross section of the microstructure molded metal mold | die which concerns on this invention.

  Hereinafter, modes for carrying out the present invention will be described. First, the microstructure forming method according to the present invention will be described. This microstructure forming method uses a lower mold holding a lower stamper and an upper mold holding an upper stamper to transfer the microstructure of the lower and upper stampers to the molten resin applied on the lower stamper. This is a microstructure forming method for molding a microstructure having the microstructure on the upper and lower surfaces (front and back surfaces). In particular, for the lower mold and the upper mold for holding the lower and upper stampers and heating or cooling them, the origin portions are fixed in a stationary state, but the other portions allow free thermal deformation, and the lower stamper A method for forming a fine structure characterized in that a high-precision fine structure is formed by preventing the occurrence of thermal deformation distortion of the upper stamper and the transfer-formed fine structure.

  That is, in this microstructure forming method, the lower mold base controlled to a constant temperature and the lower mold formed by holding the lower mold holding the lower stamper via the heat insulating material are controlled to a constant temperature. The upper mold base that is formed by holding the upper mold with the upper stamper held through the heat insulating material is used. And the origin part is defined in each of the lower mold and the upper mold. The origin portion has the smallest thermal deformation due to the design of the mold, and a portion having a small deformation and displacement is selected. Generally, the center portion of the bottom surface of the mold is defined as the origin portion. That is, generally, the bottom center part of the lower mold is defined as the lower origin part, and the bottom center part of the upper mold is defined as the upper origin part.

  In this microstructure forming method, first, after aligning the lower origin part and the upper origin part, the lower origin part is fixed to the lower mold base, and there is no mechanical constraint. Fix to the lower mold base. Further, except that the upper origin portion is fixed to the upper mold base portion, it is fixed to the upper mold base portion without any mechanical restraint. Fixing the origin of such a mold to the mold base means, for example, fixing the mold to the mold base in a state as shown in FIG. In FIG. 1, the mold 12 is placed on the heat insulating member 14, and the connecting rod 19 is screwed to the center of the bottom surface of the mold 12 to be integrated with the mold 12. It penetrates the space provided inside the mold base 17. The gaps between the connecting rod 19 and the heat insulating member 14 and between the connecting rod 19 and the mold base 17 are appropriately determined.

  One end of the connecting rod 19 is fixed to the mold base 17. The mold base 17 forms a mold base including a mother mold and a mounting plate, and is controlled at a constant temperature. That is, the mold 12 is fixed to the mold base 17 controlled at a constant temperature via the connecting rod 19, and is restrained so that the origin of the mold 12 does not move. Since the connecting rod 19 must be one that does not displace or deform the origin portion of the mold 12, it is preferable that the connecting rod 19 has strength, low thermal conductivity, and low thermal expansion coefficient. For example, stainless steel is preferable. A heat-insulating washer can be interposed at the joint portion of the connecting rod 19 with the mold 12. Further, since the connecting rod 19 does not require a length, the connecting rod 19 may be formed from a part of the mold 12.

  As shown in FIG. 1B, the mold base 17 has push bolts 33 (33A to 33D) screwed in from four directions (XY directions). The push bolt 33 can be pressed against the connecting rod 19 by moving the push bolt 33 back and forth (back and forth). That is, by pressing the push bolt 33 from the four sides of the mold base 17 against the connecting rod 19, the origin of the mold 12 can be moved, and the origin of the mold 12 is fixed to the mold base 17. can do. In order to firmly fix the origin portion by the mold base 17, it is preferable to apply a lock nut 34 to the push bolt 33. The pressing force of the pressing bolt 33 can be adjusted appropriately.

  The mold base 17 has temperature control means 175 and is held at a constant temperature of 25 ° C. to 50 ° C. From the above, as shown in FIG. 1A, the mold 12 is fixed to the mold base 17 whose origin is held at a constant temperature, and other than the fixing of the origin, other mechanical It is placed on the heat insulating member 14 without any restraint.

  This microstructure forming method uses the lower mold and the upper mold having such a configuration, and after aligning the origin part of the lower mold and the origin part of the upper mold, each origin part Fix so that the position of is not displaced. Specifically, by adjusting the push bolt 33 (33A to 33D) described above, the origin portion of the lower mold and the origin portion of the upper mold are aligned via the connecting rod 19. Then, the connecting rod 19 is pressed with a predetermined pressing force by the push bolts 33A to 33D, and is fixed so that the position of the origin portion is not displaced. If necessary, lock with a lock nut 34. By this alignment of the origin part, the positions of the origin part of the lower mold and the origin part of the upper mold are in a state where the horizontal positions coincide even if the height positions are different. That is, the alignment of the origin portion is performed by moving the lower origin portion in a balanced manner in the plane including the lower origin portion, and moving the upper origin portion in a plane including the upper origin portion in an equilibrium manner.

  This alignment of the origin part may be adjusted for any origin part, and any origin part may be fixed and only the other origin part may be adjusted. Further, if the positioning of the origin portion is performed once when the mold is set, for example, a method may be used in which only the position adjustment of the origin portion of the lower mold is performed while the position of the origin portion of the upper mold is fixed. In this case, the upper mold base can be provided with something that can simply press the connecting rod 19 instead of the push bolt 33. Further, the positioning of the origin portion of the molding die can be performed as necessary at the time of mold setting, before the steady operation of the fine structure manufacturing, or during the steady operation.

  After the alignment of the origin portion is performed, the molten resin is applied to the lower stamper. Then, the upper mold and the lower mold are closed to perform transfer molding. That is, the upper die and the lower die are closed, and the resin 43 applied to the stamper 11 having a fine structure is pressed as shown in FIG. Each of the microstructures of each is transferred and molded.

  As described above, in this fine structure molding method, first, the origin of the mold holding the stamper is aligned, and if necessary, the position of the origin of the mold is readjusted to perform transfer molding. . Then, transfer molding is performed in a state where there is nothing that restrains thermal deformation of the mold. For this reason, it is possible to reduce misalignment, deformation, or distortion of the transferred microstructure. That is, this microstructure forming method can suitably perform high-precision transfer molding of a microstructure having a microstructure on the front and back surfaces of the resin. Note that the positional displacement and deformation distortion of the microstructures on the front and back surfaces may be based on the rotational displacement or positional displacement of the upper and lower molds or the upper and lower stampers. In such a case, the origin portion, that is, the mold can be rotated, and a rotation angle adjusting means capable of adjusting the rotation angle is provided, and rotation around the normal line of the surface including the origin portion is added to the origin portion. It is better to align the positions.

  As described above, the microstructure forming method performs alignment of the origin of the mold, makes the mold soaked, and constrains thermal expansion / contraction of the mold during transfer molding. The transfer molding is performed by fixing the origin of the molding die in a stationary state. The microstructure forming method may be any method that satisfies such characteristics. For example, the alignment of the origin part of the mold is not performed via the connecting rod 19 having the form shown in FIG. 1, but the position of the mold may be adjusted from the outside. Further, the method of fixing the mold without mechanical restraint except that the origin is fixed to the mold base held at a constant temperature is always applied to the mold as shown in the connecting rod 19 shown in FIG. It does not have to be provided integrally. A molding die provided with other things that act like the connecting rod 19 at the time of transfer molding may be used.

  This microstructure forming method can be preferably carried out by a microstructure forming mold having a simple structure described below. FIG. 2 shows the microstructure forming mold. The present microstructured mold is a mold in which a mold L12 holding a stamper L11 having a microstructure L is provided with heating and cooling means L123, 125 and is controlled to a heat insulating member L14 and a constant temperature in contact therewith. The lower mold 10 attached to the mounting plate L18 via L16, and the molding die U22 holding the stamper U21 having the fine structure U are provided with heating and cooling means U223, 225 and the heat insulating member U24. And an upper die 20 attached to the attachment plate U28 via a mother die U26 controlled to a constant temperature. By using the lower mold 10 and the upper mold 20, it is possible to manufacture a fine structure in which the fine structure L is transferred and molded on the surface of the resin 43 applied to the stamper L11 and the fine structure U is transferred on the back surface.

  In the present microstructured mold, with respect to the lower mold 10, the mold L12 is rigidly connected to the mold 10 and extends in the normal direction of the mold (molding mold installation plane PL), and the heat insulating member L14 and A connecting rod L19 penetrating the inner space of the mother die L16 is provided. The mother die L16 has XY direction adjusting means L30 (30A) that adjusts the origin position of the molding die L12 via the connecting rod L19 and restrains the origin position. Further, with respect to the upper mold 20, the mold U22 is rigidly connected to the mold 20 and extends in the normal direction of the mold (molding plane PU) and penetrates through the inner space of the heat insulating member U24 and the mother mold U26. Has a bar U29. The mother die U26 has XY direction adjusting means U30B that adjusts the origin position of the molding die U22 via the connecting rod U29 and restrains the origin position. The origin position of the molding die corresponds to the position of the origin portion of the molding die described above in the present microstructure forming method.

  The origin position of the mold can determine the required XY coordinates on the mold installation plane, and the coordinate point where the axis of the connecting bar intersects the XY coordinates can be determined as the origin position of the mold. The XY coordinates can be set for the lower mold and the upper mold, respectively, and a common absolute XY coordinate can be determined.

  In the case of this example, the origin position of the mold is determined as follows. First, the XY coordinate L is provided on the molding die installation plane PL, and the intersection L where the axis of the connecting rod L intersects the molding die installation plane PL is defined as the position of the molding die L. Further, the XY coordinates U are provided on the molding die installation plane PU, and the intersection point U where the axis of the connecting rod U intersects the molding die installation plane PU is defined as the position of the molding die U. The X and Y directions of the XY coordinates L and XY coordinates U can be, for example, the directions of the push bolts 33 of the mold base 17 (mother mold in this example) shown in FIG.

As shown in FIG. 2, the mold of this example is provided with XY direction adjusting means L30A having push bolts 33 and lock nuts 34 inserted from four sides of the base mold L16 with respect to the lower mold 10. Similarly, the upper mold 20 is provided with XY direction adjusting means U30B having a push bolt 33 and a lock nut 34 inserted from four directions of the mother die L26. The X and Y directions of the XY coordinates L and U are provided in the direction of the push bolt 33, respectively. The XY direction adjusting means L30A is configured to press the connecting rod L19 with the push bolt 33 and move it forward and backward to adjust the position of the molding die L12 to a predetermined position. Therefore, a predetermined position is defined as the origin position L _{0 of the} mold L12, and the push bolt is set so that the intersection L of the XY coordinates L where the axis of the connecting rod L intersects the mold installation plane PL coincides with the origin position L ₀ Adjust 33. Normally defines an XY coordinate L to the intersection L at the origin position L _0.

Similarly, the point where the normal passing through the origin position L ₀ of the XY coordinate L intersects the coordinate plane of the XY coordinate U is defined as the origin position U _0, and the axis of the connecting rod U of the XY coordinate U intersecting the mold installation plane PU intersection U to adjust the pushing bolt 33 so as to coincide with the home position U _0. These result, with successful alignment between the home position U ₀ of the mold U22 the origin position L ₀ of the mold L12. Note that the XY direction adjusting means L30A and the XY direction adjusting means U30B can have the same configuration (XY direction adjusting means 30). The push bolt 33 is not limited to this, and any push bolt can be used as long as it can advance and retreat, press the connecting rod, and fix the connecting rod.

  After the adjustment of the origin position, the push bolt can be kept pressed, but it is preferable to fix the connecting rod to the mother die by clamping the lock nut. That is, it is preferable that the lock nut 35 is engaged to restrain the movement of the connecting rod L19, and the molding die L12 is fixed (joined) to the mother die L16 via the connecting rod L19. Similarly, for the upper mold 20, it is preferable to fix the molding die U22 to the mother die U26 via the connecting rod U29.

  The mold L12 includes heating and cooling means 123 and 125 (heating means 123 and cooling means 125), and can heat and cool the stamper L11. The heating and cooling means may have a cooling path that extends around a plane parallel to the mounting surface of the stamper L11, and heating elements may be arranged in a row so as to sandwich the cooling path. As a result, the temperature of the stamper L11 mounting portion of the mold L12 can be controlled within a variation range of about 5 ° C. The same applies to the mold U22.

The mother die L16 has a cooling means 165 and is maintained at a constant temperature of 25 to 50 ° C. Similarly, the matrix U26 is also held at a constant temperature of 25 to 50 ° C. Therefore, no thermal expansion and contraction of the matrix L16 during transfer operations, it is possible to fix the mold L12 to the origin position L ₀ through the connecting rod L19. Similarly, it is possible to fix the mold U22 the origin position U ₀ via the connecting rod U29.

  The connecting rod L19 is screwed to the center of the bottom surface of the molding die L12. The other end of the connecting rod L19 has a structure in which a slider 195 that contacts the head portion 19a is supported by a key 197 inserted from four sides of the mounting plate 18. By moving the key 197 back and forth, the slider 195 advances and retreats according to the advance and retreat, and the connecting rod L19 is fixed to the mounting plate 18 in a state where tensile force is applied to the connecting rod L19 but no bending force is applied. Can do. That is, almost no bending force is generated and only a tensile force can be applied. The same applies to the connecting rod U29. In this example, the contact surface between the slider 195 and the key 197 is linear, but can be curved. In the case where the contact surface between the slider 195 and the key 197 is a curved surface, the slider 195 can be a ball-shaped ring, and the key 197 can be easily adjusted.

The tensile force acting on the connecting rod L19 is preferably 500 to 1500N. By applying such a tensile force to the connecting rod L19, the mold 12 can be fixed at the origin position L ₀ even during the transfer molding operation, and the microstructure is peeled off from the mold after the transfer molding operation. also it is possible to fix the mold 12 to the origin position L ₀ in the case. According to this fixing method of the connecting rod L19, as described above, it is not necessary to fix the forming die L12 by pressing the connecting rod L19 with the push bolt 33, and adjustment for fixing the connecting rod. Work becomes easy. The connecting rod U29 of the upper mold 20 is the same as the connecting rod L19.

  The connecting rod can be further provided with connecting rod rotation angle adjusting means that can rotate the connecting rod and adjust the rotation angle of the mold. For example, as shown in FIG. 2, a connecting rod rotation angle adjusting means L35A having a lever 36 joined to the connecting rod L19 and a lock 37 for fixing the lever 36 to the mother die 16 or the mounting plate 18 can be provided. Similarly, the connecting rod rotation angle adjusting means U35B can be provided for the connecting rod U29 of the upper mold 20. The connecting rod rotation angle adjusting means L35A and the connecting rod rotation angle adjusting means U35B can have the same configuration (the connecting rod rotation angle adjusting means 35).

  As described above, this microstructured mold can easily align the mold origin position, keep the mold soaked, and restrain the thermal expansion and contraction of the mold during transfer molding. Alternatively, transfer molding can be performed with the mold origin position fixed in a stationary state. As a result, it is possible to manufacture a fine structure that has been transferred and molded with high accuracy with little displacement and deformation distortion of the fine structures on the front and back surfaces.

10 Lower mold,
11 Stamper, Stamper L
12 Mold, Mold L
123, 125 Heating and cooling means
14 Heat insulation member, heat insulation member L
16 Master L
165 Cooling means
17 Mold base
175 Temperature control means
18 Mounting plate L
19 Connecting rod, connecting rod L
195 slider
197 key
20 Upper mold
21 Stamper U
22 Mold U
223, 225 Heating and cooling means
24 Thermal insulation material U
26 Master U
28 Mounting plate U
29 Connecting rod U
30, 30A, 30B XY direction adjustment means, XY direction adjustment means L, XY direction adjustment means U
33, 33A, 33B, 33C, 33D Push bolt
34 Lock nut
35, 35A, 35B Connecting rod rotation angle adjusting means, connecting rod rotation angle adjusting means L, connecting rod rotation angle adjusting means U
36 lever
37 Lock
43 resin

Claims (8)

A molding die L holding a stamper L having a microstructure L is attached to a mounting plate L via a heat insulating member L and a master die L controlled at a constant temperature in contact with the heating and cooling means L. And lower mold
A molding die U holding a stamper U having a microstructure U is attached to a mounting plate U through a heat insulating member U and a master die U controlled at a constant temperature in contact with the heating and cooling means U. And an upper mold
A microstructure molding mold for manufacturing a microstructure having a microstructure L on the surface of the resin applied to the stamper L and a microstructure U on the back surface by the lower mold and the upper mold. And
In the lower mold, the mold L is rigidly connected thereto and extends in a normal direction, and has a connecting rod L penetrating the heat insulating member L and the mother mold L, and the mother mold L is Adjusting the origin position of the molding die L via the connecting rod L, and having an XY direction adjusting means L that can restrain the molding die L to the adjusted origin position,
In the upper mold, the mold U is rigidly connected thereto and extends in the normal direction, and has a connecting rod U penetrating through the inside of the heat insulating member U and the matrix U, and the matrix U is A microstructure forming mold having an XY direction adjusting means U capable of adjusting an origin position of the molding die L via a connecting rod L and restraining the molding die U at the adjusted origin position. The XY direction adjusting means L includes a push bolt that is screwed into the mother die L and contacts the connecting rod L, and a lock nut that fixes the push bolt to the mother die L.
The XY direction adjusting means U includes a push bolt that is screwed into the mother die U and contacts the connecting rod U, and a lock nut that fixes the push bolt to the mother die U. The microstructure forming mold according to 1.   The connecting rods L and U are characterized by having connecting rod rotation angle adjusting means L and U capable of adjusting the rotation angles L and U around the axis and fixing the adjusted rotation angle. The microstructure forming mold according to claim 1 or 2.   The connecting rods L and U are fixed to the mounting plate L or U in a state in which a bending force is not generated and a tensile force is applied to the connecting rods L and U, respectively. Item 2. A microstructure-molding mold according to the item.   The microstructure forming mold according to claim 4, wherein the tensile force is 500 to 1500N. The heating and cooling means L has a cooling path that circulates in a plane parallel to the mounting surface of the stamper L, and heating elements are arranged in a row so as to sandwich the cooling path.
The heating and cooling means U has a cooling path that circulates in a plane parallel to the mounting surface of the stamper U, and heating elements are arranged in a row so as to sandwich the cooling path. Item 6. The microstructure forming mold according to any one of Items 1 to 5. A lower mold base in which a lower mold base controlled at a constant temperature holds a lower mold holding a lower stamper via a heat insulating material;
This is a microstructure forming method in which an upper mold base controlled at a constant temperature is transferred and molded with a top mold that holds an upper mold holding an upper stamper via a heat insulating material. And
The bottom center part of the lower mold is defined as a lower origin part, and the bottom center part of the upper mold is defined as an upper origin part,
First, after aligning the lower origin part with the upper origin part, the lower origin part is fixed to the lower mold base, and the lower mold base is attached to the lower mold base with no mechanical restraint. And fixing the upper origin to the upper mold base in a state where there is no mechanical constraint other than fixing the upper origin to the upper mold base,
Next, after the molten resin is applied to the lower stamper, the lower mold and the upper mold are closed, and the fine structure of the lower stamper and the upper stamper is transferred and molded on the front and back surfaces of the applied resin. Structure forming method.   The alignment of the upper origin part and the lower origin part is achieved by moving the lower origin part in a plane including the lower origin part or by moving the upper origin part in a plane including the upper origin part. The microstructure forming method according to claim 7, wherein the method is performed.

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