JP2015090932A5 - - Google Patents
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- JP2015090932A5 JP2015090932A5 JP2013230497A JP2013230497A JP2015090932A5 JP 2015090932 A5 JP2015090932 A5 JP 2015090932A5 JP 2013230497 A JP2013230497 A JP 2013230497A JP 2013230497 A JP2013230497 A JP 2013230497A JP 2015090932 A5 JP2015090932 A5 JP 2015090932A5
- Authority
- JP
- Japan
- Prior art keywords
- lens
- cylindrical portion
- pedestal
- optical element
- semiconductor optical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 230000003287 optical Effects 0.000 claims description 17
- 239000004065 semiconductor Substances 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 7
- 230000000149 penetrating Effects 0.000 claims description 3
Description
第１の発明にかかる光モジュールは、
上面を備えたステムと、
前記上面に設けられた台座と、
前記台座に設けられた半導体光素子と、
筒部、および前記筒部の一端に設けられ表面と裏面を有し前記表面と前記裏面を貫通する穴を備えたフタ部を備え、前記筒部の他端が開放し、前記台座および前記半導体光素子に被さるように前記他端が前記上面に接続し、熱膨張材料で形成されたキャップと、
前記フタ部の前記穴に設けられ前記半導体光素子と光結合するレンズと、
を備え、
前記フタ部は、前記キャップの温度が上昇すると前記レンズを前記筒部の内側に押し下げるように膨張することを特徴とする。
An optical module according to a first invention is
A stem with an upper surface;
A pedestal provided on the upper surface;
A semiconductor optical device provided on the pedestal;
A cylindrical portion, and a lid portion provided at one end of the cylindrical portion and having a front surface and a back surface, and a hole penetrating the front surface and the back surface, the other end of the cylindrical portion being opened, and the pedestal and the semiconductor The other end connected to the upper surface so as to cover an optical element, and a cap formed of a thermal expansion material;
A lens provided in the hole of the lid portion and optically coupled to the semiconductor optical element;
With
The lid part may expand so as to push the lens inward of the cylindrical part when the temperature of the cap rises.
Claims (5)
前記上面に設けられた台座と、
前記台座に設けられた半導体光素子と、
筒部、および前記筒部の一端に設けられ表面と裏面を有し前記表面と前記裏面を貫通する穴を備えたフタ部を備え、前記筒部の他端が開放し、前記台座および前記半導体光素子に被さるように前記他端が前記上面に接続し、熱膨張材料で形成されたキャップと、
前記フタ部の前記穴に設けられ前記半導体光素子と光結合するレンズと、
を備え、
前記フタ部は、前記キャップの温度が上昇すると前記レンズを前記筒部の内側に押し下げるように膨張することを特徴とする光モジュール。 A stem with an upper surface;
A pedestal provided on the upper surface;
A semiconductor optical device provided on the pedestal;
A cylindrical portion, and a lid portion provided at one end of the cylindrical portion and having a front surface and a back surface, and a hole penetrating the front surface and the back surface, the other end of the cylindrical portion being opened, and the pedestal and the semiconductor The other end connected to the upper surface so as to cover an optical element, and a cap formed of a thermal expansion material;
A lens provided in the hole of the lid portion and optically coupled to the semiconductor optical element;
With
The optical module is characterized in that when the temperature of the cap rises, the lid part expands so as to push the lens down to the inside of the cylindrical part.
前記レンズは、前記テーパ状となっている前記縁に固定されたことを特徴とする請求項１に記載の光モジュール。 The edge of the hole is tapered so that the diameter increases toward the inside of the cylindrical portion,
The optical module according to claim 1, wherein the lens is fixed to the tapered edge.
前記レンズは、前記縁に固定されたことを特徴とする請求項１に記載の光モジュール。 At least a portion of the front Symbol lid portion so as to protrude toward the inner edge of the hole is the cylindrical portion is recessed inward of the tubular portion,
The optical module according to claim 1, wherein the lens is fixed to the edge.
前記上面に設けられた台座と、
前記台座に設けられた半導体光素子と、
第１側壁部および前記第１側壁部の一端に設けられた第１レンズ保持部を備え、前記台座および前記半導体光素子に被さるように前記第１側壁部の他端が前記上面に接続し、熱膨張材料で形成された内側キャップと、
前記第１レンズ保持部に設けられ前記半導体光素子と光結合する内側レンズと、
第２側壁部および前記第２側壁部の一端に設けられた第２レンズ保持部を備え、前記第２側壁部の他端が開放し、前記内側キャップおよび前記内側レンズに被さるように前記第２側壁部の他端が前記上面に接続し、熱収縮材料で形成された外側キャップと、
前記第２レンズ保持部に設けられ前記内側レンズと光結合する外側レンズと、
を備えることを特徴とする光モジュール。 A stem with an upper surface;
A pedestal provided on the upper surface;
A semiconductor optical device provided on the pedestal;
A first lens holding portion provided at one end of the first sidewall portion and the first sidewall portion, the other end of the first sidewall portion is connected to the upper surface so as to cover the pedestal and the semiconductor optical element; An inner cap formed of a thermally expandable material;
An inner lens provided in the first lens holding portion and optically coupled with the semiconductor optical element;
A second lens holding portion provided at one end of the second side wall portion and the second side wall portion, the second end of the second side wall portion being open and covering the inner cap and the inner lens; An outer cap formed of a heat-shrink material with the other end of the side wall connected to the upper surface;
An outer lens provided in the second lens holding portion and optically coupled to the inner lens;
An optical module comprising:
筒部、および前記筒部の一端に設けられ表面と裏面を有し前記表面と前記裏面を貫通する穴を備えたフタ部を備え、前記筒部の他端が開放し、前記他端が前記上面に接続し、第１熱膨張材料で形成されたキャップと、
前記筒部の内側に配置されて前記裏面に接続し、前記第１熱膨張材料よりも小さな線膨張係数を有する第２熱膨張材料で形成された支持部と、
前記支持部に固定された半導体光素子と、
前記フタ部の前記穴に設けられ前記半導体光素子と光結合するレンズと、
を備えることを特徴とする光モジュール。 A stem with an upper surface;
A cylindrical portion, and a lid portion provided at one end of the cylindrical portion, having a front surface and a back surface, and a hole penetrating the front surface and the back surface, the other end of the cylindrical portion being opened, and the other end being the A cap connected to the upper surface and formed of a first thermal expansion material;
A support portion that is disposed inside the cylindrical portion and connected to the back surface, and is formed of a second thermal expansion material having a smaller linear expansion coefficient than the first thermal expansion material;
A semiconductor optical element fixed to the support;
A lens provided in the hole of the lid portion and optically coupled to the semiconductor optical element;
An optical module comprising:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013230497A JP6209946B2 (en) | 2013-11-06 | 2013-11-06 | Optical module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013230497A JP6209946B2 (en) | 2013-11-06 | 2013-11-06 | Optical module |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2015090932A JP2015090932A (en) | 2015-05-11 |
| JP2015090932A5 true JP2015090932A5 (en) | 2016-11-04 |
| JP6209946B2 JP6209946B2 (en) | 2017-10-11 |
Family
ID=53194317
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013230497A Active JP6209946B2 (en) | 2013-11-06 | 2013-11-06 | Optical module |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP6209946B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6792439B2 (en) | 2016-12-19 | 2020-11-25 | 新光電気工業株式会社 | Cap member and its manufacturing method and light emitting device |
| CN111954961A (en) * | 2018-04-16 | 2020-11-17 | 三菱电机株式会社 | Optical module |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5419757A (en) * | 1977-07-14 | 1979-02-14 | Olympus Optical Co Ltd | Lens prevented from being out of focus due to temperature change |
| JPS5821706A (en) * | 1981-07-31 | 1983-02-08 | Nec Corp | Optical system for transmission of light |
| JPH04226095A (en) * | 1990-04-27 | 1992-08-14 | Omron Corp | Semiconductor light emitting device |
| JPH0479391A (en) * | 1990-07-23 | 1992-03-12 | Nec Corp | Semiconductor laser module |
| JPH06138356A (en) * | 1992-10-23 | 1994-05-20 | Sony Corp | Optical space transmission device |
| JP3183089B2 (en) * | 1995-03-30 | 2001-07-03 | 三菱電機株式会社 | Optical radar device |
| JP3475672B2 (en) * | 1996-09-06 | 2003-12-08 | オムロン株式会社 | Optical module, laser radar device using the optical module, vehicle, photoelectric sensor |
| JP2002329916A (en) * | 2001-04-27 | 2002-11-15 | Ricoh Co Ltd | Optical device, optical pickup and information recording device |
| JP2003262777A (en) * | 2002-03-07 | 2003-09-19 | Konica Corp | Photographing equipment |
| JP2004342968A (en) * | 2003-05-19 | 2004-12-02 | Matsushita Electric Ind Co Ltd | Light transmission cap |
| JPWO2005003820A1 (en) * | 2003-07-08 | 2006-08-17 | 松下電器産業株式会社 | Beam shaping optical device, optical head, and optical information medium driving device |
| JP2006113176A (en) * | 2004-10-13 | 2006-04-27 | Konica Minolta Holdings Inc | Lens element |
| US7680161B2 (en) * | 2005-09-09 | 2010-03-16 | Optoelectronics Co., Ltd. | Temperature compensated laser focusing optics |
| JP5455516B2 (en) * | 2009-09-11 | 2014-03-26 | キヤノン株式会社 | Support apparatus, optical apparatus, transfer apparatus, and device manufacturing method |
-
2013
- 2013-11-06 JP JP2013230497A patent/JP6209946B2/en active Active
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