JP2015087480A - Display device and method for manufacturing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To solve such problems that with reduction in a frame width of a liquid crystal panel and with a higher definition, wiring density in a sealing region is further increased while UV light irradiation for temporary curing of a sealing material is insufficient, which induces cracks due to the pressure of a liquid crystal in an initial stage of full curing, and further induces reduction in a yield and reduction in reliability due to interruption in the sealing.SOLUTION: A display device is configured to have a curved reflection region or a scattering or refractive region in an end of a wide wiring line on an array substrate or in a slit-like opening in a wiring line, in a region interposed between a wiring layer of the array substrate and a light-shielding layer of a counter substrate.

Description

  The present disclosure relates to a display device and can be applied to, for example, a display device in which wiring is located in a seal region.

  In the sealing region where the TFT substrate and the CF substrate are bonded together, there is a problem that the wide wiring portion is not sufficiently irradiated with ultraviolet (UV) light for pre-curing the sealing material.

  On the other hand, the wiring having a wide seal region is provided with openings such as slits and holes, and the seal material is irradiated with UV light to improve the efficiency of temporary curing of the seal. A liquid crystal display device having an opening at a portion where the sealing material and the electrode line intersect is disclosed in Japanese Patent Laid-Open No. 11-85057 (Patent Document 1).

JP-A-11-85057

As the frame width of the liquid crystal panel becomes narrower and the definition becomes higher, the wiring density in the seal area becomes larger, the UV light irradiation for temporarily curing the seal material becomes insufficient, and the initial stage of the main curing with heat Therefore, insertion due to the pressure of the liquid crystal occurs, which causes a decrease in yield and reliability due to the seal being broken.
The subject of this indication is providing the display apparatus which increases the UV light irradiated to a sealing material.
Other problems and novel features will become apparent from the description of the present disclosure and the accompanying drawings.

The outline of a representative one of the present disclosure will be briefly described as follows.
That is, the display device has a curved surface in a region sandwiched between the wiring layer of the array substrate and the light shielding layer of the opposing substrate at the end of the wide wiring of the array substrate or the slit-shaped opening of the wiring. A reflective region or a scattering / refractive region is provided.

  According to the display device, it is possible to increase the UV light applied to the sealing material.

It is a top view which shows the structure of a display apparatus. It is the figure which expanded a part of FIG. 1A, (a) is a top view, (b) is sectional drawing. It is a figure explaining UV light not fully irradiated to the seal | sticker area | region of the display apparatus which concerns on a comparative example, (a) is a top view of a seal | sticker area | region, (b) is sectional drawing of a seal | sticker area | region. It is a figure explaining UV light being fully irradiated to the seal | sticker area | region of the display apparatus which concerns on embodiment, (a) is a top view of a seal | sticker area | region, (b) is sectional drawing of a seal | sticker area | region. It is a figure which shows the seal | sticker area | region of the display apparatus which concerns on Example 1, (a) is a top view, (b) is sectional drawing. 6 is a cross-sectional view illustrating a method for manufacturing the curved reflecting portion of the display device according to the first embodiment. FIG. 6 is a cross-sectional view illustrating a method for manufacturing the curved reflecting portion of the display device according to the first embodiment. FIG. 6 is a cross-sectional view illustrating a method for manufacturing the curved reflecting portion of the display device according to the first embodiment. FIG. 6 is a cross-sectional view illustrating a method for manufacturing the curved reflecting portion of the display device according to the first embodiment. FIG. 6 is a cross-sectional view illustrating a method for manufacturing the curved reflecting portion of the display device according to the first embodiment. FIG. 6 is a cross-sectional view illustrating a method for manufacturing the curved reflecting portion of the display device according to the first embodiment. FIG. It is a figure which shows the seal | sticker area | region of the display apparatus which concerns on the modification 1, (a) is a top view, (b) is sectional drawing. 11 is a plan view of a seal area of a display device according to modification example 2. FIG. 14 is a cross-sectional view of a curved reflection portion of a display device according to Modification 3. FIG. It is sectional drawing of the curved surface reflection part of the display apparatus which concerns on the modification 4. It is a figure which shows the seal | sticker area | region of the display apparatus which concerns on Example 2, (a) is a top view, (b) is sectional drawing. 6 is a cross-sectional view illustrating a method for manufacturing a scattering / refractive portion of a display device according to Example 2. FIG. 6 is a cross-sectional view illustrating a method for manufacturing a scattering / refractive portion of a display device according to Example 2. FIG. 6 is a cross-sectional view illustrating a method for manufacturing a scattering / refractive portion of a display device according to Example 2. FIG. 6 is a cross-sectional view illustrating a method for manufacturing a scattering / refractive portion of a display device according to Example 2. FIG. 6 is a cross-sectional view illustrating a method for manufacturing a scattering / refractive portion of a display device according to Example 2. FIG. 6 is a cross-sectional view illustrating a method for manufacturing a scattering / refractive portion of a display device according to Example 2. FIG. It is a figure which shows the seal | sticker area | region of the display apparatus which concerns on the modification 5, (a) is a top view, (b) is sectional drawing. 14 is a plan view of a seal area of a display device according to modification example 6. FIG.

Hereinafter, embodiments, examples, and modifications will be described with reference to the drawings. However, in the following description, the same components are denoted by the same reference numerals, and repeated description is omitted.
The configuration of the outer periphery of the display device will be described with reference to FIGS. 1A and 1B.
FIG. 1A is a plan view showing a configuration of a display device. 1B is an enlarged view of a region B in FIG. 1A, (a) is a plan view, and (b) is a cross-sectional view taken along line AA ′ shown in (a).
The display device 10 includes a TFT substrate 11 and a CF substrate 12. The sealing material 15 for bonding the TFT substrate 11 and the CF substrate 12 is located in the sealing region 15A between the inner end 15i and the outer end 15o. The sealing material 15 is located outside the active region 13. The wide wiring 14 (wiring area 14A) overlaps with the seal area 15A and is located outside the active area 13. The wiring region 14A and the seal region 15A are located outside the active region outer end 13o. That is, the wiring 14 and the sealing material 15 are covered with the outermost light shielding layer BM16.

  The distance from the end of the display device 100 to the outer end 15o of the seal region is L1, the distance to the outer end of the wiring region 14A is L2, the distance to the inner end 15i of the seal region is L3, and the inner end of the wiring region 14A Is L4, and the distance to the active region outer edge 13o is L5. For example, L1 is 0 to 200 μm, L2 is 100 to 400 μm, L3 is 300 to 1200 μm, L4 is 400 to 1800 μm, and L5 is 450 to 2000 μm. 1A and 1B show a case in which a part of the wiring region 14A and a part of the seal region 15A overlap each other. However, wiring is performed as in comparative examples, embodiments, examples, and modifications described later. All of the region 14A may be included in the seal region 15A.

  Wirings 14 and 18 are formed on the TFT substrate 11 and covered with an organic photosensitive interlayer film 17. A sealing material 15 and a liquid crystal layer 19 are formed on the organic photosensitive interlayer film 17. The organic photosensitive interlayer film 17 has an opening, and the sealing material 15 is also formed in the opening. The thickness t1 of the organic photosensitive interlayer film 17 is, for example, 2 to 3 μm. A light shielding layer 16 and a color filter are formed on the CF substrate 12 (below in FIG. 1B). A photo spacer (column spacer) 20 is formed between the light shielding layer 16 and the organic photosensitive interlayer film 17. An alignment film (not shown) is formed on both the TFT substrate 11 and the CF substrate 12, and the liquid crystal layer 19 is sandwiched between the alignment films.

<Comparative example>
FIG. 2 is used to explain that in a seal region where a TFT substrate and a CF substrate are bonded together, a wide wiring portion is not sufficiently irradiated with UV light for temporarily curing the seal material. It is a figure explaining UV light not fully irradiated to the seal | sticker area | region of such a display apparatus, (a) is a top view seen from the TFT substrate side of a seal | sticker area | region, (b) is A- shown by (a). It is sectional drawing of the seal | sticker area | region in A 'line.
As shown in FIG. 2A, the width of the sealing material 15 is wider than the width of the wiring 14a. When the TFT substrate 11 and the CF substrate 12 are bonded together, the light shielding layer 16 is provided on the sealing material 15. Therefore, when the sealing material 15 is temporarily cured with UV light, the UV light 22 is irradiated from the back side of the TFT substrate 11. Will do. Since the wiring 14a is a power supply or ground wiring, it is a wide and low resistance wiring, and for example, a metal (light-shielding film) such as aluminum or aluminum laminated with a barrier metal is used. Metal does not transmit UV light. Therefore, in the display device 10A according to the comparative example, the opening portion 21a is provided in the wiring 14a so that the UV light 22 is irradiated to the sealing material 15 as much as possible. Here, the width of the sealing material is 500 μm, the width of the wiring 14 a is 200 μm, and the size of the opening 21 a is 10 μm × 5 μm.

  However, as shown in FIG. 2B, the shadow area of the wiring 14 is not irradiated with the UV light 22, and the UV light non-irradiated area 23 exists, and the temporary curing becomes insufficient. Although the UV light non-irradiation region 23 can be reduced by increasing the opening 21a, the resistance of the wiring 14a increases. Therefore, the opening 21a cannot be made too large.

<Embodiment>
The configuration of the display device according to the embodiment and the fact that the UV light is sufficiently irradiated to the seal region as compared with the display device according to the comparative example will be described with reference to FIG.
3A and 3B are diagrams for explaining that the UV light is sufficiently applied to the seal region of the display device according to the embodiment. FIG. 3A is a plan view of the seal region viewed from the TFT substrate side, and FIG. It is sectional drawing of the seal | sticker area | region in the AA 'line shown by (a). (A) is a top view of a seal | sticker area | region, (b) is sectional drawing of a seal | sticker area | region.
The display device according to the embodiment is obtained by adding a curved reflection portion at the wiring end or opening to the display device 10A according to the comparative example.

  The display device 10B shown in FIG. 3 is a portion that is in contact with the sealing material 15, and includes a reflective portion 31a in the hole-like opening 21a of the wiring 14a and a portion adjacent to the outside of the end of the wiring 14a. A reflecting portion 31b is installed in parallel with the wiring end. Here, the width of the sealing material is 500 μm, the width of the wiring 14 a is 200 μm, the size of the opening 21 a is 10 μm × 5 μm, the size of the reflecting portion 31 a is 8 μm × 4 μm, and the width of the reflecting portion 31 b is 30 μm.

  The UV light 22 reflected by the reflecting portions 31a and 31b may be reflected directly or by the wiring 14a and wrap around the back side of the wiring 14a to make the UV light non-irradiated region 23 smaller than the display device 10A according to the comparative example. it can. Although FIG. 3 shows a case where the wiring end and the opening have a curved reflection part, it is sufficient that either the wiring end or the opening has a curved reflection part. In addition, it has the same effect even if it is a scattering and refraction part instead of the reflection parts 31a and 31b.

  In summary, at the end of the wide wiring of the array substrate or the slit-shaped opening of the wiring, the curved reflection region is located in the region sandwiched between the wiring layer of the array substrate and the light shielding layer of the opposing substrate. Alternatively, scattering and refraction areas are provided.

  The UV light that has passed through the opening of the wiring is reflected and scattered in the curved reflection area, or scattered and refracted in the refracting area and wraps around the back side of the wiring, and the sealing material that is behind the wiring Also, the efficiency of temporary curing is improved. In addition, since the area of the opening of the wiring can be reduced, an increase in wiring resistance can be suppressed.

A display device according to Example 1 will be described with reference to FIG.
4A and 4B are diagrams illustrating a seal region of the display device according to the first embodiment, in which FIG. 4A is a plan view of the seal region viewed from the TFT substrate side, and FIG. 4B is a line AA ′ illustrated in FIG. It is sectional drawing of the seal | sticker area | region in.
In the display device 10C according to the first embodiment, the hole-shaped curved reflection portion 41a is provided in the hole-shaped opening 21a of the wiring 14a on the organic photosensitive interlayer film 17 in contact with the sealing material 15, and the wiring 14a. A groove-like curved reflection portion 41b is installed in a portion adjacent to the outside of the end portion in parallel with the wiring end. The hole-shaped curved reflecting portion 41a has an elliptical shape in plan view and a semi-ring shape in sectional view. The groove-like curved reflecting portion 41b has a rectangular shape in plan view and a semi-ring shape in sectional view. A material that reflects UV light, such as metal, is used for the curved reflecting portions 41a and 41b. Here, the width of the sealing material is 500 μm, the width of the wiring 14 is 200 μm, the size of the opening 21 a is 10 μm × 5 μm, the size of the curved reflecting portion 41 a is 8 μm × 4 μm, and the width of the curved reflecting portion 41 b is 30 μm. .

  Next, a method for manufacturing the curved reflecting portion of the display device according to the first embodiment will be described with reference to FIGS. 9A to 9F.

  5A, FIG. 5B, FIG. 5C, FIG. 5D, FIG. 5E, and FIG. 5F are cross-sectional views illustrating a method of manufacturing the curved reflecting portion of the display device according to the first embodiment.

As shown in FIG. 5A, an organic photosensitive interlayer film 17 is formed on the wiring 14a. The organic photosensitive interlayer film 17 is half-tone exposed with UV light 52 (FIG. 5B), developed, melt baked, and post-baked to form holes 51a and grooves 51b in the organic photosensitive interlayer film 17 (FIG. 5C). As shown in FIG. 5D, a metal 53 is formed on the organic photosensitive interlayer film 17 in which the holes 51a and the grooves 51b are formed. A resist pattern 54 is formed by lithography (FIG. 5E), and etching and resist removal are performed to form a hole-like curved reflection portion 41a and a groove-like curved reflection portion 41b (FIG. 5F).
<Modification 1>
A modification (modification 1) of the display device according to the first embodiment will be described with reference to FIG.
6A and 6B are diagrams showing a seal region of a display device according to the first modification, wherein FIG. 6A is a plan view of the seal region viewed from the TFT substrate side, and FIG. 6B is a line AA ′ shown in FIG. It is sectional drawing of the seal | sticker area | region in.
In the display device 10D according to the first modification, the groove-like curved reflection is provided on the organic photosensitive interlayer film 17 in contact with the sealing material 15 and in the slit-like opening 21b of the wiring 14b in parallel with the longitudinal direction of the slit. A groove-like curved reflecting portion 41b is installed in a portion of the portion 61a adjacent to the outside of the end of the wiring 14b in parallel with the wiring end. The groove-like curved reflection portion 61b has a rectangular shape in a plan view and a semi-ring shape in a cross-sectional view. A material that reflects UV light, such as metal, is used for the curved reflecting portion 61b. Here, the term “slit” refers to a slit in which the ratio of the length in the longitudinal direction of the opening to the length (width) in the short direction of the opening is greater than 2: 1.

<Modification 2>
A modification (modification 2) of the display device according to the first embodiment will be described with reference to FIG.
FIG. 7 is a plan view of the seal region of the display device according to the second modification viewed from the TFT substrate side.
The display device 10E according to the modification 2 replaces the slit-shaped opening 21b of the wiring 14b of the display device 10D according to the modification 1 with the hole-shaped opening 21c, and forms a groove parallel to the longitudinal direction of the opening 21c. The curved reflection part 71b is installed. The groove-like curved reflecting portion 71b has a rectangular shape in plan view and a semi-ring shape in sectional view. A material that reflects UV light, such as metal, is used for the curved reflecting portion 71b. Here, the term “hole” means that the ratio of the length in the longitudinal direction of the opening to the length (width) in the short direction of the opening is 2: 1 or less.

<Modification 3>
A modification example (modification example 3) of the display device according to Example 1, Modification Example 1 and Modification Example 2 will be described with reference to FIG.
FIG. 8 is a cross-sectional view of a curved reflection portion of a display device according to Modification 3. The curved surface reflecting portions 41a, 41b, 61b, 71b of the display devices according to the first example, the first modified example, and the second modified example have a semi-ring shape in a cross-sectional view. A metal opening 82 is provided. UV light can also be irradiated to the back side of the curved reflecting portion.

<Modification 4>
A modification (Modification 4) of the display device according to Example 1, Modification 1 and Modification 2 will be described with reference to FIG.
FIG. 9 is a cross-sectional view of a curved reflecting portion of a display device according to Modification 4. The curved surface reflecting portions 41a, 41b, 61b, 71b of the display devices according to the first embodiment, the first modified example, and the second modified example have a semi-ring shape in cross-sectional view, but in the modified example 4, the active region 13 of the curved reflecting portion. Remove the metal on the side. The stray light of UV light harmful to the active region 13 can be reduced.

A display device according to Example 2 will be described with reference to FIG.
10A and 10B are diagrams illustrating a seal region of the display device according to the second embodiment, in which FIG. 10A is a plan view of the seal region viewed from the TFT substrate side, and FIG. 10B is a line AA ′ illustrated in FIG. It is sectional drawing of the seal | sticker area | region in.
In the display device 10F according to the second embodiment, a hole-shaped curved scattering / refracting portion 41Aa is provided on the organic photosensitive interlayer film 17 in contact with the sealing material 15 and in the hole-shaped opening 21a of the wiring 14a. A groove-like curved scattering / refracting portion 41Ab is provided in a portion adjacent to the outside of the end portion 14a in parallel with the wiring end. The hole-like curved scattering / refracting portion 41Aa has an elliptical shape in plan view and a semi-ring shape in sectional view. The groove-like curved scattering / refracting portion 41Ab has a rectangular shape in a plan view and a semi-ring shape in a sectional view. A material that scatters UV light such as SiN or ITO having a refractive index of about 2 is used for the curved surface scattering / refractive portions 41Aa and 41Ab. Here, the width of the sealing material is 500 μm, the width of the wiring 14 is 200 μm, the size of the opening 21a is 10 μm × 5 μm, the size of the curved scattering / refracting portion 41Aa is 8 μm × 4 μm, and the width of the curved scattering / refracting portion 41Ab. Is 30 μm.

Next, a method for manufacturing the curved reflecting portion of the display device according to the second embodiment will be described with reference to FIGS. 11A to 11F.
11A, 11B, 11C, 11D, 11E, and 11F are cross-sectional views illustrating a method of manufacturing the curved reflecting portion of the display device according to the second embodiment.
As shown in FIG. 11A, an organic photosensitive interlayer film 17 is formed on the wiring 14a. The organic photosensitive interlayer film 17 is half-tone exposed with UV light 52 (FIG. 11B), developed, melt baked, and post-baked to form holes 51a and grooves 51b in the organic photosensitive interlayer film 17 (FIG. 11C). As shown in FIG. 11D, SiN or ITO 53A is formed on the organic photosensitive interlayer film 17 in which the holes 51a and the grooves 51b are formed. A resist pattern 54 is formed by lithography (FIG. 11E), and etching and resist removal are performed to form a hole-shaped curved scattering / refracting portion 41Aa and a groove-shaped curved scattering / refracting portion 41Ab (FIG. 11F).
<Modification 5>
A modification (modification 5) of the display device according to the second embodiment will be described with reference to FIG.
12A and 12B are diagrams showing a seal region of a display device according to the modification 5. FIG. 12A is a plan view of the seal region viewed from the TFT substrate side, and FIG. 12B is a line AA ′ shown in FIG. It is sectional drawing of the seal | sticker area | region in.
The display device 10G according to the modified example 5 has an organic photosensitive interlayer film 17 in contact with the sealing material 15, and the slit-like opening 21b of the wiring 14b has a groove-like curved surface scattering parallel to the longitudinal direction of the slit. A groove-like curved scattering / refracting portion 41Ab is installed in a portion adjacent to the outside of the end of the wiring 14b where the refracting portion 61Ab is parallel to the wiring end. The groove-like curved scattering / refracting portion 61Ab has a rectangular shape in plan view and a semi-ring shape in sectional view, like the curved scattering / refracting portion 41Ab. For the curved surface scattering / refracting portion 61Ab, a material that scatters UV light, such as SiN or ITO having a refractive index of about 2, is used as in the curved surface scattering / refracting portion 41Ab.

<Modification 6>
A modification (modification 6) of the display device according to the second embodiment will be described with reference to FIG.
FIG. 13 is a plan view of the seal region of the display device according to the modification 6 as viewed from the TFT substrate side.
In the display device 10H according to the modified example 6, the slit-shaped opening 21b of the wiring 14b of the display device 10G according to the modified example 5 is replaced with a hole-shaped opening 21c, and the groove shape is parallel to the longitudinal direction of the opening 21c. The curved surface scattering / refracting part 71Ab is installed. The groove-like curved scattering / refracting portion 71Ab has a rectangular shape in a plan view and a semi-ring shape in a sectional view. A material that scatters UV light such as SiN or ITO having a refractive index of about 2 is used for the curved surface scattering / refractive portion 71Ab.

  As mentioned above, the invention made by the present inventor has been specifically described based on the embodiments, examples, and modifications. However, the present invention is not limited to the above-described embodiments, examples, and modifications. It goes without saying that various changes can be made.

10, 10A, 10B, 10C, 10D, 10E, 10F, 10G, 10H... Display device 11... TFT substrate 12 .. counter substrate 13... Active region 13o. 14a, 14b ... wiring 14A ... wiring region 15 ... sealing material 15A ... sealing region 15i ... inner end 15o of sealing region ... outer end 16 of sealing region ... outermost periphery Shading layer (black matrix)
17 ... Organic photosensitive interlayer 18 ... Wiring 19 ... Liquid crystal layer 20 ... Photo spacer (column spacer)
21a, 21b ... opening 22 ... UV light 23 ... UV light non-irradiated area 31a ... reflective part 31b ... reflective part

Claims (18)

The display device
A first substrate;
A second substrate;
A sealing material for bonding the first substrate and the second substrate;
With
The first substrate includes a wiring layer having an opening,
The second substrate includes a light shielding layer;
The wiring layer has a region overlapping the sealing material in plan view,
A reflection part or a scattering / refractive part is provided in a region sandwiched between the wiring layer and the light-shielding layer at the end of the wiring layer or the opening of the wiring layer. The display device according to claim 1.
The end portion of the wiring layer has a groove-like curved reflection portion,
The opening of the wiring layer has a hole-like curved reflecting portion. The display device according to claim 1.
An end portion of the wiring layer has a groove-like curved reflection portion,
The opening of the wiring layer has a groove-like curved reflecting portion. The display device according to claim 3.
The opening of the wiring layer has a slit shape. The display device according to claim 3.
The opening of the wiring layer has a hole shape. The display device according to claim 2.
The curved reflecting portion has an opening at the top. The display device according to claim 2.
An active region side of the curved reflecting portion has an opening. The display device according to claim 1.
The end portion of the wiring layer has a groove-like curved scattering / refracting portion,
The opening of the wiring layer has a hole-like curved scattering / refracting portion. The display device according to claim 1.
The end of the wiring layer has a groove-like curved scattering / refracting part,
The opening of the wiring layer has a groove-like curved scattering / refracting portion. The display device according to claim 9.
The opening of the wiring layer has a slit shape. The display device according to claim 9.
The opening of the wiring layer has a hole shape. The display device according to claim 1.
An organic photosensitive interlayer film between the wiring layer and the sealing material;
The reflection part or the scattering / refracting part is formed on the organic photosensitive interlayer film. The display device according to claim 1.
The wiring layer is in a region where the sealing material is disposed in a plan view. The display device according to claim 1.
There is a liquid crystal layer between the first substrate and the second substrate. The manufacturing method of the display device is as follows:
(A) forming an organic photosensitive interlayer film on the wiring layer;
(B) forming a hole in the organic photosensitive interlayer film;
(C) forming a metal, SiN or ITO on the organic photosensitive interlayer film in which the hole is formed;
(D) patterning the metal or SiN or ITO to form a hole-like curved reflection portion or curved scattering portion;
Have In the manufacturing method of the display device according to claim 15,
In the step (b), a groove is formed in the organic photosensitive interlayer film,
In the step (c), a metal, SiN, or ITO is formed on the organic photosensitive interlayer film in which the groove is formed,
In the step (d), the metal, SiN, or ITO is patterned to form a groove-like curved reflecting portion or curved scattering portion. In the manufacturing method of the display device according to claim 15,
Holes are formed in the organic photosensitive interlayer film by halftone exposure. In the manufacturing method of the display device according to claim 16,
Grooves are formed in the organic photosensitive interlayer film by halftone exposure.

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