JP2015087207A - Vibration characteristics detection method, vibration characteristics adjustment method, and vibration element - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a vibration characteristics detection method capable of more accurately detecting a leakage output while suppressing deterioration of an element, to provide a vibration characteristics adjustment method capable of adjusting the leakage output so as to more accurately cancel out the leakage output, and to provide a vibration element capable of more accurately detecting the leakage output while suppressing the deterioration of the element.SOLUTION: A vibration characteristics detection method includes: a wafer processing step of forming a sensing vibration piece 58 and an imparting vibration piece 59 in the same wafer 9; and a leakage output detection step of applying a voltage to a driving electrode of the imparting vibration piece 59, exciting vibration in a drive mode and detecting vibration in a detection mode in a direction crossing a vibration direction in the drive mode in a detecting electrode. Further, it is preferable that an extension direction of the imparting vibration piece 59 is the same as an extension direction of a driving vibration arm of the sensing vibration piece 58.

Description

  The present invention relates to a vibration characteristic detection method, a vibration characteristic adjustment method, and a vibration element.

  The vibration element is used for, for example, vehicle body control in a vehicle, detection of a vehicle position of a car navigation system, vibration control correction (so-called camera shake correction) of a digital camera, a video camera, etc., and detects physical quantities such as angular velocity and acceleration. Sensors are known. As a sensor, for example, an angular velocity sensor (vibration gyro sensor) is known (see, for example, Patent Document 1).

For example, a vibration gyro sensor described in Patent Document 1 includes a base, a connecting arm extending from the base, a driving arm extending from the tip of the connecting arm, and a detection arm extending from the base. Prepare. When such a vibration gyro sensor receives an angular velocity in a predetermined direction in a state where the drive arm is bent and vibrated, a Coriolis force acts on the drive arm, and accordingly, the detection arm is bent and vibrated. By detecting such bending vibration of the detection arm, the angular velocity can be detected.
The base and drive arm of such a vibration gyro sensor are formed of, for example, a piezoelectric material. And a base part and a drive arm are formed by processing a piezoelectric material using a photolithographic technique and an etching technique.

  However, due to the etching anisotropy of piezoelectric materials and variations in processing processes, the cross-sectional shape of the base and drive arm may not be rectangular, but may be parallelograms, rhombuses, or other irregular shapes. . When such an unintended shape change occurs, the vibration direction of the drive arm deviates from the design value, and so-called leakage output (vibration leakage) occurs. This leak output is a vibration of a component orthogonal to the vibration direction of the drive mode of the drive arm that occurs in a state where no angular velocity is received, and such a leak output is a cause of reducing the detection sensitivity of the vibration gyro sensor. Become.

In Patent Document 2, an alignment shift between the mask placed on the front surface of the wafer (piezoelectric material) and the mask placed on the back surface at the time of etching is the cause of the shape change described above. Has been suggested. In addition, Patent Document 2 discloses a vibrator including a base, a pair of drive vibration systems, and a pair of detection vibration systems, and includes a drive-side signal pad and a drive-side ground pad provided on the base. , A transducer including a detection-side signal pad and a detection-side ground pad is disclosed. In this vibrator, a voltage signal is applied to the drive side signal pad and the detection side ground pad provided on the base to excite the drive vibration system, and each potential with respect to the detection side signal pad and the detection side ground pad is output as an output signal. Take out as. And it is disclosed that the leak output is detected based on the magnitude relationship between the extracted detection frequency and drive frequency.
Further, it is disclosed that the mass of the drive vibration piece is adjusted based on the detected leak output to reduce the unbalance of the drive vibration.

JP 2006-105614 A JP 2005-37235 A

However, in the vibrator described in Patent Document 2, although each potential with respect to the detection-side signal pad and the detection-side ground pad is extracted as an output signal, the signal is very weak. For this reason, the leak output cannot be accurately detected, and it is difficult to sufficiently reduce the unbalance of the drive vibration.
Further, when the voltage signal applied to the drive side signal pad and the detection side ground pad is increased in order to increase the output signal, there is a concern that the vibration piece is deteriorated and the function and performance of the vibration gyro sensor are lowered.
An object of the present invention is to provide a vibration characteristic detection method capable of more accurately detecting a leak output while suppressing deterioration of the element, a vibration characteristic adjustment method adjustable to cancel the leak output more accurately, and deterioration of the element. It is an object of the present invention to provide a vibration element capable of more accurately detecting a leakage output while suppressing the above-mentioned.

SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following application examples.
[Application Example 1]
The vibration characteristic detection method of the present invention is a method for detecting the vibration characteristic of a vibration element having a sensing resonator element,
Forming on the same wafer the sensing vibrating piece and an additional vibrating piece including a driving electrode to which a driving voltage is applied and a detection electrode for detecting charges generated by the vibration accompanying the application of the driving voltage. And a process of
Applying a voltage to the driving electrode of the additional vibrating piece to excite the vibration, and detecting the vibration in a direction intersecting the direction of the vibration with the detection electrode;
It is characterized by having.
As a result, the leakage output can be detected using an additional vibrating piece different from the sensing vibrating piece, so that the leakage output can be detected more accurately while suppressing deterioration of the element of the sensing vibrating piece. it can.

[Application Example 2]
In the vibration characteristic detecting method of the present invention, the sensing vibrating piece includes a driving vibrating arm that drives and vibrates,
The extending direction of the additional vibrating piece is preferably the same as the extending direction of the driving vibrating arm.
As a result, the manufacturing history of the driving vibrating arm and the manufacturing history of the additional vibrating piece become closer. As a result, the estimation accuracy of the leakage output of the sensing vibrating piece estimated by exciting the additional vibrating piece becomes higher, and the leakage output of the driving vibrating arm can be estimated more accurately.

[Application Example 3]
In the vibration characteristic detection method of the present invention, it is preferable that a voltage higher than a rated voltage of the sensing vibrating piece is applied to the driving electrode of the additional vibrating piece.
As a result, the amplitude of the additional vibrating piece that vibrates in the drive mode can be increased, and the amount of charge generated with the leakage output also increases. As a result, the absolute value of the charge amount can be increased, and even a minute leak output can be accurately detected with high sensitivity.

[Application Example 4]
In the vibration characteristic detection method of the present invention, the additional vibrating piece includes a first surface, a second surface that is the surface opposite to the first surface, and a side surface that connects the first surface and the second surface. Have
Preferably, the driving electrode is provided on each of the first surface, the second surface, and the side surface, and each of the detection electrodes is provided on the first surface and the side surface.
As a result, the additional vibrating piece can be reduced in size, and the manufacturing ease of the sensing vibrating piece is increased.

[Application Example 5]
In the vibration characteristic detection method of the present invention, it is preferable that a plurality of the sensing vibrating pieces and at least one additional vibrating piece are formed on the wafer.
As a result, the area occupied by the additional vibrating piece can be minimized, so that the number of sensing vibrating pieces on the wafer can be secured to the maximum.

[Application Example 6]
In the vibration characteristic detection method of the present invention, it is preferable that the frequency of the additional vibrating piece is different from the frequency of the sensing vibrating piece.
Accordingly, when the additional vibrating piece is vibrated, the sensing vibrating piece is also excited, thereby preventing a deviation in the detection result of the leak output.

[Application Example 7]
In the vibration characteristic adjustment method of the present invention, the vibration characteristic of the vibration element having a sensing resonator element is adjusted,
Forming on the same wafer the sensing vibrating piece and an additional vibrating piece including a driving electrode to which a driving voltage is applied and a detection electrode for detecting charges generated by the vibration accompanying the application of the driving voltage. And a process of
Applying a voltage to the driving electrode of the additional vibrating piece to excite the vibration, and detecting the vibration in a direction intersecting the direction of the vibration with the detection electrode;
Adjusting a vibration characteristic of the sensing vibrating piece based on the detected vibration;
It is characterized by having.
Accordingly, by using the additional vibrating piece, it is possible to more accurately detect the leakage output while suppressing deterioration of the element of the sensing vibrating piece, so that the leakage output of the sensing vibrating piece can be canceled more accurately. The vibration element can be adjusted.

[Application Example 8]
In the vibration characteristic adjusting method of the present invention, the sensing vibrating piece includes a driving vibrating arm that drives and vibrates, and an adjusting vibrating arm that vibrates with the driving vibrating arm,
It is preferable to adjust the vibration characteristics of the sensing vibrating piece by changing the amount of charge generated from the adjusting vibrating arm and reducing the leakage output of the driving vibrating arm.
Thereby, the zero point output of the vibration element can be brought close to zero, and a vibration element with higher sensitivity can be obtained.

[Application Example 9]
The vibrating element of the present invention includes a sensing vibrating piece,
A vibrating piece formed integrally with the sensing vibrating piece, a driving electrode to which a driving voltage is applied, and a detection electrode that detects vibration in a direction crossing the direction of the vibration accompanying the application of the driving voltage. An additional vibrating piece comprising:
It is characterized by having.
As a result, it is possible to obtain a vibration element that can more accurately detect the leakage output while suppressing deterioration of the element.

It is typical sectional drawing which shows schematic structure of a sensor device provided with embodiment of the vibration element of this invention. It is a top view of the sensor device shown in FIG. It is a top view which shows the vibration element with which the sensor device shown in FIG. 1 was equipped. 4A is an enlarged plan view of the drive vibration arm of the vibration element shown in FIG. 3, and FIG. 4B is a cross-sectional view of the drive vibration arm shown in FIG. 4A. 5A is an enlarged plan view of the vibrating arm for detection of the vibrating element shown in FIG. 3, and FIG. 5B is a cross-sectional view of the vibrating arm for detection shown in FIG. 6A is an enlarged plan view of the adjustment vibration arm of the vibration element shown in FIG. 3, and FIG. 6B is a cross-sectional view of the adjustment vibration arm shown in FIG. 6A. It is a figure which shows the connection state of the electrode for a detection and the electrode for adjustment in the vibration element shown in FIG. It is a figure for demonstrating operation | movement of the vibration element shown in FIG. FIG. 9A is a diagram showing the leakage output of the detection electrode shown in FIG. 5, and FIG. 9B is a diagram showing the output of the adjustment electrode shown in FIGS. FIG. 10A is an enlarged plan view of the additional vibrating piece of the vibrating element shown in FIG. 3, and FIG. 10B is a cross-sectional view of the additional vibrating piece shown in FIG. It is a figure for demonstrating embodiment of the vibration characteristic detection method of this invention. It is another figure for demonstrating embodiment of the vibration characteristic detection method of this invention. 1 is a perspective view illustrating a configuration of a mobile (or notebook) personal computer including a vibration element of the present invention. It is a perspective view which shows the structure of a mobile telephone (PHS is also included) provided with the vibration element of this invention. It is a perspective view which shows the structure of a digital still camera provided with the vibration element of this invention.

Hereinafter, a vibration characteristic detection method, a vibration characteristic adjustment method, and a vibration element of the present invention will be described in detail based on preferred embodiments shown in the accompanying drawings.
<Sensor device>
Next, a sensor device including an embodiment of the vibration element of the present invention will be described.
FIG. 1 is a schematic cross-sectional view showing a schematic configuration of a sensor device including an embodiment of the vibration element of the present invention, FIG. 2 is a plan view of the sensor device shown in FIG. 1, and FIG. 3 is a sensor device shown in FIG. FIG. 4A is an enlarged plan view of the vibrating arm for driving the vibrating element shown in FIG. 3, and FIG. 4B is the driving element shown in FIG. 4A. 5A is an enlarged plan view of the vibration arm for detection of the vibration element shown in FIG. 3, and FIG. 5B is a cross-sectional view of the vibration arm for detection shown in FIG. 6 (a) is an enlarged plan view of the adjustment vibrating arm of the vibration element shown in FIG. 3, FIG. 6 (b) is a cross-sectional view of the adjustment vibrating arm shown in FIG. 6 (a), and FIG. FIG. 8 is a diagram showing the connection state of the detection electrode and the adjustment electrode in the vibration element shown in FIG. 3, and FIG. 8 is a diagram for explaining the operation of the vibration element shown in FIG. 9A is a diagram showing the leakage output of the detection electrode shown in FIG. 5, FIG. 9B is a diagram showing the output of the adjustment electrode shown in FIGS. 6 and 7, and FIG. FIG. 10B is an enlarged plan view of the additional vibrating piece of the vibrating element shown in FIG. 3, and FIG. 10B is a cross-sectional view of the additional vibrating piece shown in FIG.

In the following, for convenience of explanation, in FIGS. 1 to 6, 8, and 10, the x axis, the y axis, and the z axis are illustrated as three axes orthogonal to each other, and a direction parallel to the x axis is represented by “x The direction parallel to the y-axis is referred to as the “y-axis direction”, and the direction parallel to the z-axis is referred to as the “z-axis direction”. The + z axis side is also referred to as “upper” and the −z axis side is also referred to as “lower”.
A sensor device 1 shown in FIGS. 1 and 2 is a gyro sensor that detects an angular velocity as a physical quantity.

Such a sensor device 1 can be used for, for example, camera shake correction of an imaging device, posture detection of a vehicle or the like in a mobile navigation system using a GPS (Global Positioning System) satellite signal, posture control, and the like.
As shown in FIGS. 1 and 2, the sensor device 1 includes a vibration element 2, an IC chip 3, and a package 4 that houses the vibration element 2 and the IC chip 3.

Hereinafter, each part which comprises the sensor device 1 is demonstrated sequentially.
[Vibration element]
The vibration element 2 is a gyro sensor element that detects an angular velocity around one axis.
As shown in FIG. 3, the vibration element 2 includes a base 21, a pair of drive vibration arms 221, 222, a pair of detection vibration arms 231, 232, and a pair of adjustment vibration arms (vibration). Arm) 241, 242, support portion (frame body) 25, four connecting portions 261, 262, 263, 264, drive electrode groups 51, 52, detection electrode groups 53, 54, and adjustment electrode A sensing vibrating piece 58 including groups 55 and 56 and an additional vibrating piece 59 provided on the support portion 25 are provided.
In the present embodiment, the sensing vibrating piece 58 and the additional vibrating piece 59 are integrally formed of a piezoelectric material. The piezoelectric material is not particularly limited, but it is preferable to use quartz. Thereby, the characteristic of the vibration element 2 can be made excellent.

  The quartz crystal has an X axis (electric axis), a Y axis (mechanical axis), and a Z axis (optical axis) that are orthogonal to each other. A base 21, a pair of drive vibration arms 221, 222, a pair of detection vibration arms 231, 232, a pair of adjustment vibration arms 241, 242, a support part 25 and four connection parts 261, 262, 263, H.264 can be formed, for example, by etching a substrate made of quartz having a Z-axis in the thickness direction and a plate surface parallel to the X-axis and the Y-axis. The thickness of the substrate is appropriately set according to the oscillation frequency (resonance frequency), outer size, workability, and the like of the vibration element 2. In the following description, the base 21, the pair of drive vibration arms 221 and 222, the pair of detection vibration arms 231 and 232, the pair of adjustment vibration arms 241 and 242, the support portion 25, and the four connection portions 261. , 262, 263, and 264 will be described as an example of a single unit made of quartz.

((Vibration piece for sensing))
As described above, the sensing vibrating piece 58 includes the base 21, the pair of driving vibrating arms 221, 222, the pair of detecting vibrating arms 231, 232, and the pair of adjusting vibrating arms (vibrating arms). ) 241, 242, support portion (frame body) 25, four connecting portions 261, 262, 263, 264, driving electrode groups 51, 52, detection electrode groups 53, 54, and adjustment electrode group 55, 56.

Of these, the base portion 21 is supported by the support portion 25 via four connecting portions 261, 262, 263, and 264. Each of the four connecting portions 261, 262, 263, and 264 has an elongated shape, one end is connected to the base portion 21, and the other end is connected to the support portion 25.
The driving vibrating arms 221 and 222 respectively extend from the base portion 21 in the y-axis direction (+ y direction). Further, the driving vibrating arms 221 and 222 each extend along the Y axis of the crystal. Further, the cross sections of the drive vibrating arms 221 and 222 each have a rectangular shape composed of a pair of sides parallel to the x axis and a pair of sides parallel to the z axis.
The driving vibrating arm 221 is provided with a driving electrode group 51, and similarly, the driving vibrating arm 222 is provided with a driving electrode group 52.

Hereinafter, the drive electrode group 51 will be described representatively. Note that the drive electrode group 52 is the same as the drive electrode group 51, and thus the description thereof is omitted.
As shown in FIGS. 4A and 4B, the driving electrode group 51 includes a driving electrode 511 provided on the upper surface of the driving vibrating arm 221 and a driving provided on the lower surface of the driving vibrating arm 221. 4 and the driving electrode 513 provided on the side surface of one of the driving vibration arms 221 (left side in FIG. 4) and the other side surface (right side in FIG. 4) of the driving vibration arm 221. Drive electrode 514.

  The drive electrode 511 and the drive electrode 512 are electrically connected to each other via a wiring (not shown) so as to have the same potential. Further, the drive electrode 513 and the drive electrode 514 are electrically connected to each other via a wiring (not shown) so as to have the same potential. Such driving electrodes 511 and 512 are electrically connected to terminals 57a provided on the support portion 25 shown in FIG. Further, the driving electrodes 513 and 514 are electrically connected to a terminal 57b provided on the support portion 25 shown in FIG.

The detection vibrating arms 231 and 232 respectively extend from the base portion 21 in the y-axis direction (−y direction). The detection vibrating arms 231 and 232 extend along the Y axis of the crystal. Further, the cross-sections of the detection vibrating arms 231 and 232 each have a rectangular shape composed of a pair of sides parallel to the x axis and a pair of sides parallel to the z axis.
Such detection vibrating arms 231 and 232 vibrate in accordance with physical quantities applied to the driving vibrating arms 221 and 222, respectively.

  The detection vibrating arm 231 is provided with a detection electrode group 53. Similarly, the detection vibrating arm 232 is provided with a detection electrode group 54. In this way, by providing the detection electrode groups 53 and 54 on the detection vibration arms 231 and 232 provided separately from the drive vibration arms 221 and 222, the detection electrode groups 53 and 54 have the detection electrode groups. The electrode area (area of the portion functioning as an electrode) can be increased. Therefore, the detection sensitivity of the vibration element 2 can be improved. Here, the detection vibrating arm 231 and the detection electrode group 53 constitute a detection unit. Similarly, the detection vibrating arm 232 and the detection electrode group 54 constitute a detection unit.

Hereinafter, the detection electrode group 53 will be described representatively. Note that the detection electrode group 54 is the same as the detection electrode group 53, and thus the description thereof is omitted.
As shown in FIGS. 5A and 5B, the detection electrode group 53 is provided on the detection electrodes 531 and 532 provided on the upper surface of the detection vibration arm 231 and on the lower surface of the detection vibration arm 231. And detection electrodes 533 and 534. Here, the detection electrodes 531 and 533 are provided on one side (left side in FIG. 5) in the width direction of the detection vibrating arm 231, and the detection electrodes 532 and 534 are respectively used for detection. The vibrating arm 231 is provided on the other side in the width direction (right side in FIG. 5).

  The detection electrode 531 and the detection electrode 534 are electrically connected to each other via a wiring (not shown) so as to have the same potential. Further, the detection electrode 532 and the detection electrode 533 are electrically connected to each other via a wiring (not shown) so as to have the same potential. Here, the detection electrodes 531 and 534 and the detection electrodes 532 and 533 form a pair.

  Such detection electrodes 531 and 534 are electrically connected to a terminal 57c provided on the support portion 25 shown in FIG. Further, the detection electrodes 532 and 533 are electrically connected to a terminal 57e provided on the support portion 25 shown in FIG. The detection electrode group 54 is electrically connected to terminals 57d and 57f provided on the support portion 25 shown in FIG. 3 via a wiring (not shown).

  The adjusting vibrating arms 241 and 242 respectively extend from the base portion 21 in the y-axis direction. The adjustment vibrating arms 241 and 242 extend along the Y-axis of the crystal. Further, the cross sections of the adjustment vibrating arms 241 and 242 each have a rectangular shape composed of a pair of sides parallel to the x axis and a pair of sides parallel to the z axis. The adjustment vibrating arms 241 and 242 are each rectangular and have a front surface (first surface), a back surface (second surface), and a side surface that connects the front surface and the back surface.

Such adjustment vibrating arms 241 and 242 are provided so as to be parallel to the driving vibrating arms 221 and 222 described above. That is, the driving vibrating arms 221 and 222 and the adjusting vibrating arms 241 and 242 extend in directions parallel to each other. As a result, when the driving vibrating arms 221 and 222 and the adjusting vibrating arms 241 and 242 are made of crystal, the driving vibrating arms 221 and 222 and the adjusting vibrating arms 241 and 242 are each along the Y axis of the crystal. The driving vibrating arms 221 and 222 are configured to extend so as to efficiently vibrate, and charges can be generated in the adjustment electrodes 551 to 554 described later with a simple configuration.
The adjustment vibrating arm 241 is provided with an adjustment electrode group 55. Similarly, the adjustment vibrating arm 242 is provided with an adjustment electrode group 56.

Hereinafter, the adjustment electrode group 55 will be described representatively. The adjustment electrode group 56 is the same as the adjustment electrode group 55, and therefore the description thereof is omitted.
As shown in FIGS. 6A and 6B, the adjustment electrode group 55 includes an adjustment electrode 551 provided on the upper surface of the adjustment vibrating arm 241 and an adjustment provided on the lower surface of the adjustment vibration arm 241. The adjustment electrode (side electrode) 553 provided on the side surface of one of the adjustment electrode 552, the adjustment vibration arm 241 (left side in FIG. 6), and the other (right side in FIG. 6) of the adjustment vibration arm 241. It is comprised with the electrode for adjustment (side electrode) 554 provided in the side surface.

The adjustment electrode 551 and the adjustment electrode 552 are formed so as to overlap each other when seen in a plan view. That is, the adjustment electrode 551 and the adjustment electrode 552 are formed so that their external shapes match when viewed in plan.
The adjustment electrode 551 and the adjustment electrode 552 are electrically connected to each other through a wiring (not shown) so as to have the same potential. Further, the adjustment electrode 553 and the adjustment electrode 554 are electrically connected so as to have the same potential. Here, the adjustment electrodes 551 and 552 and the adjustment electrodes 553 and 554 form a pair.

  Such adjustment electrodes 551 and 552 are electrically connected to the terminals 57e provided on the support portion 25 shown in FIG. 3 together with the detection electrodes 532 and 533 described above via a wiring (not shown). Further, the adjustment electrodes 553 and 554 are electrically connected to the terminals 57c provided on the support portion 25 shown in FIG. 3 together with the detection electrodes 531 and 534 described above via wirings not shown. The adjustment electrode group 56 is electrically connected to terminals 57d and 57f provided on the support portion 25 shown in FIG. 3 together with the detection electrode group 54 via a wiring (not shown).

  In the vibration element 2 having such adjustment electrodes 551 to 554, as shown in FIG. 7, the adjustment electrodes 551, 552 and the charge amounts generated in the detection electrodes 531 and 534 and the detection electrodes 532 and 533 are reduced. A sum of charges generated in the adjustment electrodes 553 and 554 can be output from the terminals 57c and 57e as a sensor output (hereinafter also simply referred to as “sensor output”).

Here, since the charges generated in the adjustment electrodes 551 and 552 and the adjustment electrodes 553 and 554 are opposite in polarity to the charges generated in the detection electrodes 531 and 534 and the detection electrodes 532 and 533, the detection electrodes 531 and 534 and the detection electrodes 532 and 533 cancel at least a part of the electric charges.
In such adjustment electrodes 551 and 552, it is possible to adjust the sensor output by removing a part thereof. That is, by removing a part of the adjustment electrodes 551 and 552, the amount of charge between the adjustment electrodes 551 and 552 and the adjustment electrodes 553 and 554 can be reduced, and the sensor output can be adjusted. For example, the sensor output can be adjusted (corrected) so that the sensor output (hereinafter also referred to as “zero point output”) in a state where no physical quantity is applied to the vibration element 2 becomes zero. Thereby, the vibration element 2 with high sensitivity is obtained.

  In the vibration element 2 configured as described above, when a drive signal is applied between the terminal 57a and the terminal 57b, the drive vibration arm 221 and the drive vibration arm 222 are mutually connected as shown in FIG. Bending vibration (drive vibration) so as to approach and separate. That is, the driving vibration arm 221 is bent in the direction of the arrow A1 shown in FIG. 8 and the driving vibration arm 222 is bent in the direction of the arrow A2 shown in FIG. 8, and the driving vibration arm 221 is shown in FIG. The state in which the drive vibrating arm 222 is bent in the direction of the arrow B2 shown in FIG.

If the angular velocity ω about the y-axis is applied to the vibrating element 2 with the driving vibrating arms 221 and 222 being driven in this way, the driving vibrating arms 221 and 222 are mutually moved in the z-axis direction by Coriolis force. Bend and vibrate on the opposite side. Along with this, the detection vibrating arms 231 and 232 undergo bending vibration (detection vibration) on the opposite sides in the z-axis direction. That is, the detection vibrating arm 231 is bent in the direction of the arrow C1 shown in FIG. 8, the detection vibrating arm 232 is bent in the direction of the arrow C2 shown in FIG. 8, and the detection vibrating arm 231 is shown in FIG. The state in which the detection vibrating arm 232 is bent in the direction of the arrow D2 shown in FIG. 8 is alternately repeated while bending in the direction of the arrow D1.
The angular velocity ω applied to the vibration element 2 can be obtained by detecting the charges generated in the detection electrode groups 53 and 54 by the detection vibration of the detection vibration arms 231 and 232.

  At this time, the adjustment vibrating arms 241 and 242 are also excited to bend and vibrate in directions toward and away from each other with the driving vibration of the driving vibrating arms 221 and 222. As a result, charges are generated in the adjustment electrodes 551 and 552 and the adjustment electrodes 553 and 554. By adjusting the amount of charge, the charges generated in the detection electrodes 531 and 534 and the detection electrodes 532 and 533 are reduced. At least a portion can be offset.

  In such a vibration element 2, if the cross-sectional shape of the driving vibration arms 221 and 222 does not become as designed due to variations in manufacturing, the vibration for driving is performed even though no physical quantity is added to the vibration element 2. When the arms 221 and 222 are vibrated by energization, as shown in FIG. 9A, electric charge that becomes a leakage output S is generated between the detection electrodes 531 and 534 and the detection electrodes 532 and 533.

Further, in the vibration element 2, as shown in FIG. 9B, the adjustment is performed in the state where the drive vibration arms 221 and 222 are vibrated by energization regardless of whether or not a physical quantity is applied to the vibration element 2. Electric charges serving as an adjustment output T are generated between the electrodes 551 and 552 and the adjustment electrodes 553 and 554.
Since the leakage output S and the adjustment output T have opposite polarities, the zero point output of the vibration element 2 can be made zero by making the absolute value of the adjustment output T equal to the absolute value of the leakage output S. .

  On the other hand, as described above, the sensor output can be adjusted by removing a part of the adjustment electrodes 551 and 552. At this time, the absolute value of the leakage output S can be accurately estimated. Without this, naturally, the zero point output of the vibration element 2 cannot be made zero. Therefore, in the present invention, the leakage output S can be accurately estimated by providing the additional vibrating piece 59 described later.

((Additional vibrating piece))
An additional vibrating piece 59 is provided inside the support portion 25.
The additional vibrating piece 59 extends from the support portion 25 in the y-axis direction (−y direction). Further, the cross section of the additional vibrating piece 59 has a rectangular shape composed of a pair of sides parallel to the x axis and a pair of sides parallel to the z axis. That is, it has a front surface (first surface), a back surface (second surface), and a side surface connecting the front surface and the back surface.
The additional vibrating piece 59 is provided with drive electrodes 591, 592, and 593 and detection electrodes 594 and 595.

  More specifically, as shown in FIGS. 10A and 10B, a driving electrode 591 and a detection electrode 594 are provided on the surface of the additional vibrating piece 59. A driving electrode 592 is provided on the back surface, and a driving electrode 593 is provided on the side surface of one of the additional vibrating pieces 59 (left side in FIG. 9). 9 is provided with a detection electrode 595 on the side surface. According to the additional vibrating piece 59 having such a configuration, the size can be reduced, which contributes to the size reduction of the vibration element 2. The area occupied by the additional vibrating piece 59 is minimized, and the ease of manufacturing the vibrating element 2 (sensing vibrating piece 58) is increased.

The drive electrode 591 is electrically connected to a terminal 57g provided on the support portion 25 shown in FIG. 3 via a wiring (not shown). The driving electrode 592 is electrically connected to a terminal 57h provided on the support portion 25 shown in FIG.
Further, the drive electrode 593 and the detection electrode 594 are electrically grounded via a wiring (not shown).
Further, the detection electrode 595 is electrically connected to a terminal 57i provided on the support portion 25 shown in FIG. 3 via a wiring (not shown).

  Such an additional vibrating piece 59 is integrally formed with the sensing vibrating piece 58 as described above. Further, as described above, the sensing vibrating piece 58 and the additional vibrating piece 59 are formed by etching a substrate made of, for example, quartz. Therefore, it can be said that the additional vibrating piece 59 has the same manufacturing history as the sensing vibrating piece 58. For this reason, as described above, for example, if the cross-sectional shape of the drive vibrating arms 221 and 222 is not as designed due to variations in manufacturing, the additional vibration piece 59 having the same manufacturing history is also used for the drive vibration. Like the arms 221 and 222, the cross-sectional shape is likely to be out of design. And it is thought that the cross-sectional shape of the drive vibrating arms 221 and 222 and the cross-sectional shape of the additional vibrating piece 59 show the same tendency deviating from the design shape. For this reason, in the state in which the driving vibrating arms 221 and 222 are vibrated by energization, the electric charges generated between the detection electrodes 531 and 534 and the detection electrodes 532 and 533 due to the leakage output, and the additional vibrating piece 59 In the state in which the current is vibrated by energization, the charge detected with the leak output has a correlation such as proportionality. Therefore, if this correlation is utilized, the leakage output (vibration characteristics) of the driving vibrating arms 221 and 222 is detected by exciting the additional vibrating piece 59 instead of the driving vibrating arms 221 and 222 and detecting the leakage output. Can be estimated.

  Further, the additional vibrating piece 59 is allowed to be excited with a large amplitude exceeding the rating as compared with the driving vibrating arms 221 and 222 of the sensing vibrating piece 58. That is, if the sensing vibration piece 58 is excited with an amplitude larger than the rated amplitude, the sensing vibration piece 58 may be greatly distorted and the piezoelectric body may be deteriorated. Since it is provided at a position physically separated from the sensing vibrating piece 58, even if the additional vibrating piece 59 is excited with a large amplitude, it is considered that the sensing vibrating piece 58 is hardly affected. Since the additional vibrating piece 59 does not affect the operation of the sensing vibrating piece 58, even if the piezoelectric body of the additional vibrating piece 59 deteriorates, it does not affect the vibration element 2 after commercialization. There is no. Therefore, by exciting the additional vibrating piece 59 with a large amplitude and increasing the amount of charge detected along with the leakage output, the S / N ratio of the detected current is improved, and the leakage output of the sensing vibrating piece 58 is reduced. It can be estimated more accurately.

  The leakage output S of the sensing vibrating piece 58 estimated in this way is considered to have higher accuracy than in the past. For this reason, if the adjustment output T is adjusted according to the leakage output S estimated in this way, the zero point output of the vibration element 2 can be brought closer to zero more accurately. As a result, the vibration element 2 and the sensor device 1 with higher detection sensitivity can be obtained.

From the above viewpoint, the shape and size of the additional vibrating piece 59 are preferably close to the shape and size of the driving vibrating arms 221 and 222. For example, the width of the additional vibrating piece 59 is preferably equal to the width of the driving vibrating arms 221 and 222. Thereby, both cross-sectional shapes can be brought closer.
The extending direction of the additional vibrating piece 59 extending from the support portion 25 is not particularly limited, but is preferably the same as the extending direction of the driving vibrating arms 221 and 222. Thereby, the manufacturing history of the driving vibrating arms 221 and 222 and the manufacturing history of the additional vibrating piece 59 are closer. As a result, the estimation accuracy of the leakage output of the sensing vibrating piece 58 estimated by exciting the additional vibrating piece 59 becomes higher, and the leakage output of the driving vibrating arms 221 and 222 can be estimated more accurately. it can.

Even if the stretching directions are different from each other, there is a certain tendency in the difference in the estimation results due to the difference in the stretching direction. It can be carried out.
From the viewpoint of further improving the estimation accuracy, it is preferable that the direction in which the additional vibrating piece 59 extends and the direction in which the driving vibrating arms 221 and 222 extend are the same. That is, it is preferable to extend the additional vibrating piece 59 from the support portion 25 in the + y direction.

  The vibration frequency of the additional vibrating piece 59 is preferably different from the vibration frequency of the sensing vibrating piece 58. As a result, when the driving vibrating arms 221 and 222 and the detecting vibrating arms 231 and 232 of the sensing vibrating piece 58 vibrate, the additional vibrating piece 59 is also unintentionally excited, and the sensing vibrating piece 58 operates. Adverse effects such as instability are prevented.

On the other hand, when the additional vibrating piece 59 is vibrated in the vibration characteristic detecting method described later, the sensing vibrating piece 58 is also excited, thereby preventing the detection result of the leak output from being shifted. Can do.
The vibration of the sensing vibrating piece 58 refers to the vibration of the driving vibrating arms 221 and 222, the vibration of the detecting vibrating arms 231 and 232, and the vibration of the adjusting vibrating arms 241 and 242.

The sensor device 1 and the vibration element 2 have been described above. However, the form of the sensing vibrating piece 58 of the vibration element 2 described above is not limited to a so-called H-type tuning fork, and for example, a double T type, a two-leg tuning fork, Various forms such as a tripod tuning fork, comb-tooth type, orthogonal type, and prismatic type may be used.
In addition, the number of drive vibrating arms, detection vibrating arms, and adjustment vibrating arms may be one or three or more, respectively. The driving vibration arm may also serve as the detection vibration arm.

Further, the number, position, shape, size, and the like of the driving electrodes are not limited to the above-described embodiment as long as the driving vibrating arms can be vibrated by energization.
In addition, the number, position, shape, size, and the like of the detection electrodes are limited to the above-described embodiment as long as the vibration of the driving vibrating arm due to the addition of the physical quantity can be electrically detected. It is not something.
In addition, the number, position, shape, size, and the like of the adjustment electrodes are not limited to the above-described embodiments as long as they can output the electric charges generated with the drive vibration of the adjustment vibration arm. Absent.

<Vibration characteristic detection method>
Next, an embodiment of the vibration characteristic detection method of the present invention will be described.
11 and 12 are diagrams for explaining embodiments of the vibration characteristic detection method of the present invention.
In the vibration characteristic detection method according to the present embodiment, the sensing vibrating piece 58 and the additional vibrating piece 59 are formed on the same wafer 9, and the driving electrodes 591, 592, and 593 of the additional vibrating piece 59 are used. A leakage output detecting step of exciting a drive mode vibration by applying a voltage and detecting a detection mode vibration in a direction intersecting the vibration direction of the drive mode at the detection electrodes 594 and 595. Hereinafter, each process will be described sequentially.
In the following description, a connecting portion between the base 21 of the sensing vibrating piece 58 shown in FIG. 3 and the four connecting portions 261, 262, 263, and 264 is shown as a vibrating piece to which the vibration characteristic detecting method of the present invention is applied. The vibration piece cut and cut will be described as an example.

[1] First, a wafer of piezoelectric material is prepared. Examples of the wafer include a substrate made of the above-described piezoelectric material, and a typical example is a quartz wafer.
Next, the wafer is processed with respect to such a wafer by using a known photolithography technique or the like.
Subsequently, drive electrode groups 51 and 52, detection electrode groups 53 and 54, and adjustment electrode groups 55 and 56 are formed. Similarly, drive electrodes 591, 592, 593 and detection electrodes 594, 595 are formed. Thereby, the wafer 9 in which the sensing vibrating piece 58 and the additional vibrating piece 59 are formed is obtained (wafer processing step).

In the wafer 9 shown in FIG. 11, the sensing vibrating piece 58 and the additional vibrating piece 59 are formed one by one in one partition 60. A wafer 9 shown in FIG. 11 is an example of a multi-piece wafer in which six sections 60 are formed. In addition, a blank 61 is provided on the wafer 9 so as to surround these sections 60, and the blank 61 and the sensing vibrating piece 58 are connected via a connecting portion 62.
In addition, examples of the formation of each electrode include a physical film formation method such as a sputtering method and a vacuum deposition method, a chemical film formation method such as a CVD method, and a plating method.

[2] Next, a voltage is applied to the drive electrodes 591 and 592 of the additional vibrating piece 59 to vibrate the additional vibrating piece 59 in the drive mode. Thereby, the vibration reciprocating in the X direction in FIG. 10B is excited in the additional vibrating piece 59.
Next, vibration (leakage output) in the detection mode in a direction intersecting the vibration mode is detected by the detection electrodes 594 and 595 (leakage output detection step). The detection electrode 595 generates a charge including a charge associated with the leak output, and the magnitude of the leak output can be specified by measuring the amount of the charge. Based on the leakage output obtained for the additional vibrating piece 59, the leakage output of the driving vibrating arms 221 and 222 can be estimated more accurately.

Note that the amount of charge output from the detection electrode 595 is obtained by superimposing the charge associated with the leakage output and the charge associated with the vibration in the drive mode. Therefore, by subtracting the charge accompanying the vibration of the driving mode from the measured charge amount, the charge accompanying the leakage output can be calculated.
At this time, a voltage equivalent to the rated voltage applied to the drive vibrating arms 221 and 222 of the sensing vibrating piece 58 may be applied to the drive electrodes 591, 592, and 593, but preferably the rated voltage Apply a higher voltage. As a result, the amplitude of the additional vibrating piece 59 that vibrates in the drive mode can be increased, and the amount of charge generated with the leakage output also increases. As a result, the absolute value of the charge amount can be increased, and even a minute leak output can be accurately detected with high sensitivity.

In the wafer 9, the arrangement of the additional vibrating piece 59 provided in each section 60 is not limited to the position shown in FIG.
FIG. 12 is another diagram for explaining an embodiment of the vibration characteristic detecting method of the present invention.
In the wafer 9 shown in FIG. 12, three sections 60 each having one sensing vibrating piece 58 are formed. A partition 63 is formed so as to be adjacent to the partition 60. In addition, one additional vibrating piece 59 is formed in the partition 63. In FIG. 12, one section 63 is formed to correspond to one section 60 on a one-to-one basis.
In the wafer 9 shown in FIG. 12 as well, the leakage output of the driving vibrating arms 221 and 222 can be estimated based on the leakage output obtained for the additional vibrating piece 59.

  In addition, in the wafer 9 shown in FIGS. 11 and 12, the arrangement and the number of the additional vibrating pieces 59 are not particularly limited. That is, it is only necessary that at least one additional vibrating piece 59 is formed on the wafer 9 with respect to the plurality of sensing vibrating pieces 58. As a result, the area occupied by the additional vibrating piece 59 can be minimized, and the number of sensing vibrating pieces 58 in the wafer 9 can be secured to the maximum. Further, a plurality of additional vibrating pieces 59 may be formed for one sensing vibrating piece 58.

In addition, depending on the photolithography process and the etching process, unevenness in process progress occurs on the wafer 9. Therefore, the arrangement and number of additional vibrating pieces 59 may be set according to the unevenness of the process progress.
Further, in the wafer 9 shown in FIGS. 11 and 12, as described above, one additional vibrating piece 59 is formed to correspond to one sensing vibrating piece 58 in a one-to-one correspondence. In the output detection step, it is preferable to excite the additional vibrating piece 59 corresponding to the sensing vibrating piece 58 to detect the leak output so as to detect the leak output. Thereby, the leak output of the driving vibrating arms 221 and 222 can be estimated more accurately. In the wafer 9 shown in FIGS. 11 and 12, since the additional vibrating pieces 59 are arranged close to each other in a one-to-one relationship with the sensing vibrating piece 58, the cross-sectional shape of the additional vibrating piece 59 in this arrangement is shown. This is because the cross-sectional shape of the driving vibrating arms 221 and 222 of the sensing vibrating piece 58 disposed in the vicinity thereof is particularly close, and accordingly, the estimation accuracy of the leakage output is increased.

<Vibration characteristic adjustment method>
Next, an embodiment of the vibration characteristic adjusting method of the present invention will be described.
In the vibration characteristic adjusting method according to the present embodiment, after detecting the leakage output of the driving vibrating arms 221 and 222 of the sensing vibrating piece 58, a part of the adjustment electrodes 551 and 552 is removed based on the leakage output. Thus, there is a step of adjusting the charge generated in the adjustment electrodes 551 and 552 (charge adjustment step).

Examples of a method for removing a part of the adjustment electrodes 551 and 552 include laser trimming. In this way, by removing a part of the adjustment electrodes 551 and 552, the amount of charge output from the adjustment electrodes 551 and 552 (the absolute value of the adjustment output T) is adjusted, and the zero point of the vibration element 2 is adjusted. The output can be close to zero.
After adjusting the vibration characteristics of the vibration element 2 in this way, the connection portion 62 of the wafer 9 is cut. Thereby, the sensing vibrating piece 58 is separated into pieces. Thereafter, the sensor device 1 can be obtained by mounting the sensing vibrating piece 58 in the package as necessary.
In order to adjust the absolute value of the adjustment output T, in addition to removing a part of the adjustment electrodes 551 and 552, a part of the other adjustment electrodes may be removed. Further, the area of the adjustment electrode groups 55 and 56 may be increased, and the mass of the adjustment vibrating arms 241 and 242 may be changed.

[IC chip]
The IC chip 3 shown in FIGS. 1 and 2 is an electronic component having a function of driving the vibration element 2 described above and a function of detecting an output (sensor output) from the vibration element 2.
Although not shown, the IC chip 3 includes a drive circuit that drives the vibration element 2 and a detection circuit that detects an output from the vibration element 2.
The IC chip 3 is provided with a plurality of connection terminals 31.

(package)
As shown in FIGS. 1 and 2, the package 4 includes a base member 41 (base) having a concave portion that opens upward, and a lid member 42 (lid) provided so as to cover the concave portion of the base member 41. Prepare. Thereby, an internal space in which the vibration element 2 and the IC chip 3 are accommodated is formed between the base member 41 and the lid member 42.

The base member 41 includes a flat plate body 411 (plate portion) and a frame body 412 (frame portion) joined to the outer peripheral portion of the upper surface of the plate body 411.
Such a base member 41 is made of, for example, an aluminum oxide sintered body, crystal, glass, or the like.
As shown in FIG. 1, the upper surface of the base member 41 (the surface covered with the lid member 42) is covered with a bonding member 81 such as an adhesive that includes an epoxy resin, an acrylic resin, or the like. The support portion 25 of the vibrating element 2 is joined. Thereby, the vibration element 2 is supported and fixed to the base member 41.

Further, the above-described IC chip 3 is bonded to the upper surface of the base member 41 by a bonding member 82 such as an adhesive configured to include, for example, an epoxy resin, an acrylic resin, or the like. Thereby, the IC chip 3 is supported and fixed to the base member 41.
Further, as shown in FIGS. 1 and 2, a plurality of internal terminals 71 and a plurality of internal terminals 72 are provided on the upper surface of the base member 41.

The plurality of internal terminals 71 are electrically connected to the above-described terminals 57a to 57i of the vibration element 2 through, for example, wiring configured by bonding wires.
The plurality of internal terminals 71 are electrically connected to the plurality of internal terminals 72 via wiring (not shown).
In addition, the plurality of connection terminals 31 of the IC chip 3 described above are electrically connected to the plurality of internal terminals 72 via, for example, wiring configured by bonding wires.

On the other hand, as shown in FIG. 1, a plurality of external terminals 73 that are used when mounted on a device (external device) in which the sensor device 1 is incorporated are provided on the lower surface of the base member 41 (the bottom surface of the package 4). ing.
The plurality of external terminals 73 are electrically connected to the internal terminals 72 described above via internal wiring (not shown). Thereby, the IC chip 3 and the plurality of external terminals 73 are electrically connected.

Each of the internal terminals 71 and 72 and the external terminals 73 is made of a metal film in which a film of nickel (Ni), gold (Au) or the like is laminated on a metallized layer of tungsten (W) or the like by plating or the like. Become.
A lid member 42 is airtightly joined to such a base member 41. Thereby, the inside of the package 4 is hermetically sealed.

The lid member 42 is made of, for example, the same material as the base member 41 or a metal such as Kovar, 42 alloy, stainless steel, or the like.
The joining method of the base member 41 and the lid member 42 is not particularly limited. For example, a joining method using an adhesive composed of a brazing material, a curable resin, or the like, a welding method such as seam welding, laser welding, or the like is used. be able to.
Such bonding is performed under reduced pressure or in an inert gas atmosphere, whereby the inside of the package 4 can be maintained in a reduced pressure state or an inert gas sealed state.

According to the vibration element 2 provided in the sensor device 1 according to the embodiment as described above, excellent detection sensitivity can be exhibited easily and reliably.
Moreover, according to the sensor device 1 including the vibration element 2 as described above, it has excellent detection sensitivity.
The sensor device 1 (vibration element 2) as described above can be used by being incorporated into various electronic devices.
According to such an electronic device, the reliability can be improved.

<Electronic equipment>
Here, an example of an electronic apparatus provided with the vibration element of the present invention will be described in detail with reference to FIGS.
FIG. 13 is a perspective view illustrating a configuration of a mobile (or notebook) personal computer including the vibration element of the present invention.

In this figure, a personal computer 1100 includes a main body portion 1104 provided with a keyboard 1102 and a display unit 1106 provided with a display portion 100. The display unit 1106 is rotated with respect to the main body portion 1104 via a hinge structure portion. It is supported movably.
Such a personal computer 1100 incorporates the above-described sensor device 1 that functions as a gyro sensor.

FIG. 14 is a perspective view showing a configuration of a mobile phone (including PHS) including the vibration element of the present invention.
In this figure, a cellular phone 1200 includes a plurality of operation buttons 1202, an earpiece 1204, and a mouthpiece 1206, and the display unit 100 is disposed between the operation buttons 1202 and the earpiece 1204.
Such a cellular phone 1200 incorporates the above-described sensor device 1 that functions as a gyro sensor.

FIG. 15 is a perspective view showing a configuration of a digital still camera provided with the vibration element of the present invention. In this figure, connection with an external device is also simply shown.
Here, an ordinary camera sensitizes a silver halide photographic film with a light image of a subject, whereas a digital still camera 1300 photoelectrically converts a light image of a subject with an imaging device such as a CCD (Charge Coupled Device). An imaging signal (image signal) is generated.

A display unit is provided on the back of a case (body) 1302 in the digital still camera 1300, and is configured to perform display based on an imaging signal from the CCD. The display unit is a finder that displays an object as an electronic image. Function.
A light receiving unit 1304 including an optical lens (imaging optical system), a CCD, and the like is provided on the front side (the back side in the drawing) of the case 1302.
When the photographer confirms the subject image displayed on the display unit and presses the shutter button 1306, the CCD image pickup signal at that time is transferred and stored in the memory 1308.

In the digital still camera 1300, a video signal output terminal 1312 and an input / output terminal 1314 for data communication are provided on the side surface of the case 1302. As shown in the figure, a television monitor 1430 is connected to the video signal output terminal 1312 and a personal computer 1440 is connected to the input / output terminal 1314 for data communication as necessary. Further, the imaging signal stored in the memory 1308 is output to the television monitor 1430 or the personal computer 1440 by a predetermined operation.
Such a digital still camera 1300 incorporates the above-described sensor device 1 that functions as a gyro sensor.

In addition to the personal computer (mobile personal computer) shown in FIG. 13, the mobile phone shown in FIG. 14, and the digital still camera shown in FIG. Detection device, pointing device, head mounted display, ink jet type ejection device (for example, ink jet printer), laptop personal computer, television, video camera, video tape recorder, navigation device, pager, electronic notebook (including communication function), Electronic dictionary, calculator, electronic game device, game controller, word processor, workstation, video phone, crime prevention TV monitor, electronic binoculars, POS terminal, medical device (eg electronic thermometer, blood pressure monitor, blood glucose meter) Electrocardiogram measuring device, an ultrasonic diagnostic apparatus, an electronic endoscope), a fish finder, various measurement devices, gauges (e.g., gages for vehicles, aircraft, and ships), can be applied to a flight simulator or the like.
As mentioned above, although the sensor element of the present invention, the characteristic adjustment method of the sensor element, the sensor device, and the electronic device have been described based on the illustrated embodiments, the present invention is not limited to these.

In the sensor element, sensor device, and electronic apparatus of the present invention, the configuration of each part can be replaced with any configuration that exhibits the same function, and any configuration can be added.
In addition, the sensor element, the sensor device, and the electronic apparatus of the present invention may be combined with any configuration of the above-described embodiments.
In the method for adjusting the characteristics of the sensor element of the present invention, an arbitrary step can be added.

  DESCRIPTION OF SYMBOLS 1 ... Sensor device 2 ... Vibration element 3 ... IC chip 4 ... Package 9 ... Wafer 21 ... Base 25 ... Supporting part 31 ... Connection terminal 41 ... Base member 42 ... Lid member 51 ... Drive electrode group 52 ... Drive electrode group 53 ... Detection electrode group 54 ... Detection electrode group 55 ... Adjustment electrode group 56 ... Adjustment electrode group 57a ... Terminal 57b ... Terminal 57c ... Terminal 57d ... Terminal 57e ... Terminal 57f ... Terminal 57g ... Terminal 57h ... Terminal 57i ... Terminal 58 ... Sensing vibration piece 59 ... Additional vibration piece 60 ... Partition 61 ... Blank 62 ... Connection part 63 ... Partition 71 ... Internal terminal 72 ... Internal terminal 73 ... External terminal 81 ... Joining member 82 ... Joining member 100 ... Display part 221 ... Drive vibration arm 222... Vibration arm for driving 231... Vibration arm for detection 232... Vibration arm for detection 241... Vibration arm for adjustment 242... Vibration arm for adjustment 261, 262, 263, 264. Body 412 ··· Frame 511 · · · Electrode for driving 512 · · · Electrode for driving 513 · · · Electrode for driving 514 · · · Electrode for driving 531 · · · Electrode for detection 532 · · · Electrode for detection 533 · · · Electrode for detection 534 · · · Electrode for detection 551 Electrode for adjustment 552 Electrode for adjustment 553 Electrode for adjustment 554 Electrode for adjustment 591 Electrode for drive 592 Electrode for drive 593 Electrode for drive 594 Detection Electrode 595... Detection electrode 1100 .. Personal computer 1102 .. Keyboard 1104 .. Main body 1106 .. Display unit 1200. ... Mobile phone 1202 ... Operation buttons 1204 ... Earpiece 1206 ... Mouthpiece 1300 ... Digital still camera 1302 ... Case 1304 ... Light receiving unit 1306 ... Shutter button 1308 ... Memory 1312 ... Video signal output terminal 1314 Input / output terminal 1430 Television monitor 1440 Personal computer A1 Arrow A2 Arrow B1 Arrow B2 Arrow C1 Arrow C2 Arrow D1 Arrow D2 Arrow S ... Leakage output T ... Output for adjustment

Claims (9)

A method for detecting a vibration characteristic of a vibration element having a vibrating piece for sensing,
Forming on the same wafer the sensing vibrating piece and an additional vibrating piece including a driving electrode to which a driving voltage is applied and a detection electrode for detecting charges generated by the vibration accompanying the application of the driving voltage. And a process of
Applying a voltage to the driving electrode of the additional vibrating piece to excite the vibration, and detecting the vibration in a direction intersecting the direction of the vibration with the detection electrode;
A vibration characteristic detecting method characterized by comprising: The sensing vibrating piece includes a driving vibrating arm that drives and vibrates,
The vibration characteristic detection method according to claim 1, wherein the extension direction of the additional vibrating piece is the same as the extension direction of the driving vibrating arm.   The vibration characteristic detection method according to claim 1, wherein a voltage higher than a rated voltage of the sensing vibrating piece is applied to the driving electrode of the additional vibrating piece. The additional vibrating piece includes a first surface, a second surface that is the surface opposite to the first surface, and a side surface that connects the first surface and the second surface;
4. The device according to claim 1, wherein the driving electrode is provided on each of the first surface, the second surface, and the side surface, and a detection electrode is provided on each of the first surface and the side surface. 5. The vibration characteristic detection method described.   5. The vibration characteristic detecting method according to claim 1, wherein a plurality of the sensing vibrating pieces and at least one additional vibrating piece are formed on the wafer. 6.   The shaking characteristic detection method according to claim 1, wherein a frequency of the additional vibrating piece is different from a frequency of the sensing vibrating piece. A method of adjusting vibration characteristics of a vibration element having a sensing resonator element,
Forming on the same wafer the sensing vibrating piece and an additional vibrating piece including a driving electrode to which a driving voltage is applied and a detection electrode for detecting charges generated by the vibration accompanying the application of the driving voltage. And a process of
Applying a voltage to the driving electrode of the additional vibrating piece to excite the vibration, and detecting the vibration in a direction intersecting the direction of the vibration with the detection electrode;
Adjusting a vibration characteristic of the sensing vibrating piece based on the detected vibration;
A method for adjusting vibration characteristics, comprising: The sensing vibrating piece includes a driving vibrating arm that drives and vibrates, and an adjusting vibrating arm that vibrates with the driving vibrating arm,
The vibration characteristic adjusting method according to claim 7, wherein the vibration characteristic of the sensing vibrating piece is adjusted by changing a charge amount generated from the adjusting vibrating arm and reducing a leakage output of the driving vibrating arm. A vibrating piece for sensing;
A vibrating piece formed integrally with the sensing vibrating piece, a driving electrode to which a driving voltage is applied, and a detection electrode that detects vibration in a direction crossing the direction of the vibration accompanying the application of the driving voltage. An additional vibrating piece comprising:
A vibration element comprising:

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