JP2015077548A - Gas processing device and gas processing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a gas processing device capable of efficiently processing a gas to be processed.SOLUTION: A gas processing device 1 comprises a housing 10, metal piping 12 and a water supply mechanism 30. The housing 10 has a processing chamber 11. In the processing chamber 11, a processing agent 14 where the processing capacity of a gas to be processed is increased by increasing humidity is disposed. The piping 12 is connected to the housing 10. The piping 12 supplies the gas to be processed to the processing chamber 11. The water supply mechanism 30 supplies water to the processing chamber 11.

Description

  The present invention relates to a gas processing apparatus and a gas processing method using the same.

  Conventionally, treatment of gas containing hydrogen sulfide has been performed. Iron oxide is known as a treatment agent for hydrogen sulfide-containing gas. Patent Document 1 describes that hydrogen sulfide is efficiently treated by setting the humidity of the hydrogen sulfide-containing gas brought into contact with iron oxide to 30% or more. As described above, there is a gas to be processed whose processing efficiency is increased by increasing the humidity.

JP 2003-22498 A

  However, when the humidity of the gas to be processed is increased, the processing apparatus is easily corroded, and the life of the processing apparatus is shortened. For this reason, there exists a problem that it is difficult to process to-be-processed gas efficiently.

  A main object of the present invention is to provide a gas processing apparatus capable of efficiently processing a gas to be processed.

  The gas processing apparatus according to the present invention includes a housing, a metal pipe, and a water supply mechanism. The housing has a processing chamber. The processing chamber is provided with a processing agent that increases the processing capacity of the gas to be processed by increasing the humidity. The piping is connected to the housing. The piping supplies the gas to be processed to the processing chamber. The water supply mechanism supplies water to the processing chamber.

  In the gas processing method according to the present invention, the gas is processed using the gas processing apparatus.

  ADVANTAGE OF THE INVENTION According to this invention, the gas processing apparatus which can process to-be-processed gas efficiently can be provided.

1 is a schematic cross-sectional view of a gas processing apparatus according to a first embodiment. It is typical sectional drawing of the processing apparatus of the gas which concerns on 2nd Embodiment. It is typical sectional drawing of the processing apparatus of the gas which concerns on 3rd Embodiment. It is typical sectional drawing of the processing apparatus of the gas which concerns on 5th Embodiment.

  Hereinafter, an example of the preferable form which implemented this invention is demonstrated. However, the following embodiment is merely an example. The present invention is not limited to the following embodiments.

  Moreover, in each drawing referred in embodiment etc., the member which has a substantially the same function shall be referred with the same code | symbol. The drawings referred to in the embodiments and the like are schematically described. A ratio of dimensions of an object drawn in a drawing may be different from a ratio of dimensions of an actual object. The dimensional ratio of the object may be different between the drawings. The specific dimensional ratio of the object should be determined in consideration of the following description.

(First embodiment)
FIG. 1 is a schematic cross-sectional view of a gas processing apparatus 1 according to the first embodiment. This processing apparatus 1 is an apparatus for processing and detoxifying a gas containing a component that is toxic to the human body or the environment, for example. The gas to be processed by the gas processing apparatus 1 is an acidic gas, for example, hydrogen arsenide such as hydrogen sulfide, hydrogen selenide, and arsine, hydrogen phosphide such as phosphine and diphosphine, silicon hydride such as silane, and the like. It may contain at least one of borohydrides such as borane and diborane. Especially, it is preferable that to-be-processed gas contains hydrogen sulfide.

  The processing device 1 includes a housing 10. The housing 10 is columnar. The casing 10 may have a columnar shape or a prismatic shape. In the present embodiment, the housing 10 is made of metal. The housing 10 is preferably made of a material having resistance to the gas to be processed. The housing 10 is preferably made of, for example, stainless steel.

  A processing chamber 11 for processing a gas to be processed is provided inside the housing 10. An introduction pipe 12 and a discharge pipe 13 are connected to the housing 10. Each of the introduction pipe 12 and the discharge pipe 13 is constituted by a metal pipe. The introduction pipe 12 and the discharge pipe 13 are each preferably made of, for example, stainless steel.

  In the present embodiment, the introduction pipe 12 is connected to the lower part of the housing 10. Specifically, it is connected to the lower part of the side wall 10 a of the housing 10. The introduction pipe 12 opens at the lower part of the processing chamber 11. A gas to be processed is introduced into the processing chamber 11 through the introduction pipe 12.

  On the other hand, the discharge pipe 13 is connected to the upper part of the housing 10. Specifically, the discharge pipe 13 is connected to the top wall portion 10 b of the housing 10. The discharge pipe 13 opens at the upper part of the processing chamber 11. The processed gas processed in the processing chamber 11 is discharged out of the processing chamber 11 through the discharge pipe 13.

  A processing agent 14 is disposed in the processing chamber 11. The processing agent 14 is a chemical | medical agent which processes a to-be-processed gas. Specifically, the treatment agent 14 reduces the concentration of harmful substances contained in the gas to be treated. The treatment agent 14 may be, for example, an adsorbent that adsorbs a substance intended to reduce the concentration in the gas to be treated. For example, the treatment agent 14 may be a substance (reactant) that reacts with a substance to be reduced in concentration in the gas to be treated. For example, the treatment agent 14 may be a catalyst that causes a substance that reduces the concentration in the gas to be treated to react. The treatment agent 14 may include at least two of an adsorbent, a reactant, and a catalyst.

  The processing agent 14 is not particularly limited as long as the processing gas 14 has a higher processing capacity of the processing gas as the humidity of the processing gas becomes higher. Moreover, it is preferable that the processing agent 14 generates heat when it comes into contact with the gas to be processed. Specifically, the treatment agent 14 is preferably an adsorbent that generates heat of adsorption, a reactive agent that generates heat of reaction, or the like. For example, when the gas to be treated contains hydrogen sulfide or hydrogen selenide, the treatment agent 14 preferably contains iron oxide.

  In the processing chamber 11, first and second processing layers 21 and 22 including a processing agent 14 are provided. The first treatment layer 21 is provided on the relatively upstream side, and the second treatment layer 22 is provided on the relatively downstream side. More specifically, the first treatment layer 21 is provided on the downstream side of the connection portion of the introduction pipe 12 in the gas flow path direction. The second processing layer 22 is provided between the first processing layer 21 and the connection portion of the discharge pipe 13. The first processing layer 21 and the second processing layer 22 are provided to be separated from each other. A hollow layer 23 is provided between the first treatment layer 21 and the second treatment layer 22.

  The first and second treatment layers 21 and 22 are each made of a foam on which treatment particles containing the treatment agent 14 are supported.

  By the way, in the case of using a reactive agent that increases the processing capacity of the gas to be processed as the humidity of the gas to be processed increases, it is preferable to previously add moisture to the gas to be processed. Therefore, it is considered preferable to generate a gas to be processed containing moisture in advance and introduce the gas into the processing chamber via the introduction pipe.

  However, when a gas to be treated containing moisture is introduced into the treatment chamber from the introduction port, a corrosive liquid in which the gas to be treated is dissolved may be generated in the introduction pipe. The corrosive liquid may corrode the metal introduction pipe and damage the introduction pipe.

  In view of this, in the processing apparatus 1, the water supply mechanism 30 is arranged in the processing chamber 11 and water is directly supplied to the processing chamber 11. For this reason, even if the corrosive liquid which the to-be-processed gas melt | dissolved arises, the corrosive liquid does not flow into the introduction pipe 12 easily. Therefore, the introduction pipe 12 is not easily damaged. Therefore, the processing apparatus 1 can efficiently process the gas to be processed.

  From the viewpoint of making it difficult for a corrosive liquid to be generated, the water supply mechanism 30 is preferably a mechanism that sprays water into the processing chamber 11. The water supply mechanism 30 is preferably a mechanism that intermittently supplies water. The water supply mechanism 30 is more preferably a mechanism that sprays water intermittently onto the processing chamber 11.

  In the water supply mechanism 30, the relative humidity of the gas to be treated in the second treatment layer 22 is 30% or more, more preferably 50% or more, still more preferably 80%, and particularly preferably substantially 100%. Thus, it is preferable to supply water.

  Further, in the processing apparatus 1, the first processing layer 21 is disposed between the bottom wall portion 10 c of the metal housing 10 and a portion to which water is supplied from the water supply mechanism 30. The first treatment layer 21 is a porous layer. For this reason, the corrosive liquid in which the gas to be processed is dissolved is held by the first processing layer 21 that is a porous layer, and hardly reaches the bottom wall portion 10c. Therefore, the housing 10 is also prevented from being damaged by the corrosive liquid.

  In the processing apparatus 1, the 1st processing layer 21 containing the processing agent 14 is provided as a porous layer. For this reason, the ratio of the processing agent 14 in the processing chamber 11 can be increased. Therefore, a high processing capacity of the gas to be processed can be realized.

  In the present embodiment, heat is generated when the processing agent 14 comes into contact with the gas to be processed. For this reason, volatilization of the liquid hold | maintained at the 1st process layer 21 is accelerated | stimulated by the contact with the process agent 14 contained in the 1st process layer 21, and to-be-processed gas. Therefore, the corrosive liquid is less likely to reach the bottom wall portion 10c. Therefore, the housing 10 is more effectively suppressed from being damaged by the corrosive liquid.

  Further, in the processing apparatus 1, the introduction pipe 12 is connected to a portion located below the first processing layer 21 of the housing 10. For this reason, in the processing chamber 11, an air flow is generated from the lower side to the upper side of the first processing layer 21. When the airflow passes through the first treatment layer 21, the volatilization of the liquid held in the first treatment layer 21 is further promoted. Therefore, the corrosive liquid does not easily reach the bottom wall portion 10c. Therefore, the casing 10 is more effectively prevented from being damaged by the corrosive liquid.

  When water is supplied to the region between the first treatment layer 21 and the second treatment layer 22, the humidity of the gas to be treated that passes through the second treatment layer 22 is increased, but the first treatment layer 21. The humidity of the gas to be processed that passes through is not so high. For this reason, it is preferable to make the 1st process layer 21 small and the 2nd process layer 22 large. However, if the first treatment layer 21 is too thin, the ability of the first treatment layer 21 to hold liquid may be reduced. Therefore, the dimension of the second treatment layer 22 in the gas flow direction is preferably larger than the dimension of the first treatment layer 21 in the gas flow direction, and the dimension of the first treatment layer 21 in the gas flow direction. Is preferably 0.05 times to 1 time, more preferably 0.1 times to 0.3 times.

  In the present embodiment, the example in which the first treatment layer 21 that is a porous layer is provided has been described. However, the present invention is not limited to this configuration. Instead of providing the first treatment layer 21, a porous layer not containing a treatment agent may be provided. In this case, the porous layer can be composed of, for example, silica, alumina, zeolite, or the like.

  In this embodiment, the example which provides the porous layer which consists of a foam with which the process particle was carry | supported was demonstrated. However, the present invention is not limited to this configuration. For example, you may provide the powder layer comprised by the process particle as a porous layer. Moreover, you may provide the layer which consists of a sintered body of a process particle as a porous layer.

  Hereinafter, other examples of preferred embodiments of the present invention will be described. In the following description, members having substantially the same functions as those of the first embodiment are referred to by the same reference numerals, and description thereof is omitted.

(Second Embodiment)
FIG. 2 is a schematic cross-sectional view of a gas processing apparatus 1a according to the second embodiment.

  In the gas processing apparatus 1 according to the first embodiment, the example in which the introduction pipe 12 is connected to a portion located below the first processing layer 21 of the housing 10 has been described. However, the present invention is not limited to this configuration. As in the gas processing apparatus 1 a shown in FIG. 2, the introduction pipe 12 may be connected to a portion of the housing 10 positioned above the first processing layer 21. However, in this case, the introduction pipe 12 is connected to the hollow layer 23 provided with the water supply mechanism 30. For this reason, the corrosive liquid in which the gas to be treated is dissolved is more likely to enter the introduction pipe 12 in the processing apparatus 1 a than in the processing apparatus 1. Therefore, as in the processing apparatus 1 according to the first embodiment, the hollow layer 23 to which the water supply mechanism 30 supplies water and the introduction pipe 12 are isolated by the porous layer configured by the first processing layer 21. It is preferable.

  In the processing apparatus 1a, the gas to be processed is not easily supplied to the first processing layer 21. For this reason, it replaces with the 1st process layer 21, and even if it provides the porous layer which does not contain a processing agent, the processing capability of to-be-processed gas does not fall easily.

(Third embodiment)
FIG. 3 is a schematic cross-sectional view of a gas processing apparatus 1b according to the third embodiment.

  As shown in FIG. 3, in the gas processing apparatus 1b, the introduction pipe 12 is connected to the upper part of the processing chamber 11, and the discharge pipe 13 is connected to the lower part. For this reason, the gas to be processed flows from the upper side to the lower side in the processing chamber 11. In such a case, only the second treatment layer 22 that is the main treatment layer of the first and second treatment layers 21 and 22 is provided, and the water supply mechanism 30 is provided above the second treatment layer 22. May be. In the processing apparatus 1b, it is suppressed that the corrosive liquid which the to-be-processed gas melt | dissolves contacts with the introduction pipe 12 and the bottom wall part 10c of the housing | casing 10, and the to-be-processed gas which has high humidity is the whole process layer Can be supplied. Therefore, it becomes possible to process the gas to be processed more efficiently.

(Fourth embodiment)
The gas processing apparatus 1 according to the first embodiment may be further provided with a negative pressure mechanism that makes the inside of the processing chamber 11 a negative pressure. Specifically, for example, a pump for decompressing the processing chamber 11 may be connected to the discharge pipe 13. By providing the negative pressure mechanism, generation of liquid water can be suppressed. Therefore, corrosion of the housing 10 and the introduction pipe 12 can be more effectively suppressed.

(Fifth embodiment)
FIG. 4 is a schematic cross-sectional view of a gas processing apparatus 1c according to the fifth embodiment. As in the gas processing apparatus 1c shown in FIG. 4, a gas supply mechanism P that supplies a gas separately from the gas to be processed may be further provided in the processing chamber 11. By providing the gas supply mechanism P, the total gas flow rate in the processing chamber 11 can be increased. For this reason, vaporization of the corrosive liquid can be promoted. Therefore, corrosion of the housing 10 and the introduction pipe 12 can be more effectively suppressed.

DESCRIPTION OF SYMBOLS 1, 1a, 1b, 1c: Processing apparatus 10: Housing | casing 10a: Side wall part 10b: Top wall part 10c: Bottom wall part 11: Processing chamber 12: Introducing pipe 13: Discharge pipe 14: Processing agent 21: 1st process Layer 22: Second treatment layer 23: Hollow layer 30: Water supply mechanism

Claims (14)

A housing having a processing chamber in which a processing agent that increases the processing capacity of the gas to be processed by increasing the humidity is disposed;
A metal pipe connected to the housing and supplying a gas to be processed to the processing chamber;
A water supply mechanism for supplying water to the treatment chamber;
A gas processing apparatus comprising:   The gas processing apparatus according to claim 1, wherein the water supply mechanism sprays the water into the processing chamber. The housing is made of metal;
The gas processing apparatus according to claim 1, further comprising a porous layer disposed between a bottom wall portion of the housing and a portion to which water is supplied from the water supply mechanism.   The gas processing apparatus according to claim 3, wherein the pipe is connected to a portion of the housing that is located below the porous layer.   The gas processing apparatus according to claim 3 or 4, wherein the porous layer contains the processing agent.   The gas processing apparatus according to any one of claims 3 to 5, further comprising a processing unit that is disposed downstream of the porous layer in the processing chamber and includes the processing agent.   The gas processing apparatus according to any one of claims 3 to 6, wherein the porous layer is composed of a powder layer or a foam having open cells.   The said to-be-processed gas contains at least 1 sort (s) of hydrogen sulfide, hydrogen selenide, hydrogen arsenide, hydrogen phosphide, silicon hydride, and borohydride, as described in any one of Claims 1-7. Gas processing equipment. The gas to be treated contains hydrogen sulfide,
The gas processing apparatus according to claim 1, wherein the processing agent includes iron oxide.   The gas processing apparatus according to any one of claims 1 to 9, further comprising a negative pressure mechanism that makes the processing chamber have a negative pressure.   The gas processing apparatus according to claim 1, further comprising a gas supply mechanism that supplies a gas separately from the gas to be processed into the processing chamber and increases a total flow rate of the gas in the processing chamber. .   The said water supply mechanism is a gas processing apparatus as described in any one of Claims 1-11 which supplies water intermittently.   The gas processing apparatus according to claim 1, wherein the processing agent generates heat when it comes into contact with the gas to be processed.   The gas processing method of processing gas using the gas processing apparatus as described in any one of Claims 1-13.

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