JP2015068644A - Radiation detection device and radiation detection system - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a radiation detection device capable of responding to various photographing conditions.SOLUTION: The radiation detection device 1 includes: a base 112 including a plurality of regions having a sensor substrate 103 on which photoelectric conversion elements 113 are arranged in a matrix shape, and a scintillator section 101 integrally overlaid on the sensor substrate 103; a storage unit 108 for storing the plurality of regions; a driving/winding unit 107 for moving the plurality of regions; and a positioning mechanism for positioning the plurality of regions. The pitch of the arrangement of the photoelectric conversion elements 113 differs between the plurality of regions.

Description

  The present invention relates to a radiation detection apparatus and a radiation detection system used for radiation imaging and the like. In particular, the present invention relates to a radiation detection apparatus used in medical diagnostic imaging equipment, non-destructive inspection equipment, and the like, and a radiation detection system using this radiation detection equipment.

  Patent Document 1 discloses a configuration in which a radiation detection device can be housed by bending, and a sensor in a housing portion is taken in and out as necessary. In the configuration described in Patent Document 1, a decrease in the performance of the radiation detector due to continuous radiation irradiation is attempted to be avoided by appropriately changing the irradiation region.

JP 2011-227045 A

  By the way, in digital radiography (DR), there is a demand for an apparatus that can cope with various photographing conditions by a single device due to diversification of photographing environments. In the configuration described in Patent Document 1, the imaging region of the radiation detection unit can be selected. However, since any shooting area has uniform characteristics, it cannot cope with diversification of shooting conditions. Therefore, a radiation detection device that can cope with further diversification of imaging conditions, specifically, radiation that can respond to various imaging conditions without changing the device even if imaging conditions such as tube voltage change. A detection device is desired. In view of the above circumstances, an object of the present invention is to provide a radiation detection apparatus and a radiation detection system that can cope with various imaging conditions with a single device.

  In view of the above problems, the present invention provides a base on which a plurality of regions having a sensor unit in which sensors are arranged in a matrix and a scintillator unit that is arranged integrally with the sensor unit are arranged; A storage unit that stores the region; a drive mechanism that moves the plurality of regions; and a positioning mechanism that positions the plurality of regions, and the pitch of the sensor array is different for each of the plurality of regions. It is characterized by. Further, the present invention provides a base on which a plurality of sensor units in which sensors are arranged in a matrix, a plurality of scintillator units are arranged, another base separate from the base, and the plurality A first storage section for storing the sensor section, a second storage section for storing the plurality of scintillator sections, a first drive mechanism for moving the plurality of sensor sections, and moving the plurality of scintillator sections. A plurality of scintillator portions having different film thicknesses, and the pitch of the sensor arrangement is determined by the plurality of sensors. It is different for each part. In addition, the present invention provides a sensor unit disposed inside a housing, a plurality of scintillator units disposed on a base, a storage unit that stores the scintillator unit, a drive mechanism that moves the scintillator unit, A positioning mechanism for positioning the scintillator portion, wherein the plurality of scintillator portions have different film thicknesses. According to the present invention, there is provided a base on which a plurality of regions having a sensor unit in which sensors are arranged in a matrix and a scintillator unit formed integrally with the sensor unit are disposed, and the base Separately, another base on which a plurality of reflection layer portions are arranged, a first storage portion that stores the plurality of regions, a second storage portion that stores the plurality of reflection layer portions, A first drive mechanism for moving a plurality of regions; a second drive mechanism for moving the plurality of reflective layer portions; and a positioning mechanism for positioning the plurality of regions and the plurality of reflective layer portions. The film thickness of the scintillator portion is different for each of the plurality of regions, and the plurality of reflective layer portions have different reflectances.

  ADVANTAGE OF THE INVENTION According to this invention, the radiation detection apparatus and radiation detection system which can respond | correspond to several imaging conditions with one radiation detection apparatus can be provided.

It is the cross section and surface conceptual diagram for demonstrating 1st Embodiment. It is a section conceptual diagram for explaining the form of the sensor and scintillator of a 1st embodiment. It is a cross-sectional conceptual diagram for demonstrating 2nd Embodiment. It is a section conceptual diagram for explaining a 3rd embodiment. It is a section conceptual diagram for explaining a 4th embodiment. It is a cross-sectional conceptual diagram for demonstrating the reflective layer part of 4th Embodiment. It is explanatory drawing of the example of application to the radiation detection system using a radiation detection apparatus.

  Hereinafter, embodiments of the radiation detection apparatus of the present invention will be described in detail with reference to the drawings. The radiation detection apparatus according to each embodiment of the present invention is an apparatus in which a scintillator unit and a sensor substrate as a sensor unit are combined. The scintillator unit converts the radiation that has passed through the imaging target region of the patient or the subject into visible light. On the sensor substrate which is an example of the sensor unit, photoelectric conversion elements and switching elements which are examples of the sensor are arranged in a matrix to form a sensor array (photoelectric conversion element array), which is converted from radiation by the scintillator unit. Detect visible light. In the present invention, radiation includes not only X-rays but also electromagnetic waves such as α rays, β rays, and γ rays. Moreover, in each figure, the arrow X shows the incident direction of a radiation.

<About radiation detector>
<First Embodiment>
FIG. 1A and FIG. 1B are schematic views showing a schematic configuration of a radiation detection apparatus 1 according to the first embodiment. FIG. 1A is a view seen from the side of the incident direction of radiation, and FIG. 1B is a view seen from the irradiation direction of the incident line. In the first embodiment, a plurality of scintillator units 101 and a sensor substrate 103 are arranged on one base 112. That is, the sensor substrate 103 as an example of the sensor unit is disposed on the surface of the film-like base 112, and further, a region 114 in which the scintillator unit 101 is provided integrally with the sensor substrate 103 is formed. A plurality of regions 114 in which the sensor substrate 103 and the scintillator unit 101 are integrally formed are overlapped on one film-like base 112. In each region 114, a scintillator protective layer 102 that further protects the scintillator unit 101 may be formed.

  A plurality of regions 114 in which the sensor substrate 103 and the scintillator unit 101 are integrally formed are stacked on the base 112. The base 112 having such a configuration is accommodated in a curved state (a state wound around a roll) inside a storage unit 108 to be described later. In use, the base 112 is pulled out of the storage unit 108 and moved, and a predetermined region 114 out of a plurality of the bases 112 is selected and positioned in the radiation irradiation region 110. The radiation irradiation region 110 is a region where radiation transmitted through a region to be imaged by a patient or a subject is incident during imaging.

  The scintillator unit 101 converts the irradiated radiation into light having a wavelength that can be detected by the sensor substrate 103. For the scintillator unit 101, for example, a needle crystal scintillator made of cesium iodide (CsI: Tl) to which a small amount of thallium (Tl) is added is preferably used. Furthermore, the scintillator unit 101 may have a configuration capable of suppressing damage in the housed state or during movement. For example, the scintillator unit 101 may be partitioned and cut in units of pixels of a photoelectric conversion element 113 (described later, see FIG. 2) installed on the sensor substrate 103. Specifically, the scintillator unit 101 may be partitioned in a matrix like the photoelectric conversion element 113. In this case, in a state in which the base 112 is stored in the storage unit 108 (a state wound on a roll), a configuration in which the scintillator unit 101 is curved so as to be positioned outside the sensor substrate 103 is applied. Is done. When the scintillator portion 101 has a configuration partitioned in a matrix, it can be bent more easily in the housed state, and damage in the bent state can be prevented or suppressed.

When the scintillator unit 101 includes a material that deteriorates due to the influence of the external environment, the scintillator protective layer 102 is preferably provided so as to cover the scintillator unit 101. Examples of materials that deteriorate due to the influence of the external environment include deliquescent materials such as cesium iodide. Note that the scintillator protective layer 102 may be any material and structure that can withstand bending during movement and movement, and the specific material and structure are not limited. As a material that can be used for the scintillator protective layer 102, for example, a metal film such as an aluminum foil, a magnesium foil, or a copper foil can be applied. In addition, a polymer film having low water vapor permeability can be applied. Examples of the polymer film having low water vapor permeability include chlorinated resins such as polyvinyl chloride (PVC), polyvinylidene chloride (PVDC), and polyparaxylylene (parylene), polyvinyl fluoride (PVF), Films of fluororesins such as chloroethylene chloride (PCTFE), polyvinylidene fluoride (PVDF), fluorinated ethylene polymer (FEP), and perfluoroalkoxyl (PFA), and resins such as polyurea are suitable. Incidentally, the water vapor permeability of these films, it is more preferable is preferably at most ^{10g / (m 2 · day)} , at 5g / (m ² · day) or less. The scintillator protective layer 102 has a thickness that can maintain moisture-proof performance. Therefore, for example, the thickness of the scintillator protective layer 102 is preferably 12 μm or more, and more preferably 25 μm or more. Note that the scintillator protective layer 102 may have a structure in which a highly moisture-proof film is bonded to the base film. For example, the scintillator protective layer 102 may have a configuration in which a metal foil such as an Al foil that is a highly moisture-proof film is bonded to a PET film as a base film.

  As the sensor substrate 103 as an example of the sensor unit, a flexible substrate that can be wound is applied. On the sensor substrate 103, a plurality of photoelectric conversion elements 113 (see FIG. 2A), which are examples of sensors, and switching elements (not shown) are arranged in a matrix. Further, a protective layer (not shown) for protecting the photoelectric conversion elements 113 and the switching elements is formed on the sensor substrate 103. For the flexible substrate, for example, a plastic substrate such as a PET (polyethylene terephthalate) substrate is preferably used. Moreover, as long as sufficient flexibility is obtained, a configuration in which a thin glass substrate is used may be used. In this case, for the purpose of preventing damage to the glass substrate, it is preferable that a reinforcing film is provided on the side opposite to the surface on which the photoelectric conversion element 113 is formed. The photoelectric conversion element 113 detects visible light converted from radiation (such as X-ray having patient information) by the scintillator unit 101. Each photoelectric conversion element 113 is connected to a switching element and wiring (not shown). Then, the sensor substrate 103 transmits an electrical signal converted from visible light by the photoelectric conversion element 113 to a signal processing circuit substrate (not shown) provided in the storage unit 108. As the photoelectric conversion element 113 and the switching element, those that can withstand bending are applied. For example, an amorphous silicon (a-Si) semiconductor, an amorphous oxide semiconductor, an organic semiconductor, a carbon nanotube, or the like is preferably used. As the amorphous oxide semiconductor, for example, an In—Ga—Zn—O-based amorphous oxide semiconductor can be used. As the organic semiconductor, for example, a phthalocyanine compound, a pentacene compound, a polythiophene compound, or the like can be applied. For the photoelectric conversion element 113 and the switching element, a material that is not altered or destroyed by the formation process of the scintillator portion 101 is applied.

The sensor substrate 103 may be provided with a protective layer (not shown) that protects the photoelectric conversion element 113 and the like. In particular, when deterioration such as corrosion occurs due to the material of the scintillator portion 101, it is preferable to form a protective layer. As the protective layer, for example, an inorganic protective layer such as SiO ₂ or Al ₂ O ₃ or an organic protective layer such as polyimide can be applied. However, the material of the protective layer is not particularly limited as long as it is not deteriorated or destroyed by the curved state of the storage state.

  In the present embodiment, a plurality of sensor substrates 103 are provided on one base 112, and the scintillator unit 101 is provided so as to be superimposed on each sensor substrate 103. Further, a scintillator protective layer 102 is formed so as to cover each scintillator portion 101. That is, a plurality of regions 114 in which the sensor substrate 103, the scintillator unit 101, and the scintillator protection layer 102 are integrally formed are overlapped on one base 112. And each area | region 114 has a mutually different characteristic.

  FIG. 2 is a diagram schematically showing the configuration of the region 114 arranged on the base 112. As shown in FIG. 2A, an example of a configuration in which two regions 114 of region A and region B are formed on one base 112 will be described. The scintillator portions 101 in the region A and the region B have the same characteristics such as film thickness, resolution, and sensitivity characteristics. In contrast, the photoelectric conversion elements 113 arranged in a matrix on the sensor substrate 103 have different arrangement pitches in the area A and the area B. For example, the array pitch P1 in the region A is set to 50 μm, and the array pitch P2 in the region B is set to 150 μm. Thus, the characteristics of the sensor substrate 103 are different for each region 114. In such a configuration, when a high-definition image is required, shooting is performed using the area A, and shooting is normally performed using the area B. This can be performed by the radiation detection apparatus 1. Therefore, one radiation detection apparatus 1 can cope with various imaging conditions.

  An example of a configuration in which two regions of region C and region D are provided on one base 112 as shown in FIG. The pitch of the arrangement of the photoelectric conversion elements 113 on the sensor substrate 103 is the same in the region C and the region D. On the other hand, the film thickness of the scintillator unit 101 differs between the region C and the region D. For example, the film thickness T1 of the scintillator portion 101 in the region C is set to 500 μm, and the film thickness T2 of the scintillator portion 101 in the region D is set to 1000 μm. As described above, a plurality of sensor substrates 103 are arranged on one base 112, and the scintillator portions 101 having different film thicknesses T1 and T2 are integrally formed on each sensor substrate 103 so as to overlap each other. With such a configuration, for example, the region C is used for normal imaging, and the region D is used when imaging with a high tube voltage is required. This can be done with the device 1. Therefore, one radiation detection apparatus 1 can cope with various imaging conditions.

  In the above description, the configuration in which the pitch of the photoelectric conversion elements 113 arranged in a matrix and the film thickness of the scintillator unit 101 are individually set has been described, but these may be set in combination. . In the above description, the configuration in which two regions 114 having different characteristics are arranged on one base 112 is shown. However, the number of regions 114 to be arranged, that is, the types of characteristics is not limited to two. Absent.

  Next, the structure of the other part of the radiation detection apparatus 1 is demonstrated with reference to FIG. The radiation detection apparatus 1 includes a housing 109, and a base 112 and each part and each mechanism described later are disposed inside the housing 109.

  The storage unit 108 stores the base 112 in a curved state (a state wound around a roll). That is, a roll around which the base 112 is wound is rotatably stored in the storage unit 108. The storage unit 108 may be configured to be able to rotatably store the roll around which the base 112 is wound, and the specific configuration is not limited. For example, the storage unit 108 can be a cylindrical or box-shaped container. The storage unit 108 is provided with a signal processing circuit board (not shown) for operating the sensor board 103. The signal processing circuit board is provided with a drive circuit unit, an image signal processing circuit unit, a data transfer circuit unit, and the like. The drive circuit unit drives the sensor substrate 103. The image signal processing circuit unit performs predetermined image processing on the image signal such as reading and amplifying the image signal (electric signal) generated by the sensor substrate 103. The data transfer circuit unit outputs the image signal to an external device. The external device is, for example, an image image processing device or a data storage device. Note that a part or all of the drive circuit unit, the image signal processing circuit unit, and the data transfer circuit unit may be provided on the base 112.

  The storage unit 108 is provided with an extraction unit 106. The take-out part 106 is a part through which the base 112 on which a plurality of regions 114 are arranged moves between the inside and the outside of the storage part 108. The take-out unit 106 may be provided with a guide or the like for changing the moving direction of the base 112 on which the region 114 is arranged. In the example shown in FIG. 1, the traveling direction of the base 112 is changed by about 60 ° in the take-out portion 106. Such a mechanism contributes to miniaturization of the radiation detection apparatus 1. The take-out unit 106 may be provided with a static elimination mechanism that removes static electricity. By installing this static elimination mechanism, it is possible to remove frictional static electricity generated at the portion where the base 112 contacts the extraction portion 106. Therefore, shooting in a more stable state (acquisition of an image signal) is possible. A known configuration can be applied to the static elimination mechanism. In short, any configuration that can remove static electricity accumulated on the scintillator unit 101 and the sensor substrate 103 of the base 112 may be used. Furthermore, a dust removal mechanism may be installed in the extraction unit 106 in addition to the above-described charge removal mechanism. According to such a mechanism, dust attached to the region 114 of the base 112 can be removed. For this reason, durability and reliability of the radiation detection apparatus 1 can be improved. The dust removal mechanism may be configured to remove dust attached to the region 114 of the base 112, and the configuration is not limited. Various known dust removal mechanisms can be applied to the dust removal mechanism.

  A driving / winding unit 107, which is an example of a driving mechanism, rotationally drives a roll around which the base 112 is wound. As a result, a predetermined one of the plurality of regions 114 arranged on the base 112 is moved to the radiation irradiation region 110. The driving / winding unit 107 has a driving motor (not shown) that rotationally drives a roll around which the base 112 is wound. In the present embodiment, it is preferable that a motor capable of relatively precise positioning, such as a servo motor or a stepping motor, is applied as the driving motor. Further, the storage unit 108 is provided with a motor drive circuit unit that drives a motor for driving the drive / winding unit 107. When a positioning sensor 105 (described later) for detecting the position of the area 114 is provided, the motor drive circuit unit performs feedback control for obtaining position information feedback from the positioning sensor 105 and determining the position of the area 114.

  The radiation detection apparatus 1 preferably has a configuration in which a pressing mechanism 104 and a pressing mechanism driving unit (not shown) for driving and controlling the pressing mechanism 104 are provided as a fixing mechanism for fixing the region 114. The pressing mechanism 104 fixes the region 114 to the radiation irradiation region 110 after moving one of the plurality of regions 114 arranged on the base 112 used for imaging to the radiation irradiation region 110. In the pressing mechanism 104, at least the side of the region 114 that comes into contact with the scintillator protective layer 102 is formed into a flat surface. The pressing mechanism driving unit fixes the region 114 where the scintillator unit 101 and the sensor substrate 103 are formed to the radiation irradiation region 110 by pressing the pressing mechanism 104 against the scintillator protective layer 102 in the region 114. . Therefore, it is possible to perform imaging in a state where the scintillator unit 101 and the sensor substrate 103 are stable. The pressing mechanism 104 illustrated in FIG. 1 is a mechanism that can be attached to and detached from the housing 109 and is movable. The pressing mechanism driving unit can reciprocate the pressing mechanism 104. For example, the pressing mechanism driving unit includes a driving force source (such as a motor or an actuator) that drives the pressing mechanism 104 and a circuit board (control circuit unit) on which a control circuit that controls the driving force source is mounted. . The pressing mechanism drive unit moves the pressing mechanism 104 away from the scintillator protection layer 102 in the region 114 when moving or changing the region 114 to be used. When shooting is performed after the movement is completed, the pressing mechanism driving unit presses the pressing mechanism 104 against the scintillator protection layer 102 in the region 114 to be used. Note that the pressing mechanism 104 may not be used as long as the region 114 including the sensor substrate 103 and the scintillator unit 101 can be sufficiently fixed. For example, the base 112 may be pulled by the driving force of the driving / winding unit 107 and may be fixed so as not to move by maintaining the tensioned state.

  Moreover, the radiation detection apparatus 1 may have a positioning mechanism for moving the region 114 used for imaging to the radiation irradiation region 110 with high accuracy. As the positioning mechanism, a positioning sensor 105 that can detect the marker 111 provided on the base 112 is applicable. Specifically, the positioning sensors 105 are provided at a plurality of locations on the outer periphery of the pressing mechanism 104 and outside the radiation irradiation region 110. The marker 111 is provided at a position detected by the positioning sensor 105 when the area 114 to be used is located in the radiation irradiation area 110. According to such a configuration, the region 114 used for imaging can be accurately positioned in the radiation irradiation region 110. As the positioning sensor 105, for example, a non-contact type sensor such as a light detection method, a laser detection method (transmission type, reflection type), a magnetic method (eg, a Hall element), an infrared detection method, or the like can be used. The marker 111 may have any configuration that can be detected by the positioning sensor 105. Note that the positioning sensor 105 may be provided on the base 112 and the marker 111 may be provided on the pressing mechanism 104. In addition, the driving / winding unit 107 of the sensor substrate 103 can precisely control the feed amount of the base 112, thereby positioning the region 114 to be used. In this case, the positioning sensor 105 (positioning mechanism) described above is not particularly necessary.

  In addition, the radiation detection apparatus 1 is provided with an operation unit for a user (examiner) to operate the radiation detection apparatus 1. The operation unit is provided with operation members (for example, a switch and an operation panel) for operating and setting the radiation detection apparatus 1. The user (examiner) selects the region 114 to be used for imaging by operating the operation member of the operation unit. When the operation unit detects an operation of selecting the region 114 by the user, first, the pressing mechanism driving unit moves the pressing mechanism 104 from the scintillator protective layer 102 in the region 114 currently located in the radiation irradiation region 110. Release. Then, the motor driving circuit unit drives the driving motor of the driving / winding unit 107 to move the selected region 114 to the radiation irradiation region 110. At this time, if the positioning sensor 105 is provided, the motor driving circuit unit feedback-controls the driving / winding unit 107 using the detection result of the positioning sensor 105. When the selected area 114 is positioned in the radiation irradiation area 110, the pressing mechanism driving unit (not shown) moves the pressing mechanism 104 and presses it against the scintillator protective layer 102 in the positioned area 114. Note that the user may directly select the region 114 used for imaging in the operation unit, and the motor driving circuit unit may move the selected region 114 to the radiation irradiation region 110. In addition, even if the user performs an operation of inputting imaging conditions in the operation unit, the motor drive circuit unit selects the area 114 suitable for the input imaging conditions and moves it to the radiation irradiation area 110. Good.

  In addition, the radiation detection apparatus 1 concerning this embodiment may have a computer provided with CPU, ROM, RAM, and an interface. In this case, a computer program for controlling the radiation detection apparatus 1 is stored in the ROM in advance. Then, the CPU reads out the computer program stored in the ROM, expands it in the RAM, and executes it. Thus, the computer functions as each part of the radiation detection apparatus 1 and the above-described operation is realized.

  As described above, the motor drive circuit unit and the signal processing circuit board control and drive the drive / winding unit 107, select the region 114 having appropriate characteristics for the set imaging conditions, and select the radiation irradiation region. Move to 110.

  In addition, the storage unit 108 may be provided with a heating mechanism for heating the scintillator unit 101 such as a heater. The heating mechanism performs a recovery process when the scintillator unit 101 has deteriorated due to multiple irradiations of radiation. The heating mechanism may be any configuration that can heat the scintillator unit 101, and the configuration is not limited. Various known heaters can be applied to the heating mechanism.

<Second Embodiment>
Next, a second embodiment will be described. In addition, the same code | symbol is attached | subjected about the same structure as 1st Embodiment, and description is abbreviate | omitted. 3A and 3B are schematic cross-sectional views of the schematic configuration of the radiation detection apparatus 1 according to the second embodiment. 3A shows a state when the base 112 is moved, and FIG. 3B shows a state when photographing. In the second embodiment, the sensor substrate 203 and the scintillator unit 101 are formed separately. A plurality of regions 214 in which the scintillator unit 101 and the scintillator protective layer 102 that protects the scintillator unit 101 are formed are arranged on the base 112. One sensor substrate 203 is provided on the housing 109 of the radiation detection apparatus 1. In the second embodiment, the sensor substrate 203 and the scintillator protection layer 102 in the region 214 of the base 112 are brought into contact with each other during photographing.

  Unlike the first embodiment, the sensor substrate 203 is formed separately from the base 112. The sensor substrate 203 is installed inside the housing 109. The sensor substrate 203 of the second embodiment may have a configuration having flexibility as in the first embodiment, or may have a configuration without flexibility. For example, the sensor substrate 203 may be configured by a glass plate. In the case where the sensor substrate 203 has a configuration that does not have flexibility, in addition to the same material as that of the first embodiment, a semiconductor material such as polycrystalline silicon or crystalline silicon is used for the sensor substrate 203. Can do.

  The sensor substrate 203 is supported inside the housing 109 by a member such as a pressing support base 213. The pressing support base 213 is a base for fixing the sensor substrate 203. When irradiation radiation enters the radiation irradiation region 110 from the sensor substrate 203 side, the pressing support base 213 is preferably formed of a radiation transmissive material. As the material having high radiation transparency, a general plastic material (for example, acrylic resin such as PMMA, PET resin, Teflon (registered trademark), ABS resin, etc.), amorphous carbon, CFRP, or the like is preferable. At the time of photographing, as shown in FIG. 3B, the pressing mechanism 104 and the pressing support base 213 include the sensor substrate 203 and the scintillator portion 101 and the scintillator protective layer in the region 214 disposed on the base 112. 102. The pressing mechanism 104 applies pressure so as not to damage the scintillator unit 101 and the scintillator protective layer 102 in the region 214. The radiation detection apparatus 1 includes a pressing mechanism drive unit (not shown) that drives the pressing mechanism 104 and the pressing support base 213. The pressing mechanism driving unit includes a driving source (for example, a motor or an actuator) for the pressing mechanism 104 and the pressing support base 213, and a control unit (for example, a circuit board on which a control circuit is constructed) that controls the driving source. Have 3A and 3B show a configuration in which both the pressing mechanism 104 and the pressing support base 213 are driven, at least one (for example, only the pressing mechanism 104) is driven. Any configuration may be used.

The base 112 has flexibility as in the first embodiment. A configuration common to that of the first embodiment can be applied to the base 112. The same scintillator unit 101 and scintillator protection layer 102 in the region 214 disposed on the base 112 are applied as in the first embodiment. That is, the base 112 is provided with a plurality of regions 214 where the scintillator unit 101 and the scintillator protective layer 102 are formed. The film thickness of the scintillator unit 101 differs for each region 214. Then, the driving / winding unit 107 selects one of the plurality of regions 214 in accordance with an operation on the operation unit, and moves the selected region 214 to a position overlapping the sensor substrate 203 for positioning.
According to such a configuration, it is possible to perform imaging by selecting one of the plurality of regions 214 having the scintillator unit 101 whose characteristics are suitable for imaging conditions. Accordingly, it is possible to deal with various shooting conditions as in the first embodiment.

<Third Embodiment>
Next, a third embodiment will be described. In the third embodiment, a first base on which a plurality of first regions on which sensor substrates are provided is arranged is different from a second base on which a plurality of second regions on which scintillator units are provided are arranged. It is a form formed in the body. Furthermore, the radiation detection apparatus 1 according to the second embodiment includes a first storage unit that stores the first base, a first drive mechanism that moves the first base, and a second base. And a second drive mechanism for moving the second base. And a 1st base and a 2nd base can be moved separately independently. FIG. 4 is a schematic diagram illustrating a schematic configuration of the radiation detection apparatus 1 according to the third embodiment. FIG. 4A shows a state when the scintillator unit 101 and the sensor substrate 103 are moved, and FIG. 4B shows a state when photographing. In addition, the same code | symbol is attached | subjected to the same structure as 1st or 2nd embodiment, and description is abbreviate | omitted. On one base 312 which is an example of the first base, a plurality of regions 314 which are examples of the first region where the sensor substrate 103 is provided are arranged. The sensor substrate 103 has the same configuration as that of the first embodiment, and is particularly flexible. The arrangement pitch of the photoelectric conversion elements 113 on the sensor substrate 103 is different for each region 314. On the other base 112 that is an example of the second base, a plurality of regions 214 that are examples of the second region in which the scintillator portion 101 and the scintillator protective layer 102 are formed are arranged. The scintillator unit 101 has a different film thickness (ie, characteristic) for each region 214. The base 112 has a common configuration with the base 112 of the second embodiment.

  The radiation detection apparatus 1 according to the present embodiment is provided with a plurality of storage units 108. Of the plurality, the storage unit 108 that stores one base 312 is an example of the first storage unit, and the storage unit 108 that stores the other base 112 is an example of the second storage unit. . In the present embodiment, the storage unit 108 that stores one base 312 and the storage unit 108 that stores the other base 112 are provided separately. Each storage unit 108 is provided with a driving / winding unit 107 that rotationally drives the roll. Of these, the drive / winding unit 107 that drives the roll around which one base 312 is wound is an example of the first drive mechanism. The driving / winding unit 107 that drives the roll around which the other base 112 is wound is an example of the second driving mechanism. These drive / winding units 107 can independently rotate the roll. Therefore, one base 312 and the other base 112 can be moved separately and independently.

  As shown in FIG. 4B, at the time of imaging, the sensor substrate 103 in the region 314 of one base 312 and the scintillator protection layer 102 in the region 214 of the other base 112 are positioned in the radiation irradiation region 110. To be in contact. In order to create this state, the pressing support base 213 and the pressing mechanism 104 sandwich the scintillator portion 101 in the region 314 of one base 312 and the sensor substrate 103 in the region 214 of the other base 112. To do. The configuration for driving the pressing support base 213 and the pressing mechanism 104 can be the same as that of the second embodiment. Each drive / winding unit 107 selects one of a plurality of regions 214 and 314 arranged on each of the two bases 112 and 312 according to an operation on the operation unit. Then, the selected areas 214 and 314 are moved to the radiation irradiation area 110 and positioned. Note that the same configuration as that of the first embodiment can be applied to the positioning mechanisms of the regions 214 and 314. According to such a configuration, the scintillator unit 101 and the sensor substrate 103 having different characteristics can be combined according to the photographing conditions. Therefore, shooting can be performed according to various shooting conditions. Further, the storage unit 108 is provided with a dust removal mechanism for removing dust from the bases 112 and 312. Further, the storage unit 108 that stores the other base 112 is provided with a static elimination mechanism that removes static electricity accumulated in the scintillator unit 101. The dust removal mechanism and the charge removal mechanism are the same as those in the first embodiment.

<Fourth Embodiment>
Next, a fourth embodiment will be described. In the fourth embodiment, a first base in which a plurality of first regions in which sensor substrates and scintillator portions are provided is arranged, and a second base in which a plurality of second regions in which reflective layer portions are provided are arranged. In this form, the base is formed separately. Furthermore, the radiation detection apparatus 1 according to the second embodiment includes a first storage unit that stores the first base, a first drive mechanism that moves the first base, and a second base. And a second drive mechanism for moving the second base. And a 1st base and a 2nd base can be moved separately independently. FIG. 5 is a schematic diagram illustrating a schematic configuration of the radiation detection apparatus 1 according to the fourth embodiment. FIG. 5A shows a state when the two bases 112 and 412 are moved, and FIG. 5B shows a state when photographing. In addition, the same code | symbol is attached | subjected to the same structure as either of the 1st to 3rd embodiment, and description is abbreviate | omitted. In the fourth embodiment, two bases 112 and 412 formed separately are applied. On one base 112 that is an example of the first base, a plurality of regions 214 in which the sensor substrate 103 and the scintillator unit 101 are integrally formed are arranged. On the other base 412 that is an example of the second base, a plurality of regions 414 where the scintillator reflection layer portions 417 are formed are arranged.

  As shown in FIG. 5A, the radiation detection apparatus 1 is provided with a plurality of storage units 108. The storage unit 108 that stores the one base 112 is an example of the first storage unit. The storage unit 108 that stores the other base 412 is an example of the second storage unit. In the present embodiment, a storage unit 108 that stores one base 112 and a storage unit 108 that stores the other base 412 are provided separately. Each storage unit 108 is provided with a driving / winding unit 107. Among these, the drive / winding unit 107 that drives the roll around which the one base 112 is wound is an example of the first drive mechanism. The driving / winding unit 107 that drives the roll on which the other base 412 is wound is an example of the second driving mechanism. These drive / winding units 107 can independently rotate the roll. Therefore, one base 112 and the other base 412 can be moved separately and independently. Each storage unit 108 is provided with a dust removal mechanism for removing dust from one base 112 and the other base 412. Further, the storage unit 108 in which one base 412 is stored is provided with a heating mechanism for heating the scintillator unit 101. These dust removal mechanism and heating mechanism can be applied with the same configuration as in the first embodiment.

  As shown in FIG. 5A, a plurality of regions 214 in which the sensor substrate 103, the scintillator unit 101, and the scintillator protection layer 102 are integrally formed are arranged on one base 112. One base 112 is stored in the storage unit 108 in a curved state (in a state wound around a roll). The drive / winding unit 107 can selectively move the plurality of regions 214 arranged on the base 112 to the radiation irradiation region 110 by driving the roll. These configurations are the same as those in the second embodiment. On the other base 412, a plurality of regions 414 where the scintillator reflection layer portions 417 are formed are arranged. The base 412 is stored in the storage unit 108 in a curved state (in a state wound on a roll). The drive / winding unit 107 can selectively move the plurality of regions 414 arranged on the base 412 to the radiation irradiation region 110 by driving the roll. As these configurations, configurations common to the one base 112 can be applied. As shown in FIG. 5B, at the time of shooting, the pressing support base 213 and the pressing mechanism 104 are selected from a plurality of areas 214 arranged on one base 112 and the other base. One selected from a plurality of regions 414 arranged in 412 is sandwiched and brought into contact.

  FIG. 6 is a diagram schematically showing the configuration of the base 412. As shown in FIG. 6, the base 412 has a plurality of regions 414 where the scintillator reflection layer portions 417 are formed. The characteristics of the scintillator reflection layer portion 417 are different for each region 414. An example of the characteristic of the scintillator reflection layer portion 417 is reflectance. In this case, the reflectivity of the scintillator reflection layer portion 417 is different for each region 414. FIG. 6 shows an example of a configuration in which two regions 414 are arranged (that is, an example in which there are two types of reflectivity), but the number of regions 414 (types of reflectivity) is not limited. Each drive / winding unit 107 selects one of a plurality of regions 214 and 414 arranged on the bases 112 and 412 in accordance with an operation on the operation unit, and sets the radiation irradiation region 110 as one. Move. Then, the two regions 214 and 414 of the two selected bases 112 and 412 are overlapped to perform photographing. According to such a configuration, the region 414 in which the scintillator reflection layer portion 417 is formed and the region 214 in which the scintillator portion 101 and the sensor substrate 103 are integrally formed can be combined in a combination suitable for imaging conditions. Therefore, it can cope with various photographing conditions.

[First embodiment]
The first embodiment is an embodiment of the radiation detection apparatus shown in FIG.

  First, the sensor substrate 103 is formed on a polyimide sheet having a thickness of 200 μm as the base 112. The polyimide sheet as the base 112 has a width of 380 mm and a length of 1500 mm. As a method for forming the sensor substrate 103, first, a method of forming a photoelectric conversion element and a TFT using amorphous silicon, and finally forming a sensor protective layer using polyimide having a thickness of 5 μm is applied. The pitch of the arrangement of the photoelectric conversion elements 113 is 100 μm. Three regions (region A, region B, region C) where the sensor substrate 103 is formed are arranged on the polyimide sheet. The size of each region is 360 × 440 mm. Further, a wiring for driving the sensor is formed at a place where the positioning sensor 105 is installed. Next, thallium-added cesium iodide (CsI: Tl) is formed by vapor deposition as the scintillator portion 101 so as to overlap the sensor protective layer. The film thickness of thallium-added cesium iodide is set to 200 μm in region A, 500 μm in region B, and 800 μm in region C. Further, the thallium-added cesium iodide is cut at regular intervals and partitioned into a matrix in order to prevent destruction in a curved state. After the formation of the scintillator portion 101, polyparaxylylene having a thickness of 15 μm is formed as the scintillator protection layer 102 so as to cover the scintillator portions 101 in the regions A to C. Thereafter, a scintillator reflection layer portion made of an Al foil having a thickness of 12 μm is adhered to the surface of the scintillator protection layer 102. Next, a plurality of Hall elements are installed as positioning sensors 105 at predetermined positions on the base 112. Next, a drive circuit unit for driving the sensor substrate 103 and a sensor drive circuit unit for driving the positioning sensor 105 are provided at both ends of the polyimide sheet as the base 112. And the base 112 (base 112 in which the scintillator part 101, the sensor board | substrate 103, and other circuit parts were formed) which passed through the above process is wound up with a roll. Thereafter, the roll around which the base 112 is wound is stored in the storage unit 108. The take-out unit 106 for taking out the base 112 is provided with a charge removal blow having a charge removal / dust removal function as a charge removal mechanism and a dust removal mechanism. In addition, the storage unit 108 is provided with a heating mechanism for the purpose of restoring the characteristics of the scintillator unit 101. In the heating mechanism, a ceramic heater is installed in the vicinity of the extraction unit 106 in accordance with the shape of the extraction unit 106. In this embodiment, a ceramic heater capable of heating up to about 200 ° C. at the highest temperature is installed as a heating mechanism. A base 112 on which a plurality of regions 114 composed of the scintillator section 101 and the sensor substrate 103 are arranged is fixed via a guide installed at a predetermined position inside the housing 109. Further, a pressing mechanism 104 and a pressing mechanism driving unit are disposed inside the housing 109. The pressing mechanism 104 is a plate-like member having a thickness of about 50 mm and a surface direction dimension of 350 × 430 mm. Silicon rubber having a thickness of about 5 mm is provided on the surface of the pressing mechanism 104. The radiation detection apparatus 1 according to the first embodiment is manufactured through the above steps.

  According to the radiation detection apparatus 1 according to the first embodiment, it is possible to perform imaging while changing the imaging region under a plurality of irradiation conditions. In the first embodiment, the radiation (X-ray) irradiation range is narrowed down to the radiation irradiation region 110, and the sensor substrate 103 and the scintillator protection layer 102 are allowed to pass through so that the radiation is incident on the scintillator unit 101. When a high-definition image at a low tube voltage (for example, about 30 kVp) is required, the region A in which the film thickness of the scintillator unit 101 is 200 μm is selected. By using this area A, an image reflecting the fine structure of the non-imaging area can be acquired. At an intermediate tube voltage (for example, about 70 kVp), the region B where the film thickness of the scintillator portion 101 is 500 μm is selected. In this region B, it can be used for general photographing, and an image in which sensitivity and sharpness are balanced can be acquired. At a high tube voltage (for example, about 130 kVp), the region C where the film thickness of the scintillator unit 101 is 800 μm is selected. This region C is preferably applied to a test substance having a large thickness.

[Second embodiment]
The second example is an example in which the film thickness of the scintillator unit 101 is set constant in the areas A to C of the first example, and the pitch of the arrangement of the photoelectric conversion elements 113 is varied. In the areas A to C, the film thickness of the scintillator unit 101 is set to 500 μm. On the other hand, the pitch of the arrangement of the photoelectric conversion elements 113 is set to 50 μm in the region A, 100 μm in the region B, and 200 μm in the region C. Other configurations are the same as those of the first embodiment. According to the radiation detection apparatus 1 according to the second embodiment, imaging is normally performed in the area B, the area A is used for applications that require resolution, and the area C is used for applications that require sensitivity. . Thus, the single radiation detection apparatus 1 can cope with a plurality of imaging conditions.

[Third embodiment]
As shown in FIG. 3, the third embodiment is an embodiment having one sensor substrate 203 and a plurality of scintillator portions 101 arranged on a sheet-like base 112. Then, one of the plurality of scintillator units 101 is selected and brought into contact with the sensor substrate 203 to perform photographing. Only the parts different from the first embodiment will be described here. First, the photoelectric conversion element 113 and the TFT are formed on the surface of the glass substrate. In addition, a drive circuit portion for driving the photoelectric conversion element 113 and the TFT is provided around the area where the photoelectric conversion element 113 and the TFT are formed. Then, a polyimide resin having a thickness of 5 μm is formed on the surfaces of the photoelectric conversion element 113 and the TFT. Next, the scintillator and the scintillator protective layer 102 are formed on the base 112. In this embodiment, a polyimide sheet having a thickness of 200 μm is used as the base 112. Then, an Al foil having a thickness of 12 μm is bonded to the surface of the polyimide sheet as the base 112 via a heat-resistant epoxy adhesive (for example, a heat-resistant epoxy adhesive Durarco 7050 manufactured by Taiyo Wire Mesh Co., Ltd.). Next, a plurality of scintillator portions 101 are formed using the same method as in the first embodiment. As a result, three areas of area A, area B, and area C are arranged on the base 112. CsI: Tl is formed as the scintillator unit 101. The film thickness of the scintillator section 101 is 200 μm in the region A, 500 μm in the region B, and 800 μm in the region C. Then, after the scintillator portion 101 is formed, a polyparaxylylene film having a thickness of 15 μm is formed. Further, the positioning sensor is installed on the scintillator support base, and the scintillator position is determined together with the positioning sensor installed on the pressing mechanism. The subsequent steps are the same as in the first embodiment. The radiation detection apparatus 1 according to the second embodiment has the same effects as the first embodiment. However, since only one sensor substrate 103 is required and the sensor substrate 103 does not have to be disposed on the film-like base 112, the component configuration and the manufacturing process can be simplified.

[Fourth embodiment]
In the fourth embodiment, as shown in FIG. 4, the sensor substrate 103 and the scintillator unit 101 are separate bodies, and each can be changed separately and independently. Here, only the configuration different from the first to third embodiments will be described, and the description of the common configuration will be omitted. As the sensor substrate 103, a flexible substrate is applied as in the first embodiment. The scintillator unit 101 and the scintillator protective layer 102 have the same configuration as that of the third embodiment. The positioning sensor 105 is installed on each of the base 312 that supports the sensor substrate 103 and the base 112 that supports the scintillator unit 101. The pressing support base 213 and the pressing mechanism 104 have the same configuration as that of the third embodiment. The radiation detection apparatus 1 according to the fourth embodiment can select a combination of the sensor substrate 103 and the scintillator unit 101 suitable for imaging conditions.

[Fifth embodiment]
Next, an embodiment of a radiation detection system to which the radiation detection apparatus according to any one of the above embodiments is applied will be described. FIG. 7 is a diagram schematically showing the configuration of the radiation detection system according to the example of the present invention.
An X-ray tube 6050, which is an example of a radiation generating means, generates X-rays 6060. The X-ray 6060 passes through the imaging target region (shown here as the chest 6062) of the patient or the subject 6061 and enters the radiation detection apparatus 1 according to any one of the above embodiments. The X-ray incident on the radiation detection apparatus 1 includes information on the inside of the patient or the subject 6061 body. The scintillator unit 101 emits light corresponding to the incidence of X-rays. The photoelectric conversion element 113 of the sensor substrate 103 photoelectrically converts light emitted from the scintillator unit 101 in response to X-rays. Thereby, information inside the body of the patient or subject 6061 can be obtained as an electrical signal. The signal processing circuit of the radiation detection apparatus 1 converts this electrical signal into a digital format and transmits it to an image processor 6070 serving as a signal processing means. The image processor 6070 performs image processing on the transmitted electrical signal, and outputs and displays it on a display 6080 which is an example of display means provided in the control room. For this reason, the examiner or the like can observe information inside the body of the patient or the subject 6061 as an image. Further, the image processor 6070 can transfer this electric signal to a remote place by transmission processing means such as a network 6090 such as a telephone, a LAN, and the Internet. For example, the image processor 6070 can transmit the electric signal to a display 6081 serving as a display unit such as a doctor room in another place to display the electric signal. Or it can preserve | save in recording means, such as an optical disk. For this reason, it is possible for a remote doctor to make a diagnosis. Moreover, it can also record on the film 6110 by the film processor 6100 used as a recording means. Further, the image processor 6070 can transmit this electrical signal to the film processor 6100. The film processor 6100 can create a film 6110 that includes information inside the body of the patient or subject 6061 from the received electrical signal using a laser printer.

  The radiation detection apparatus according to the present invention can be applied to a medical radiation detection apparatus or a non-medical analysis / inspection apparatus using radiation, such as a nondestructive inspection apparatus.

Claims (13)

A base on which a plurality of regions each having a sensor unit in which sensors are arranged in a matrix and a scintillator unit arranged to overlap the sensor unit are arranged;
A storage section for storing the base;
A drive mechanism for moving the base;
A positioning mechanism for positioning the region in a region where radiation is incident;
Have
The radiation detector according to claim 1, wherein a pitch of the sensor array is different for each region. A sensor unit disposed inside the housing;
A base on which a plurality of regions where the scintillator portion is provided are arranged;
A storage section for storing the base;
A drive mechanism for moving the base;
A positioning mechanism for positioning the scintillator portion in a region where radiation is incident;
Have
The radiation detector according to claim 1, wherein the scintillator section has a different film thickness for each region. A first base on which a plurality of first regions provided with sensor parts in which sensors are arranged in a matrix are arranged;
A plurality of second regions in which scintillator portions are provided, a second base separate from the first base;
A first storage section for storing the first base;
A second storage portion for storing the second base;
A first drive mechanism for moving the first base;
A second drive mechanism for moving the second base;
A positioning mechanism for positioning the first region and the second region in a region where radiation is incident;
Have
The pitch of the sensor array is different for each of the first regions,
The scintillator section has a different film thickness for each of the second regions. A first base on which a plurality of first regions in which a sensor unit in which sensors are arranged in a matrix and a scintillator unit formed to overlap the sensor unit are provided are arranged;
A second base that is separate from the first base and in which a plurality of second regions in which the reflective layer portion is provided are disposed;
A first storage section for storing the first base;
A second storage portion for storing the second base;
A first drive mechanism for moving the first base;
A second drive mechanism for moving the second base;
A positioning mechanism for positioning the first region and the second region;
Have
The film thickness of the scintillator portion is different for each first region,
The radiation detector according to claim 1, wherein the reflection layer portion has a different reflectance for each of the second regions. The radiation detection apparatus according to claim 1, wherein the storage unit is provided with a static elimination mechanism that removes static electricity from the base. The first storage unit is provided with a static elimination mechanism for removing static electricity from the first base,
The radiation detection apparatus according to claim 3, wherein the second storage unit is provided with a static elimination mechanism that removes static electricity from the second base. The radiation detection apparatus according to claim 1, wherein the storage unit is provided with a dust removal mechanism for removing dust from the base. The first storage unit is provided with a dust removal mechanism for removing dust from the first base,
The radiation detection apparatus according to claim 3, wherein the second storage unit is provided with a dust removal mechanism that removes dust from the second base. The radiation detection apparatus according to claim 1, wherein the storage unit includes a heating mechanism that heats the scintillator unit. 9. The heating mechanism for heating the scintillator section is provided in any one of the first storage section and the second storage section. 9. Radiation detection equipment. The radiation detection apparatus according to claim 1, wherein the scintillator section includes cesium iodide. The radiation detection apparatus according to claim 11, wherein a scintillator protective layer is disposed in the scintillator section. Radiation detection means for detecting radiation;
Signal processing means for processing signals from the radiation detection means;
Have
The radiation detection system according to claim 1, wherein the radiation detection apparatus according to claim 1 is applied to the radiation detection unit.