JP2015067699A - Curable resin composition and use thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a curable resin composition capable of providing a cured product having a sufficient surface hardness and having an excellent electrical characteristic, and to provide a cured film formed by the curable resin composition, and a display device member and a display device which have the cured films thereby achieving high-definition.SOLUTION: There is provided the curable resin composition which contains an alkali-soluble resin and a polyfunctional compound having 2 or more functionality, and in which the curable resin composition further contains a compound having at least one reactive functional group selected from a group consisting of epoxy group, oxetanyl group and blocked isocyanate group, and the alkali-soluble resin is a polymer having a ring structure in the main chain.

Description

The present invention relates to a curable resin composition and its use. More specifically, the present invention relates to a curable resin composition useful for constituent members of various display devices, a cured film using the same, a display device member, and a display device.

Curable resin compositions that can be cured by heat or active energy rays are used in various applications such as components of various display devices represented by liquid crystal display devices, solid-state imaging devices, touch panel display devices, and the like. The development of the technology for allowing the cured product to exhibit desired physical properties in each application is underway. Among these applications, the touch panel display device can perform an input operation by touching the screen with a finger, a touch pen, or the like, instead of the conventional input operation using a keyboard, a mouse, or the like due to the development of information technology in recent years. Since it is a display device that can be input and the input operation is intuitive and easy to understand, it has been rapidly spread in recent years.

Touch-panel display devices are roughly classified into two types, a method using electricity and a method not using electricity in principle for detecting the touched position. Resistive film system, electrostatic capacity system, electromagnetic induction system, etc. are used for electricity, and infrared system, ultrasonic surface acoustic wave system, etc. are not used. The resistance film method has become the mainstream. In the resistive film method, a film is usually arranged on a glass substrate through a small spacer, and a transparent conductive film such as ITO (Indium Tin Oxide) is formed on each of the glass substrate and the opposite surface of the film. Although it has such a structure, the demand for the capacitance method is increasing due to the fact that it is vulnerable to changes over time and impacts and many malfunctions, and development is being promoted. There are two types of electrostatic capacity methods, a surface type and a projection type, and the latter is easily adopted for miniaturization, and is therefore widely used for smartphones, tablet-type portable terminals, and the like.

Generally, a capacitive touch panel display device is formed by assembling a transparent conductive film such as ITO, a protective film for protecting the transparent conductive film, an insulating film resist, and wiring on a substrate. However, it consists of a structure arrange | positioned on elements, such as a liquid crystal and organic EL (electroluminescence).

One of main members such as a liquid crystal display device and a solid-state image sensor is a color filter. In general, the color filter covers and protects the pixel and the resin black matrix in addition to the substrate (also referred to as a base material), the pixel, and the resin black matrix (BM), and a protective film provided for flattening the unevenness thereof. Consists of

Components such as protective films and insulating films included in these various display devices are required to have excellent surface hardness and good electrical characteristics, that is, low dielectric constant. Yes.

As a conventional curable resin composition, for example, a photothermal polymerizable composition containing an alkali-soluble resin having a carboxyl group in the molecule as a binder, a predetermined polymerizable compound, a polymerization initiator, and a heteroalicyclic blocked isocyanate compound Is disclosed (see Patent Document 1).

JP 2006-119441 A

As described above, cured products of curable resin compositions typified by protective films and insulating films in various display devices are required to exhibit excellent surface hardness and good electrical characteristics. Yes. In recent years, with the increase in definition of display devices and the like, there has been a strong demand for higher performance for each member used. However, the current situation is that the conventional curable resin composition does not sufficiently meet this demand for higher performance. For example, in the composition described in Patent Document 1, there is room for improvement in terms of the state of the cured film and the surface hardness, and further to improve the electrical characteristics so as to sufficiently meet the demand for higher definition in recent years. There was also room for ingenuity.

This invention is made | formed in view of the said present condition, and it aims at providing the curable resin composition which can give the hardened | cured material which has sufficient surface hardness and is excellent in an electrical property. Another object of the present invention is to provide a cured film formed of such a curable resin composition, and a display device member and a display device that can realize high definition by having the cured film.

As a result of various studies on the curable resin composition, the present inventors, in a resin composition containing an alkali-soluble resin and a bifunctional or higher polyfunctional compound, a polymer having a ring structure in the main chain as the alkali-soluble resin. It has been found that a cured product having excellent developability, photosensitivity, adhesion and curability and having sufficient surface hardness can be obtained. And when the compound which has a predetermined | prescribed reactive functional group was further included in the resin composition, it discovered that sufficient surface hardness and low dielectric constant were able to be balanced and made compatible in hardened | cured material. This is considered to be caused by the following mechanism.

When a compound having a predetermined reactive functional group is contained in the resin composition, the compound is stably present when the resin composition is stored (stored) at room temperature or room temperature. When subjected to a heating step (also referred to as a baking step or a post-bake step), a reactive group having high reactivity is regenerated from the compound, and this reacts with a hydroxyl group contained in the resin composition. Since this reaction produces a curable compound, it is considered that the crosslinking density is improved and the surface hardness is improved. For example, in the case where a compound having a blocked isocyanate group (block isocyanate compound) is used as an example, when the blocked isocyanate compound is heat-cured, a highly reactive isocyanate group is regenerated from the blocked isocyanate group, and this isocyanate group is converted into a hydroxyl group. Reacts with to form a urethane structure, thus improving the crosslinking density. At the same time, this reaction reduces or eliminates the hydroxyl group that causes high dielectric constant, and it is considered that a low dielectric constant can also be achieved.

The present inventors also have such a curable resin composition particularly suitable as a resin composition for forming a protective film or an insulating film used for a touch panel display device, a color filter, or the like, and is formed from this. It has been found that the cured film, the display device member and the display device can sufficiently meet the recent demands for high performance, downsizing, and weight reduction, and the above problems can be solved brilliantly. The present invention has been reached.

That is, the present invention is a curable resin composition comprising an alkali-soluble resin and a polyfunctional compound having two or more functions, and the curable resin composition further comprises an epoxy group, an oxetanyl group, and a blocked isocyanate group. The alkali-soluble resin includes a compound having at least one reactive functional group selected from the above, and the alkali-soluble resin is a curable resin composition that is a polymer having a ring structure in the main chain.
The present invention is also a cured film formed from the curable resin composition.
The present invention is also a member for a display device having the cured film.
The present invention is also a display device having the cured film.
The present invention is described in detail below. In addition, the form which combined each preferable form of this invention described below 2 or 3 or more is also a preferable form of this invention.

[Curable resin composition]
The curable resin composition of the present invention (also simply referred to as “resin composition”) is selected from the group consisting of an alkali-soluble resin, a bifunctional or higher polyfunctional compound, an epoxy group, an oxetanyl group, and a blocked isocyanate group. These compounds having at least one reactive functional group (also referred to as “reactive compounds”) can be used alone or in combination of two or more. Further, if necessary, one or more other components may be further contained.

In the present specification, the “total amount of solid content of the curable resin composition” means the total amount of components that form a cured product (excluding the solvent that volatilizes when the cured product is formed). Specifically, when it contains an alkali-soluble resin, a polyfunctional compound having two or more functions, and another polymerizable monomer, the other polymerizable monomer, the reactive compound, and further an inorganic system When it contains a compound or a coupling agent, it means the total amount of the inorganic compound and coupling agent, and when it further contains a photopolymerization initiator, the photopolymerization initiator.

The curable resin composition preferably also contains a hydroxyl group. Specifically, it is preferable that one or two or more of the components contained in the curable resin composition have a hydroxyl group (hydroxyl group) in the molecule. Thereby, since the hydroxyl group and the reactive functional group in the reactive compound react to produce a curable compound, it is considered that the crosslink density of the cured product is improved and the surface hardness is improved. Thus, the form in which the said curable resin composition contains a hydroxyl group is one of the suitable forms of this invention. Specifically, for example, a form containing a polymer having a hydroxyl group in the molecule as an alkali-soluble resin; a compound having a hydroxyl group in the molecule as a bifunctional or higher-functional polyfunctional compound or other polymerizable monomer The containing form; etc. are preferred.

<Alkali-soluble resin>
The curable resin composition contains an alkali-soluble resin, and the alkali-soluble resin is a polymer having a ring structure in the main chain. When a polymer having a ring structure in the main chain is used as the alkali-soluble resin, it is excellent in heat resistance, surface hardness, and adhesion, and for example, various changes with time after post-bake (heat treatment) are further suppressed. A cured product capable of stably expressing physical properties can be obtained.

The alkali-soluble resin may be a resin (polymer) exhibiting alkali solubility, but is preferably a polymer having an acid group in its molecule (also referred to as “acid group-containing polymer”). Examples of the acid group include a functional group that neutralizes with alkaline water, such as a carboxyl group, a phenolic hydroxyl group, a carboxylic acid anhydride group, a phosphoric acid group, and a sulfonic acid group, and has only one of these. You may have, and you may have 2 or more types. Among these, a carboxyl group and a carboxylic anhydride group are preferable, and a carboxyl group is more preferable.

When the alkali-soluble resin is an acid group-containing polymer, the acid value (AV) is not particularly limited, but is preferably 20 mgKOH / g or more and less than 300 mgKOH / g, for example. Thereby, more sufficient alkali solubility is expressed, and it becomes possible to obtain a cured product having better developability. The lower limit of the acid value is more preferably 30 mgKOH / g or more, and still more preferably 40 mgKOH / g or more. Moreover, 250 mgKOH / g or less is more preferable, More preferably, it is 200 mgKOH / g or less.

The acid value of the polymer is measured, for example, with an automatic titration apparatus (trade name “COM-555” manufactured by Hiranuma Sangyo Co., Ltd.) using a 0.1 N aqueous KOH solution as the titrant. The acid value per solid content can be calculated from the acid value of the solution and the solid content of the solution. The solid content of the polymer solution can be determined as follows.
About 0.3 g of the polymer solution is weighed into an aluminum cup, dissolved by adding about 1 g of acetone, and then naturally dried at room temperature. Then, using a hot air dryer (trade name “PHH-101” manufactured by Espec Corp.), after drying at 140 ° C. for 3 hours, it is allowed to cool in a desiccator and the mass is measured. From the mass reduction amount, the solid content concentration of the polymer solution is calculated.

The alkali-soluble resin preferably has a weight average molecular weight of 2000 to 250,000. When the molecular weight is within this range, better developability can be exhibited. From the viewpoint of further improving the solvent resistance, it is more preferably 3000 or more, further preferably 5000 or more, and particularly preferably 7000 or more. From the viewpoint of viscosity and the like, it is more preferably 100,000 or less, still more preferably 50,000 or less, and particularly preferably 30,000 or less. When the alkali-soluble resin has a high molecular weight, the higher acid value tends to be developed, and when the alkali-soluble resin has a low molecular weight, the hardness of the coating film tends not to be sufficient. .

The weight average molecular weight is determined, for example, by a GPC (gel permeation chromatography) method using HLC-8220GPC (manufactured by Tosoh Corp.) and column TSKgel SuperHZM-M (manufactured by Tosoh Corp.) with polystyrene as a standard substance and tetrahydrofuran as an eluent. Can do.

As the alkali-soluble resin, for example, a polymer obtained by polymerizing a monomer component containing a monomer having an acid group and a polymerizable double bond (also referred to as a base polymer), as described later, A polymer obtained by reacting the base polymer with a compound having a functional group capable of bonding to an acid group and a polymerizable double bond ("polymer having a double bond in a side chain" or "side chain double bond") The polymer is also referred to as “containing polymer”. The latter side chain double bond-containing polymer is more preferable.
In addition, each monomer used can use 1 type (s) or 2 or more types, respectively.

Here, as described above, since the alkali-soluble resin is a polymer having a ring structure in the main chain, the monomer component forming the base polymer is a single component having an acid group and a polymerizable double bond. It is preferable to contain one or more monomers capable of introducing a ring structure into the main chain skeleton of the polymer together with the monomer. That is, the alkali-soluble resin is obtained by polymerizing a monomer component including a monomer having an acid group and a polymerizable double bond and a monomer capable of introducing a ring structure into the main chain skeleton of the polymer. Polymer obtained (base polymer) and polymer obtained by reacting the base polymer with a compound having a functional group capable of binding to an acid group and a polymerizable double bond (polymer containing a side chain double bond) It is preferable that

Examples of the monomer having an acid group and a polymerizable double bond include unsaturated monocarboxylic acids such as (meth) acrylic acid, crotonic acid, cinnamic acid, and vinyl benzoic acid; maleic acid, fumaric acid, and itacon. Unsaturated polyvalent carboxylic acids such as acid, citraconic acid, and mesaconic acid; a chain between unsaturated groups such as mono (2-acryloyloxyethyl) succinate and mono (2-methacryloyloxyethyl) succinate and carboxyl groups Unsaturated monocarboxylic acids extended; unsaturated acid anhydrides such as maleic anhydride and itaconic anhydride; phosphate group-containing unsaturated compounds such as light ester P-1M (manufactured by Kyoeisha Chemical); . Among these, it is preferable to use carboxylic acid monomers (unsaturated monocarboxylic acids, unsaturated polycarboxylic acids, unsaturated acid anhydrides) from the viewpoints of versatility and availability. More preferably, unsaturated monocarboxylic acids are preferably used in terms of reactivity, alkali solubility, etc., more preferably (meth) acrylic acid (that is, acrylic acid and / or methacrylic acid), and among these, particularly preferable Is methacrylic acid.

The content ratio of the monomer having an acid group and a polymerizable double bond is preferably 5% by mass or more with respect to 100% by mass of the base polymer component, for example. Thereby, the solubility with respect to an alkali becomes more sufficient, for example, it becomes a curable resin composition further useful for the use for which developability is required. More preferably, it is 10 mass% or more, More preferably, it is 15 mass% or more. Moreover, it is preferable that it is 95 mass% or less at the point which can maintain the outstanding external appearance, adhesiveness, etc. of the hardened | cured material more after post-baking, for example. More preferably, it is 90 mass% or less.

Examples of the monomer capable of introducing a ring structure into the main chain skeleton of the polymer include, for example, a monomer having a double bond-containing ring structure in the molecule, and a ring structure having a ring structure in the main chain by cyclopolymerization. The monomer etc. which form a polymer are mentioned, It is suitable to use these 1 type, or 2 or more types. Such monomers include the group consisting of N-substituted maleimide monomers, dialkyl-2,2 ′-(oxydimethylene) diacrylate monomers, and α- (unsaturated alkoxyalkyl) acrylates. It is preferable to use at least one selected from the above. Thus, the alkali-soluble resin is an N-substituted maleimide monomer unit, a dialkyl-2,2 ′-(oxydimethylene) diacrylate monomer unit, and / or α- (unsaturated alkoxyalkyl). The form which is a polymer having an acrylate monomer unit is one of the preferred forms of the present invention.

In particular, resins containing N-substituted maleimide monomer units and / or dialkyl-2,2 ′-(oxydimethylene) diacrylate monomer units are heat resistant, inorganic compound dispersible, hardness It becomes possible to give a cured film with improved and the like.
The resin (polymer) containing the above-mentioned monomer unit means a resin containing a structural unit derived from the monomer by, for example, a monomer polymerization reaction or a crosslinking reaction.

In the monomer component, examples of the N-substituted maleimide monomer include N-cyclohexylmaleimide, N-phenylmaleimide, N-methylmaleimide, N-ethylmaleimide, N-isopropylmaleimide, and Nt-butylmaleimide. , N-dodecylmaleimide, N-benzylmaleimide, N-naphthylmaleimide and the like, and one or more of these can be used. Among these, N-cyclohexylmaleimide, N-phenylmaleimide, and N-benzylmaleimide are preferable, and N-benzylmaleimide is particularly preferable because of less coloring and excellent dispersibility of the inorganic compound.

Examples of the N-benzylmaleimide include benzylmaleimide; alkyl-substituted benzylmaleimide such as p-methylbenzylmaleimide and p-butylbenzylmaleimide; phenolic hydroxyl group-substituted benzylmaleimide such as p-hydroxybenzylmaleimide; o-chlorobenzylmaleimide , Halogen-substituted benzylmaleimides such as o-dichlorobenzylmaleimide and p-dichlorobenzylmaleimide.

Examples of the dialkyl-2,2 ′-(oxydimethylene) diacrylate monomer include, for example, dimethyl-2,2 ′-[, from the viewpoints of little coloring, dispersibility, industrial availability, and the like. It is preferable to use oxybis (methylene)] bis-2-propenoate or the like.

Examples of the α- (unsaturated alkoxyalkyl) acrylate include α-allyloxymethyl acrylic acid, α-allyloxymethyl acrylate methyl, α-allyloxymethyl ethyl acrylate, α-allyloxymethyl acrylate n- Propyl, α-allyloxymethyl acrylate i-propyl, α-allyloxymethyl acrylate n-butyl, α-allyloxymethyl acrylate s-butyl, α-allyloxymethyl acrylate t-butyl, α-allyloxy N-amyl methyl acrylate, s-amyl α-allyloxymethyl acrylate, t-amyl α-allyloxymethyl acrylate, neopentyl α-allyloxymethyl acrylate, n-hexyl α-allyloxymethyl acrylate, α -Allyloxymethyl acrylate s-hexyl, α Allyloxymethyl acrylate n-heptyl, α-allyloxymethyl acrylate n-octyl, α-allyloxymethyl acrylate s-octyl, α-allyloxymethyl acrylate t-octyl, α-allyloxymethyl acrylate 2 -Ethylhexyl, α-allyloxymethyl acrylate capryl, α-allyloxymethyl acrylate nonyl, α-allyloxymethyl acrylate decyl, α-allyloxymethyl acrylate undecyl, α-allyloxymethyl acrylate, α-allyloxymethyl acrylate Tridecyl allyloxymethyl acrylate, myristyl α-allyloxymethyl acrylate, pentadecyl α-allyloxymethyl acrylate, cetyl α-allyloxymethyl acrylate, heptadecyl α-allyloxymethyl acrylate, α-allyloxy Chain saturated hydrocarbon group-containing α such as stearyl methyl acrylate, nonadecyl α-allyloxymethyl acrylate, eicosyl α-allyloxymethyl acrylate, seryl α-allyloxymethyl acrylate, melyl α-allyloxymethyl acrylate -(Allyloxymethyl) acrylate is preferred. Among them, methyl α-allyloxymethyl acrylate (also referred to as “α- (allyloxymethyl) methyl acrylate”) is particularly preferable.

The α- (unsaturated alkoxyalkyl) acrylate can be produced, for example, by a production method disclosed in International Publication No. 2010/114077.

The content ratio of monomers capable of introducing a ring structure into the main chain skeleton of the polymer (the total ratio when two or more types are used) is, for example, the base polymer component (monomer component forming the base polymer). ) It is preferable that it is 1-40 mass% with respect to 100 mass%. Within this range, it becomes possible to obtain a cured film with further improved heat resistance, surface hardness, etc., and when the resin composition further contains inorganic fine particles, a cured film having excellent dispersibility is obtained. be able to. In particular, the content ratio of N-substituted maleimide monomer, dialkyl-2,2 ′-(oxydimethylene) diacrylate monomer, and / or α- (unsaturated alkoxyalkyl) acrylate (two or more types) When used, the total ratio) is preferably 1 to 40% by mass with respect to 100% by mass of the base polymer component (monomer component forming the base polymer). When the addition amount of the N-substituted maleimide monomer is further increased, a cured product that is superior in terms of hardness can be obtained, and a dialkyl-2,2 ′-(oxydimethylene) diacrylate monomer is used. By this, the cured | curing material which is more excellent in the point of heat-resistant coloring property is obtained. However, if the content ratio of the N-substituted maleimide monomer is too large, the development speed may not be more appropriate. More preferably, it is 2-40 mass% as said content rate, More preferably, it is 3-35 mass%.

In addition to the above-mentioned monomer having an acid group and a polymerizable double bond, and a monomer capable of introducing a ring structure into the main chain skeleton of the polymer, the above monomer component also includes other radical polymerization. It may contain a functional monomer (also referred to as “other monomer”). As another monomer, 1 type (s) or 2 or more types, such as the other (meth) acrylic acid ester type monomer which does not correspond to the monomer mentioned above, and an aromatic vinyl type monomer, can be used. .

The other (meth) acrylic acid ester monomers are dialkyl-2,2 ′-(oxydimethylene) diacrylate monomers and (meta) other than α- (unsaturated alkoxyalkyl) acrylates. ) Acrylic acid ester monomer, for example, methyl (meth) acrylate, ethyl (meth) acrylate, n-propyl (meth) acrylate, i-propyl (meth) acrylate, (meth) acrylic N-butyl acid, s-butyl (meth) acrylate, t-butyl (meth) acrylate, n-amyl (meth) acrylate, s-amyl (meth) acrylate, t-amyl (meth) acrylate, N-hexyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, isodecyl (meth) acrylate, tridecyl (meth) acrylate, (meth) acrylic Cyclohexyl acid, cyclohexylmethyl (meth) acrylate, octyl (meth) acrylate, isooctyl (meth) acrylate, lauryl (meth) acrylate, stearyl (meth) acrylate, benzyl (meth) acrylate, (meth) acrylic Acid phenyl, isobornyl (meth) acrylate, adamantyl (meth) acrylate, tricyclodecanyl (meth) acrylate, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, (meth) 3-hydroxypropyl acrylate, 2-hydroxybutyl (meth) acrylate, 3-hydroxybutyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, 2-methoxyethyl (meth) acrylate, (meth) 2-Ethoxyethyl acrylate, (meth) acrylic acid Phenoxyethyl toluate, tetrahydrofurfuryl (meth) acrylate, glycidyl (meth) acrylate, β-methylglycidyl (meth) acrylate, β-ethylglycidyl (meth) acrylate, (meth) acrylic acid (3,4) -Epoxycyclohexyl) methyl, N, N-dimethylaminoethyl (meth) acrylate, methyl α-hydroxymethyl acrylate, ethyl α-hydroxymethyl acrylate, etc., 1,4-dioxaspiro [4,5] deca- 2-ylmethacrylic acid, (meth) acryloylmorpholine, tetrahydrofurfuryl acrylate, 4- (meth) acryloyloxymethyl-2-methyl-2-ethyl-1,3-dioxolane, 4- (meth) acryloyloxymethyl- 2-methyl-2-isobutyl-1,3-dioxolane, -(Meth) acryloyloxymethyl-2-methyl-2-cyclohexyl-1,3-dioxolane, 4- (meth) acryloyloxymethyl-2,2-dimethyl-1,3-dioxolane, alkoxylated phenylphenol (meth) An acrylate etc. are mentioned. Examples of commercially available products of these compounds include MMDOL30, MEDOL30, MIBDOL30, CHDOL30, MEDOL10, MIBDOL10, MIBDOL10, CHDOL10, Biscote 150, Biscote 160 (above, manufactured by Osaka Organic Chemical Industry Co., Ltd.), ACMO (manufactured by Kojin Co., Ltd.). A-LEN-10 (manufactured by Shin-Nakamura Chemical Co., Ltd.) and the like. Among them, in terms of excellent heat resistance, methyl (meth) acrylate, ethyl (meth) acrylate, butyl (meth) acrylate, cyclohexyl (meth) acrylate, benzyl (meth) acrylate, alkoxylated phenylphenol (meta ) Acrylate is preferred. More preferably, in terms of excellent heat resistance, adhesion, and developability, methyl (meth) acrylate, benzyl (meth) acrylate, cyclohexyl (meth) acrylate, and / or alkoxylated phenylphenol (meth) acrylate Is to use.

The monomer component used to obtain the base polymer is further methyl (meth) acrylate, benzyl (meth) acrylate, cyclohexyl (meth) acrylate, and alkoxylated phenylphenol (meth). A form containing at least one (meth) acrylic acid ester monomer selected from the group consisting of acrylates is also a preferred form of the present invention.

Examples of the aromatic vinyl monomer include styrene, vinyl toluene, α-methyl styrene, methoxy styrene, and the like. Of these, styrene and vinyltoluene are preferable from the viewpoint of heat resistance coloring property and heat decomposition property of the resin.

The content ratio of the other (meth) acrylic acid ester monomer and / or aromatic vinyl monomer (total ratio when two or more are used) is, for example, 100% by mass of the base polymer component. On the other hand, it is suitable that it is 1-80 mass%. When it is in this range, a cured product that is more excellent in heat-resistant colorability, inorganic compound dispersibility, and alkali solubility can be obtained. More preferably, it is 5-75 mass%, More preferably, it is 10-70 mass%.

As said other monomer, 1 type (s) or 2 or more types, such as the following compound, can also be used, for example, The content rate shall be 20 mass% or less in 100 mass% of said base polymer components. Is preferred.
(Meth) acrylamides such as N, N-dimethyl (meth) acrylamide and N-methylol (meth) acrylamide; heavy materials such as polystyrene, polymethyl (meth) acrylate, polyethylene oxide, polypropylene oxide, polysiloxane, polycaprolactone and polycaprolactam Macromonomers having a (meth) acryloyl group at one end of the combined molecular chain; conjugated dienes such as 1,3-butadiene, isoprene and chloroprene; vinyl esters such as vinyl acetate, vinyl propionate, vinyl butyrate and vinyl benzoate Class: methyl vinyl ether, ethyl vinyl ether, propyl vinyl ether, butyl vinyl ether, 2-ethylhexyl vinyl ether, n-nonyl vinyl ether, lauryl vinyl ether, cyclohexyl vinyl ether , Methoxyethyl vinyl ether, ethoxyethyl vinyl ether, methoxyethoxyethyl vinyl ether, methoxypolyethylene glycol vinyl ether, 2-hydroxyethyl vinyl ether, 4-hydroxybutyl vinyl ether, and other vinyl ethers; N-vinylpyrrolidone, N-vinylcaprolactam, N-vinylimidazole N-vinyl compounds such as N-vinylmorpholine and N-vinylacetamide; unsaturated isocyanates such as isocyanatoethyl (meth) acrylate and allyl isocyanate;

As a method for polymerizing the monomer component, a commonly used technique such as bulk polymerization, solution polymerization, emulsion polymerization or the like can be used, and it may be appropriately selected according to the purpose and application. Among these, solution polymerization is preferred because it is industrially advantageous and structural adjustments such as molecular weight are easy. The polymerization mechanism of the monomer component may be a polymerization method based on a mechanism such as radical polymerization, anionic polymerization, cationic polymerization, or coordination polymerization, but the polymerization method based on the radical polymerization mechanism is industrial. Is also preferable.

The polymerization initiating method in the above polymerization reaction may be performed by supplying energy necessary for initiating polymerization from an active energy source such as heat, electromagnetic waves (infrared rays, ultraviolet rays, X-rays, etc.), electron beams, etc. If an agent is used in combination, the energy required for initiation of polymerization can be greatly reduced, and reaction control is facilitated, which is preferable.
The molecular weight of the polymer obtained by polymerizing the monomer components can be controlled by adjusting the amount and type of the polymerization initiator, the polymerization temperature, the type and amount of the chain transfer agent, and the like.

When the monomer component is polymerized by a solution polymerization method, the solvent used for the polymerization is not particularly limited as long as it is inert to the polymerization reaction, and the polymerization mechanism and the type of monomer used. May be appropriately set according to the polymerization conditions such as the amount, the polymerization temperature, the polymerization concentration, etc., but when a solvent is used as a diluent or the like later when the curable resin composition is used, a solvent containing the solvent is used. It is efficient and preferable to use for solution polymerization of monomer components.

As said solvent, the following compound etc. are mentioned suitably, for example, These 1 type (s) or 2 or more types can be used.
Monoalcohols such as methanol, ethanol, isopropanol, n-butanol, s-butanol; glycols such as ethylene glycol and propylene glycol; cyclic ethers such as tetrahydrofuran and dioxane; ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene Glycol monoethers such as glycol monobutyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol monobutyl ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol monobutyl ether, 3-methoxybutanol; ethylene glycol dimethyl ether, ethylene glycol Jie Glycol ethers such as ether ether, ethylene glycol ethyl methyl ether, diethylene glycol dimethyl ether, diethylene glycol diethyl ether, diethylene glycol ethyl methyl ether, propylene glycol dimethyl ether, propylene glycol diethyl ether; ethylene glycol monomethyl ether acetate, ethylene glycol monoethyl ether acetate, ethylene glycol mono Butyl ether acetate, diethylene glycol monomethyl ether acetate, diethylene glycol monoethyl ether acetate, diethylene glycol monobutyl ether acetate, propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, Esters of glycol monoethers such as propylene glycol monobutyl ether acetate, dipropylene glycol monomethyl ether acetate, dipropylene glycol monoethyl ether acetate, dipropylene glycol monobutyl ether acetate, 3-methoxybutyl acetate; methyl acetate, ethyl acetate, propyl acetate , Isopropyl acetate, butyl acetate, methyl propionate, ethyl propionate, butyl propionate, methyl lactate, ethyl lactate, butyl lactate, methyl 3-methoxypropionate, ethyl 3-methoxypropionate, methyl 3-ethoxypropionate, 3 -Alkyl esters such as ethyl ethoxypropionate, methyl acetoacetate, ethyl acetoacetate; acetone, methyl ethyl ketone, methyl isobutyrate Ketones such as ruketone and cyclohexanone; aromatic hydrocarbons such as benzene, toluene, xylene and ethylbenzene; aliphatic hydrocarbons such as hexane, cyclohexane and octane; amides such as dimethylformamide, dimethylacetamide and N-methylpyrrolidone ;etc.

Among these solvents, propylene glycol monomethyl ether, propylene are used because of the solubility of the resulting polymer, surface smoothness when forming a coating film, little influence on the human body and the environment, and industrial availability. It is more preferable to use glycol monomethyl ether acetate, diethylene glycol dimethyl ether, diethylene glycol ethyl methyl ether, or ethyl lactate.

As the usage-amount of the said solvent, it is suitable that it is 50-1000 mass parts with respect to 100 mass parts of said base polymer components. More preferably, it is 100-500 mass parts.

When the monomer component is polymerized by a radical polymerization mechanism, it is industrially advantageous and preferable to use a polymerization initiator that generates radicals by heat. Such a polymerization initiator is not particularly limited as long as it generates radicals by supplying thermal energy. Depending on the polymerization conditions such as polymerization temperature, solvent, type of monomer to be polymerized, etc. And may be selected as appropriate. Moreover, you may use together reducing agents, such as transition metal salt and amines, with a polymerization initiator.

Examples of the polymerization initiator include cumene hydroperoxide, diisopropylbenzene hydroperoxide, di-t-butyl peroxide, lauroyl peroxide, benzoyl peroxide, t-butylperoxyisopropyl carbonate, and t-butylperoxy- 2-ethylhexanoate, azobisisobutyronitrile, 1,1′-azobis (cyclohexanecarbonitrile), 2,2′-azobis (2,4-dimethylvaleronitrile), dimethyl 2,2′-azobis ( 2-methylpropionate), hydrogen peroxide, persulfate, etc., which are usually used as polymerization initiators, such as peroxides and azo compounds, may be used alone or in combination of two or more. May be.

The amount of the polymerization initiator used may be appropriately set according to the type and amount of the monomer used, the polymerization conditions such as the polymerization temperature and the polymerization concentration, the molecular weight of the target polymer, etc., and is particularly limited. It is not a thing. For example, in order to obtain a polymer having a weight average molecular weight of several thousand to several tens of thousands, the content is preferably 0.1 to 20 parts by mass with respect to 100 parts by mass of the base polymer component. More preferably, it is 0.5-15 mass parts.

In the above polymerization, a chain transfer agent usually used may be used as necessary. Preferably, a polymerization initiator and a chain transfer agent are used in combination. In addition, when a chain transfer agent is used at the time of superposition | polymerization, it exists in the tendency which can suppress the increase in molecular weight distribution or gelatinization.

Examples of the chain transfer agent include mercaptocarboxylic acids such as mercaptoacetic acid and 3-mercaptopropionic acid; methyl mercaptoacetate, methyl 3-mercaptopropionate, 2-ethylhexyl 3-mercaptopropionate, and n-mercaptopropionic acid n- Octyl, methoxybutyl 3-mercaptopropionate, stearyl 3-mercaptopropionate, trimethylolpropane tris (3-mercaptopropionate), pentaerythritol tetrakis (3-mercaptopropionate), dipentaerythritol hexakis (3- Mercaptocarboxylic esters such as mercaptopropionate); alkyl mercapts such as ethyl mercaptan, t-butyl mercaptan, n-dodecyl mercaptan, 1,2-dimercaptoethane Mercapto alcohols such as 2-mercaptoethanol and 4-mercapto-1-butanol; Aromatic mercaptans such as benzenethiol, m-toluenethiol, p-toluenethiol and 2-naphthalenethiol; Tris [(3- Mercaptopropionyloxy) -ethyl] isocyanurate and other mercaptoisocyanurates; 2-hydroxyethyl disulfide and diethyl sulfides such as tetraethyl thiuram disulfide; dithiocarbamates such as benzyldiethyldithiocarbamate; α-methylstyrene dimer and the like Body dimers; alkyl halides such as carbon tetrabromide. These may be used alone or in combination of two or more.

Among these, mercaptocarboxylic acids, mercaptocarboxylic esters, alkyl mercaptans, mercapto alcohols, aromatic mercaptans, mercaptoisocyanurates, in terms of availability, ability to prevent crosslinking, and low degree of polymerization rate reduction. It is preferable to use a compound having a mercapto group such as More preferred are alkyl mercaptans, mercaptocarboxylic acids, mercaptocarboxylic acid esters, and still more preferred are n-dodecyl mercaptan and mercaptopropionic acid.

The amount of the chain transfer agent used is not particularly limited as long as it is appropriately set according to the type and amount of the monomer to be used, polymerization conditions such as polymerization temperature and polymerization concentration, and the molecular weight of the target polymer. In order to obtain a polymer having a weight average molecular weight of several thousand to several tens of thousands, the content is preferably 0.1 to 20 parts by mass with respect to 100 parts by mass of the base polymer component. More preferably, it is 0.5-15 mass parts.

Regarding the polymerization conditions, the polymerization temperature may be appropriately set according to the type and amount of the monomer to be used, the type and amount of the polymerization initiator, and is preferably 50 to 150 ° C, for example, 70 to 120 ° C. is more preferable. Also, the polymerization time can be appropriately set similarly, but for example, 1 to 8 hours is preferable.

The alkali-soluble resin is also preferably a polymer having a double bond in the side chain. Specifically, a polymer (base polymer) obtained by polymerizing the above monomer components and a compound obtained by reacting a compound having a functional group capable of binding to an acid group and a polymerizable double bond. It is preferably a polymer (also referred to as a side chain double bond-containing polymer). Thereby, the sclerosis | hardenability of the said curable resin composition is improved more, and the hardened | cured material excellent by adhesiveness with a board | substrate etc. and surface hardness can be obtained. Thus, the form in which the alkali-soluble resin is a polymer having a double bond in the side chain is one of the preferred forms of the present invention.

In the compound having a functional group capable of binding to the acid group and a polymerizable double bond, examples of the polymerizable double bond include (meth) acryloyl group, vinyl group, allyl group, methallyl group, and the like. A compound having one or more of these compounds is suitable. Of these, a (meth) acryloyl group is preferable in terms of reactivity. In addition, examples of the functional group capable of binding to an acid group include a hydroxy group, an epoxy group, an oxetanyl group, an isocyanate group, and the like, and those having one or more of these as the compound are suitable. . Of these, epoxy groups (including glycidyl groups) are preferred from the viewpoint of the speed of the modification treatment reaction, heat resistance, and dispersibility.

Examples of the compound having a functional group capable of binding to the acid group and a polymerizable double bond include glycidyl (meth) acrylate, β-methylglycidyl (meth) acrylate, β-ethylglycidyl (meth) acrylate, Examples thereof include vinyl benzyl glycidyl ether, allyl glycidyl ether, (meth) acrylic acid (3,4-epoxycyclohexyl) methyl, vinylcyclohexene oxide, and the like, and one or more of these can be used. Among these, it is preferable to use a compound (monomer) having an epoxy group and a (meth) acryloyl group.

The amount of the compound having a functional group capable of binding to the acid group and a polymerizable double bond is, for example, 1 to 100 parts by mass of the base polymer component (total amount of monomer components constituting the base polymer). The amount is preferably 50 parts by mass. More preferably, it is 5-45 mass parts.

As a method for obtaining the side chain double bond-containing polymer, for example, when reacting the base polymer component with a compound having a functional group capable of binding to an acid group and a polymerizable double bond, the base polymer A method in which the amount of the acid group (preferably carboxyl group) of the component is larger than the amount of the compound having a functional group capable of binding to the acid group and a polymerizable double bond; the base polymer component and the acid group And a method of reacting a compound having a polybasic acid anhydride group after reacting with a compound having a functional group and a polymerizable double bond.

The step of reacting the base polymer component (preferably a polymer having a carboxyl group) with a compound having a functional group capable of binding to an acid group and a polymerizable double bond ensures a good reaction rate and is a gel. In order to prevent the formation, it is preferably carried out in a temperature range of 50 to 160 ° C. More preferably, it is 70-140 degreeC, More preferably, it is 90-130 degreeC. Moreover, in order to improve reaction rate, the basic catalyst and acidic catalyst for esterification or transesterification normally used can be used as a catalyst. Among them, it is preferable to use a basic catalyst because side reactions are reduced.

Examples of the basic catalyst include tertiary amines such as dimethylbenzylamine, triethylamine, tri-n-octylamine, and tetramethylethylenediamine; tetramethylammonium chloride, tetramethylammonium bromide, tetrabutylammonium bromide, and n-dodecyltrimethyl. Quaternary ammonium salts such as ammonium chloride; urea compounds such as tetramethylurea; alkylguanidines such as tetramethylguanidine; amide compounds such as dimethylformamide and dimethylacetamide; tertiary phosphines such as triphenylphosphine and tributylphosphine; tetraphenylphosphonium Quaternary phosphonium salts such as bromide and benzyltriphenylphosphonium bromide; It is possible to have. Of these, dimethylbenzylamine, triethylamine, tetramethylurea, and triphenylphosphine are preferable in terms of reactivity, handling properties, and halogen-free properties.

The catalyst is used in an amount of 0.01 to 5 parts by mass with respect to 100 parts by mass as a total of the base polymer component and the compound having a functional group capable of binding to an acid group and a polymerizable double bond group. It is preferable. More preferably, it is 0.1-3 mass parts.

The step of reacting the base polymer component with a compound having a functional group capable of binding to an acid group and a polymerizable double bond also adds a polymerization inhibitor to prevent gelation, It is preferably carried out in the presence. As the molecular oxygen-containing gas, air or oxygen gas diluted with an inert gas such as nitrogen is usually used and blown into the reaction vessel.

As the polymerization inhibitor, a commonly used polymerization inhibitor for radically polymerizable monomers can be used. For example, hydroquinone, methylhydroquinone, trimethylhydroquinone, t-butylhydroquinone, methoquinone, 6-t-butyl. -2,4-xylenol, 2,6-di-t-butylphenol, 2,6-di-t-butyl-4-methoxyphenol, 2,2'-methylenebis (4-methyl-6-t-butylphenol), etc. Phenolic inhibitors, organic acid copper salts, phenothiazines and the like, and one or more of these can be used. Among them, a phenol-based inhibitor is preferable in terms of low coloration and ability to prevent polymerization, and 2,2′-methylenebis (4-methyl-6-tert-butylphenol), methoquinone, 6-t- Butyl-2,4-xylenol and 2,6-di-t-butylphenol are more preferable.

The amount of the polymerization inhibitor used is a functional group capable of bonding with the base polymer component and the acid group from the viewpoint of ensuring sufficient polymerization prevention effect and curability when the curable resin composition is used. And it is preferable that it is 0.001-1 mass part with respect to 100 mass parts of total amounts with the compound which has a polymerizable double bond. More preferably, it is 0.01-0.5 mass part.

Examples of the compound having a polybasic acid anhydride group include succinic anhydride, dodecenyl succinic acid, pentadecenyl succinic acid, octadecenyl succinic acid, tetrahydrophthalic anhydride, methyltetrahydrophthalic anhydride, hexahydrophthalic anhydride. Acid, methylhexahydrophthalic anhydride, endomethylenetetrahydrophthalic anhydride, methylendomethylenetetrahydrophthalic anhydride, maleic anhydride, itaconic anhydride, phthalic anhydride, glutaric anhydride, phthalic anhydride, trimellitic anhydride, anhydrous Examples include pyromellitic acid, and one or more of these can be used.

The side chain double bond-containing polymer preferably has a double bond equivalent of 200 to 10,000. By setting it as such a range, it is expected that the sufficient storage stability of the polymer and the good plate-making characteristics in the sensitivity and pattern shape of the curable resin composition of the present invention will be compatible at a higher level. it can. More preferably 250 or more, further preferably 300 or more, particularly preferably 350 or more, more preferably 400 or more, still more preferably 440 or more, more preferably 5000 or less, still more preferably 4000 or less, particularly preferably. 3000 or less, more preferably 2000 or less, and most preferably 1900 or less.

The double bond equivalent is the mass (g) of the solid content of the polymer solution per 1 mol of the double bond of the polymer. The mass of the solid content of the polymer solution here means the mass of the base polymer component, the mass of the compound having a functional group capable of binding to an acid group and a polymerizable double bond group, and the mass of a chain transfer agent. And a thermal polymerization initiator. It can be determined by dividing the mass of the solid content of the polymer solution by the double bond amount of the polymer. The double bond amount of the polymer can be determined from the amount of the charged acid group and the compound having a functional group capable of bonding and a polymerizable double bond.

In the curable resin composition, the content of the alkali-soluble resin is preferably 5% by mass or more and 70% by mass or less with respect to 100% by mass of the total solid content of the curable resin composition. Is preferred. By being in such a range, it becomes possible to show the effect of the present invention more remarkably. More preferably, it is 10-65 mass%, More preferably, it is 10-50 mass%, Most preferably, it is 10-40 mass%.

<Polyfunctional compound>
The curable resin composition includes a bifunctional or higher polyfunctional compound (also simply referred to as “polyfunctional compound”). A polyfunctional compound is a compound having two or more functional groups in one molecule. By including such a compound, the curable resin composition has excellent photosensitivity and curability, and a cured film having extremely high hardness can be obtained. The two or more functional groups may be the same functional group or different functional groups.

The number of functions of the polyfunctional compound is preferably 3 or more, more preferably 4 or more, and still more preferably 5 or more. Further, from the viewpoint of further suppressing curing shrinkage, the functional number is preferably 10 or less, more preferably 8 or less. The molecular weight of the polyfunctional compound is not particularly limited, but is preferably 2000 or less, for example, from the viewpoint of handling.

Examples of the functional group include a vinyl group, an allyl group, a (meth) acryloyl group, an epoxy group, an isocyanato group, a hydroxyl group, an acid anhydride group, and an oxazoline group. Among these, a (meth) acryloyl group is preferable. That is, the polyfunctional compound is preferably a compound having at least one (meth) acryloyl group in one molecule, such as a polyfunctional (meth) acrylate compound or a polyfunctional urethane (meth) acrylate compound. It is preferable to use a (meth) acryloyl group-containing isocyanurate compound or the like. More preferably, it is a compound having two or more (meth) acryloyl groups in one molecule (hereinafter, also referred to as “polyfunctional (meth) acrylate compound”), and thereby has higher hardness and higher transparency. A cured product can be obtained.

The content of the polyfunctional compound may be appropriately set according to the purpose and use in addition to the type of compound and alkali-soluble resin to be used. For example, from the viewpoint of better developability and plate-making property, a curable resin It is suitable that it is 2-80 mass% with respect to 100 mass% of solid content total amount of a composition. More preferably, it is 5-70 mass%, More preferably, it is 8-50 mass%, Most preferably, it is 10-40 mass%, Most preferably, it is 10-30 mass%.

Below, the polyfunctional (meth) acrylate compound suitable as a polyfunctional compound of this invention and another polyfunctional compound are further demonstrated.

-Multifunctional (meth) acrylate compound-
The number of (meth) acryloyl groups possessed by the polyfunctional (meth) acrylate compound is preferably 3 or more. Thus, it is preferable that the polyfunctional compound contains a trifunctional or higher polyfunctional (meth) acrylate compound, whereby the photosensitivity and curability are further improved, and the hardness and transparency can be further improved. it can. More preferably, it is 4 or more, More preferably, it is 5 or more. Moreover, from a viewpoint of suppressing cure shrinkage more, 10 or less is preferable, More preferably, it is 8 or less, More preferably, it is 6 or less.

The (meth) acryloyl group possessed by the polyfunctional (meth) acrylate compound means a methacryloyl group and / or an acryloyl group, but an acryloyl group is preferred from the viewpoint of better reactivity. That is, the polyfunctional (meth) acrylate compound is particularly preferably a polyfunctional acrylate compound having two or more acryloyl groups.

Although the molecular weight of the said polyfunctional (meth) acrylate compound is not specifically limited, For example, 2000 or less is suitable from a viewpoint of handling. More preferably, it is 1000 or less. Moreover, 100 or more are suitable.

Although it does not specifically limit as said polyfunctional (meth) acrylate compound, For example, the following compound etc. are mentioned.
Ethylene glycol di (meth) acrylate, diethylene glycol di (meth) acrylate, polyethylene glycol di (meth) acrylate, propylene glycol di (meth) acrylate, butylene glycol di (meth) acrylate, hexanediol di (meth) acrylate, cyclohexanedimethanol Bifunctional (meth) acrylate compounds such as di (meth) acrylate, bisphenol A alkylene oxide di (meth) acrylate, bisphenol F alkylene oxide di (meth) acrylate;

Trimethylolpropane tri (meth) acrylate, ditrimethylolpropane tetra (meth) acrylate, glycerol tri (meth) acrylate, pentaerythritol tri (meth) acrylate, pentaerythritol tetra (meth) acrylate, dipentaerythritol penta (meth) acrylate, Dipentaerythritol hexa (meth) acrylate, tripentaerythritol hepta (meth) acrylate, tripentaerythritol octa (meth) acrylate, ethylene oxide-added trimethylolpropane tri (meth) acrylate, ethylene oxide-added ditrimethylolpropane tetra (meth) acrylate, ethylene oxide Addition pentaerythritol tetra (meth) acrylate, ethylene oxide addition dipe Taerythritol hexa (meth) acrylate, propylene oxide-added trimethylolpropane tri (meth) acrylate, propylene oxide-added ditrimethylolpropane tetra (meth) acrylate, propylene oxide-added pentaerythritol tetra (meth) acrylate, propylene oxide-added dipentaerythritol hexa (Meth) acrylate, ε-caprolactone-added trimethylolpropane tri (meth) acrylate, ε-caprolactone-added ditrimethylolpropane tetra (meth) acrylate, ε-caprolactone-added pentaerythritol tetra (meth) acrylate, ε-caprolactone-added dipentaerythritol Trifunctional or more polyfunctional (meth) acrylate compounds such as hexa (meth) acrylate;

-Other polyfunctional compounds-
Examples of the polyfunctional compound include polyfunctional vinyl ether compounds, vinyl ether group-containing (meth) acrylate compounds, polyfunctional allyl ether compounds, allyl group-containing (meth) acrylate compounds, (meth) acryloyl group-containing isocyanurate compounds, polyfunctional compounds. An allyl group-containing isocyanurate compound, a polyfunctional urethane (meth) acrylate compound, a polyfunctional aromatic vinyl compound, or the like can also be used.

Examples of the polyfunctional vinyl ether compound include ethylene glycol divinyl ether, diethylene glycol divinyl ether, polyethylene glycol divinyl ether, propylene glycol divinyl ether, butylene glycol divinyl ether, hexanediol divinyl ether, bisphenol A alkylene oxide divinyl ether, and bisphenol F alkylene oxide. Divinyl ether, trimethylolpropane trivinyl ether, ditrimethylolpropane tetravinyl ether, glycerin trivinyl ether, pentaerythritol tetravinyl ether, dipentaerythritol pentavinyl ether, dipentaerythritol hexavinyl ether, ethylene oxide-added trimethylol proppant Vinyl ethers, ethylene oxide-added ditrimethylolpropane tetravinyl ether, ethylene oxide adduct of pentaerythritol tetravinyl ether, ethylene oxide adduct of dipentaerythritol hexavinyl ether.

Examples of the vinyl ether group-containing (meth) acrylate compound include 2-vinyloxyethyl (meth) acrylate, 3-vinyloxypropyl (meth) acrylate, 1-methyl-2-vinyloxyethyl (meth) acrylate, (meth) 2-vinyloxypropyl acrylate, 4-vinyloxybutyl (meth) acrylate, 4-vinyloxycyclohexyl (meth) acrylate, 5-vinyloxypentyl (meth) acrylate, 6-vinyloxyhexyl (meth) acrylate, (Meth) acrylic acid 4-vinyloxymethylcyclohexylmethyl, (meth) acrylic acid p-vinyloxymethylphenylmethyl, (meth) acrylic acid 2- (vinyloxyethoxy) ethyl, (meth) acrylic acid 2- (vinyloxy) And ethoxyethoxyethoxy) ethyl.

Examples of the polyfunctional allyl ether compound include ethylene glycol diallyl ether, diethylene glycol diallyl ether, polyethylene glycol diallyl ether, propylene glycol diallyl ether, butylene glycol diallyl ether, hexanediol diallyl ether, bisphenol A alkylene oxide diallyl ether, and bisphenol F alkylene. Oxide diallyl ether, trimethylolpropane triallyl ether, ditrimethylolpropane tetraallyl ether, glycerol triallyl ether, pentaerythritol tetraallyl ether, dipentaerythritol pentaallyl ether, dipentaerythritol hexaallyl ether, ethylene oxide-added trimethylol proppant Allyl ether, ethylene oxide-added ditrimethylolpropane tetra allyl ether, ethylene oxide adduct of pentaerythritol tetra-allyl ether, ethylene oxide adduct of dipentaerythritol hexa-allyl ether.

Examples of the allyl group-containing (meth) acrylate compound include allyl (meth) acrylate.
Examples of the (meth) acryloyl group-containing isocyanurate compound include tri (acryloyloxyethyl) isocyanurate, tri (methacryloyloxyethyl) isocyanurate, alkylene oxide-added tri (acryloyloxyethyl) isocyanurate, alkylene oxide-added tri ( Methacryloyloxyethyl) isocyanurate and the like.

Examples of the polyfunctional allyl group-containing isocyanurate compound include triallyl isocyanurate.
Examples of the polyfunctional urethane (meth) acrylate compound include polyfunctional isocyanates such as tolylene diisocyanate, isophorone diisocyanate, and xylylene diisocyanate, 2-hydroxyethyl (meth) acrylate, and 2-hydroxypropyl (meth) acrylate. And the like obtained by reaction with a hydroxyl group-containing (meth) acrylic acid ester.
Examples of the polyfunctional aromatic vinyl compound include divinylbenzene.

<Inorganic compounds>
It is preferable that the curable resin composition also contains an inorganic compound. An inorganic compound means a compound containing an inorganic component, for example, inorganic fine particles such as metals, metal salts (carbonates, sulfates, etc.), metal oxides, and organic compounds having metal atoms. An organic compound containing
The metal here includes a so-called semi-metal such as silicon. Specifically, the metal is preferably one or more of silicon, titanium, zirconium, calcium, barium, aluminum and the like.

As the inorganic compound, inorganic fine particles are preferable, and among them, it is preferable that at least one metal selected from the group consisting of silicon, titanium, and zirconium is included. As a result, a low dielectric constant can be achieved and the surface hardness of the cured product can be further improved. Thus, the form in which the curable resin composition further contains inorganic fine particles, and the form in which the inorganic fine particles contain at least one metal selected from the group consisting of silicon, titanium, and zirconium, It is included in a preferred form of the present invention.

Examples of the inorganic fine particles include metal oxides such as silicon oxide (such as silica), titanium oxide (such as titania), and zirconium oxide (such as zirconia), and composite metal oxides including any one or more of silicon, titanium, and zirconium. Is preferred. Among these, silica fine particles, titania fine particles, and zirconia fine particles are preferable. That is, the inorganic fine particles preferably include silica fine particles, titania fine particles and / or zirconia fine particles. More preferred are silica fine particles.

The content of the inorganic fine particles containing at least one metal selected from the group consisting of silicon, titanium and zirconium is 50% by mass with respect to 100% by mass of the total amount of inorganic compounds in the curable resin composition. It is suitable that it is above. Thereby, the effect by the said inorganic type microparticles | fine-particles can be exhibited more fully. More preferably, it is 70 mass% or more, More preferably, it is 90 mass% or more.

In the curable resin composition, the content of the inorganic compound (solid content) is preferably 5% by mass or more in 100% by mass of the total solid content of the curable resin composition. Thereby, the surface hardness of the cured product becomes more sufficient. More preferably, it is 7 mass% or more, More preferably, it is 10 mass% or more. Further, from the viewpoint of developability, dispersion stability, and low dielectric constant, it is preferably 50% by mass or less. More preferably, it is 40 mass% or less.

Here, in the present invention, since a polyfunctional compound (preferably a polyfunctional (meth) acrylate compound) is included, it is normally expected that curing shrinkage will increase. In such a case, it is conceivable to increase the content of the inorganic compound to reduce curing shrinkage. However, in the present invention, the content of the inorganic compound can be increased by configuring the curable resin composition as described above. Even if the amount is lowered as much as the above-mentioned preferable range, curing shrinkage is relieved, and a cured film having high hardness and high smoothness can be obtained. For this reason, it is possible to sufficiently avoid the possibility that the developability is not sufficient or the low dielectric constant cannot be achieved, which is assumed when a large amount of the inorganic compound is contained.

Hereinafter, the case where the inorganic compound used in the present invention is inorganic fine particles such as silica fine particles and the case where it is an organic compound containing an inorganic component will be further described. In addition, it is also suitable to use these together.

-Inorganic fine particles-
Examples of the inorganic fine particles include the above-described silicon oxide (such as silica), titanium oxide (such as titania), zirconium oxide (such as zirconia), metal oxides such as aluminum oxide, and metal salts such as calcium carbonate and barium sulfate. Is preferred. Of these, metal oxides are more preferable. A composite metal oxide containing two or more metal atoms may be used.

The average particle diameter of the inorganic fine particles is preferably 1 to 500 nm, for example. By being in this range, the dispersibility and dispersion stability of the inorganic fine particles become more sufficient, and it becomes possible to give a cured product that is superior in dispersibility and further suppressed in change over time. More preferably, it is 1-300 nm, More preferably, it is 1-200 nm, Most preferably, it is 1-100 nm.
The average particle diameter can be measured, for example, using a laser diffraction particle size distribution measuring machine.

The inorganic fine particles may be in the form of a dried powder or in the form of a dispersion (for example, colloidal silica) dispersed in an organic solvent. From the viewpoint of the dispersion stability of the product, it is preferable to use a dispersion in which the dispersion is dispersed in an organic solvent. That is, the inorganic fine particles are preferably contained in the curable resin composition as an organic solvent dispersion.

Examples of the organic solvent (dispersion medium) used for forming the dispersion include ketone solvents, ester solvents, ether solvents, alcohol solvents, amide solvents, xylene, toluene, and the like. These 1 type (s) or 2 or more types can be used. Among them, it is preferable to use a ketone solvent, an ester solvent and / or an ether solvent. More preferably, a ketone-based solvent and / or an ester-based solvent is used, so that dispersibility can be maintained without change in appearance such as discoloration, coloring, and cracks, and sufficient surface hardness and adhesion can be maintained. A cured product can be obtained.

Examples of the ketone solvent include methyl ethyl ketone and methyl isobutyl ketone.
As the ester solvent, for example, ethyl acetate, butyl acetate, propylene glycol monomethyl acetate and the like are suitable.
Examples of the ether solvent include acetylated products of m alkylene glycol and n alkyl ether (m and n are the same or different and are one or more multiple prefixes represented by mono, di, tri, tetra, etc.). Etc. are suitable. Examples of malkylene glycol n alkyl ethers include ethylene glycol monomethyl ether, propylene glycol monomethyl ether, and the like, but ethers having a hydroxyl group at the terminal, such as m alkylene glycol n alkyl ether itself (that is, alcohol having an ether bond). Class) has performance as an alcohol solvent due to its terminal hydroxyl group, and therefore corresponds to an alcohol solvent instead of an ether solvent.
Examples of the alcohol solvent include methanol, isopropanol, ethylene glycol, butanol, and the like, and ethers having a hydroxyl group at the terminal (alcohols having an ether bond) such as the m alkylene glycol n alkyl ether described above. .

When a dispersion formed by dispersing in an organic solvent is used as the inorganic fine particles, the amount of the organic solvent (dispersion medium) is preferably set to an amount that can sufficiently disperse the inorganic fine particles. That is, the amount of the organic solvent used is adjusted so that the content of the inorganic fine particles in the curable resin composition is within the above-described preferable range and the inorganic fine particles are sufficiently dispersed. It is preferable. For example, it is preferable that the total amount of the organic solvent as a dispersion medium is 50 parts by mass or more with respect to 100 parts by mass of the inorganic fine particles. More preferably, it is 70 mass parts or more, More preferably, it is 100 mass parts or more. Moreover, since there exists a possibility that a hardening process cannot be performed simply when there is too much solvent amount more than necessary, it is suitable that it is 600 mass parts or less. More preferably, it is 550 mass parts or less, More preferably, it is 500 mass parts or less.

The organic solvent dispersion can be obtained by sufficiently dispersing inorganic fine particles in the organic solvent described above, but commercially available products can also be used. Examples of commercially available products include MEK-ST, MEK-ST-L, MEK-ST-ZL, MEK-ST-UP, MEK-AC-2101, MEK-AC-4101, MEK-EC-2104, MEK-AC- Organo silica sol using methyl ethyl ketone as a dispersion medium such as 2202, MEK-AC-5101; Organo silica sol using methyl isobutyl ketone as a dispersion medium such as MIBK-ST, MIBK-SD, MIBK-SD-L; Acetic acid such as EAC-ST Organosilica sol with ethyl as dispersion medium; Organosilica sol with butyl acetate as dispersion medium such as NBAC-ST; Organosilica sol with methanol as dispersion medium such as methanol silica sol and MA-ST-M; IPA-ST, IPA-ST Organosilica sol using isopropanol such as -L as a dispersion medium Organosilica sol with ethylene glycol as dispersion medium such as EG-ST; Organosilica sol with xylene / n-butanol as dispersion medium such as XBA-ST; Alkylene glycol monoalkyl ether such as NPC-ST-30 and PGM-ST Organosilica sol as dispersion medium; Organosilica sol with dimethylacetamide such as DMAC-ST as dispersion medium; Organosilica sol with toluene as dispersion medium such as TOL-ST; Propylene glycol monomethyl acetate such as PMA-ST as dispersion medium Organosilica sol; etc. (all manufactured by Nissan Chemical Co., Ltd.).

-Organic compounds containing inorganic components-
The organic compound containing the inorganic component is preferably an organic compound having a metal atom. Among these, an organic compound containing a silicon atom is more preferable. A compound having a siloxane bond (Si—O—Si bond) (also referred to as a silane compound or a siloxane compound) is more preferable.

In the silane compound, examples of the structure of the siloxane skeleton that essentially requires a siloxane bond include a chain shape (straight or branched), a ladder shape, a net shape, a cyclic shape, a cage shape, and a cubic shape. Especially, since the effect is easily exhibited even if the addition amount of the silane compound is small, a ladder shape, a net shape, or a cage shape is preferable. That is, the silane compound preferably includes polysilsesquioxane.
In addition, as a ratio for which the siloxane skeleton accounts in the said silane compound, it is preferable that it is 10-80 mass% in 100 mass% of silane compounds.

The siloxane skeleton (main chain skeleton that requires a siloxane bond) can also be expressed as (SiO _m ) _n . The structure other than (SiO _m ) _n in such a silane compound, for example, when the silane compound is a compound represented by the following average composition formula (1), X represents an organic skeleton, Y represents a hydrogen atom, a hydroxyl group, or the like. And Z representing an organic skeleton other than X, which are bonded to the silicon atom of the main chain skeleton. X, Y and Z may or may not be included in the repeating unit in the form of a “chain”. For example, one or more Xs may be contained in one molecule as a side chain.

In the main chain skeleton (SiO _m ) _n , m is preferably a number of 1 or more and less than 2. More preferably, m = 1.5 to 1.8. More preferably, m = 1.5. In the case where the silane compound is a compound represented by the following average composition formula (1), in the main chain skeleton (Si—O _m1 ) _n1 and (Si—O _m2 ) _n2 in the following formula (2), (n ₁ The range of (+1) / (n ₁ + n ₂ +1) is preferably the same as the preferable range of a in the following average composition formula (1).

N represents a polymerization degree (polymerization degree of the main chain skeleton), and is preferably 1 to 5000. More preferably, it is 1-2000, More preferably, it is 1-1000.

Among the silane compounds, a compound represented by the following average composition formula (1) is particularly preferable.
XaYbZcSiOd (1)
(Wherein X is the same or different and represents an organic skeleton. Y is the same or different and represents at least one selected from the group consisting of a hydrogen atom, a hydroxyl group, a halogen atom and an OR group. R is The same or different, at least one group selected from the group consisting of an alkyl group, an acyl group, an aryl group, and an unsaturated aliphatic residue, which may have a substituent, and Z may be the same or different; Differently, it represents an organic skeleton different from X. a is a number of 0 or less than 3, b is a number of 0 or less than 3, c is a number of 0 or less than 3, d is a number less than 2 that is not 0 a + b + c + 2d = 4)

By containing the silane compound, a cured product having excellent heat resistance, pressure resistance, mechanical / chemical stability, and thermal conductivity can be provided. For example, by appropriately selecting a structure such as a siloxane skeleton and an organic skeleton (X) and exhibiting high compatibility with components contained in the resin composition, the resin composition can be easily heat-resistant and pressure-resistant. Etc. can be given. A resin composition imparted with heat resistance, pressure resistance, and the like can be suitably used for mounting applications and the like because it can form a cured product having a low decrease in various physical properties even under harsh environments such as high temperature and pressure.

In the above average composition formula (1): XaYbZcSiOd, the coefficient a of X is a number 0 ≦ a <3, the coefficient b of Y is a number 0 ≦ b <3, and the coefficient c of Z is 0 ≦ c <3, and the coefficient d of O is a number of 0 <d <2. Here, from the viewpoint of improving the solubility of the silane compound in the component (for example, alkali-soluble resin) in the resin composition, the coefficient a of X in the average composition formula (1) satisfies 0 <a. It is preferable.

In the average composition formula (1), a + b + c is preferably 0.5 or more. More preferably, it is 0.7 or more, more preferably 0.7 or more and 1.0 or less, and particularly preferably 1. Further, d which is a coefficient of oxygen O is preferably 1.50.

In the average composition formula (1), the number of bonds between the silicon atom to which X is bonded and the oxygen atom is preferably 3. In this case, since the silicon atom to which X is bonded is not bonded to another functional group, it can be a silane compound that is more excellent in heat resistance, moisture resistance, and hydrolysis resistance. In addition, the number of bonds between the silicon atom and the oxygen atom constituting the siloxane bond is preferably 3. In this case, since the silicon atom which comprises a siloxane bond is not couple | bonded with functional groups other than the organic group represented by X, it can be set as the silane compound excellent in heat resistance and hydrolyzability.

In the average composition formula (1), X represents an organic skeleton, and the proportion of such an organic skeleton is preferably 20 to 100 moles with respect to 100 moles of silicon atoms contained in the silane compound. . More preferably, it is 50-100 mol, More preferably, it is 70-100 mol.

The organic skeleton represented by X is not particularly limited, but is preferably a group having a molecular weight of 1000 or less, for example. Specifically, for example, an alkyl group having 1 to 30 carbon atoms, an alkoxy group having 1 to 30 carbon atoms, or an aromatic residue having 6 to 30 carbon atoms, which may have a substituent, may be mentioned.
The substituent is not particularly limited and may be, for example, a halogen atom, an unsaturated hydrocarbon group such as an alkenyl group or an alkynyl group, or a polymerizable functional group such as an epoxy group.

In the average composition formula (1), Y is preferably a hydroxyl group or an OR group. Among them, an OR group is more preferable, and an OR group in which R is an alkyl group having 1 to 8 carbon atoms is more preferable.

In the average composition formula (1), Z is preferably at least one selected from the group consisting of an aromatic residue such as an alkyl group, an aryl group, and an aralkyl group, and an unsaturated aliphatic residue. (These may have a substituent). More preferably, it is a C1-C8 alkyl group which may have a substituent, or aromatic residues, such as an aryl group and an aralkyl group. Specifically, for example, methyl group, ethyl group, phenyl group, vinyl group, chloropropyl group, mercaptopropyl group, (epoxycyclohexyl) ethyl group, glycidoxypropyl group, N-phenyl-3-aminopropyl group, (Meth) acryloxypropyl group, hexyl group, decyl group, octadecyl group, trifluoropropyl group and the like are preferable.

The silane compound also includes, for example, the following formula (2):

(In the formula, X, Y and Z are the same as described above. N ₁ and n ₂ represent the degree of polymerization. N ₁ is a non-zero positive integer, and n ₂ is 0 or positive. It is an integer.)
In the formula, “Y / Z-” represents that Y or Z is bonded, “X ₁ to ₂ −” represents that 1 or 2 X are bonded, and “(Z / _Y) 1 _{~ 2} - "indicates that the Z or Y is either single bond or Z or Y is a bond to two, Z and Y are one by one, to total of two coupling. “Si— (X / Y / Z) ₃ ” indicates that any three selected from X, Y, and Z are bonded to a silicon atom.

In the above formula (2), _{Si-O m1} and _{Si-O m @ 2} is not intended to define the binding order of _{Si-O m1} and _{Si-O m @ 2,} for example, _{Si-O m1} and _{Si-O m @ 2} alternating Or the form co-condensed at random, the form which the polysiloxane which consists of Si-O _m1, and the polysiloxane of Si-O _m2 couple | bond are suitable, and a condensation structure is arbitrary.

Examples of the molecular structure of the silane compound include a chain structure (linear and branched), a ladder structure, a network, a ring, a ring structure composed of a ladder, a cage (including an incomplete cage), and the like. All are preferred.

The structure of the silane compound can be identified by measuring 1H-NMR, 13C-NMR, and MALDI-TOF-MS.

As for the molecular weight of the said silane compound, it is suitable that a number average molecular weight is 100-100,000, for example. By being in this range, it becomes more excellent in heat decomposition resistance and miscibility with other components in the curable resin composition. The upper limit of the number average molecular weight is more preferably 80,000 or less, and still more preferably 60,000 or less. The weight average molecular weight is preferably from 100 to 150,000, more preferably 140,000 or less, still more preferably 120,000 or less, particularly preferably 100,000 or less as the upper limit of the weight average molecular weight.

The molecular weight (number average molecular weight and weight average molecular weight) of the silane compound can be determined by, for example, GPC (gel permeation chromatography) measurement.
The GPC measurement is preferably set to the following conditions, for example.
Measuring instrument: HLC-8120GPC (trade name, manufactured by Tosoh Corporation)
Molecular weight column: TSK-GEL GMHXL-L and TSK-GELG5000HXL (both manufactured by Tosoh Corporation) are used in series.
Eluent: Tetrahydrofuran (THF)
Standard material for calibration curve: Polystyrene (manufactured by Tosoh Corporation)
Measurement method: The measurement object is dissolved in THF so that the solid content is about 0.2% by mass, and the molecular weight is measured using an object obtained by filtration through a filter as a measurement sample.

<Reactive compound>
The curable resin composition contains a reactive compound. The reactive compound is a compound having at least one reactive functional group selected from the group consisting of an epoxy group, an oxetanyl group and a blocked isocyanate group. By including such a reactive compound, the cured product can achieve both excellent surface hardness and low dielectric constant.

As a compound having at least one reactive functional group selected from the group consisting of the epoxy group, oxetanyl group and blocked isocyanate group, as long as it has at least one reactive functional group in one molecule Good. For example, an epoxy group-containing compound (also referred to as an epoxy compound), an oxetanyl group-containing compound (also referred to as an oxetane compound), and a blocked isocyanate group-containing compound (also referred to as a blocked isocyanate compound) are preferable. Among these, a blocked isocyanate compound is more preferable. When the blocked isocyanate compound is used, when the resin composition is cured by heat treatment, a highly reactive isocyanate group is regenerated by heating from the blocked isocyanate group in the compound, and this is combined with the resin composition in the resin composition. The crosslink density of the cured product is further increased by the reaction product with the hydroxyl group, and the effects of the present invention can be more fully exhibited. Thus, the form in which the said resin composition contains a blocked isocyanate compound is one of the suitable forms of this invention.

In this specification, “epoxy group” includes, in addition to an epoxy group in a narrow sense, a group in which an oxirane ring is bonded to carbon such as a glycidyl group, or an ether or ester bond such as a glycidyl ether group and a glycidyl ester group. And a group containing an epoxycyclohexane ring and the like.

The content of the reactive compound is preferably 5% by mass or more in the total solid content of 100% by mass of the curable resin composition. As a result, a lower dielectric can be achieved. More preferably, it is 7 mass% or more, More preferably, it is 10 mass% or more. Moreover, it is suitable that it is 50 mass% or less from a viewpoint of the improvement of surface hardness. More preferably, it is 40 mass% or less, More preferably, it is 30 mass% or less.

In the present invention, when the total amount of the inorganic compound and the reactive compound is 100% by mass, the reactive compound is preferably 10 to 90% by mass. Thereby, both low dielectric constant and improvement in surface hardness can be achieved. More preferably, it is 20-80 mass%.

Below, the epoxy compound, oxetane compound, and block isocyanate compound suitable as a reactive compound of this invention are further demonstrated.

-Epoxy compound-
The epoxy compound is preferably a compound having an alicyclic epoxy group from the viewpoints of curability and reactivity. Among these, compounds having two or more epoxy groups in the molecule are preferable.

Specific examples of the epoxy compound include the following compounds.
Polyphenol type epoxy compounds such as bisphenol A diglycidyl ether, bisphenol F diglycidyl ether, phenol novolac glycidyl ether, cresol novolac glycidyl ether; glycerin triglycidyl ether, trimethylolpropane triglycidyl ether, neopentyl glycol tetraglycidyl ether Glycidyl ether type epoxy compounds such as polyalkylene glycol diglycidyl ether and sorbitol polyglycidyl ether; hydrogenated polyphenol type epoxy compounds such as hydrogenated bisphenol A diglycidyl ether and hydrogenated bisphenol F diglycidyl ether; aniline, toluidine and methylenediamine Glycidylamine type of aniline derivatives such as aminophenol Poxy compounds; glycidyl ester type epoxy compounds such as phthalic acid diglycidyl ester, trimellitic acid triglycidyl ester, trimesic acid triglycidyl ester, pyromellitic acid tetraglycidyl ester; 1-cyclohexene-1,2-dicarboxylic acid diglycidyl ester, 3-cyclohexene-1,2-dicarboxylic acid diglycidyl ester, 4-cyclohexene-1,2-dicarboxylic acid diglycidyl ester, hexahydrophthalic acid diglycidyl ester, 3-methylhexahydrophthalic acid diglycidyl ester, 4- Methylhexahydrophthalic acid diglycidyl ester, 1,2,4-cyclohexanetricarboxylic acid triglycidyl ester, 1,2,4,5-cyclohexanetetracarboxylic acid tetraglycidyl ester, etc. Alicyclic polycarboxylic acid glycidyl ester;

Isocyanuric epoxy compounds such as triglycidyl isocyanurate and monoallyl diglycidyl isocyanurate; 3,4-epoxycyclohexylmethyl-3 ', 4'-epoxycyclohexanecarboxylate, tetrakis (3,4-epoxycyclohexylmethyl) butanetetracarboxyl , Di (3,4-epoxycyclohexylmethyl) -4,5-epoxytetrahydrophthalate), ethylene bis (3,4-epoxycyclohexanecarboxylate), bis (3,4-epoxycyclohexyl) methane, 2,2- Epoxycyclohexyl epoxy compounds such as bis (3,4-epoxycyclohexyl) propane, bis (3,4-epoxycyclohexylmethyl) adipate, bis (3,4-epoxycyclohexyl); 1 Vinyl-3-cyclohexene dioxide, 3,4-epoxy-6-methylcyclohexyl-3,4-epoxy-6-methylcyclohexanecarboxylate, bis (3,4-epoxy-6-methylhexyl) adipate, ethylenebis ( 3,4-epoxy-6-methylcyclohexanecarboxylate), limonene dioxide, 1,2,5,6-cyclooctadiene dioxide, dicyclopentadiene dioxide, and other alicyclic epoxy compounds;

Among the above epoxy compounds, polyphenol type epoxy compounds are preferable from the viewpoint of reactivity, and among them, epoxy compounds using bisphenols are preferable. Bisphenol A diglycidyl ether is more preferable, and 2,2-bis (4-hydroxyphenyl) propane diglycidyl ether and triglycidyl isocyanurate are more preferable.

-Oxetane compounds-
Examples of the oxetane compound include a compound having one oxetanyl group in the molecule and a compound having two or more oxetanyl groups in the molecule. From the viewpoint of curability and reactivity, an oxetanyl group is included in the molecule. A compound having two or more is preferred.

Examples of the oxetane compound include compounds having one oxetanyl group in a molecule represented by the following general formula (a-1), and molecules represented by the following general formulas (a-2) to (a-3). Examples thereof include a compound having two oxetanyl groups therein, a compound having three or more oxetanyl groups in the molecule represented by the following general formula (a-4), and the like.

In the formula, R ^a1 is the same or different and represents a hydrogen atom, an alkyl group (which may be linear, branched or cyclic), a fluoroalkyl group, an allyl group, an aryl group, a furyl group or a thienyl group. , May have a substituent. R ^a2 represents a hydrogen atom, an alkyl group (which may be linear, branched or cyclic), an alkenyl group, a group having an aromatic ring, an alkylcarbonyl group, an alkoxycarbonyl group or an N-alkylcarbamoyl group, It may have a substituent. R ^a3 is a chain or branched alkylene group, a poly (alkylene oxide) group, a chain or branched divalent unsaturated hydrocarbon group, a carbonyl group, an alkylene group containing a carboxy group, or an alkylene containing a carbamoyl group. Represents a group or any of the partial structures (b-1) to (b-11) described later, and may have a substituent. R ^a4 represents a polyvalent linking group. s is an integer of 3 or more, preferably 3 or 4.

The alkyl group (which may be linear, branched or cyclic) is preferably an alkyl group having 1 to 6 carbon atoms, and examples thereof include a methyl group, an ethyl group, a propyl group, and a butyl group. As the fluoroalkyl group, those in which part or all of the hydrogen atoms of the alkyl group having 1 to 6 carbon atoms (which may be linear, branched or cyclic) are substituted with fluorine atoms are preferable. Examples of the aryl group include a phenyl group, a naphthyl group, and a tolyl group. Examples of the substituent include an alkyl group having 1 to 6 carbon atoms (which may be linear, branched or cyclic), a halogen atom such as a fluorine atom, and the like.

As said alkenyl group, a C2-C6 alkenyl group is preferable, for example, 1-propenyl group, 2-propenyl group, 2-methyl-1-propenyl group, 2-methyl-2-propenyl group, 1-butenyl. Group, 2-butenyl group, 3-butenyl group and the like. Examples of the group having an aromatic ring include a phenyl group, a benzyl group, a fluorobenzyl group, a methoxybenzyl group, and a phenoxyethyl group. As the alkylcarbonyl group, an alkylcarbonyl group having 2 to 6 carbon atoms is preferable, and examples thereof include an ethylcarbonyl group, a propylcarbonyl group, and a butylcarbonyl group. Examples of the alkoxycarbonyl group having 2 to 6 carbon atoms include an ethoxycarbonyl group, a propoxycarbonyl group, and a butoxycarbonyl group. The N-alkylcarbamoyl group is preferably an N-alkylcarbamoyl group having 2 to 6 carbon atoms, and examples thereof include an ethylcarbamoyl group, a propylcarbamoyl group, a butylcarbamoyl group, and a pentylcarbamoyl group.

Examples of the chain or branched alkylene group include an ethylene group, a propylene group, and a butylene group. Examples of the poly (alkylene oxide) group include a poly (ethylene oxide) group and a poly (propylene oxide) group. Examples of the chain or branched divalent unsaturated hydrocarbon group include a propenylene group, a methylpropenylene group, and a butenylene group.

In the formula, R ^a5 represents a hydrogen atom, an alkyl group, an alkoxy group, a halogen atom, a nitro group, a cyano group, a mercapto group, a lower alkyl carboxyl group, a carboxyl group, or a carbamoyl group. R ^a6 represents an oxygen atom, a sulfur atom, a methylene group,

Represents. R ^a7 represents a hydrogen atom, an alkyl group, an alkoxy group, a halogen atom, a nitro group, a cyano group, a mercapto group, a lower alkyl carboxyl group, a carboxyl group or a carbamoyl group, and 2 to 4 substituents are substituted on the naphthalene ring in the structure You may do it. q is a number from 0 to 10, and may be a mixture of compounds having different numerical values.
In addition, as an alkyl group, a C1-C4 alkyl group is preferable, for example, a hydrogen atom, a methyl group, an ethyl group, a propyl group, a butyl group etc. are mentioned. As an alkoxy group, a C1-C4 alkoxy group is preferable, for example, a methoxy group, an ethoxy group, a propoxy group, a butoxy group etc. are mentioned. Examples of the halogen atom include a chlorine atom and a bromine atom.

Examples of the polyvalent linking group represented by R ^a4 in the general formula (a-4) include a branched alkylene group having 1 to 12 carbon atoms as represented by the following formulas (i) to (v). , Branched poly (oxyalkylene) groups, branched polysiloxy groups, and the like. In the following formula (i), R ^a10 represents a methyl group, an ethyl group, or a propyl group. In the following formula (iv), p is an integer of 1 to 10.

Specific examples of the oxetane compound include the following compounds.
1,4-bis {[(3-ethyl-3-oxetanyl) methoxy] methyl} benzene (Aron oxetane OXT-121 (trade name “XDO”, manufactured by Toagosei Co., Ltd., the same shall apply hereinafter)), di [2- ( 3-oxetanyl) butyl] ether (Aronoxetane OXT-221 (DOX)), 1,4-bis [(3-ethyloxetane-3-yl) methoxy] benzene (HQOX), 1,3-bis [(3- Ethyloxetane-3-yl) methoxy] benzene (RSOX), 1,2-bis [(3-ethyloxetane-3-yl) methoxy] benzene (CTOX), 4,4′-bis [(3-ethyloxetane- 3-yl) methoxy] biphenyl (4,4′-BPOX), 2,2′-bis [(3-ethyl-3-oxetanyl) methoxy] biphenyl (2,2′-BPOX), 3,3 ′, 5,5′-tetramethyl [4,4′-bis (3-ethyloxetane-3-yl) methoxy] biphenyl (TM-BPOX), 2,7-bis [(3-ethyloxetane- 3-yl) methoxy] naphthalene (2,7-NpDOX), 1,6-bis [(3-ethyloxetane-3-yl) methoxy] -2,2,3,3,4,4,5,5- Octafluorohexane (OFH-DOX), 3 (4), 8 (9) -bis [(1-ethyl-3-oxetanyl) methoxymethyl] -tricyclo [5.2.1.1.2.6] decane, 1,2-bis [2-{(1-ethyl-3-oxetanyl) methoxy} ethylthio] ethane, 4,4′-bis [(1-ethyl-3-oxetanyl) methyl] thiodibenzenethioether, 2,3 -Bis [(3-ethyloxetane- 3-yl) methoxymethyl] norbornane (NDMOX), 2-ethyl-2-[(3-ethyloxetane-3-yl) methoxymethyl] -1,3-O-bis [(1-ethyl-3-oxetanyl) Methyl] -propane-1,3-diol (TMPTOX), 2,2-dimethyl-1,3-O-bis [(3-ethyloxetane-3-yl) methyl] -propane-1,3-diol (NPGOX) ), 2-butyl-2-ethyl-1,3-O-bis [(3-ethyloxetane-3-yl) methyl] -propane-1,3-diol, 1,4-O-bis [(3- Ethyloxetane-3-yl) methyl] -butane-1,4-diol, 2,4,6-O-tris [(3-ethyloxetane-3-yl) methyl] cyanuric acid;

3-ethyl-3 {[(3-ethyloxetane-3-yl) methoxy] methyl} oxetane, etherified product of bisphenol A and 3-ethyl-3-chloromethyloxetane (abbreviated OXC) (BisAOX), bisphenol F And OXC etherified product (BisFOX), phenol novolak and OXC etherified product (PNOX), cresol novolak and OXC etherified product (CNOX), oxetanylsilsesquioxane (OX-SQ), 3-ethyl-3 -Hydroxymethyloxetane silicon alkoxide (OX-SC) 3-ethyl-3- (2-ethylhexyloxymethyl) oxetane (Aron oxetane OXT-212 (EHOX)), 3-ethyl-3- (dodecyloxy) Methyl) oxetane (OXR-12), 3-d Lu-3- (octadecyloxymethyl) oxetane (OXR-18), 3-ethyl-3- (phenoxymethyl) oxetane (Aron oxetane OXT-211 (POX)), 3-ethyl-3-hydroxymethyloxetane (OXA) ), 3- (cyclohexyloxy) methyl-3-ethyloxetane (CHOX);

Examples of the oxetane compound include a compound having a relatively high molecular weight of about 1000 to 5000 and having 1 to 4 oxetanyl groups; a polymer containing an oxetanyl group;

-Block isocyanate compounds-
The above-mentioned blocked isocyanate compound is a compound having a blocked isocyanate group, that is, a group in which the isocyanate group is protected by reaction with a blocking agent and temporarily inactivated, and the polyisocyanate compound is blocked in the presence of the blocking agent. Can be obtained. What is necessary is just to carry out by the method currently performed normally as a blocking reaction, and a blocking agent and a polyisocyanate compound can use 1 type (s) or 2 or more types, respectively.

The blocking agent may be any compound containing an active hydrogen atom, for example, phenols such as phenol, cresol, xylenol, chlorophenol, ethylphenol; alkanol, amyl alcohol, alkylene glycol monomethyl ether, benzyl ether, methyl glycolate , Alcohols such as butyl glycolate, diacetone alcohol, methyl lactate, ethyl lactate; lactams such as ε-caprolactam, δ-valerolactam, γ-butyrolactam, β-propiolactam; formaldehyde oxime, acetoaldoxime, acetoxime Oximes such as methyl ethyl ketoxime, diacetyl monooxime, butanone oxime, cyclohexane oxime; butyl mercaptan, hexyl mercaptan, t-butyl mercaptan Mercaptans such as thiophenol, methylthiophenol and ethylthiophenol; acid amide block agents such as acetic acid amide and benzamide; imides such as succinimide and maleic acid imide; amines such as xylidine, aniline, butylamine and dibutylamine Imidazoles such as imidazole and 2-ethylimidazole; imines such as methyleneimine and propyleneimine; diketones; ureas; esters such as diethyl malonate; amines; pyrazoles such as pyrazole; Among these, oximes, lactams, pyrazoles or esters are preferable, butanone oxime, ε-caprolactam, pyrazole or diethyl malonate is more preferable.

It does not specifically limit as a polyisocyanate compound which can react with the said blocking agent, For example, an isocyanurate type, a biuret type, an adduct type etc. are mentioned. Specifically, for example, aromatics such as tolylene diisocyanate, phenylene diisocyanate, diphenylmethane diisocyanate, naphthalene diisocyanate, xylylene diisocyanate, diphenylsulfone diisocyanate, triphenylmethane diisocyanate, triphenylmethane triisocyanate, diphenyl ether-4,4'-diisocyanate Group polyisocyanate; tetramethylene diisocyanate, hexamethylene diisocyanate, methylene diisocyanate, trimethylhexamethylene diisocyanate, 3-isocyanate methyl-3,5,5-trimethylcyclohexyl isocyanate, 3-isocyanate ethyl-3,5,5-trimethylcyclohexyl isocyanate, 3-isocyanatoethyl-3 Aliphatic polyisocyanates such as 5,5-triethylcyclohexyl isocyanate, diphenylpropane diisocyanate, cyclohexylene diisocyanate, 3,3'-diisocyanate dipropyl ether, 4,4-methylenebis (cyclohexyl isocyanate) and isophorone diisocyanate; bicycloheptane triisocyanate, etc. Alicyclic polyisocyanate; and the like.

The block isocyanate compound is preferably an isocyanurate type block isocyanate compound represented by the following general formula (3) or an adduct type block isocyanate compound represented by the following general formula (4). Even if any of these is used, it is considered that the crosslinked density of the cured product is improved and a low dielectric constant can be achieved by a substantially similar mechanism.

In the formula, X ¹ , X ² and X ³ , and X ⁴ , X ⁵ and X ⁶ are the same or different and represent a divalent organic group. Y ¹ , Y ² and Y ³ , and Y ⁴ , Y ⁵ and Y ⁶ are the same or different and represent a group derived from a blocking agent.

Examples of the divalent organic group include an alkylene group, an arylene group, and a (poly) oxyalkylene group, and a part thereof may be substituted with a substituent. It does not specifically limit as a substituent, For example, halogen atoms, such as a fluorine atom, a chlorine atom, a bromine atom, and an iodine atom, are mentioned. In addition, when the divalent organic group has a ring structure, examples of the substituent include a halogen atom, an alkyl group such as a methyl group and an ethyl group, and the like.

The alkylene group preferably has 1 to 30 carbon atoms, for example. Among these, from the viewpoint of further increasing the surface hardness of the cured product, it is preferable that the number of carbon atoms is not too large. Therefore, the upper limit value of the carbon number is preferably 12, and more preferably 8. The lower limit is preferably 2 or more.

The alkylene group may have a linear structure, or may have a branched structure or an alicyclic structure. Specifically, for example, methylene group, ethylene group, propylene group, isopropylene group, butylene group, isobutylene group, t-butylene group, pentylene group, neopentylene group, hexylene group (hexamethylene group), heptylene group, octylene group, Examples include 2-ethylhexylene group, nonylene group, decylene group, undecylene group, dodecylene group and the like.

The number of carbon atoms of the arylene group is preferably 6-30, for example. More preferably, it is 6-14.
Specific examples of the arylene group include a phenylene group, a tolylene group, a naphthylene group, and a diethylnaphthylene group.

As said (poly) oxyalkylene group, what was formed by the C2-C18 oxyalkylene group is suitable. When two or more types of oxyalkylene groups are present, the addition form may be any addition form such as random addition, block addition, and alternate addition. As carbon number of an oxyalkylene group, 2-8 are preferable, More preferably, it is 2-4, More preferably, it is 2.

In the (poly) oxyalkylene group, the average number of repeating oxyalkylene groups (average number of added moles) is, for example, preferably a number of 1 to 30. Among these, from the viewpoint of further increasing the surface hardness of the cured product, since the average number of repetitions is preferably small, the upper limit is preferably 12, more preferably 8, and even more preferably 6.

Among the divalent organic groups, an alkylene group having an alicyclic structure derived from isophorone, an alkylene group having 2 to 8 carbon atoms, and an arylene group having an aromatic ring derived from xylylene are preferable.

The group derived from the blocking agent is a group having one bond after one active hydrogen atom of the blocking agent is removed.

Although the said block isocyanate compound can be obtained by blocking reaction as mentioned above, you may use a commercial item. As a commercial item, for example, Sumidur BL-3175, BL-4165, BL-1100, BL-1265, CT stable, Death module TPLS-2957, TPLS-2062, TPLS-2078, TPLS-2117, TPLS-2704 , Desmotherm 2170, desmotherm 2265 (both manufactured by Sumitomo Bayer Urethane Co., Ltd., trade names); coronate 2512, coronate 2513, coronate 2520 (both manufactured by Nippon Polyurethane Industry Co., Ltd.); B-830, B-815, B 846, B-870, B-874, B-882 (trade name, manufactured by Mitsui Takeda Chemical Company); TPA-B80E, 17B-60PX, E402-B80T (trade name, manufactured by Asahi Kasei Chemicals Corp.);

<Photopolymerization initiator>
It is preferable that the curable resin composition also contains a photopolymerization initiator. Thereby, it becomes possible to improve the sensitivity and curability of the resin composition. Thus, the form in which the said curable resin composition further contains a photoinitiator is one of the suitable forms of this invention.

The photopolymerization initiator is preferably a radical polymerizable photopolymerization initiator. A radical polymerizable photopolymerization initiator is one that generates a polymerization initiating radical by irradiation with an active energy ray such as an electromagnetic wave or an electron beam, and one or more commonly used ones can be used. . Moreover, you may use together 1 type (s) or 2 or more types of photosensitizers, radical photopolymerization promoters, etc. as needed. Even if a photosensitizer and / or a radical photopolymerization accelerator are not used in combination, the effects of the present invention can be sufficiently exerted, but when used together, sensitivity and curability are further improved.

Specific examples of the photopolymerization initiator include the following compounds.
2,2-diethoxyacetophenone, 2,2-dimethoxy-2-phenylacetophenone, 1-hydroxycyclohexyl phenyl ketone, 2-hydroxy-2-methyl-1-phenylpropan-1-one, 1- [4- (2 -Hydroxyethoxy) phenyl] -2-hydroxy-2-methyl-1-propan-1-one, 2-hydroxy-1- {4- [4- (2-hydroxy-2-methylpropionyl) benzyl] phenyl}- 2-methylpropan-1-one, 2-methyl-1- (4-methylthiophenyl) -2-morpholinopropan-1-one, 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -Butanone-1,2- (dimethylamino) -2-[(4-methylphenyl) methyl] -1- [4- (4-morpholinyl) Nyl] -1-butanone and other alkylphenone compounds; benzophenone, 4,4′-bis (dimethylamino) benzophenone, benzophenone compounds such as 2-carboxybenzophenone, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin Benzoin compounds such as isobutyl ether; thioxanthone compounds such as thioxanthone, 2-ethylthioxanthone, 2-isopropylthioxanthone, 2-chlorothioxanthone, 2,4-dimethylthioxanthone, 2,4-diethylthioxanthone;

2- (4-methoxyphenyl) -4,6-bis (trichloromethyl) -s-triazine, 2- (4-methoxynaphthyl) -4,6-bis (trichloromethyl) -s-triazine, 2- (4 Halomethylated triazine compounds such as -ethoxynaphthyl) -4,6-bis (trichloromethyl) -s-triazine, 2- (4-ethoxycarbonylnaphthyl) -4,6-bis (trichloromethyl) -s-triazine; 2-trichloromethyl-5- (2′-benzofuryl) -1,3,4-oxadiazole, 2-trichloromethyl-5- [β- (2′-benzofuryl) vinyl] -1,3,4-oxa Halomethylated oxadiazole compounds such as diazole, 4-oxadiazole, 2-trichloromethyl-5-furyl-1,3,4-oxadiazole; 2 2′-bis (2-chlorophenyl) -4,4 ′, 5,5′-tetraphenyl-1,2′-biimidazole, 2,2′-bis (2,4-dichlorophenyl) -4,4 ′, 5,5′-tetraphenyl-1,2′-biimidazole, 2,2′-bis (2,4,6-trichlorophenyl) -4,4 ′, 5,5′-tetraphenyl-1,2 ′ -Biimidazole compounds such as biimidazole; 1,2-octanedione, 1- [4- (phenylthio)-, 2- (O-benzoyloxime)], ethanone, 1- [9-ethyl-6- (2 -Methylbenzoyl) -9H-carbazol-3-yl]-, 1- (O-acetyloxime) and other oxime ester compounds; bis (η5-2,4-cyclopentadien-1-yl) -bis (2, 6-Difluoro-3- (1H Pyrrol-1-yl) - phenyl) titanocene compounds such as titanium; p-dimethylaminobenzoic acid, p- benzoic acid ester compounds such as diethyl benzoate; acridine compounds such as 9-phenyl acridine or the like.

Examples of the photosensitizer and photoradical polymerization accelerator that may be used in combination with the photopolymerization initiator include dye compounds such as xanthene dyes, coumarin dyes, 3-ketocoumarin compounds, and pyromethene dyes; 4-dimethylamino Examples thereof include dialkylaminobenzene compounds such as ethyl benzoate and 2-ethylhexyl 4-dimethylaminobenzoate; mercaptan hydrogen donors such as 2-mercaptobenzothiazole, 2-mercaptobenzoxazole and 2-mercaptobenzimidazole.

The content of the photopolymerization initiator may be appropriately set according to the purpose, application, etc., and is not particularly limited, but is 0.1 parts by mass or more with respect to 100 parts by mass of the solid content of the curable resin composition. Preferably it is. Thereby, the hardened | cured material excellent by adhesiveness can be obtained, and peeling is suppressed more fully even after high temperature exposure. In consideration of the balance between the influence of the decomposition product of the photopolymerization initiator, economy, and the like, the amount is preferably 30 parts by mass or less. The lower limit is more preferably 0.5 parts by mass or more, further preferably 1 part by mass or more, particularly preferably 2 parts by mass or more, and the upper limit is more preferably 25 parts by mass or less, and still more preferably 20 parts by mass or less. is there.

The photosensitizer and the photo radical polymerization accelerator do not have to be used as described above. It is preferable that it is 0.001-20 mass% with respect to 100 mass% of solid content total amount of a composition. More preferably, it is 0.01-15 mass%, More preferably, it is 0.05-10 mass%.

<Coupling agent>
It is preferable that the curable resin composition also contains a coupling agent. The coupling agent has a property of bonding with an oxidized surface of an inorganic substance by a hydrolysis reaction or a condensation reaction. By using this property, for example, adhesion to a substrate or the like on which ITO or the like is deposited is performed. It becomes possible to fully exhibit the property. Thus, the form in which the said curable resin composition contains a coupling agent is one of the suitable forms of this invention.

Specifically, as the coupling agent, for example, a coupling agent having a reactive group such as a vinyl group, a (meth) acryl group, an epoxy group, an amino group, a mercapto group, or an isocyanate is preferable. Especially, what has a vinyl group, a (meth) acryloyl group, and / or an epoxy group as a reactive group is preferable. More preferred is a (meth) acryloyl group. Moreover, what contains silicon, a zirconia, titanium, and / or aluminum etc. as a center metal is suitable, for example, what has silicon as a center metal is preferable, More preferably, it is a silane coupling agent. By using a silane coupling agent, the dispersibility, adhesion and surface hardness of the cured product can be made more satisfactory.

Among the silane coupling agents, a silane coupling agent having a (meth) acryloyl group is particularly preferable, and thus the storage stability is further improved. In addition, the adhesion is further improved.
In addition, as a coupling agent which has metals other than silicon as a central metal, a zirco aluminate coupling agent, a titanate coupling agent, etc. are mentioned, for example.

As the silane coupling agent, and one or more reactive groups described above, the alkoxysilane group _{^{(-Si (OR 1) 3-}} n (R 2) n; OR 1 is a hydrolysable group And R ¹ is preferably a hydrocarbon group, R ² is a hydrocarbon group, and n is 0, 1 or 2. Among them, it is preferable to use a silane coupling agent having a vinyl group, a (meth) acryloyl group and / or an epoxy group, and thereby disperse without change over time such as discoloration, coloring, cracks, etc. even after high temperature exposure. It is possible to obtain a cured product that can maintain the properties more sufficiently and that has more sufficient surface hardness and adhesion.

Examples of the silane coupling agent having a vinyl group include vinyltrimethoxysilane and vinyltriethoxysilane.
Examples of the silane coupling agent having the (meth) acryloyl group include 3- (meth) acryloxypropyltrimethoxysilane, 3- (meth) acryloxypropylmethyldimethoxysilane, and 3- (meth) acryloxypropyltri Examples include methoxysilane, 3- (meth) acryloxypropylmethyldimethoxysilane, and 3- (meth) acryloxypropyltriethoxysilane.
Specific examples of the silane coupling agent having an epoxy group include 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropyltriethoxysilane, 3-glycidoxypropylmethyldiethoxysilane, 3- Examples thereof include glycidoxypropylmethyldimethoxysilane and 2- (3,4-epoxycyclohexyl) ethyltrimethoxysilane.

Examples of the silane coupling agent having an amino group include N-phenyl-3-aminopropyltrimethoxysilane.
Examples of the silane coupling agent having a mercapto group include 3-mercaptopropylmethyldimethoxysilane and 3-mercaptopropyltrimethoxysilane.
Examples of the silane coupling agent having an isocyanate group include 3-isocyanatopropyltriethoxysilane.

In the curable resin composition, the content of the coupling agent is suitably 3% by mass or more in 100% by mass of the total solid content of the curable resin composition. By being 3% by mass or more, sufficient adhesion and surface hardness can be obtained even after high temperature exposure. Preferably it is 5 mass% or more, More preferably, it is 7 mass% or more. Moreover, it is suitable that it is 30 mass% or less from viewpoints, such as the storage stability of curable resin composition. More preferably, it is 25 mass% or less, More preferably, it is 20 mass% or less.

<Other ingredients>
-Solvent-
The curable resin composition preferably also contains a solvent. A solvent is preferably used as a diluent or the like. That is, specifically, the viscosity is lowered and the handling property is improved; the coating film is formed by drying; the coloring material is used as a dispersion medium; and the like. It is a low-viscosity organic solvent or water that can dissolve or disperse each of the components.

As the solvent, those usually used can be used, and may be appropriately selected according to the purpose and application, and are not particularly limited, and examples thereof include the following compounds. These may be used alone or in combination of two or more.

Monoalcohols such as methanol, ethanol, isopropanol, n-butanol, s-butanol; glycols such as ethylene glycol and propylene glycol; cyclic ethers such as tetrahydrofuran and dioxane; ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene Glycol monoethers such as glycol monobutyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol monobutyl ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol monobutyl ether, 3-methoxybutanol; ethylene glycol dimethyl ether, ethylene glycol Jie Ether, ethylene glycol ethyl methyl ether, diethylene glycol dimethyl ether, diethylene glycol diethyl ether, diethylene glycol ethyl methyl ether, propylene glycol dimethyl ether, glycol ethers such as propylene glycol diethyl ether;

Ethylene glycol monomethyl ether acetate, ethylene glycol monoethyl ether acetate, ethylene glycol monobutyl ether acetate, diethylene glycol monomethyl ether acetate, diethylene glycol monoethyl ether acetate, diethylene glycol monobutyl ether acetate, propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, propylene glycol Esters of glycol monoethers such as monobutyl ether acetate, dipropylene glycol monomethyl ether acetate, dipropylene glycol monoethyl ether acetate, dipropylene glycol monobutyl ether acetate, 3-methoxybutyl acetate Methyl acetate, ethyl acetate, propyl acetate, isopropyl acetate, butyl acetate, methyl propionate, ethyl propionate, butyl propionate, methyl lactate, ethyl lactate, butyl lactate, methyl 3-methoxypropionate, ethyl 3-methoxypropionate, Alkyl esters such as methyl 3-ethoxypropionate, ethyl 3-ethoxypropionate, methyl acetoacetate, ethyl acetoacetate; ketones such as acetone, methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone; benzene, toluene, xylene, ethylbenzene, etc. Aromatic hydrocarbons; Aliphatic hydrocarbons such as hexane, cyclohexane, and octane; Amides such as dimethylformamide, dimethylacetamide, and N-methylpyrrolidone; Water;

The amount of the solvent used may be appropriately set according to the purpose and application, and is not particularly limited, but is 10 to 90% by mass in the total amount of 100% by mass of the curable resin composition of the present invention. It is preferable to do. More preferably, it is 20-80 mass%.

-Fluorine-based additive-
The curable resin composition may also contain one or more fluorine-based additives (also referred to as fluorine additives) from the viewpoint of further improving the curability. Note that the fluorine-based additive also has a function as a leveling agent.

The fluorine-based additive is a compound having a fluorine atom in the structure. For example, a compound that is usually used as a fluorine-based surfactant or a fluorine-based surface modifier can be used.

The fluorine-based additive is soluble in various organic solvents (for example, ether solvents, ester solvents, ketone solvents, alcohol solvents, etc.) from the viewpoint that it is preferable not to separate components in the curable resin composition. Those having a high value are more preferably used. Specifically, for example, those having an HLB value (hydrophilic / lipophilic balance) in the range of 0 to 16 are suitable. The HLB value is more preferably 1-13.
The HLB value is obtained by, for example, the Griffin method or the Davis method.

The fluorine-containing additive preferably further contains 0.01 to 80% by mass of fluorine in a total amount of 100% by mass of the fluorine-based additive.
The fluorine content can be quantified by, for example, ion chromatography.

The fluorine-based additive also includes nonionic and anionic ones, and nonionic ones are preferable from the viewpoint of dispersibility with the resin and the like.

Specific examples of the fluorine-based additive include perfluorobutane sulfonate (Megafac F-114), perfluoroalkyl group-containing carboxylates (Megafac F-410), perfluoroalkylethylene oxide adducts ( Mega-Fuck F-444, EXP.TF-2066), perfluoroalkyl group-containing phosphate ester (Mega-Fact EXP.TF-2148), perfluoroalkyl group-containing phosphate ester-type neutralized amine (MegaFack EXP.TF) -2149), fluorine-containing group / hydrophilic group-containing oligomer (Megafac F-430, EXP • TF-1540), fluorine-containing group / lipophilic group-containing oligomer (Megafac F-552, F-554, F-558) F-561, R-41), fluorine-containing group / hydrophilic group / lipophilic group-containing o Gomer (Megafuck F-477, F-553, F-555, F-556, F-557, F-559, F-562, R-40, EXP / TF-1760), fluorine-containing group / hydrophilic group -Oligophilic group / UV-reactive group-containing oligomer (Megafac RS-72-K, RS-75, RS-76-E, RS-76-NS, RS-77), etc. ). Among them, compounds containing lipophilic groups (containing fluorine-containing groups / lipophilic group-containing oligomers, fluorine-containing groups / hydrophilic groups / lipophilic group-containing oligomers, fluorine-containing groups / hydrophilic groups / lipophilic groups / UV-reactive groups) Oligomer) is preferred.

The content of the fluorine-based additive may be appropriately set according to the purpose, application, etc., and is not particularly limited, but is 0.1 to 10 parts by mass with respect to 100 parts by mass of the total solid content of the curable resin composition. It is preferable that More preferably, it is 0.2 mass part or more, More preferably, it is 5 mass parts or less, More preferably, it is 4 mass parts or less, Most preferably, it is 3 mass parts or less.

The curable resin composition further includes, for example, a polymerizable monomer other than the above-described polyfunctional compound; a coloring material (also referred to as a colorant); a dispersant depending on the required characteristics of each application to which the curable resin composition is applied. Heat resistance improver; leveling agent; development aid; inorganic fine particles such as silica fine particles; coupling agents such as silane, aluminum and titanium; thermosetting resins such as filler, epoxy resin, phenol resin and polyvinylphenol Curing agents such as polyfunctional thiol compounds, plasticizers, polymerization inhibitors, ultraviolet absorbers, antioxidants, matting agents, antifoaming agents, antistatic agents, slip agents, surface modifiers, thixotropic agents; One or more of a thixotropic agent, a quinonediazide compound, a polyhydric phenol compound, a cationic polymerizable compound, an acid generator, and the like may be further included. For example, when using the said curable resin composition for a color filter use, it is preferable that a coloring material is included. Thus, the form in which the curable resin composition further contains a color material is also one of the preferred forms of the present invention. A form containing at least one selected from the group consisting of a colorant, a dispersant, a heat resistance improver, a leveling agent and a development aid is also suitable.
Hereinafter, these contained components will be described.

-Polymerizable monomers other than polyfunctional compounds-
The polymerizable monomer (also referred to as a polymerizable compound) is a compound other than the above-described polyfunctional compound, and has activities such as free radicals, electromagnetic waves (for example, infrared rays, ultraviolet rays, X-rays), and electron beams. It is a low molecular compound having a polymerizable unsaturated bond (also referred to as a polymerizable unsaturated group) that can be polymerized by irradiation with energy rays or the like. For example, the monofunctional compound which has one polymerizable unsaturated group in a molecule | numerator is mentioned.

Examples of the monofunctional polymerizable monomer include, for example, N-substituted maleimide and (meta) among the compounds exemplified as other monomers preferably contained in the monomer component of the (meth) acrylate polymer. ) Acrylic esters; (Meth) acrylamides; Unsaturated monocarboxylic acids; Unsaturated polycarboxylic acids; Unsaturated monocarboxylic acids in which the chain between the unsaturated group and the carboxyl group is extended; Unsaturated acid anhydride Aromatic vinyls, conjugated dienes, vinyl esters, vinyl ethers, N-vinyl compounds, unsaturated isocyanates, and the like.

-Color material-
As the color material, for example, a pigment or a dye is preferably used. These may be used alone or in combination of two or more. Moreover, you may combine a pigment and dye. For example, when forming red, blue, and green pixels of a color filter, a technique that exhibits color characteristics obtained by combining color materials, such as blue and purple, green and yellow, is preferably used. Further, when forming a black matrix, it can be formed using a black color material.
Among the above pigments and dyes, for example, pigments (for example, organic pigments or inorganic pigments) are excellent in terms of durability, and for example, dyes are excellent in terms of improving luminance of panels and the like. These may be selected or used in combination. Of the pigments, organic pigments are more preferable.

Examples of the pigment include azo pigments, phthalocyanine pigments, polycyclic pigments (for example, quinacridone, perylene, perinone, isoindolinone, isoindoline, dioxazine, thioindigo, anthraquinone, quinophthalone). , Metal complex, diketopyrrolopyrrole, etc.), organic pigments such as dye lake pigments; white and extender pigments (eg, titanium oxide, zinc oxide, zinc sulfide, clay, talc, barium sulfate, calcium carbonate, etc.) Chromatic pigment (for example, chrome lead, cadmium, chromium vermilion, nickel titanium, chromium titanium, yellow iron oxide, bengara, zinc chromate, red lead, ultramarine, bitumen, cobalt blue, chromium green, chromium oxide, bismuth vanadate, etc.) , Black pigments (eg carbon black, bone black, graphs) Ito, iron black, titanium black, etc.), the luminous material pigments (e.g. pearl pigments, aluminum pigments, bronze pigments, etc.), fluorescent pigments (such as zinc sulfide, strontium sulfide, and inorganic pigments strontium aluminate, etc.) and the like. Examples of pigment colors that can be used include yellow, red, purple, blue, green, brown, black, and white.

The pigment may also be subjected to surface treatment such as rosin treatment, surfactant treatment, resin dispersant treatment, pigment derivative treatment, oxide film treatment, silica coating, wax coating, etc. depending on the purpose and application.

As the pigment, for example, a pigment indicated by a color index (CI; issued by The Society of Dyers and Colourists) number in JP2013-148602A and JP2013-61599A is used. be able to. Color materials that may be used in the present invention are not limited to these. The pigments exemplified in these publications may be used alone or in combination of two or more.

As the dye, for example, organic dyes described in JP 2010-9033 A, JP 2010-211198 A, JP 2009-51896 A, and JP 2008-50599 A may be used. it can. Of these, azo dyes, anthraquinone dyes, phthalocyanine dyes, quinoneimine dyes, quinoline dyes, nitro dyes, carbonyl dyes, methine dyes, and the like are preferable.

The content ratio of the color material (that is, the total ratio of the pigment and the dye) can be appropriately set according to the purpose and application, but the preferable range of the content ratio of the color material is a solid content of the curable resin composition. It is 3-70 mass% with respect to the total amount of 100 mass%. More preferably, it is 5-60 mass%, More preferably, it is 10-50 mass%.

-Dispersant-
The above-mentioned dispersant has an interaction site with a color material and an interaction site with a dispersion medium (for example, a solvent or a binder resin), and has a function of stabilizing the dispersion of the color material into the dispersion medium. In general, it is classified into a resin-type dispersant (for example, a polymer dispersant), a surfactant (for example, a low-molecular dispersant), and a pigment derivative. The curable resin composition of the present invention preferably contains a dispersant together with the color material. In addition, as a dispersant (that is, a resin-type dispersant, a surfactant and / or a pigment derivative), a commonly used dispersant can be used. Moreover, one type of dispersant may be used alone, or two or more types may be used in combination.

Examples of the resin-type dispersant include polycarboxylic acid esters such as polyurethane and polyacrylate, unsaturated polyamides, polycarboxylic acids, polycarboxylic acid amine salts, polycarboxylic acid ammonium salts, polycarboxylic acid alkylamine salts, and polysiloxanes. , Long-chain polyaminoamide phosphate, hydrogen group-containing polycarboxylic acid ester, amide formed by reaction of poly (lower alkyleneimine) with polyester having a free carboxyl group, or a salt thereof, (meth) acrylic acid-styrene Copolymer, (meth) acrylic acid- (meth) acrylic acid ester copolymer, styrene-maleic acid copolymer, polyvinyl alcohol, polyvinylpyrrolidone, polyester, modified polyacrylate, ethylene oxide / polypropylene oxide adduct, etc. All It is.
The resin-type dispersant has a graft structure in which the main chain is an anchor chain having an interaction site with a coloring material, and the graft chain is a compatible chain having an interaction property with a dispersion medium. In addition, a resin in which an anchor chain and a compatible chain have a block structure is particularly preferably used.

As a brand name of the said resin type dispersing agent, the brand name of the resin type dispersing agent illustrated in Unexamined-Japanese-Patent No. 2013-61599 can be mentioned, for example. However, it is not limited to these.

Examples of the surfactant include polyoxyethylene alkyl ether sulfate, sodium dodecylbenzenesulfonate, sodium alkylnaphthalenesulfonate, sodium alkyldiphenyletherdisulfonate, lauryl sulfate monoethanolamine, lauryl sulfate triethanolamine, ammonium lauryl sulfate, Anionic surfactants such as sodium stearate and sodium lauryl sulfate; nonions such as polyoxyethylene oleyl ether, polyoxyethylene lauryl ether, polyoxyethylene nonylphenyl ether, polyoxyethylene sorbitan monostearate and polyethylene glycol monolaurate Surfactants; cationic boundaries such as alkyl quaternary ammonium salts and their ethylene oxide adducts Alkyl betaines such as alkyl dimethylamino acetic acid betaine, and amphoteric surfactants such as alkyl imidazolines; active agents.

The dye derivative is a compound having a structure in which a functional group is introduced into the dye. Examples of the functional group include a sulfonic acid group, a sulfonamide group and a quaternary salt thereof, a dialkylamino group, a hydroxyl group, a carboxyl group, and an amide group. And phthalimide groups. Examples of the structure of the base dye include azo, anthraquinone, quinophthalone, phthalocyanine, quinacridone, benzimidazolone, isoindoline, dioxazine, indanthrene, perylene, diketopyrrolopyrrole. And the like.

The content of the dispersant (that is, the resin-type dispersant, the surfactant and / or the pigment derivative) may be appropriately set according to the purpose and application, but the dispersion stability and durability (heat resistance, light resistance) From the viewpoint of balance between weather resistance and the like) and transparency, for example, it is preferably 0.01 to 60% by mass with respect to 100% by mass of the total solid content of the curable resin composition. More preferably, it is 0.1-50 mass%, More preferably, it is 0.3-40 mass%.

-Heat resistance improver-
The heat resistance improver is preferably used for improving heat resistance and strength. As the heat resistance improver, for example, an N- (alkoxymethyl) melamine compound, a compound having two or more epoxy groups or oxetanyl groups, and the like are suitable. In particular, when the curable resin composition is used as a resist for a photospacer, a transparent resist for a protective film, or a resist for an interlayer insulating film, these uses are preferable.

-Leveling agent-
The leveling agent is preferably used for improving leveling properties. As the leveling agent, fluorine-based and silicon-based surfactants are preferable, and among them, the above-described fluorine-based additives are preferable.

-Development aid-
The development aid is preferably used for improving developability. Examples of the development aid include monocarboxylic acids such as (meth) acrylic acid, acetic acid and propionic acid; polyvalent carboxylic acids such as maleic acid, fumaric acid, succinic acid, tetrahydrophthalic acid and trimellitic acid; maleic anhydride And carboxylic acid anhydrides such as succinic anhydride, tetrahydrophthalic anhydride, trimellitic anhydride;

<Method for producing curable resin composition>
It does not specifically limit as a manufacturing method of the said curable resin composition, For example, it can prepare by mixing and disperse | distributing the containing component mentioned above using various mixers and dispersers.
Here, when using inorganic fine particles as the inorganic compound, first, the inorganic fine particles are dispersed in an organic solvent (dispersion medium) to obtain an organic solvent dispersion of the inorganic fine particles. It is preferable to obtain a curable resin composition by mixing with an alkali-soluble resin, a polyfunctional compound, a reactive compound, and other components contained as necessary. Thereby, the effect of this invention is exhibited further.

The said dispersion | distribution process and mixing process are not specifically limited, What is necessary is just to perform by a normal method. Further, it may further include other steps that are normally performed. When the said curable resin composition contains a color material, it is suitable to manufacture through the dispersion | distribution process process of a color material.

Examples of the color material dispersion treatment step include, first, weighing each of a predetermined amount of a color material (preferably an organic pigment), a dispersant, and a solvent, and then paint conditioner, bead mill, roll mill, ball mill, jet mill, homogenizer, kneader, blender. And the like, and using a dispersing machine such as a method, a color material is dispersed in fine particles to form a liquid color material dispersion (also referred to as a mill base). Preferably, after kneading and dispersing with a roll mill, kneader, blender or the like, fine dispersion is performed with a media mill such as a bead mill filled with 0.01 to 1 mm beads. The obtained mill base contains an inorganic compound (or an organic solvent dispersion thereof), an alkali-soluble resin, a polyfunctional compound, a reactive compound, and a solvent, a leveling agent, etc. as necessary, which are separately stirred and mixed. A curable resin composition can be obtained by adding a composition (preferably a transparent liquid) and mixing to obtain a uniform dispersion solution.
In addition, it is preferable that the obtained curable resin composition is filtered with a filter or the like to remove fine dust.

[Curing film]
Next, the cured film formed using the curable resin composition of the present invention will be described.
The curable resin composition of the present invention can form a cured film by irradiation (exposure) with an active energy ray. Specifically, for example, the curable resin composition is applied onto a substrate (also referred to as a base material) and dried, and the applied surface is irradiated (exposed) with an active energy ray to form a cured film. It is preferable. Thus, the cured film formed of the said curable resin composition is also one of this invention. Moreover, since the said curable resin composition is used suitably as a resist material, the form whose cured film formed with the said curable resin composition is a resist cured film is also one of the suitable forms of this invention. One.

The substrate on which the curable resin composition is applied is not particularly limited. For example, a transparent glass substrate such as white plate glass, blue plate glass, silica-coated blue plate glass; polyethylene terephthalate (PET), polyester, polycarbonate, polyolefin, polysulfone Sheets or films made of thermoplastic resins such as ring-opened polymers of cyclic olefins and hydrogenated products thereof; Sheets or films made of thermosetting resins such as epoxy resins and unsaturated polyester resins; Aluminum plates, copper plates, nickel plates And a metal substrate such as a stainless steel plate; a ceramic substrate; a semiconductor substrate having a photoelectric conversion element; a member made of various materials such as a glass substrate (color filter for LCD) having a color material layer on the surface; Especially, the sheet | seat or film which consists of heat resistant resin among a glass substrate and a plastic substrate from a heat resistant point is preferable. The substrate is preferably a transparent substrate.

Further, the substrate may be subjected to corona discharge treatment, ozone treatment, chemical treatment with a silane coupling agent, etc., if necessary, and an inorganic material such as a gas barrier layer or a protective film on both sides or one side of the substrate. You may form the coating film of a component or an organic component. Moreover, when using a cured film for the member for display apparatuses, it is suitable to form electrodes, such as ITO, on the said board | substrate. In addition, the cured film of this invention is excellent also in adhesiveness with not only a board | substrate but electrodes, such as an ITO film | membrane.

The method for applying the curable resin composition to the substrate is not particularly limited, and examples thereof include spin coating, slit coating, roll coating, and cast coating, and any method can be preferably used.

The coating film after being applied to the substrate can be dried using, for example, a hot plate, an IR oven, a convection oven, or the like. The drying conditions are appropriately selected according to the boiling point of the solvent component contained, the type of the curing component, the film thickness, the performance of the dryer, etc., but are usually performed at a temperature of 50 to 150 ° C. for 10 seconds to 300 seconds. Is preferred.

Examples of the light source of the active energy beam include a xenon lamp, a halogen lamp, a tungsten lamp, a high pressure mercury lamp, an ultrahigh pressure mercury lamp, a metal halide lamp, a medium pressure mercury lamp, a low pressure mercury lamp, a lamp light source such as a carbon arc, a fluorescent lamp, and an argon ion laser. Laser light sources such as YAG laser, excimer laser, nitrogen laser, helium cadmium laser, and semiconductor laser are used. Further, examples of the exposure system include a proximity system, a mirror projection system, and a stepper system, but the proximity system is preferably used.
In the irradiation process of the active energy beam, the active energy beam may be irradiated through a predetermined mask pattern depending on the application. In this case, the exposed portion is cured, and the cured portion is insolubilized or hardly soluble in the developer.

Further, if necessary, after the step of irradiating with the active energy beam, a step of developing with a developer to remove an unexposed portion and forming a pattern (also referred to as a developing step) may be performed. Thereby, a patterned cured film can be obtained.
The development process in the development step can be usually performed at a development temperature of 10 to 50 ° C. by a method such as immersion development, spray development, brush development, or ultrasonic development. In addition, when using alkaline aqueous solution as a developing solution, it is preferable to wash | clean with water after image development.

The developer is not particularly limited as long as it dissolves the curable resin composition of the present invention. Usually, an organic solvent or an alkaline aqueous solution is used, and a mixture thereof may be used.
Examples of the organic solvent suitable as the developer include an ether solvent and an alcohol solvent. Specifically, for example, dialkyl ethers, ethylene glycol monoalkyl ethers, ethylene glycol dialkyl ethers, diethylene glycol dialkyl ethers, triethylene glycol dialkyl ethers, alkyl phenyl ethers, aralkyl phenyl ethers, diaromatic ethers , Isopropanol, benzyl alcohol and the like.

In addition to the alkaline agent, the alkaline aqueous solution may contain a surfactant, an organic solvent, a buffering agent, a dye, a pigment, and the like as necessary. Examples of the organic solvent in this case include organic solvents suitable as the developer described above.
Examples of the alkali agent include inorganic substances such as sodium silicate, potassium silicate, sodium hydroxide, potassium hydroxide, lithium hydroxide, tribasic sodium phosphate, dibasic sodium phosphate, sodium carbonate, potassium carbonate, and sodium bicarbonate. Alkali agents: Examples include amines such as trimethylamine, diethylamine, isopropylamine, n-butylamine, monoethanolamine, diethanolamine, triethanolamine, tetramethylammonium hydroxide, tetraethylammonium hydroxide, and these may be used alone or in combination of two or more. May be combined.

Examples of the surfactant include nonionic surfactants such as polyoxyethylene alkyl ethers, polyoxyethylene alkyl esters, sorbitan acid alkyl esters, monoglyceride alkyl esters; alkylbenzene sulfonates, alkylnaphthalene sulfonic acids, and the like. Anionic surfactants such as salts, alkyl sulfates, alkyl sulfonates, sulfosuccinic acid ester salts; amphoteric surfactants such as alkylbetaines and amino acids, and the like. These may be used alone or in combination of two or more. Also good.

Further, if necessary, a post-curing step (also referred to as post-baking or post-treatment step) may be performed. The post-curing step includes, for example, a post-heating step (also referred to as a heat treatment step) in addition to a step of exposing with a light amount of, for example, 0.5 to 5 J / cm ² using a light source such as a high-pressure mercury lamp. . By performing such post-treatment, it becomes possible to further strengthen the hardness and adhesion of the patterned cured film.

Among the post-treatment steps described above, the latter heat treatment step is preferred, and the temperature at that time is preferably 60 ° C. or higher. By performing the heat treatment step in this temperature range, the reactive compound is decomposed, and the effects of the present invention can be more fully exhibited. A form in which the cured film is heat-treated at a temperature of 60 ° C. or higher is also a preferred form of the present invention. The heat treatment temperature is more preferably 80 ° C. or higher, and preferably 300 ° C. or lower. Moreover, although heat processing time is not specifically limited, For example, it is preferable that it is 10 seconds-300 minutes.

[Uses of curable resin composition]
As described above, the curable resin composition of the present invention provides a cured product (cured film) that is particularly excellent in electrical properties and surface hardness, and also excellent in developability and adhesion to a substrate. Accordingly, the cured product (cured film) formed from such a curable resin composition is, for example, a component of various display devices such as a liquid crystal display device, a solid-state imaging device, and a touch panel display device, as well as ink and printing. It is preferably used for various applications such as various optical members such as plates, printed wiring boards, semiconductor elements, and photoresists, electric machines and electronic devices. Especially, it is suitable to use for the color filter used for a liquid crystal display device, a solid-state image sensor, etc., and a touch-panel type display device, Especially the protective film (color color) in these various display devices using the said curable resin composition. It is preferable to form a protective film for a filter, a protective film for a touch panel display device, or the like, or an insulating film (such as an insulating film for a touch panel display device). As a result, the reliability of display quality and imaging quality of various display devices can be sufficiently increased to the extent that it can sufficiently meet the recent demand for higher performance. Thus, the form in which the curable resin composition is a curable resin composition for forming a protective film or an insulating film, the form in which the cured film is a protective film or an insulating film, and the cured film is a cured film for a touch panel These forms are also included in the preferred forms of the present invention. Moreover, the cured film formed with the said curable resin composition, the member for display apparatuses which has this cured film, and the display apparatus which has this cured film are contained in this invention.

The display device member and the display device of the present invention may have one or more other constituent members as long as the cured film is included. The cured film has excellent electrical characteristics and surface hardness, is stably excellent in adhesion to a substrate and the like, and has high smoothness and high transmittance. Therefore, it is particularly suitable as a transparent member, and is very useful as a protective film or insulating film in various display devices. Although it does not specifically limit as a display apparatus, For example, a liquid crystal display device, a solid-state image sensor, a touchscreen display apparatus etc. are suitable. As the touch panel display device, a capacitance type device is particularly preferable.
The display device member may be a film-like single layer or multilayer member composed of the cured film, or a member in which another layer is combined with the single layer or multilayer member. It may also be a member (for example, a color filter) that includes the cured film in its configuration.

Since the curable resin composition of the present invention has the above-described configuration, it can provide both a superior surface hardness and electrical characteristics, and can provide a cured product having excellent adhesion, developability, transparency, and the like. It can be done. Therefore, a display device member and a display device having a cured film formed of such a curable resin composition are very useful in the optical field, the electric machine / electronic field, and the like.

The present invention will be described in more detail with reference to the following examples. However, the present invention is not limited to these examples. Unless otherwise specified, “part” means “part by weight” and “%” means “mass%”.
In the following synthesis examples and preparation examples, various physical properties and the like were measured as follows.

[Physical properties of resin solution (alkali-soluble resin)]
<Weight average molecular weight>
Weight average molecular weight was measured by a GPC (gel permeation chromatography) method using HLC-8220GPC (manufactured by Tosoh Corp.) and column TSKgel SuperHZM-M (manufactured by Tosoh Corp.) using polystyrene as a standard substance and tetrahydrofuran as an eluent.

<Acid value>
1.5 g of the resin solution is precisely weighed and dissolved in a mixed solvent of 90 g of acetone / 10 g of water, and 0.1 T KOH aqueous solution is used as a titrant, and an automatic titrator (trade name “COM-555, manufactured by Hiranuma Sangyo Co., Ltd.) is used. )), The acid value of the resin solution was measured, and the acid value per gram of the solid content was determined from the acid value of the solution and the solid content of the solution.

<Concentration of solid content>
About 0.3 g of the polymer solution was weighed into an aluminum cup, dissolved by adding about 1 g of acetone, and then naturally dried at room temperature. Then, using a hot air dryer (trade name “PHH-101”, manufactured by Espec Corp.), after drying at 140 ° C. for 3 hours, it was allowed to cool in a desiccator and the mass was measured. From the mass reduction amount, the solid content concentration (NV, mass%) of the polymer solution was calculated.

[Film properties]
An ITO substrate was prepared by depositing ITO (Indium Tin Oxide) with a thickness of 140 nm on glass. The resin composition obtained on this ITO substrate was applied by a spin coating method, heat-treated (90 ° C., 3 minutes), and then a UV aligner (trade name, manufactured by TOPCON Co., Ltd.) equipped with a 2.0 kW ultra-high pressure mercury lamp. "TME-150RNS") was exposed at an exposure amount of 60 mJ / cm ² (in terms of 365 nm illuminance), and heat treatment (230 ° C for 30 minutes) was performed. Using the obtained coating film, dielectric constant and pencil hardness were measured.

<Dielectric constant>
A resin composition is applied to a 5 cm square ITO-deposited glass substrate by spin coating so that the thickness after drying is 1.5 μm, heat-treated (90 ° C. for 3 minutes), and then a 2.0 kW ultrahigh pressure mercury lamp. Were exposed at an exposure amount of 60 mJ / cm 2 (in terms of 365 nm illuminance) using a UV aligner (trade name “TME-150RNS”, manufactured by TOPCON), and heat treatment (230 ° C. for 30 minutes) was performed. Furthermore, gold (Au) was vapor-deposited on the surface so as to form a square pattern having a thickness of 40 nm and a side of 0.5 cm to form an electrode to obtain a sample for evaluation (a cured film having a thickness of 1.5 μm). The dielectric constant of the capacitance of this sample was determined by calculation from the film thickness value using an impedance analyzer 4294A (manufactured by Agilent Technologies).
Moreover, this measured value was evaluated by a 5-point perfect score, and used for the comprehensive evaluation described later.
3.6 or less: 5 points 3.7 to 3.8: 4 points 3.9 to 4.0: 3 points 4.1 to 4.2: 2 points 4.3 to 4.4: 1 point 4.5 Above: 0 points

<Surface hardness (pencil hardness)>
This was performed according to JIS-K5600-5-4 (1999). The load was 500 g of the old JIS version of JIS-K5400 (1990), and the hardest pencil that did not cause scars was taken as the value of pencil hardness. Moreover, this measured value was evaluated by a 5-point perfect score, and used for the comprehensive evaluation described later. The hardness decreases in the order of 3H>2H>H>F>HB>B>2B>3B> 4B.
H or more (H, 2H or 3H): 5 points F: 4 points HB: 3 points B: 2 points 2B: 1 point 3B or less (3B or 4B): 0 points

<Comprehensive evaluation>
The total score of the above-mentioned dielectric constant evaluation score (5-point scale) and pencil hardness evaluation score (5-point maximum) was evaluated with a 10-point scale.

(Synthesis of resin solution)
First, a resin solution A (No. A-1) was synthesized as an alkali-soluble resin contained in the resin composition.

Synthesis Example 1 (Synthesis of A-1)
A separable flask with a cooling tube as a reaction vessel was charged with 64 parts of propylene glycol monomethyl ether acetate (PGMEA) and 16 parts of propylene glycol monomethyl ether (PGME), and the temperature was raised to 90 ° C. in a nitrogen atmosphere. 1 benzyl maleimide (BzMI) 8.6 parts, methacrylic acid (MAA) 17.2 parts, cyclohexyl acrylate (CHA) 60 parts, PGMEA 6.9 parts, PGME 1.4 parts, perbutyl O (trade name, manufactured by NOF Corporation) ) 1.7 parts, 1.7 parts of n-dodecyl mercaptan (n-DM), 53.5 parts of PGMEA, and 10.7 parts of PGME were continuously fed over 3 hours as the dropping system 2. Then, after maintaining at 90 ° C. for 30 minutes, the temperature was raised to 115 ° C. and polymerization was continued for 1.5 hours. Next, 14.2 parts of glycidyl methacrylate (GMA), 0.30 part of triethylamine (TEA) as a catalyst, and 0.15 part of Antage W-400 (trade name, manufactured by Kawaguchi Chemical Co., Ltd.) as a polymerization inhibitor were added to this reaction solution. The resin solution A-1 was obtained by continuing reaction at 110 degreeC for 2 hours and 115 degreeC for 6 hours, bubbling nitrogen and oxygen mixed gas (oxygen concentration 7%). Various physical properties (weight average molecular weight, solid content concentration, and acid value per solid content) of the obtained resin solution A-1 were measured. The results are shown in Table 1.

Synthesis Examples 2 to 8 (Synthesis of A-2 to A-8)
Resin solutions A-2 to A-8 were obtained in the same manner as in Synthesis Example 1 except that the types and blending amounts of the monomer components were changed as shown in Table 1. About each obtained resin solution, various physical properties were measured similarly to the synthesis example 1. The results are shown in Table 1.

Abbreviations in Table 1 are as follows.
BzMI: Benzylmaleimide MD: Dimethyl-2,2 ′-[oxybis (methylene)] bis-2-propenoate AMA: α- (allyloxymethyl) methyl acrylate (AMA)
CHA: cyclohexyl acrylate (cyclohexyl acrylate)
BzMA: benzyl methacrylate MMA: methyl methacrylate MAA: methacrylic acid GMA: glycidyl methacrylate (glycidyl methacrylate)
Mw: weight average molecular weight of the finally obtained polymer

[Preparation of resin composition and evaluation test of coating film]
Example 1
In terms of solid content, 22.5 parts of resin solution A-1, 22.5 parts of dipentaerythritol hexaacrylate (DPHA), 22.5 parts of NBAC-ST (trade name, manufactured by Nissan Chemical Industries), Duranate TPA- 22.5 parts of B80E (trade name, manufactured by Asahi Kasei Chemicals), 10 parts of KBM503 (trade name, manufactured by Shin-Etsu Silicone) as a silane coupling agent, 1 part of Irgacure 907 (manufactured by BASF) as a photopolymerization initiator 0.5 parts of F-554 (manufactured by DIC) as an agent, 0.2 parts of Antage W-400 (manufactured by Kawaguchi Chemical Co., Ltd.) as a polymerization inhibitor, and further dilute solvent (propylene glycol monomethyl ether acetate; PGMEA) as a solid content It added so that it might become a density | concentration 25%, and the resin composition g-1 was obtained by stirring. About the obtained resin composition g-1, according to the evaluation method mentioned above, the physical property of the coating film (coating film) was evaluated. The results are shown in Table 2.

Examples 2-14 and Comparative Examples 1-6
Each resin composition was obtained in the same manner as in Example 1 using the raw materials shown in Tables 2 and 3 at the blending ratios shown in Tables 2 and 3. About each of the obtained resin composition, the physical property of the coating film (coating film) was evaluated according to the evaluation method mentioned above. The results are shown in Tables 2 and 3.

Abbreviations in Tables 2 and 3 are as follows. The blending amount of each raw material in Tables 2 and 3 is the solid content, and in Tables 2 and 3, the use of a diluting solvent (PGMEA) is omitted.
DPHA: Dipentaerythritol hexaacrylate (trade name, manufactured by Kyoeisha Chemical Co., Ltd.)
PETA: pentaerythritol triacrylate biscoat 802: tripentaerythritol acrylate FA513-AS: dicyclopentanyl acrylate (trade name, manufactured by Hitachi Chemical Co., Ltd.)
NBAC-ST: butyl acetate dispersed silica sol (trade name, manufactured by Nissan Chemical Industries, Ltd.)
PMSQE: Polysilsesquioxane (trade name “SR-13”, manufactured by Konishi Chemical Co., Ltd.)
TPA-B80E: Blocked isocyanate compound (trade name “Duranate TPA-B80E”, manufactured by Asahi Kasei Chemicals Corporation)
BL-3175: Block isocyanate compound (trade name “Desmodur BL3175”, manufactured by Sumika Bayer Urethane Co., Ltd.)
TEPIC: Polyfunctional epoxy compound (trade name, manufactured by Nissan Chemical Co., Ltd.)
IRGACURE907: 2-methyl-1- [4- (methylthio) phenyl] -2-morpholinopropan-1-one (trade name, manufactured by BASF)
KBM503: 2-methacryloxypropyltrimethoxysilane (trade name, manufactured by Shin-Etsu Silicone)
Antage W-400: Phenolic antioxidant (trade name, manufactured by Kawaguchi Chemical Industry Co., Ltd.)
F-554: Fluorine-containing / lipophilic group-containing oligomer (nonionic, trade name “Megafac F-554”, manufactured by DIC Corporation)

From the examples and comparative examples, the following points were confirmed.
(1) Comparison of Example 1 and Comparative Example 1 and Example 13 and Comparative Example 4 The resin composition g-1 of Example 1 is an inorganic component that is a component of the resin composition h-1 of Comparative Example 1. It consists of a structure in which a part of the compound is replaced with a reactive compound. Similarly, the resin composition g-13 of Example 13 has a configuration in which a part of the inorganic compound that is a component of the resin composition h-4 of Comparative Example 4 is replaced with a reactive compound. When the physical property results of Example 1 and Comparative Example 1 are compared, the dielectric constant of the coating film obtained from the resin composition g-1 is significantly lower than that of the coating film obtained from the resin composition h-1. In addition, the surface hardness (pencil hardness) was remarkably increased, and similar results were confirmed in Example 13 and Comparative Example 4. Therefore, it became clear that the low dielectric constant and the hardness improvement can be achieved by blending the reactive compound.

(2) Comparison between Examples 1, 10 and 11 and Comparative Example 6, Example 14 and Comparative Example 5 Comparison with resin compositions g-1, g-10 and g-11 of Examples 1, 10 and 11 Only the alkali-soluble resin is different from the resin composition h-6 of Example 6. Specifically, in Examples 1, 10 and 11, a polymer having a ring structure in the main chain was used as the alkali-soluble resin, whereas the alkali-soluble resin used in Comparative Example 6 was cyclic in the main chain. It is a polymer having no structure. Similarly, the resin composition g-14 of Example 14 and the resin composition h-5 of Comparative Example 5 were used in Example 14, although a polymer having a ring structure in the main chain was used as the alkali-soluble resin. On the other hand, the alkali-soluble resin used in Comparative Example 5 is different in that it is a polymer having no ring structure in the main chain. When the physical property results of Examples 1, 10 and 11 and Comparative Example 6 are compared, the coatings obtained from the resin compositions g-1, g-10 and g-11 are coated from the resin composition h-6. Compared with the film, the surface hardness of the coated film (cured product) was remarkably improved, and the same results were confirmed in Example 14 and Comparative Example 5. Therefore, it has been clarified that the surface hardness of the coating film (cured product) can be remarkably improved by using at least a polymer having a ring structure in the main chain as the alkali-soluble resin.

(3) Comparison between Examples 2-12 and Comparative Example 1 The resin compositions g-2 to g-3 of Examples 2 to 3 are polyfunctional compounds (DPHA) which are components contained in the resin composition g-1. ) Is changed to another polyfunctional compound, and the resin composition g-4 of Example 4 is obtained by replacing the reactive compound (block isocyanate compound) that is a component of the resin composition g-1 with another block. It is the example changed to the isocyanate compound, Resin composition g-5 of Example 5 is an example which changed the content component ratio of the resin composition g-1, and the resin composition g-6 of Examples 6-12 -G-12 is the example which changed the alkali-soluble resin (resin solution A-1) which is a content component of the resin composition g-1 into the other alkali-soluble resin, and resin composition g-12 of Example 12 Is a reactive compound that is a component of the resin composition g-1 (Block I An example of changing the cyanate compound) the other reactive compounds (epoxy compounds). Regarding the coating films obtained from these examples, as in Example 1, the dielectric constant decreased and the surface hardness (pencil hardness) increased as compared with the coating film obtained from the resin composition h-1. .

(4) Comparison between Example 1 and Comparative Example 2 The resin composition h-2 of Comparative Example 2 was obtained by replacing the polyfunctional compound, which is a component of the resin composition g-1, with a monofunctional polymerizable monomer. In this case, the surface hardness of the coating film obtained from the resin composition g-1 is significantly higher than that of the coating film obtained from the resin composition h-1.

From the above (1) to (4), the effect of the present invention is exhibited by making the resin composition the configuration of the present invention (the configuration including a predetermined alkali-soluble resin, polyfunctional compound and reactive compound). It was confirmed that
Supplementally, the resin composition g-1 of Example 1 differs from the resin composition g-14 of Example 14 in that it includes an inorganic compound. The resin composition h-6 of Comparative Example 6 and the resin composition h-5 of Comparative Example 5 are also different in the same points. By comparing Example 1 and Example 14 and Comparative Example 6 and Comparative Example 5, respectively, it was found that the surface hardness can be further improved when the resin composition further contains an inorganic compound. Furthermore, when Example 1 and Example 13 in which the kind of inorganic compound is different were compared, it was found that the effect of improving the surface hardness was high by using inorganic fine particles among the inorganic compounds.

Claims (8)

A curable resin composition comprising an alkali-soluble resin and a polyfunctional compound having two or more functions,
The curable resin composition further includes a compound having at least one reactive functional group selected from the group consisting of an epoxy group, an oxetanyl group and a blocked isocyanate group,
The curable resin composition, wherein the alkali-soluble resin is a polymer having a ring structure in the main chain. The curable resin composition according to claim 1, further comprising a photopolymerization initiator. The curable resin composition according to claim 1, further comprising an inorganic compound. The curable resin composition according to claim 1, wherein the alkali-soluble resin is a polymer having a double bond in a side chain. Furthermore, a coupling agent is included, The curable resin composition in any one of Claims 1-4 characterized by the above-mentioned. A cured film formed from the curable resin composition according to claim 1. A member for a display device, comprising the cured film according to claim 6. A display device comprising the cured film according to claim 6.