JP2015058780A - On-vehicle device - Google Patents

On-vehicle device Download PDF

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JP2015058780A
JP2015058780A JP2013193000A JP2013193000A JP2015058780A JP 2015058780 A JP2015058780 A JP 2015058780A JP 2013193000 A JP2013193000 A JP 2013193000A JP 2013193000 A JP2013193000 A JP 2013193000A JP 2015058780 A JP2015058780 A JP 2015058780A
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case
circuit board
contact portion
vehicle device
vehicle
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JP6107560B2 (en
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和則 前田
Kazunori Maeda
和則 前田
弘太郎 紅林
Kotaro Kurebayashi
弘太郎 紅林
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Denso Corp
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Denso Corp
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Abstract

PROBLEM TO BE SOLVED: To inhibit creaky sounds from being produced between a circuit board and a contact part at a device in which the circuit board is sandwiched by the contact part of a case.SOLUTION: A case 2, in which a circuit board 3 is stored, is formed by connecting an upper case 5 and a lower case 6 with an engagement structure. A rib 13 which contacts with an upper surface of the circuit board 3 is integrally provided at the upper case 5. Elastic support parts 14, each of which cooperates with the rib 13 to sandwich the circuit board 3 in a vertical direction and support the circuit board 3 in the state, are integrally provided at the lower case 6. A protruding part 16 which contacts with a lower surface of the circuit board 3 is provided on an upper surface of each elastic support part 14. Further, an auxiliary contact part 17 which is located near (at the inner side of) the protruding part 16 and has a protruding shape is integrally provided on the upper surface of each elastic support part 14. The auxiliary contact part 17 is separated from the lower surface of the circuit board 3 at normal time and contacts with the lower surface of the circuit board 3 when the case 2 deflects.

Description

本発明は、例えばETC車載機やDSRC車載機等の、ケース内に回路基板を収容して構成される車載装置に関する。   The present invention relates to a vehicle-mounted device configured by housing a circuit board in a case, such as an ETC vehicle-mounted device or a DSRC vehicle-mounted device.

車両に搭載される車載装置として、例えばETC車載機やDSRC車載機等が知られており、これら車載装置にあっては、一般に、例えば合成樹脂製のケース内に、電子部品が実装された回路基板等を備えて構成されている。この場合、例えば特許文献1には、ケースを構成する上ケースと下ケースとを、係合により連結する構造とすると共に、それら上ケース及び下ケースに一体に形成されたリブ(当接部)によって、回路基板を上下から挟んで保持するようにした構成が開示されている。これによれば、ねじ等の部品数を削減し、組立の簡単化を図ることができる。   As an in-vehicle device mounted on a vehicle, for example, an ETC in-vehicle device, a DSRC in-vehicle device, and the like are known, and in these in-vehicle devices, in general, a circuit in which an electronic component is mounted in a case made of synthetic resin, for example. A substrate is provided. In this case, for example, Patent Document 1 discloses a structure in which an upper case and a lower case constituting a case are connected by engagement, and a rib (contact portion) formed integrally with the upper case and the lower case. Discloses a configuration in which the circuit board is held between the upper and lower sides. According to this, the number of parts such as screws can be reduced, and assembling can be simplified.

特開2012−228903号公報JP 2012-228903 A

ところで、複数種類の車載装置、例えば上記したETC車載機及びDSRC車載機に関して、ケースを共用化することが考えられている。但し、DSRC車載機はETC車載機に比べて、回路の構成要素(部品数等)が多くなるため、例えば、ETC車載機では4層の多層基板が用いられるのに対し、DSRC車載機では6層の多層基板が用いられるといった事情がある。そこで、回路基板の層数ひいては厚み寸法の相違に対し、ケースの共用化を図るため、回路基板を挟持するリブのうち例えば下ケース側のリブを、回路基板の厚みに追従して弾性変形する形状とすることが考えられる。   By the way, it is considered to share a case with respect to a plurality of types of in-vehicle devices such as the above-described ETC in-vehicle device and DSRC in-vehicle device. However, since the DSRC in-vehicle device has more circuit components (number of parts and the like) than the ETC in-vehicle device, for example, the ETC in-vehicle device uses a four-layer multilayer board, whereas the DSRC in-vehicle device uses 6 layers. There is a situation in which a multi-layer substrate is used. Therefore, in order to share the case with respect to the difference in the number of layers of the circuit board and the thickness dimension, for example, the rib on the lower case side among the ribs sandwiching the circuit board is elastically deformed following the thickness of the circuit board. It can be considered to have a shape.

しかしながら、上記したケースを共用する構成の車載装置では、車両への取付時や使用時において、回路基板と、回路基板を挟持しているケースのリブ部分との間の摺動(摩擦)により、きしみ音が発生するという問題があった。このようなきしみ音は、車載装置を両面テープ等で車内に取付ける際にケースを押え付けたり、例えば乗員の膝がケースに当たったりした場合等、主としてケースの中央部に荷重がかかってたわみ変形した際に発生する。   However, in the in-vehicle device configured to share the above-described case, the sliding (friction) between the circuit board and the rib portion of the case holding the circuit board at the time of attachment to the vehicle or use, There was a problem that squeak noise was generated. Such a squeak noise is mainly caused by a load applied to the center of the case when the case is pressed down when mounting the in-vehicle device in the car with double-sided tape, etc. Occurs when

このきしみ音は、スティック・スリップ音と呼ばれ、ケースが通常状態からたわみ変形することに伴い、ケースのリブと回路基板との間が、スティック状態からスリップ状態に遷移し、その時にエネルギが解放され、その解放されるエネルギが大きいときに音が発生する。次に述べるように、回路基板の厚み寸法の最低、最高の範囲が大きくなるほど解放エネルギを小さくすることは難しくなり、厚みの異なる多種類の回路基板を共通して保持するケースの場合、保持力を調整(低下)してもきしみ音の問題が解決できなくなる虞がある。   This squeak noise is called stick-slip noise. As the case is flexed and deformed from the normal state, the transition between the rib of the case and the circuit board changes from the stick state to the slip state, at which time energy is released. Sound is generated when the released energy is large. As described below, as the minimum and maximum range of circuit board thickness increases, it becomes more difficult to reduce the release energy. In the case of holding multiple types of circuit boards with different thicknesses in common, the holding power There is a possibility that the problem of squeak noise cannot be solved even if the adjustment (decrease) is made.

即ち、図5は、回路基板の厚み寸法と、ケースによる回路基板の保持力(挟持力)との関係に対して、きしみ音が発生するケースを図示している。図5(a)は、1種類の回路基板(例えば4層基板)のみを保持する場合、図5(b)は、2種類の回路基板(例えば4層基板及び6層基板)を保持する場合を例示している。ここで、回路基板を保持するために必要な保持力は、基準値F1以上であり、また、解放エネルギが閾値F2を超えると、きしみ音が発生してしまうとする。回路基板の厚み寸法には、若干のばらつきがあるが、そのばらつき内で厚み寸法が大きくなるほど回路基板の保持力も大きくなり、また、基板の保持力が大きいほど、解放エネルギも大きくなる。   That is, FIG. 5 illustrates a case where a squeak noise is generated with respect to the relationship between the thickness dimension of the circuit board and the holding force (clamping force) of the circuit board by the case. FIG. 5A shows a case where only one type of circuit board (for example, a four-layer board) is held, and FIG. 5B shows a case where two types of circuit boards (for example, a four-layer board and a six-layer board) are held. Is illustrated. Here, it is assumed that the holding force necessary for holding the circuit board is equal to or greater than the reference value F1, and if the release energy exceeds the threshold value F2, a squeak noise is generated. There is some variation in the thickness dimension of the circuit board. The larger the thickness dimension within the variation, the greater the holding power of the circuit board, and the greater the holding power of the board, the greater the release energy.

図5(a)に示すように、1種類の回路基板(4層基板)を保持するケースでは、回路基板の厚み寸法のばらつきが、寸法T1からT2までの比較的狭い範囲となる。今、仮に、回路基板の保持力Pが実線で示す値であるとしたとき、解放エネルギRが実線で示すようになり、厚み寸法が大きい側で、解放エネルギが閾値F2を超えてきしみ音が発生する虞がある。そこで、回路基板の保持力を、基準値F1以上の範囲において破線で示すP´まで低下させると、解放エネルギも破線で示すR´になり、閾値F2以下に抑えることができる。つまり、1種類の回路基板を保持するケースの場合には、保持力を調整(低下)するといった比較的簡単な対策で、きしみ音発生を抑制することができる。   As shown in FIG. 5A, in the case of holding one type of circuit board (four-layer board), the variation in the thickness dimension of the circuit board is a relatively narrow range from dimension T1 to T2. Now, assuming that the holding force P of the circuit board is a value indicated by a solid line, the release energy R is indicated by a solid line, and the release energy exceeds the threshold F2 on the side where the thickness dimension is large, and a squeak noise is generated. May occur. Therefore, when the holding force of the circuit board is reduced to P ′ indicated by a broken line in the range of the reference value F1 or more, the released energy becomes R ′ indicated by the broken line, and can be suppressed to the threshold value F2 or less. That is, in the case of holding one type of circuit board, the generation of squeak noise can be suppressed with a relatively simple measure such as adjusting (decreasing) the holding force.

これに対し、図5(b)に示すように、2種類の回路基板(4層基板、6層基板)を保持するケースでは、4層基板の厚み寸法のばらつきが、寸法T1からT2の範囲で、それより厚い6層基板の厚み寸法のばらつきが、寸法T3からT4の範囲となり、全体としてのばらつきが、寸法T1からT4までの比較的広い範囲となる。この場合には、回路基板の保持力Pが実線で示す値であるとしたとき、解放エネルギRが実線で示すようになり、厚み寸法が小さい側を除く大部分で、解放エネルギが閾値F2を超えてきしみ音が発生する虞がある。ところが、回路基板の保持力を、基準値F1以上の範囲において破線で示すP´に低下させても、解放エネルギも破線で示すR´になり、厚み寸法が大きい側で、解放エネルギが閾値F2を超えてきしみ音が発生する問題が依然として残る。   On the other hand, as shown in FIG. 5B, in the case of holding two types of circuit boards (four-layer board and six-layer board), the variation in the thickness dimension of the four-layer board is in the range of dimensions T1 to T2. Thus, the variation in thickness of the thicker six-layer substrate is in the range from T3 to T4, and the overall variation is in a relatively wide range from T1 to T4. In this case, assuming that the holding force P of the circuit board is a value indicated by a solid line, the release energy R is indicated by a solid line, and the release energy exceeds the threshold value F2 in most of the portions except for the smaller thickness dimension. There is a risk of squeaking noise. However, even if the holding force of the circuit board is reduced to P ′ indicated by a broken line within the range of the reference value F1 or more, the release energy also becomes R ′ indicated by the broken line, and the release energy is the threshold value F2 on the side where the thickness dimension is large. There still remains the problem of squeaking noises.

本発明は上記事情に鑑みてなされたものであり、その目的は、ケースの当接部により回路基板を挟持するようにしたものにあって、回路基板と当接部との間におけるきしみ音の発生を抑えることができる車載装置を提供するにある。   The present invention has been made in view of the above circumstances, and an object of the present invention is to hold a circuit board by a contact part of a case, and a squeak noise between the circuit board and the contact part. It is in providing the vehicle-mounted apparatus which can suppress generation | occurrence | production.

上記目的を達成するために、本発明の車載装置は、ケース内に、回路基板を収容して構成されるものであって、前記ケースは、前記回路基板の一方の面に当接する第1の当接部を有する第1のケースと、前記回路基板の他方の面に当接する第2の当接部を有す第2のケースとを備え、前記第1の当接部と第2の当接部との間で前記回路基板を挟持するように構成されていると共に、前記第1のケース及び第2のケースの両方又はいずれか一方に、通常時には前記回路基板の表面から離間し、前記ケースがたわみ変形した際に、前記回路基板に当接する補助当接部が設けられているところに特徴を有する。   In order to achieve the above object, an in-vehicle device according to the present invention is configured to accommodate a circuit board in a case, and the case is in contact with one surface of the circuit board. A first case having a contact portion, and a second case having a second contact portion that contacts the other surface of the circuit board, the first contact portion and the second contact The circuit board is configured to be sandwiched between the contact portion, and at least one of the first case and the second case is normally separated from the surface of the circuit board, and A feature is that an auxiliary contact portion is provided to contact the circuit board when the case is flexibly deformed.

これによれば、ケース内の回路基板は、ケースに設けられた第1の当接部と第2の当接部との間に挟持されて保持されている。ここで、例えば外力によりケースがたわみ変形した際には、当接部と回路基板との間がスティック状態からスリップ状態に遷移する虞があるが、ケースのたわみ変形に伴い、回路基板には、当接部が当接していることに加えて、補助当接部が当接することになる。これによって、回路基板の表面に対する当接部の接触箇所(接触面積)が大きくなり、摺動抵抗が大きくなってスリップ状態に遷移しにくくなる。   According to this, the circuit board in the case is sandwiched and held between the first contact portion and the second contact portion provided in the case. Here, for example, when the case is bent and deformed by an external force, there is a possibility that the contact portion and the circuit board may transition from the stick state to the slip state. In addition to the contact portion being in contact, the auxiliary contact portion is in contact. As a result, the contact location (contact area) of the contact portion with the surface of the circuit board is increased, the sliding resistance is increased, and the transition to the slip state is difficult.

従って、本発明によれば、ケースの当接部により回路基板を挟持するようにしたものにあって、回路基板と当接部との間におけるきしみ音の発生を抑えることができるという優れた効果を奏する。尚、通常時(ケースがたわみ変形していない状態)には、補助当接部は回路基板の表面当接していないので、回路基板に対する当接部による保持力が必要以上に大きくなることもない。   Therefore, according to the present invention, the circuit board is sandwiched by the contact portion of the case, and the excellent effect that the generation of squeak noise between the circuit board and the contact portion can be suppressed. Play. In normal times (when the case is not flexed and deformed), the auxiliary contact portion is not in contact with the surface of the circuit board, so that the holding force by the contact portion with respect to the circuit board does not increase more than necessary. .

本発明の一実施例を示すもので、車載装置の平面図1 is a plan view of an in-vehicle device according to an embodiment of the present invention. 図1のA−A線に沿う縦断右側面図(a)及び図1のB−B線に沿う縦断正面図(b)A vertical right side view along line AA in FIG. 1 (a) and a front view along vertical line BB in FIG. 1 (b). 回路基板と補助当接部との関係を説明するための、通常時(a)及びケースのたわみ変形時(b)の要部の拡大縦断正面図Enlarged longitudinal front view of the main part at normal time (a) and at the time of bending deformation of the case (b) for explaining the relationship between the circuit board and the auxiliary contact part ケースの上面側(a)及び下面側(b)に外力が作用する様子を示す斜視図The perspective view which shows a mode that external force acts on the upper surface side (a) and lower surface side (b) of a case. 回路基板の厚さ寸法とケースによる保持力及び解放エネルギとの関係を説明するためのもので、(a)は1種類の回路基板を保持する場合、(b)は2種類の回路基板を保持する場合を示す図It is for explaining the relationship between the thickness dimension of the circuit board and the holding force and release energy by the case. (A) holds one kind of circuit board, (b) holds two kinds of circuit boards. Figure showing when to

以下、本発明を、車載装置としてのETC/DSRC車載器に適用した一実施例について、図面を参照しながら説明する。尚、以下の説明では、便宜上、ケースのうち、ETC/DSRCカード(図示せず)の出し入れ口のある面を前面(図1の状態を平面図)として説明する。前記ETC/DSRCカードは、例えば周知の接触型のICカードから構成される。   Hereinafter, an embodiment in which the present invention is applied to an ETC / DSRC vehicle-mounted device as a vehicle-mounted device will be described with reference to the drawings. In the following description, for the sake of convenience, the surface of the case having the slot for the ETC / DSRC card (not shown) will be described as the front surface (the state of FIG. 1 is a plan view). The ETC / DSRC card is composed of, for example, a well-known contact type IC card.

図1、図2に示すように、本実施例に係る車載装置1は、例えば合成樹脂製のケース2内に、回路基板3やカードコネクタ4等を備えて構成される。前記ケース2は、図4にも示すように、全体として、前後にやや長く高さ(上下)方向に薄型なほぼ矩形箱状をなし、第1のケースであるアッパケース5と、第2のケースであるロアケース6を結合して構成される。このケース2(アッパケース5)の前面部には、下部寄りに位置して横長なスリット状のカード出し入れ口7が設けられている。尚、このケース2の前端部には、左右方向中央部に位置して緩やかな湾曲状(円弧状)の凹部2aが設けられている。   As shown in FIGS. 1 and 2, the in-vehicle device 1 according to the present embodiment includes a circuit board 3, a card connector 4, and the like in a case 2 made of synthetic resin, for example. As shown in FIG. 4, the case 2 has a substantially rectangular box shape that is slightly longer in the front-rear direction and thin in the height (vertical) direction, and includes an upper case 5 that is a first case, The lower case 6 which is a case is combined. The front side of the case 2 (upper case 5) is provided with a horizontally long slit-shaped card slot 7 which is located near the lower part. The front end of the case 2 is provided with a gently curved (arc-shaped) recess 2a located at the center in the left-right direction.

前記回路基板3は、図2に示すように、前記ケース2内の高さ(上下)方向ほぼ中間部に位置して配設され、その一方の面である上面に各種の電子部品8が実装されている。これにて、回路基板3には、外部との通信を制御する通信制御回路や、ETC/DSRCカードの読取り、書込みを行うカード処理回路、電源回路等の各種回路が構成されている。アッパケース5の内面(天井面)には、電子部品8との間に位置して例えばウレタンフォームからなるポリマーシート9が配置されている。   As shown in FIG. 2, the circuit board 3 is disposed at a substantially middle portion in the height (up and down) direction in the case 2, and various electronic components 8 are mounted on the upper surface which is one surface thereof. Has been. Thus, the circuit board 3 includes various circuits such as a communication control circuit that controls communication with the outside, a card processing circuit that reads and writes an ETC / DSRC card, and a power supply circuit. A polymer sheet 9 made of, for example, urethane foam is disposed on the inner surface (ceiling surface) of the upper case 5 so as to be positioned between the electronic component 8.

このとき、詳しく図示はしないが、ETC車載機及びDSRC車載機に関して、ケース2は共用されるが、DSRC車載機はETC車載機に比べて、回路の構成要素(部品数等)が多くなるため、回路基板3として、例えば、ETC車載機では4層の多層基板が用いられるのに対し、DSRC車載機では6層の多層基板が用いられ、DSRC車載機用の回路基板3の方がETC車載機用に比べて厚みがやや大きく構成される。回路基板3は、アッパケース5とロアケース6との間に挟持されてケース2内に配設されるようになっている。その回路基板3の支持構造を含むケース2の詳細な構造については、後述する。   At this time, although not shown in detail, the case 2 is shared for the ETC in-vehicle device and the DSRC in-vehicle device, but the DSRC in-vehicle device has more circuit components (such as the number of parts) than the ETC in-vehicle device. As the circuit board 3, for example, a 4-layer multilayer board is used in an ETC in-vehicle apparatus, whereas a 6-layer multilayer board is used in a DSRC in-vehicle apparatus, and the circuit board 3 for the DSRC in-vehicle apparatus is an ETC in-vehicle apparatus. The thickness is slightly larger than that for machine use. The circuit board 3 is sandwiched between the upper case 5 and the lower case 6 and disposed in the case 2. The detailed structure of the case 2 including the support structure for the circuit board 3 will be described later.

前記カードコネクタ4は、前記回路基板3の他方の面である下面側(ロアケース6との間)に位置して設けられている。詳しく図示はしないが、このカードコネクタ4は、前記カード出し入れ口7から挿入されたETC/DSRCカードを読取位置にロックするロック機構、読取位置のETC/DSRCカードに電気的に接続されるコンタクト、イジェクトボタン18(図4参照)が操作されることにより、ETC/DSRCカードを排出するカード排出機構等が設けられている。図1に示すように、前記ケース2の後面には、電源やアンテナ装置との接続用の図示しないコネクタが設けられており、ケーブル10が接続されるようになっている。   The card connector 4 is provided on the lower surface side (between the lower case 6) that is the other surface of the circuit board 3. Although not shown in detail, the card connector 4 includes a lock mechanism for locking the ETC / DSRC card inserted from the card insertion / removal port 7 in the reading position, a contact electrically connected to the ETC / DSRC card in the reading position, When the eject button 18 (see FIG. 4) is operated, a card ejection mechanism for ejecting the ETC / DSRC card is provided. As shown in FIG. 1, a connector (not shown) for connection with a power source or an antenna device is provided on the rear surface of the case 2 so that a cable 10 is connected thereto.

さて、前記ケース2について、図3も参照して詳述する。前記アッパケース5は、下面側が開口した薄型のほぼ矩形箱状に構成され、前記ケース2の天井壁、左右の側壁、前壁、後壁を構成する。アッパケース5の前壁部には、前記カード出し入れ口7が形成されている。図示はしないが、このアッパケース5の後壁部には、コネクタ用の開口が形成されている。一方、前記ロアケース6は、前記ケース2の底壁を構成すると共に、その底壁部の左右の辺部に、僅かな高さで立上る側壁部を一体に有している。尚、ロアケース6と左右の側壁部と、前記アッパケース5の左右の側壁部とは、アッパケース5側が外側に来るようにして、一部が上下方向にラップするようになっている。   Now, the case 2 will be described in detail with reference to FIG. The upper case 5 is formed in a thin, substantially rectangular box shape having an open bottom surface, and constitutes a ceiling wall, left and right side walls, a front wall, and a rear wall of the case 2. The card slot 7 is formed in the front wall portion of the upper case 5. Although not shown, a connector opening is formed in the rear wall portion of the upper case 5. On the other hand, the lower case 6 constitutes the bottom wall of the case 2 and integrally has side walls that rise at a slight height on the left and right sides of the bottom wall. The lower case 6, the left and right side wall portions, and the left and right side wall portions of the upper case 5 are partially wrapped in the vertical direction so that the upper case 5 side is on the outside.

このとき、図2(b)に一部のみ示すように、前記アッパケース5の側壁部には、例えば、左側壁部の前後の2箇所、及び右側壁部の後寄りの1箇所の合計3箇所に位置して、係合爪11が内側を向くように形成されている。これに対し、ロアケース6には、左右の側壁部の外面側の、前記に、3箇所の係合爪11に対応した位置に、係合凹部12が形成されている。これにて、アッパケース5とロアケース6とは、左右の壁側部の3箇所において係合爪11が係合凹部12に係合することにより、ねじ等の別部品を用いずに連結されるようになっている。   At this time, as shown only in part in FIG. 2 (b), the side wall of the upper case 5 includes, for example, two places before and after the left side wall and one place behind the right side wall. The engaging claw 11 is formed at a location so as to face inward. On the other hand, the lower case 6 has engagement recesses 12 formed at positions corresponding to the three engagement claws 11 on the outer surface side of the left and right side wall portions. Thus, the upper case 5 and the lower case 6 are connected without using another part such as a screw by engaging the engaging claws 11 with the engaging recesses 12 at three positions on the left and right wall sides. It is like that.

更に、前記アッパケース5には、図2(b)に一部のみ示すように、左右の各辺部の前後部の合計4箇所に位置して、リブ13が一体に形成されている。これらリブ13は、前後に薄い板状をなし、アッパケース5の天井面から側壁内面にかけた部位に、下方に延びるように設けられている。これらリブ13の先端面(下端面)は水平に延びるように設けられ、前記回路基板3の上面(左右の辺部近傍の合計4箇所)に当接する。従って、リブ13の先端面が第1の当接部として機能する。   Further, as shown in a part of FIG. 2 (b), the upper case 5 is integrally formed with ribs 13 at a total of four locations in the front and rear portions of the left and right sides. These ribs 13 are formed in a thin plate shape in the front and rear, and are provided so as to extend downward at a portion extending from the ceiling surface of the upper case 5 to the inner surface of the side wall. The front end surfaces (lower end surfaces) of these ribs 13 are provided so as to extend horizontally, and abut on the upper surface of the circuit board 3 (a total of four locations near the left and right sides). Therefore, the tip surface of the rib 13 functions as a first contact portion.

これに対し、前記ロアケース6の左右の側壁部には、図2(a)、(b)に一部示すように、前記リブ13と協働して前記回路基板3を上下から挟むように支持するための、弾性支持部14が一体に設けられている。この弾性支持部14は、ロアケース6の左右の側壁部の前後部の合計4箇所に位置して設けられる。この弾性支持部14は、図2(a)に示すように、ロアケース6の側壁部の上面から上方に延びる基部14aと、その基部14aの上端から前後方向(図2(a)で右側)に細長く延びる可動部14bとを有して構成される。   On the other hand, the left and right side wall portions of the lower case 6 are supported so as to sandwich the circuit board 3 from above and below in cooperation with the ribs 13, as shown in part in FIGS. 2 (a) and 2 (b). For this purpose, an elastic support portion 14 is integrally provided. The elastic support portions 14 are provided at a total of four locations on the front and rear portions of the left and right side wall portions of the lower case 6. As shown in FIG. 2A, the elastic support portion 14 includes a base portion 14a extending upward from the upper surface of the side wall portion of the lower case 6, and a front-rear direction (right side in FIG. 2A) from the upper end of the base portion 14a. And a movable portion 14b that is elongated.

このとき、前記可動部14bの下面側(側壁部の上面との間)には、可動部14bの下方への変形(弾性変形)を許容する溝(切込み)15が形成されている。また、前記可動部14bの上面には、先端(後端)及び中間部の外側寄り部位に位置して、2個の突起部16が一体に設けられている。これら突起部16が、前記回路基板3の下面に当接する第2の当接部として機能する。これにて、前記回路基板3は、ロアケース6の各弾性支持部14(突起部16)上に、位置決め状態に載置(セット)され、その状態で、ロアケース6に対しアッパケース5が連結される。これにより、回路基板3は、その左右の側辺部において、リブ13と弾性支持部14(突起部16)との間で挟持される。   At this time, a groove (cut) 15 is formed on the lower surface side (between the upper surface of the side wall portion) of the movable portion 14b to allow deformation (elastic deformation) downward of the movable portion 14b. Further, two projecting portions 16 are integrally provided on the upper surface of the movable portion 14b at positions closer to the outer side of the front end (rear end) and the intermediate portion. These protrusions 16 function as second contact portions that contact the lower surface of the circuit board 3. Thus, the circuit board 3 is placed (set) on the respective elastic support portions 14 (projections 16) of the lower case 6 in a positioned state, and the upper case 5 is connected to the lower case 6 in this state. The Thereby, the circuit board 3 is clamped between the rib 13 and the elastic support part 14 (projection part 16) in the left and right side parts.

そして、本実施例では、図2(b)及び図3に示すように、前記各弾性支持部14には、前記突起部16の近傍(内側)に位置して、突起状の補助当接部17が一体に設けられている。図3(a)に示すように、この補助当接部17は、前記突起部16の上端よりも僅かに低く形成されており、通常時においては、回路基板3の下面から僅かな距離t(えば0.1mm程度)だけ離間している。これに対し、次の作用説明でも述べるように、例えばケース2が外力を受けてたわみ変形した際に、図3(b)に示すように、突起部16と共に回路基板3の下面に当接するようになっている。   In this embodiment, as shown in FIGS. 2B and 3, each elastic support portion 14 is located in the vicinity (inner side) of the protruding portion 16 and has a protruding auxiliary contact portion. 17 is provided integrally. As shown in FIG. 3A, the auxiliary contact portion 17 is formed slightly lower than the upper end of the projection portion 16, and in a normal state, it is a slight distance t ( For example, about 0.1 mm). On the other hand, as will be described in the following description of the operation, for example, when the case 2 is deformed by bending due to an external force, it contacts the lower surface of the circuit board 3 together with the protrusion 16 as shown in FIG. It has become.

次に、上記構成の作用について述べる。上記のように構成された車載装置1は、車両の車室内、例えばインストルメントパネルの下部等に取付けられる。このとき、車載装置1のケース2を両面テープ等で車室内に取付ける際にケース2を押え付けたり、例えば乗員の膝がケース2に当たったりした場合等、主としてケース2の上下面の中央部に荷重(図4(a)、(b)に示す外力F1、F2)が掛かりケース2がたわみ変形した際に、スティック・スリップ音と呼ばれるきしみ音の発生の虞が考えられる。   Next, the operation of the above configuration will be described. The in-vehicle device 1 configured as described above is attached to a vehicle interior of the vehicle, for example, a lower portion of an instrument panel. At this time, when the case 2 of the vehicle-mounted device 1 is attached to the vehicle interior with a double-sided tape or the like, the case 2 is pressed down, for example, when the occupant's knee hits the case 2, etc. When a load (external forces F1 and F2 shown in FIGS. 4A and 4B) is applied to the case 2 and the case 2 is bent and deformed, there is a possibility that a squeak noise called a stick-slip sound may be generated.

このきしみ音は、スティック・スリップ音と呼ばれ、ケース2が通常状態からたわみ変形することに伴い、回路基板3の上面に対しアッパケース5のリブ13がスティック状態からスリップ状態に遷移して摺動する、或いは回路基板3の下面に対しロアケース6の弾性支持部14(突起部16)がスティック状態からスリップ状態に遷移して摺動する際に、解放されるエネルギが大きいときに音が発生する。この場合、上記構造では、ポリマーシート9の存在等により、回路基板3からロアケース6側に荷重が大きくかかるため、きしみ音の寄与の度合いは、ロアケース6側(回路基板3の下面側)が大きくなる。   This squeak noise is called stick-slip noise, and the rib 13 of the upper case 5 shifts from the stick state to the slip state with respect to the upper surface of the circuit board 3 as the case 2 bends and deforms from the normal state. When the elastic support part 14 (projection part 16) of the lower case 6 moves from the stick state to the slip state and slides relative to the lower surface of the circuit board 3, a sound is generated when the released energy is large. To do. In this case, in the above structure, a large load is applied from the circuit board 3 to the lower case 6 due to the presence of the polymer sheet 9 and the like, and the degree of contribution of squeak noise is large on the lower case 6 side (the lower surface side of the circuit board 3). Become.

特に、本実施例の車載装置1のように、厚みの相違する複数種類の回路基板3に関してケース2を共用するもの、つまり、保持する回路基板3の厚み寸法の最低、最高の範囲が大きくなるものでは、「発明が解決しようとする課題」の項で述べたように、ケース2による回路基板3の保持力(挟持力)を調整(低下)してもきしみ音の問題が解決できなくなる虞がある(図5(b)参照)。   In particular, as in the vehicle-mounted device 1 of this embodiment, the case 2 is shared with respect to a plurality of types of circuit boards 3 having different thicknesses, that is, the minimum and maximum ranges of the thickness dimension of the circuit board 3 to be held are increased. However, as described in the section “Problems to be Solved by the Invention”, the problem of squeak noise may not be solved even if the holding force (holding force) of the circuit board 3 by the case 2 is adjusted (decreased). (See FIG. 5B).

ところが、本実施例の車載装置1においては、ロアケース6の弾性支持部14には、突起部16に加えて、補助当接部17が設けられている。これにより、通常時には、図3(a)に示すように、回路基板3の下面には突起部16のみが接触しているのであるが、外力F1,F2によりケース2がたわみ変形した際には、図3(b)に示すように、回路基板3の下面には、突起部16が当接していることに加えて、補助当接部17が当接することになる。   However, in the in-vehicle device 1 of the present embodiment, the elastic support portion 14 of the lower case 6 is provided with an auxiliary contact portion 17 in addition to the projection portion 16. As a result, normally, as shown in FIG. 3A, only the protrusion 16 is in contact with the lower surface of the circuit board 3, but when the case 2 is bent and deformed by the external forces F1 and F2. As shown in FIG. 3 (b), the auxiliary contact portion 17 comes into contact with the lower surface of the circuit board 3 in addition to the contact with the projection 16.

これによって、回路基板3の表面に対する当接部16,17の接触箇所(接触面積)が大きくなり、摺動抵抗が大きくなるので、スティック状態からスリップ状態に遷移しにくくなり、この結果、きしみ音が発生しにくくなる。尚、通常時(ケース2がたわみ変形していない状態)には、補助当接部17は回路基板3の下面から離間しているので、回路基板3に対する保持力が必要以上に大きくなることもない。   As a result, the contact portions (contact areas) of the contact portions 16 and 17 with respect to the surface of the circuit board 3 are increased, and the sliding resistance is increased, so that it is difficult to make a transition from the stick state to the slip state. Is less likely to occur. In the normal state (when the case 2 is not flexed and deformed), the auxiliary contact portion 17 is separated from the lower surface of the circuit board 3, so that the holding force with respect to the circuit board 3 may become larger than necessary. Absent.

このように本実施例の車載装置1によれば、ケース2のリブ13と弾性支持部14とにより回路基板3を挟持するようにしたものにあって、ロアケース6の弾性支持部14に、突起部16の近傍に位置して、ケース2がたわみ変形した際に回路基板3に当接する補助当接部17を設けるようにしたので、回路基板3と弾性支持部14との間におけるきしみ音の発生を抑えることができるという優れた効果を得ることができる。   Thus, according to the in-vehicle device 1 of the present embodiment, the circuit board 3 is sandwiched between the rib 13 and the elastic support portion 14 of the case 2, and the protrusion is formed on the elastic support portion 14 of the lower case 6. Since the auxiliary contact portion 17 is provided in the vicinity of the portion 16 to contact the circuit board 3 when the case 2 is bent and deformed, a squeak noise between the circuit board 3 and the elastic support portion 14 is provided. The outstanding effect that generation | occurrence | production can be suppressed can be acquired.

尚、上記実施例では、補助当接部17を突起部16の近傍に突起状の設けるようにしたが、補助当接部を、第1の当接部又は第2の当接部と連続するようなテーパ形状に設けることもできる。これによっても、通常時には回路基板の表面に第1の当接部(又は第2の当接部)のみが当接し、ケースのたわみ変形に伴い、第1の当接部(又は第2の当接部)及び補助当接部が広い面積で回路基板に当接するようになり、突起の場合と同様の作用・効果を得ることができる。   In the above-described embodiment, the auxiliary contact portion 17 is provided in the vicinity of the projection portion 16. However, the auxiliary contact portion is continuous with the first contact portion or the second contact portion. It can also provide in such a taper shape. Even in this case, only the first contact portion (or the second contact portion) normally contacts the surface of the circuit board, and the first contact portion (or the second contact portion) is deformed as the case is deformed. The contact portion) and the auxiliary contact portion come into contact with the circuit board over a wide area, and the same operation and effect as in the case of the protrusion can be obtained.

また、上記実施例では、補助当接部17をロアケース6側に設けるようにしたが、補助当接部をアッパケース側に設けても良く、また第1、第2のケースの双方に設けるようにしても良い。その他、ケースの形状や係合構造等の構造、当接部を設ける位置や個数等についても種々の変形が可能であり、また、本発明は、ETC車載機、DSRC車載器に限らず、車載装置全般に適用することができる等、本発明は要旨を逸脱しない範囲内で適宜変更して実施し得るものである。   In the above-described embodiment, the auxiliary contact portion 17 is provided on the lower case 6 side. However, the auxiliary contact portion may be provided on the upper case side, and may be provided on both the first and second cases. Anyway. In addition, the shape of the case, the structure such as the engagement structure, the position and the number of the contact portions, and the like can be variously modified. The present invention is not limited to the ETC in-vehicle device and the DSRC in-vehicle device. The present invention can be implemented with appropriate modifications within a range that does not depart from the gist, such as being applicable to all devices.

図面中、1は車載装置、2はケース、3は回路基板、5はアッパケース(第1のケース)、6はロアケース(第2のケース)、11は係合爪、12は係合凹部、13はリブ(第1の当接部)、14は弾性支持部、16は突起部(第2の当接部)、17は補助当接部を示す。   In the drawings, 1 is an in-vehicle device, 2 is a case, 3 is a circuit board, 5 is an upper case (first case), 6 is a lower case (second case), 11 is an engaging claw, 12 is an engaging recess, Reference numeral 13 denotes a rib (first contact portion), 14 denotes an elastic support portion, 16 denotes a projection portion (second contact portion), and 17 denotes an auxiliary contact portion.

Claims (4)

ケース内に、回路基板を収容して構成される車載装置であって、
前記ケースは、前記回路基板の一方の面に当接する第1の当接部を有する第1のケースと、前記回路基板の他方の面に当接する第2の当接部を有す第2のケースとを備え、前記第1の当接部と第2の当接部との間で前記回路基板を挟持するように構成されていると共に、
前記第1のケース及び第2のケースの両方又はいずれか一方に、通常時には前記回路基板の表面から離間し、前記ケースがたわみ変形した際に、前記回路基板に当接する補助当接部が設けられていることを特徴とする車載装置。
A vehicle-mounted device configured by housing a circuit board in a case,
The case has a first case having a first contact portion that contacts one surface of the circuit board, and a second case having a second contact portion that contacts the other surface of the circuit board. A case, and configured to sandwich the circuit board between the first contact portion and the second contact portion,
Either or both of the first case and the second case are usually provided with an auxiliary contact portion that is separated from the surface of the circuit board and contacts the circuit board when the case is bent and deformed. An in-vehicle device characterized in that
前記第1の当接部又は第2の当接部の少なくともいずれか一方は、弾性変形可能に構成されており、
前記補助当接部は、前記弾性変形可能な当接部の近傍に位置して設けられていることを特徴とする請求項1記載の車載装置。
At least one of the first contact portion and the second contact portion is configured to be elastically deformable,
The in-vehicle device according to claim 1, wherein the auxiliary contact portion is provided in the vicinity of the elastically deformable contact portion.
前記補助当接部は、前記当接部の近傍に凸状に設けられていることを特徴とする請求項1又は2記載の車載装置。   The in-vehicle device according to claim 1, wherein the auxiliary contact portion is provided in a convex shape in the vicinity of the contact portion. 前記補助当接部は、前記当接部と連続するようなテーパ形状に設けられていることを特徴とする請求項1又は2記載の車載装置。   The in-vehicle device according to claim 1, wherein the auxiliary contact portion is provided in a tapered shape so as to be continuous with the contact portion.
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