JP2015049256A - Optical module member, optical module, and electronic equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an optical module achieving both of high integration of an optical module and high qualities of optical communications, and to provide an optical module member facilitating manufacture of the above optical module, and electronic equipment including the optical module and having high reliability.SOLUTION: An optical module member 100 includes: an optical waveguide 1 having a core 14; and a photoelectric conversion substrate 2 stacked on the optical waveguide 1, which comprises an insulating substrate 21, an optical element mounting part 22 that is disposed on the insulating substrate and can mount an optical element to be optically connected to the optical waveguide 1, an electric element mounting part 23 that is disposed on the insulating substrate 21 and can mount an electric element, an electric wiring line (first electric wiring line) 24 that electrically connects the optical element mounting part 22 and the electric element mounting part 23, and an electric wiring line (second electric wiring line) 25 drawn from the electric element mounting part 23. The optical module member is configured to avoid overlapping of the core 14 and the electric wiring line 25 in a plan view on a plane including the optical waveguide 1.

Description

  The present invention relates to an optical module member, an optical module, and an electronic device.

  As a device for transmitting information to a broadband line (broadband) capable of communicating a large amount of information at high speed, a transmission device such as a router device or WDM (Wavelength Division Multiplexing) is used. In these transmission apparatuses, a large number of signal processing boards in which arithmetic elements such as LSIs and storage elements such as memories are combined are installed, and each line is interconnected.

  In each signal processing board, a circuit in which arithmetic elements, storage elements, etc. are connected by electrical wiring is constructed. However, with the increase in the amount of information to be processed in recent years, each board has information with higher throughput. It is required to transmit. However, as information transmission speeds up, problems such as the occurrence of crosstalk and high-frequency noise and deterioration of electrical signals become apparent. For this reason, electrical wiring becomes a bottleneck, making it difficult to improve the throughput of the signal processing board. Similar problems are also becoming apparent in supercomputers and large-scale servers.

  Therefore, it has been studied to solve these problems by optical communication technology. In the optical communication technology, an optical fiber or an optical waveguide that guides an optical signal from one point to another point is used. The optical waveguide has a linear core part and a clad part provided so as to cover the periphery thereof, and the core part is made of a material substantially transparent to an optical signal, and the clad part Is made of a material having a refractive index lower than that of the core.

  A light emitting element such as a semiconductor laser is disposed on the incident side of the optical waveguide, and a light receiving element such as a photodiode is disposed on the emission side. Light incident from the light emitting element propagates through the optical waveguide, is received by the light receiving element, and performs communication based on the flickering pattern of the received light or its intensity pattern.

  By replacing the electric wiring in the signal processing board by such an optical waveguide, it is expected that the problem of the electric wiring as described above will be solved and the signal processing board can be further increased in throughput.

  When replacing electric wiring with an optical waveguide, it is necessary to perform mutual conversion between an electric signal and an optical signal. Therefore, light having a light emitting element, a light receiving element, and an optical waveguide that optically connects between them. Modules are used.

  For example, Patent Document 1 discloses an optical interface having a printed circuit board, a light emitting element mounted on the printed circuit board, and an optical waveguide provided on the lower surface side of the printed circuit board. The optical waveguide and the light emitting element are optically connected through a through hole, which is a through hole for transmitting an optical signal, formed on the printed board.

JP 2005-294407 A

  In recent years, modularization of optical interfaces has progressed, and not only light emitting elements and light receiving elements, but also drive elements that drive light emitting elements and signal amplifying elements that amplify signals from the light receiving elements are mounted on the printed circuit board. There is a lot to do.

  However, the progress of modularization increases the degree of integration of elements and electrical wiring. Normally, increasing the degree of integration of elements and electrical wiring often increases the speed and capacity of optical communications. However, by increasing the degree of integration, the optical circuit is generated by the heat generated from the electrical elements. There was a problem that signal quality deteriorates due to thermal deformation.

  An object of the present invention includes an optical module that achieves both high integration of an optical module and high quality of optical communication, an optical module member capable of easily manufacturing the optical module, and the optical module. The object is to provide a highly reliable electronic device.

Such an object is achieved by the present inventions (1) to (9) below.
(1) a layered optical waveguide having a long core portion;
A photoelectric conversion substrate laminated on the optical waveguide, the insulating substrate, and an optical element mounting portion provided on the insulating substrate and capable of mounting an optical element so as to be optically connected to the optical waveguide; An electric element mounting portion provided on the insulating substrate and capable of mounting an electric element; a first electric wiring for electrically connecting the optical element mounting portion and the electric element mounting portion; and the electric element A photoelectric conversion substrate comprising: a second electrical wiring drawn from the mounting portion;
Have
An optical module member configured so that the core portion and the second electric wiring do not overlap when viewed in plan with respect to a plane including the optical waveguide.

  (2) The optical module member according to (1), wherein the optical waveguide includes a plurality of the core portions arranged in parallel.

  (3) In the above (2), the end of the electric element mounting portion is configured to be located further outside than the outermost one of the parallel core portions in the plan view. Optical module member.

  (4) The distance between the end portion of the electric element mounting portion and the outermost one of the plurality of parallel core portions is 0.05 to 10 mm. Element.

  (5) The optical module member according to (3) or (4), wherein the second electric wiring is drawn from the end of the electric element mounting portion.

  (6) The optical module member according to any one of (3) to (5), wherein an extension direction of the second electric wiring is substantially orthogonal to an extension direction of the core portion. .

(7) The photoelectric conversion substrate is
As the optical element mounting part, a light emitting element mounting part capable of mounting a light emitting element, and a light receiving element mounting part capable of mounting a light receiving element,
(1) The electric element mounting section includes a driving element mounting section for driving the light emitting element and a signal amplifying element mounting section capable of mounting a signal amplifying element for amplifying a signal from the light receiving element. The member for optical modules of any one of thru | or (6).

(8) The optical module member according to any one of (1) to (7),
An optical element mounted on the optical element mounting portion;
An electric element mounted on the electric element mounting portion;
An optical module comprising:
(9) An electronic apparatus comprising the optical module according to (8).

  According to the present invention, it is possible to obtain an optical module that achieves both high integration of the optical module and high quality of optical communication.

Moreover, according to this invention, the member for optical modules which can manufacture the said optical module easily is obtained.
Moreover, according to this invention, the reliable electronic device provided with the said optical module is obtained.

It is a perspective view which shows 1st Embodiment of the optical module of this invention. It is the sectional view on the AA line of FIG. It is the BB sectional view taken on the line of FIG. It is a perspective view which expands and shows a part of optical waveguide contained in the optical module shown in FIG. It is a perspective view which shows 1st Embodiment of the member for optical modules of this invention. It is a top view of the member for optical modules shown in FIG. It is a top view which shows 2nd Embodiment of the member for optical modules of this invention. It is a perspective view which shows 3rd Embodiment of the optical module of this invention. It is CC sectional view taken on the line of FIG. It is a top view which shows the member for optical modules corresponded to a comparative example.

  Hereinafter, the optical module member, the optical module, and the electronic device of the present invention will be described in detail based on preferred embodiments shown in the accompanying drawings.

<Optical module and optical module members>
<< First Embodiment >>
First, the first embodiment of the optical module of the present invention and the first embodiment of the optical module member of the present invention will be described.

  1 is a perspective view showing a first embodiment of the optical module of the present invention, FIG. 2 is a cross-sectional view taken along line AA in FIG. 1, and FIG. 3 is a cross-sectional view taken along line BB in FIG. 4 is an enlarged perspective view showing a part of the optical waveguide included in the optical module shown in FIG. 1, and FIG. 5 is a perspective view showing the first embodiment of the optical module member of the present invention. FIG. 6 is a plan view of the optical module member shown in FIG. In FIGS. 1, 5, and 6, the optical waveguide behind the member is indicated by a dotted line. In FIG. 4, the optical waveguide 1 shown in FIG. 1 is shown upside down.

  An optical module 1000 shown in FIG. 1 is mounted on an optical module member 100 including an optical waveguide 1, an optical element 4 and an electrical element 5 mounted on the optical module member 100, and an end of the optical waveguide 1. And an optical connector 6. In such an optical module 1000, the light emitted from the optical element 4 is transmitted to the optical connector 6 through the optical waveguide 1, while the light incident on the optical waveguide 1 in the optical connector 6 is received by the optical element 4. To do. By such optical transmission, optical communication can be performed between the optical element 4 and the optical connector 6.

  More specifically, the optical module member 100 of the optical module 1000 includes a film-like long optical waveguide 1 and a photoelectric conversion substrate 2 stacked on one end of the optical waveguide 1. It is a member provided.

  Among these, as shown in FIGS. 5 and 6, the photoelectric conversion substrate 2 includes an insulating substrate 21, an optical element mounting portion 22 on which the optical element 4 can be mounted, a signal to the optical element 4, and an optical element 4. And an electric element mounting portion 23 on which an electric element 5 for receiving a signal from can be mounted.

  Hereinafter, the configuration of each part of the optical module 1000 and the optical module member 100 will be sequentially described in detail.

(Optical waveguide)
First, the optical waveguide 1 will be described.

  The optical waveguide 1 shown in FIG. 4 includes a laminate 10 in which a clad layer 11, a core layer 13, and a clad layer 12 are sequentially laminated from the lower side. In the core layer 13, as shown in FIG. 4, twelve long core portions 14 and side clad portions 15 provided adjacent to the side surfaces thereof are formed. In FIG. 4, the core part 14 and the side clad part 15 in the core layer 13 seen through the clad layer 12 are also shown by dotted lines.

  The width and height (the thickness of the core layer 13) of the core part 14 are not particularly limited, but are preferably about 1 to 200 μm, more preferably about 5 to 100 μm. Thereby, it is possible to increase the density of the core part 14 while increasing the transmission efficiency of the core part 14. That is, since the number of core portions 14 that can be laid per unit area can be increased, large-capacity optical communication can be performed even in a small area.

  In addition, the number of the core parts 14 formed in the core layer 13 is not particularly limited, but is 2 to 100, for example.

  The optical waveguide 1 is formed with a recess 170 formed by a process of removing a part of the laminated body 10. The concave portion 170 shown in FIG. 4 is formed on the extension line of the end portion of the core portion 14 and at a position corresponding to the side cladding portion 15. A part of the inner side surface of the recess 170 is constituted by an inclined surface 171 that is inclined with respect to a plane including the core layer 13. The inclined surface 171 functions as a mirror (optical path conversion unit) that converts the optical path of the core unit 14. That is, the mirror composed of the inclined surface 171 changes the light propagation direction by, for example, reflecting light propagating through the core unit 14 shown in FIG. 4 downward in FIG.

  As shown in FIG. 4, the inclined surface 171 is a flat surface continuously formed from the cladding layer 12 through the core layer 13 to the cladding layer 11. Further, an upright surface 172 is provided at a position facing the inclined surface 171 on the inner surface of the recess 170. The upright surface 172 is a flat surface continuously formed from the cladding layer 12 through the core layer 13 to the cladding layer 11 and is a surface perpendicular to the plane including the core layer 13. . In the present embodiment, the case where the inclined surface 171 is a flat surface has been described as an example. However, in the present invention, the inclined surface 171 does not necessarily need to be a flat surface, and may be a curved surface as necessary. Alternatively, it may be an assembly of surfaces having partially different inclination angles.

  On the other hand, two surfaces of the inner surface of the concave portion 170 that are substantially parallel to the optical axis of the core portion 14 are also upright surfaces 173 and 174 that are perpendicular to the same plane as the core layer 13.

  The inclined surface 171 and the three upright surfaces 172, 173, and 174 constitute the inner surface of the recess 170.

  Further, the maximum depth of the recess 170 is appropriately set based on the thickness of the laminated body 10 and is not particularly limited, but is preferably 1 to 500 μm from the viewpoint of mechanical strength and flexibility of the optical waveguide 1. And more preferably about 5 to 400 μm. The recess 170 may partially penetrate the stacked body 10.

  Further, the maximum length of the concave portion 170, that is, the maximum length of the component parallel to the optical axis of the core portion 14 in the opening of the concave portion 170 in FIG. 4 is not particularly limited, but the cladding layers 11 and 12 and the core layer 13 are not limited. The thickness is preferably about 2 to 1200 [mu] m, more preferably about 10 to 1000 [mu] m, in relation to the thickness and the inclination angle of the inclined surface 171.

  Furthermore, the maximum width of the concave portion 170, that is, the maximum length of the component orthogonal to the optical axis of the core portion 14 in the opening of the concave portion 170 in FIG. 4 is not particularly limited, and is appropriately determined according to the width of the core portion 14 and the like. Although it is set, it is preferably about 1 to 600 μm, more preferably about 5 to 500 μm.

  One concave portion 170 may be formed for one core portion 14, but one concave portion 170 may be provided so as to straddle the plurality of core portions 14. .

  Moreover, when forming the some recessed part 170, those formation positions may mutually be the same positions in the longitudinal direction of the core part 14, and as shown in FIG. 4, you may mutually shift | deviate in the longitudinal direction. .

  Although the shape of the opening of the recess 170 shown in FIG. 4 is a rectangle, the shape of the opening of the recess 170 processed in the present invention is not limited to this, and may be any shape, for example, a pentagon, It may be a polygon such as a hexagon, an ellipse, or a circle such as an oval.

  In addition, since the inclined surface 171 functions as a mirror, the inclination angle is appropriately set according to the direction in which the optical path of the core portion 14 is converted, but the same plane as the core layer 13 is used as a reference surface. The angle (acute angle side) formed by the reference surface and the inclined surface 171 is preferably about 30 to 60 °, and more preferably about 40 to 50 °. By setting the tilt angle within the above range, it is possible to efficiently convert the optical path of the core portion 14 on the tilted surface 171 and to suppress the loss accompanying the optical path conversion.

  On the other hand, the angle (acute angle side) formed by the reference surface and the upright surfaces 172, 173, 174 is preferably about 60 to 90 °, respectively. In each figure, it is illustrated as approximately 90 °. The angle formed by the reference surface and the upright surfaces 172, 173, 174 is not limited to such a range, and may be less than 60 °.

  The constituent materials (main materials) of the core layer 13 and the cladding layers 11 and 12 as described above are, for example, acrylic ether, methacrylic resin, polycarbonate, polystyrene, cyclic ether resin such as epoxy resin and oxetane resin. , Polyamide, polyimide, polybenzoxazole, polysilane, polysilazane, silicone resin, fluorine resin, polyurethane, polyolefin resin, polybutadiene, polyisoprene, polychloroprene, polyester such as PET and PBT, polyethylene succinate, polysulfone, poly Various resin materials such as ethers and cyclic olefin resins such as benzocyclobutene resins and norbornene resins can be used. Note that the resin material may be a composite material in which materials having different compositions are combined. Since these can be easily processed by laser processing, they are suitable as constituent materials for the core layer 13 and the cladding layers 11 and 12.

  In addition, a method for fixing the optical waveguide 1 and the photoelectric conversion substrate 2 is not particularly limited. For example, an epoxy adhesive, an acrylic adhesive, a urethane adhesive, a silicone adhesive, and various hot melt adhesives ( Various adhesives such as polyesters and modified olefins), or a method of bonding via an adhesive sheet or the like is used.

(Optical connector)
The optical connector 6 is a member for optically connecting the optical waveguide 1 to another optical component such as an optical fiber or another optical waveguide. By using an optical connector 6 that is detachable between other optical components, an optical connection between the optical module 1000 and another optical component or an operation for releasing the connection is performed. It can be done easily. For this reason, the mounting ease of the optical module 1000 can be further improved.

  The structure of the optical connector 6 is not specifically limited, For example, the thing based on various connector standards is used. Specific examples include PMT connectors, MT connectors defined in JIS C 5981, 16MT connectors, two-dimensional array type MT connectors, MPO connectors, MPX connectors, and the like.

  Although the optical connector 6 shown in FIG. 1 is configured to input and output light from the end face of the core portion 14, the optical connector 6 used in the present invention is not limited to this type. For example, a mirror for optical path conversion is provided at the end of the core portion 14 where the optical connector 6 is provided, and is configured to be connected to other optical components provided on the upper surface side or the lower surface side of the optical waveguide 1, for example. It may be.

  The optical waveguide 1 may be divided into a plurality of parts along the way, and the optical connector 6 may be attached to at least one of the end portions of the divided optical waveguide 1. That is, the optical module 1000 may include a plurality of optical connectors 6.

(Photoelectric conversion substrate)
As described above, the photoelectric conversion substrate 2 includes the insulating substrate 21, the four optical element mounting portions 22 on which the optical elements 4 can be mounted, and the four electric element mounting portions 23 on which the electric elements 5 can be mounted. I have. In FIGS. 5 and 6, for convenience of explanation, the outer edges of the optical element mounting portion 22 and the electric element mounting portion 23 are surrounded by a line and shown with dots inside, but the optical module member 100 includes: These lines do not need to be shown. Therefore, the optical element mounting part 22 and the electric element mounting part 23 may not be visually recognized. Further, when the optical element mounting unit 22 and the electric element mounting unit 23 are, for example, elements of the type in which the optical element 4 and the electric element 5 mounted thereon are mounted by a flip chip bonding method, This is almost equivalent to the region projected on the insulating substrate 21.

  Of the photoelectric conversion substrate 2, the insulating substrate 21 may be any substrate as long as it has insulating properties. Examples of the constituent material thereof include polyimide resins, polyamide resins, epoxy resins, and various types. Various resin materials such as polyester resins such as vinyl resins and polyethylene terephthalate resins are listed. In addition, paper, glass cloth, resin film, etc. are used as a base material, and this base material is impregnated with a resin material such as a phenol resin, a polyester resin, an epoxy resin, a cyanate resin, a polyimide resin, or a fluorine resin. In addition to insulating substrates used for composite copper-clad laminates such as glass cloth / epoxy copper-clad laminates, glass nonwoven fabrics / epoxy copper-clad laminates, polyetherimide resin substrates, polyethers Examples thereof include heat-resistant and thermoplastic organic rigid substrates such as ketone resin substrates and polysulfone resin substrates, and ceramic rigid substrates such as alumina substrates, aluminum nitride substrates, and silicon carbide substrates.

  Of the photoelectric conversion substrate 2, a portion set so that the optical element 4 can be mounted on the insulating substrate 21 is the optical element mounting portion 22. As shown in FIGS. 5 and 6, the optical element mounting portion 22 includes a plurality of land portions 221 for fixing the terminals of the optical element 4. The land portion 221 is a conductive layer provided on the insulating substrate 21, and the arrangement and the plan view shape thereof can be an arrangement and shape corresponding to a terminal (not shown) of the optical element 4. Similarly, a portion set so that the electric element 5 can be mounted on the insulating substrate 21 is an electric element mounting portion 23. Similarly to the optical element mounting part 22, the electric element mounting part 23 includes a plurality of land parts 231 for fixing the terminals of the electric element 5.

  The photoelectric conversion substrate 2 includes the four optical element mounting portions 22 and the four electric element mounting portions 23 as described above, and these are arranged in a line along the extending direction of the core portion 14 of the optical waveguide 1. Are lined up. Moreover, the optical element mounting part 22 and the electric element mounting part 23 are arrange | positioned alternately.

  In addition, a filled via 211 is disposed on the insulating substrate 21 at a position close to the electric element mounting portion 23. The filled via 211 passes through the insulating substrate 21, and a bump 8 as shown in FIG. 2 is coupled to the back side of the insulating substrate 21 so as to be electrically connected to the filled via 211. The electric element mounting portion 23 can be electrically connected to an external electric circuit through the bumps 8. In the optical module 1000 shown in FIG. 2, the electrical wiring 28 electrically connected to the filled via 211 is also formed on the lower surface of the insulating substrate 21, and the bumps 8 are provided so as to be coupled to the electrical wiring 28. It has been.

  In addition, although it does not specifically limit as a constituent material of bump 8, Various lead-containing solders, various lead-free solders, various brazing materials, etc. are mentioned.

  In such a photoelectric conversion substrate 2, each land portion 221 and each land portion 231 are electrically connected via electric wiring (first electric wiring) 24, and each land portion 231 and filled via 211 are electrically connected. They are electrically connected via (second electrical wiring) 25.

  Each electric wiring 24, 25, 28, each land part 221, 231 and filled via 211 are each made of a conductive material. Examples of the conductive material include simple metals such as copper, aluminum, nickel, chromium, zinc, tin, gold, and silver, or alloys containing these metal elements.

  Further, as shown in FIG. 2, the photoelectric conversion substrate 2 includes a solder resist layer 29 that covers a part of the land portion and the electric wiring. Thereby, a land part and electric wiring can be protected from oxidation, corrosion, etc., and the long-term reliability of the photoelectric conversion board | substrate 2 can be improved more. Moreover, it contributes to the improvement of insulation.

  In addition, the soldering resist layer 29 is comprised with various resin materials, and may contain the inorganic filler as needed.

  Here, when the photoelectric conversion substrate 2 is viewed in plan with respect to a plane including the optical waveguide 1, as shown in FIG. 6, the core portion 14 and the electric wiring 25 that connects each land portion 231 and the filled via 211 are formed. It is configured not to overlap. Thereby, it is possible to ensure a sufficient distance between the electrical wiring 25 serving as a heat generation source and the core portion 14 through which the optical signal is transmitted. As described above, the electric wiring 25 connects each land portion 231 of the electric element mounting portion 23 and the filled via 211, and since the flowing current is relatively large, the heat generation amount is also large. Accordingly, by preventing the core portion 14 and the electrical wiring 25 from overlapping each other, a sufficient distance can be ensured between them, so that the heat generated from the electrical wiring 25 is affected by the core portion 14. And difficult. Thereby, generation | occurrence | production of malfunctions, such as a signal quality fall accompanying the thermal deformation of the core part 14, can be suppressed. As a result, for example, even when the number of core portions 14 (number of channels) formed in the optical waveguide 1 is increased and the electrical wiring 25 is increased in density accordingly, highly reliable light that can perform high-quality optical communication. Module 1000 is obtained. That is, according to the present invention, it is possible to reduce the size of the optical module 1000 by high integration while ensuring the reliability of optical communication in the optical module 1000.

  The heat generated from the electrical wiring 25 includes not only Joule heat due to the electrical resistance of the electrical wiring 25 but also heat generated by conduction of the heat generated from the electrical element 5 through the electrical wiring 25. In particular, when the electric element 5 is a driver IC such as an LLD, the tendency becomes more prominent.

  Further, the optical waveguide 1 shown in FIG. 6 includes twelve core portions 14 arranged in parallel as described above. In such a case, when the optical module member 100 is viewed in plan, the electric element mounting portion 23 has a plurality of core portions 14 (hereinafter also referred to as “core portion 14 group”) whose end portions are arranged in parallel. It is preferable that the outermost one (hereinafter referred to as the “outermost core portion 14”) is positioned further outside. By doing in this way, when each land part 231 is provided at the end of the electric element mounting part 23, each land part 231 is inevitably easily arranged outside the group of core parts 14, and from there, the filled via 211 is provided. The electrical wiring 25 extending to the side naturally does not overlap the core portion 14. For this reason, the effect mentioned above can be acquired more reliably. In addition, by configuring the electric element mounting portion 23 as described above, each land portion 231 can be easily brought close to the filled via 211. For this reason, the line length of the electrical wiring 25 can be shortened, the optical module 1000 can be downsized, and the amount of heat generated from the electrical wiring 25 can be further suppressed. In addition, there is an advantage that the amount of electromagnetic noise generated from the electrical wiring 25 can be suppressed.

  In addition, it is preferable that the distance d1 of the edge part of the electric element mounting part 23 and the outermost core part 14 is about 0.05-10 mm, and it is more preferable that it is about 0.1-8 mm. By setting the distance d1 within the above range, the thermal deformation of the core portion 14 can be sufficiently suppressed while avoiding an increase in the size of the optical module 1000. That is, when the distance d1 is less than the lower limit value, depending on the constituent material (heat resistance) of the core part 14, the heat generated from the electric wiring 25 may cause the core part 14 to be deformed. On the other hand, when the distance d1 exceeds the upper limit value, the effect of suppressing the thermal deformation of the core portion 14 reaches a peak, and it may be difficult to reduce the size of the optical module 1000.

  Moreover, the electric element mounting portion 23 shown in FIG. 6 has a rectangular shape. The shape of the electric element mounting portion 23 is appropriately set according to the shape of the electric element 5 to be mounted in plan view, but is often rectangular or square. In this case, it is preferable that the electric element mounting portion 23 is set so that two opposing sides of the four sides and the extending direction of the core portion 14 are substantially parallel. Accordingly, by arranging the land portion 231 to which the electric wiring 25 is connected among the land portions 231 at the outer edge portions of the two sides, the electric wiring 24 and the electric wiring 25 can be sufficiently separated. This makes it difficult for electromagnetic noise to be superimposed on each other. For this reason, the reliability of the optical communication in the optical module 1000 becomes higher.

  Note that “substantially parallel” refers to a state in which a part of the outer edge of the electric element mounting portion 23 and the extending direction of the core portion 14 have a deviation angle of 3 ° or less from true parallel.

  Further, by configuring the electric element mounting portion 23 as described above, the distribution of stress generated by mounting the electric element 5 on the electric element mounting portion 23 tends to be relatively uniform. For this reason, the deformation of the core portion 14 due to the stress concentration can be suppressed, and the transmission efficiency of the core portion 14 can be suppressed from decreasing.

  Moreover, it is preferable that the electrical wiring 25 includes a portion configured such that the extending direction thereof is substantially orthogonal to the extending direction of the core portion 14. By configuring the electrical wiring 25 in this way, the line length of the electrical wiring 25 can be further shortened, the optical module 1000 can be miniaturized, and the amount of heat generated from the electrical wiring 25 can be further suppressed. . In addition, there is an advantage that the amount of electromagnetic noise generated from the electrical wiring 25 can be suppressed.

  Note that “substantially orthogonal” means a state in which the extending direction of the electrical wiring 25 and the extending direction of the core portion 14 are not more than 3 ° from the true orthogonal.

  Moreover, it is preferable that the part occupies 50% or more of the length of the electric wiring 25. Furthermore, the said part is located at least in each land part 231 side among the electrical wiring 25, The said effect is acquired more reliably.

  The number of land portions 231 provided in one electric element mounting portion 23 is not particularly limited, but is preferably about 4 to 200.

(Optical element)
The optical module 1000 shown in FIG. 1 includes four optical elements 4. Each optical element 4 is provided with three light emitting / receiving sections 40 (see FIG. 3). The light emitting / receiving unit 40 is optically connected to the inclined surface 171 of the optical waveguide 1 through a through hole 210 (see FIG. 3) provided in the insulating substrate 21. Thereby, for example, the light emitted from the light emitting / receiving unit 40 is reflected by the inclined surface 171 through the through-hole 210 and enters the core unit 14. On the other hand, when the light incident on the core portion 14 is reflected by the inclined surface 171, the reflected light enters the light emitting / receiving portion 40 through the through hole 210.

  Further, the position of the inclined surface 171 provided in the optical waveguide 1 corresponds to the arrangement of these optical elements 4. Therefore, the positions of the end portions of the core portions 14 are also set so as to shift in the longitudinal direction in accordance with the position of the inclined surface 171.

  The light emitting / receiving unit 40 only needs to have a function as a light emitting unit or a light receiving unit, and may have both functions.

  When the light emitting / receiving unit 40 has a function as a light emitting unit, as the optical element 4, for example, light emission from a surface emitting laser (VCSEL), a laser diode (LD), a light emitting diode (LED), an organic EL element, or the like. An element is mentioned.

  On the other hand, when the light emitting / receiving section 40 has a function as a light receiving section, examples of the optical element 4 include a light receiving element such as a photodiode (PD, APD).

  Therefore, a light emitting element may be mounted on all of the four optical element mounting portions 22, and a light receiving element may be mounted on all of them.

  The light emitting element and the light receiving element may be mounted so as to coexist. That is, the optical module member 100 includes an optical element mounting part (light emitting element mounting part) 22 on which a light emitting element can be mounted as the optical element 4 and an optical element mounting part (receiving element mounting) on which a light receiving element can be mounted as the optical element 4. Part) 22. Thereby, one optical module 1000 can perform bidirectional optical communication.

  Moreover, the mounting method of the optical element 4 to the optical element mounting portion 22 is not particularly limited, and may be a flip chip bonding method, a die bonding method, a wire bonding method, or the like.

(Electrical element)
The electric element 5 is an element that drives the optical element 4 or amplifies a signal received by the optical element 4.

  For example, in the case where a light emitting element is mounted as the optical element 4 on the optical element mounting part 22, the electric element mounting part 23 electrically connected to the optical element mounting part 22 has an electric function of driving the light emitting element. Element 5 is mounted. Specifically, a driving element such as a driver IC (LDD) can be used.

  On the other hand, when the light receiving element is mounted as the optical element 4 on the optical element mounting part 22, the electric element mounting part 23 electrically connected to the optical element mounting part 22 is converted from the optical signal by the light receiving element. An electric element 5 having a function of amplifying an electric signal is mounted. Specifically, a signal amplifying element such as a transimpedance amplifier (TIA), a limiting amplifier (LA), or a combination IC in which these functions are integrated can be used.

  As described above, when the light emitting element and the light receiving element are mixedly mounted on the optical module member 100, the optical module member 100 can be mounted with an electric element that can mount a driving element that drives the light emitting element as the electric element 5. A mounting portion (driving element mounting portion) 23 and an electric element mounting portion (signal amplifying element mounting portion) 23 capable of mounting a signal amplifying element that amplifies a signal from the light receiving element as the electric element 5 are provided. preferable. Thereby, one optical module 1000 can perform bidirectional optical communication.

  Moreover, the mounting method of the electric element 5 with respect to the electric element mounting part 23 is not specifically limited, However, The method similar to the mounting method of the optical element 4 mentioned above is used.

  The photoelectric conversion substrate 2 includes electronic components other than these elements as required, such as a CPU (Central Processing Unit), an MPU (Microprocessor Unit), an LSI, an IC, a RAM, a ROM, a capacitor, and a coil. Various active elements such as resistors and diodes and various passive elements may be mounted.

  The optical module 1000 and the optical module member 100 according to the present embodiment have been described above, but the number of photoelectric conversion substrates 2 provided in one optical module 1000 may be two or more. That is, the photoelectric conversion substrate 2 may be provided in place of the optical connector 6.

  Moreover, the number of the optical element mounting part 22 and the electric element mounting part 23 provided in one photoelectric conversion board | substrate 2 is not specifically limited, One may be sufficient and it is plural (for example, about 2-20), Also good.

<< Second Embodiment >>
Next, a second embodiment of the optical module of the present invention and a second embodiment of the optical module member of the present invention will be described.

  FIG. 7 is a plan view showing a second embodiment of the optical module member of the present invention. In FIG. 7, the optical waveguide behind the member is indicated by a dotted line. The same reference numerals are given to the same components as those of the optical module and the optical module member described above.

Hereinafter, although 2nd Embodiment is described, in the following description, it demonstrates centering around difference with 1st Embodiment, The description is abbreviate | omitted about the same matter.
The second embodiment is the same as the first embodiment except that the configuration of the photoelectric conversion substrate 2 is different.

  The photoelectric conversion substrate 2 shown in FIG. 7 includes four optical element mounting portions 22 and two electric element mounting portions 23. Therefore, it differs from the first embodiment in that the number of optical element mounting portions 22 and the number of electric element mounting portions 23 are different.

  Of the two electric element mounting parts 23, the one located on the optical connector 6 side is the electric element mounting part 23a, and the other is the electric element mounting part 23b. The electric element mounting part 23a and the electric element mounting part 23b are respectively Two optical element mounting portions 22 are electrically connected to each other.

  The optical elements 4 having the same function are mounted on the two optical element mounting sections 22 connected to the electric element mounting section 23a. That is, two light emitting elements or two light receiving elements are mounted. Similarly, two light emitting elements or two light receiving elements are also mounted on the two optical element mounting portions 22 connected to the electric element mounting portion 23b.

  In this embodiment, since one electric element 5 is allocated to two optical elements 4, the number of electric element mounting portions 23 can be reduced accordingly. Thereby, the member 100 for optical modules can be reduced more in size.

In the case of the present embodiment, two optical elements 4 (light emitting elements) are simultaneously driven in the two electric element mounting portions 23a and 23b, respectively, or from the two optical elements 4 (light receiving elements). The electric element 5 capable of simultaneously amplifying these signals is mounted.
In the second embodiment as described above, the same operations and effects as in the first embodiment can be obtained.

«Third embodiment»
Next, a third embodiment of the optical module of the present invention will be described.

  FIG. 8 is a perspective view showing a third embodiment of the optical module of the present invention, and FIG. 9 is a sectional view taken along the line CC of FIG. In FIG. 8, the optical waveguide behind the member is indicated by a dotted line.

Hereinafter, the third embodiment will be described. In the following description, differences from the first embodiment will be mainly described, and description of similar matters will be omitted.
The third embodiment is the same as the first embodiment except that an electric circuit board 7 is further provided.

  An optical module 1000 ′ illustrated in FIG. 8 includes the optical module 1000 according to the first embodiment and the electric circuit board 7, and these are electrically connected. In such an optical module 1000 ′, an electric circuit formed on the photoelectric conversion board 2 and an electric circuit (not shown) provided on the electric circuit board 7 are electrically connected. For example, the electric circuit board The operation of the electric element 5 mounted on the photoelectric conversion substrate 2 can be controlled from the 7 side. As a result, the optical module 1000 ′ is a device including the electric circuit board 7 and an interface for inputting and outputting an electric signal processed in the electric circuit board 7 as an optical signal.

  The photoelectric conversion substrate 2 and the electric circuit substrate 7 are electrically and mechanically connected via bumps 8 as shown in FIG.

  The electric circuit board 7 is a board on which an electric circuit is formed, and various active elements such as CPU, MPU, LSI, IC, RAM, ROM, capacitor, coil, resistor, diode, etc. Various electrical connectors and the like may be mounted.

  In such an optical module 1000 ′, problems such as noise and signal degradation peculiar to electric signals are eliminated, so that the signal processing speed can be improved. In addition, since heat generation due to Joule heat is suppressed in the optical waveguide portion, power required for cooling can be reduced, and power consumption of the optical module 1000 ′ can be reduced.

The electric circuit board 7 shown in FIG. 9 is a so-called build-up board, and is formed by alternately laminating insulating layers 71 and conductor layers 72 and providing a solder resist layer 73 on the surface. The conductor layer 72 is patterned to form electrical wiring. Although not shown, a through wiring is formed in the insulating layer 71, and the electrical wiring is electrically connected through the through wiring.
Examples of the constituent material of the conductor layer 72 include the conductive materials described above.

  On the other hand, examples of the constituent material of the insulating layer 71 include silicon compounds such as silicon oxide and silicon nitride, resin materials such as polyimide resins and epoxy resins, and the like.

  Further, the electric circuit board 7 is not limited to the build-up board as described above, and may be a single-layer electric wiring board (rigid board), for example, a single-layer polyimide board, a polyester board, or an aramid film board. Such various flexible substrates may be used. In addition, the build-up board may include a core board as necessary. As the electric circuit board 7, for example, what is called a mother board or a main board may be used.

  The configuration of the solder resist layer 73 is the same as the configuration of the solder resist layer 29 described above.

  Further, in the optical module 1000 ′, as shown in FIG. 9, the optical waveguide 1 is sandwiched between the photoelectric conversion substrate 2 and the electric circuit substrate 7. With such a configuration, since the optical waveguide 1 can be surrounded by the electric substrate, the optical waveguide 1 can be protected from an external force, and the reliability of the optical module 1000 ′ can be further improved.

  In addition, also in 3rd Embodiment, the effect | action and effect similar to 1st, 2nd embodiment are acquired.

<Electronic equipment>
In the optical module of the present invention as described above, as described above, even if the density of the electrical wiring is increased, the transmission efficiency in the optical waveguide is not easily lowered. It is possible to achieve compatibility with For this reason, by providing such an optical module, it is possible to obtain a highly reliable electronic device that can perform high-quality optical communication despite its small size.

  Examples of the electronic device including the optical module of the present invention include electronic devices such as a mobile phone, a game machine, a router device, a WDM device, a personal computer, a television, and a home server. In any of these electronic devices, it is necessary to transmit a large amount of data at high speed between an arithmetic device such as an LSI and a storage device such as a RAM. Therefore, by providing such an electronic device with the optical module of the present invention, problems such as noise and signal degradation peculiar to electric wiring are eliminated, and a dramatic improvement in performance can be expected.

  In addition, the amount of heat generated in the optical waveguide portion is greatly reduced compared to electrical wiring. For this reason, the electric power required for cooling can be reduced and the power consumption of the whole electronic device can be reduced.

  As mentioned above, although this invention was demonstrated based on embodiment of illustration, this invention is not limited to these.

  For example, the optical waveguide according to the present invention may have a multilayer structure instead of a single layer structure.

  Moreover, the member for optical modules and the optical module according to the present invention may be a combination of two or more of the above embodiments. Furthermore, an arbitrary structure may be added to each of the embodiments or a combination thereof.

Next, specific examples of the present invention will be described.
1. Production of optical module (Example 1)
First, an optical module member shown in FIG. 6 was prepared. In addition, what used acrylic resin as the main material was used for the optical waveguide.

  Next, two surface emitting laser diode (VCSEL) arrays and two photodiode (PD) arrays were mounted on the optical module member. Two laser diode driver ICs and two limiting amplifiers were mounted. Thereby, the optical module shown in FIG. 1 was obtained.

  The distance d1 between the end portion of the electric element mounting portion and the outermost core portion in the optical module member was 0.05 mm.

(Examples 2 to 6)
The optical module shown in FIG. 1 was obtained in the same manner as in Example 1 except that the distance d1 was changed to the value shown in Table 1.

(Example 7)
An optical module was obtained in the same manner as in Example 1 except for the following changes.
First, an optical module member shown in FIG. 7 was prepared.

  Next, two surface emitting laser diode arrays and two photodiode arrays were mounted on the optical module member. Also, one laser diode driver IC and two limiting amplifiers were mounted. Thereby, an optical module was obtained.

  The distance d1 between the end portion of the electric element mounting portion and the outermost core portion in the optical module member was 1.0 mm.

(Comparative example)
FIG. 10 is a plan view showing an optical module member corresponding to a comparative example. In FIG. 10, the optical waveguide behind the member is indicated by a dotted line.

  First, an optical module member 900 shown in FIG. 10 was prepared. The optical module member 900 is the same as the optical module member 100 shown in FIG. 6 except for the configuration described below.

  That is, the optical module member 900 includes an optical waveguide 9 similar to the optical waveguide 1 and a photoelectric conversion substrate 92 stacked on one end thereof. An optical connector 96 is attached to the other end of the optical module member 900. In addition, twelve core portions 914 that are arranged in parallel are formed in the optical waveguide 9.

  The photoelectric conversion substrate 92 includes an insulating substrate 921, an optical element mounting portion 922 on which an optical element can be mounted, an electric element mounting portion 923 on which an electric element can be mounted, and a filled via 9211. The optical element mounting portion 922 includes a plurality of land portions 9221 for fixing the terminals of the optical elements. Similarly, the electric element mounting portion 923 includes a plurality of land portions 9231 for fixing the terminals of the electric elements. Each land portion 9221 and each land portion 9231 are electrically connected via electric wiring 924, and each land portion 9231 and filled via 9211 are electrically connected via electric wiring 925.

  In such an optical module member 900, the core portion 14 and the electric wiring 925 intersect each other in plan view.

  Two surface emitting laser diode arrays and two photodiode arrays were mounted on such an optical module member 900. Two laser diode driver ICs and two limiting amplifiers were mounted. Thereby, an optical module was obtained.

2. Evaluation of Optical Module Next, in the optical modules obtained in each Example and Comparative Example, a rated current was passed through the surface emitting laser diode array and left as it was for 96 hours.

  Then, the insertion loss immediately after the start of energization, the insertion loss after 24 hours of energization, and the insertion loss after 96 hours of energization were measured, and the amount of change in insertion loss was evaluated according to the following evaluation criteria.

<Evaluation of change in insertion loss>
A: Change amount of insertion loss is very small B: Change amount of insertion loss is small C: Change amount of insertion loss is slightly small D: Change amount of insertion loss is slightly large E: Change amount of insertion loss is large F : Very large change in insertion loss Table 1 shows the above evaluation results.

  As is clear from Table 1, in the optical modules obtained in each example, the amount of change in insertion loss was small even after 96 hours of energization. In particular, the tendency was remarkable in the optical modules obtained in Examples 2 to 6.

  On the other hand, in the optical modules obtained in the respective comparative examples, the insertion loss slightly increased after 24 hours of energization, and the insertion loss increased at an accelerated rate after 96 hours of energization.

  From the above, according to the present invention, it has been clarified that an optical module capable of performing high-quality optical communication can be obtained even when energized continuously for a long period of time.

DESCRIPTION OF SYMBOLS 1 Optical waveguide 10 Laminated body 100 Optical module member 1000 Optical module 1000 'Optical module 2 Photoelectric conversion board 4 Optical element 40 Light emitting / receiving part 5 Electric element 6 Optical connector 7 Electric circuit board 71 Insulating layer 72 Conductor layer 73 Solder resist layer 8 Bump 11 Cladding layer 12 Cladding layer 13 Core layer 14 Core portion 15 Side cladding portion 170 Recess 171 Inclined surface 172 Upright surface 173 Upright surface 21 Insulating substrate 210 Through hole 211 Filled via 22 Optical element mounting portion 221 Land portion 23 Electric element mounting portion 23a Electric element mounting portion 23b Electric element mounting portion 231 Land portion 24 Electric wiring 25 Electric wiring 28 Electric wiring 29 Solder resist layer 9 Optical waveguide 900 Optical module member 914 Core portion 92 Photoelectric conversion substrate 921 Insulating substrate 9211 Filled via 922 Optical element powered by 9221 land portion 923 electric device mounting portion 9231 land portion 924 electric wiring 925 electrically interconnect 96 optical connectors

Claims (9)

A layered optical waveguide with a long core, and
A photoelectric conversion substrate laminated on the optical waveguide, the insulating substrate, and an optical element mounting portion provided on the insulating substrate and capable of mounting an optical element so as to be optically connected to the optical waveguide; An electric element mounting portion provided on the insulating substrate and capable of mounting an electric element; a first electric wiring for electrically connecting the optical element mounting portion and the electric element mounting portion; and the electric element A photoelectric conversion substrate comprising: a second electrical wiring drawn from the mounting portion;
Have
An optical module member configured so that the core portion and the second electric wiring do not overlap when viewed in plan with respect to a plane including the optical waveguide.   The optical module member according to claim 1, wherein the optical waveguide includes a plurality of the core portions arranged in parallel.   3. The optical module according to claim 2, wherein an end portion of the electric element mounting portion is positioned further outward than an outermost one of the parallel core portions in the plan view. Element.   The optical module member according to claim 3, wherein a distance between an end portion of the electric element mounting portion and an outermost one of the plurality of parallel core portions is 0.05 to 10 mm.   5. The optical module member according to claim 3, wherein the second electrical wiring is led out from the end portion of the electrical element mounting portion.   6. The optical module member according to claim 3, wherein an extending direction of the second electric wiring is substantially orthogonal to an extending direction of the core portion. The photoelectric conversion substrate is
As the optical element mounting part, a light emitting element mounting part capable of mounting a light emitting element, and a light receiving element mounting part capable of mounting a light receiving element,
2. The electric element mounting section includes a driving element mounting section for driving the light emitting element and a signal amplifying element mounting section on which a signal amplifying element for amplifying a signal from the light receiving element can be mounted. The member for optical modules of any one of 6. An optical module member according to any one of claims 1 to 7,
An optical element mounted on the optical element mounting portion;
An electric element mounted on the electric element mounting portion;
An optical module comprising:   An electronic apparatus comprising the optical module according to claim 8.

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