JP2015046449A - Substrate processing method, substrate processing system and storage medium - Google Patents

Abstract

PROBLEM TO BE SOLVED: To remove a hard mask without giving damage to metal wiring.SOLUTION: A substrate processing method includes: a process liquid supply step; a chemical liquid supply step; and a removal liquid supply step. In the process liquid supply step, the process liquid containing a volatile component and used for forming a film on a substrate is supplied to the substrate in which a hard mask is formed on the surface and at least a part of metal wiring formed inside is exposed, and the exposed surface of the metal wiring is covered. In the chemical supply step, a predetermined chemical liquid for dissolving the hard mask is supplied to the substrate having the process liquid solidified or cured by volatilization of the volatile component. In the removal liquid supply step, the removal liquid for removing the process liquid is supplied to the process liquid solidified or cured after the chemical liquid supply step.

Description

  Embodiments disclosed herein relate to a substrate processing method, a substrate processing system, and a storage medium.

  Conventionally, a dry etching process is known in which dry etching is performed in a state where the surface of a substrate is masked with a hard mask such as TiN (titanium nitride) in order to expose a metal wiring formed inside a substrate such as a semiconductor wafer. (See Patent Document 1).

  Thereafter, the hard mask removing liquid is supplied to the substrate with the metal wiring exposed, whereby the hard mask on the substrate surface is removed.

JP 2010-027786 A

  However, there is a possibility that the exposed metal wiring may be damaged by corrosion or the like by the hard mask removing liquid for removing the hard mask.

  An object of one embodiment is to provide a substrate processing method, a substrate processing system, and a storage medium that can remove a hard mask without damaging a metal wiring.

  The substrate processing method which concerns on the one aspect | mode of embodiment contains a process liquid supply process, a chemical | medical solution supply process, and a removal liquid supply process. In the treatment liquid supply step, a treatment liquid for forming a film on the substrate containing a volatile component is supplied to the substrate on which a hard mask is formed on the surface and at least a part of the metal wiring formed inside is exposed. And cover the exposed metal wiring surface. In the chemical solution supplying step, a predetermined chemical solution for dissolving the hard mask is supplied to the substrate on which the processing solution is solidified or hardened by volatilization of the volatile component. In the removal liquid supply step, after the chemical solution supply step, a removal liquid for removing the treatment liquid is supplied to the solidified or hardened treatment liquid.

  According to one aspect of the embodiment, the hard mask can be removed without damaging the metal wiring.

FIG. 1A is an explanatory diagram of a substrate processing method according to the present embodiment. FIG. 1B is an explanatory diagram of the substrate processing method according to the present embodiment. FIG. 1C is an explanatory diagram of the substrate processing method according to the present embodiment. FIG. 2 is a diagram showing a schematic configuration of the substrate processing system according to the present embodiment. FIG. 3 is a diagram showing a schematic configuration of the first processing apparatus. FIG. 4 is a diagram illustrating a schematic configuration of the second processing apparatus. FIG. 5 is a schematic diagram showing an example of the configuration of the dry etching unit. FIG. 6 is a schematic diagram illustrating an example of the configuration of the first liquid processing unit. FIG. 7 is a schematic diagram showing an example of the configuration of the second liquid processing unit. FIG. 8 is a flowchart showing the processing procedure of the substrate processing according to the present embodiment. FIG. 9A is an explanatory diagram of substrate processing. FIG. 9B is an explanatory diagram of substrate processing. FIG. 9C is an explanatory diagram of substrate processing. FIG. 9D is an explanatory diagram of substrate processing. FIG. 9E is an explanatory diagram of substrate processing.

  Hereinafter, embodiments of a substrate processing method, a substrate processing system, and a storage medium disclosed in the present application will be described in detail with reference to the accompanying drawings. In addition, this invention is not limited by embodiment shown below.

<Contents of substrate processing method>
First, the substrate processing method according to the present embodiment will be described with reference to FIGS. 1A to 1C. 1A to 1C are explanatory views of a substrate processing method according to this embodiment.

  The substrate processing method according to the present embodiment protects exposed metal wiring with a film when a hard mask formed on the surface of a substrate such as a semiconductor wafer (hereinafter referred to as wafer W) is removed with a chemical solution. Thus, the hard mask is removed without damaging the metal wiring.

  As shown in FIG. 1A, the wafer W includes, for example, a wiring layer 101, a liner film 103, an interlayer insulating film 104, and a hard mask 105. These are laminated in the order of the wiring layer 101, liner film 103, interlayer insulating film 104, and hard mask 105.

  In the wiring layer 101, a Cu wiring 102 which is an example of a metal wiring is formed. The hard mask 105 is made of a metal such as TiN (titanium nitride).

  Further, the wafer W has a via hole 106. The via hole 106 is formed by dry etching using the hard mask 105 as a mask. The via hole 106 reaches the wiring layer 101, and the surface of the Cu wiring 102 is exposed from the bottom of the via hole 106.

  In the substrate processing method according to the present embodiment, as shown in FIG. 1A, a processing liquid containing a volatile component and forming a film on the wafer W (hereinafter referred to as “film forming processing liquid”) is used as the wafer W. Then, the exposed surface of the Cu wiring 102 is covered with a film-forming treatment liquid. Specifically, in this embodiment, a film-forming treatment liquid (hereinafter referred to as “topcoat liquid”) for forming a topcoat film on the wafer W is supplied onto the wafer W.

  Here, the top coat film is a protective film applied to the upper surface of the resist film in order to prevent the immersion liquid from entering the resist film. The immersion liquid is a liquid used for immersion exposure in a lithography process, for example.

  The topcoat liquid supplied onto the wafer W is solidified or cured while causing volume shrinkage due to volatilization of volatile components contained therein, and becomes a topcoat film (see FIG. 1B). The topcoat liquid contains an acrylic resin having a property that the volume shrinks when solidifying or curing, and the volume shrinkage of the topcoat liquid is also caused by the curing shrinkage of the acrylic resin. As used herein, “solidification” means solidification, and “curing” means that molecules are connected to each other to become a polymer (for example, crosslinking or polymerization).

  Thereafter, a chemical solution for dissolving the hard mask 105 is supplied to the wafer W as shown in FIG. 1B. As a result, the hard mask 105 is removed from the wafer W as shown in FIG. 1C. At this time, since the surface of the Cu wiring 102 is covered with the top coat film, it is not damaged by the chemical solution such as corrosion.

  As described above, according to the substrate processing method according to the present embodiment, the hard mask 105 is removed in a state where the exposed Cu wiring 102 is protected by the top coat film. The mask 105 can be removed.

  In the substrate processing method according to the present embodiment, the top coat film formed on the wafer W is removed to remove a reaction product such as a polymer generated by dry etching or ashing.

  Specifically, a removal liquid for removing the topcoat film is supplied onto the topcoat film. In the present embodiment, an alkaline developer is used as the remover.

  The top coat film is peeled off from the wafer W by supplying the alkali developer. At this time, the reaction product remaining on the wafer W is also peeled off from the wafer W together with the top coat film. Thereby, the reaction product can be removed from the wafer W.

  As described above, according to the substrate processing method according to the present embodiment, the reaction product can be removed without using a chemical action, so that damage to the Cu wiring 102 due to an etching action or the like can be suppressed. .

  Therefore, according to the substrate processing method of the present embodiment, the reaction product remaining on the wafer W after dry etching or ashing can be removed while suppressing damage to the wafer W. Furthermore, since it can be Q-time free, it is possible to improve productivity and yield. The top coat film is completely removed from the wafer W without being subjected to pattern exposure after being formed on the wafer W.

  The top coat liquid is solidified or cured while causing volume shrinkage to form a top coat film. The reaction product remaining on the wafer W can be separated from the wafer W also by strain (tensile force) caused by the volume shrinkage of the top coat liquid at this time.

  The topcoat liquid causes volume shrinkage due to volatilization of the volatile components and curing shrinkage of the acrylic resin. Therefore, the volumetric shrinkage is larger than that of the film-forming treatment liquid containing only the volatile components, and the reaction product is strongly separated. Can do. In particular, the acrylic resin has a larger cure shrinkage than other resins such as an epoxy resin, and therefore the topcoat liquid is effective in that it gives a tensile force to the reaction product.

  Further, the top coat film swells when it is peeled off by the alkali developer. For this reason, according to the substrate processing method according to the present embodiment, the reaction product can be strongly separated from the wafer W not only by volume shrinkage due to volatilization of the topcoat film but also by volume expansion due to swelling of the topcoat film. .

  Moreover, in this embodiment, it is supposed that the removal efficiency of a reaction product will be improved by using what has alkalinity as a removal liquid.

  By supplying the alkali developer, a zeta potential having the same polarity is generated on the surface of the wafer W and the surface of the reaction product. The reaction product separated from the wafer W due to the change in the volume of the topcoat liquid is charged with a zeta potential having the same polarity as that of the wafer W, so that it repels the wafer W. Thereby, reattachment of the reaction product to the wafer W is prevented.

  In this way, after the reaction product is pulled away from the wafer W or the like using the volume shrinkage of the topcoat liquid, the reaction product is regenerated by generating a zeta potential of the same polarity in the wafer W and the reaction product. Since adhesion is prevented, the removal efficiency of the reaction product can be increased.

  The alkaline developer may contain at least one of ammonia, tetramethylammonium hydroxide (TMAH), and an aqueous choline solution, for example.

  Further, according to the substrate processing method according to the present embodiment, it is possible to easily remove reaction products that have entered the via hole 106, which has been difficult to remove by a cleaning method using physical force, for example.

  Note that the top coat film formed on the wafer W is finally all removed from the wafer W. Therefore, the wafer W after the top coat film is removed is in a state before the top coat liquid is supplied, that is, the Cu wiring 102 and the hard mask 105 are exposed.

<Configuration of substrate processing system>
Next, a configuration of a substrate processing system that executes the above-described substrate processing method will be described with reference to FIG. FIG. 2 is a diagram showing a schematic configuration of the substrate processing system according to the present embodiment.

  As shown in FIG. 2, the substrate processing system 1 according to the present embodiment includes a first processing apparatus 2, a second processing apparatus 3, a first control apparatus 4A, and a second control apparatus 4B.

  The first processing apparatus 2 performs dry etching and topcoat liquid supply to the wafer W. Further, the second processing apparatus 3 supplies an alkaline developer to the wafer W processed by the first processing apparatus 2.

  4A of 1st control apparatuses are computers, for example, and are provided with the control part 401 and the memory | storage part 402. FIG. The storage unit 402 stores a program for controlling various processes executed in the first processing device 2. The control unit 401 controls the operation of the first processing device 2 by reading and executing the program stored in the storage unit 402.

  Similarly, the 2nd control apparatus 4B is a computer, for example, and is provided with the control part 403 and the memory | storage part 404. FIG. The storage unit 404 stores a program for controlling various processes executed in the second processing device 3. The control unit 403 controls the operation of the second processing device 3 by reading and executing the program stored in the storage unit 404.

  These programs are recorded in a computer-readable storage medium, and are installed in the storage unit 402 of the first control device 4A and the storage unit 404 of the second control device 4B from the storage medium. It may be. Examples of the computer-readable storage medium include a hard disk (HD), a flexible disk (FD), a compact disk (CD), a magnetic optical disk (MO), and a memory card.

<Configuration of first processing apparatus>
Next, the configuration of the first processing apparatus 2 will be described with reference to FIG. FIG. 3 is a diagram showing a schematic configuration of the first processing apparatus 2. In the following, in order to clarify the positional relationship, the X axis, the Y axis, and the Z axis that are orthogonal to each other are defined, and the positive direction of the Z axis is the vertically upward direction.

  As shown in FIG. 3, the first processing apparatus 2 includes a carry-in / out station 5 and a processing station 6. The carry-in / out station 5 and the processing station 6 are provided adjacent to each other.

  The carry-in / out station 5 includes a carrier placement unit 10 and a transport unit 11. On the carrier mounting unit 10, a plurality of transfer containers (hereinafter referred to as carriers C) that store a plurality of wafers W in a horizontal state are mounted.

  The transport unit 11 is provided adjacent to the carrier placement unit 10 and includes a substrate transport device 111 therein. The substrate transfer device 111 includes a wafer holding mechanism that holds the wafer W. Further, the substrate transfer device 111 can move in the horizontal direction and the vertical direction and can turn around the vertical axis, and transfers the wafer W between the carrier C and the processing station 6 using the wafer holding mechanism. Do.

  The processing station 6 is provided adjacent to the transport unit 11. The processing station 6 includes a dry etching unit 12, a load lock chamber 13, a first liquid processing unit 14, and an etch back unit 15.

  In the first processing apparatus 2, the substrate transfer device 111 in the loading / unloading station 5 takes out the wafer W from the carrier C placed on the carrier placement unit 10, and takes the taken out wafer W to the dry etching unit 12 in the processing station 6. Carry in.

  In the dry etching unit 12, a dry etching process is performed on the wafer W loaded by the substrate transfer device 111. As a result, a via hole 106 is formed and the Cu wiring 102 inside the wafer W is exposed.

  Note that the dry etching process is performed in a reduced pressure state. In the dry etching unit 12, an ashing process for removing unnecessary resist may be performed after the dry etching process.

  The wafer W that has been processed in the dry etching unit 12 is carried into the first liquid processing unit 14 via the load lock chamber 13. The load lock chamber 13 is configured so that the internal pressure can be switched between an atmospheric pressure state and a reduced pressure state. A substrate transfer device (not shown) is provided inside the load lock chamber 13.

  The wafer W after the dry etching process or the ashing process is unloaded from the dry etching unit 12 by a substrate transfer device (not shown) in the load lock chamber 13 and is loaded into the first liquid processing unit 14.

  Specifically, the inside of the load lock chamber 13 is kept under reduced pressure until the wafer W is unloaded from the dry etching unit 12, and after the unloading is completed, an inert gas such as nitrogen or argon is supplied. To switch to atmospheric pressure. Then, after switching to the atmospheric pressure state, a substrate transfer device (not shown) in the load lock chamber 13 carries the wafer W into the first liquid processing unit 14.

  As described above, since the wafer W is cut off from the outside air until it is transferred from the dry etching unit 12 to the first liquid processing unit 14, oxidation of the exposed Cu wiring 102 is prevented.

  Subsequently, in the first liquid processing unit 14, a film forming processing liquid supply process for supplying a topcoat liquid to the wafer W is performed. As described above, the top coat liquid supplied to the wafer W is solidified or cured while causing volume shrinkage to form a top coat film. As a result, the exposed Cu wiring 102 is covered with the top coat film.

  Subsequently, the wafer W is taken out from the first liquid processing unit 14 by the substrate transfer device 111 and carried into the etch back unit 15. In the etch back unit 15, an etch back process is performed in which a part of the top coat film formed on the wafer W is removed by dry etching to expose the hard mask 105.

  Then, the wafer W after the etch-back process is unloaded from the etch-back unit 15 by the substrate transfer device 111 and accommodated in the carrier C of the carrier platform 10. Thereafter, the carrier C is transported to the second processing apparatus 3.

<Configuration of second processing apparatus>
Next, the configuration of the second processing apparatus 3 will be described with reference to FIG. FIG. 4 is a diagram showing a schematic configuration of the second processing apparatus 3.

  As shown in FIG. 4, the second processing device 3 includes a carry-in / out station 7 and a processing station 8. The carry-in / out station 7 and the processing station 8 are provided adjacent to each other.

  The carry-in / out station 7 includes a carrier placement unit 16 and a transport unit 17. A plurality of carriers C are placed on the carrier placement unit 16.

  The transport unit 17 is provided adjacent to the carrier placement unit 16 and includes a substrate transport device 171 and a delivery unit 172 therein. The substrate transfer device 171 includes a wafer holding mechanism that holds the wafer W. Further, the substrate transfer device 171 can move in the horizontal direction and the vertical direction and turn around the vertical axis, and transfers the wafer W between the carrier C and the delivery unit 172 using the wafer holding mechanism. Do.

  The processing station 8 is provided adjacent to the transfer unit 17. The processing station 8 includes a transport unit 18 and a plurality of second liquid processing units 19. The plurality of second liquid processing units 19 are provided side by side on both sides of the transport unit 18.

  The transport unit 18 includes a substrate transport device 181 inside. The substrate transfer device 181 includes a wafer holding mechanism that holds the wafer W. Further, the substrate transfer device 181 can move in the horizontal direction and the vertical direction and can turn around the vertical axis, and the wafer is transferred between the delivery unit 172 and the second liquid processing unit 19 using a wafer holding mechanism. W is transported.

  In the second processing apparatus 3, the substrate transfer apparatus 171 of the loading / unloading station 7 takes out the wafer W processed by the first processing apparatus 2 from the carrier C and places the taken wafer W on the delivery unit 172. The wafer W placed on the delivery unit 172 is taken out from the delivery unit 172 by the substrate transfer device 181 of the processing station 8 and carried into the second liquid processing unit 19.

  In the second liquid processing unit 19, a process of supplying a chemical solution to remove the hard mask 105, a process of supplying an alkali developer to remove the top coat film, and the like are performed on the wafer W. Thereby, the hard mask 105 is removed and the top coat film is removed. Further, the reaction product P remaining on the wafer W is removed as the top coat film is peeled off.

  Thereafter, the wafer W is unloaded from the second liquid processing unit 19 by the substrate transfer device 181 and placed on the delivery unit 172. Then, the processed wafer W placed on the delivery unit 172 is returned to the carrier C of the carrier platform 16 by the substrate transfer device 171.

<Configuration of dry etching unit>
Next, the configuration of the dry etching unit 12 included in the first processing apparatus 2 will be described with reference to FIG. FIG. 5 is a schematic diagram illustrating an example of the configuration of the dry etching unit 12.

  As shown in FIG. 5, the dry etching unit 12 includes a chamber 201 having a sealed structure that accommodates the wafer W, and a mounting table 202 for mounting the wafer W in a horizontal state is provided in the chamber 201. The mounting table 202 includes a temperature adjustment mechanism 203 that adjusts the wafer W to a predetermined temperature by cooling or heating the wafer W. A loading / unloading port (not shown) for loading / unloading the wafer W to / from the load lock chamber 13 is provided on the side wall of the chamber 201.

  A shower head 204 is provided on the ceiling of the chamber 201. A gas supply pipe 205 is connected to the shower head 204. An etching gas supply source 207 is connected to the gas supply pipe 205 via a valve 206, and a predetermined etching gas is supplied from the etching gas supply source 207 to the shower head 204. The shower head 204 supplies the etching gas supplied from the etching gas supply source 207 into the chamber 201.

  The etching gas supplied from the etching gas supply source 207 is, for example, CH3F gas, CH2F2 gas, CF4 gas, O2 gas, Ar gas source, or the like.

  An exhaust device 209 is connected to the bottom of the chamber 201 via an exhaust line 208. The pressure inside the chamber 201 is maintained in a reduced pressure state by the exhaust device 209.

  The dry etching unit 12 is configured as described above, and supplies the etching gas into the chamber 201 from the shower head 204 in a state where the inside of the chamber 201 is depressurized by using the exhaust device 209. The mounted wafer W is dry-etched. As a result, a via hole 106 (see FIG. 1A) is formed in the wafer W, and the Cu wiring 102 is exposed.

  Further, in the dry etching unit 12, for example, after the interlayer insulating film 104 (see FIG. 1A) is dry etched using the resist film as a mask, an ashing process for removing the resist film may be performed.

<Configuration of first liquid processing unit>
Next, the configuration of the first liquid processing unit 14 will be described with reference to FIG. FIG. 6 is a schematic diagram illustrating an example of the configuration of the first liquid processing unit 14.

  As shown in FIG. 6, the first liquid processing unit 14 includes a chamber 20, a substrate holding mechanism 30, liquid supply units 40 </ b> _ <b> 1 and 40 </ b> _ <b> 2, and a recovery cup 50.

  The chamber 20 accommodates the substrate holding mechanism 30, the liquid supply units 40_1 and 40_2, and the recovery cup 50. An FFU (Fan Filter Unit) 21 is provided on the ceiling of the chamber 20. The FFU 21 forms a down flow in the chamber 20.

  An inert gas supply source 23 is connected to the FFU 21 via a valve 22. The FFU 21 discharges an inert gas such as N 2 gas supplied from the inert gas supply source 23 into the chamber 20. Thus, by using an inert gas as the downflow gas, it is possible to prevent the exposed Cu wiring 102 (see FIG. 1A) from being oxidized.

  The substrate holding mechanism 30 includes a rotation holding unit 31 that holds the wafer W in a rotatable manner, and a gas supply unit 32 that is inserted into the hollow portion 314 of the rotation holding unit 31 and supplies gas to the lower surface of the wafer W.

  The rotation holding unit 31 is provided in the approximate center of the chamber 20. A holding member 311 for holding the wafer W from the side surface is provided on the upper surface of the rotation holding unit 31. The wafer W is horizontally held by the holding member 311 while being slightly separated from the upper surface of the rotation holding unit 31.

  The rotation holding unit 31 includes a drive mechanism 312 including a motor and a belt that transmits the rotation of the motor to the rotation holding unit 31. The rotation holding unit 31 is rotated around the vertical axis by the drive mechanism 312. Then, when the rotation holding unit 31 rotates, the wafer W held by the rotation holding unit 31 rotates integrally with the rotation holding unit 31. The rotation holding unit 31 is rotatably supported by the chamber 20 and the recovery cup 50 via a bearing 313.

  The gas supply unit 32 is a long member inserted through a hollow portion 314 formed at the center of the rotation holding unit 31. A flow path 321 is formed inside the gas supply unit 32, and an N 2 supply source 34 is connected to the flow path 321 through a valve 33. The gas supply unit 32 supplies N 2 gas supplied from the N 2 supply source 34 to the lower surface of the wafer W via the valve 33 and the flow path 321.

  The N2 gas supplied through the valve 33 is a high-temperature (for example, about 90 ° C.) N2 gas, and is used for a volatilization promoting process described later.

  When the substrate holding mechanism 30 receives a wafer W from a substrate transfer device (not shown) in the load lock chamber 13, the substrate holding mechanism 30 is placed on the upper surface of the gas supply unit 32 in a state where the gas supply unit 32 is lifted using a lifting mechanism (not shown). The wafer W is placed on the provided support pins (not shown). Thereafter, the substrate holding mechanism 30 lowers the gas supply unit 32 to a predetermined position, and then transfers the wafer W to the holding member 311 of the rotation holding unit 31. In addition, when the processed wafer W is transferred to the substrate transfer apparatus 111, the substrate holding mechanism 30 raises the gas supply unit 32 using a lifting mechanism (not shown), and shows the wafer W held by the holding member 311. Do not place on the support pins. Then, the substrate holding mechanism 30 passes the wafer W placed on support pins (not shown) to the substrate transfer device 111.

  The liquid supply unit 40_1 includes nozzles 41a to 41c, an arm 42 that horizontally supports the nozzles 41a to 41c, and a turning lift mechanism 43 that turns and lifts the arm 42.

  The liquid supply unit 40_1 supplies a predetermined chemical (here, DHF) to the wafer W from the nozzle 41a, supplies DIW (pure water), which is a type of rinse liquid, from the nozzle 41b, and is a type of dry solvent. A certain IPA (isopropyl alcohol) is supplied from the nozzle 41c. DHF is dilute hydrofluoric acid.

  Specifically, a DHF supply source 45a is connected to the nozzle 41a via a valve 44a, a DIW supply source 45b is connected to the nozzle 41b via a valve 44b, and a nozzle 44c is connected via a valve 44c. IPA supply sources 45c are connected to each other. The DHF supplied from the nozzle 41a is diluted hydrofluoric acid diluted to a concentration that does not corrode the Cu wiring 102.

  The liquid supply unit 40_2 includes nozzles 41d and 41e, an arm 42 that horizontally supports the nozzles 41d and 41e, and a turning lift mechanism 43 that turns and lifts the arm 42.

  The liquid supply unit 40_2 supplies the wafer W with MIBC (4-methyl-2-pentanol) as a solvent having an affinity for the topcoat liquid from the nozzle 41d and supplies the topcoat liquid from the nozzle 41e.

  Specifically, a MIBC supply source 45d is connected to the nozzle 41d via a valve 44d, and a topcoat liquid supply source 45e is connected to the nozzle 41e via a valve 44e.

  MIBC is also contained in the topcoat solution and has an affinity for the topcoat solution. For example, PGME (propylene glycol monomethyl ether), PGMEA (propylene glycol monomethyl ether acetate), or the like may be used as a solvent having an affinity with the top coat liquid other than MIBC.

  Here, the dedicated nozzles 41a to 41e are provided for each processing liquid, but the nozzles may be shared by a plurality of processing liquids. However, when the nozzle is shared, for example, when it is not desired to mix the processing liquids, a process of once discharging the processing liquid remaining in the nozzles and the pipes is required, and the processing liquid is consumed wastefully. On the other hand, if the dedicated nozzles 41a to 41e are provided, the process liquid discharging step as described above is not required, and the process liquid is not wasted.

  The collection cup 50 is disposed so as to surround the rotation holding unit 31 and collects the processing liquid scattered from the wafer W by the rotation of the rotation holding unit 31. A drain port 51 is formed at the bottom of the recovery cup 50, and the processing liquid collected by the recovery cup 50 is discharged from the drain port 51 to the outside of the first liquid processing unit 14. Further, an exhaust port 52 for discharging the N 2 gas supplied from the gas supply unit 32 or the inert gas supplied from the FFU 21 to the outside of the first liquid processing unit 14 is formed at the bottom of the recovery cup 50.

<Configuration of etch back unit>
The etch back unit 15 has the same configuration as the dry etching unit 12 described above. The etch back unit 15 performs dry etching on the wafer W on which the top coat film is formed in the first liquid processing unit 14, thereby removing a part of the top coat film and the hard mask 105 (see FIG. 1A). Perform exposure processing to expose the.

<Configuration of second liquid processing unit>
Next, the structure of the 2nd liquid processing unit 19 with which the 2nd processing apparatus 3 is provided is demonstrated with reference to FIG. FIG. 7 is a schematic diagram showing an example of the configuration of the second liquid processing unit 19.

  As shown in FIG. 7, the second liquid processing unit 19 includes a substrate holding mechanism 70, a liquid supply unit 80, and a recovery cup 90 in the chamber 60.

  The substrate holding mechanism 70 includes a rotation holding unit 71, a column unit 72, and a driving unit 73. The rotation holding unit 71 is provided in the approximate center of the chamber 60. A holding member 711 that holds the wafer W from the side surface is provided on the upper surface of the rotation holding unit 71. The wafer W is horizontally held by the holding member 711 while being slightly separated from the upper surface of the rotation holding unit 71. The column portion 72 is a member extending in the vertical direction, and a base end portion thereof is rotatably supported by the drive unit 73 and horizontally supports the rotation holding unit 71 at the distal end portion. The drive unit 73 rotates the support column 72 around the vertical axis.

  The substrate holding mechanism 70 rotates the support 72 by rotating the support 72 by using the driving unit 73, thereby rotating the wafer W held by the support 71. Rotate.

  The liquid supply unit 80 includes nozzles 81 a to 81 c, an arm 82 that horizontally supports the nozzles 81 a to 81 c, and a turning lift mechanism 83 that turns and lifts the arm 82.

  The liquid supply unit 80 supplies a hard mask removing liquid for removing the hard mask 105 from the nozzle 81a to the wafer W, and supplies an alkaline developer as a removing liquid for removing the top coat film from the nozzle 81b. Liquid DIW is supplied from the nozzle 81c.

  Specifically, a hard mask removal liquid supply source 85a is connected to the nozzle 81a via a valve 84a, an alkali developer supply source 85b is connected to the nozzle 81b via a valve 84b, and the nozzle 81c is connected to the nozzle 81c. The DIW supply source 85c is connected via the valve 84c.

  The alkaline developer supplied from the nozzle 81 b contains an anticorrosive agent that prevents corrosion of the Cu wiring 102. As a result, the top coat film can be removed while suppressing damage to the Cu wiring 102 in the removal liquid supply process described later.

  The collection cup 90 is disposed so as to surround the rotation holding unit 71 in order to prevent the treatment liquid from being scattered around. A drain port 91 is formed at the bottom of the recovery cup 90, and the processing liquid collected by the recovery cup 90 is discharged from the drain port 91 to the outside of the second liquid processing unit 19.

<Specific operation of substrate processing system>
Next, a specific operation of the substrate processing system 1 will be described with reference to FIGS. 8 and 9A to 9E. FIG. 8 is a flowchart showing the processing procedure of the substrate processing according to the present embodiment. 9A to 9E are explanatory diagrams of substrate processing.

  9A is an explanatory view of the dry etching process (step S101) in FIG. 8, FIG. 9B is an explanatory view of the film forming process liquid supply process (step S106) in FIG. 8, and FIG. FIG. 9D is an explanatory view of the etch back process (step S107) in FIG. 8, and FIG. 9D is an explanatory view of the hard mask removal process (step S109) in FIG. FIG. 9E shows the wafer W after the removal liquid supply process (step S110) in FIG. Each processing procedure shown in FIG. 8 is performed based on the control of the first control device 4A or the second control device 4B.

  In the substrate processing system 1 according to the present embodiment, the processes from the dry etching process (step S101) to the first carry-out process (step S108) shown in FIG. 8 are performed in the first processing apparatus 2, and the hard mask removal process (step The processing from S109) to the second carry-out processing (step S111) is performed in the second processing device 3.

  As shown in FIG. 8, first, dry etching processing is performed in the dry etching unit 12 (step S101). In the dry etching process, the dry etching unit 12 performs dry etching or ashing on the wafer W. Thereby, the Cu wiring 102 provided inside the wafer W is exposed (see FIG. 9A).

  Subsequently, the wafer W is carried into the first liquid processing unit 14. Since this carrying-in process is performed through the load lock chamber 13, the exposed Cu wiring 102 can be prevented from being oxidized.

  Subsequently, chemical processing is performed in the first liquid processing unit 14 (step S102). In such chemical processing, the nozzle 41a of the liquid supply unit 40_1 (see FIG. 6) is positioned above the center of the wafer W. Thereafter, DHF is supplied to the wafer W from the nozzle 41a. The DHF supplied to the wafer W spreads on the surface of the wafer W due to the centrifugal force accompanying the rotation of the wafer W.

  Thereby, the hard mask 105, the Cu wiring 102, or the surface of the reaction product P is slightly dissolved by DHF, and the adhesion of the reaction product P is weakened. Therefore, the reaction product P can be easily removed.

  Here, the chemical treatment in step S102 is performed for the purpose of facilitating the removal of the reaction product P, and is performed under low etching conditions such that the reaction product P is not completely removed. The low etching conditions are, for example, a time shorter than the etching time required to completely remove the reaction product P, or a DHF concentration lower than the concentration of DHF necessary to completely remove the reaction product P. This is a condition for performing etching at a concentration of.

  For this reason, the reaction product P can be removed more effectively while suppressing damage to the Cu wiring 102 as compared with the conventional case where the reaction product P is removed only by DHF. Further, in the present embodiment, DHF supplied from the nozzle 41a is diluted to a concentration that does not corrode the Cu wiring 102, so that damage to the Cu wiring 102 can be more reliably suppressed.

  In the chemical treatment, the reaction product P having a relatively small particle size is easily removed, and in the removal of the reaction product P using a topcoat solution and an alkali removal solution described later, a reaction product having a relatively large particle size is used. P is easily removed. Therefore, the reaction product P can be more effectively removed by combining these treatments.

  Note that the above low etching conditions are etching conditions that do not completely remove the hard mask 105. The chemical solution supplied from the nozzle 41a is not limited to DHF, and for example, an aqueous solution containing ammonium fluoride, hydrochloric acid, sulfuric acid, hydrogen peroxide solution, phosphoric acid, acetic acid, nitric acid, ammonium hydroxide, organic acid, or ammonium fluoride. Etc.

  Subsequently, the first liquid processing unit 14 rinses the surface of the wafer W with DIW (step S103). In the rinsing process, the nozzle 41b (see FIG. 6) is positioned above the center of the wafer W. Thereafter, the valve 44b is opened for a predetermined time, whereby DIW is supplied from the nozzle 41b to the surface of the rotating wafer W, and DHF remaining on the wafer W is washed away.

  Subsequently, in the first liquid processing unit 14, a replacement process is performed (step S104). In such replacement processing, the nozzle 41c (see FIG. 6) is positioned above the center of the wafer W. Thereafter, when the valve 44c is opened for a predetermined time, IPA is supplied from the nozzle 41c to the surface of the rotating wafer W, and DIW on the wafer W is replaced with IPA. Thereafter, the rotation of the wafer W stops with the IPA remaining on the wafer W. When the replacement process is completed, the liquid supply unit 40_1 moves to the outside of the wafer W. Note that the processing of steps S102 to S104 is not necessarily performed.

  Subsequently, in the first liquid processing unit 14, a solvent supply process is performed (step S105). The solvent supply process is a process of supplying to the wafer W MIBC having an affinity for the topcoat liquid before supplying the topcoat liquid, which is a film forming processing liquid, to the wafer W.

  Specifically, the nozzle 41d of the liquid supply unit 40_2 is positioned above the center of the wafer W, and thereafter, the MIBC is supplied from the nozzle 41d to the wafer W. The MIBC supplied to the wafer W is spread on the surface of the wafer W by centrifugal force accompanying the rotation of the wafer W.

  As described above, MIBC having an affinity for the top coat liquid is spread on the wafer W in advance, so that the top coat liquid can easily spread on the wafer W in the film forming process liquid supply process described later, and a via hole is formed. 106 (see FIG. 9A) can easily enter. Therefore, the consumption of the topcoat liquid can be suppressed, and the reaction product P that has entered the via hole 106 can be more reliably removed.

  MIBC has an affinity with the topcoat solution, but is hardly mixed with DIW and has a low affinity. In contrast, in the first liquid processing unit 14, DIW is replaced with IPA having higher affinity with MIBC than DIW before supplying MIBC. Thereby, compared with the case where a solvent supply process (step S105) is performed immediately after the rinsing process (step S103), the MIBC is likely to spread on the surface of the wafer W, and the consumption of MIBC can be suppressed.

  Note that when the solvent having affinity for the film-forming treatment liquid has affinity for not only the film-forming treatment liquid but also DIW, the replacement process in step S104 may be omitted.

  As described above, when it is desired to efficiently spread the top coat film on the upper surface of the wafer W in a short time, it is preferable to perform the above-described solvent supply process. Note that if the film-forming treatment liquid has an affinity for IPA, the solvent supply process in step S105 may be omitted.

  Subsequently, in the first liquid processing unit 14, a film forming process liquid supply process is performed (step S106). In the film forming process liquid supply process, the nozzle 41e of the liquid supply unit 40_2 is positioned above the center of the wafer W. Thereafter, as shown in FIG. 9B, a topcoat liquid that is a film-forming treatment liquid is supplied from a nozzle 41e to the surface of the wafer W that is a circuit formation surface on which no resist film is formed.

  The top coat liquid supplied to the wafer W spreads on the surface of the wafer W due to the centrifugal force accompanying the rotation of the wafer W. As a result, as shown in FIG. 9B, a liquid film of the topcoat liquid is formed on the entire surface of the wafer W. At this time, the surface of the wafer W is in a state in which wettability is enhanced by the MIBC supplied onto the wafer W in step S105. As a result, the topcoat liquid easily spreads on the surface of the wafer W and also easily enters the via hole 106. Therefore, it is possible to reduce the amount of the top coat liquid used and shorten the processing time.

  As the volatile components are volatilized by the rotation of the wafer W, the topcoat liquid is solidified or cured. As a result, a top coat film is formed on the entire surface of the wafer W.

  Further, in the first liquid processing unit 14, a volatilization promoting process is performed. Such a volatilization promoting process is a process for promoting further volatilization of the volatile components contained in the top coat liquid that forms a film on the entire surface of the wafer W. Specifically, the valve 33 (see FIG. 6) is opened for a predetermined time, so that high-temperature N 2 gas is supplied from the gas supply unit 32 to the back surface of the rotating wafer W. Thereby, the topcoat liquid is heated together with the wafer W, and the volatilization of the volatile components is promoted.

  The volatilization promoting process may be a process for reducing the pressure in the chamber 20 by a decompression device (not shown), or may be a process for reducing the humidity in the chamber 20 with a gas supplied from the FFU 21. These treatments can also promote the volatilization of volatile components.

  Moreover, although the example in the case where the first liquid processing unit 14 performs the volatilization promoting process is shown here, the volatilization promoting process can be omitted. That is, the first liquid processing unit 14 may wait for the wafer W until the topcoat liquid is naturally solidified or cured. Also, volatilization of the top coat liquid is promoted by stopping the rotation of the wafer W or rotating the wafer W at a rotation speed that does not expose the surface of the wafer W by shaking the top coat liquid. You may let them.

  Subsequently, in the first processing apparatus 2, the wafer W after the film forming process liquid supply process is taken out from the first liquid processing unit 14 and loaded into the etch back unit 15, and then the etch back unit 15 performs an etch back process. (Step S107). As a result, the top coat film is etched and the hard mask 105 is exposed as shown in FIG. 9C.

  Subsequently, in the first liquid processing unit 14, a first carry-out process is performed (step S108). In the first carry-out process, the substrate transfer device 111 takes out the wafer W after the etch-back process from the etch-back unit 15, transfers the wafer W to the carrier placement unit 10, and places the carrier C placed on the carrier placement unit 10. To house.

  At this time, the exposed Cu wiring 102 of the wafer W is covered with the top coat film (see FIG. 9C). That is, since the Cu wiring 102 is cut off from the outside air, it is not adversely affected by oxidation or the like.

  Therefore, according to the substrate processing system 1 according to the present embodiment, time management for complying with the Q-time becomes unnecessary, and thus productivity can be improved.

  The wafer W accommodated in the carrier C is transferred from the first processing apparatus 2 to the carrier mounting unit 16 of the second processing apparatus 3. Thereafter, the wafer W is taken out from the carrier C by the substrate transfer device 171 (see FIG. 4) of the second processing apparatus 3 and is carried into the second liquid processing unit 19 via the delivery unit 172 and the substrate transfer device 181. .

  In the second liquid processing unit 19, first, a hard mask removal process is performed (step S109). In such a hard mask removal process, the nozzle 81a (see FIG. 7) is positioned above the center of the wafer W. Thereafter, the valve 84a is opened for a predetermined time, whereby the hard mask removing liquid is supplied to the rotating wafer W from the nozzle 81a. As a result, the hard mask 105 is removed from the wafer W as shown in FIG. 9D.

  Since the hard mask removing process is performed in a state where the Cu wiring 102 is covered with the top coat film, the hard mask removing liquid does not touch the Cu wiring 102. Therefore, according to the substrate processing system 1 according to the present embodiment, the hard mask 105 can be removed without damaging the Cu wiring 102 such as corrosion.

  The reaction product P adhering to the hard mask 105 is removed from the wafer W together with the hard mask 105 by the hard mask removal process (see FIG. 9D).

  Subsequently, in the second liquid processing unit 19, a removal liquid supply process is performed (step S110). In such a removal liquid supply process, the nozzle 81b (see FIG. 7) is positioned above the center of the wafer W. Thereafter, the valve 84b is opened for a predetermined time, so that an alkaline developer as a removing solution is supplied onto the rotating wafer W from the nozzle 81b. As a result, the top coat film formed on the wafer W is peeled off and dissolved to be removed from the wafer W.

  At this time, the reaction product P remaining on the wafer W is peeled off from the wafer W together with the peeling off of the topcoat film, and removed from the wafer W together with the topcoat film (see FIG. 9E).

  At this time, since the zeta potential having the same polarity is generated in the wafer W and the reaction product P, the wafer W and the reaction product P are repelled to prevent the reaction product P from reattaching to the wafer W or the like.

  Further, the alkaline developer contains an anticorrosive agent that prevents corrosion of the Cu wiring 102. For this reason, even if an alkaline developer adheres to the Cu wiring 102, corrosion of the Cu wiring 102 can be suppressed. Therefore, according to the substrate processing system 1 according to the present embodiment, the topcoat film can be removed while suppressing damage to the Cu wiring 102.

  When the removal liquid supply processing is completed, the second liquid processing unit 19 supplies DIW to the wafer W from the nozzle 81c and rinses the surface of the wafer W. As a result, the dissolved top coat film and the reaction product P floating in the alkaline developer are removed from the wafer W together with DIW. When the rinsing process is finished, the second liquid processing unit 19 performs a drying process in which the DIW remaining on the surface of the wafer W is shaken off and the wafer W is dried by increasing the rotation speed of the wafer W for a predetermined time. Thereafter, the rotation of the wafer W is stopped.

  Then, in the second liquid processing unit 19, a second unloading process is performed (step S111). In the second carry-out process, the wafer W is taken out from the second liquid processing unit 19 by the substrate transfer device 181 (see FIG. 4), and placed on the carrier placement unit 16 via the delivery unit 172 and the substrate transfer device 171. It is accommodated in the placed carrier C. When the second carry-out process is completed, a series of substrate processes for one wafer W is completed.

  As described above, the substrate processing system 1 according to this embodiment includes the liquid supply unit 40_2 (corresponding to an example of a processing liquid supply unit), the liquid supply unit 40_1 (corresponding to an example of a chemical solution supply unit), and the liquid supply. Unit 80 (corresponding to an example of a removal liquid supply unit). The liquid supply unit 40_2 is a process for forming a film on the wafer W containing a volatile component with respect to the wafer W on which the hard mask 105 is formed and at least a part of the Cu wiring 102 formed therein is exposed. A top coat solution that is a solution is supplied to cover the exposed surface of the Cu wiring 102. The liquid supply unit 40_1 supplies a hard mask removing liquid for dissolving the hard mask 105 to the wafer W. The liquid supply unit 80 supplies an alkaline developer that removes all of the topcoat liquid to the topcoat liquid solidified or cured on the wafer W due to volatilization of volatile components.

  Therefore, according to the substrate processing system 1 according to the present embodiment, the hard mask 105 can be removed without damaging the Cu wiring 102.

  In the above-described embodiment, the example in which the topcoat liquid is used as the film-forming treatment liquid has been described. However, the film-forming treatment liquid is not limited to the topcoat liquid.

  For example, the film-forming treatment liquid may be a treatment liquid containing a phenol resin. Since such a phenol resin also causes curing shrinkage similarly to the above-described acrylic resin, it is effective in that a tensile force is applied to the reaction product P as in the case of the top coat liquid.

  An example of the film-forming treatment liquid containing a phenol resin is a resist liquid. The resist solution is a film-forming treatment solution for forming a resist film on the wafer W. Specifically, the resist solution contains a novolac type phenol resin.

  Note that when a resist solution is used as the film-forming treatment solution, a thinner that can dissolve the resist solution may be used as the removal solution. When thinner is used as the removal liquid, the rinsing process after the removal liquid supply process can be omitted. In the case where a resist solution is used as the film-forming treatment solution, the removal solution may be supplied after performing an exposure process such as an overall exposure on the resist film formed on the wafer W. In such a case, the remover may be a developer or a thinner.

  The synthetic resin contained in the film-forming treatment liquid may be any resin that cures and shrinks, and is not limited to the above acrylic resin or phenol resin. For example, the synthetic resin contained in the film-forming treatment liquid is epoxy resin, melanin resin, urea resin, unsaturated polyester resin, alkyd resin, polyurethane, polyimide, polyethylene, polypropylene, polyvinyl chloride, polystyrene, polyvinyl acetate, Tetrafluoroethylene, acrylonitrile butadiene styrene resin, acrylonitrile styrene resin, polyamide, nylon, polyacetal, polycarbonate, modified polyphenylene ether, polybutylene terephthalate, polyethylene terephthalate, polyphenylene sulfide, polysulfone, polyether ether ketone, polyamide imide, etc. Good.

  Further, an antireflection film liquid may be used as the film-forming treatment liquid. The antireflection film liquid is a film forming treatment liquid for forming an antireflection film on the wafer W. The antireflection film is a protective film for reducing the surface reflection of the wafer W and increasing the transmittance. When such an antireflection film liquid is used as a film-forming treatment liquid, DIW that can dissolve the antireflection film liquid can be used as a removal liquid.

  In addition to the volatile component and the synthetic resin, the film-forming treatment liquid may further include a predetermined chemical solution that dissolves the wafer W, the material formed on the wafer W, or foreign matter adhering to the wafer W. The “material configured on the wafer W” is, for example, the hard mask 105 or the Cu wiring 102, and the “foreign matter adhering to the wafer W” is, for example, the reaction product P. Examples of the “predetermined chemical solution” include hydrogen fluoride, ammonium fluoride, hydrochloric acid, sulfuric acid, hydrogen peroxide solution, phosphoric acid, acetic acid, nitric acid, and ammonium hydroxide. Since the hard mask 105 and the surface of the reaction product P are dissolved by these chemical solutions, the adhesion of the reaction product P is weakened, so that the reaction product P can be easily removed.

  The “predetermined chemical solution” is used under the condition that the etching amount is small as compared with the chemical solution in the normal chemical cleaning in which cleaning is performed using only the chemical action of the chemical solution. For this reason, it is possible to remove the reaction product P more effectively while suppressing the erosion to the wafer W as compared with general chemical cleaning.

  In the above-described embodiment, an example in which an alkali developer is used as the removing liquid has been described. However, the removing liquid may be a solution obtained by adding hydrogen peroxide to an alkali developer. As described above, the surface roughness of the wafer W due to the alkali developer can be suppressed by adding the hydrogen peroxide solution to the alkali developer.

  The removal solution may be an organic solvent such as thinner, toluene, acetate esters, alcohols, glycols (propylene glycol monomethyl ether), or an acid developer such as acetic acid, formic acid, hydroxyacetic acid, etc. Also good.

  Furthermore, the removal liquid may further contain a surfactant. Since the surfactant has a function of weakening the surface tension, reattachment of the reaction product P to the wafer W can be suppressed.

  In the above-described embodiment, an example in which the metal wiring provided in the wafer W is the Cu wiring 102 has been described. However, the metal wiring is not limited to the Cu wiring 102. In such a case, the topcoat film removal solution may contain an anticorrosive agent according to the type of metal wiring.

  In the above-described embodiment, an example in which the wiring material is Cu has been described. However, the wiring material is not limited to Cu, and may be W, Co, or the like.

  In the above-described embodiment, an example in which the hard mask 105 is formed of TiN has been described. However, the material of the hard mask 105 is not limited to TiN. For example, metal materials such as Ti, TiO, Al, and Al compounds may be used.

  In the above-described embodiment, an example in which the chemical process (step S102 in FIG. 8) is performed before the film formation process liquid supply process is shown. However, the chemical process is performed after the removal liquid supply process, that is, It may be performed after the top coat film is removed. In such a case, the reaction product P (particularly, the reaction product P having a small particle diameter) that has not been completely removed by peeling off the top coat film is removed by chemical treatment. Also in such a case, the reaction product P can be removed more effectively while suppressing the erosion to the wafer W as compared with general chemical cleaning.

  In addition, when performing a chemical | medical solution process after a removal liquid supply process, the liquid supply part 40_1 with which the 1st liquid processing unit 14 is provided may be provided in the 2nd liquid processing unit 19, or the processing unit for performing a chemical | medical solution washing | cleaning. May be provided separately.

  Further, the configuration of the substrate processing system 1 is not limited to the configuration exemplified in the above-described embodiment.

  For example, in the above-described embodiment, an example in which the dry etching unit 12, the first liquid processing unit 14, and the etch back unit 15 are provided in the first processing apparatus 2 has been described. However, the dry etching unit 12, first liquid processing Part or all of the unit 14 and the etch back unit 15 may be provided independently as separate devices.

  Further, the dry etching unit 12, the load lock chamber 13, the first liquid processing unit 14, and the etch back unit 15 included in the first processing apparatus 2 may be disposed in the processing station 8 of the second processing apparatus 3. In such a case, the first processing device 2 becomes unnecessary.

  In the above-described embodiment, the chemical liquid processing (step S102 in FIG. 8) is performed in the first liquid processing unit 14, but the chemical liquid processing is performed in a processing unit different from the first liquid processing unit 14. It is good. Similarly, in the above-described embodiment, the hard mask removing process (step S109 in FIG. 8) is performed in the second liquid processing unit 19, but the hard mask removing process is different from the second liquid processing unit 19. It may be performed in the processing unit.

  In the above-described embodiment, the film forming process liquid supply process and the removal liquid supply process are performed in separate units (the first liquid processing unit 14 and the second liquid processing unit 19). The liquid supply process and the removal liquid supply process may be performed by one unit (for example, the first liquid processing unit 14). Further, for example, in the first liquid processing unit 14, chemical liquid processing, film forming processing liquid supply processing, and removal liquid supply processing may be performed.

  Further effects and modifications can be easily derived by those skilled in the art. Thus, the broader aspects of the present invention are not limited to the specific details and representative embodiments shown and described above. Accordingly, various modifications can be made without departing from the spirit or scope of the general inventive concept as defined by the appended claims and their equivalents.

W wafer P reaction product 1 substrate processing system 2 first processing device 3 second processing device 4 control device 12 dry etching unit 13 load lock chamber 14 first liquid processing unit 19 second liquid processing units 40_1, 40_2, 80 liquid supply Part 101 Wiring layer 102 Cu wiring 103 Liner film 104 Interlayer insulating film 106 Via hole

Claims (8)

The exposed metal is supplied with a processing liquid for forming a film on the substrate containing a volatile component to a substrate on which a hard mask is formed and at least a part of the metal wiring formed therein is exposed. A treatment liquid supply step for covering the surface of the wiring;
A chemical solution supplying step of supplying a predetermined chemical solution for dissolving the hard mask to the substrate in which the processing solution is solidified or hardened by volatilization of the volatile component;
And a removal liquid supply step of supplying a removal liquid for removing the treatment liquid to the solidified or hardened treatment liquid after the chemical liquid supply process. The treatment liquid supply step covers the surface of the substrate including the exposed surface of the metal wiring and the surface of the hard mask with the treatment liquid,
The substrate processing method according to claim 1, further comprising: an exposing step of exposing the hard mask by removing the solidified or hardened processing liquid covering the surface of the substrate by dry etching. The substrate processing method according to claim 1, wherein the removing liquid contains an anticorrosive for the metal wiring. A chemical solution supplying step of supplying a predetermined chemical solution for dissolving a material configured on the substrate or a foreign substance adhering to the substrate to the substrate before the treatment solution supplying step is provided. Item 4. The substrate processing method according to any one of Items 1 to 3. 2. A chemical solution supplying step of supplying a predetermined chemical solution for dissolving a material formed on the substrate or a foreign substance adhering to the substrate to the substrate after the removing solution supplying step. 4. The substrate processing method according to any one of 3 above. The exposed metal is supplied with a processing liquid for forming a film on the substrate containing a volatile component to a substrate on which a hard mask is formed and at least a part of the metal wiring formed therein is exposed. A treatment liquid supply unit covering the surface of the wiring;
A chemical supply section for supplying a predetermined chemical solution for dissolving the hard mask to the substrate on which the processing liquid is solidified or cured by volatilization of the volatile component;
A substrate processing system comprising: a removal liquid supply unit that supplies a removal liquid for removing the treatment liquid from the solidified or cured treatment liquid. The substrate processing system according to claim 6, further comprising a dry etching unit that etches the substrate with an etching gas. A computer-readable storage medium that operates on a computer and stores a program for controlling the substrate processing system,
A storage medium characterized in that, when executed, the program causes a computer to control the substrate processing system so that the substrate processing method according to claim 1 is performed.

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