JP2015046391A - 発光装置、及び電子機器 - Google Patents
発光装置、及び電子機器 Download PDFInfo
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- JP2015046391A JP2015046391A JP2014154520A JP2014154520A JP2015046391A JP 2015046391 A JP2015046391 A JP 2015046391A JP 2014154520 A JP2014154520 A JP 2014154520A JP 2014154520 A JP2014154520 A JP 2014154520A JP 2015046391 A JP2015046391 A JP 2015046391A
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016208020A (ja) * | 2015-04-22 | 2016-12-08 | 株式会社半導体エネルギー研究所 | 回路基板の作製方法、発光装置の作製方法、及び発光装置 |
| WO2019180878A1 (ja) * | 2018-03-22 | 2019-09-26 | シャープ株式会社 | 表示デバイス、及び表示デバイスの製造方法 |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001290439A (ja) * | 2000-02-01 | 2001-10-19 | Semiconductor Energy Lab Co Ltd | 半導体装置およびその作製方法 |
| US20010040645A1 (en) * | 2000-02-01 | 2001-11-15 | Shunpei Yamazaki | Semiconductor device and manufacturing method thereof |
| US20040079941A1 (en) * | 2002-10-18 | 2004-04-29 | Shunpei Yamazaki | Semiconductor apparatus and fabrication method of the same |
| US20040232413A1 (en) * | 2002-10-30 | 2004-11-25 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
| JP2005183374A (ja) * | 2003-11-28 | 2005-07-07 | Semiconductor Energy Lab Co Ltd | 表示装置の作製方法 |
| JP2005182000A (ja) * | 2003-11-28 | 2005-07-07 | Semiconductor Energy Lab Co Ltd | 表示装置の作製方法 |
| US20080171484A1 (en) * | 2003-11-28 | 2008-07-17 | Semiconductor Energy Laboratory Co., Ltd. | Method of Manufacturing Display Device |
| US20100308335A1 (en) * | 2009-06-04 | 2010-12-09 | Tae-Woong Kim | Organic light emitting diode display and method of manufacturing the same |
| US20120153812A1 (en) * | 2010-12-20 | 2012-06-21 | Deeder Aurongzeb | Large area light emitting electrical package with current spreading bus |
-
2014
- 2014-07-30 JP JP2014154520A patent/JP2015046391A/ja not_active Withdrawn
Patent Citations (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001290439A (ja) * | 2000-02-01 | 2001-10-19 | Semiconductor Energy Lab Co Ltd | 半導体装置およびその作製方法 |
| US20010040645A1 (en) * | 2000-02-01 | 2001-11-15 | Shunpei Yamazaki | Semiconductor device and manufacturing method thereof |
| US20040079941A1 (en) * | 2002-10-18 | 2004-04-29 | Shunpei Yamazaki | Semiconductor apparatus and fabrication method of the same |
| JP2004140267A (ja) * | 2002-10-18 | 2004-05-13 | Semiconductor Energy Lab Co Ltd | 半導体装置およびその作製方法 |
| US20040232413A1 (en) * | 2002-10-30 | 2004-11-25 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
| JP2011142332A (ja) * | 2002-10-30 | 2011-07-21 | Semiconductor Energy Lab Co Ltd | 発光装置及び電子機器 |
| JP2005182000A (ja) * | 2003-11-28 | 2005-07-07 | Semiconductor Energy Lab Co Ltd | 表示装置の作製方法 |
| US20070181246A1 (en) * | 2003-11-28 | 2007-08-09 | Semiconductor Energy Laboratory Co., Ltd. | Method of manufacturing display device |
| US20080171484A1 (en) * | 2003-11-28 | 2008-07-17 | Semiconductor Energy Laboratory Co., Ltd. | Method of Manufacturing Display Device |
| JP2005183374A (ja) * | 2003-11-28 | 2005-07-07 | Semiconductor Energy Lab Co Ltd | 表示装置の作製方法 |
| US20100308335A1 (en) * | 2009-06-04 | 2010-12-09 | Tae-Woong Kim | Organic light emitting diode display and method of manufacturing the same |
| JP2010282966A (ja) * | 2009-06-04 | 2010-12-16 | Samsung Mobile Display Co Ltd | 有機発光表示装置及び有機発光表示装置の製造方法 |
| US20120153812A1 (en) * | 2010-12-20 | 2012-06-21 | Deeder Aurongzeb | Large area light emitting electrical package with current spreading bus |
| JP2013546154A (ja) * | 2010-12-20 | 2013-12-26 | ゼネラル・エレクトリック・カンパニイ | 電流拡散バスを備えた大面積発光電気パッケージ |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016208020A (ja) * | 2015-04-22 | 2016-12-08 | 株式会社半導体エネルギー研究所 | 回路基板の作製方法、発光装置の作製方法、及び発光装置 |
| WO2019180878A1 (ja) * | 2018-03-22 | 2019-09-26 | シャープ株式会社 | 表示デバイス、及び表示デバイスの製造方法 |
| US20210020689A1 (en) * | 2018-03-22 | 2021-01-21 | Sharp Kabushiki Kaisha | Display device and method for producing display device |
| US11626449B2 (en) | 2018-03-22 | 2023-04-11 | Sharp Kabushiki Kaisha | Display device and method for producing display device |
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