JP2015044394A - Mold fastening device of injection molding machine provided with mold platen center position adjustment function - Google Patents

Mold fastening device of injection molding machine provided with mold platen center position adjustment function Download PDF

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JP2015044394A
JP2015044394A JP2013178399A JP2013178399A JP2015044394A JP 2015044394 A JP2015044394 A JP 2015044394A JP 2013178399 A JP2013178399 A JP 2013178399A JP 2013178399 A JP2013178399 A JP 2013178399A JP 2015044394 A JP2015044394 A JP 2015044394A
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platen
mold
temperature
temperature control
movable
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JP5705931B2 (en
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信篤 土屋
Nobuatsu Tsuchiya
信篤 土屋
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Fanuc Corp
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Fanuc Corp
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/76—Measuring, controlling or regulating
    • B29C45/80—Measuring, controlling or regulating of relative position of mould parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/64—Mould opening, closing or clamping devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/76—Measuring, controlling or regulating
    • B29C45/78—Measuring, controlling or regulating of temperature
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2945/00—Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
    • B29C2945/76—Measuring, controlling or regulating
    • B29C2945/76494—Controlled parameter
    • B29C2945/76531—Temperature
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2945/00—Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
    • B29C2945/76—Measuring, controlling or regulating
    • B29C2945/76494—Controlled parameter
    • B29C2945/76568—Position
    • B29C2945/76581—Position distance
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2945/00—Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
    • B29C2945/76—Measuring, controlling or regulating
    • B29C2945/76655—Location of control
    • B29C2945/76702—Closure or clamping device

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a mold fastening device of an injection molding machine provided with a mold platen center position adjustment function which detects difference between center heights of a fixing platen and of a movable platen of a mold fastening device with one side of the fixing platen and the movable platen as the center height reference and controls the center height of the another side so that the difference between the center heights is eliminated.SOLUTION: A fixing platen 1 is assigned as a temperature control subject platen, and a movable platen 2 is assigned as a height reference platen. Displacement detection parts 8 are provided at a fixing side metal mold 3a and at a movable side metal mold 3b and detect deviation between the central axes of the fixing platen 1 and of the movable platen 2. The fixing platen 1 includes a support leg 5 connected by a fixing point 6, and a temperature adjustment unit 7 is mounted on the support leg 5. When a temperature difference between the fixing platen 1 and the movable platen 2 occurs, the central axes of the fixing platen 1 and of the movable platen 2 are deviated from each other due to the difference in thermal expansion of the fixing platen 1 and of the movable platen 2. A temperature control device 9 implements temperature control of the temperature adjustment unit 7, to eliminate the deviation.

Description

本発明は、射出成形機において、型締装置の固定盤と可動盤の一方を中心高さの基準として固定盤と可動盤の中心高さの差を検出して中心高さの差を解消するように他方の中心高さを制御する型締装置に関する。   The present invention eliminates the difference in the center height by detecting the difference in the center height between the fixed platen and the movable platen using one of the fixed platen and the movable platen of the mold clamping device as a reference for the center height in the injection molding machine. In this way, the mold clamping device controls the other center height.

レンズ成形などの精密成形では、固定側金型と可動側金型の僅かな芯ずれであっても、成形品の形状精度を低下させる。芯ずれの原因として、固定盤と可動盤の温度差が挙げられる。レンズ成形などの精密成形では、金型温度を８０℃〜１３０℃にして成形が行われることがある。その際に、固定盤と可動盤の温度差により、固定盤と可動盤の熱膨張の程度が異なり、可動盤と固定盤の中心位置に差が生じ、芯ずれが発生する。   In precision molding such as lens molding, even if there is a slight misalignment between the fixed side mold and the movable side mold, the shape accuracy of the molded product is lowered. A cause of misalignment is a temperature difference between the fixed platen and the movable platen. In precision molding such as lens molding, molding may be performed at a mold temperature of 80 ° C to 130 ° C. At that time, the degree of thermal expansion between the fixed platen and the movable platen differs depending on the temperature difference between the fixed platen and the movable platen, and a difference occurs in the center position between the movable platen and the fixed platen, resulting in misalignment.

また、固定盤ならびに可動盤の外周部は、室温の変化に対し影響を受けやすく、中心部は影響を受けにくい。このため、可動盤又は固定盤の構造によっては、室温の変化により、芯ずれが発生する。   Further, the outer peripheral portions of the fixed plate and the movable plate are easily affected by changes in room temperature, and the central portion is not easily affected. For this reason, depending on the structure of the movable platen or fixed platen, misalignment occurs due to a change in room temperature.

そこで、可動盤と固定盤の中心位置の差が発生するたびに、その差を解消する必要がある。可動盤の高さ調整は可動盤の下にシムを挟む方法が取られているが、機械を停止させる必要があり時間がかかるため、成形中の機械の温度変動に対応することは困難である。   Therefore, every time a difference between the center positions of the movable platen and the fixed platen occurs, it is necessary to eliminate the difference. The method of adjusting the height of the movable platen is to put a shim under the movable platen, but it is necessary to stop the machine and it takes time, so it is difficult to cope with the temperature fluctuation of the machine during molding .

また、特許文献１に開示される技術は、可動盤の高さをローラの回動により調整している。特許文献２に開示される技術は、可動側金型と可動盤の間に設けたＸ−Ｙ送り機構により、可動側金型の位置を調整している。特許文献３に開示される技術は、支持部材に内設された温調回路を用いて金型の芯ずれ調整を行っている。   Moreover, the technique disclosed in Patent Document 1 adjusts the height of the movable platen by rotating the roller. In the technique disclosed in Patent Document 2, the position of the movable mold is adjusted by an XY feed mechanism provided between the movable mold and the movable platen. The technique disclosed in Patent Document 3 performs mold misalignment adjustment using a temperature control circuit provided in a support member.

特開２００７−２６０９４５JP2007-260945 特開２００８−２４６７８３JP2008-244673 特開２００９−２６９１８４JP 2009-269184 A

特許文献１は、可動盤の高さをローラの回動により調整しており、機構部の設計変更が多い。特許文献２は、型開き量がＸ−Ｙ送り機構の厚み分だけ少なくなる。特許文献３は、支持部材に内設された温調回路を用いて金型の芯ずれ調整を行っているが、芯ずれを解消するよう自動制御する機構については言及していない。   In Patent Document 1, the height of the movable platen is adjusted by the rotation of the roller, and the design of the mechanism is frequently changed. In Patent Document 2, the mold opening amount is reduced by the thickness of the XY feed mechanism. Japanese Patent Laid-Open No. 2004-260688 performs a misalignment adjustment of a mold using a temperature control circuit provided in a support member, but does not mention a mechanism that automatically controls so as to eliminate the misalignment.

そこで本発明の目的は、型締装置の固定盤と可動盤の一方を中心高さの基準として検出し固定盤と可動盤の中心高さの差を検出して、温度調節手段により中心高さの差を解消するように他方の中心高さを制御する型盤の中心位置調整機能を備えた射出成形機の型締装置を提供することである。   Therefore, an object of the present invention is to detect one of the fixed plate and the movable platen of the mold clamping device as a reference for the center height, detect the difference in the center height between the fixed platen and the movable platen, and adjust the center height by the temperature adjusting means. An object of the present invention is to provide a mold clamping device of an injection molding machine having a function of adjusting the center position of a mold platen to control the center height of the other so as to eliminate the difference.

本願の請求項１に係る発明は、可動側金型を保持する可動盤と、固定側金型を保持する固定盤を有する射出成形機の型締装置において、前記可動盤及び前記固定盤のうちの何れか一方を温度制御対象型盤とし、他方を高さ基準型盤とし、前記温度制御対象型盤に配設された温度調節手段と、前記高さ基準型盤の中心高さと前記温度制御対象型盤の中心高さとの差を測定する変位測定手段と、前記温度制御対象型盤の中心高さが前記高さ基準型盤の中心高さと同じになるように、前記変位測定手段により測定された前記高さ基準型盤の中心高さと前記温度制御対象型盤の中心高さとの差に基づいて、前記温度調節手段により前記温度制御対象型盤の温度を制御する温度制御装置と、を有することを特徴とする型盤の中心位置調整機能を備えた射出成形機の型締装置である。   The invention according to claim 1 of the present application is a mold clamping device of an injection molding machine having a movable plate for holding a movable die and a fixed plate for holding a fixed die, wherein the movable plate and the fixed plate are Any one of these is a temperature control target mold, and the other is a height reference mold, temperature adjusting means disposed on the temperature control target mold, the center height of the height reference mold and the temperature control Displacement measuring means for measuring the difference between the center height of the target mold and the displacement measuring means so that the center height of the temperature control target mold is the same as the center height of the height reference mold A temperature control device for controlling the temperature of the temperature control target mold plate by the temperature adjusting means based on the difference between the center height of the height reference mold plate and the center height of the temperature control target mold plate. A shooter equipped with a center position adjustment function A mold clamping apparatus of a molding machine.

請求項２に係る発明は、前記温度制御対象型盤の中心高さが前記高さ基準型盤の中心高さよりも低い場合に前記温度調節手段の設定温度を上げ、前記温度制御対象型盤の中心高さが前記高さ基準型盤の中心高さよりも高い場合に前記温度調節手段の設定温度を下げる制御を行う請求項１に記載の射出成形機の型締装置である。
請求項３に係る発明は、前記温度制御対象型盤は、型盤の両側面に支持脚を有し、前記支持脚の少なくとも一方に温度調節手段を設けたことを特徴とする請求項１または２のいずれかに記載の射出成形機の型締装置である。 The invention according to claim 2 increases the set temperature of the temperature adjusting means when the center height of the temperature control target mold is lower than the center height of the height reference mold, and the temperature control target mold The mold clamping device for an injection molding machine according to claim 1, wherein when the center height is higher than the center height of the height reference mold platen, control is performed to lower the set temperature of the temperature adjusting means.
The invention according to claim 3 is characterized in that the temperature control target pattern board has support legs on both sides of the pattern board, and temperature adjusting means is provided on at least one of the support legs. 3. A mold clamping apparatus for an injection molding machine according to any one of 2 above.

本発明により、型締装置の固定盤と可動盤の一方を中心高さの基準として検出し固定盤と可動盤の中心高さの差を検出して、温度調節手段により中心高さの差を解消するように他方の中心高さを制御する型盤の中心位置調整機能を備えた射出成形機の型締装置を提供できる。   According to the present invention, one of the fixed platen and the movable platen of the mold clamping device is detected with reference to the center height, the difference in the center height between the fixed platen and the movable platen is detected, and the difference in the center height is detected by the temperature adjusting means. It is possible to provide a mold clamping device of an injection molding machine having a function of adjusting the center position of the mold platen to control the center height of the other so as to eliminate it.

本発明に係る温度制御装置を説明する図である。It is a figure explaining the temperature control apparatus which concerns on this invention. 図１において矢印Ａ方向に見た断面図である。It is sectional drawing seen in the arrow A direction in FIG. 温度上昇時に発生する芯ずれを説明する模式図である。It is a schematic diagram explaining misalignment that occurs when the temperature rises. 温度調節機による芯ずれの補正を説明する模式図である。It is a schematic diagram explaining correction | amendment of misalignment by a temperature controller. 実施形態１の構成における温度制御を行うフローを説明する図である。It is a figure explaining the flow which performs temperature control in the structure of Embodiment 1. FIG. 温度調節機を可動盤上に有する温度制御装置の模式図である。It is a schematic diagram of the temperature control apparatus which has a temperature regulator on a movable board. 温度調節機を可動盤の脚上に有する温度制御装置の模式図である。It is a schematic diagram of the temperature control apparatus which has a temperature controller on the leg of a movable board. 実施形態２の構成における温度制御を行うフローを説明する図である。It is a figure explaining the flow which performs temperature control in the structure of Embodiment 2. FIG.

以下、本発明の実施形態を図面と共に説明する。
＜実施形態１＞
図１は、本発明に係る温度制御装置を説明する図である。図２は、図１において矢印Ａ方向に見た断面図である。図３は、温度上昇時に発生する芯ずれを説明する模式図である。図４は、温度調節機による芯ずれの補正を説明する模式図である。 Hereinafter, embodiments of the present invention will be described with reference to the drawings.
<Embodiment 1>
FIG. 1 is a diagram illustrating a temperature control device according to the present invention. FIG. 2 is a cross-sectional view taken in the direction of arrow A in FIG. FIG. 3 is a schematic diagram illustrating misalignment that occurs when the temperature rises. FIG. 4 is a schematic diagram for explaining the correction of misalignment by the temperature controller.

射出成形機は、図示しない機台上に射出機構部と型締機構部とを対向配置し、制御装置により射出機構部と型締機構部を制御し、成形サイクルを実行する。型締機構部は、金型３のうち固定側金型３ａを取り付ける固定盤１、金型３のうち可動側金型３ｂを取り付ける可動盤２を備えている。なお、後述する温度制御装置９は、射出成形機を制御する制御装置の１つの機能として実現できる。   In an injection molding machine, an injection mechanism unit and a mold clamping mechanism unit are arranged opposite to each other on a machine base (not shown), and the injection mechanism unit and the mold clamping mechanism unit are controlled by a control device to execute a molding cycle. The mold clamping mechanism portion includes a stationary platen 1 to which a stationary die 3 a is attached among the die 3, and a movable platen 2 to which a movable die 3 b is attached among the die 3. In addition, the temperature control apparatus 9 mentioned later is realizable as one function of the control apparatus which controls an injection molding machine.

固定盤１は、水平方向両側部の中心を支持脚５，５によって支持されている。ここで、支持脚５により支持する点を固定点という。固定盤１と図示しないリアプラテンとはタイバー４によって連結されている。可動盤２はタイバー４の軸方向に沿って移動可能であり、固定盤１に対して進退自在に構成されている。   The fixed platen 1 is supported by support legs 5 and 5 at the center of both sides in the horizontal direction. Here, the point supported by the support leg 5 is called a fixed point. The stationary platen 1 and a rear platen (not shown) are connected by a tie bar 4. The movable platen 2 is movable along the axial direction of the tie bar 4 and is configured to be movable back and forth with respect to the fixed platen 1.

図１、図２に示す型締機構部においては、固定盤１を温度制御対象型盤とし、可動盤２を高さ基準型盤としている。変位検出部８は固定側金型３ａと可動側金型３ｂに設けられており、固定盤１と可動盤２の中心軸のずれを検出する。変位検出部８によって検出された変位検出信号は、温度制御装置９に入力される。温度制御装置９は温度調節機７の温度を制御する。固定盤１は固定点６によって接続された支持脚５を有しており、温度調節機７は支持脚５に設置されている。   In the mold clamping mechanism shown in FIGS. 1 and 2, the stationary platen 1 is a temperature control target die plate and the movable platen 2 is a height reference die plate. The displacement detector 8 is provided in the fixed mold 3a and the movable mold 3b, and detects the deviation of the central axes of the fixed plate 1 and the movable plate 2. The displacement detection signal detected by the displacement detector 8 is input to the temperature control device 9. The temperature control device 9 controls the temperature of the temperature controller 7. The stationary platen 1 has a support leg 5 connected by a fixing point 6, and the temperature controller 7 is installed on the support leg 5.

なお、変位検出部８として、リニアゲージ式センサ、磁気式センサ、超音波式センサ、渦電流式センサ、光電式センサ、レーザ式センサなどの変位センサを用いることができる。なお、例えば、変位検出器８としては、固定側金型３ａに送信側の要素を設置し、可動側金型３ｂに受信側の要素を設置し、両者で変位検出器を構成することができる。また、温度調節機７として、電気ヒータ、電熱冷却素子、流体による温度調節器などを用いることができる。   Note that a displacement sensor such as a linear gauge sensor, a magnetic sensor, an ultrasonic sensor, an eddy current sensor, a photoelectric sensor, or a laser sensor can be used as the displacement detector 8. For example, as the displacement detector 8, a transmission-side element can be installed in the fixed mold 3a, and a reception-side element can be installed in the movable mold 3b. . As the temperature controller 7, an electric heater, an electrothermal cooling element, a fluid temperature controller, or the like can be used.

固定盤１と可動盤２に温度差が生じると、図３のように固定盤１と可動盤２の熱膨張の差により固定盤１と可動盤２の中心軸がずれる。図３では、基準盤である可動盤２の中心軸に対して固定盤１の中心軸が低い状態にあることが図示されている。   When a temperature difference occurs between the fixed platen 1 and the movable platen 2, the central axes of the fixed platen 1 and the movable platen 2 are shifted due to a difference in thermal expansion between the fixed platen 1 and the movable platen 2 as shown in FIG. FIG. 3 shows that the central axis of the fixed platen 1 is lower than the central axis of the movable platen 2 that is the reference plate.

そこで、温度制御装置９は、図５のフローチャートに示す方法により、その芯ずれを解消する。変位検出部８が芯ずれを検知したら（ＳＡ０１）、まず、固定盤１の中心高さが可動盤２の中心高さよりも低いか判断する（ＳＡ０２）。固定盤１の中心高さが可動盤２の中心高さよりも低い場合、固定盤１を熱膨張させる必要があるため、温度調節機７の設定温度を上げる（ＳＡ０３）。固定盤１の中心高さが可動盤２の中心高さよりも高い場合、固定盤１の熱膨張を減少させる必要があるため、温度調節機７の設定温度を下げる（ＳＡ０４）。この設定温度の変更を、芯ずれが許容値以下に収まるまで継続する（ＳＡ０５）。許容値以下に収まったら終了する。   Therefore, the temperature control device 9 eliminates the misalignment by the method shown in the flowchart of FIG. If the displacement detector 8 detects misalignment (SA01), it is first determined whether the center height of the fixed platen 1 is lower than the center height of the movable platen 2 (SA02). When the center height of the fixed platen 1 is lower than the center height of the movable platen 2, it is necessary to thermally expand the fixed platen 1, so the set temperature of the temperature controller 7 is increased (SA03). When the center height of the fixed platen 1 is higher than the center height of the movable platen 2, it is necessary to reduce the thermal expansion of the fixed platen 1, so the set temperature of the temperature controller 7 is lowered (SA04). This change in the set temperature is continued until the misalignment falls below the allowable value (SA05). When it falls below the allowable value, the process ends.

図５のフローチャートの処理によって温度調節機７の温度を制御することで、固定側金型３ａと可動側金型３ｂの中心軸を合わせることができる。なお、温度調節機７の制御は、ＯＮ・ＯＦＦ制御でも電流値制御でもよい。変位検出部８は固定盤１と可動盤２に設けてもよい。   By controlling the temperature of the temperature controller 7 by the process of the flowchart of FIG. 5, the central axes of the fixed mold 3a and the movable mold 3b can be matched. The temperature controller 7 may be controlled by ON / OFF control or current value control. The displacement detector 8 may be provided on the fixed platen 1 and the movable platen 2.

＜実施形態２＞
図６は、温度調節機を可動盤上に有する温度制御装置の模式図である。図７は、温度調節機を可動盤の脚上に有する温度制御装置の模式図である。温度が変動しやすい部位は型締装置によって異なるため、温度調節機７や変位検出部８の設置に適した部位も異なってくる。そのため、図７に示すように固定盤１を高さ基準型盤とし、可動盤２を温度制御対象型盤としてもよい。ただし、支持脚５を有する型盤に取付ける場合には、支持脚の熱膨張の方が型盤本体の熱膨張よりも支配的であるため、型盤本体ではなく支持脚５に取付ける。例えば、温度調節機７の取付け位置は図６のように可動盤２上でもよいが、図７のように支持脚５が可動盤２に設けられている場合には可動盤２の支持脚５上に設ける。 <Embodiment 2>
FIG. 6 is a schematic diagram of a temperature control device having a temperature controller on a movable platen. FIG. 7 is a schematic diagram of a temperature control device having a temperature controller on the leg of the movable platen. Since the part where the temperature is likely to vary varies depending on the mold clamping device, the part suitable for the installation of the temperature controller 7 and the displacement detector 8 also varies. Therefore, as shown in FIG. 7, the fixed platen 1 may be a height reference type platen, and the movable platen 2 may be a temperature control target type platen. However, in the case of mounting on the mold base having the support legs 5, the thermal expansion of the support legs is more dominant than the thermal expansion of the mold base body, so that it is mounted on the support legs 5 instead of the mold base body. For example, the temperature adjuster 7 may be mounted on the movable platen 2 as shown in FIG. 6, but when the support leg 5 is provided on the movable platen 2 as shown in FIG. Provide on top.

ここで、図７の場合の温度制御の処理を図８のフローチャートを用いて説明する。
温度制御装置９は、図８のフローチャートに示す方法により、その芯ずれを解消する。変位検出部８が芯ずれを検知したら（ＳＢ０１）、まず、可動盤２の中心高さが固定盤１の中心高さよりも低いか判断する（ＳＢ０２）。可動盤２の中心高さが固定盤１の中心高さよりも低い場合、可動盤２を熱膨張させる必要があるため、温度調節機７の設定温度を上げる（ＳＢ０３）。可動盤２の中心高さが固定盤１の中心高さよりも高い場合、可動盤２の熱膨張を減少させる必要があるため、温度調節機７の設定温度を下げる（ＳＢ０４）。この設定温度の変更を、芯ずれが許容値以下に収まるまで継続する（ＳＢ０５）。許容値以下に収まったら終了する。 Here, the temperature control process in the case of FIG. 7 will be described with reference to the flowchart of FIG.
The temperature control device 9 eliminates the misalignment by the method shown in the flowchart of FIG. If the displacement detector 8 detects misalignment (SB01), it is first determined whether the center height of the movable platen 2 is lower than the center height of the fixed platen 1 (SB02). When the center height of the movable platen 2 is lower than the center height of the fixed platen 1, it is necessary to thermally expand the movable platen 2, so the set temperature of the temperature controller 7 is raised (SB03). When the center height of the movable platen 2 is higher than the center height of the fixed platen 1, it is necessary to reduce the thermal expansion of the movable platen 2, so the set temperature of the temperature controller 7 is lowered (SB04). This change in the set temperature is continued until the misalignment falls below the allowable value (SB05). When it falls below the allowable value, the process ends.

上述したように、本発明は、温度調節手段を用いることで型盤を熱膨張させて、型盤の中心高さを制御する。温度調節手段は、外付けが可能である簡易な構造であるため、組立済の機械にも本発明の適用が容易である。さらに、部品点数を抑えられるため、高価なシステムにはならないだけでなく、保守性や信頼性の向上にもつながる。   As described above, the present invention controls the center height of the template by thermally expanding the template by using the temperature adjusting means. Since the temperature adjusting means has a simple structure that can be externally attached, the present invention can be easily applied to an assembled machine. Furthermore, since the number of parts can be suppressed, not only does it become an expensive system, but also leads to improvement in maintainability and reliability.

１ 固定盤
２ 可動盤
３ 金型
３ａ 固定側金型
３ｂ 可動側金型
４ タイバー
５ 支持脚
６ 固定点
７ 温度調節機
８ 変位検出部
９ 温度制御装置 DESCRIPTION OF SYMBOLS 1 Fixed platen 2 Movable platen 3 Mold 3a Fixed side die 3b Movable side die 4 Tie bar 5 Support leg 6 Fixed point 7 Temperature controller 8 Displacement detection part 9 Temperature control apparatus

本願の請求項１に係る発明は、可動側金型を保持する可動盤と、固定側金型を保持する固定盤を有する射出成形機の型締装置において、前記可動盤及び前記固定盤のうちの何れか一方を温度制御対象型盤とし、他方を高さ基準型盤とし、前記温度制御対象型盤に配設された温度調節手段と、前記高さ基準型盤の中心高さと前記温度制御対象型盤の中心高さとの差を測定する変位測定手段と、前記温度制御対象型盤の中心高さが前記高さ基準型盤の中心高さと同じになるように、前記変位測定手段により測定された前記高さ基準型盤の中心高さと前記温度制御対象型盤の中心高さとの差に基づいて、前記温度調節手段により前記温度制御対象型盤の温度を制御する温度制御装置と、を有し、前記温度制御対象型盤の熱膨張の量を制御することによって前記可動盤と前記固定盤の中心高さの差を解消することを特徴とする型盤の中心位置調整機能を備えた射出成形機の型締装置である。 The invention according to claim 1 of the present application is a mold clamping device of an injection molding machine having a movable plate for holding a movable die and a fixed plate for holding a fixed die, wherein the movable plate and the fixed plate are Any one of these is a temperature control target mold, and the other is a height reference mold, temperature adjusting means disposed on the temperature control target mold, the center height of the height reference mold and the temperature control Displacement measuring means for measuring the difference between the center height of the target mold and the displacement measuring means so that the center height of the temperature control target mold is the same as the center height of the height reference mold A temperature control device for controlling the temperature of the temperature control target mold plate by the temperature adjusting means based on the difference between the center height of the height reference mold plate and the center height of the temperature control target mold plate. Yes, and to control the amount of thermal expansion of the temperature-controlled mold platen A mold clamping apparatus of an injection molding machine having a center position adjustment function of the mold platen, characterized in that I to eliminate the difference between the center height of the stationary platen and the movable platen.

Claims (3)

可動側金型を保持する可動盤と、固定側金型を保持する固定盤を有する射出成形機の型締装置において、
前記可動盤及び前記固定盤のうちの何れか一方を温度制御対象型盤とし、他方を高さ基準型盤とし、
前記温度制御対象型盤に配設された温度調節手段と、
前記高さ基準型盤の中心高さと前記温度制御対象型盤の中心高さとの差を測定する変位測定手段と、
前記温度制御対象型盤の中心高さが前記高さ基準型盤の中心高さと同じになるように、前記変位測定手段により測定された前記高さ基準型盤の中心高さと前記温度制御対象型盤の中心高さとの差に基づいて、前記温度調節手段により前記温度制御対象型盤の温度を制御する温度制御装置と、
を有することを特徴とする型盤の中心位置調整機能を備えた射出成形機の型締装置。 In a mold clamping device of an injection molding machine having a movable platen for holding a movable side mold and a fixed platen for holding a fixed side die,
Either one of the movable platen and the fixed platen is a temperature control target type platen, and the other is a height reference type platen,
Temperature adjusting means disposed on the temperature control target mold plate;
A displacement measuring means for measuring a difference between a center height of the height reference pattern and a center height of the temperature control target pattern;
The center height of the height reference mold plate measured by the displacement measuring means and the temperature control target mold so that the center height of the temperature control target mold plate is the same as the center height of the height reference mold plate. A temperature control device that controls the temperature of the temperature control target mold board by the temperature adjusting means based on a difference from the center height of the board;
A mold clamping device for an injection molding machine having a function of adjusting the center position of the mold platen. 前記温度制御対象型盤の中心高さが前記高さ基準型盤の中心高さよりも低い場合に前記温度調節手段の設定温度を上げ、前記温度制御対象型盤の中心高さが前記高さ基準型盤の中心高さよりも高い場合に前記温度調節手段の設定温度を下げる制御を行う請求項１に記載の射出成形機の型締装置。   When the center height of the temperature control target mold is lower than the center height of the height reference mold, the set temperature of the temperature adjusting means is increased, and the center height of the temperature control target mold is the height reference The mold clamping device of an injection molding machine according to claim 1, wherein control is performed to lower the set temperature of the temperature adjusting means when the center height of the mold platen is higher. 前記温度制御対象型盤は、型盤の両側面に支持脚を有し、前記支持脚の少なくとも一方に温度調節手段を設けたことを特徴とする請求項１または２のいずれかに記載の射出成形機の型締装置。   3. The injection according to claim 1, wherein the temperature control target mold plate has support legs on both sides of the mold plate, and temperature adjusting means is provided on at least one of the support legs. 4. Mold clamping device for molding machine.
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