JP2015043564A - Radiation detection element substrate, inspection device for radiation detection element substrate and method for inspecting radiation detection element substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a radiation detection element substrate capable of inspecting a radiation detection element substrate having a plurality of channel terminals in one control pad without drastically adding or changing of the inspection device for the radiation detection element substrate having one transistor in one pixel, an inspection device for the radiation detection element substrate, and a method for inspecting the radiation detection element substrate.SOLUTION: A control pad 28 for inspection having first control terminals 22 for inspection in which control wirings M extend to the outside than a mounting substrate and are connected to each other, and control wirings G extend from first control terminals 14, is provided. The gate off voltage is applied to wiring terminals 24 at one time in which control wirings M are connected to each other, to perform the inspection.

Description

  The present invention relates to a radiation detection element substrate, a radiation detection element substrate inspection apparatus, and a radiation detection element substrate inspection method.

  In recent years, a radiation sensitive layer is disposed on a TFT (Thin Film Transistor) active matrix substrate (hereinafter simply referred to as a TFT substrate, but a TFT substrate used in a radiation detector may be particularly referred to as a radiation detection element substrate). However, radiation detectors (sometimes referred to as “electronic cassettes”, etc.) such as FPD (Flat Panel Detector) that can convert radiation dose into digital data (electrical signals) have been put into practical use. In addition, a radiation image capturing apparatus that captures a radiation image represented by the amount of irradiated radiation using this radiation detector has been put into practical use.

  Moreover, in the TFT substrate used for the electronic cassette as described above, there is a trend toward higher functionality by connecting a plurality of transistors in a pixel.

  For example, in Patent Document 1, in addition to the conventional 1 × 1 reading in which reading is performed for each pixel, 2 × 2 reading in which 4 × 2 × 2 pixels are collectively read as analog values is possible.

  In Patent Document 2, a read transistor and a reset transistor are provided, respectively, to achieve a high speed reset.

  On the other hand, electronic cassettes used for portable applications are becoming narrower, and a technique for connecting a plurality of transistors to one gate pad (hereinafter referred to as a control pad) has also been developed. In this technique, terminals of a plurality of channels (functions) can be adjacently arranged on one control pad, and channels (functions) to be operated can be selectively used according to the usage to be used.

JP 2012-130656 A JP 2013-033945 A

  A TFT substrate inspection apparatus often uses a liquid crystal TFT inspection apparatus, but the liquid crystal TFT generally has a structure having one transistor (switching element) per pixel. When a TFT substrate having a plurality of transistors for one pixel as in Patent Documents 1 and 2 and a terminal having a plurality of channels on one control pad as described above, an advanced level is provided for each channel during inspection. It is necessary to control. Since a general inspection apparatus does not assume such advanced control, a large amount of cost is required for remodeling the inspection apparatus to enable advanced control.

  The present invention has been made in consideration of the above-described facts, and it is possible to perform one control without making a large additional change to an inspection apparatus for inspecting a radiation detection element substrate having one switching element per pixel. An object of the present invention is to provide a radiation detection element substrate, a radiation detection element substrate inspection apparatus, and a radiation detection element substrate inspection method capable of inspecting a radiation detection element substrate having a plurality of channel terminals on a pad.

  In order to achieve the above object, a radiation detection element substrate of the present invention is provided corresponding to one pixel among a plurality of pixels, and includes a plurality of first switching elements and a plurality of switching elements for reading out charges generated according to radiation. First control connected to the control terminal of one or more second switching elements, the first switching elements provided for one or more of the pixels, and having a use different from the use of the first switching elements A first control terminal connected to the first switching element via the first wiring, and a first control terminal arranged side by side with the first control terminal, and the second control wiring connected to the control end of the second switching element via the second control wiring A first region including a second control terminal connected to the two switching elements and a signal terminal connected to the first switching element via a signal wiring connected to the output terminal of the first switching element; An inspection connection wiring section connected to the second control terminal; and an inspection first control terminal connected to the first control terminal, and provided in a portion adjacent to the first region and removed after the inspection is completed. And a second region.

  According to the radiation detection element substrate of the present invention, a plurality of first switching elements for reading out charges corresponding to one pixel generated in response to radiation, provided corresponding to one or more pixels among the plurality of pixels. The first switching element is connected to the first switching element via the first control wiring connected to the control terminal of the first switching element, at least one second switching element having a use different from that of the first switching element. A first control terminal, a second control terminal arranged side by side with the first control terminal, and connected to the second switching element via a second control wiring connected to the control end of the second switching element; and A radiation detection element substrate including a first region including a signal terminal connected to the first switching element via a signal wiring connected to an output end of the one switching element; The inspection connecting wiring connected to the second control terminal and the inspection first control terminal connected to the first control terminal are provided in the second region provided in the portion removed after the inspection adjacent to the first control terminal. ing.

  Thus, by providing the inspection connection wiring portion and the first control terminal for inspection in the second region provided in the portion to be removed after completion of the inspection adjacent to the first region, for inspection during the functional inspection of the substrate. By applying a voltage for turning off the second switching element to the connection wiring portion, it is possible to inspect a radiation detection element substrate having a plurality of channel terminals on one control pad using a conventional inspection apparatus. .

  The second region may be provided adjacent to the first control terminal and the first region on the second control terminal side, and may further include a connection terminal connected to the inspection connection wiring part. In this case, the connection terminals may be arranged so as to be arranged side by side with the first control terminal and the second control terminal.

  In addition, as the second switching element, a switching element for converting the resolution may be applied, a switching element for resetting the charge may be applied, or the charge may be accumulated. A switching element may be applied.

  In addition, when a test is performed on the test connection wiring portion, a voltage for turning off the second switching element is applied, so that the second switching element can be invalidated and a test can be performed using a conventional test apparatus.

  The second region is provided adjacent to the first control terminal and the first region on the second control terminal side, and connected to the connection terminal connected to the inspection connection wiring portion and the second control terminal. A second control terminal for inspection, and a third switching element that is provided between the connection terminal and the second control terminal for inspection and that turns off the second switching element by a voltage applied to the connection terminal. Good.

  The second area is provided adjacent to the first control terminal and the first area on the second control terminal side, and is connected to the connection wiring portion for inspection and to the inspection terminal connected to the second control terminal. You may make it further include a 2nd control terminal and the switching part which switches the switching element turned off by the voltage applied to the connection terminal to a 1st switching element or a 2nd switching element.

  Further, the first control terminal and the second control terminal may be arranged at positions shifted in a direction intersecting with the arrangement direction according to the order of arrangement.

  The first control terminal for inspection may be arranged at a position shifted in a direction intersecting with the arrangement direction according to the order of arrangement.

  On the other hand, the inspection apparatus for a radiation detection element substrate according to the present invention is provided corresponding to each one of a plurality of pixels, and includes a plurality of first switching elements and a plurality of pixels for reading out charges generated according to radiation. First control wiring connected to the control terminal of the first switching element, one or more second switching elements provided in correspondence with one or more pixels of the first switching element. A first control terminal connected to the first switching element via the first switching terminal, and a second switching line arranged via the second control wiring connected to the control end of the second switching element. A first region including a second control terminal connected to the element and a signal terminal connected to the first switching element via a signal wiring connected to the output end of the first switching element; A second connecting portion including a connecting wiring portion for inspection connected to the control terminal and a first control terminal for inspection connected to the first control terminal; A first probe unit for contacting the first control terminal for inspection on the radiation detection element substrate including the region, a second probe unit for contacting the signal terminal, and second switching to the connection wiring section for inspection And a voltage application unit for applying a voltage for turning off the element.

  According to the radiation detection element substrate inspection apparatus of the present invention, a voltage application unit for applying a voltage for turning off the second switching element to the inspection connection wiring part is replaced with a conventional inspection apparatus (one switching element per pixel). The radiation detection element substrate inspection apparatus having the above. Accordingly, the radiation detection element having a plurality of channel terminals on one control pad, as in the prior art, by bringing the first probe unit into contact with the first control terminal for inspection and bringing the second probe unit into contact with the signal terminal. The substrate can be inspected.

  Note that the voltage application unit may apply a voltage for turning off the second switching element from an empty terminal of the first probe unit or the second probe unit.

  Furthermore, in the inspection method for a radiation detection element substrate of the present invention, a plurality of first switching elements, a plurality of pixels, which are provided corresponding to each one of a plurality of pixels and read out charges generated according to radiation. First control wiring connected to the control terminal of the first switching element, one or more second switching elements provided in correspondence with one or more pixels of the first switching element. A first control terminal connected to the first switching element via the first switching terminal, and a second switching line arranged via the second control wiring connected to the control end of the second switching element. A first region including a second control terminal connected to the element and a signal terminal connected to the first switching element via a signal wiring connected to the output end of the first switching element; The inspection wiring line connected to the second control terminal and the first control terminal for inspection connected to the first control terminal, and is provided in a portion adjacent to the first area and removed after completion of the inspection. A voltage for turning on the first switching element is applied from the first control terminal for inspection to a connection wiring portion for inspection in the radiation detection element substrate having two regions in a state where the voltage for turning off the second switching element is applied. A voltage applying step, a storage step of applying a constant voltage from the signal terminal in a state in which a voltage for turning on the first switching element is applied in the voltage applying step, and accumulating charges in each pixel, and a first control terminal for inspection Applying a voltage to turn off the first switching element to hold the charge accumulation of each pixel in the accumulation step for a certain period of time, and a first switch from the first control terminal for inspection. By applying a voltage that turns on the quenching device, a reading step of reading the charges held by the holding step from the signal terminal, by performing, for an inspection of the radiation detecting element substrate.

  According to the method for inspecting a radiation detection element substrate of the present invention, a conventional inspection (radiation detection element having one switching element per pixel) in a state where a voltage for turning off the second switching element is applied to the inspection connection wiring portion. The inspection is performed in the same manner as the inspection of the substrate. Therefore, just by applying a voltage for turning off the second switching element to the inspection connection wiring portion, the second switching element is invalidated, and a plurality of signals are applied to one pixel using the first control terminal for inspection. It is possible to inspect the radiation detection element substrate having the switching elements.

  As described above, according to the present invention, a single control pad has a plurality of channel terminals without significant additional changes to the inspection apparatus for inspecting a radiation detection element substrate having one switching element per pixel. The radiation detection element substrate capable of inspecting the radiation detection element substrate, the radiation detection element substrate inspection apparatus, and the radiation detection element substrate inspection method can be provided.

It is a schematic block diagram of an example of the radiographic imaging system which concerns on this Embodiment. It is a figure which shows the structure of an example of the 1st area | region of the radiation detection element board | substrate which concerns on this Embodiment. It is a figure which shows an example of the conventional test | inspection apparatus which test | inspects the radiation detection element board | substrate with which one transistor was provided in one pixel. It is a figure which shows the structure of an example of the radiation detection element board | substrate which concerns on this Embodiment. It is a figure which shows an example of the test | inspection apparatus which performs the conduction | electrical_connection test of the radiation detection element board | substrate which concerns on this Embodiment. It is a timing chart which shows an example of the test | inspection sequence by the test | inspection apparatus which performs the conduction | electrical_connection test of the radiation detection element board | substrate which concerns on this Embodiment. It is a figure which shows the 1st modification of a structure of the radiation detection element board | substrate which concerns on this Embodiment. It is a figure which shows the 2nd modification of a structure of the radiation detection element board | substrate which concerns on this Embodiment. It is a figure which shows an example in case the number of transistors connected to a pixel is three. It is a figure which shows the modification at the time of shifting and arrange | positioning a 1st control terminal and a 2nd control terminal in 2 rows according to the sequence of an arrangement | sequence. It is a figure which shows the modification at the time of shifting and arrange | positioning a 1st control terminal and a 2nd control terminal in 3 rows according to the sequence of an arrangement | sequence. It is a figure which shows the other modification at the time of shifting and arrange | positioning a 1st control terminal and a 2nd control terminal in 2 rows according to the sequence of an arrangement | sequence. It is a figure which shows the modification when the 1st control terminal for a test | inspection is shifted and arrange | positioned according to the order of arrangement | sequence in 2 rows.

  First, a schematic configuration of a radiographic imaging system using a radiographic imaging apparatus including a radiation detection element substrate according to the present embodiment will be described. FIG. 1 is a schematic configuration diagram of an example of a radiographic image capturing system according to the present embodiment.

  The radiographic imaging system 100 includes a radiation irradiation device 104 that irradiates a subject 102 with radiation (for example, X-ray (X-ray), etc.), and radiation detection that detects radiation irradiated from the radiation irradiation device 104 and transmitted through the subject 102. A radiographic image capturing apparatus 108 including a device 106, and a control apparatus 110 for instructing radiographic image capturing and acquiring a radiographic image from the radiographic image capturing apparatus 108. At the timing based on the control of the control device 110, the radiation carrying the image information by passing through the subject 102 irradiated from the radiation irradiation device 104 and positioned at the imaging position is irradiated to the radiographic imaging device 108.

  The radiographic image capturing system 100 has a function of performing still image capturing and moving image capturing, and the control device 110 performs still image capturing and moving image based on a user instruction or control of the radiation irradiation device 104. The radiographing apparatus 108 is instructed to switch which radiographing is performed.

  The radiographic imaging device 108 includes a radiation detector 106. The radiation detector 106 has a function of generating charges according to the amount of radiation transmitted through the subject 102, and generating and outputting image information indicating a radiation image based on the charge amount of the generated charges.

  Subsequently, a radiation detection element substrate applied to the radiation detector 106 according to the present exemplary embodiment will be described. The radiation detection element substrate according to the present embodiment includes a first region and a second region. FIG. 2 is a diagram showing the configuration of the first region of the radiation detection element substrate according to the present embodiment. In the present embodiment, an indirect conversion type radiation detection element substrate that once converts radiation such as X-rays into light and converts the converted light into electric charge will be described as an example. A conversion type radiation detection element substrate may be used. In the present embodiment, the first region refers to a region corresponding to a substrate that may be referred to as a so-called mounting substrate.

  In the first region 11 of the radiation detection element substrate 10 applied to the radiation detector according to the present exemplary embodiment, the sensor unit 12 that receives light to generate charges and accumulates the generated charges is included in the sensor unit 12. A plurality of pixels 20 including two transistors Tr1 and Tr2 which are switching elements for reading out the accumulated charges are arranged in a matrix. In the present embodiment, the sensor unit 12 generates electric charges by irradiating the sensor unit 12 with light converted from radiation by the scintillator.

  The pixel 20 has one direction (control wiring direction corresponding to the horizontal direction in FIG. 2, hereinafter also referred to as “row direction”) and a cross direction with respect to the row direction (signal wiring direction corresponding to the vertical direction in FIG. 2, hereinafter referred to as “column direction”. Are also arranged in a matrix. In FIG. 2, the arrangement of the pixels 20 is simplified, but for example, 1024 × 1024 pixels 20 are arranged in the row direction and the column direction.

  The radiation detection element substrate 10 includes a plurality of control wirings G (G1 to G8 in FIG. 2) for controlling on / off of the transistor Tr1 and a plurality of controls for controlling on / off of the transistor Tr2. A wiring M (M1 to M4 in FIG. 2) and a plurality of signal wirings D (D1 to D5 in FIG. 2) provided for each column of the pixels 20 for reading out the charges accumulated in the sensor unit 12. Are provided so as to cross each other.

  The sensor unit 12 of each pixel 20 is connected to a common wiring (not shown), and a bias voltage is applied from a power source (not shown) via the common wiring.

  A control terminal of each transistor Tr1 is connected to the control wiring G, and a control signal for switching each transistor Tr1 flows. Thus, when the control signal flows through each control wiring G, each transistor Tr1 is switched. The control wiring M is connected to the control terminal of each transistor Tr2, and a control signal for switching each transistor Tr2 flows. As described above, when the control signal flows through each control wiring M, each transistor Tr2 is switched.

  To the signal wiring D, the output terminal of the transistor Tr1 and the output terminal of the transistor Tr2 of each pixel 20 are connected. In the signal wiring D, an electrical signal corresponding to the amount of charge accumulated in each pixel 20 flows through the transistor Tr1 or the transistor Tr2 in accordance with the switching state of the transistor Tr1 and the switching state of the transistor Tr2.

  In the present embodiment, as shown in FIG. 2, the arrangement relationship of the transistor Tr1, the transistor Tr2, and the sensor unit 12 is inverted between the even lines and the odd lines of the control wiring G (upside down in FIG. 2).

  The control wiring G is connected to the first control terminal 14, the control wiring M is connected to the second control terminal 16, and the signal wiring D is connected to the signal terminal 18. In the present embodiment, the first control terminal 14 and the second control terminal 16 are provided on the same control pad 26, and the control pad 26 is disposed on one side of the radiation detection element substrate 10.

  In the radiation detection element substrate 10 according to the present exemplary embodiment, imaging with two different resolutions is possible. In the following, the higher resolution of the two resolutions is referred to as high resolution, and the lower resolution is referred to as low resolution.

  That is, when performing high-resolution imaging, a control signal is input to the control wiring M via the second control terminal 16 so as to turn off the transistor Tr2, while sequentially turning on the transistor Tr1. A control signal is input to the control wiring G via the first control terminal 14. In the pixel 20 in which the transistor Tr1 is on, the charge is read from the sensor unit 12, and the charge of one pixel 20 is sequentially output to the signal wiring D.

  When performing low-resolution imaging, a control signal is input to the control wiring G via the first control terminal 14 so as to turn off the transistor Tr1, while sequentially turning on each transistor Tr2. A control signal is input to the control wiring M via the second control terminal 16. In the pixel 20 in which the transistor Tr2 is turned on, the charge is read from the sensor unit 12, and the charge is output to the signal wiring D. Here, the charges output to one signal wiring D are output collectively from the charges of the four pixels 20, and the resolution is lower than when the transistor Tr2 is turned off and the transistor Tr1 is turned on. .

  By the way, in the radiation detection element substrate 10, since a plurality of transistors Tr1 and Tr2 are provided in one pixel 20, a conventional inspection apparatus that inspects a radiation detection element substrate in which one transistor 20 is provided. Then, you can not perform the inspection.

  Here, a conventional inspection apparatus for inspecting a conventional radiation detection element substrate in which one transistor is provided in one pixel will be described. FIG. 3 is a diagram showing a conventional inspection apparatus for inspecting a radiation detection element substrate in which one transistor is provided in one pixel. In this embodiment, a case where a continuity test is performed will be described in detail as a specific example of the test.

  As shown in FIG. 3, the conventional inspection apparatus includes a first probe unit 30 for operating a control wiring, a second probe unit 32 for reading an image from a signal line, a first probe unit 30 and a second probe. And a control unit 34 for controlling the unit 32.

  Each of the first probe unit 30 and the second probe unit 32 includes a needle-like contact terminal (probe pin), and the first probe unit 30 is used as a control terminal GT for selecting a pixel for reading out the charge of the radiation detection element substrate. The second probe unit 32 is operated by being brought into contact with the signal terminals DT for reading out the charges of the radiation detection element substrate.

  The inspection sequence applies a gate-on voltage for each row from the first probe unit 30 to turn on a transistor that selects a pixel from which charges are read, and applies a constant voltage from the second probe unit 32 to charge each pixel 20. To accumulate. Next, a gate-off voltage is applied from the first probe unit 30 to turn off the transistor and hold it for a certain time. Subsequently, a gate-on voltage is applied to each row from the first probe unit 30 to turn on the transistors, and the second probe unit 32 reads an image and outputs a two-dimensional image to the control unit 34. Thereby, defects such as point defects and line defects are determined by the control unit 34 from the two-dimensional image.

  In the radiation detection element substrate having a plurality of transistors in one pixel as in the first region 11 of the radiation detection element substrate 10 of the present embodiment, inspection is performed using an inspection apparatus that cannot individually control each transistor. If it is performed, the accumulated charge leaks through the transistor Tr2 while the transistor Tr1 is turned off and held for a certain time, and even if it is not a defect, it is determined as a defect. Further, as in the first region 11 of the radiation detection element substrate 10 according to the present embodiment, two channel control terminals (the first control terminal 14 and the second control terminal 16) are provided on one side (on the same control pad). In the radiation detection element substrate that is arranged, there is a problem in that reading cannot be performed correctly when reading is performed for each row, and the substrate cannot be inspected.

  Therefore, the radiation detection element substrate 10 according to the present exemplary embodiment extends the control wiring M to a region outside the first region 11 that is a region surrounded by a one-dot chain line shown in FIG. The connection wiring portion 25 is provided in the second region 21. In addition, an inspection control pad 28 provided with the inspection first control terminal 22 by extending the control wiring G from the first control terminal 14 is provided in the second region 21. Specifically, as shown in FIG. 4, the radiation detection element substrate 10 according to the present exemplary embodiment is adjacent to the first region 11, the inspection connection wiring portion 25, the inspection control pad 28, and the connection terminal. A second region 21 including 24 is provided. When conducting the continuity test, the gate-off voltage is collectively applied to the connection terminals 24 where the control wirings M are connected to each other. In the present embodiment, “adjacent” includes not only the case where the adjacent positions are arranged without any gap but also the case where the adjacent positions are arranged with a gap. For example, another region may be provided between the first region 11 and the second region 21.

  That is, since the transistor Tr2 is turned off by collectively applying the gate-off voltage to the connection terminal 24, the accumulated charge is transferred to the transistor while the transistor Tr1 is turned off and held for a certain time. There is no leakage through Tr2. Therefore, it is possible to detect a pixel defect by a conventional inspection sequence.

  Further, since only the inspection first control terminal 22 is provided in the inspection control pad 28, the conventional first probe unit 30 can be used as it is.

  In addition, since the inspection control pad 28 is provided in the second region 21 outside the first region 11, there is no problem in mounting by removing it after the continuity inspection is completed by removing it. Further, by providing the inspection control pad 28 separately from the first region 11, the inspection first control terminal 22, which may be damaged by the inspection, is separated, and the first control terminal 14 without damage is radiated. It can be used for taking images.

  As shown in FIG. 4, the connection terminals 24 may be arranged in the second region 21 outside the first region 11 side by side with the second control terminal 16 in the first region 11. Further, the connection terminals 24 may be arranged in the second region 21 outside the first region 11 along with the first control terminals 14 in the first region 11. Accordingly, it is possible to apply the gate-off voltage using the empty terminal of the probe unit that is brought into contact with the first control terminal 14 or the second control terminal 16 when performing inspection.

  The connection terminal 24 may be provided in a region separate from the inspection control pad 28 (the inspection first control terminal 22) in the first region 11. In this case, the second region 21 may be a region including a plurality of regions. For example, the second region 21 may be provided for each channel. As a specific example, the second region 21 may be a region where the inspection control pad 28 is provided and a region where at least one of the inspection connection wiring portion 25 and the connection terminal 24 is provided. When a plurality of areas are provided in the second area 21 as described above, all the areas are adjacent to one side of the first area 11 (the side where the control pad 26 is provided in FIG. 4). It is not necessary to provide it. For example, the control pad 26 of the first region 11 is provided in any one of the region in which the inspection control pad 28 is provided and the region in which at least one of the inspection connection wiring portion 25 and the connection terminal 24 is provided. The other region may be provided on the opposite side (side) of the first region 11.

  FIG. 5 is a diagram illustrating an example of an inspection apparatus that performs continuity inspection of the radiation detection element substrate 10 according to the present embodiment.

  The inspection apparatus 50 for inspecting the radiation detection element substrate 10 according to the present embodiment includes a fixed potential application unit 36 that applies a fixed potential (gate off voltage) to the connection terminal 24 with respect to the conventional inspection apparatus shown in FIG. Have been added.

  As a method of applying a fixed potential by the fixed potential application unit 36, when the first probe unit 30 or the second probe unit 32 of the conventional inspection apparatus has an empty terminal, a gate-off voltage is applied using the empty terminal. Therefore, the conventional inspection apparatus can be used as it is.

  When the first probe unit 30 and the second probe unit 32 do not have a vacant terminal, a conventional power supply can be added as the fixed potential application unit 36 to use a conventional inspection apparatus as it is.

  In FIG. 5, in order to simplify the illustration, a state in which a fixed potential is directly applied from the fixed potential application unit 36 to the connection terminal 24 is not illustrated.

  Next, an inspection sequence by the inspection apparatus 50 that performs the continuity inspection of the radiation detection element substrate 10 according to the present embodiment will be described. FIG. 6 is a timing chart showing an inspection sequence by the inspection apparatus 50 that conducts a continuity inspection of the radiation detection element substrate 10 according to the present embodiment.

  In the present embodiment, the first probe unit 30 is brought into contact with the inspection control terminal 22 of the inspection control pad 28 of the radiation detection element substrate 10, and the second probe unit is brought into contact with the signal terminal 18 of the radiation detection element substrate 10. The fixed potential 36 is connected to the connection terminal 24 to operate. That is, the continuity test is performed in a state where the gate-off voltage is applied from the fixed potential 36 to all the second control terminals 16 through the connection terminals 24 at once.

  In the present embodiment, a gate-off voltage is applied to all the second control terminals 16 at once, whereby the transistor Tr2 is turned off and invalidated, and then a continuity test is performed. The continuity test is performed in the same manner as the conventional test sequence described above.

  That is, the gate-on voltage is applied to each row from the first probe unit 30 to turn on the transistor Tr1, and a constant voltage is applied from the second probe unit 32 to accumulate charges in each pixel 20. Next, a gate-off voltage is applied from the first probe unit 30 to turn off the transistor Tr1 and hold it for a certain time. Subsequently, a gate-on voltage is applied to each row from the first probe unit 30 to turn on the transistor Tr1, and image reading is performed by the second probe unit 32 to output a two-dimensional image to the control unit 34. Thereby, defects such as point defects and line defects are determined by the control unit 34 from the two-dimensional image.

  Here, when a defect such as a disconnection or a short circuit occurs in the signal wiring D, the control wiring G, and the transistor Tr1, a defective portion can be identified from the two-dimensional image as in the conventional inspection. In addition, even when a defect such as a disconnection or a short circuit occurs in the control wiring M or the transistor Tr2, the transistor Tr2 cannot be operated normally, so that the signal of the related pixel cannot be read accurately and output. The defect can be detected from the two-dimensional image.

  In the prior art, a large amount of cost was generated for the production of the dedicated probe unit and the development of the control software, which had become a bottleneck in the development of the substrate. By doing so, it becomes possible to divert the conventional inspection apparatus as it is, and a significant cost reduction can be realized.

  Then, the modification of the radiation detection element board | substrate 10 which concerns on this Embodiment is demonstrated. FIG. 7 is a diagram illustrating a first modification of the configuration of the radiation detection element substrate 10 including the first region 11 and the second region 21 according to the present embodiment.

  In the above-described embodiment, the control wiring M is extended to a region outside the mounting substrate by the one-dot chain line in FIG. 4 and connected to each other, and the control wiring G is also extended from the first control terminal 14 to be inspected. Although the example in which the inspection control pad 28 having the first control terminal 22 is provided has been described, in the modification, the control wiring M is further extended from the second control terminal 16 to control the inspection second control terminal 23. In addition to being provided on the pad 28, the inspection second control terminal 23 can be electrically separated from the inspection control pad 28 by the transistor Tr3.

  Specifically, the control wiring M is extended to the second region 21 adjacent to the first region 11, and the inspection second control terminal 23 is provided on the inspection control pad 28. A transistor Tr3 is provided between the second control terminal 16 and the inspection second control terminal 23, and the control wiring M is connected to the connection terminal 24 via the transistor Tr3.

  The radiation detection element substrate 10 according to the first modification can be operated in the same manner as in the above embodiment by applying a gate-off voltage to the connection terminal 24.

  FIG. 8 is a diagram illustrating a second modification of the configuration of the radiation detection element substrate 10 including the first region 11 and the second region 21 according to the present embodiment.

  In the first modification, the inspection second control terminal 23 is provided on the inspection control pad 28 via the transistor Tr3 with respect to the radiation detection tissue plate 10 shown in FIG. However, in the second modified example, the inspection control pad 28 is provided in which the channel to be inspected (the first control terminal 14 or the second control terminal 16) can be switched.

  Specifically, as shown in FIG. 8, two transistors Tr4 and Tr5 are provided between each control terminal (first control terminal 14 and second control terminal 16) and each inspection control terminal. That is, the connection terminal 24 for collectively applying the gate-off voltage and each control terminal (the first control terminal 14 and the second control terminal 16) are connected to the source-drain of one transistor Tr4. . The gate of the transistor Tr4 connected to the first control terminal 14 is connected to a switch SW2 that is an example of a switching unit, and the gate of the transistor Tr4 connected to the second control terminal 16 is an example of a switching unit. Connected to the switch SW1.

  On the other hand, the source-drain of the other transistor Tr5 has control terminals (first control terminal 14 and second control terminal 16) and test control terminals (test first control terminal 22 and test second control). Terminal 23). The gate of the transistor Tr5 connected to the first control terminal 14 is connected to the switch SW1, and the gate of the transistor Tr5 connected to the second control terminal 16 is connected to the switch SW2.

  Thus, by switching the switches SW1 and SW2, a gate-off voltage is applied to one channel at a time, and the other channel can be inspected using the inspection control terminal.

  For example, when a channel on the first control terminal 14 side is inspected, a gate-on voltage is applied to the switch SW1 and a gate-off voltage is applied to the switch SW2, thereby electrically connecting the channel on the second control terminal 16 side. By separating and applying a gate-off voltage to the connection terminal 24, the continuity test of the channel on the first control terminal 14 side can be performed as in the conventional case. Further, when inspecting the channel on the second control terminal 16 side, it is possible to inspect the channel on the second control terminal 16 side by applying a gate-off voltage to the switch SW1 and applying a gate-on voltage to the switch SW2. Become. At this time, as described above, since the inspection apparatus performs reading for each line, there is a problem that a channel portion that is not operated is output as a disconnection. However, since the coordinates of the channels not to be operated are known, it is possible to extract only the necessary images by image processing, and it is possible to eliminate the problem by performing image determination.

  Further, in the radiation detection tissue plate 10 shown in FIG. 8, when the switch SW1 is turned on and the switch SW2 is turned off, the operation in the case of a product can be performed. In this case, these configurations may be provided not in the first region 11 but in the first region 11.

  In the first modification and the second modification, the transistor Tr3 or the transistors Tr4 and Tr5 and the switches SW1 and SW2 are provided on the second region 21, but like the connection terminal 24 described above, Needless to say, it may be provided in a separate area from the inspection control pad 28 (inspection first control terminal 22) and the like. Needless to say, it may be provided in a separate area from the connection terminal 24, the control pad 26, and the like.

  In the present embodiment, the radiation detection element substrate 10 having a resolution change transistor in one pixel has been described as an example. However, the function of the transistor connected to the pixel is not limited. A device having a transistor with a function (for example, a reset transistor for charge resetting or a storage transistor for charge storage) may be applied.

  In this embodiment, an example in which a plurality of transistors are connected to all the pixels has been described. However, a plurality of transistors need not be connected to all the pixels, and only at least one specific pixel is a transistor. May be applied to a radiation detection element substrate in which there are a plurality of (for example, two), and other pixels have one transistor. Further, there is no upper limit to the number of transistors connected to one pixel, and it may be three or more. For example, as shown in FIG. 9, a reset transistor TrA that resets the charge of the sensor unit 12, a storage transistor TrB that stores the charge generated in the sensor unit, a read transistor TrC that reads the charge stored in the storage transistor, May be applied to a radiation detection element substrate having one pixel. However, when three or more transistors are provided, when conducting a continuity test, a gate-off signal other than the 1 × 1 image reading transistor is collectively applied and separated.

  Further, in the above embodiment, when all the pixels are provided with the transistor Tr2 and read out at a low resolution, the transistor Tr1 is turned off and the transistor Tr2 is turned on to read out the four pixels all together. Although an example of performing reading has been described, the resolution conversion method by the transistor Tr2 is not limited to this. For example, the transistor Tr2 is provided for each of a plurality of pixels, such as one for every four pixels, instead of all the pixels, and the transistor Tr1 is turned off and the transistor Tr2 is turned on to perform low-resolution reading. You may do it.

  In the above embodiment, the first control terminal 14 and the second control terminal 16 are provided on the control pad 26 so as to be arranged in a line along the side of the first region 11. The arrangement of 14 and the second control terminal 16 is not limited to the above embodiment. Variations of the arrangement of the first control terminal 14 and the second control terminal 16 are shown in FIGS. 10 to 12 show a case where the first control terminal 14 and the second control terminal 16 are arranged so as to be shifted in a direction crossing the arrangement direction according to the arrangement order. The control pad 26 shown in FIG. 10 shows an example when the first control terminal 14 and the second control terminal 16 are arranged in two rows. In the case of the modification shown in FIG. 10, the entire arrangement order is the even-numbered first control terminal 14 or the second control terminal 16 and the odd-numbered first control terminal 14 or the second control terminal 16. The sequence is different. Moreover, the control pad 26 shown in FIG. 11 shows an example when the first control terminal 14 and the second control terminal 16 are arranged in three rows. In the case of the modification shown in FIG. 11, the first control terminal 14 or the second control terminal 16 in the order in which the entire arrangement order is divisible by 3 and the first control terminal 14 in the order in which the remainder is divided by 3 are obtained. Alternatively, the arrangement differs between the second control terminal 16 and the first control terminal 14 or the second control terminal 16 in the order of one surplus when divided by 3. Further, the control pad 26 shown in FIG. 13 shows another example when the first control terminal 14 and the second control terminal 16 are arranged in two rows. In the modification shown in FIG. 13, the first control terminal 14 and the second control terminal 16 are arranged differently. Needless to say, the same arrangement may be applied when the inspection second control terminal 23 is provided. As described above, when the first control terminal 14 and the second control terminal 16 are provided side by side, by providing the first control terminal 14 and the second control terminal 16 in a plurality of arrangements, the adjacent control terminals (the first control terminal 14 or the first control terminal 14 or the first control terminal 14 or The distance between the two control terminals 16) can be increased. Therefore, the area of the control terminal can be increased. Needless to say, the modification in which the first control terminal 14 and the second control terminal 16 are provided on the control pad 26 in a plurality of arrangements is not limited to that illustrated in FIGS. As a modification, for example, it may be arranged in four or more rows.

  The arrangement of the first control terminal 22 for inspection is the same as that of the first control terminal 14 and the second control terminal 16. In the above embodiment, the inspection first control terminals 22 are provided on the inspection control pad 28 so as to be arranged in a line along the side of the second region 21. The arrangement is not limited to the above embodiment. For example, the inspection first control terminal 22 may also be arranged shifted in a direction intersecting the arrangement direction according to the arrangement order, similarly to the first control terminal 14 and the second control terminal 16 described above. A modification of the arrangement of the inspection first control terminals 22 is shown in FIG. The inspection control pad 28 shown in FIG. 13 shows an example when the inspection first control terminals 22 are arranged in two rows. In the modification shown in FIG. 13, the entire arrangement order is different between the even-numbered first inspection control terminals 22 and the odd-numbered first control terminals 22 for inspection. Needless to say, the modification in which the inspection control pads 28 are provided with the inspection first control terminals 22 in a plurality of arrangements is not limited to that illustrated in FIG. 13. As a modification, for example, it may be arranged in three or more rows.

  Moreover, in this Embodiment, although the inspection apparatus which performs a conduction | electrical_connection inspection was demonstrated in detail as a test | inspection performed with respect to the radiation detection element board | substrate 10, it is not limited to this, and this embodiment also applies to an inspection apparatus that performs other inspections. Needless to say, the present invention can also be applied to an inspection apparatus that performs a function inspection (function test), as in the embodiment.

  In the radiation detection element substrate 10 after the removal of the second region 21 shown in FIG. 2, the control wiring G is provided up to the first control terminal 14, and the control wiring M is provided up to the second control terminal 16. However, the state of the control wirings G and M is not limited to the state shown in FIG. For example, as described above, the control lines G and M pass through the first control terminal 14 or the second control terminal 16 and extend to the outside of the first region 11, that is, the second region 21. Even after the removal of the second region 21, the first region may pass through the first control terminal 14 or the second control terminal 16 and extend to the edge of the first region 11. In this case, it is preferable to perform the processing of the end portions of the control wirings G and M so that the end portions of the extended control wirings G and M are not exposed to the cross section (separated surface) of the first region 11.

  Moreover, the radiation in this Embodiment is not specifically limited, X-rays, a gamma ray, etc. can be applied.

  In addition, the configuration, operation, and the like of the radiation detection element substrate 10 and the like described in this embodiment are merely examples, and it goes without saying that they can be changed according to the situation without departing from the gist of the present invention.

DESCRIPTION OF SYMBOLS 10 Radiation detection element board | substrate 11 1st area | region 12 Sensor part 14 1st control terminal 16 2nd control terminal 18 Signal terminal 20 Pixel 21 2nd area | region 22 Inspection connection wiring part 24 Connection terminal 25 Inspection connection wiring part 30 1st probe Unit 32 Second probe unit 34 Control unit 36 Fixed potential application section D Signal wiring G, M Control wiring SW1, SW2 Switch Tr1, Tr2 Transistor TrA Reset transistor TrB Storage transistor TrC Read transistor

Claims (14)

A plurality of first switching elements provided corresponding to each one of the plurality of pixels and for reading out charges generated in response to radiation;
One or more second switching elements provided corresponding to one or more pixels of the plurality of pixels and having a use different from the use of the first switching element;
A first control terminal connected to the first switching element via a first control wiring connected to a control end of the first switching element;
A second control terminal arranged side by side with the first control terminal and connected to the second switching element via a second control wiring connected to a control end of the second switching element;
And a signal terminal connected to the first switching element via a signal wiring connected to the output end of the first switching element,
A first region including:
A connection wiring portion for inspection connected to the second control terminal;
And a first control terminal for inspection connected to the first control terminal,
A second region provided in a portion adjacent to the first region, which is removed after completion of the inspection,
A radiation detection element substrate.   The second region further includes a connection terminal provided adjacent to the first region on the first control terminal and the second control terminal side and connected to the inspection connection wiring portion. The radiation detection element substrate as described.   The radiation detection element substrate according to claim 2, wherein the connection terminals are arranged so as to be arranged side by side with the first control terminal and the second control terminal.   The radiation detection element substrate according to claim 1, wherein the second switching element is for resolution conversion.   The radiation detection element substrate according to claim 1, wherein the second switching element is for resetting the electric charge.   The radiation detection element substrate according to claim 1, wherein the second switching element is for accumulating the electric charge.   The radiation detection element substrate according to any one of claims 1 to 6, wherein a voltage for turning off the second switching element is applied to the inspection connection wiring portion when the inspection is performed. The second region is provided adjacent to the first region on the first control terminal and the second control terminal side, and
A connection terminal connected to the inspection connection wiring portion;
A second control terminal for inspection connected to the second control terminal;
A third switching element that is provided between the connection terminal and the second control terminal for inspection, and turns off the second switching element by a voltage applied to the connection terminal;
The radiation detection element substrate according to claim 1, further comprising: The second region is provided adjacent to the first region on the first control terminal and the second control terminal side, and
A connection terminal connected to the inspection connection wiring portion;
A second control terminal for inspection connected to the second control terminal;
A switching unit that switches a switching element that is turned off by a voltage applied to the connection terminal to the first switching element or the second switching element;
The radiation detection element substrate according to claim 1, further comprising: The first control terminal and the second control terminal are arranged at positions shifted in a direction intersecting the arrangement direction according to the order of arrangement.
The radiation detection element board | substrate of any one of Claims 1-9.   The radiation detection element substrate according to claim 1, wherein the first control terminal for inspection is arranged at a position shifted in a direction intersecting with the arrangement direction according to the order of arrangement. A plurality of first switching elements are provided corresponding to one pixel among the plurality of pixels, and are provided corresponding to one or more pixels among the plurality of pixels, for reading out charges generated in response to radiation. One or more second switching elements having different uses from the first switching element, and connected to the first switching element via a first control wiring connected to a control end of the first switching element. The first control terminal is arranged side by side with the first control terminal, and the second control terminal is connected to the second switching element via the second control wiring connected to the control end of the second switching element. A first region including a control terminal and a signal terminal connected to the first switching element via a signal wiring connected to an output end of the first switching element; and the second control terminal A second region provided in a portion to be removed after completion of the inspection, including the connected inspection connection wiring portion and the first control terminal for inspection connected to the first control terminal; A first probe unit for making contact with the first control terminal for inspection in a radiation detection element substrate comprising:
A second probe unit for contacting the signal terminal;
A voltage application unit for applying a voltage to turn off the second switching element to the inspection connection wiring unit;
An inspection apparatus for a radiation detection element substrate, comprising:   The radiation detection element substrate inspection apparatus according to claim 12, wherein the voltage application unit applies a voltage for turning off the second switching element from an empty terminal of the first probe unit or the second probe unit. A plurality of first switching elements are provided corresponding to one pixel among the plurality of pixels, and are provided corresponding to one or more pixels among the plurality of pixels, for reading out charges generated in response to radiation. One or more second switching elements having different uses from the first switching element, and connected to the first switching element via a first control wiring connected to a control end of the first switching element. The first control terminal is arranged side by side with the first control terminal, and the second control terminal is connected to the second switching element via the second control wiring connected to the control end of the second switching element. A first region including a control terminal and a signal terminal connected to the first switching element via a signal wiring connected to an output end of the first switching element; and the second control terminal A second region provided in a portion to be removed after completion of the inspection, including the connected inspection connection wiring portion and the first control terminal for inspection connected to the first control terminal; In a state in which a voltage for turning off the second switching element is applied to the inspection connection wiring part in the radiation detection element substrate comprising:
A voltage applying step of applying a voltage for turning on the first switching element from the first control terminal for inspection;
An accumulation step of accumulating charges in each pixel by applying a constant voltage from the signal terminal in a state where a voltage for turning on the first switching element is applied in the voltage application step;
A holding step of applying a voltage for turning off the first switching element from the first control terminal for inspection to hold the charge accumulation of each pixel in the accumulation step for a certain period of time;
A reading step of applying a voltage for turning on the first switching element from the first control terminal for inspection and reading out the charge held in the holding step from the signal terminal;
A method for inspecting a radiation detection element substrate, wherein the inspection of the radiation detection element substrate is carried out.

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