JP2015041745A - Noise countermeasure component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a noise countermeasure component that can be attached onto a printed wiring board easier than a conventional product.SOLUTION: A noise countermeasure component has a magnetic body 11 shaped to have through holes 11A-11C, a holding part 12 formed of an electric insulation material and holding the magnetic body 11, and solder joints 13, 13 attached to the holding part 12 and capable of soldering to a printed wiring board 15. The noise countermeasure component can be attached onto the printed wiring board 15 by soldering the solder joints 13, 13 to the printed wiring board 15. When an electronic component 18 having leads 18A-18C is mounted on the printed wiring board 15, it is attached onto the printed wiring board 15 to bring about a state where the leads 18A-18C are caused to pass through the through holes 11A-11C.

Description

  The present invention relates to a noise countermeasure component through which a lead of an electronic component is passed.

  Conventionally, as one of noise countermeasures for electronic components, a structure in which an annular magnetic body is arranged on a printed wiring board and the lead of the electronic component is passed through a through hole of the annular magnetic body is known. (For example, refer to Patent Document 1).

Japanese Patent Laid-Open No. 11-54978

  By the way, when mounting the electronic component, if the position of the annular magnetic body may be shifted on the printed wiring board, the position of the through hole formed in the annular magnetic body and the position of the through hole formed in the printed wiring board Will not match, making it difficult to insert the lead. In addition, if an external force is applied to the annular magnetic body due to the tip of the lead being caught by the annular magnetic body when the lead is inserted, the annular magnetic body may fall off the printed wiring board.

  In particular, when an electronic component is mounted by an automatic mounting machine, if the annular magnetic body is simply placed on the printed wiring board, the position of the annular magnetic body may be displaced due to vibration during the mounting process. In addition, when such a positional shift occurs, problems such as difficulty in inserting the lead or being caught by the tip of the lead occur when the electronic component is mounted as described above.

  Therefore, in order to avoid these problems, it is necessary to place the annular magnetic body at an appropriate position and to insert the lead while maintaining the position appropriately so as not to shift the position. However, since the annular magnetic body as described above is an extremely small part, it is not always easy to handle, and it takes a considerable amount of work to insert the lead while preventing misalignment.

  With respect to such a problem, in the technique described in Patent Document 1 described above, a stepped recess is formed in the peripheral edge of the upper surface of the through hole of the printed wiring board, and an annular magnetic body is fitted into the stepped recessed portion, thereby It has been proposed to perform positioning with a magnetic body.

  However, in order to form such a stepped recess, a special processing step that is not performed on a normal printed wiring board is required, which increases the cost accordingly. In addition, since the annular magnetic body is extremely small and difficult to handle, the work of fitting the annular magnetic body into the stepped recess also takes a considerable amount of work, resulting in a decrease in productivity, which also causes an increase in cost.

  In general, since this type of annular magnetic body has a large dimensional tolerance, it is not easy to form a stepped recess in which the annular magnetic body fits precisely and exactly. There is a case where a magnetic body cannot be inserted. For this reason, it is inevitable that the clearance of the step concave portion is designed to ensure a large diameter. However, in such a step concave portion having a large diameter, the position of the annular magnetic body is displaced in the step concave portion. Will end up.

  The technology described below is intended to solve the above-described problems, and one of its purposes is to provide a noise countermeasure component that can be mounted on a printed wiring board more easily than conventional products. is there.

  A noise countermeasure component described below includes a magnetic body having a shape having a through hole, a holding portion that is formed of an electrically insulating material and holds the magnetic body, and is attached to the holding portion. A solder joint that can be soldered to the printed wiring board by soldering the solder joint to the printed wiring board. When mounted on a printed wiring board, it is mounted on the printed wiring board and the lead is passed through the through hole.

  According to the noise countermeasure component configured as described above, the noise countermeasure component can be mounted on the printed wiring board by soldering the solder joint portion to the printed wiring board. Therefore, unlike those that cannot be fixed to the printed wiring board, if the noise countermeasure component is soldered to an appropriate position, the noise countermeasure component will not be displaced from its mounting position. It will not fall off. Therefore, when inserting the lead of the electronic component into the through hole of the magnetic body, it is not necessary to perform the insertion work while holding the noise countermeasure component, and the insertion mounting method (insert the lead into the hole formed in the printed wiring board) It is also possible to mount the electronic component by using an automatic mounting machine that can mount the electronic component by soldering.

  In addition, as with other electronic components soldered to the printed wiring board, this noise countermeasure component can be mounted with an automatic mounting machine, so it could not be mounted with such a method. Compared to the above, it is possible to easily and accurately mount the noise countermeasure component on the printed wiring board. In addition, it is not necessary to process the printed wiring board in advance when fixing the noise countermeasure component to the printed wiring board, so there is an extra man-hour compared to the conventional technology that requires prior processing to the printed wiring board. There is no increase.

By the way, in the noise countermeasure component as described above, it is preferable that the solder joint portion has a shape that can be soldered to the printed wiring board by a surface mounting method.
According to the noise countermeasure component configured in this way, the noise countermeasure component can be mounted using an automatic mounting machine capable of mounting electronic components by the surface mounting method. Compared with this, it is possible to improve the mounting efficiency of noise countermeasure parts and increase productivity.

  Further, in the noise countermeasure component as described above, the solder joint portion is configured by a metal wire bent in a substantially L shape, and one of the portions on both sides of the bent portion is inserted into the holding portion. It is preferable that it is attached to the holding part by being inserted, and the other part is a part to be soldered to the printed wiring board.

  According to the noise countermeasure component configured as described above, an intended solder joint can be formed by a metal wire bent in an L shape, and the structure of the solder joint becomes simple. Therefore, with such a solder joint, it is not necessary to use a complicated mold or the like, and a desired noise countermeasure component can be easily manufactured. Note that the metal wire bent in an L shape may be inserted into the holding portion after being bent into an L shape in advance, but the metal wire after the straight metal wire is inserted into the holding portion. The line may be bent in an L shape.

  Further, on the outer peripheral side of the bent portion, a region in which a solder fillet is formed between the solder joint portion and the holding portion when the solder joint portion is soldered to the printed wiring board. It is preferable that a void is provided.

  According to the noise countermeasure component configured as described above, when the solder joint is soldered to the printed wiring board, a solder fillet is formed in the gap on the outer peripheral side of the bent portion. On the other hand, noise countermeasure components can be firmly joined.

In the noise countermeasure component as described above, it is preferable that the solder joint portion has a shape that can be soldered to the printed wiring board by an insertion mounting method.
According to the noise countermeasure component configured as described above, the noise countermeasure component can be mounted using an automatic mounting machine capable of mounting an electronic component by the insertion mounting method, so that manual mounting is required. Compared with this, it is possible to improve the mounting efficiency of noise countermeasure parts and increase productivity.

  Further, in the noise countermeasure component as described above, the inner peripheral side of the through hole is covered with an electrically insulating material that forms the holding portion, so that the lead is inserted when the lead is passed through the through hole. Is preferably structured so as not to contact the magnetic body.

  According to the noise countermeasure component configured in this way, the lead and the magnetic body do not contact each other, so the lead and the magnetic body are not electrically connected, and the electronic component is connected to another energized location via the magnetic body. There is no problem of short circuit. Moreover, even if the electronic component is exothermic, the heat is not directly transmitted to the magnetic body through the lead, so that it is possible to suppress a decrease in performance due to the temperature rise of the magnetic body. .

In the noise countermeasure component as described above, it is preferable that the magnetic body has a plurality of the through holes.
According to the noise countermeasure component configured as described above, since the lead can be passed through each of the plurality of through holes, it is suitable for mounting an electronic component having a plurality of leads. When a plurality of through holes are formed for one magnetic body and leads are passed through each of the plurality of through holes, a short circuit is prevented if there is a risk of short-circuiting between the leads via the magnetic body. Therefore, it is preferable that measures are taken. For example, the inner peripheral surface of the through hole may be covered with an electrically insulating material so that the lead and the magnetic body are not in direct contact with each other.

  However, a through hole that is not covered with an electrically insulating material may exist as long as electrical conduction by a magnetic material does not occur between leads of an electronic component. For example, when n leads are passed through n through holes, if (n-1) through holes are covered with an electrically insulating material, the remaining one through hole is electrically insulated. Even if it is not covered with a material, the n leads are not short-circuited with each other, and therefore it is arbitrary whether or not all the n through holes are covered. In addition, if the electrical resistance value of the magnetic material is sufficiently large enough to be regarded as an electrically insulating material, even if a plurality of through holes are formed for one magnetic material, It is not essential to coat the inner peripheral surface of the hole with an electrically insulating material.

Moreover, in the noise countermeasure components as described above, it is preferable that the holding portion holds a plurality of the magnetic bodies.
According to the noise countermeasure component configured in this way, the lead can be passed through the through holes of each of the plurality of magnetic bodies, which is also suitable when mounting an electronic component having a plurality of leads. .

  Further, in the noise countermeasure component as described above, the solder joint portion is configured by a rectangular wire that is a strip-shaped metal wire, and the holding portion is attached with the rectangular wire that is the solder joint portion. An insertion hole into which a flat wire is inserted is formed, and the insertion hole has a substantially + -shaped cross section perpendicular to the insertion direction of the flat wire, and the flat wire is inserted into the insertion hole. Is preferably inserted even if the orientation of the rectangular wire is changed by 90 degrees.

  According to the noise countermeasure component configured as described above, when inserting the flat wire into the insertion hole, it can be inserted even if the orientation of the flat wire is changed by 90 degrees. Therefore, even if it is desired to configure two types of noise countermeasure parts in which the orientation of the rectangular wire is changed by 90 degrees, the holding part can be shared. Therefore, in order to form the holding part, it is only necessary to have the same mold. It is possible to reduce the cost by mass production effect by suppressing the mold investment.

  To give a more specific example, for example, when a flat wire is bent into a substantially L shape to be surface-mountable, each of the pair of insertion holes with the flat surfaces of the flat wire facing each other. If one end of the flat wire is inserted into the wire and the other end of the flat wire is bent in a direction away from each other, a solderable portion can be formed. On the other hand, when extending the flat wire into a shape that can be inserted and mounted, insert one end of the flat wire into each of the pair of insertion holes so that the flat surface of the flat wire is on the same plane. For example, radial taping can be performed using a flat surface of a flat wire. Therefore, in these cases, the orientation of the rectangular wire is changed by 90 degrees, but even in such a case, an insertion hole is formed in which the cross-sectional shape perpendicular to the insertion direction is substantially + -shaped. Then, the holding unit can be shared.

In the noise countermeasure component as described above, it is preferable that the magnetic body surrounds a range of ½ or more of the total length of the lead in a state where the lead is passed through the through hole.
According to the noise countermeasure component configured in this way, the magnetic body surrounds a range of 1/2 or more of the total length of the lead, so that the magnetic body surrounds only a range of less than 1/2 of the total length of the lead, A good noise countermeasure effect can be exhibited.

It is a figure which shows the noise countermeasure components illustrated as a 1st example, (A) is a top view, (B) is a front view, (C) is a right view, (D) is a bottom view, (E) is a perspective view. FIG. 2F is a cross-sectional view taken along the line IF-IF in FIG. It is a figure which shows the magnetic body with which the noise countermeasure component illustrated as a 1st example is equipped, (A) is a top view, (B) is a front view, (C) is a right view, (D) is a bottom view, E) is a perspective view. (A) is explanatory drawing which shows the use condition of the noise countermeasure component illustrated as a 1st example, (B) is an enlarged view of the IIIB part shown in FIG. 3 (A). It is a figure which shows the noise countermeasure components illustrated as a 2nd example, (A) is a top view, (B) is a front view, (C) is a right view, (D) is a rear view, (E) is a bottom view. (F) is a perspective view, (G) is a cross-sectional view taken along the line IVG-IVG in FIG. 4 (C), and (H) is a line IVH-IVH in FIG. 4 (B). Sectional drawing in the cut surface. It is a figure which shows the magnetic body with which the noise countermeasure component illustrated as a 2nd example is provided, (A) is a top view, (B) is a front view, (C) is a perspective view. It is a figure which shows the use condition of the noise countermeasure component illustrated as a 2nd example, (A) is explanatory drawing which shows the state which let the left lead pass the noise countermeasure component, (B) is a noise countermeasure component with the right lead. Explanatory drawing which shows the state which passed through, (C) is explanatory drawing which shows the state which passed the lead of the left side and the right side through each noise countermeasure component, respectively. It is a figure which shows the noise countermeasure components illustrated as a 3rd example, (A) is a top view, (B) is a front view, (C) is a right view, (D) is a rear view, (E) is a bottom view. FIG. 8F is a perspective view, and FIG. 7G is a cross-sectional view taken along the line VIIG-VIIG in FIG. Explanatory drawing which shows the use condition of the noise countermeasure component illustrated as a 3rd example. It is a figure which shows the noise countermeasure components illustrated as a 4th example, (A) is a top view, (B) is a front view, (C) is a right view, (D) is a rear view, (E) is a bottom view. FIG. 10F is a perspective view, and FIG. 9G is a cross-sectional view taken along the line IXG-IXG in FIG. It is a figure which shows the noise countermeasure components illustrated as a 5th example, (A) is a top view, (B) is a front view, (C) is a right view, (D) is a rear view, (E) is a bottom view. FIG. 10F is a perspective view, and FIG. 10G is a cross-sectional view taken along line XG-XG in FIG. It is a figure which shows the holding | maintenance part with which the noise countermeasure component illustrated as a 6th example is equipped, (A) is a top view, (B) is a front view, (C) is a right view, (D) is a bottom view, E) is a perspective view. It is a figure which shows the noise countermeasure components illustrated as a 6th example, or its part, (A) is sectional drawing in the cut surface shown by the XIIA-XIIA line | wire in FIG.11 (C), (B) is FIG. FIG. 12A is an explanatory diagram in which a surface mounting type solder joint is added to the configuration illustrated in FIG. 12A, and FIG. 12C is an explanation in which an insertion mounting type solder joint is added to the configuration illustrated in FIG. Figure.

  Next, the noise countermeasure component will be described with a more specific example. In the following description, the side shown in the plan view is the upper side, the side shown in the front view is the front side, the side shown in the left side view is the left side, the side shown in the right side view is the right side, and the side shown in the rear view is the rear side The side appearing in the bottom view is referred to as the lower side. Moreover, in the perspective view, the above-described directions of up, down, left, and right are also shown. However, each of these directions is only a direction specified for the purpose of concisely explaining the relative positional relationship of each part constituting the noise suppression component. What kind of noise suppression component is used when mounting the noise suppression component? It is arbitrary whether it arrange | positions toward a direction.

[First case]
A noise countermeasure component 10 shown in FIGS. 1A to 1F includes a magnetic body 11, a holding portion 12 that holds the magnetic body 11, and solder joint portions 13 and 13 attached to the holding portion 12. Prepare. Regarding the noise countermeasure component 10, the rear view appears the same as the front view, and the left side view appears the same as the right side view.

  The magnetic body 11 is made of ferrite and has a shape having three through holes 11A, 11B, and 11C as shown in FIGS. 2 (A) to 2 (E). In addition, regarding this magnetic body 11, the rear view appears the same as the front view, and the left side view appears the same as the right side view.

  The holding part 12 is formed of an electrically insulating resin material (for example, polyamide, polypropylene, polyethylene, etc.), and as shown in FIGS. It is molded into a shape that covers.

  The holding part 12 is formed in a shape that covers the inner peripheral side of the through holes 11A, 11B, and 11C, whereby the holding part 12 itself has a shape that forms the through holes 12A, 12B, and 12C. On the other hand, on the bottom surface side of the noise countermeasure component 10, the holding portion 12 does not cover the magnetic body 11 as shown in FIG. Therefore, the lower side (bottom surface) of the magnetic body 11 is exposed to the bottom surface side of the noise countermeasure component 10.

  The solder joints 13 and 13 are formed by bending a flat wire (a strip-shaped wire) formed of a metal material (for example, an iron-based alloy) into a substantially L shape when viewed from the front (FIG. 1F). reference.). The solder joints 13 and 13 are formed by press-fitting a flat wire into the holding portion 12 and then bending the flat wire.

  As shown in FIG. 3A, the noise countermeasure component 10 configured as described above is printed on a printed wiring board in a surface mounting manner by soldering solder joints 13 and 13 to the printed wiring board 15. 15 is mounted on. With such a noise countermeasure component 10, the noise countermeasure component 10 can be mounted on the printed wiring board 15 by a surface mounting type automatic mounting machine.

  Further, as shown in FIG. 3B, a gap 16 is provided between the solder joint portion 13 and the holding portion 12 on the outer peripheral side of the bent portion of the solder joint portion 13. Therefore, when the solder joint portion 13 is soldered to the printed wiring board 15, a solder fillet 17 is formed in the gap 16. Therefore, compared with the case where such a solder fillet 17 is not formed, the noise countermeasure component 10 is firmly bonded to the printed wiring board 15.

  In addition, as shown in FIG. 3A, the place where the solder fillet 17 is formed is provided at a position that is symmetrical in the state in which the noise countermeasure component 10 is viewed from the front. Therefore, when the surface tension acts on the solder joints 13 and 13 from the melted solder when the solder fillet 17 is formed, the noise countermeasure component 10 has a surface tension acting from the solder side on the left and right sides due to the self-alignment effect by the solder. Displace itself to an equal position. Therefore, even when a slight misalignment occurs when the noise countermeasure component 10 is mounted on the printed wiring board 15, after the solder paste is melted, an appropriate joining position corresponding to the solder paste application position is obtained. Since the noise countermeasure component 10 is displaced, the mounting position accuracy of the noise countermeasure component 10 can be increased.

  After mounting the noise countermeasure component 10 on the printed wiring board 15 in this way, as shown in FIG. 3A, an electronic component 18 (for example, FET) having leads 18A, 18B, and 18C is inserted and mounted. It is mounted on the printed wiring board 15 by a method. At this time, the leads 18A, 18B, and 18C included in the electronic component 18 are passed through the through holes 11A, 11B, and 11C included in the magnetic body 11 and the through holes 12A, 12B, and 12C included in the holding unit 12. .

  As described above, since the noise countermeasure component 10 is surface-mounted with sufficiently high positional accuracy, the lead 18A, which the electronic component 18 has, does not interfere with the guide pins on the automatic mounting machine side when the electronic component 18 is mounted. 18B and 18C can be appropriately introduced into the holes of the printed wiring board 15.

  In a state where the electronic component 18 is mounted on the printed wiring board 15, the magnetic body 11 attenuates the noise current flowing through the leads 18A, 18B, and 18C, and the noise countermeasure effect is exhibited. In particular, in the case of this example, the vertical dimension of the magnetic body 11 is a dimension surrounding a range of 1/2 or more with respect to the total length of each of the leads 18A, 18B, and 18C. Therefore, the effect of attenuating the noise current is higher than when thin ring-shaped ferrite that can surround only a range of less than 1/2 is attached to the leads 18A, 18B, and 18C.

  In the case of this example, the main body portion 18D of the electronic component 18 is mounted on the upper surface of the noise countermeasure component 10, so that the distance between the lower end of the main body portion 18D and the upper surface of the printed wiring board 15 is the vertical direction of the noise countermeasure component 10. It is in a state that matches the dimensions. That is, the noise countermeasure component 10 functions as a spacer that keeps the distance between the lower end of the main body portion 18D and the upper surface of the printed wiring board 15 at a predetermined distance. Therefore, if such a noise countermeasure component 10 is used, the protruding height of the electronic component 18 on the printed wiring board 15 can be made uniform, and variations between the plurality of electronic components 18 and a plurality of printed wirings can be achieved. It is possible to suppress the occurrence of variation between the plates 15 and to stabilize the noise countermeasure effect.

  In this case, the noise countermeasure component 10 also has an effect of preventing or suppressing the bending of the leads 18A, 18B, 18C by surrounding the leads 18A, 18B, 18C. Therefore, even when some external force is applied to the electronic component 18, the leads 18A, 18B, and 18C are less likely to bend and the electronic component 18 does not fall compared to when the noise countermeasure component 10 is not mounted. Further, since the noise countermeasure component 10 also suppresses the accumulation of dust around the leads 18A, 18B, 18C, the leads 18A, 18B, 18C are caused by the occurrence of condensation at the places where such dust has accumulated. Problems such as short circuiting can be prevented or suppressed.

  In the case of this example, the holding portion 12 covers the inner peripheral surfaces of the through holes 11A, 11B, and 11C also on the inner peripheral side of the through holes 11A, 11B, and 11C of the magnetic body 11. Therefore, even if the leads 18A, 18B, and 18C come into contact with the inner peripheral surfaces of the through holes 12A, 12B, and 12C of the holding portion 12, the leads 18A, 18B, and 18C do not contact the magnetic body 11.

  Therefore, the leads 18A, 18B, and 18C are not short-circuited via the magnetic body 11, and insulation between the leads 18A, 18B, and 18C can be ensured. In addition, since the holding portion 12 covers the inner peripheral surfaces of the through holes 11A, 11B, and 11C, heat on the leads 18A, 18B, and 18C side is hardly transmitted to the magnetic body 11. Therefore, compared with the case where the inner peripheral surfaces of the through holes 11A, 11B, and 11C are not covered, the temperature rise of the magnetic body 11 can be suppressed, and the impedance characteristic of the magnetic body 11 is caused by such a temperature rise. It is possible to prevent or suppress the decrease.

  Further, if the inner peripheral surfaces of the through holes 11A, 11B, and 11C are covered with the holding portion 12, it should be melted into the through holes 12A, 12B, and 12C of the holding portion 12 through the holes of the printed wiring board 15. Even if the solder enters, the holding portion 12 having low wettability with respect to the solder serves as a protective wall. Thereby, the molten solder that has entered one through hole (for example, the through hole 11A) is adjacent to the through hole (for example, the through hole 11B) or a lead (for example, the lead 18B) in the through hole. Can be prevented, and a short circuit between leads (for example, between the leads 18A and 18B) due to such molten solder can be prevented.

[Second case]
The noise suppression component 20 shown in FIGS. 4A to 4H has a structure in which one lead can be inserted into a magnetic body. In this respect, three leads are made into a magnetic body. This is different from the first case, which was designed to allow insertion.

  More specifically, the noise countermeasure component 20 includes a magnetic body 21, a holding portion 22 that holds the magnetic body 21, and solder joint portions 23 and 23 attached to the holding portion 22. In addition, regarding this noise countermeasure component 20, the left side view appears symmetrically with the right side view.

  The magnetic body 21 is made of ferrite, and has a cylindrical shape having a through hole 21A as shown in FIGS. Note that the left side view, right side view, and rear view of the magnetic body 21 appear the same as the front view.

  The holding portion 22 is formed of an electrically insulating resin material (for example, polyamide, polypropylene, polyethylene, etc.), and as shown in FIGS. Shaped to cover the side. That is, unlike the holding part 12 shown in the first case, the holding part 22 covers the lower side of the magnetic body 21.

  A tapered through hole 22A whose diameter increases toward the upper side is formed on the upper side of the holding part 22, and a through hole 22B having substantially the same diameter as the through hole 21A of the magnetic body 21 is formed on the lower side of the holding part 22. The through holes 22A, the through holes 21A, and the through holes 22B are arranged in series in the vertical direction, thereby penetrating the magnetic body 21 and the holding portion 22 in the vertical direction. On the upper surface of the holding portion 22, a suction surface 22F for suction by a suction nozzle (not shown) provided in the automatic mounting machine is formed.

  The solder joints 23, 23 are formed by bending a flat wire (a strip-shaped wire) formed of a metal material (for example, an iron-based alloy) into a substantially L shape when viewed from the front (see FIG. 4F). .), Which is similar to the first case.

  Similarly to the noise countermeasure component 10 shown in the first example, the noise countermeasure component 20 configured as described above can be mounted on the printed wiring board by the surface mounting method. Moreover, although detailed illustration is abbreviate | omitted in the 2nd example, the shape of the solder joint part 23 and 23 is also substantially L-shaped like the 1st example, A gap is provided as in the case. Therefore, a solder fillet is formed in the gap during soldering, and the effect obtained by forming the solder fillet is the same as in the first case.

  Also, as shown in FIGS. 6A to 6C, after the noise countermeasure component 20 is mounted on the printed wiring board 25, the electronic component 28 (for example, FET) having leads 28A, 28B, and 28C. ) Is mounted on the printed wiring board 25 by an insertion mounting method. At this time, either or both of the leads 28A and 28C included in the electronic component 28 are passed through the through hole 21A included in the magnetic body 21 and the through holes 22A and 22B included in the holding portion 22. . In a state where the electronic component 28 is mounted on the printed wiring board 25, the magnetic body 21 attenuates the noise current flowing through the leads 28A and 28C, and the noise countermeasure effect is exhibited.

  Also in this example, the vertical dimension of the magnetic body 21 is a dimension that surrounds a range of 1/2 or more with respect to the total length of each of the leads 28A and 28C. The effect of attenuating the noise current is higher than when a thin ring-shaped ferrite that cannot be enclosed is attached to the leads 28A and 28C. Also in this example, the function as a spacer is the same as in the first example, and the protruding height of the electronic component 28 on the printed wiring board 25 can be made uniform. In this case, the inner peripheral side of the magnetic body 21 is not covered, but the magnetic body 21 has only a single through hole 21A, and the through hole 21A has only one lead. Since they are not passed, the leads 28A, 28B, 28C are not short-circuited via the magnetic body 21.

[Third example]
The noise countermeasure component 30 shown in FIGS. 7A to 7G has a structure in which two leads can be inserted into a magnetic body. In this respect, the three leads are made into a magnetic body. This is different from the first case in which the structure can be inserted and the second case in which a single lead can be inserted into the magnetic body.

  More specifically, the noise countermeasure component 30 includes magnetic bodies 31 and 31, a holding portion 32 that holds the magnetic bodies 31 and 31, and solder joint portions 33 and 33 attached to the holding portion 32. Note that the left side view of the noise countermeasure component 30 appears symmetrically to the right side view.

  The magnetic bodies 31, 31 are made of ferrite and have the same shape as the magnetic body 21 shown in the second case. The holding part 32 is formed of an electrically insulating resin material (for example, polyamide, polypropylene, polyethylene, etc.), and as shown in FIGS. Shaped to cover the side. However, unlike the holding part 22 shown in the second example, the holding part 32 does not cover the upper side of the magnetic body 31, and the magnetic body 31 is not attached to the holding part 32 from the upper end side of the holding part 32. It is press-fitted inside.

  Under the holding portion 32, through holes 32A and 32C having substantially the same diameter as the through hole 31A of the magnetic body 31 are formed. The through hole 31A and the through hole 32A, and the through hole 31A and the through hole 32C are respectively in the vertical direction. Are disposed in series with each other so as to penetrate the magnetic body 31 and the holding portion 32 in the vertical direction. The holding portion 32 is also formed with a through hole 32B penetrating in the vertical direction. On the upper surface of the holding part 32, a suction surface 32F for suction by a suction nozzle (not shown) provided in the automatic mounting machine is formed.

  The solder joints 33, 33 are formed by bending a flat wire (a strip-shaped wire) formed of a metal material (for example, an iron alloy) into a substantially L shape when viewed from the front (see FIG. 7F). This is the same as the first and second cases.

  Similarly to the noise countermeasure components 10 and 20 shown in the first and second examples, the noise countermeasure component 30 configured as described above can be mounted on the printed wiring board by a surface mounting method. Moreover, although detailed illustration is abbreviate | omitted in a 3rd case, the shape of the solder joint part 33 and 33 is also substantially L-shaped like the 1st and 2nd examples, As in the first case, a gap is provided. Therefore, a solder fillet is formed in the gap during soldering, and the effect obtained by forming the solder fillet is the same as in the first and second cases.

  Further, as shown in FIG. 8, after the noise countermeasure component 30 is mounted on the printed wiring board 35, the electronic component 38 (for example, FET) having the leads 38A, 38B, and 38C is printed by the insertion mounting method. Mounted on the plate 35. At this time, the lead 38 </ b> A included in the electronic component 38 is passed through the through hole 31 </ b> A included in the magnetic body 31 and the through hole 32 </ b> A included in the holding unit 32. The lead 38 </ b> B included in the electronic component 38 is in a state of being passed through the through hole 32 </ b> B included in the holding unit 32. That is, the lead 38B is not passed through the magnetic body. The lead 38 </ b> C included in the electronic component 38 is passed through the through hole 31 </ b> C included in the magnetic body 31 and the through hole 32 </ b> C included in the holding portion 32. In a state where the electronic component 38 is mounted on the printed wiring board 35, the magnetic bodies 31 and 31 attenuate the noise current flowing through the leads 38A and 38C, and the noise countermeasure effect is exhibited.

  Also in this case, the vertical dimension of the magnetic body 31 is a dimension that surrounds a range of 1/2 or more with respect to the total length of each of the leads 38A and 38C. The effect of attenuating the noise current is higher than when a thin ring-shaped ferrite that cannot be enclosed is attached to the leads 38A and 38C. Also in this example, the function as a spacer is the same as in the first example, and the protruding height of the electronic component 38 on the printed wiring board 35 can be made uniform. Further, in this case, the inner peripheral side of the magnetic body 31 is not covered, but the two magnetic bodies 31, 31 are in a separated position, and each magnetic body 31 is formed with only a single through hole 31A. Since only one lead is passed through the through hole 31A, the leads 38A, 38B, 38C are not short-circuited via the magnetic bodies 31, 31.

[Fourth example]
The noise countermeasure component 40 shown in FIGS. 9A to 9G has a structure that can be mounted on a printed wiring board by an insertion mounting method. In this respect, it can be mounted on a printed wiring board by a surface mounting method. This is different from the first to third cases, which were assumed to be simple structures. However, other parts are configured in the same way as the second case.

  More specifically, the noise countermeasure component 40 includes a magnetic body 41, a holding portion 42 that holds the magnetic body 41, and solder joint portions 43 and 43 attached to the holding portion 42. In addition, regarding this noise countermeasure component 40, the left side view appears symmetrically with the right side view.

  The magnetic body 41 has the same shape as the magnetic body 21 shown in the second case, and the material is the same as in the second case. The holding part 42 is also made of the same material as the holding part 22 shown in the second case, and has almost the same shape, but only the shape of the place where the solder joints 43 and 43 are inserted is the same as the second case. Is different.

  The solder joints 43 and 43 are configured by a flat wire (a strip-shaped wire) formed of a metal material (for example, an iron-based alloy). First, the solder joints 43 and 43 are not bent. It is different from the case of. Secondly, in the case of the solder joint portions 43, 43, the rectangular wire is inserted into the holding portion 42 with the thickness direction thereof being directed in the front-rear direction in the figure. This is different from the second case in which the thickness direction is directed in the left-right direction in the drawing and is inserted into the holding portion 22.

  Unlike the noise countermeasure components 10, 20, and 30 shown in the first to third cases, the noise countermeasure component 40 configured as described above can be mounted on a printed wiring board by an insertion mounting method. Moreover, in this noise countermeasure component 40, since the thickness direction of the flat wire constituting the solder joints 43, 43 is directed in the front-rear direction in the figure, radial taping is performed using the flat surface of the flat wire. It can be performed. Therefore, if such radial taping is performed, the noise countermeasure component 40 is suitable for supply to an automatic mounting machine that performs automatic mounting by the insertion mounting method.

  After mounting the noise countermeasure component 40 on the printed wiring board, as in the second case, an electronic component having a lead (for example, FET) is mounted on the printed wiring board by an insertion mounting method. At this time, the lead of the electronic component is passed through the through-hole of the magnetic body, whereby the magnetic body attenuates the noise current flowing through the lead, so that the noise countermeasure effect is exhibited.

  Also in this example, since the vertical dimension of the magnetic body 41 is a dimension that surrounds a range of 1/2 or more with respect to the total length of the lead, it is thin enough to surround only a range of less than 1/2. The effect of attenuating the noise current is higher than when the ring-shaped ferrite is attached to the lead. Also in this example, the function as a spacer is the same as in the first example, and the protruding height of the electronic components on the printed wiring board can be made uniform. Also in this example, the inner peripheral side of the magnetic body 41 is not covered, but only a single through hole 41A is formed in the magnetic body 41, and one lead is provided in the through hole 41A. Therefore, the plurality of leads are not short-circuited via the magnetic body 41.

[Fifth example]
The noise countermeasure component 50 shown in FIGS. 10A to 10G has a structure that can be mounted on a printed wiring board by an insertion mounting method, and this point is configured in the same way as the fourth case. Yes. In addition, the other parts are configured in the same way as the third case.

  More specifically, the noise countermeasure component 50 includes magnetic bodies 51, 51, a holding part 52 that holds the magnetic bodies 51, 51, and solder joint parts 53, 53 attached to the holding part 52. In addition, regarding this noise countermeasure component 50, the left side view appears symmetrically with the right side view.

  The magnetic bodies 51 and 51 have the same shape and the same material as the third case. The holding portion 52 is also made of the same material as that of the third case, and only the shape of the portion into which the solder joint portions 53 and 53 are inserted is different from that of the third case. The solder joint portions 53 and 53 are the same as in the fourth example, and are inserted into the holding portion 52 in a state where the thickness direction of the flat wire is directed in the front-rear direction in the drawing.

  Similarly to the noise countermeasure component 40 shown in the fourth example, the noise countermeasure component 50 configured as described above can be mounted on the printed wiring board by the insertion mounting method. Moreover, in this noise countermeasure component 50, since the thickness direction of the flat wire constituting the solder joint portions 53, 53 is directed in the front-rear direction in the figure, radial taping is performed using the flat surface of the flat wire. It can be performed. After mounting the noise countermeasure component 50 on the printed wiring board, as in the third case, an electronic component having a lead (for example, FET) is mounted on the printed wiring board by the insertion mounting method, and the effect is obtained. Is similar to the third case.

[Sixth case]
The holding part 62 shown in FIGS. 11 (A) to 11 (E) has substantially the same shape as the second case and the fourth case, but is formed in the same manner as the second case. This is different from the second case and the fourth case in that both the solder joint and the insertion mounting type solder joint formed in the same manner as the fourth case can be configured.

  That is, as shown in FIGS. 11D and 12A, when the holding portion 62 is molded, an insertion hole 62A having a substantially + -shaped cross section is formed on the bottom surface of the holding portion 62, and this insertion hole 62A is formed. When a flat wire is inserted into the flat wire, it can be inserted even if the orientation of the flat wire is changed by 90 degrees. That is, with such an insertion hole 62A, the thickness direction of the rectangular wire can be directed in the left-right direction as in the case of the noise countermeasure component 60A shown in FIG. Thus, the surface mount type solder joint 63A can be configured. Also, the thickness direction of the flat wire can be directed in the front-rear direction as in the fourth example, as in the noise countermeasure component 60B shown in FIG. 12C. 63B can also be configured.

  Therefore, with such a holding unit 62, the holding unit 62 can be shared even if it is desired to configure two types of noise countermeasure components 60A and 60B in which the orientation of the rectangular wire is changed by 90 degrees. In performing the molding, it is only necessary to have the same mold, and it is possible to reduce the cost due to the mass production effect by suppressing the mold investment.

[Other cases]
The noise countermeasure component has been described with some specific examples. However, the present invention is not limited to the above-described examples, and various modifications can be made without departing from the technical idea of the present invention. It can be implemented in the form.

  For example, in each of the above cases, the FET is given as an example of the electronic component, but in addition, the above-described noise countermeasure component can be attached to various electronic components having leads such as a film capacitor.

  10, 20, 30, 40, 50, 60A, 60B ... Noise countermeasure parts, 11, 21, 31, 41, 51 ... Magnetic body, 12, 22, 32, 42, 52, 62 ... Holding part, 13, 23, 33, 43, 53, 63A, 63B ... Solder joints.

Claims (10)

A magnetic body having a shape having a through hole;
A holding part that is formed of an electrically insulating material and holds the magnetic body;
A solder joint attached to the holding part and solderable to the printed wiring board;
By soldering the solder joint to the printed wiring board, the printed wiring board can be mounted on the printed wiring board, and an electronic component having a lead is mounted on the printed wiring board. A noise countermeasure component that is mounted on the lead hole and the lead is passed through the through hole. The noise countermeasure component according to claim 1, wherein the solder joint portion has a shape that can be soldered to the printed wiring board by a surface mounting method. The solder joint portion is configured by a metal wire bent in a substantially L shape, and one of the portions on both sides of the bent portion is attached to the holding portion by being inserted into the holding portion. The noise countermeasure component according to claim 2, wherein the other is a portion to be soldered to the printed wiring board. On the outer peripheral side of the bent portion, a gap serving as a region where a solder fillet is formed when the solder joint is soldered to the printed wiring board between the solder joint and the holding portion. The noise countermeasure component according to claim 3. The noise countermeasure component according to claim 1, wherein the solder joint portion has a shape that can be soldered to the printed wiring board by an insertion mounting method. The inner peripheral side of the through-hole is covered with an electrically insulating material that forms the holding portion, so that the lead does not contact the magnetic body when the lead is passed through the through-hole. The noise countermeasure component according to any one of claims 1 to 5. The noise countermeasure component according to claim 6, wherein the magnetic body has a plurality of the through holes. The noise countermeasure component according to any one of claims 1 to 7, wherein the holding unit holds a plurality of the magnetic bodies. The solder joint is constituted by a rectangular wire that is a strip-shaped metal wire,
In the holding portion, an insertion hole into which the rectangular wire is inserted is formed in order to attach the rectangular wire which is the solder joint portion,
The insertion hole has a substantially + -shaped cross section perpendicular to the insertion direction of the rectangular wire, and when the rectangular wire is inserted into the insertion hole, the orientation of the rectangular wire is changed. The noise countermeasure component according to any one of claims 1 to 8, wherein insertion is possible even if the angle is changed by 90 degrees. The noise countermeasure component according to any one of claims 1 to 9, wherein the magnetic body surrounds a range of ½ or more of a total length of the lead in a state where the lead is passed through the through hole.