JP2015040290A - Detergent composition for alkali development device and method for washing alkali development device - Google Patents
Detergent composition for alkali development device and method for washing alkali development device Download PDFInfo
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- 239000000203 mixture Substances 0.000 title claims abstract description 68
- 239000003513 alkali Substances 0.000 title claims abstract description 41
- 238000000034 method Methods 0.000 title claims abstract description 16
- 238000011161 development Methods 0.000 title claims abstract description 15
- 238000005406 washing Methods 0.000 title abstract description 11
- 239000003599 detergent Substances 0.000 title abstract 3
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims abstract description 7
- 239000002738 chelating agent Substances 0.000 claims abstract description 6
- 150000001491 aromatic compounds Chemical class 0.000 claims abstract description 5
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims abstract description 5
- 238000004140 cleaning Methods 0.000 claims description 66
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 23
- 150000008044 alkali metal hydroxides Chemical class 0.000 claims description 9
- 229910001860 alkaline earth metal hydroxide Inorganic materials 0.000 claims description 6
- -1 ether carboxylate Chemical class 0.000 claims description 6
- KXDHJXZQYSOELW-UHFFFAOYSA-N Carbamic acid Chemical compound NC(O)=O KXDHJXZQYSOELW-UHFFFAOYSA-N 0.000 claims description 4
- 125000006273 (C1-C3) alkyl group Chemical group 0.000 claims description 3
- BVKZGUZCCUSVTD-UHFFFAOYSA-N carbonic acid Chemical compound OC(O)=O BVKZGUZCCUSVTD-UHFFFAOYSA-N 0.000 claims description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 3
- DRAJWRKLRBNJRQ-UHFFFAOYSA-N Hydroxycarbamic acid Chemical compound ONC(O)=O DRAJWRKLRBNJRQ-UHFFFAOYSA-N 0.000 claims description 2
- 239000003795 chemical substances by application Substances 0.000 claims description 2
- 239000013522 chelant Substances 0.000 claims 1
- 239000007788 liquid Substances 0.000 abstract description 15
- 239000002699 waste material Substances 0.000 abstract description 5
- 229910052784 alkaline earth metal Inorganic materials 0.000 abstract description 2
- 125000000217 alkyl group Chemical group 0.000 abstract description 2
- 125000004432 carbon atom Chemical group C* 0.000 abstract description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 abstract 2
- 229910052783 alkali metal Inorganic materials 0.000 abstract 1
- 150000001340 alkali metals Chemical class 0.000 abstract 1
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 15
- WVDDGKGOMKODPV-UHFFFAOYSA-N Benzyl alcohol Chemical compound OCC1=CC=CC=C1 WVDDGKGOMKODPV-UHFFFAOYSA-N 0.000 description 10
- 230000000694 effects Effects 0.000 description 8
- 239000002689 soil Substances 0.000 description 7
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- WRMNZCZEMHIOCP-UHFFFAOYSA-N 2-phenylethanol Chemical compound OCCC1=CC=CC=C1 WRMNZCZEMHIOCP-UHFFFAOYSA-N 0.000 description 4
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 4
- 239000012459 cleaning agent Substances 0.000 description 4
- 238000009472 formulation Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- DZCAZXAJPZCSCU-UHFFFAOYSA-K sodium nitrilotriacetate Chemical compound [Na+].[Na+].[Na+].[O-]C(=O)CN(CC([O-])=O)CC([O-])=O DZCAZXAJPZCSCU-UHFFFAOYSA-K 0.000 description 4
- 230000002522 swelling effect Effects 0.000 description 4
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 3
- WMFOQBRAJBCJND-UHFFFAOYSA-M Lithium hydroxide Chemical compound [Li+].[OH-] WMFOQBRAJBCJND-UHFFFAOYSA-M 0.000 description 3
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 3
- 235000019445 benzyl alcohol Nutrition 0.000 description 3
- 229910052791 calcium Inorganic materials 0.000 description 3
- 239000011575 calcium Substances 0.000 description 3
- 238000004090 dissolution Methods 0.000 description 3
- 229910052749 magnesium Inorganic materials 0.000 description 3
- 239000011777 magnesium Substances 0.000 description 3
- 239000003973 paint Substances 0.000 description 3
- 239000007921 spray Substances 0.000 description 3
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 2
- 229910001854 alkali hydroxide Inorganic materials 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000010790 dilution Methods 0.000 description 2
- 239000012895 dilution Substances 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 238000010422 painting Methods 0.000 description 2
- WVDDGKGOMKODPV-ZQBYOMGUSA-N phenyl(114C)methanol Chemical compound O[14CH2]C1=CC=CC=C1 WVDDGKGOMKODPV-ZQBYOMGUSA-N 0.000 description 2
- 239000011734 sodium Substances 0.000 description 2
- 229910052708 sodium Inorganic materials 0.000 description 2
- 229910000029 sodium carbonate Inorganic materials 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000008961 swelling Effects 0.000 description 2
- AEQDJSLRWYMAQI-UHFFFAOYSA-N 2,3,9,10-tetramethoxy-6,8,13,13a-tetrahydro-5H-isoquinolino[2,1-b]isoquinoline Chemical compound C1CN2CC(C(=C(OC)C=C3)OC)=C3CC2C2=C1C=C(OC)C(OC)=C2 AEQDJSLRWYMAQI-UHFFFAOYSA-N 0.000 description 1
- VUOPOLXTPXVVQF-UHFFFAOYSA-N 2-(2,2-dihydroxyethylamino)acetic acid;sodium Chemical compound [Na].OC(O)CNCC(O)=O VUOPOLXTPXVVQF-UHFFFAOYSA-N 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 description 1
- 229910000272 alkali metal oxide Inorganic materials 0.000 description 1
- 229910000287 alkaline earth metal oxide Inorganic materials 0.000 description 1
- 150000001342 alkaline earth metals Chemical class 0.000 description 1
- 239000002280 amphoteric surfactant Substances 0.000 description 1
- 239000003945 anionic surfactant Substances 0.000 description 1
- AXCZMVOFGPJBDE-UHFFFAOYSA-L calcium dihydroxide Chemical compound [OH-].[OH-].[Ca+2] AXCZMVOFGPJBDE-UHFFFAOYSA-L 0.000 description 1
- 239000000920 calcium hydroxide Substances 0.000 description 1
- 229910001861 calcium hydroxide Inorganic materials 0.000 description 1
- 150000004649 carbonic acid derivatives Chemical class 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 1
- 229940071106 ethylenediaminetetraacetate Drugs 0.000 description 1
- 150000002334 glycols Chemical class 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 150000002484 inorganic compounds Chemical class 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- JWCKCCMWAGPCHA-UHFFFAOYSA-N methoxy(phenyl)methanol Chemical compound COC(O)C1=CC=CC=C1 JWCKCCMWAGPCHA-UHFFFAOYSA-N 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 235000010755 mineral Nutrition 0.000 description 1
- 150000007522 mineralic acids Chemical class 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000002736 nonionic surfactant Substances 0.000 description 1
- CQRYARSYNCAZFO-UHFFFAOYSA-N o-hydroxybenzyl alcohol Natural products OCC1=CC=CC=C1O CQRYARSYNCAZFO-UHFFFAOYSA-N 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- BVJSUAQZOZWCKN-UHFFFAOYSA-N p-hydroxybenzyl alcohol Chemical compound OCC1=CC=C(O)C=C1 BVJSUAQZOZWCKN-UHFFFAOYSA-N 0.000 description 1
- CCDXIADKBDSBJU-UHFFFAOYSA-N phenylmethanetriol Chemical compound OC(O)(O)C1=CC=CC=C1 CCDXIADKBDSBJU-UHFFFAOYSA-N 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 229940083542 sodium Drugs 0.000 description 1
- 235000015424 sodium Nutrition 0.000 description 1
- HELHAJAZNSDZJO-OLXYHTOASA-L sodium L-tartrate Chemical compound [Na+].[Na+].[O-]C(=O)[C@H](O)[C@@H](O)C([O-])=O HELHAJAZNSDZJO-OLXYHTOASA-L 0.000 description 1
- 239000001509 sodium citrate Substances 0.000 description 1
- NLJMYIDDQXHKNR-UHFFFAOYSA-K sodium citrate Chemical compound O.O.[Na+].[Na+].[Na+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O NLJMYIDDQXHKNR-UHFFFAOYSA-K 0.000 description 1
- 229960001790 sodium citrate Drugs 0.000 description 1
- 235000011083 sodium citrates Nutrition 0.000 description 1
- 239000000176 sodium gluconate Substances 0.000 description 1
- 229940005574 sodium gluconate Drugs 0.000 description 1
- 235000012207 sodium gluconate Nutrition 0.000 description 1
- 229910001575 sodium mineral Inorganic materials 0.000 description 1
- 239000001433 sodium tartrate Substances 0.000 description 1
- 229960002167 sodium tartrate Drugs 0.000 description 1
- 235000011004 sodium tartrates Nutrition 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- UEUXEKPTXMALOB-UHFFFAOYSA-J tetrasodium;2-[2-[bis(carboxylatomethyl)amino]ethyl-(carboxylatomethyl)amino]acetate Chemical compound [Na+].[Na+].[Na+].[Na+].[O-]C(=O)CN(CC([O-])=O)CCN(CC([O-])=O)CC([O-])=O UEUXEKPTXMALOB-UHFFFAOYSA-J 0.000 description 1
- XFLNVMPCPRLYBE-UHFFFAOYSA-J tetrasodium;2-[2-[bis(carboxylatomethyl)amino]ethyl-(carboxylatomethyl)amino]acetate;tetrahydrate Chemical compound O.O.O.O.[Na+].[Na+].[Na+].[Na+].[O-]C(=O)CN(CC([O-])=O)CCN(CC([O-])=O)CC([O-])=O XFLNVMPCPRLYBE-UHFFFAOYSA-J 0.000 description 1
- MPSJHIAGGNGGEZ-UHFFFAOYSA-K trisodium;2-(carboxylatomethoxy)butanedioate Chemical compound [Na+].[Na+].[Na+].[O-]C(=O)COC(C([O-])=O)CC([O-])=O MPSJHIAGGNGGEZ-UHFFFAOYSA-K 0.000 description 1
- SOBHUZYZLFQYFK-UHFFFAOYSA-K trisodium;hydroxy-[[phosphonatomethyl(phosphonomethyl)amino]methyl]phosphinate Chemical compound [Na+].[Na+].[Na+].OP(O)(=O)CN(CP(O)([O-])=O)CP([O-])([O-])=O SOBHUZYZLFQYFK-UHFFFAOYSA-K 0.000 description 1
Landscapes
- Photosensitive Polymer And Photoresist Processing (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Detergent Compositions (AREA)
- Weting (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
Description
本発明は、アルカリ現像装置用洗浄剤組成物、およびこれを用いるアルカリ現像装置の洗浄方法に関する。 The present invention relates to a cleaning composition for an alkali developing device and a cleaning method for an alkali developing device using the same.
プリント基板の製造においては、一般的に、プリント基板上にフォトレジストなどのアルカリ可溶型感光膜を塗布した後、露光、アルカリ現像により回路パターンを形成し、続いて銅のエッチングを行った後、最終的にレジストを除去して回路形成を行う。アルカリ現像の工程は通常、現像液（例えば炭酸ナトリウム等の炭酸塩水溶液など）を感光膜面にスプレーすることによって行われる。このとき、現像液により溶解された感光膜は、経時的に粘着性を持った有機高分子化合物（以下、「スカム汚れ」という。）として現像液中に析出することが知られている。
さらに、現像液中には炭酸ナトリウム等の炭酸塩や、現像液の希釈に用いる希釈水中に含まれるミネラル成分（主にカルシウムとマグネシウム）に由来する無機系化合物（以下、「スケール汚れ」という。）が経時的に析出することも知られている。
In the production of printed circuit boards, generally, after applying an alkali-soluble photosensitive film such as a photoresist on a printed circuit board, a circuit pattern is formed by exposure and alkali development, followed by copper etching. Finally, the resist is removed to form a circuit. The alkali development step is usually performed by spraying a developer (for example, an aqueous carbonate solution such as sodium carbonate) onto the surface of the photosensitive film. At this time, it is known that the photosensitive film dissolved by the developer precipitates in the developer as an organic polymer compound having adhesiveness with time (hereinafter referred to as “scum stain”).
Further, the developer contains an inorganic compound (hereinafter referred to as “scale stain”) derived from carbonates such as sodium carbonate and mineral components (mainly calcium and magnesium) contained in the diluted water used for diluting the developer. ) Is also known to precipitate over time.
現像液は通常、現像装置内を循環して使用されるため、スカム汚れやスケール汚れが現像液中に析出すると、これらの汚れが現像槽内のスプレーノズル、配管、壁面などに堆積し、その結果、現像液の吐出量が低下することがあった。現像液が適切に吐出されない場合は、現像不足等の問題が発生しやすくなる。また、スカム汚れやスケール汚れは、現像槽の温度センサー、加熱ヒーター等にも堆積するため、液温コントロールに誤差が生じ、現像不足を発生させることもあった。さらに、スカム汚れやスケール汚れがプリント配線等の基材上へ付着した場合には、回路の欠線あるいは短絡という問題を引き起こす。 Since the developer is usually circulated in the developing device, if scum stains or scale stains are deposited in the developer, these stains accumulate on the spray nozzles, piping, wall surfaces, etc. in the developer tank. As a result, the discharge amount of the developer may decrease. If the developer is not properly discharged, problems such as insufficient development are likely to occur. Further, since scum dirt and scale dirt are deposited on the temperature sensor, heater, etc. of the developing tank, an error occurs in the liquid temperature control, resulting in insufficient development. Furthermore, when scum dirt or scale dirt adheres to a substrate such as a printed wiring, a problem of circuit breakage or short circuit is caused.
このような問題を解決するために、特許文献１には、水酸化アルカリまたはアルカリ土類金属等を含む第一段階洗浄液と、無機酸等を含有する第二段階洗浄液とからなるアルカリ現像装置の洗浄液と、それを使用したアルカリ現像装置の洗浄方法が開示されている。
また特許文献２には、水酸化アルカリおよび芳香族系アルコール等を含む水溶性塗料剥離剤が開示されている。
In order to solve such a problem, Patent Document 1 discloses an alkali developing device comprising a first stage cleaning liquid containing an alkali hydroxide or an alkaline earth metal and a second stage cleaning liquid containing an inorganic acid or the like. A cleaning solution and a method for cleaning an alkali developing device using the same are disclosed.
Patent Document 2 discloses a water-soluble paint remover containing alkali hydroxide and aromatic alcohol.
しかしながら、特許文献１に記載の洗浄液では、必ずしもスカム汚れを十分に除去することができなかった。また、特許文献１に記載の洗浄方法の場合、第一段階洗浄液と第二段階洗浄液の２種類の洗浄液を用いる必要があるため、作業工程数の増大、洗浄時間の増大（すなわち、現像装置の停止時間の増大）、洗浄後の廃液量の増加という問題があった。
特許文献２に記載の水溶性塗料剥離剤は、塗装現場で使用される塗装器具などに付着した塗料を除去するためのものであり、アルカリ現像装置用への使用は想定されていない。
However, the cleaning liquid described in Patent Document 1 cannot always remove scum dirt sufficiently. In the case of the cleaning method described in Patent Document 1, since it is necessary to use two types of cleaning liquids, that is, the first stage cleaning liquid and the second stage cleaning liquid, an increase in the number of work steps and an increase in cleaning time (that is, the development device) There was a problem that the amount of waste liquid after washing was increased).
The water-soluble paint remover described in Patent Document 2 is for removing paint adhered to a painting tool or the like used at a painting site, and is not assumed to be used for an alkali developing device.
本発明は上記事情に鑑みてなされたもので、少ない洗浄回数かつ短時間で、スカム汚れとスケール汚れを除去でき、しかも洗浄後の廃液量を削減できるアルカリ現像装置用洗浄剤組成物、およびアルカリ現像装置の洗浄方法の提供を課題とする。 The present invention has been made in view of the above circumstances, and is capable of removing scum stains and scale stains in a small number of times and in a short time, and can reduce the amount of waste liquid after washing, and an alkali developer cleaning agent composition and alkali It is an object of the present invention to provide a developing device cleaning method.
本発明は以下の態様を有する。
［１］ アルカリ金属の水酸化物およびアルカリ土類金属の水酸化物よりなる群から選ばれる少なくとも１種（ａ）と、下記一般式（１）で表される水酸基含有芳香族化合物（ｂ）と、キレート剤（ｃ）とを含む、アルカリ現像装置用洗浄剤組成物。
The present invention has the following aspects.
[1] At least one (a) selected from the group consisting of alkali metal hydroxides and alkaline earth metal hydroxides, and a hydroxyl group-containing aromatic compound (b) represented by the following general formula (1) And a cleaning composition for an alkali developing device, comprising a chelating agent (c).
式（１）中、Ａは水素原子または炭素数１〜３のアルキル基であり、ｎは１〜３の整数であり、ｍは１〜３の整数であり、Ｌは０〜３の整数である。 In formula (1), A is a hydrogen atom or a C1-C3 alkyl group, n is an integer of 1-3, m is an integer of 1-3, L is an integer of 0-3. is there.
［２］ さらに水を含む、［１］に記載のアルカリ現像装置用洗浄剤組成物。
［３］ 前記キレート剤（ｃ）が、アミノカルボン酸塩、ヒドロキシアミノカルボン酸塩、ヒドロキシカルボン酸塩およびエーテルカルボン酸塩よりなる群から選ばれる少なくとも１種である、［１］または［２］に記載のアルカリ現像装置用洗浄剤組成物。
［４］ ［１］〜［３］のいずれか一項に記載のアルカリ現像装置用洗浄剤組成物を用いる、アルカリ現像装置の洗浄方法。
[2] The cleaning composition for an alkali developing device according to [1], further comprising water.
[3] The chelating agent (c) is at least one selected from the group consisting of aminocarboxylates, hydroxyaminocarboxylates, hydroxycarboxylates and ether carboxylates, [1] or [2] A cleaning composition for an alkali developing device as described in 1. above.
[4] A method for cleaning an alkali developing device using the cleaning composition for an alkali developing device according to any one of [1] to [3].
本発明によれば、少ない洗浄回数かつ短時間で、スカム汚れとスケール汚れを除去でき、しかも洗浄後の廃液量を削減できるアルカリ現像装置用洗浄剤組成物、およびアルカリ現像装置の洗浄方法を提供できる。 According to the present invention, there are provided a cleaning composition for an alkaline developing device and a cleaning method for an alkaline developing device that can remove scum stain and scale stain in a small number of times and in a short time, and can reduce the amount of waste liquid after washing. it can.
以下、本発明を詳細に説明する。
「アルカリ現像装置用洗浄剤組成物」
本発明のアルカリ現像装置用洗浄剤組成物（以下、単に「洗浄剤組成物」という。）は、アルカリ金属の水酸化物およびアルカリ土類金属の水酸化物よりなる群から選ばれる少なくとも１種（ａ）（以下、「（ａ）成分」という。）と、以下に説明する水酸基含有芳香族化合物（ｂ）（以下、「（ｂ）成分」という。）と、キレート剤（ｃ）（以下、「（ｃ）成分」という。）とを含む。また、洗浄剤組成物は水を含むことが好ましい。
Hereinafter, the present invention will be described in detail.
"Cleaning composition for alkali developing device"
The alkaline developer cleaning composition of the present invention (hereinafter simply referred to as “cleaning composition”) is at least one selected from the group consisting of alkali metal hydroxides and alkaline earth metal hydroxides. (A) (hereinafter referred to as “component (a)”), a hydroxyl group-containing aromatic compound (b) described below (hereinafter referred to as “component (b)”), and chelating agent (c) (hereinafter referred to as “component (a)”). And “(c) component”). Moreover, it is preferable that a cleaning composition contains water.
＜（ａ）成分＞
（ａ）成分は、アルカリ金属の水酸化物およびアルカリ土類金属の水酸化物よりなる群から選ばれる少なくとも１種（ａ）である。
（ａ）成分は、後述する（ｂ）成分の作用により膨潤したスカム汚れを洗浄剤組成物中へ溶解しやすくする効果を有する。
<(A) component>
The component (a) is at least one (a) selected from the group consisting of alkali metal hydroxides and alkaline earth metal hydroxides.
The component (a) has an effect of easily dissolving the scum soil swollen by the action of the component (b) described later into the cleaning composition.
アルカリ金属の水酸化物としては、例えば水酸化リチウム、水酸化ナトリウム、水酸化カリウムなどが挙げられる。
アルカリ土類金属の水酸化物としては、例えば水酸化カルシウムなどが挙げられる。
これらアルカリ金属の水酸化物およびアルカリ土類金属の水酸化物は、それぞれ１種単独で用いてもよく、２種以上を併用してもよい。
（ａ）成分としては、水への溶解性やスカム汚れの除去性に優れる点で、アルカリ金属の水酸化物が好ましく、その中でも水酸化ナトリウム、水酸化カリウムが特に好ましい。
Examples of the alkali metal hydroxide include lithium hydroxide, sodium hydroxide, and potassium hydroxide.
Examples of the alkaline earth metal hydroxide include calcium hydroxide.
Each of these alkali metal hydroxides and alkaline earth metal hydroxides may be used alone or in combination of two or more.
As the component (a), alkali metal hydroxides are preferable, and sodium hydroxide and potassium hydroxide are particularly preferable because they are excellent in solubility in water and removability of scum dirt.
なお、（ａ）成分として、アルカリ金属の酸化物やアルカリ土類金属の酸化物を水に溶解し生成したものを用いることもできる。 As the component (a), an alkali metal oxide or alkaline earth metal oxide dissolved in water can be used.
（ａ）成分の含有量は、洗浄剤組成物１００質量％中、０．１〜２０質量％が好ましく、０．５〜１０質量％がより好ましい。（ａ）成分の含有量が上記範囲内であれば、スカム汚れの除去性がより向上する。また、スカム汚れの洗浄剤組成物中への溶解が促進され、アルカリ現像装置からの剥離がより短時間で進む。 (A) 0.1-20 mass% is preferable in 100 mass% of cleaning composition, and, as for content of a component, 0.5-10 mass% is more preferable. If content of (a) component exists in the said range, the removability of scum dirt will improve more. Further, dissolution of the scum stain in the cleaning composition is promoted, and peeling from the alkali developing device proceeds in a shorter time.
＜（ｂ）成分＞
（ｂ）成分は、下記一般式（１）で表される水酸基含有芳香族化合物（ｂ）である。
（ｂ）成分は、スカム汚れを膨潤させる効果を有する。
<(B) component>
The component (b) is a hydroxyl group-containing aromatic compound (b) represented by the following general formula (1).
The component (b) has an effect of swelling scum dirt.
式（１）中、Ａは水素原子または炭素数１〜３のアルキル基である。アルキル基の炭素数が３を超えるとスカム汚れに対する膨潤効果が低下する。
ｎは１〜３の整数である。ｎが１未満または３を超えるとスカム汚れに対する膨潤効果が低下する。
ｍは１〜３の整数である。ｍが１未満または３を超えるとスカム汚れに対する膨潤効果が低下する。
Ｌは０〜３の整数である。Ｌが３を超えるとスカム汚れに対する膨潤効果が低下する。
なお、Ｌが１〜３の整数の場合、Ａはそれぞれ同じであってもよいし、異なっていてもよい。
In Formula (1), A is a hydrogen atom or a C1-C3 alkyl group. When the number of carbon atoms in the alkyl group exceeds 3, the swelling effect on scum dirt is reduced.
n is an integer of 1 to 3. When n is less than 1 or exceeds 3, the swelling effect on scum stains is reduced.
m is an integer of 1-3. When m is less than 1 or exceeds 3, the swelling effect on scum stains is reduced.
L is an integer of 0-3. When L exceeds 3, the swelling effect with respect to scum dirt will fall.
When L is an integer of 1 to 3, A may be the same or different.
（ｂ）成分としては、例えばベンジルアルコール（ｎ＝１、ｍ＝１、Ｌ＝０）、フェネチルアルコール（ｎ＝１、ｍ＝２、Ｌ＝０）、ヒドロキシベンジルアルコール（ｎ＝１、ｍ＝１、Ｌ＝１、Ａ＝水素原子）、ヒドロキシフェネチルアルコール（ｎ＝１、ｍ＝２、Ｌ＝１、Ａ＝水素原子）、メトキシフェニルメタノール（ｎ＝１、ｍ＝１、Ｌ＝１、Ａ＝メチル基）、ジヒドロキシフェニルメタノール（ｎ＝１、ｍ＝１、Ｌ＝２、Ａ＝水素原子）などが挙げられる。
これら（ｂ）成分は、それぞれ１種単独で用いてもよく、２種以上を併用してもよい。
（ｂ）成分としては、スカム汚れの洗浄除去性がより向上する点で、ベンジルアルコール、フェネチルアルコールが好ましい。
Examples of the component (b) include benzyl alcohol (n = 1, m = 1, L = 0), phenethyl alcohol (n = 1, m = 2, L = 0), hydroxybenzyl alcohol (n = 1, m = 1, L = 1, A = hydrogen atom), hydroxyphenethyl alcohol (n = 1, m = 2, L = 1, A = hydrogen atom), methoxyphenylmethanol (n = 1, m = 1, L = 1, A = methyl group), dihydroxyphenylmethanol (n = 1, m = 1, L = 2, A = hydrogen atom) and the like.
These components (b) may be used alone or in combination of two or more.
As the component (b), benzyl alcohol and phenethyl alcohol are preferable from the viewpoint that the scum dirt can be more easily removed and removed.
（ｂ）成分の含有量は、洗浄剤組成物１００質量％中、０．５〜２５質量％が好ましく、３〜２０質量％がより好ましい。（ｂ）成分の含有量が上記範囲内であれば、スカム汚れの膨潤がより促進され、アルカリ現像装置からの剥離がより短時間で進む。特に、（ｂ）成分の含有量が３〜２０質量％であれば、スカム汚れの除去性がより向上する。 (B) 0.5-100 mass% is preferable in 100 mass% of cleaning composition, and, as for content of a component, 3-20 mass% is more preferable. If the content of the component (b) is within the above range, the swelling of the scum stain is further promoted, and the peeling from the alkali developing device proceeds in a shorter time. In particular, when the content of the component (b) is 3 to 20% by mass, the scum stain removability is further improved.
＜（ｃ）成分＞
（ｃ）成分は、キレート剤（ｃ）である。
（ｃ）成分は、スケール汚れに含まれるマグネシウムやカルシウム成分をスケール汚れから引き離し、スケール汚れ自体の水への溶解性を高める効果を有する。アルカリ現像装置の壁面などに付着しているスケール汚れが水に溶解することで、スカム汚れの剥離も容易となる。さらに、スカム汚れがカルシウムやマグネシウムなどとイオン結合することで難溶化するのを防ぐこともできる。
<(C) component>
(C) A component is a chelating agent (c).
The component (c) has an effect of separating the magnesium and calcium components contained in the scale dirt from the scale dirt and increasing the solubility of the scale dirt itself in water. Since the scale dirt adhering to the wall surface of the alkali developing device dissolves in water, the scum dirt can be easily peeled off. Furthermore, it is possible to prevent the scum soil from being hardly soluble by ionic bonding with calcium or magnesium.
（ｃ）成分としては、例えばニトリロ三酢酸三ナトリウム、エチレンジアミン四酢酸四ナトリウム、ジエチレントリアミノ五酢酸五ナトリウム等のアミノカルボン酸塩；ジヒドロキシエチルグリシンナトリウム、Ｎ−（２−ヒドロキシエチル）イミノ二酢酸二ナトリウム、トリエタノールアミンＬ−グルタミン酸二酢酸四ナトリウム、ヒドロキシエチルエチレンジアミノ四酢酸四ナトリウム等のヒドロキシアミノカルボン酸塩；クエン酸ナトリウム、酒石酸ナトリウム、グルコン酸ナトリウム、ナトリウムグリコヘプトネート等のヒドロキシカルボン酸塩；カルボキシメチルタルトロン酸三ナトリウム、カルボキシメチルオキシコハク酸三ナトリウム等のエーテルカルボン酸塩などが挙げられる。
これら（ｂ）成分は、それぞれ１種単独で用いてもよく、２種以上を併用してもよい。
Examples of the component (c) include aminocarboxylates such as trisodium nitrilotriacetate, tetrasodium ethylenediaminetetraacetate and pentasodium diethylenetriaminopentaacetate; sodium dihydroxyethylglycine, di-N- (2-hydroxyethyl) iminodiacetic acid Hydroxyaminocarboxylates such as sodium, triethanolamine L-glutamate tetrasodium acetate, hydroxyethylethylenediaminotetraacetate tetrasodium; hydroxycarboxylic acids such as sodium citrate, sodium tartrate, sodium gluconate, sodium glycoheptonate Salts; ether carboxylates such as trisodium carboxymethyltaltronate and trisodium carboxymethyloxysuccinate.
These components (b) may be used alone or in combination of two or more.
（ｃ）成分としては、スケール汚れの溶解除去性がより向上する点で、アミノカルボン酸塩が好ましく、その中でもニトリロ三酢酸三ナトリウム、エチレンジアミン四酢酸四ナトリウムが特に好ましい。 As the component (c), aminocarboxylates are preferable from the viewpoint of further improving the dissolution and removal of scale dirt. Among them, nitrilotriacetic acid trisodium and ethylenediaminetetraacetic acid tetrasodium are particularly preferable.
（ｃ）成分の含有量は、洗浄剤組成物１００質量％中、０．５〜２０質量％が好ましく、２〜２０質量％がより好ましい。（ｃ）成分の含有量が上記範囲内であれば、スケール汚れの洗浄剤組成物中への溶解をより促進し、スカム汚れの難溶化を防止できる。その結果、アルカリ現像装置からのスカム汚れおよびスケール汚れの剥離がより短時間で進む。 (C) 0.5-20 mass% is preferable in 100 mass% of cleaning composition, and, as for content of a component, 2-20 mass% is more preferable. If content of (c) component exists in the said range, melt | dissolution in the cleaning composition of a scale dirt can be accelerated | stimulated more and the insolubilization of a scum dirt can be prevented. As a result, the removal of scum stain and scale stain from the alkali developing device proceeds in a shorter time.
＜水＞
水は、（ａ）〜（ｃ）成分を洗浄剤組成物中に安定して存在させる効果を有する。加えて、アルカリ現像装置内から除去したスカム汚れおよびスケール汚れの装置内への再付着を防止する効果も有する。
なお、（ａ）〜（ｃ）成分は水中に完全に溶解していてもよいが、必ずしも完全に溶解している必要はない。
<Water>
Water has an effect of causing the components (a) to (c) to exist stably in the cleaning composition. In addition, it also has an effect of preventing redeposition of scum dirt and scale dirt removed from the alkali developing apparatus.
In addition, although (a)-(c) component may be melt | dissolving completely in water, it does not necessarily need to melt | dissolve completely.
水の含有量は、洗浄剤組成物１００質量％中、３５．０〜９８．９質量％が好ましく、５０〜９４．５質量％がより好ましい。水の含有量が上記範囲内であれば、水の添加効果が十分に得られる。 The content of water is preferably 35.0 to 98.9% by mass and more preferably 50 to 94.5% by mass in 100% by mass of the cleaning composition. When the water content is within the above range, the effect of adding water can be sufficiently obtained.
＜他の成分＞
洗浄剤組成物は、本発明の効果を妨げない範囲内であれば、必要に応じてノニオン界面活性剤、両性界面活性剤、アニオン界面活性剤、防錆剤、アルカリ助剤（アルカノールアミン類）、有機溶剤（グリコール類、グリコールエーテル類）などを含むことができる。
<Other ingredients>
As long as the cleaning composition is within the range that does not interfere with the effects of the present invention, a nonionic surfactant, an amphoteric surfactant, an anionic surfactant, a rust inhibitor, an alkali auxiliary (alkanolamines), if necessary. Organic solvents (glycols, glycol ethers) and the like can be included.
＜製造方法＞
洗浄剤組成物は、例えば（ａ）〜（ｃ）成分と、必要に応じて水や他の成分とを、均一になるまで撹拌混合することで得られる。
濃度の調整については、（ａ）〜（ｃ）成分の濃度（含有量）の高いもの（濃縮組成物）を予め調製しておき、洗浄するアルカリ現像槽内等で濃縮組成物を所定の濃度になるように水で希釈してもよいし、（ａ）〜（ｃ）成分をアルカリ現像槽内で所定の濃度に調整してもよい。洗浄剤組成物の輸送や貯蔵を考慮すると、濃縮組成物を予め調製し、アルカリ現像槽内等で濃縮組成物を所定の濃度になるように水で希釈することが好ましい。
濃縮組成物における（ａ）〜（ｃ）成分の濃度は特に限定されない。また、濃縮組成物中において（ａ）〜（ｃ）成分は均一に溶解や分散していてもよいが、必ずしも溶解や分散している必要はない。
<Manufacturing method>
The cleaning composition can be obtained, for example, by stirring and mixing the components (a) to (c) and, if necessary, water and other components until uniform.
Regarding the adjustment of the concentration, a high concentration (content) of the components (a) to (c) (concentrated composition) is prepared in advance, and the concentrated composition is set to a predetermined concentration in an alkali developing tank to be washed. The components (a) to (c) may be adjusted to a predetermined concentration in an alkali developing tank. In consideration of transportation and storage of the cleaning composition, it is preferable to prepare a concentrated composition in advance and dilute the concentrated composition with water so as to have a predetermined concentration in an alkali developing tank or the like.
The concentration of the components (a) to (c) in the concentrated composition is not particularly limited. In the concentrated composition, the components (a) to (c) may be uniformly dissolved or dispersed, but are not necessarily dissolved or dispersed.
＜作用効果＞
以上説明した本発明の洗浄剤組成物は、アルカリ現像装置に付着したスカム汚れとスケール汚れを少ない洗浄回数で効率よく除去することができる。また、特許文献１に記載のような２種類の洗浄液を用いる必要がないため、作業工程数や洗浄時間の増大、洗浄後の廃液量の増加を抑制できる。
このように、本発明の洗浄剤組成物は、既存のアルカリ現像装置用の洗浄剤と比較して経済的であり、スカム汚れとスケール汚れを短時間で十分に除去できる性能を有している。そのため、生産ラインに負担をかけることなく保守が可能となり、定期洗浄サイクルの延長が可能となる。また、本発明の洗浄剤組成物を用いれば、スカム汚れとスケール汚れに由来する現像不良、回路欠陥および短絡を防止できるため、生産歩留まりが向上する。
<Effect>
The cleaning composition of the present invention described above can efficiently remove scum stains and scale stains adhering to an alkali developing device with a small number of washings. Moreover, since it is not necessary to use two types of cleaning liquids as described in Patent Document 1, it is possible to suppress an increase in the number of work steps, a cleaning time, and an amount of waste liquid after cleaning.
As described above, the cleaning composition of the present invention is more economical than existing cleaning agents for alkali developing devices, and has the ability to sufficiently remove scum stains and scale stains in a short time. . Therefore, maintenance can be performed without imposing a burden on the production line, and the regular cleaning cycle can be extended. In addition, if the cleaning composition of the present invention is used, it is possible to prevent development defects, circuit defects, and short circuits due to scum stains and scale stains, thereby improving production yield.
＜用途＞
本発明の洗浄剤組成物は、アルカリ洗浄できるものであればいずれの用途にも使用できる。例えば、精密機械の洗浄、半導体基板の洗浄、プリント配線基板等の回路形成時に使用される装置の洗浄に使用できる。特に、アルカリ可溶型感光膜の現像に使用されるアルカリ現像装置、例えば液状レジスト現像装置、ドライフィルム現像装置等の洗浄に好適である。
<Application>
The cleaning composition of the present invention can be used for any application as long as it can be alkali-cleaned. For example, it can be used for cleaning precision machines, semiconductor substrates, and devices used when forming circuits such as printed wiring boards. In particular, it is suitable for cleaning an alkali developing device used for developing an alkali-soluble photosensitive film, such as a liquid resist developing device or a dry film developing device.
＜洗浄方法＞
本発明のアルカリ現像装置の洗浄方法では、上述した本発明の洗浄剤組成物を用いて洗浄対象となるアルカリ現像装置を洗浄する。
洗浄の仕方としては特に制限されないが、例えばアルカリ現像装置内に洗浄剤組成物を循環させたり吹き付けたりする方法、現像槽内のスプレーノズル、配管、壁面などを洗浄剤組成物に浸漬させる方法などが挙げられる。
洗浄剤組成物の温度は１０〜８０℃が好ましい。
なお、洗浄剤組成物を用いてアルカリ現像装置を洗浄した後に、水洗浄したりブラッシングしたりしてもよい。
<Washing method>
In the alkali developing device cleaning method of the present invention, the alkali developing device to be cleaned is cleaned using the above-described cleaning composition of the present invention.
The method of cleaning is not particularly limited. For example, a method of circulating or spraying the cleaning agent composition in the alkali developing device, a method of immersing the spray nozzle, piping, wall surface, etc. in the developing tank in the cleaning agent composition, etc. Is mentioned.
The temperature of the cleaning composition is preferably 10 to 80 ° C.
In addition, after washing | cleaning an alkali image development apparatus using a cleaning composition, you may wash with water or brush.
以下、本発明について実施例を挙げて具体的に説明する。ただし、本発明はこれらに限定されるものではない。 Hereinafter, the present invention will be specifically described with reference to examples. However, the present invention is not limited to these.
「実施例１」
＜洗浄剤組成物の調製＞
表１に示す配合に従い、（ａ）成分として水酸化カリウムと、（ｂ）成分としてベンジルアルコールと、（ｃ）成分としてエチレンジアミン四酢酸四ナトリウムと、水とを均一になるまで撹拌混合して洗浄剤組成物を調製した。
得られた洗浄剤組成物を用いて、以下のようにして汚れの除去性を評価した。
"Example 1"
<Preparation of cleaning composition>
In accordance with the formulation shown in Table 1, (a) potassium hydroxide as the component, (b) component benzyl alcohol, (c) component ethylenediaminetetraacetate, and water are stirred and mixed until uniform. An agent composition was prepared.
Using the obtained cleaning composition, the stain removal property was evaluated as follows.
＜汚れの除去性の評価＞
６ヶ月間、アルカリ現像工程に使用された液状レジスト現像装置内とドライフィルム現像装置内のスカム汚れおよびスケール汚れが付着しているスプレーノズルとギヤ部品、計４種類の部品を試験片として用意した。
４種類の部品を洗浄剤組成物に浸漬させ、４０℃で６０分撹拌した。各部品を取り出し、水洗浄とブラッシングを行い、各部品に付着しているスカム汚れおよびスケール汚れの除去具合をそれぞれ目視にて確認し、以下の評価基準にて評価した。結果を表１に示す。
◎：４種類全ての部品について、９５％以上の汚れが除去できている。
○：４種類全ての部品について、８０％以上９５％未満の汚れが除去できている。
△：４種類全ての部品について、５０％以上８０％未満の汚れが除去できている。
×：少なくとも１種類の部品について、５０％未満の汚れしか除去できていない。
<Evaluation of dirt removal>
For six months, a total of four types of parts were prepared as test pieces: spray nozzles and gear parts with scum stains and scale stains in the liquid resist development device and dry film development device used in the alkali development process. .
Four types of parts were immersed in the cleaning composition and stirred at 40 ° C. for 60 minutes. Each part was taken out, washed with water and brushed. The degree of removal of scum dirt and scale dirt adhering to each part was visually confirmed, and evaluated according to the following evaluation criteria. The results are shown in Table 1.
A: 95% or more of dirt was removed from all four types of parts.
◯: For all four types of parts, 80% or more and less than 95% of dirt can be removed.
(Triangle | delta): The dirt of 50% or more and less than 80% has been removed about all four types of components.
X: For at least one type of component, only less than 50% of dirt can be removed.
「実施例２〜２２」
表１、２に示す配合に変更した以外は、実施例１と同様にして洗浄剤組成物を調製し、汚れの除去性の評価を行った。結果を表１、２に示す。
"Examples 2 to 22"
A cleaning composition was prepared in the same manner as in Example 1 except that the formulation shown in Tables 1 and 2 was changed, and the soil removal property was evaluated. The results are shown in Tables 1 and 2.
「実施例２３」
表２に示す配合に従い、（ａ）成分として水酸化カリウムと、（ｂ）成分としてベンジルアルコールと、（ｃ）成分としてニトリロ三酢酸三ナトリウムと、水とを均一になるまで撹拌混合して濃縮組成物を調製した。
汚れの除去性の評価を行う際に、得られた濃縮組成物１質量部に対し、水２質量部を加えて濃縮組成物を希釈してから、実施例１と同様にして汚れの除去性の評価を行った。結果を表２に示す。
なお、希釈後の洗浄剤組成物の濃度（（ａ）〜（ｃ）成分の含有量の合計）は、実施例４で調製した洗浄剤組成物と同じである。
"Example 23"
According to the composition shown in Table 2, (a) potassium hydroxide as the component, (b) component benzyl alcohol, (c) component nitrilotriacetic acid trisodium, and water are stirred and mixed until uniform. A composition was prepared.
When evaluating the soil removability, 2 parts by weight of water was added to 1 part by weight of the obtained concentrated composition to dilute the concentrated composition, and then the soil removability was performed in the same manner as in Example 1. Was evaluated. The results are shown in Table 2.
In addition, the density | concentration (total of content of (a)-(c) component) of the cleaning composition after dilution is the same as the cleaning composition prepared in Example 4.
「実施例２４」
表２に示す配合に従い、（ａ）成分として水酸化カリウムと、（ｂ）成分としてベンジルアルコールと、（ｃ）成分としてニトリロ三酢酸三ナトリウムとを均一になるまで撹拌混合してスラリー状の濃縮組成物を得た。
汚れの除去性の評価を行う際に、得られた濃縮組成物１４質量部に対し、水８６質量部を加えて濃縮組成物を希釈してから、実施例１と同様にして汚れの除去性の評価を行った。結果を表２に示す。
なお、希釈後の洗浄剤組成物の濃度（（ａ）〜（ｃ）成分の含有量の合計）は、実施例９で調製した洗浄剤組成物と同じである。
"Example 24"
According to the formulation shown in Table 2, (a) potassium hydroxide as component, (b) benzyl alcohol as component, (c) nitrilotriacetic acid trisodium as a component are stirred and mixed until uniform, and concentrated in slurry form A composition was obtained.
When evaluating the soil removability, 86 parts by weight of water was added to 14 parts by weight of the obtained concentrated composition to dilute the concentrated composition, and then the soil removability was performed in the same manner as in Example 1. Was evaluated. The results are shown in Table 2.
In addition, the density | concentration (total of content of (a)-(c) component) of the cleaning composition after dilution is the same as the cleaning composition prepared in Example 9.
「比較例１〜３」
表３に示す配合に変更した以外は、実施例１と同様にして洗浄剤組成物を調製し、汚れの除去性の評価を行った。結果を表３に示す。
"Comparative Examples 1-3"
A cleaning composition was prepared in the same manner as in Example 1 except that the formulation shown in Table 3 was changed, and the stain removal property was evaluated. The results are shown in Table 3.
表１、２の結果より、実施例１〜２２の洗浄剤組成物は、いずれもスカム汚れとスケール汚れに対して良好な除去性を有していた。また、実施例２３、２４の結果より、濃縮組成物を水で所定の濃度に希釈しても、良好な除去性を発揮することが示された。
一方、表３の結果より、（ｃ）成分を含まない比較例１、（ｂ）成分を含まない比較例２、（ａ）成分を含まない比較例３の場合、スカム汚れに対する除去性が不十分であった。特に比較例１の場合は、スケール汚れに対する除去性にも劣っていた。
From the results shown in Tables 1 and 2, all of the cleaning compositions of Examples 1 to 22 had good removability against scum stain and scale stain. Further, the results of Examples 23 and 24 showed that even when the concentrated composition was diluted to a predetermined concentration with water, good removability was exhibited.
On the other hand, from the results of Table 3, in the case of Comparative Example 1 that does not contain the component (c), Comparative Example 2 that does not contain the component (b), and Comparative Example 3 that does not contain the component (a), the removability to scum stain is poor It was enough. In particular, in the case of Comparative Example 1, the removability to scale dirt was also inferior.
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04359257A (en) * | 1991-06-05 | 1992-12-11 | Kansai Paint Co Ltd | Peeling liquid |
| JPH0756357A (en) * | 1993-08-20 | 1995-03-03 | Nippon Hyomen Kagaku Kk | Cleaning liquid for alkali developing device and cleaning method therefor |
| JPH07271057A (en) * | 1994-03-31 | 1995-10-20 | Tokyo Ohka Kogyo Co Ltd | Removing solution for positive type resist |
| JPH10195492A (en) * | 1997-01-09 | 1998-07-28 | Kao Corp | Cleaning composition for removing resin stain |
| JP2009062408A (en) * | 2007-09-04 | 2009-03-26 | Sony Mobile Display Corp | Aqueous detergent composition |
| JP2010271477A (en) * | 2009-05-20 | 2010-12-02 | Eastman Kodak Co | Cleaning composition for developing device of lithographic printing plate precursor, and cleaning method |
| DE102011082136A1 (en) * | 2011-09-05 | 2013-03-07 | Vacuumschmelze Gmbh & Co. Kg | Cleaning composition useful for removing e.g. cured casting resins on surfaces of e.g. tool, comprises polyglycol monoether compound, aromatic substituted alkyl alcohol, non-toxic nitrogen heterocyclic compound and alkali metal hydroxide |
-
2013
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Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04359257A (en) * | 1991-06-05 | 1992-12-11 | Kansai Paint Co Ltd | Peeling liquid |
| JPH0756357A (en) * | 1993-08-20 | 1995-03-03 | Nippon Hyomen Kagaku Kk | Cleaning liquid for alkali developing device and cleaning method therefor |
| JPH07271057A (en) * | 1994-03-31 | 1995-10-20 | Tokyo Ohka Kogyo Co Ltd | Removing solution for positive type resist |
| JPH10195492A (en) * | 1997-01-09 | 1998-07-28 | Kao Corp | Cleaning composition for removing resin stain |
| JP2009062408A (en) * | 2007-09-04 | 2009-03-26 | Sony Mobile Display Corp | Aqueous detergent composition |
| JP2010271477A (en) * | 2009-05-20 | 2010-12-02 | Eastman Kodak Co | Cleaning composition for developing device of lithographic printing plate precursor, and cleaning method |
| DE102011082136A1 (en) * | 2011-09-05 | 2013-03-07 | Vacuumschmelze Gmbh & Co. Kg | Cleaning composition useful for removing e.g. cured casting resins on surfaces of e.g. tool, comprises polyglycol monoether compound, aromatic substituted alkyl alcohol, non-toxic nitrogen heterocyclic compound and alkali metal hydroxide |
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