JP2015035499A - Alignment mark formation method and formation device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an alignment mark formation method capable of reducing an area for disposing a plurality of alignment marks of different dimensions.SOLUTION: A first alignment mark is formed by forming droplets from a thin film material and discharging the droplets, and coating and hardening the thin film material on a substrate. On the substrate on which the first alignment mark is formed, by forming droplets from a thin film material and discharging the droplets, and coating and hardening the thin film material, a second alignment mark that is included in the first alignment mark or includes the first alignment mark in a plan view is formed.

Description

  The present invention relates to a method for forming an alignment mark by forming a thin film material into droplets and ejecting them from an inkjet nozzle, and an alignment mark forming apparatus.

  In general, the positional accuracy required for the positioning of the substrate differs in a plurality of processes for manufacturing the substrate. Depending on the required position accuracy, cameras with different magnifications are used to observe the alignment marks. Depending on the magnification of the camera, an alignment mark having a size that fits within the angle of view (field of view) of the camera is prepared. For this reason, alignment marks of various dimensions are arranged on the substrate. For example, a rough alignment mark and a fine alignment mark are prepared on the substrate disclosed in Patent Document 1.

JP 2007-47305 A

  In the conventional method, a region for arranging a plurality of alignment marks having different dimensions must be secured on the substrate. In order to effectively use the surface of the substrate, it is desired to reduce the area for arranging the alignment marks.

  An object of the present invention is to provide an alignment mark forming method and an alignment mark forming apparatus capable of reducing an area for arranging a plurality of alignment marks having different dimensions.

According to one aspect of the invention,
Forming a first alignment mark by applying a thin film material to a substrate by discharging the thin film material into droplets, applying the thin film material, and curing;
The substrate on which the first alignment mark is formed is made to be included in the first alignment mark in a plan view by applying a thin film material by discharging the thin film material into droplets and applying and curing the thin film material. Alternatively, there is provided an alignment mark forming method including a step of forming a second alignment mark including the first alignment mark.

According to another aspect of the invention,
A stage for holding a substrate;
A nozzle head having a plurality of nozzle holes for discharging a photocurable liquid thin film material toward the substrate held on the stage;
A moving mechanism for moving one of the substrate and the nozzle head relative to the other;
A light source for irradiating the liquid thin film material applied to the substrate held on the stage with light for curing;
A control device for controlling the nozzle head, the light source, and the moving mechanism;
The control device controls the nozzle head, the light source, and the moving mechanism,
The first alignment mark is formed by applying the thin film material by applying the thin film material to the substrate as droplets, and then applying the thin film material to cure.
The substrate on which the first alignment mark is formed is made to be included in the first alignment mark in a plan view by applying a thin film material by discharging the thin film material into droplets and applying and curing the thin film material. Alternatively, an alignment mark forming apparatus for forming a second alignment mark including the first alignment mark is provided.

  Since the second alignment mark is included in the first alignment mark or includes the first alignment mark, compared to the case where the first alignment mark and the second alignment mark are formed in different regions, A region for forming the alignment mark can be reduced.

FIG. 1 is a plan view of an alignment mark formed by the alignment mark forming method according to the embodiment and a substrate on which the alignment mark is formed. 2A to 2C are cross-sectional views of the substrate and the alignment mark in the middle of the alignment mark forming method according to the embodiment. FIG. 3A is a schematic side view of the low-magnification camera and the synthetic alignment mark, and FIG. 3B is a diagram illustrating a relationship between the field of view of the low-magnification camera and the synthetic alignment mark. 4A is a schematic side view of a low-magnification camera and a synthetic alignment mark, and FIG. 4B is a diagram illustrating a relationship between the field of view of the low-magnification camera and the synthetic alignment mark. FIG. 5A is a schematic side view of the low-magnification camera and the synthetic alignment mark, and FIG. 5B is a diagram illustrating a relationship between the field of view of the low-magnification camera and the synthetic alignment mark. 6A and 6B are schematic side views of a composite alignment mark and a camera formed by an alignment mark forming method according to another embodiment. FIG. 7 is a schematic diagram of an alignment mark forming apparatus according to an embodiment. 8A and 8B are a perspective view and a bottom view, respectively, of the nozzle unit of the alignment mark forming apparatus according to the embodiment. FIG. 9 is a plan view of the stage and the nozzle unit of the alignment mark forming apparatus according to the embodiment.

  FIG. 1 shows a substrate on which an alignment mark is to be formed by the alignment mark forming method according to the embodiment and a plan view of the formed alignment mark. Regions 12 on which various patterns are to be formed and alignment mark formation regions 11 are defined on the surface of the substrate 10.

  A first alignment mark 13, a second alignment mark 14, and a third alignment mark 15 are formed in the alignment mark formation region 11. In plan view, the third alignment mark 15 is included in the second alignment mark 14, and the second alignment mark 14 is included in the first alignment mark 13. Each of the first alignment mark 13, the second alignment mark 14, and the third alignment mark 15 has a circular planar shape and is arranged concentrically. Note that it is not always necessary to arrange them concentrically, and the centers of these marks may be shifted from each other. The first alignment mark 13, the second alignment mark 14, and the third alignment mark 15 are collectively referred to as a combined alignment mark 16.

  With reference to FIG. 2A-FIG. 2C, the formation method of the alignment mark by an Example is demonstrated.

  As shown in FIG. 2A, the thin film material 20 is applied to the alignment mark formation region 11 by discharging the thin film material 20 into droplets toward the alignment mark formation region 11 of the substrate 10. For the thin film material 20, for example, a photocurable resin is used. After the thin film material 20 is applied to the substrate 10, the thin film material 20 is cured by irradiating light for curing. Thereby, the first alignment mark 13 made of the cured thin film material is formed. At this stage, the degree of cure does not necessarily need to be almost 100%, and it is sufficient that the degree of cure that can prevent the thin film material 20 from spreading in the lateral direction is obtained.

  As shown in FIG. 2B, the upper surface of the first alignment mark 13 is formed by discharging the thin film material 20 into droplets toward the alignment mark forming region 11 of the substrate 10 on which the first alignment mark 13 is formed. A thin film material 20 is applied to the substrate. After the thin film material 20 is applied to the upper surface of the first alignment mark 13, the thin film material 20 is cured by irradiating light for curing. Thereby, the second alignment mark 14 made of the cured thin film material is formed. The outer peripheral line of the second alignment mark 14 is arranged inside the outer peripheral line of the first alignment mark 13.

  As shown in FIG. 2C, a third alignment mark 15 is similarly formed on the second alignment mark 14. The outer peripheral line of the third alignment mark 15 is arranged inside the outer peripheral line of the second alignment mark 14.

  FIG. 3A shows a schematic side view of the synthetic alignment mark 16 and the low magnification camera 30. A synthetic alignment mark 16 is formed on the substrate 10. A low-magnification camera 30 is disposed above the composite alignment mark 16. FIG. 3B shows the relationship between the field of view 31 of the low-magnification camera 30 and the composite alignment mark 16. The first alignment mark 13 is within the field of view 31. Therefore, the position of the substrate 10 can be detected by performing image analysis of the first alignment mark 13.

  FIG. 4A shows a schematic side view of the composite alignment mark 16 and the medium magnification camera 33. A medium magnification camera 33 is disposed above the composite alignment mark 16. FIG. 4B shows the relationship between the field of view 34 of the medium magnification camera 33 and the composite alignment mark 16. The first alignment mark 13 protrudes from the visual field 34 and the second alignment mark 14 is within the visual field 34. Therefore, the position of the substrate 10 can be detected by performing image analysis of the second alignment mark 14.

  FIG. 5A shows a schematic side view of the composite alignment mark 16 and the high magnification camera 36. A high-magnification camera 36 is disposed above the composite alignment mark 16. FIG. 5B shows the relationship between the field of view 37 of the high-magnification camera 36 and the composite alignment mark 16. The first alignment mark 13 and the second alignment mark 14 protrude from the visual field 37 and the third alignment mark 15 is within the visual field 37. Therefore, the position of the substrate 10 can be detected by performing image analysis of the third alignment mark 15.

  Since the composite alignment mark 16 includes the first alignment mark 13, the second alignment mark 14, and the third alignment mark 15 having different dimensions, detection of alignment marks using various cameras having different magnifications is possible. Can respond. In addition, since the second alignment mark 14 and the third alignment mark 15 are included in the first alignment mark 13, it is possible to prevent an increase in the area to be secured for arranging the alignment mark.

FIG. 6A shows a schematic view of an alignment mark and a camera formed by an alignment mark forming method according to another embodiment. In the embodiment shown in FIG. 6A as well, as in the embodiment shown in FIGS. 2A to 5B, the composite alignment mark including the first alignment mark 13, the second alignment mark 14, and the third alignment mark 15. 16 is formed on the substrate 10.

  In the embodiment shown in FIGS. 3A to 5B, the camera is arranged toward the surface on which the synthetic alignment mark 16 is formed, and the synthetic alignment mark 16 is observed. In the embodiment shown in FIG. 6A, the low-magnification camera 30, the medium-magnification camera 33, and the high-magnification camera 36 are arranged toward the surface opposite to the surface on which the synthetic alignment mark 16 is formed. The alignment mark 16 is observed.

  A transparent substrate such as a glass substrate is used as the substrate 10 so that the synthetic alignment mark 16 can be observed through the substrate 10. The first alignment mark 13 and the second alignment mark 14 are transparent or translucent. The third alignment mark 15 is not transparent. The second alignment mark 14 is observed through the first alignment mark 13 and the substrate 10. The third alignment mark 15 is observed through the second alignment mark 14, the first alignment mark 13 and the substrate 10.

  In order to improve the visibility of the first alignment mark 13 and the second alignment mark 14, the first alignment mark 13 and the second alignment mark 14 may be formed of a colored translucent material. By making the second alignment mark 14 a color different from that of the first alignment mark 13, the visibility of the second alignment mark 14 can be further enhanced.

  FIG. 6B shows a schematic view of an alignment mark and a camera formed by an alignment mark forming method according to still another embodiment. In the embodiment shown in FIG. 6A, the first alignment mark 13 located at the lowest layer is the largest, and the third alignment mark 15 located at the highest layer is the smallest. In the embodiment shown in FIG. 6B, conversely, the first alignment mark 13 located in the lowermost layer is the smallest and the third alignment mark 15 located in the uppermost layer is the largest.

  The second alignment mark 14 covers the first alignment mark 13 and extends to the outside of the first alignment mark 13. The third alignment mark 15 covers the second alignment mark 14 and extends to the outside of the second alignment mark 14. As described above, in the embodiment shown in FIG. 6B, the first alignment mark 13 is included in the second alignment mark 14 and the second alignment mark 14 is included in the third alignment mark 15 in plan view. It is included.

  The color of the second alignment mark 14 is different from the color of the first alignment mark 13. The color of the third alignment mark 15 is different from the color of the second alignment mark 14. The substrate 10 is transparent. Therefore, the first alignment mark 13, the second alignment mark 14, and the third alignment mark 15 can be easily visually recognized through the substrate 10.

FIG. 7 shows a schematic view of an alignment mark forming apparatus according to the embodiment. A stage 52 is supported on the surface plate 50 via a moving mechanism 51. The stage 52 holds the substrate 10 that is an object for forming alignment marks. An xyz orthogonal coordinate system is defined in which a plane parallel to the surface of the substrate 10 is an xy plane and a normal direction of the surface of the substrate 10 is a z direction. A nozzle unit 53 is supported above the stage 52. The moving mechanism 51 is controlled by the control device 60 to move one of the substrate 10 and the nozzle unit 53 in the x direction and the y direction with respect to the other. In FIG. 7, the nozzle unit 53 is stationary with respect to the surface plate 50 and the substrate 10 is moved. However, conversely, the substrate 10 may be stationary and the nozzle unit 53 may be moved.

  The nozzle unit 53 has a nozzle head facing the substrate 10. A photocurable liquid thin film material is formed into droplets and discharged from a plurality of nozzle holes formed in the nozzle head toward the substrate 10. The timing at which the thin film material is discharged from the nozzle holes is controlled by the control device 60.

  FIG. 8A shows a perspective view of the nozzle unit 53, and FIG. 8B shows a bottom view of the nozzle unit 53. Two nozzle heads 71 and three curing light sources 72 are attached to the support plate 70. The two nozzle heads 71 are arranged side by side in the y direction. A curing light source 72 is disposed between the two nozzle heads 71 and outside the nozzle head 71. Focusing on one nozzle head 71, curing light sources 72 are arranged on the positive side and the negative side of the nozzle head 71 in the y direction, respectively.

  In each of the nozzle heads 71, a plurality of nozzle holes 73 arranged at equal intervals in the x direction are formed. 8A and 8B show an example in which the plurality of nozzle holes 73 of each nozzle head 71 are arranged in two rows. The two nozzle heads 71 are fixed so as to be offset from each other in the x direction. A total of four rows of nozzle holes 73 formed in the two nozzle heads 71 are distributed at equal intervals in the x direction as a whole.

  The curing light source 72 irradiates the liquid thin film material applied to the substrate 10 (FIG. 7) with curing light. For example, when the thin film material is discharged from the nozzle head 71 while moving the substrate 10 (FIG. 7) in the y direction, the thin film material applied to the substrate 10 is arranged on the downstream side of the nozzle head 71 that discharged the thin film material. The cured light from the curing light source 72 is cured.

  8A and 8B, the number of nozzle heads 71 mounted is two, but the number of nozzle heads 71 mounted may be one or three or more. The curing light source 72 may be disposed on the downstream side of each nozzle head 71. When the thin film material is applied while reciprocating the substrate 10 in the y direction, the curing light sources 72 are disposed on both sides of each nozzle head 71. When the number of mounted nozzle heads 71 is increased, the pitch of the nozzle holes 73 distributed at equal intervals in the x direction is reduced. Thereby, the resolution of the alignment mark to be formed can be increased.

  You may make it discharge the thin film material which has mutually different transparency and color from the two nozzle heads 71. FIG. Thus, in the embodiment shown in FIGS. 6A and 6B, the first alignment mark 13, the second alignment mark 14, and the third alignment mark 15 are formed of two types of thin film materials having different transparency and color. It becomes possible to do.

  FIG. 9 is a plan view of the stage 52 and the nozzle unit 53 of the alignment mark forming apparatus according to the embodiment. The substrate 10 is held on the stage 52. An alignment mark formation region 11 is defined on the surface of the substrate 10.

  A nozzle unit 53 is disposed above the substrate 10. The nozzle unit 53 includes a nozzle head 71 and a curing light source 72. The thin film material can be applied to the substrate 10 by discharging the thin film material from the nozzle head 71 while moving the substrate 10 in the y direction by the moving mechanism 51. The control device 60 controls the movement of the substrate 10 by the moving mechanism 51 and the discharge timing of the thin film material from the nozzle head 71. Thereby, a thin film material can be applied to the alignment mark formation region 11. Position information and pattern information of the alignment mark formation region 11 are stored in the control device 60 in advance.

  By repeating the same process while shifting the substrate 10 in the x direction, an alignment mark can be formed in any region of the surface of the substrate 10.

  The alignment mark formed by the method according to the above embodiment is used, for example, when manufacturing a thick copper substrate. When forming an insulating pattern used as a mask when forming a thick copper pattern by plating, an alignment mark is used for detecting the position of the substrate. Further, when the two thick copper substrates are bonded together, an alignment mark is used for alignment between the substrates.

  Although the present invention has been described with reference to the embodiments, the present invention is not limited thereto. It will be apparent to those skilled in the art that various modifications, improvements, combinations, and the like can be made.

DESCRIPTION OF SYMBOLS 10 Substrate 11 Alignment mark formation area 12 Pattern formation area 13 First alignment mark 14 Second alignment mark 15 Third alignment mark 16 Composite alignment mark 20 Thin film material 30 Low magnification camera 31 Field of view 33 Medium magnification camera 34 Field of view 36 High Magnification camera 37 Field of view 50 Surface plate 51 Moving mechanism 52 Stage 53 Nozzle unit 60 Controller 70 Support plate 71 Nozzle head 72 Curing light source 73 Nozzle hole

Claims (8)

Forming a first alignment mark by applying a thin film material to a substrate by discharging the thin film material into droplets, applying the thin film material, and curing;
The substrate on which the first alignment mark is formed is made to be included in the first alignment mark in a plan view by applying a thin film material by discharging the thin film material into droplets and applying and curing the thin film material. Or forming a second alignment mark including the first alignment mark.   The alignment mark forming method according to claim 1, wherein the second alignment mark is included in the first alignment mark in a plan view.   The alignment mark forming method according to claim 2, wherein the substrate and the first alignment mark are transparent or translucent, and the second alignment mark is not transparent.   The substrate is transparent, and the first alignment mark is included in the second alignment mark in a plan view, and the first alignment mark and the second alignment mark have different colors. The alignment mark forming method according to claim 1, wherein the alignment mark is formed of a thin film material. A stage for holding a substrate;
A nozzle head having a plurality of nozzle holes for discharging a photocurable liquid thin film material toward the substrate held on the stage;
A moving mechanism for moving one of the substrate and the nozzle head relative to the other;
A light source for irradiating the liquid thin film material applied to the substrate held on the stage with light for curing;
A control device for controlling the nozzle head, the light source, and the moving mechanism;
The control device controls the nozzle head, the light source, and the moving mechanism,
The first alignment mark is formed by applying the thin film material by applying the thin film material to the substrate as droplets, and then applying the thin film material to cure.
The substrate on which the first alignment mark is formed is made to be included in the first alignment mark in a plan view by applying a thin film material by discharging the thin film material into droplets and applying and curing the thin film material. Alternatively, an alignment mark forming apparatus for forming a second alignment mark including the first alignment mark.   6. The control device according to claim 5, wherein the control device controls the nozzle head, the light source, and the moving mechanism so that the second alignment mark is included in the first alignment mark in a plan view. Alignment mark forming device.   The said control apparatus of Claim 5 controls the said nozzle head, the said light source, and the said moving mechanism so that the said 1st alignment mark may be included in the said 2nd alignment mark in planar view. Alignment mark forming device. The nozzle head is
8. The device according to claim 5, further comprising: a first nozzle head that discharges the first thin film material; and a second nozzle head that discharges the second thin film material having a color different from that of the first thin film material. The alignment mark forming apparatus according to Item.

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