JP2015035408A - Circuit board and battery pack module - Google Patents

Circuit board and battery pack module Download PDF

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JP2015035408A
JP2015035408A JP2013167133A JP2013167133A JP2015035408A JP 2015035408 A JP2015035408 A JP 2015035408A JP 2013167133 A JP2013167133 A JP 2013167133A JP 2013167133 A JP2013167133 A JP 2013167133A JP 2015035408 A JP2015035408 A JP 2015035408A
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temperature sensor
hole
wiring layer
wiring
circuit board
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JP6184242B2 (en
Inventor
洋介 佐伯
Yosuke Saeki
洋介 佐伯
黒田　和人
Kazuto Kuroda
和人 黒田
小杉　伸一郎
Shinichiro Kosugi
伸一郎 小杉
関野　正宏
Masahiro Sekino
正宏 関野
滋 野澤
Shigeru Nozawa
滋 野澤
行田　稔
Minoru Gyoda
稔 行田
冬樹 神戸
Fuyuki Kanbe
冬樹 神戸
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Toshiba Corp
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Toshiba Corp
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Priority to JP2013167133A priority Critical patent/JP6184242B2/en
Priority to PCT/JP2013/079358 priority patent/WO2015019511A1/en
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/16—Special arrangements for conducting heat from the object to the sensitive element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/20—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders
    • H01M50/204—Racks, modules or packs for multiple batteries or multiple cells
    • H01M50/207—Racks, modules or packs for multiple batteries or multiple cells characterised by their shape
    • H01M50/209—Racks, modules or packs for multiple batteries or multiple cells characterised by their shape adapted for prismatic or rectangular cells
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/02—Means for indicating or recording specially adapted for thermometers
    • G01K1/026—Means for indicating or recording specially adapted for thermometers arrangements for monitoring a plurality of temperatures, e.g. by multiplexing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/42—Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells
    • H01M10/425—Structural combination with electronic components, e.g. electronic circuits integrated to the outside of the casing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/42—Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells
    • H01M10/48—Accumulators combined with arrangements for measuring, testing or indicating the condition of cells, e.g. the level or density of the electrolyte
    • H01M10/486—Accumulators combined with arrangements for measuring, testing or indicating the condition of cells, e.g. the level or density of the electrolyte for measuring temperature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/50—Current conducting connections for cells or batteries
    • H01M50/569—Constructional details of current conducting connections for detecting conditions inside cells or batteries, e.g. details of voltage sensing terminals
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K2205/00—Application of thermometers in motors, e.g. of a vehicle
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Battery Mounting, Suspending (AREA)
  • Structure Of Printed Boards (AREA)
  • Secondary Cells (AREA)

Abstract

PROBLEM TO BE SOLVED: To improve detection accuracy of the temperature of a battery cell.SOLUTION: A battery pack module 10 includes a plurality of battery cells, and a control circuit board 14 mounted with a temperature sensor 13. The control circuit board 14 has a first conductor pattern 45 which is provided on the surface of a first wiring layer L1(on a surface 14B of the control circuit board 14), is electrically and thermally connected to a contact part 44 of a first through hole 40, extends from the contact part 44 of the first through hole 40 toward the temperature sensor 13 and surrounds the temperature sensor 13. The control circuit board 14 also has a second conductor pattern 46 which is provided in an inner layer in the lamination direction among first to fourth wiring layers L1 to L4 (for example, the second wiring layer L2 overlaid on the first wiring layer L1 via an insulation layer 41), is electrically and thermally connected to the first through hole 40 and extends from the first through hole 40 to a position where the second conductor pattern 46 interferes with the temperature sensor 13 in the lamination direction.

Description

本発明の実施形態は、基板および組電池モジュールに関する。   Embodiments described herein relate generally to a substrate and an assembled battery module.

従来、複数の電池セルを電気的に接続するとともに機械的に一体に固定した組電池において、リード線が接続されたサーミスタによって各電池セルの温度を検出する技術が知られている。   Conventionally, in a battery pack in which a plurality of battery cells are electrically connected and mechanically fixed integrally, a technique for detecting the temperature of each battery cell using a thermistor to which a lead wire is connected is known.

特開２０１２−３８４６８号公報JP 2012-38468 A

ところで、温度検出対象とサーミスタとの熱的な結合を強めることにより、サーミスタによる温度検出精度を向上させることが望まれている。   Incidentally, it is desired to improve the temperature detection accuracy of the thermistor by strengthening the thermal coupling between the temperature detection target and the thermistor.

本実施形態の組電池モジュールは、積層された複数の配線層と、前記複数の配線層のうちで積層方向の第１の端部に設けられた第１配線層の表面に配置された温度センサと、前記複数の配線層を積層方向に貫通し、前記温度センサの温度検出対象に電気的に接続された第１スルーホールと、前記第１配線層の表面上において前記第１スルーホールに熱的に接続されるとともに、前記温度センサの周囲を取り囲むように形成された第１熱伝達パターンと、前記複数の配線層のうちで内層の第２配線層において前記第１スルーホールに熱的に接続されるとともに、前記複数の配線層の積層方向に見て前記温度センサに干渉する位置に配置された第２熱伝達パターンと、を備える基板と、複数の電池セルと、前記電池セルの電極端子に電気的に接続されるとともに、外部に露出した第３配線層の表面において前記第１スルーホールに電気的に接続された接続部材と、を備える、ことを特徴とする。   The assembled battery module of this embodiment includes a plurality of stacked wiring layers and a temperature sensor disposed on the surface of the first wiring layer provided at the first end in the stacking direction among the plurality of wiring layers. A first through hole that penetrates the plurality of wiring layers in the stacking direction and is electrically connected to a temperature detection target of the temperature sensor, and heats the first through hole on the surface of the first wiring layer. A first heat transfer pattern formed so as to surround the temperature sensor and thermally connect to the first through hole in the second wiring layer of the inner layer among the plurality of wiring layers. A substrate having a second heat transfer pattern connected to and disposed at a position interfering with the temperature sensor when viewed in the stacking direction of the plurality of wiring layers, a plurality of battery cells, and electrodes of the battery cells Electrically connected to terminal Together are provided with, and electrically connected to the connecting member to the first through-hole in the surface of the third wiring layer exposed to the outside, characterized in that.

実施形態の組電池モジュールの構成図である。It is a block diagram of the assembled battery module of embodiment. 実施形態の基板の断面図である。It is sectional drawing of the board | substrate of embodiment. 実施形態の基板の表面を示す平面図である。It is a top view which shows the surface of the board | substrate of embodiment. 実施形態の第１変形例の基板の表面を示す平面図である。It is a top view which shows the surface of the board | substrate of the 1st modification of embodiment. 実施形態の第２変形例の基板の表面を示す平面図である。It is a top view which shows the surface of the board | substrate of the 2nd modification of embodiment. 実施形態の第３変形例の基板の表面を示す平面図である。It is a top view which shows the surface of the board | substrate of the 3rd modification of embodiment. 実施形態の第４変形例の組電池モジュールの回路図である。It is a circuit diagram of the assembled battery module of the 4th modification of embodiment. 実施形態の第５変形例の組電池モジュールの回路図である。It is a circuit diagram of the assembled battery module of the 5th modification of embodiment.

以下、実施形態の基板および組電池モジュールについて添付図面を参照しながら説明する。
本実施形態の組電池モジュール１０は、図１に示すように、筐体１１と、複数の電池セル１２，…，１２と、温度センサ１３と、制御回路基板１４と、を備えている。 Hereinafter, the board | substrate and assembled battery module of embodiment are demonstrated, referring an accompanying drawing.
As shown in FIG. 1, the assembled battery module 10 of this embodiment includes a housing 11, a plurality of battery cells 12,..., A temperature sensor 13, and a control circuit board 14.

複数の電池セル１２，…，１２は、樹脂などから成る筐体１１の内部に収容されている。複数の電池セル１２，…，１２の各々は、リチウムイオン電池などの非水電解質二次電池であり、アルミニウムまたはアルミニウム合金で形成された扁平な略直方体形状の外装容器２１と、外装容器２１内に非水電解液と共に収納された電極体（図示略）と、を備えている。
各電池セル１２は、電極体の正極に接続された正極端子２２および負極に接続された負極端子２３を、例えば合成樹脂やガラスなどの絶縁体からなるガスケット２４を介して、外装容器２１の端子面２１Ａ（例えば、鉛直方向上方の上端面）上の長手方向両端部のそれぞれに備えている。
複数の電池セル１２，…，１２の各々の正極端子２２および負極端子２３は、導電性のアルミニウムまたは真鍮などの金属からなる複数のバスバー２５，…，２５により電気的に直列または並列に接続されている。
複数のバスバー２５，…，２５のうち正極側の出力端を有するバスバー２５および負極側の出力端を有するバスバー２５は、複数の電池セル１２，…，１２の各々の端子面２１Ａに所定間隔をおいて対向配置された制御回路基板１４の対向面１４Ａに形成された回路パターンに電気的に接続されている。 The plurality of battery cells 12,..., 12 are accommodated in a housing 11 made of resin or the like. Each of the plurality of battery cells 12,..., 12 is a non-aqueous electrolyte secondary battery such as a lithium ion battery, and a flat, substantially rectangular parallelepiped outer container 21 made of aluminum or an aluminum alloy, and the outer container 21. And an electrode body (not shown) housed together with the non-aqueous electrolyte.
Each battery cell 12 has a positive terminal 22 connected to the positive electrode of the electrode body and a negative terminal 23 connected to the negative electrode connected to the terminal of the outer container 21 via a gasket 24 made of an insulator such as synthetic resin or glass. It is provided at each of both ends in the longitudinal direction on the surface 21A (for example, the upper end surface above the vertical direction).
The positive terminal 22 and the negative terminal 23 of each of the battery cells 12,..., 12 are electrically connected in series or in parallel by a plurality of bus bars 25,. ing.
Of the plurality of bus bars 25,..., 25, the bus bar 25 having a positive output end and the bus bar 25 having a negative output end have a predetermined interval between the terminal surfaces 21 </ b> A of the plurality of battery cells 12,. Are electrically connected to the circuit pattern formed on the opposing surface 14A of the control circuit board 14 that is oppositely disposed.

温度センサ１３は、例えばチップ型のサーミスタであって、制御回路基板１４の厚さ方向で対向面１４Ａの反対側の表面１４Ｂ上に実装され、バスバー２５に電気的に接続された第１スルーホール４０の近傍に配置されている。温度センサ１３は、バスバー２５の温度に応じた抵抗値の電圧信号を処理回路３２に出力する。   The temperature sensor 13 is, for example, a chip-type thermistor, and is mounted on the surface 14B opposite to the facing surface 14A in the thickness direction of the control circuit board 14 and is electrically connected to the bus bar 25. 40 is arranged in the vicinity. The temperature sensor 13 outputs a voltage signal having a resistance value corresponding to the temperature of the bus bar 25 to the processing circuit 32.

制御回路基板１４は、図２に示すように、複数の絶縁層４１と交互に積層された複数の配線層４２、例えば４つの第１〜第４配線層Ｌ１〜Ｌ４を備えている。第１〜第４配線層Ｌ１〜Ｌ４のうち、積層方向の第１の端部に配置された第１配線層Ｌ１の表面は制御回路基板１４の表面１４Ｂを成し、積層方向の第２の端部に配置された第４配線層Ｌ４の表面は制御回路基板１４の対向面１４Ａを成している。なお、第１配線層Ｌ１および第４配線層Ｌ４の各表面上の所定領域には、所定パターンの絶縁性のレジスト膜４３が設けられている。   As shown in FIG. 2, the control circuit board 14 includes a plurality of wiring layers 42 alternately stacked with a plurality of insulating layers 41, for example, four first to fourth wiring layers L1 to L4. Of the first to fourth wiring layers L1 to L4, the surface of the first wiring layer L1 disposed at the first end in the stacking direction forms the surface 14B of the control circuit board 14, and the second layer in the stacking direction. The surface of the fourth wiring layer L4 disposed at the end forms an opposing surface 14A of the control circuit board 14. An insulating resist film 43 having a predetermined pattern is provided in a predetermined region on each surface of the first wiring layer L1 and the fourth wiring layer L4.

制御回路基板１４は、制御回路基板１４を積層方向に貫通し、第１配線層Ｌ１の表面（つまり、制御回路基板１４の表面１４Ｂ）上の回路パターンと第４配線層Ｌ４の表面（つまり、制御回路基板１４の対向面１４Ａ）上の回路パターンとに電気的に接続された第１スルーホール４０を備えている。第１スルーホール４０は、導電性の内壁を有する貫通穴であって、対向面１４Ａ上の回路パターンに接続されたバスバー２５に電気的に接続されている。
制御回路基板１４は、図３に示すように、第１配線層Ｌ１の表面（つまり、制御回路基板１４の表面１４Ｂ）上において、第１スルーホール４０の接点部４４に電気的および熱的に接続された第１導体パターン４５を備えている。第１導体パターン４５は、第１スルーホール４０の接点部４４から温度センサ１３に向かい延伸して、温度センサ１３の周囲を取り囲むような形状を有する。
さらに、制御回路基板１４は、図２に示すように、第１〜第４配線層Ｌ１〜Ｌ４のうちで積層方向の内層、例えば絶縁層４１を介して第１配線層Ｌ１に積層された第２配線層Ｌ２において、第１スルーホール４０に電気的および熱的に接続された第２導体パターン４６を備えている。第２導体パターン４６は、第１スルーホール４０から、積層方向で温度センサ１３に干渉する位置まで延伸する形状を有している。 The control circuit board 14 penetrates the control circuit board 14 in the stacking direction, and the circuit pattern on the surface of the first wiring layer L1 (that is, the surface 14B of the control circuit board 14) and the surface of the fourth wiring layer L4 (that is, the surface) A first through hole 40 electrically connected to the circuit pattern on the opposing surface 14A) of the control circuit board 14 is provided. The first through hole 40 is a through hole having a conductive inner wall, and is electrically connected to the bus bar 25 connected to the circuit pattern on the facing surface 14A.
As shown in FIG. 3, the control circuit board 14 is electrically and thermally connected to the contact portion 44 of the first through hole 40 on the surface of the first wiring layer L1 (that is, the surface 14B of the control circuit board 14). A connected first conductor pattern 45 is provided. The first conductor pattern 45 has a shape extending from the contact portion 44 of the first through hole 40 toward the temperature sensor 13 and surrounding the temperature sensor 13.
Further, as shown in FIG. 2, the control circuit board 14 is formed by stacking the first wiring layer L1 on the first wiring layer L1 via the inner layer in the stacking direction, for example, the insulating layer 41 among the first to fourth wiring layers L1 to L4. The second wiring layer L2 includes a second conductor pattern 46 that is electrically and thermally connected to the first through hole 40. The second conductor pattern 46 has a shape that extends from the first through hole 40 to a position that interferes with the temperature sensor 13 in the stacking direction.

上述したように、本実施形態による組電池モジュール１０によれば、温度センサ１３の周囲を取り囲むような形状を有する第１導体パターン４５に加えて、内層で温度センサ１３に干渉する位置まで延伸する形状を有する第２導体パターン４６を備えることにより、バスバー２５と温度センサ１３との熱的な結合を増大させ、温度の検出精度を向上させることができる。   As described above, according to the assembled battery module 10 according to the present embodiment, in addition to the first conductor pattern 45 having a shape surrounding the temperature sensor 13, the inner layer extends to a position that interferes with the temperature sensor 13. By providing the second conductor pattern 46 having a shape, the thermal coupling between the bus bar 25 and the temperature sensor 13 can be increased, and the temperature detection accuracy can be improved.

（第１変形例）
なお、上述した実施形態では、図４に示す第１変形例のように、制御回路基板１４は、第１導体パターン４５と第２導体パターン４６とを電気的かつ熱的に接続する第２スルーホール４７を備えてもよい。
第２スルーホール４７は、導電性の内壁を有する貫通穴であって、例えば、複数の配線層４２，…，４２を成す４つの第１〜第４配線層Ｌ１〜Ｌ４のうちの少なくとも第１配線層Ｌ１と第２配線層Ｌ２との間を貫通している。第２スルーホール４７は、第１配線層Ｌ１の第１導体パターン４５と第２配線層Ｌ２の第２導体パターン４６とを電気的かつ熱的に接続する。
この第１変形例によれば、バスバー２５と温度センサ１３との熱的な結合を、より一層増大させ、温度の検出精度を向上させることができる。 (First modification)
In the embodiment described above, as in the first modification shown in FIG. 4, the control circuit board 14 has the second through that electrically and thermally connects the first conductor pattern 45 and the second conductor pattern 46. A hole 47 may be provided.
The second through hole 47 is a through hole having a conductive inner wall, and is, for example, at least the first of the four first to fourth wiring layers L1 to L4 forming the plurality of wiring layers 42,. It penetrates between the wiring layer L1 and the second wiring layer L2. The second through hole 47 electrically and thermally connects the first conductor pattern 45 of the first wiring layer L1 and the second conductor pattern 46 of the second wiring layer L2.
According to the first modification, the thermal coupling between the bus bar 25 and the temperature sensor 13 can be further increased, and the temperature detection accuracy can be improved.

（第２変形例）
なお、上述した実施形態および第１変形例では、図５に示す第２変形例のように、制御回路基板１４は、第１導体パターン４５の周囲を取り囲むように設けられるとともに、複数の配線層４２，…，４２のうちで少なくとも第１配線層Ｌ１を積層方向に貫通する穴部４８を備えてもよい。
穴部４８は、非導電性の内壁を有する貫通穴である。例えば図５に示すように、複数の穴部４８，…，４８は、複数の第２スルーホール４７，…，４７によって第１導体パターン４５に電気的かつ熱的に接続された第２導体パターン４６の周囲のうち、温度センサ１３に接続された配線パターン（図示略）が存在する領域以外の領域を取り囲むように設けられている。複数の穴部４８，…，４８の各々は、少なくとも第１配線層Ｌ１から第２配線層Ｌ２までに亘って積層方向に貫通している。
この第２変形例によれば、温度検出対象であるバスバー２５以外の部品と温度センサ１３との熱的な結合を抑制し、温度センサ１３によるバスバー２５の温度の検出精度を向上させることができる。 (Second modification)
In the embodiment and the first modification described above, the control circuit board 14 is provided so as to surround the first conductor pattern 45 as in the second modification shown in FIG. 42,..., 42 may include a hole 48 penetrating at least the first wiring layer L1 in the stacking direction.
The hole 48 is a through hole having a non-conductive inner wall. For example, as shown in FIG. 5, the plurality of holes 48,..., 48 are the second conductor pattern electrically and thermally connected to the first conductor pattern 45 by the plurality of second through holes 47,. 46 is provided so as to surround a region other than a region where a wiring pattern (not shown) connected to the temperature sensor 13 exists. Each of the plurality of holes 48,..., 48 penetrates in the stacking direction from at least the first wiring layer L1 to the second wiring layer L2.
According to the second modification, thermal coupling between the temperature sensor 13 and components other than the bus bar 25 that is a temperature detection target can be suppressed, and the temperature detection accuracy of the bus bar 25 by the temperature sensor 13 can be improved. .

（第３変形例）
なお、上述した実施形態の第２変形例では、図６に示す第３変形例のように、制御回路基板１４は、温度センサ１３に接続された配線を設置するための領域を複数の配線層４２，…，４２の内層に設けることによって、複数の穴部４８，…，４８を第１導体パターン４５の周囲を隙間無く取り囲むように配置可能である。
例えば図６に示す複数の穴部４８，…，４８は、第２導体パターン４６の周囲の全域を取り囲むように設けられ、少なくとも第１配線層Ｌ１から第２配線層Ｌ２までに亘って積層方向に貫通している。
この第３変形例によれば、温度検出対象であるバスバー２５以外の部品と温度センサ１３との熱的な結合を、より一層、抑制し、温度センサ１３によるバスバー２５の温度の検出精度を向上させることができる。 (Third Modification)
In the second modification of the above-described embodiment, as in the third modification shown in FIG. 6, the control circuit board 14 has a region for installing wiring connected to the temperature sensor 13 as a plurality of wiring layers. .., 42 can be arranged so as to surround the first conductor pattern 45 without any gaps.
For example, the plurality of holes 48,..., 48 shown in FIG. 6 are provided so as to surround the entire area around the second conductor pattern 46, and at least the first wiring layer L1 to the second wiring layer L2 are stacked in the stacking direction. Has penetrated.
According to the third modification, thermal coupling between the temperature sensor 13 and components other than the bus bar 25 that is a temperature detection target is further suppressed, and the temperature sensor 13 detects the temperature of the bus bar 25 more accurately. Can be made.

（第４変形例）
なお、上述した実施形態では、温度センサ１３は、電池セル１２の電圧（セル電圧）を検出する電圧検出回路４９に対して、電気的な接続および遮断を切り替え可能に接続されてもよい。
例えば図７に示す第４変形例の組電池モジュール１０は、直列に接続された複数の電池セル１２，…，１２に対して、隣り合う電池セル１２，１２間の接続点に温度センサ１３（例えば、ＴＨ１，ＴＨ２，…）を介して接続された電圧検出回路４９を備えている。電圧検出回路４９は、例えばアナログ・フロント・エンド（ＡＦＥ）などのアナログ回路である。組電池モジュール１０は、複数の温度センサ１３，…，１３の各々と電圧検出回路４９とを接続する各接続線と接地点Ｇとの間に、直列に接続されたスイッチング素子５０および分圧抵抗５１を備えている。さらに、組電池モジュール１０は、スイッチング素子５０と分圧抵抗５１との間に接続された分圧検出回路５２を備えている。スイッチング素子５０は、例えばＦＥＴなどであって、処理回路３２から出力されるオン・オフ信号に応じて、温度センサ１３による温度検出時に接続（オン）とされ、温度検出時以外に遮断（オフ）とされる。分圧検出回路５２は、例えばアナログ・デジタル変換回路（ＡＤＣ）などである。 (Fourth modification)
In the above-described embodiment, the temperature sensor 13 may be connected to the voltage detection circuit 49 that detects the voltage (cell voltage) of the battery cell 12 so as to be able to switch between electrical connection and disconnection.
For example, the assembled battery module 10 of the 4th modification shown in FIG. 7 is the temperature sensor 13 (at the connection point between the adjacent battery cells 12 and 12 with respect to the some battery cells 12, ..., 12 connected in series. For example, a voltage detection circuit 49 connected via TH1, TH2,. The voltage detection circuit 49 is an analog circuit such as an analog front end (AFE). The assembled battery module 10 includes a switching element 50 and a voltage dividing resistor connected in series between a connection line connecting each of the temperature sensors 13,..., 13 and the voltage detection circuit 49 and the ground point G. 51 is provided. Furthermore, the assembled battery module 10 includes a voltage dividing detection circuit 52 connected between the switching element 50 and the voltage dividing resistor 51. The switching element 50 is, for example, an FET or the like, and is connected (ON) when temperature is detected by the temperature sensor 13 according to an ON / OFF signal output from the processing circuit 32, and is cut off (OFF) except when the temperature is detected. It is said. The voltage dividing detection circuit 52 is, for example, an analog / digital conversion circuit (ADC).

この第４変形例において、処理回路３２は、各スイッチング素子５０のオンおよびオフの切り替えと、電圧検出回路４９の時定数の切り替えとなどを制御し、各電池セル１２のセル電圧の検出と温度の検出とを切り替えて実行する。処理回路３２は、電圧検出回路４９により検出された複数の電池セル１２，…，１２の各々のセル電圧値と、各分圧検出回路５２により検出された分圧値とにより、各電池セル１２の温度を検出する。
この第４変形例によれば、各温度センサ１３と電圧検出回路４９とを接続して、各温度センサ１３にセル電圧検出線から直接的に給電することによって、バスバー２５と温度センサ１３との熱的な結合を増大させ、温度の検出精度を向上させることができる。さらに、各電池セル１２に対する温度検出時のみに各スイッチング素子５０をオンにするので、電流の漏れやセル電圧のバランスの崩れなどの不具合が生じることを防ぐことができる。 In the fourth modified example, the processing circuit 32 controls switching of the switching elements 50 on and off, switching of the time constant of the voltage detection circuit 49, and the like, and detects the cell voltage of each battery cell 12 and the temperature. Switching between detection and execution. The processing circuit 32 uses each cell voltage value of each of the plurality of battery cells 12,..., 12 detected by the voltage detection circuit 49 and the divided voltage value detected by each divided voltage detection circuit 52, so that each battery cell 12. Detect the temperature.
According to the fourth modified example, each temperature sensor 13 and the voltage detection circuit 49 are connected, and each temperature sensor 13 is directly supplied with power from the cell voltage detection line, whereby the bus bar 25 and the temperature sensor 13 are connected. Thermal coupling can be increased and temperature detection accuracy can be improved. Furthermore, since each switching element 50 is turned on only at the time of temperature detection with respect to each battery cell 12, it is possible to prevent problems such as current leakage and cell voltage imbalance.

（第５変形例）
なお、上述した実施形態の第４変形例では、図８に示す第５変形例の組電池モジュール１０のように、直列に接続されたスイッチング素子５０および分圧抵抗５１を、各電池セル１２の正極および負極の端子間に各温度センサ１３を介して接続してもよい。 (5th modification)
In the fourth modification of the above-described embodiment, the switching element 50 and the voltage dividing resistor 51 connected in series are connected to each battery cell 12 as in the assembled battery module 10 of the fifth modification shown in FIG. The temperature sensor 13 may be connected between the positive and negative terminals.

なお、上記の実施形態は、例として提示したものであり、発明の範囲を限定することは意図していない。これら新規な実施形態は、その他の様々な形態で実施されることが可能であり、発明の要旨を逸脱しない範囲で、種々の省略、置き換え、変更を行うことができる。これら実施形態やその変形は、発明の範囲や要旨に含まれるとともに、特許請求の範囲に記載された発明とその均等の範囲に含まれる。   In addition, said embodiment is shown as an example and is not intending limiting the range of invention. These novel embodiments can be implemented in various other forms, and various omissions, replacements, and changes can be made without departing from the scope of the invention. These embodiments and modifications thereof are included in the scope and gist of the invention, and are included in the invention described in the claims and the equivalents thereof.

例えば、上述した実施形態において、第１スルーホール４０に電気的および熱的に接続された第１および第２導体パターン４５，４６を備えるとしたが、これに限定されず、第１および第２導体パターン４５，４６の代わりに、第１スルーホール４０に熱的に接続された第１および第２熱伝達パターンを備えてもよい。つまり、第１および第２熱伝達パターンは電気的な導電性を有していなくてもよい。   For example, in the above-described embodiment, the first and second conductor patterns 45 and 46 that are electrically and thermally connected to the first through hole 40 are provided. However, the first and second conductor patterns 45 and 46 are not limited thereto. Instead of the conductor patterns 45 and 46, first and second heat transfer patterns thermally connected to the first through holes 40 may be provided. That is, the first and second heat transfer patterns may not have electrical conductivity.

例えば、上述した実施形態の第４変形例において、高耐圧のマルチプレクサや複数の電圧検出回路４９を用いて複数の電池セル１２，…，１２の各々の温度を検出してもよい。   For example, in the fourth modification example of the above-described embodiment, the temperature of each of the plurality of battery cells 12,..., 12 may be detected using a high voltage multiplexer or a plurality of voltage detection circuits 49.

１０ 組電池モジュール
１２ 電池セル
１３ 温度センサ
１４ 制御回路基板
２５ バスバー
４０ 第１スルーホール
４２ 配線層
４５ 第１導体パターン
４６ 第２導体パターン
４７ 第２スルーホール
４８ 穴部 DESCRIPTION OF SYMBOLS 10 Assembly battery module 12 Battery cell 13 Temperature sensor 14 Control circuit board 25 Bus bar 40 1st through-hole 42 Wiring layer 45 1st conductor pattern 46 2nd conductor pattern 47 2nd through-hole 48 Hole

Claims (6)

積層された複数の配線層と、
前記複数の配線層のうちで積層方向の第１の端部に設けられた第１配線層の表面に配置された温度センサと、
前記複数の配線層を積層方向に貫通し、前記温度センサの温度検出対象に電気的に接続された第１スルーホールと、
前記第１配線層の表面上において前記第１スルーホールに熱的に接続されるとともに、前記温度センサの周囲を取り囲むように形成された第１熱伝達パターンと、
前記複数の配線層のうちで内層の第２配線層において前記第１スルーホールに熱的に接続されるとともに、前記複数の配線層の積層方向に見て前記温度センサに干渉する位置に配置された第２熱伝達パターンと、
を備える、
ことを特徴とする基板。 A plurality of laminated wiring layers;
A temperature sensor disposed on the surface of the first wiring layer provided at the first end in the stacking direction among the plurality of wiring layers;
A first through hole penetrating the plurality of wiring layers in the stacking direction and electrically connected to a temperature detection target of the temperature sensor;
A first heat transfer pattern formed on the surface of the first wiring layer so as to be thermally connected to the first through hole and to surround the temperature sensor;
Among the plurality of wiring layers, the second wiring layer, which is an inner layer, is thermally connected to the first through hole, and is disposed at a position that interferes with the temperature sensor when viewed in the stacking direction of the plurality of wiring layers. A second heat transfer pattern,
Comprising
A substrate characterized by that. 前記複数の配線層のうちの少なくとも前記第１配線層と前記第２配線層との間を貫通し、前記第１熱伝達パターンと前記第２熱伝達パターンとを熱的に接続する第２スルーホールを備える、
ことを特徴とする請求項１に記載の基板。 A second through that penetrates at least the first wiring layer and the second wiring layer of the plurality of wiring layers and thermally connects the first heat transfer pattern and the second heat transfer pattern. With a hall,
The substrate according to claim 1. 前記第１熱伝達パターンの周囲を取り囲むように設けられるとともに、前記複数の配線層のうちで少なくとも前記第１配線層を前記積層方向に貫通する穴部を備える、
ことを特徴とする請求項１または請求項２に記載の基板。 The hole is provided so as to surround the first heat transfer pattern and includes a hole penetrating at least the first wiring layer in the stacking direction among the plurality of wiring layers.
The substrate according to claim 1 or 2, characterized in that 前記温度センサに接続された配線は前記内層に配置され、
前記穴部は前記第１熱伝達パターンの周囲を隙間無く取り囲むように配置可能である、
ことを特徴とする請求項３に記載の基板。 The wiring connected to the temperature sensor is arranged in the inner layer,
The hole portion can be arranged so as to surround the first heat transfer pattern without a gap.
The substrate according to claim 3. 請求項１から請求項４の何れか１つに記載の基板と、
複数の電池セルと、
前記複数の電池セルの各々の電極端子に電気的に接続されるとともに、前記複数の配線層のうちで積層方向の第２の端部に設けられた第３配線層の表面において前記第１スルーホールに電気的に接続された接続部材と、
を備える、
ことを特徴とする組電池モジュール。 A substrate according to any one of claims 1 to 4, and
A plurality of battery cells;
The first through hole is electrically connected to the electrode terminals of each of the plurality of battery cells, and the third through layer is provided on a surface of a third wiring layer provided at a second end in the stacking direction among the plurality of wiring layers. A connecting member electrically connected to the hall;
Comprising
An assembled battery module. 前記電池セルの電圧を検出する電圧検出回路を備え、
前記温度センサは前記電圧検出回路に電気的に接続されている、
ことを特徴とする請求項５に記載の組電池モジュール。 A voltage detection circuit for detecting the voltage of the battery cell;
The temperature sensor is electrically connected to the voltage detection circuit;
The assembled battery module according to claim 5.
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