JP2015035285A - Light source for lighting, and lighting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a light source for lighting and a lighting device suppressing deformation of a lamp box body and/or falling-off of an LED module.SOLUTION: A straight tube LED lamp 1 includes a straight tube housing body 20 and a longitudinal substrate 120 which is disposed in the box body 20 and on the surface of which an LED 100 is disposed. The inner wall of the box body 20 and the back surface of the substrate 120 are intermittently bonded with an adhesive 30.

Description

  The present invention relates to an illumination light source and an illumination device, and more particularly to a straight tube lamp having a light emitting element such as a light emitting diode (LED) and an illumination device including the same.

  LED is expected to be a new light source in various lamps such as fluorescent lamps and incandescent lamps, which are conventionally known because of its high efficiency and long life, and research and development of lamps using LED (LED lamps) is being promoted. ing.

  As the LED lamp, a straight tube type LED lamp (straight tube type LED lamp) that replaces a straight tube type fluorescent lamp having an electrode coil at both ends, or an arc tube having an electrode coil at both ends of a glass bulb is provided. There are bulb-type fluorescent lamps and bulb-type LED lamps (bulb-type LED lamps) that can replace incandescent bulbs using filament coils. For example, Patent Document 1 discloses a conventional straight-tube LED lamp.

JP 2009-043447 A

  As for the straight tube LED lamp, for example, a straight tube LED lamp as shown in FIGS. 6A and 6B has been proposed. FIG. 6A is a cross-sectional view showing an example of a conventional straight tube LED lamp. 6B is a cross-sectional view of a straight tube LED lamp cut along line A-A ′ of FIG. 6A.

  A straight tube LED lamp 500 as shown in FIGS. 6A and 6B includes a long LED module 510, a case 520 made of a long glass tube in which a plurality of LED modules are arranged, and a case. A pair of caps 530 and 540 provided at both ends of 520 and a base 550 made of an aluminum plate on which the LED module 510 is placed are provided. The LED module 510 includes a long substrate 511 made of ceramics, a plurality of LEDs 512 mounted on the substrate 511, and a sealing member 513 that collectively seals the plurality of LEDs 512.

  In such a straight tube LED lamp 500, the base 550 is fixed to the inner surface of the housing 520 with an adhesive 560. Specifically, as shown in FIGS. 6A and 6B, an inner surface of a casing 520 that is a cylindrical surface and a rear surface of a base 550 that is a cylindrical surface that is substantially the same shape as the inner surface of the casing 520 are based on the base. It is fixed by an adhesive 560 made of silicon resin applied to the entire back surface of the table 550.

  However, the straight tube LED lamp 500 configured as described above has a problem that the entire long casing 520 is warped, and the lamp shape is distorted. For example, the housing 520 may bend due to the entire center being warped so that the central portion of the housing 520 is lifted, or both ends of the housing 520 being warped upward. When the housing 520 is distorted, there is a problem that the light orientation in the lamp is lowered or the lamp cannot be mounted on the lighting fixture.

  Further, when a straight tube type LED lamp is mounted on a lighting fixture, the LED module 510 is bonded to the inner surface of the upper portion of the housing 520. However, the LED module 510 is attached to the housing due to a decrease in adhesive force and the weight of the LED module 510. There is also a problem of detachment from the body 520. From this viewpoint, it is desirable that the LED module be reduced in weight.

  The present invention has been made to solve such a problem, and an object thereof is to provide an illumination light source and an illumination device that suppress distortion of a lamp housing and dropout of an LED module.

  In order to achieve the above object, an aspect of the light source for illumination according to the present invention includes a straight tube-shaped housing and a long substrate disposed in the housing and having a light emitting element disposed on a surface thereof. And the inner wall of the housing and the back surface of the substrate are intermittently adhered by an adhesive.

  In one aspect of the illumination light source according to the present invention, the adhesive is formed between the inner wall of the housing and the back surface of the substrate and between the adhesive regions where the adhesive is formed. There may be at least one spatial region that is not used.

  In the aspect of the illumination light source according to the present invention, the space area may be sandwiched between the adhesion areas in the longitudinal direction of the substrate.

  Further, in one aspect of the illumination light source according to the present invention, a plurality of the space regions may exist at an equal pitch between the bonding regions in the longitudinal direction.

  Further, in one aspect of the illumination light source according to the present invention, a pitch at which the adhesion region and the space region are repeated and a weight of the adhesive per the adhesion region are an adhesion portion between the substrate and the adhesive. The shear strength at may be set to be 1.0 MPa or more.

  Further, in one aspect of the illumination light source according to the present invention, in a central portion in a longitudinal direction where a plurality of the light emitting elements are arranged, a surface region of the substrate facing a back surface region of the substrate to which the adhesive is bonded. The light emitting element may be disposed.

  Further, in one aspect of the illumination light source according to the present invention, the circuit component is disposed at a longitudinal end portion where the circuit component for converting electric power from the outside to power supplied to the light emitting element is disposed. The adhesive may be disposed in a back surface region of the substrate facing the front surface region of the substrate.

  Further, in one aspect of the illumination light source according to the present invention, the housing includes glass as a main material, the substrate includes a resin as a main material, and the adhesive is a silicon-based adhesive. Good.

  In the aspect of the illumination light source according to the present invention, the thickness of the substrate may be 1.6 mm or more.

  In the aspect of the illumination light source according to the present invention, the light emitting element may have a junction temperature of 80 ° C. or lower during light emission.

  In addition, an aspect of the lighting device according to the present invention includes any one of the above-described illumination light sources.

  According to the present invention, since the casing and the substrate are intermittently bonded to each other on the surfaces facing each other, the stress applied in the longitudinal direction of the casing can be dispersed. Further, since the substrate and the housing are directly bonded without using a heat sink or the like, the weight can be reduced. Therefore, it is possible to suppress the distortion of the housing and the dropping of the substrate.

1 is a schematic perspective view of a straight tube LED lamp according to the present invention. Sectional drawing which makes the tube-axis direction of the straight tube | pipe type LED lamp 1 which concerns on Embodiment 1 the normal line. Sectional drawing parallel to the pipe-axis direction of the straight tube | pipe type LED lamp which concerns on Embodiment 1 of this invention. Sectional drawing which sets the tube-axis direction of the LED module which concerns on the modification of Embodiment 1 as a normal line. FIG. 6 is an overview perspective view of a lighting device according to Embodiment 2. Sectional drawing which shows an example of the conventional straight tube | pipe type LED lamp. Sectional drawing of the straight tube | pipe type LED lamp cut | disconnected along the A-A 'line | wire of FIG. 6A.

(Knowledge that became the basis of the present invention)
The inventor has found that the following problems occur with respect to the conventional LED lamp described in the “Background Art” section.

  When a resin substrate is used as the LED substrate as in the LED lamp described in Patent Document 1, the entire long casing 520 is warped, and there is a problem that the lamp shape is distorted. Furthermore, when the conventional straight tube LED lamp described in FIG. 6A is mounted on a lighting fixture, the LED module 510 is bonded to the upper inner surface of the housing 520. There is a problem that the LED module 510 is detached from the housing 520 due to its own weight.

  From this viewpoint, it is desirable that the LED module be reduced in weight. However, when priority is given to weight reduction, for example, when a resin substrate is used as in Patent Document 1, stress is generated in the longitudinal direction of the housing due to the difference in linear expansion coefficient between the housing and the substrate. Thereby, a board | substrate peels from a housing | casing or a distortion | strain and curvature generate | occur | produce in a housing | casing. The present inventor applies intermittently rather than applying the adhesive on the adhesive surface of the inner surface of the housing in order to reduce the weight and eliminate the dropping of the substrate and the distortion and warping of the housing. I found out.

  Furthermore, in the LED lamp described in Patent Document 1, a base 550 is used to dissipate heat during LED light emission. However, the present inventor, if considering the amount of heat generated during normal use, defines the junction temperature of the LED to a predetermined value or less, and if the thickness of the substrate on which the LED is disposed is defined to a predetermined value or more, the heat dissipation function is provided. It was found that the shared base 550 is not an essential component. Furthermore, it has been found that the configuration in which the base 550 is not arranged improves the luminous flux.

  In view of the above, the illumination light source according to one embodiment of the present invention includes a straight tube-shaped housing and a long substrate that is disposed in the housing and has a light-emitting element disposed on the surface thereof. The inner wall of the body and the back surface of the substrate are intermittently bonded with an adhesive.

  According to this aspect, since the housing and the substrate are intermittently bonded to each other on the surfaces facing each other, the stress applied in the longitudinal direction of the housing can be dispersed. Further, since the substrate and the housing are directly bonded without using a heat sink or the like, the weight can be reduced. Therefore, it is possible to suppress the distortion of the housing and the dropping of the substrate.

  DESCRIPTION OF EMBODIMENTS Hereinafter, an illumination light source and an illumination device according to embodiments of the present invention will be described with reference to the drawings. Note that each of the embodiments described below shows a preferred specific example of the present invention. Therefore, the numerical values, shapes, materials, components, arrangement positions and connection forms of the components shown in the following embodiments are merely examples, and are not intended to limit the present invention. Therefore, among the constituent elements in the following embodiments, constituent elements that are not described in the independent claims showing the highest concept of the present invention are described as optional constituent elements.

  Each figure is a schematic diagram and is not necessarily illustrated strictly. Moreover, in each figure, the same code | symbol is attached | subjected about the same structural member.

  In the following embodiments, a straight tube LED lamp which is an embodiment of the illumination light source of the present invention and a lighting device using the straight tube LED lamp will be exemplified.

(Embodiment 1)
First, a straight tube LED lamp 1 according to Embodiment 1 of the present invention will be described. In addition, the straight tube | pipe type LED lamp 1 which concerns on this Embodiment is a light source for illumination replaced with the conventional straight tube | pipe type fluorescent lamp.

[Entire configuration of the lamp]
First, the structure of the straight tube | pipe type LED lamp 1 which concerns on Embodiment 1 of this invention is demonstrated using FIG.

  FIG. 1 is a schematic perspective view of a straight tube LED lamp according to the present invention. As shown in FIG. 1, the straight tube LED lamp 1 includes an LED module 10, a long casing 20 in which the LED module 10 is disposed, an adhesive 30, and the longitudinal direction of the casing 20 (tube A power supply base (power supply side base) 40 provided at one end in the axial direction, and a non-power supply base (non-power supply base) 50 provided at the other end in the longitudinal direction of the housing 20. , A lighting light source including a lighting circuit (not shown). In the straight tube LED lamp 1, a long and cylindrical lamp housing (envelope) is configured by the power supply base 40, the non-power supply base 50 and the housing 20. The straight tube type LED lamp 1 is supported by the lighting fixture by attaching the feeding base 40 and the non-feeding base 50 to the socket of the lighting fixture. The straight tube LED lamp 1 is, for example, a 40-shaped straight tube LED lamp, and the total length of the lamp is about 1250 mm.

  In addition, although not shown, a housing 20 is provided with a connector through which power supplied to the LED module 10 is passed, a lighting circuit for causing the LED module 10 to emit light, and the like. Further, the straight tube type LED lamp 1 in the present embodiment adopts a one-side power feeding method in which power is fed to the LED module 10 only from the power feeding base 40. That is, the straight tube LED lamp 1 receives power from a lighting fixture or the like only from the power supply cap 40.

  Hereinafter, each component of the straight tube LED lamp 1 will be described in detail with reference to FIGS. 2 and 3.

  FIG. 2 is a cross-sectional view in which the tube axis direction of the straight tube LED lamp 1 according to the embodiment is a normal line. FIG. 3 is a sectional view parallel to the tube axis direction of the straight tube LED lamp according to the embodiment of the present invention.

[Case]
The casing 20 is a long translucent cover having translucency that covers the LED module 10. As shown in FIG. 1, in the present embodiment, the casing 20 includes a long cylindrical body having openings at both ends. This is a straight tubular outer tube. The housing | casing 20 can be comprised with a transparent resin material or glass.

For example, the casing 20 is made of soda lime glass having silica (SiO ₂ ) of 70 to 72 [%] as a main component, and a glass tube having a thermal conductivity of about 1.0 [W / m · K] is used. be able to. The linear expansion coefficient in the longitudinal direction of the glass tube is, for example, 9 × 10 ⁻⁶ / K (9 ppm / K). Moreover, as the housing | casing 20, the plastic tube comprised from resin materials, such as an acryl or a polycarbonate, can be used, for example.

  The housing 20 may include a light diffusing unit having a light diffusing function for diffusing light from the LED module 10. Thereby, the light emitted from the LED module 10 can be diffused when passing through the housing 20. Examples of the light diffusion portion include a light diffusion sheet or a light diffusion film formed on at least one of the inner surface and the outer surface of the housing 20. Specifically, there is a milky white light diffusion film formed by attaching a resin or white pigment containing a light diffusion material (fine particles) such as silica or calcium carbonate to at least one of the inner surface and the outer surface of the housing 20. . Other light diffusing parts include a lens structure provided in at least one of the inside and the outside of the housing 20 or a concave or convex portion formed in at least one of the inner surface and the outer surface of the housing 20. For example, the case 20 is provided with a light diffusion function (light diffusion unit) by printing a dot pattern on at least one of the inner surface and the outer surface of the housing 20 or by processing a part of the housing 20. You can also. Further, by molding the housing 20 itself using a resin material or the like in which a light diffusing material is dispersed, the housing 20 can be provided with a light diffusion function (light diffusion portion).

[Base]
The power supply base 40 is a base for supplying power to the LED 100. The power supply cap 40 is also a power receiving cap that receives power for lighting the LED 100 from an external power source of the straight tube LED lamp 1.

  As shown in FIGS. 1 and 3, the power supply cap 40 has a bottomed cylindrical shape that covers one of the end portions in the longitudinal direction of the housing 20. The power supply base 40 in this embodiment includes a base body made of a synthetic resin such as polybutylene terephthalate (PBT) and a power supply pin 41 that is a pair of power receiving connection terminals made of a metal material such as brass. The pair of power supply pins 41 are configured to protrude outward from the bottom of the base body. The power supply pin 41 is a pin that supplies power to turn on the LED element, and functions as a power reception pin that receives predetermined power from an external device such as a lighting fixture. For example, by attaching the power supply base 40 to the socket of the lighting fixture, the pair of power supply pins 41 are in a state of receiving power from the power supply device built in the lighting fixture. The power supply pin 41 also functions as a connection terminal for detachably attaching to the socket of the lighting fixture.

  The non-power supply base 50 has a function of attaching the straight tube LED lamp 1 to a lighting fixture in a predetermined region of the LED module 10.

  As shown in FIGS. 1 and 3, the non-power feeding base 50 has a bottomed cylindrical shape that covers the other end in the longitudinal direction of the housing 20. The non-power-feeding base 50 in the present embodiment includes a base body made of a synthetic resin such as PBT and a single non-power-feeding pin 51 made of a metal material such as brass. The non-power feeding pin 51 is configured to protrude outward from the bottom of the base body.

  The non-power supply base 50 may ground (ground) a predetermined region of the LED module 10 via a lighting fixture.

[LED module]
The LED module 10 is a light source module of the straight tube LED lamp 1 and is fixed to the inner wall of the housing 20 via an adhesive 30 in a form covered with the housing 20 as shown in FIGS. ing. Here, as shown in FIG. 3, the substrate 120 on which the LEDs constituting the LED module 10 are arranged is intermittently fixed to the inner wall of the housing 20 with an adhesive.

  As shown in FIG. 3, the LED module 10 is a COB type (Chip On Board) light emitting module that is long in the tube axis direction of the housing 20 and in which the LED chip is directly mounted on the substrate. A substrate 120, a plurality of LEDs (LED chips) 100, and a sealing member 110 that seals the LEDs 100 are provided. In addition, a circuit component 132 (including a connector) for converting external power into power to be supplied to each LED 100 and the circuit component 132 and each LED 100 are electrically connected to the longitudinal end portion of the substrate 120. Metal wiring (not shown) is provided. The circuit component 132 may simply be a connector for supplying external power to each LED 100.

  Each of the plurality of LEDs 100 is an example of a light emitting element, and is directly mounted on the surface of the central portion of the substrate 120 in the longitudinal direction. The plurality of LEDs 100 are arranged in series in a line shape (straight line) along the longitudinal direction of the substrate 120.

  Further, the LED module 10 according to the present embodiment has a structure in which the LEDs 100 mounted on the substrate 120 are collectively sealed by a sealing member 110, as shown in FIG.

  In the present embodiment, an LED that emits blue light and a sealing body (sealing member 110) formed of a translucent material mixed with phosphor particles that convert blue light into yellow light are used. Part of the blue light emitted from the LED is wavelength-converted into yellow light by the sealing body, and white light generated by the color mixture of the unconverted blue light and the converted yellow light is the LED module 10. It is emitted from. As the LED chip that emits blue light, for example, a gallium nitride based semiconductor light emitting element having a central wavelength of 440 nm to 470 nm, which is made of an InGaN based material, can be used.

The board | substrate 120 is a board | substrate for LED mounting for mounting LED100 by which at least the surface was comprised with the insulating material, Comprising: For example, it is a board | substrate of a long rectangular shape. Examples of the substrate 120 include a glass epoxy substrate (CEM-3, FR-4, etc.), a substrate made of paper phenol or paper epoxy (FR-1, etc.), a flexible flexible substrate made of polyimide, etc. It is preferable to contain an inexpensive and lightweight resin as a main component. For example, the linear expansion coefficient in the longitudinal direction of CEM-3 is 24 × 10 ⁻⁶ / K (24 ppm / K). In addition to the resin substrate, a metal base substrate can be used. As the metal base substrate, for example, an aluminum alloy substrate, an iron alloy substrate, or a copper alloy substrate having an insulating film formed on the surface can be used. The front and back surfaces of the substrate 120 are rectangular when viewed in plan.

  The substrate 120 has a longitudinal direction (Y-axis direction) parallel to the longitudinal direction of the straight tubular casing 20, and a lateral direction (X-axis direction) orthogonal to the longitudinal direction is parallel to the lateral direction of the casing 20. It is arrange | positioned at the inner wall of the housing | casing 20 so that it may become.

  The metal wiring (not shown) is an electrode wiring for supplying predetermined power to each of the plurality of LEDs 100 connected in series. In this embodiment, since the one-side power feeding method is adopted, both the high potential side and low potential side metal wirings are extended toward the power feeding base 40. The material constituting the metal wiring is preferably composed of, for example, a metal having high conductivity such as copper, and in addition, a laminated film made of nickel, aluminum, gold, or two or more of them, or An alloy may be used.

[adhesive]
As shown in FIGS. 2 and 3, the adhesive 30 is intermittently disposed between the inner wall of the housing 20 and the back surface of the substrate 120 in order to bond and fix the housing 20 and the LED module 10. The As the adhesive 30, it is preferable to use a material having a thermal conductivity of 1 [W / m · K] or more from the viewpoint of heat dissipation, and from the viewpoint of weight reduction, an adhesive having a specific gravity of 2 or less. Is preferably used. As the adhesive 30, for example, an adhesive made of silicon resin or cement is used. Alternatively, the adhesive 30 may be a double-sided tape having a thickness and a shape that can adhere to the back surface of the substrate 120 and the inner surface of the housing 20. In the present embodiment, an adhesive made of silicon resin is used as the adhesive 30 in order to reduce the weight of the straight tube LED lamp 1.

  In order to increase the thermal conductivity of the adhesive 30, it is preferable to mix inorganic particles in the adhesive 30 as appropriate. As the inorganic particles, metal particles such as silver, copper or aluminum, or non-metal particles such as alumina, aluminum nitride, silicon carbide or graphite are used.

  Here, as shown in FIG. 3, the inner wall of the housing 20 and the back surface of the substrate 120 are bonded intermittently by an adhesive 30. As described above, the linear expansion coefficient (9 ppm / K) when a glass tube is used as the housing 20 and the linear expansion coefficient (24 ppm / K) when CEM-3 is used as the substrate 120 are different. However, as shown in FIG. 3, the housing 20 and the substrate 120 are intermittently bonded to each other on the surfaces facing each other via the adhesive 30 instead of the entire surface. The stress applied in the direction can be dispersed. In other words, since the adhesive 30 is intermittently adhered, the shear stress in the longitudinal direction of the housing 20 can be released in the normal direction (Z direction) of the substrate 120 or the like.

  In addition, as shown in FIG. 3, in the central portion in the longitudinal direction where a plurality of LEDs 100 are arranged, the LEDs 100 are arranged in the surface region of the substrate 120 facing the back surface region of the substrate 120 to which the adhesive 30 is adhered. Preferably it is. With this configuration, the heat generated by the LED 100 serving as a heat generation source during light emission can be efficiently emitted to the housing 20 and the outside thereof at the shortest distance via the substrate 120 and the adhesive 30.

  Furthermore, it is preferable that the adhesive 30 is disposed on the back surface region of the substrate 120 opposite to the surface region of the substrate 120 on which the circuit component 132 is disposed at the end portion in the longitudinal direction where the circuit component 132 is disposed. With this configuration, it is possible to efficiently release the heat generated by the circuit component 132 serving as a heat generation source during power conversion to the housing 20 and the outside thereof at the shortest distance via the end portion of the substrate 120 and the adhesive 30. Become.

  Further, since the substrate 120 and the housing 20 are directly bonded without using a heat sink or the like, the weight can be reduced. Therefore, it becomes possible to suppress the distortion of the housing 20 and the dropping of the LED module 10 including the substrate 120.

  On the other hand, when the housing and the substrate are entirely bonded via the adhesive 30 on the surfaces facing each other, the housing and the substrate according to the difference in the coefficient of linear expansion between the housing and the substrate. Warp or peeling of the substrate occurs. This can be explained by the following principle. For example, in the case of an adhesive made of a silicone resin that is cured at 130 ° C. or higher, first, at the curing temperature, a housing or substrate having a large linear expansion coefficient is relatively stretched in the longitudinal direction. Thereafter, when the adhesive is lowered to room temperature in a cured state, the stretched casing or substrate is contracted in the longitudinal direction. Due to the shrinking operation of the casing or the substrate in the cured state of the adhesive, a stress is generated in the longitudinal direction of the casing and warpage occurs. Furthermore, when a crack is generated between the adhesive and the housing or the substrate, the crack grows and starts to peel off from the location where the crack is generated.

  On the other hand, according to the discontinuous arrangement of the adhesive according to the present embodiment, the stress generated in the longitudinal direction of the casing is dispersed, so that the warpage of the casing can be suppressed. Furthermore, even if the crack occurs in any part, since the adhesive is divided, it is possible to suppress the crack from growing through the adhesive and to prevent peeling.

  In the present embodiment, the space region between the inner wall of the housing 20 and the back surface of the substrate 120 where the adhesive 30 is not formed has the adhesive 30 formed in the longitudinal direction of the substrate 120. There are a plurality of equal pitches between the bonded areas. Thereby, the stress concentration in the joining region is isotropically dispersed, so that the stress in the longitudinal direction of the substrate 120 can be effectively relieved.

  Here, the application weight of the adhesive 30 and the pitch of the adjacent adhesive regions are set such that the shear strength at the bonded portion between the substrate 120 and the adhesive 30 is a predetermined value or more. For example, in the configuration of the straight tube LED lamp 1 according to the present embodiment, the predetermined value of the shear strength is preferably 1.0 MPa. If the shear strength is less than 1.0 MPa, the substrate 120 may be peeled off.

  Hereinafter, the relationship between the coating weight and the pitch and the adhesion state will be described in detail. As the pitch increases, the deflection of the substrate 120 in the Z direction increases, so that the shear stress can be released in directions other than the longitudinal direction. However, on the other hand, the shear strength of the entire substrate 120 is reduced, and if the deflection becomes excessively large, the warpage of the substrate 120 and the housing 20 becomes remarkable. On the other hand, as the pitch becomes smaller, the deflection becomes smaller, so that it becomes difficult to release the shear stress to other than the longitudinal direction. However, the shear strength of the entire substrate 120 is improved.

  Moreover, the shear strength decreases as the coating weight decreases. On the other hand, as the coating weight increases, the LED lamp itself becomes heavier.

  From the above viewpoint, there is an optimum value for the coating weight and the pitch depending on the material configuration of the LED lamp. By setting the coating weight and the pitch to the optimum values, it is possible to prevent the substrate 120 and the casing 20 from warping in the Z-axis direction or peeling of the substrate 120.

  In the housing 20 and the LED module 10 according to the present embodiment, the pitch is, for example, 60 mm (the length of the housing 20 is 1200 mm / 20 adhesive placement points) to 120 mm (the length of the housing 20 is 1200 mm / adhesive). The number of arrangement points is preferably 10). Moreover, it is preferable that the said application | coating weight is 8g (/ adhesive 1 point), for example.

  In order to achieve the above-described effect, a space where the adhesive 30 is not formed between the inner wall of the housing 20 and the back surface of the substrate 120 and between the adhesive regions where the adhesive 30 is formed. It is sufficient that at least one region exists. Due to the presence of the space region, it is possible to disperse the stress concentration in the bonding region between the inner wall of the housing 20 and the back surface of the substrate 120.

  Further, the space region is preferably sandwiched between the bonding regions in the longitudinal direction of the substrate 120. Thereby, the stress in the longitudinal direction of the substrate 120 can be effectively relieved.

  Moreover, in the conventional LED lamp, the base for ensuring heat dissipation is arrange | positioned between the board | substrate with which LED is arrange | positioned, and a housing | casing. For this reason, in the conventional LED lamp, since it is not necessary to increase the heat capacity of the substrate, the thickness of the substrate is typically about 1.0 mm. The optimum values of the pitch and the coating weight are those when the thickness of the substrate 120 is 1.0 mm.

  On the other hand, in the present embodiment, the thickness of the substrate 120 may be any of 0.8 mm, 1.6 mm, and 2.0 mm. In particular, the thickness of the substrate 120 is more preferably 1.6 mm or more. Thereby, for example, even when using a resin substrate (thermal conductivity: about 0.3 W / m · K) that is inexpensive and lightweight, such as CEM-3, but is not excellent in heat dissipation, as the substrate 120, Since heat capacity can be secured, sufficient heat dissipation can be realized without arranging a base.

  Furthermore, by excluding the arrangement of the base, the luminous flux output from the LED module 10 is improved. In addition, a base is defined as what is combined with the said board | substrate after LED is mounted in a board | substrate, or what is joined to a housing | casing separately from the board | substrate with which LED was mounted.

  Furthermore, in the straight tube LED lamp 1 according to the present embodiment, it is preferable to use a junction temperature of 80 ° C. or less when the LED 100 emits light. By operating the straight tube LED lamp 1 under these conditions, it is possible to sufficiently suppress the heat generation from the straight tube LED lamp 1.

  Note that the LED module 10 according to the present embodiment has a configuration in which the base is excluded and the substrate 120 on which the LEDs are arranged and the housing 20 are directly bonded via the adhesive 30. 120 may be a multilayer substrate.

  FIG. 4 is a cross-sectional view with the tube axis direction of the LED module according to the modification of the first embodiment as a normal line. As shown in FIG. 4, the LED module 11 according to this modification includes a substrate body 120 </ b> A, a front surface wiring layer 120 </ b> B, a back conductor layer 120 </ b> C, an LED 100, a sealing member 110, and a reflective sheet 140. Since LED100 and the sealing member 110 are the same structures as the LED module 10 which concerns on Embodiment 1, description is abbreviate | omitted.

  The substrate body 120A, the surface wiring layer 120B, and the back conductor layer 120C constitute a substrate on which the LEDs are arranged, and are multilayer substrates. The substrate body 120A is, for example, a glass epoxy substrate (CEM-3, FR-4, etc.), a substrate made of paper phenol or paper epoxy (FR-1, etc.), a flexible flexible substrate made of polyimide, etc. It is a member mainly composed of an inexpensive and lightweight resin. The front wiring layer 120B and the back conductor layer 120C are metal layers typified by copper, for example. In the surface wiring layer 120 </ b> B, wiring for electrically connecting the LED 100 and an external power source and supplying power to the LED 100 is formed. The back conductor layer 120C functions as a ground layer for grounding the reference potential of the LED module 11, for example.

  The reflection sheet 140 is configured to reflect the light emitted from the LED module 11 in a certain direction in order to improve the light extraction efficiency of the LED 100. The reflection sheet 140 is made of a material having electrical insulation properties and light reflection properties, and can be made by processing an insulation reflection sheet made of, for example, a biaxially stretched polyester (PET) film.

  In the case of the multilayer substrate, the front wiring layer 120B and the back conductor layer 120C are sufficiently thinner than the substrate body 120A, and therefore the linear expansion coefficient of the multilayer substrate itself is substantially equal to the linear expansion coefficient of the substrate body 120A. Therefore, even in the configuration of the multilayer substrate as described above, the casing 20 and the back conductor layer 120C are intermittently bonded to the mutually opposing surfaces via the adhesive 30 instead of the entire surface. The stress applied in the longitudinal direction of the housing 20 can be dispersed. Further, since the multilayer substrate and the housing 20 are directly bonded without using a heat sink or the like, the weight can be reduced. Therefore, it becomes possible to suppress the distortion of the housing 20 and the dropping of the LED module 11 including the multilayer substrate.

  In addition, when the film thickness of the back surface layer and the case is a multilayer substrate having a back surface layer and a substrate body mainly made of resin, the linear expansion coefficient of the back surface layer and the housing is The difference is preferably less than 10 ppm. In this case, the substrate body is made of resin to reduce the weight, and the linear expansion coefficient between the back surface layer and the housing compared to the difference in linear expansion coefficient between the substrate body and the housing. Therefore, the stress in the longitudinal direction of the substrate is relieved, and the application area of the adhesive 30 can be increased.

(Embodiment 2)
Next, the illuminating device 2 which concerns on Embodiment 2 of this invention is demonstrated using FIG.

  FIG. 5 is a schematic perspective view of the lighting apparatus according to Embodiment 2. FIG. As shown in the figure, the lighting device 2 according to the present embodiment is a base light, and includes a straight tube LED lamp 1 and a lighting fixture 200.

  The straight tube LED lamp 1 is the straight tube LED lamp 1 according to Embodiment 1, and is used as an illumination light source of the illumination device 2. In the present embodiment, two straight tube LED lamps 1 are used.

  The lighting fixture 200 includes a pair of sockets 210 that are electrically connected to the straight tube LED lamp 1 and holds the straight tube LED lamp 1, and a fixture body 220 to which the socket 210 is attached. The instrument body 220 can be formed by, for example, pressing an aluminum steel plate. Moreover, the inner surface of the instrument main body 220 is a reflection surface that reflects light emitted from the straight tube LED lamp 1 in a predetermined direction (for example, downward).

  The lighting fixture 200 configured as described above is mounted on a ceiling or the like via a fixture. The lighting fixture 200 may incorporate a circuit for controlling the lighting of the straight tube LED lamp 1 or the like. Further, a cover member may be provided so as to cover the straight tube type LED lamp 1.

(Other)
As described above, the illumination light source and the illumination device according to the present invention have been described based on the first and second embodiments. However, the present invention is not limited to the first and second embodiments.

  In the above embodiment, as the LED module, a COB (Chip On Board) type in which a plurality of LED chips are directly mounted on the substrate 120 and the plurality of LED chips are collectively sealed with a phosphor-containing resin. However, the present invention is not limited to this. An SMD (Surface Mount Device) type LED module using a packaged LED element may be used.

  Further, for example, in the above-described embodiment, a single-side power feeding method that feeds power to all the LEDs in the housing 20 from only one side of the power feeding base 40 is adopted. A double-sided power feeding method such as an L-shaped base (a base having a flat power receiving pin bent in an L shape) may be used. In this case, the power receiving pin on one side and the power receiving pin on the other side may be configured as one pin, or the power receiving pin on one side and the power receiving pin on the other side may be configured to receive power from both sides as a pair of power receiving pins. I do not care. Further, the pair of power reception pins and non-power supply pins are not limited to the rod-shaped metal, and may be configured by a flat metal or the like.

  From the aspect of the power feeding method, in the straight tube LED lamp according to the present invention, for example, the following variations can be cited. That is, one-sided feeding method composed of an L-shaped base on one side and a base having a non-feeding pin on the other side, a two-sided feeding method composed of L-shaped bases on both sides, a one-sided feeding system composed of L-shaped bases on both sides, These include a double-sided power feeding system configured with a G13 base and a one-sided power feeding system configured with a G13 base.

  In addition, the straight tube LED lamp according to the above embodiment is a system that receives DC power from an external power supply, but is a system that receives AC power from an external power supply by incorporating a power supply circuit (converter circuit). There may be.

  In the above embodiment, the LED modules 10 and 11 are configured to emit white light by the blue LED chip and the yellow phosphor, but are not limited thereto. For example, a phosphor-containing resin containing a red phosphor and a green phosphor may be used and combined with this and a blue LED chip to emit white light. Moreover, you may use the LED chip which light-emits colors other than blue, for example, using the ultraviolet LED chip which emits the ultraviolet light which is shorter wavelength than the blue light which a blue LED chip emits, mainly by ultraviolet light You may comprise so that white light may be emitted by the blue phosphor particles, green phosphor particles, and red phosphor particles that are excited to emit blue light, red light, and green light.

  In the above embodiment, the LED is exemplified as the light emitting element. However, a semiconductor light emitting element such as a semiconductor laser, a light emitting element such as an organic EL (Electro Luminescence), or an inorganic EL may be used.

  In addition, it is realized by arbitrarily combining the components and functions in each embodiment without departing from the scope of the present invention, or a form obtained by subjecting each embodiment to various modifications conceived by those skilled in the art. Forms are also included in the present invention.

1,500 Straight tube LED lamp (light source for illumination)
2 Illuminating device 10, 11, 510 LED module 20, 520 Housing 30, 560 Adhesive 40 Feeding base 41 Feeding pin 50 Non-feeding base 51 Non-feeding pin 100 LED (light emitting element)
110, 513 Sealing member 120, 511 Substrate 120A Substrate body 120B Surface wiring layer 120C Back conductor layer 132 Circuit component 140 Reflective sheet 200 Lighting fixture 210 Socket 220 Appliance main body 500 Straight tube LED lamp 512 LED
530, 540 base 550 base

Claims (11)

A straight pipe-shaped housing;
An elongated substrate disposed in the housing and having a light emitting element disposed on a surface thereof;
The illumination light source, wherein the inner wall of the housing and the back surface of the substrate are intermittently adhered by an adhesive. The space area where the adhesive is not formed exists between the inner wall of the housing and the back surface of the substrate between the adhesive areas where the adhesive is formed. The light source for illumination as described in 2. The illumination light source according to claim 2, wherein the spatial region is sandwiched between the adhesion regions in a longitudinal direction of the substrate. The illumination light source according to claim 3, wherein a plurality of the spatial regions are present at an equal pitch between the bonding regions in the longitudinal direction. The pitch at which the bonding region and the space region are repeated and the weight of the adhesive per bonding region are set so that the shear strength at the bonding portion between the substrate and the adhesive is 1.0 MPa or more. The illumination light source according to claim 2. The light emitting element is disposed in a surface region of the substrate facing a back surface region of the substrate to which the adhesive is bonded in a central portion in a longitudinal direction where the plurality of light emitting elements are disposed. The light source for illumination according to any one of 5. In the longitudinal direction end portion where the circuit component for converting the electric power from the outside to the power supplied to the light emitting element is disposed, the back surface region of the substrate facing the surface region of the substrate where the circuit component is disposed The illumination light source according to claim 6, wherein the adhesive is disposed. The housing includes glass as a main material,
The substrate includes a resin as a main material,
The illumination light source according to claim 1, wherein the adhesive is a silicon-based adhesive. The illumination light source according to claim 1, wherein the substrate has a thickness of 1.6 mm or more. The illumination light source according to claim 1, wherein the light emitting element has a junction temperature of 80 ° C. or lower during light emission. An illumination device comprising the illumination light source according to any one of claims 1 to 10.

Images