JP2015030020A - Soldering iron and soldering iron system - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a soldering iron with a miniaturized iron tip, capable of applying a voltage necessary for soldering only during a soldering work with a steep temperature rise, and to provide a soldering iron system.SOLUTION: A soldering iron has a heater to which a prescribed voltage is applied through a lead wire only during a soldering work, a heater rod comprising silicon having the built-in heater on a tip part, and an iron tip having a hollow base part, for covering the tip part of the heater rod.

Description

  The present invention relates to a soldering iron and a soldering iron system.

In recent years, with the development of electronic devices, various soldering irons used for soldering printed wiring and the like have been developed (for example, see Patent Document 1).
The invention described in Patent Document 1 relates to a “soldering apparatus”. Specifically, in a soldering system including a soldering iron and a soldering department, the use of the soldering system is detected, or soldering is performed. It is disclosed that a plurality of touch-sensitive buttons are provided that can set a plurality of operation parameters of different attachment systems.

JP2011-245555A

By the way, in Patent Document 1 described above, a voltage is applied to a soldering iron when a worker's hand in the factory touches the soldering iron touch sensor. Depending on the grip strength of the person and the dryness of the hand, it may not turn on, and there is concern about the stability of the operation. Patent Document 1 does not disclose the time from when the touch sensor is turned on until the tip rises to a temperature required for soldering.
Furthermore, in the factory, when soldering electronic components to the printed circuit board manually or soldering the lead wires to the motor manually, there are thousands of soldering operations per day. The tip of the iron is very worn and may be replaced in 3-4 days. At present, the tip of the tip is about 50-60mm in length, but in reality, only the tip of about 5mm is used, but the base 45-55mm is not used. They are discarded without damage and waste resources. Patent Document 1 does not disclose anything about this point.

  Accordingly, an object of the present invention is to provide a soldering iron and a soldering iron system in which the temperature rise is steep and a voltage necessary for soldering can be reliably applied only at the time of soldering, and the tip of the soldering iron is miniaturized. There is.

  In order to solve the above-mentioned problems, the first invention is a heater to which a predetermined voltage is applied via a lead wire only during a soldering operation, a heater rod made of silicon with the heater built in the tip, and the heater The tip of the rod is covered, and a base is provided with a hollow tip.

  The second invention covers a heater to which a predetermined voltage is applied via a lead wire only during a soldering operation, a heater rod made of silicon with the heater built in the tip, and the tip of the heater rod. A soldering iron having a hollow iron tip at the base, a cradle for receiving the soldering iron, and a detecting means provided on the cradle for detecting whether the soldering iron is on the cradle And a controller having control means for controlling to apply a predetermined voltage to the soldering iron when the soldering iron is not detected by the detecting means.

  According to the present invention, it is possible to provide a soldering iron and a soldering iron system capable of applying a voltage necessary for soldering only at the time of soldering work with a sharp rise in temperature.

It is the external appearance perspective view seen from the cradle side in the soldering iron system concerning one embodiment. 1 is an external perspective view of a soldering iron system according to an embodiment from a controller side. It is an external appearance perspective view of the soldering iron shown in FIG. FIG. 4 is an arrow view in the direction of arrow P1 in FIG. 3. (A) is an external view of the vicinity of the heat generating part used in the soldering iron 200 shown in FIG. 4, (b) is a cross-sectional view of (a), and (c) is Vc− of (a). It is a Vc line expanded sectional view, (d) is the Vd-Vd line expanded sectional view of (a). It is an external appearance perspective view of the iron tip shown in FIG. (A) is an arrow view of the iron tip in the direction of arrow P2 shown in FIG. 6, and (b) is a side view of a conventional iron tip. It is an example of the block diagram of the soldering iron system shown in FIG. It is an example of the flowchart for demonstrating operation | movement of the soldering iron system shown in FIG. It is a figure which shows the temperature change of the iron tip in the conventional soldering iron system and the soldering iron system of this application.

Embodiments will be described with reference to the drawings.
[Constitution]
(Soldering iron system)
FIG. 1 is an external perspective view of a soldering iron system according to an embodiment viewed from a cradle side. FIG. 2 is an external perspective view of the soldering iron system shown in FIG. 1 as viewed from the controller side. Incidentally, the power cord on the controller side is omitted.
The soldering iron system 100 includes a soldering iron 200 and a controller 300.
The soldering iron 100 is placed on a cradle 301 integrated with the controller 300. The cradle 300 is provided with a detachable tip cleaner 302.
Although the power cord 201 of the soldering iron 100 is directly connected to the controller 300, the present invention is not limited to this and may be configured to be connected by a connector.
The front panel of the controller 300 has a display element 303 for displaying the temperature of the iron tip, various display LEDs (light-emitting diodes) 304, a power switch 305, a temperature measurement switch 306, a temperature setting switch 308, and a fuse 307. Has been placed.
As the display element 303, for example, a liquid crystal display element is used.
The various display LEDs 304 are used as, for example, a power lamp, an OK lamp, an alarm lamp, and a standby lamp.
The power switch 305 is a switch for turning on and off a low voltage (for example, 80 V to 120 V) AC power from an AC (alternating current) power source (not shown) .For example, a snap switch is used, but a push switch may be used. Good.
The fuse 307 is a component for preventing damage caused by an excessive current flowing through the controller 300 when the soldering iron 200 is short-circuited, for example.
The temperature setting switch 308 is a switch for setting the tip temperature to, for example, any one of 350 ° C., 400 ° C., and 450 ° C. For example, a rotary switch is used, but a slide switch, a push switch, Alternatively, a touch panel may be used.

(Soldering Iron)
FIG. 3 is an external perspective view of the soldering iron shown in FIG. FIG. 4 is a view in the direction of the arrow P1 in FIG. 5A is an external view of the vicinity of the heat generating part used in the soldering iron 200 shown in FIG. 4, FIG. 5B is a cross-sectional view of FIG. 5A, and FIG. These are the Vc-Vc line expanded sectional views of Drawing 5 (a), and Drawing 5 (d) is the Vd-Vd line expanded sectional view of Drawing 5 (a). 6 is an external perspective view of the iron tip shown in FIG. 4, FIG. 7 (a) is an arrow view of the iron tip in the direction of arrow P2 shown in FIG. 6, and FIG. It is a side view of the conventional iron tip.

The soldering iron 200 includes a cord part 201, a gripping part 202, a heat generating part 205a, a holding part 203, and a soldering tip 204.
The code part 201 has wiring to the heater 220 (see FIG. 5) and the temperature detection means 206 of the heat generating part 205a.
The gripper 202 is a cylindrical member that is gripped by an operator, and for example, heat resistant plastic is used.
The holding portion 203 is attached to one end (left end in FIG. 4) of lead wires 210 and 211 to which a predetermined voltage is applied only at the time of soldering work, and a rod-shaped heater rod 205 made of silicon with a heater 220 built in the tip portion. And a temperature detecting means 206 for controlling the temperature of the tip 204 near the other end (in this case, near the right end) as the tip of the heater rod 205.
Examples of the temperature detection means 206 include a thermocouple, but the present invention is not limited to this, and a sheath resistance thermometer may be used. A thermocouple as the temperature detecting means 206 is attached almost along the longitudinal direction of the heater rod 205. Since the thermocouple is in line contact with the heater rod 205, a temperature change can be detected accurately and efficiently. The vicinity of the tip portion of the thermocouple is held by a temperature detecting means holding ring 206a made of metal, and the tip is pressed by a tapered portion in the fringe 204c of the base portion 204a of the tip 204.
The heat generated in the heater 220 is conducted from the heat generating portion 205a of the heater rod 205 to the iron tip 205 and is conducted to the temperature detecting means 206 to detect the temperature (see FIG. 4).

  The heater rod 205 shown in FIG. 5 is made of, for example, a plate-like body made of two silicons having a length La (for example, 45 mm), a length D / 2, and a width D (for example, D = 5 mm), which are nickel wires 210a and 211a. The laminated body obtained by pressing so as to sandwich the heater 220 connected to each other and processed into a cylindrical shape with a diameter D (or may be a prismatic shape). That is, the heater 220 is built in the tip of the heater rod 205. The nickel wire 210a is exposed from one end of the heater rod 205 (the left end in FIG. 5B) and connected to the lead wire 210, and the nickel wire 210b is exposed from a through hole formed near one end of the heater rod 205 and lead wire. Connected to 211. The lead wire 210 and the lead wire 211 are wound with a predetermined gap Lb (for example, 3.5 mm). The heater 220 is made of, for example, tungsten, and generates heat when a predetermined voltage (for example, 0 V to 35 V: variable for temperature control) is applied to the heater 220 via the lead wires 207, 210, 210a, and 211a. The lead wires 210 and 211 are connected to the controller 300 by connectors 208 and 213 and other lead wires 207 and 212, respectively. Reference numeral 209 denotes a heat-shrinkable tube that prevents the lead wire 210 and the thermocouple from coming off and prevents the lead wires 210 and 211 from short-circuiting.

  The iron tip 204 has a base portion 204a formed in a cylindrical shape having a flange, and a tip end portion 204b integrated with the base portion 204a. The shape of the distal end portion 204a is substantially conical in the drawing, but the present invention is not limited to this, and may be a knife shape, a minus driver shape, or the like.

(controller)
FIG. 8 is an example of a block diagram of the soldering iron system shown in FIG.
The soldering iron 200 of the soldering iron system 100 is indicated by a solid line during standby, and is indicated by a broken line moved in the direction of arrow P3 during use. No voltage is applied to the heater 220 of the soldering iron 200 during standby, and a voltage is applied to the heater 220 during use. The temperature detection means 206 can detect the temperature regardless of whether the soldering iron 100 is used or in standby.

The controller 300 includes a soldering iron power supply unit 300-1, a circuit power supply unit 300-2, a control unit 300-3, and a display unit 300-4.
The soldering iron power supply unit 300-1 includes a diode bridge DB1 to which an AC power supply (for example, 80V to 120V) is applied via the switch 305 and the fuse 307 and performs full-wave rectification. The output of the diode bridge DB1 is connected to a smoothing circuit including electrolytic capacitors C1 and C2, a resistor R1, and a choke transformer L1. The Zener diode D1 is a voltage control diode, and the diode D2 is a backflow prevention diode.
Between the other end of the resistor R1 and the other end of the choke transformer L1, a drain and a source of a power MOSFET (metal-oxide semiconductor field-effect transistor) Tr1 functioning as a switching element are connected, and between the drain and the source A protection diode D3 is connected.

  Each circuit power supply unit 200-2 includes a diode D5 having an anode connected to an AC power supply and a cathode connected to an input terminal of a three-terminal regulator RG1 and a capacitor C3. The output terminal of the three-terminal regulator RG1 is connected to the capacitor C4 and each circuit.

The control unit 300-3 mainly includes integrated circuits IC1 and IC2, a power MOSFET Tr1, an LED 304 for displaying a diode D4, a temperature setting switch 308, a photosensor PS1, and a crystal oscillator XT1.
An integrated circuit IC (integrated circuit) 1 is a microcontroller that performs overall control of a soldering iron system. For example, a PIC (peripheral interface controller: registered trademark) microcomputer is used. A PIC microcomputer is an electronic device in which CPU (central processing unit), RAM (random-access memory), ROM (read-only memory), etc., I / O (input / output), etc. are contained in one chip. . A control program is stored in the ROM of the integrated circuit IC1.

  In the integrated circuit IC1, the gate of the power MOSFET Tr1 for switching control of the voltage applied to the soldering iron 200 of the power supply unit 300-1 for the soldering iron is controlled via an inverter composed of bipolar transistors Tr2 and Tr3 and a resistor R4. A signal is applied.

  The integrated circuit IC2 is an element having a function of amplifying a detection signal from a thermocouple as the temperature detecting means 206 of the soldering iron 200. The detection signal amplified by the integrated circuit IC2 is input to the integrated circuit IC1.

  Among D6 to D9 indicating light emitting diodes constituting the LED 304 for display, D6 is a power lamp that lights up when the power is turned on, D7 is an OK lamp that notifies that the temperature of the soldering iron 100 can be used, D8 is an alarm lamp for notifying the occurrence of an abnormality, D9 is a standby lamp for displaying that the soldering iron 100 is placed on the cradle 301 and can be used when it is removed from the cradle 301. Correspond. D6 to D9 are lit according to the operating state of the soldering iron system 100.

  The movable piece of the temperature setting switch 308 is grounded, and each fixed piece is pulled up by a resistor (not shown). When each fixed piece is connected to the integrated circuit IC1 and comes into contact with the movable piece, the logic value “1” is changed to “ Generates a signal of “0” logic level.

The diode D4 is a circuit for detecting resistors R2 and R3, and the capacitor C5 is a voltage after full-wave rectification.
The photosensor PS1 is a sensor that is disposed in the vicinity of the cradle 301 shown in FIG. 1 and detects whether or not the tip 204 of the soldering iron 200 is placed on the cradle 301, and irradiates the detection target with light. Is a transmission type sensor having a phototransistor that receives irradiation light from a detection target and outputs a detection signal, but the present invention is not limited to this, and a reflection type photosensor is provided. It may be used. In this case, the photosensor detects whether or not the reflected light from the tip 204 is incident on the phototransistor.
A laser diode may be used instead of the light emitting diode, and a photodiode may be used instead of the phototransistor. R5 is a pull-up resistor, and R6 is a pull-down resistor.

  The crystal oscillator XT1 is an element for generating a clock signal, and the capacitors C6 and C7 constitute a part of the Colpitts oscillation circuit.

  The display unit 300-4 includes 7-segment display elements SGM1 to SGM3 and drivers Dr1 to Dr3 that drive the display elements SGM1 to SGM3. The display unit 300-4 is connected to the integrated circuit IC1 by a bus line.

<Operation>
FIG. 9 is an example of a flowchart for explaining the operation of the soldering iron system shown in FIG.
The subject of operation is a CPU.
First, when the power switch 305 is turned on (step S1), the CPU reads the set temperature of the iron tip 204 from the state of the temperature setting switch 308 (step S2).
The CPU determines whether or not the tip 204 of the soldering iron 100 is at a predetermined position on the cradle 301 based on the detection signal from the photosensor PS1. That is, when there is a detection signal, the tip 204 is in a predetermined position on the cradle 301, and when there is no detection signal, the tip 204 is not on the cradle 301 and soldering has started or soldering has been started. (Step S3).
When it is determined that the iron tip 204 is not on the cradle 301 (step S3 / NO), the CPU supplies power to the heater 220. As a method for supplying power, there is a method in which a pulse voltage is applied to the heater 220 until the temperature of the tip 204 reaches a predetermined temperature (for example, a pulse width of 20 μsec is applied) (step S4).
The CPU determines whether or not the temperature of the iron tip 204 is equal to or higher than the set temperature based on a detection signal from a thermocouple serving as the temperature detection means 206 (step S5).
When the CPU determines that the temperature of the iron tip 204 is equal to or higher than the set temperature (step S5 / YES), the CPU stops power supply to the heat generating unit 205 (step S8) and determines whether or not the temperature is lower than the set temperature (step S8). Step S9).
When the CPU determines that the temperature of the tip 204 has decreased below the set temperature (step S9 / YES), the CPU supplies power to the heater 220 (step S6).

The CPU determines whether or not the temperature of the iron tip 204 has exceeded the set temperature (step S7). If the CPU determines that the temperature of the iron tip 204 does not exceed the set temperature (step S7 / NO), the CPU proceeds to step S6. If it is determined that the set temperature has been exceeded, the process proceeds to step S8.
When the CPU determines that the temperature of the iron tip 204 is not lower than the set temperature (step S9 / NO), the CPU determines whether or not the iron tip 204 is in the cradle 301 (step S10). Is determined not to be in the cradle 301 (step S10 / NO), the process returns to step S9, and if it is determined that the iron tip 204 is in the cradle 301 (step S10 / YES), whether or not the power switch 305 is off (Step S11), and when it is determined that the power switch 305 is not OFF (step S11 / NO), the process returns to step S5.
When the power switch is off (step S11 / YES), the power supply to the heater 220 is stopped and finished (step S12).
When the tip 204 is on the cradle 301 in step S3, the process proceeds to step S11.

<Effect>
As described above, according to the present embodiment, a heater to which a predetermined voltage is applied via a lead wire only at the time of soldering work, a heater rod made of silicon with a heater built in the tip, and the tip of the heater rod A soldering iron having a hollow iron tip with a base portion, a cradle for receiving the soldering iron, a detecting means provided on the cradle for detecting whether the soldering iron is on the cradle, and And a controller having a control means for controlling so that a predetermined voltage is applied to the soldering iron when the soldering iron is not detected by the detection means, so that the temperature rise is steep and soldering is performed only during the soldering operation. It is possible to provide a soldering iron and a soldering iron system capable of applying a necessary voltage.

  As shown in FIGS. 7A and 7B, the size of the tip 204 has been reduced to about one-fifth compared to the conventional tip 2040.

FIG. 10 is a diagram showing a temperature change of a soldering tip in the conventional soldering iron system and the soldering iron system of the present application.
In the figure, the horizontal axis indicates time, and the vertical axis indicates the temperature of the tip. A solid line L1 indicates a temperature change in the soldering iron system of the present embodiment, and a broken line L2 indicates a temperature change in the conventional soldering iron system.
The figure shows that the temperature after the start of soldering in the soldering iron system of this embodiment reaches a steep temperature rise of 450 ° C. or more in about 4 seconds, whereas the conventional soldering iron system has a 350 ° C. It can be seen that it takes 36 seconds to reach.
Therefore, according to the present embodiment, it is possible to reduce the size of the tip and reduce the power consumption.

  The above-described embodiment shows an example of a preferred embodiment of the present invention, and the present invention is not limited thereto, and various modifications can be made without departing from the scope of the invention. is there.

DESCRIPTION OF SYMBOLS 100 Soldering iron system 200 Soldering iron 201 Power supply cord 202 Grasp part 203 Holding part 204 Iron tip 204a Base part 204b Tip part 204c Fringe 205 Heater rod 205a Heating part 206 Temperature detection means 206a Temperature detection means holding ring 207, 210, 211, 212 Lead Wire 208, 213 Connector 209 Heat shrinkable tube 210a, 211a Nickel wire 220 Heater 300 Controller 300-1 Soldering iron power supply unit 300-2 Circuit power supply unit 300-3 Control unit 300-4 Display unit 301 Receiving base 302 Tip Cleaner 303 Display element 304 LED
305 Power switch 306 Temperature measurement switch 307 Fuse 308 Temperature setting switch

In order to solve the above problems, the first invention is to press a heater to which a predetermined voltage is applied via a lead wire only during a soldering operation and a plate-like body made of two silicon at the tip. and heat Taroddo for built-bonded Te, covering the tip portion of the heater rod, characterized in that the base is provided with a hollow tip, a.

According to a second aspect of the present invention, a heater to which a predetermined voltage is applied via a lead wire only at the time of soldering work and the heater is built by pressing and bonding two silicon plate bodies to the tip portion. and heat Taroddo of covering the distal end portion of the heater rod, and the base is hollow tip, a soldering iron having a cradle for receiving the soldering iron, is provided in the cradle, the soldering iron is the Detection means for detecting whether or not the cradle is present, and a controller having control means for controlling to apply a predetermined voltage to the solder iron when the detection means does not detect the solder iron. It is characterized by having.

Claims (5)

A heater to which a predetermined voltage is applied via a lead wire only during a soldering operation;
A heater rod made of silicon with the heater built in the tip, and
Covering the tip of the heater rod, the base is a hollow tip,
Soldering iron characterized by comprising   2. The soldering iron according to claim 1, wherein a temperature detecting means for controlling the temperature of the tip of the iron tip is provided in the vicinity of the heater of the heater rod. A heater to which a predetermined voltage is applied via a lead wire only at the time of soldering work, a heater rod made of silicon with the heater built in the tip, and the tip of the heater rod are covered and the base is hollow A soldering iron having a soldering tip,
A receiving base for receiving the soldering iron, a detecting means provided on the receiving base for detecting whether the soldering iron is in the receiving base, and the soldering iron when the detecting means does not detect the soldering iron A controller having control means for controlling to apply a predetermined voltage to the iron;
Soldering iron system characterized by comprising A temperature detecting means for detecting the temperature of the tip of the iron tip in the vicinity of the heater of the heater rod;
4. The solder iron system according to claim 3, wherein the control means controls a voltage applied to the heater based on a detection signal from the temperature detection means.   4. The solder iron system according to claim 3, wherein the cradle is integrated with the controller.

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