JP2015026862A - Heating module and bonding device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To solve the problem that recently in tendency of enlargement in a diameter of a wafer, it becomes difficult uniform heating over each entire surface of the wafers to be overlapped.SOLUTION: A heating module for heating a wafer includes: a stage portion having a placing surface for placing a work to be heated; and a plurality of heater plates disposed on a surface to be heated which is opposite to the placing surface of the stage portion. The plurality of heater plates are disposed so as to cover at least a region, corresponding to the placing surface and be separated so that adjacent sides are parallel to each other.

Description

  The present invention relates to a heating module.

  One technique for improving the effective mounting density of semiconductor devices is a three-dimensional structure in which a plurality of semiconductor chips are stacked. In particular, a semiconductor chip manufactured by a procedure of laminating a plurality of wafers in the state of a wafer as a semiconductor substrate and joining them into individual pieces has recently attracted attention because of its high productivity. When two wafers are overlapped and joined, the electrodes are brought into contact with each other and heated and pressurized (see, for example, Patent Document 1).

JP 2005-302858 A

  In recent years, when the diameter of the wafer tends to increase, it has become difficult to uniformly heat the entire wafer surface. When distribution occurs in the temperature applied to the wafer, the bonding conditions differ for each circuit region, and in some regions, contact failure occurs due to insufficient temperature. In particular, when the heating unit is deformed, the heat transfer path to the wafer is biased, and the temperature distribution becomes significant.

  In order to solve the above-described problem, the heating module according to the first aspect of the present invention includes a stage unit having a mounting surface on which a heated body is mounted, and a heated surface opposite to the mounting surface of the stage unit. And a plurality of heater plates, which cover at least a region corresponding to the placement surface, and are disposed so that adjacent sides are kept parallel to each other.

  It should be noted that the above summary of the invention does not enumerate all the necessary features of the present invention. In addition, a sub-combination of these feature groups can also be an invention.

It is a top view which shows typically the whole structure of a bonding apparatus. It is a perspective view which shows a mode that the substrate holder was looked down from upper direction. It is a perspective view which shows a mode that the substrate holder was looked up from the downward direction. It is a front view which shows typically the whole structure of a pressurization apparatus. It is sectional drawing which shows the structure of a lower pressurization module roughly. It is a top view of the lower heat module which shows the shape and arrangement | positioning of a heater plate. It is a top view of the lower heat module which shows the positional relationship of a heater plate, a flame | frame, and a support | pillar part. It is the upper side figure and front view of a load cell. It is sectional drawing explaining the wiring of an electric heater. It is sectional drawing which shows the structure of a raising / lowering module roughly. It is sectional drawing which shows a mode that the volume of the lower subroom was increased and the main piston was raised.

  Hereinafter, the present invention will be described through embodiments of the invention, but the following embodiments do not limit the invention according to the claims. In addition, not all the combinations of features described in the embodiments are essential for the solving means of the invention.

  FIG. 1 is a plan view schematically showing the overall structure of the bonding apparatus 100 including the pressing apparatus 240. The bonding apparatus 100 includes an air environment unit 102 and a vacuum environment unit 202 formed inside a common housing 101.

  The atmospheric environment unit 102 has a plurality of substrate cassettes 111, 112, 113 and a control panel 120 facing the outside of the housing 101. Each element of each device included in the bonding apparatus 100 is obtained by performing integrated control and cooperative control by a control panel 120 that controls the entire bonding apparatus 100 or a control operation unit provided for each element. Operate. In addition, the control panel 120 has an operation unit that is operated by the user from the outside when the bonding apparatus 100 is turned on and various settings are made. Furthermore, the control panel 120 may include a connection unit that connects to other deployed devices.

  The substrate cassettes 111, 112, and 113 accommodate the substrate 180 bonded in the bonding apparatus 100 or the substrate 180 bonded in the bonding apparatus 100. The substrate cassettes 111, 112, and 113 are detachably attached to the housing 101. As a result, a plurality of substrates 180 can be loaded into the bonding apparatus 100 at once. Further, the substrates 180 bonded in the bonding apparatus 100 can be collected together.

  The atmospheric environment unit 102 includes a pre-aligner 130, a temporary bonding apparatus 140, a substrate holder rack 150 and a substrate removal unit 160, and a pair of robot arms 171 and 172, which are disposed inside the housing 101. The inside of the housing 101 is temperature-managed so that substantially the same temperature as the room temperature of the environment where the bonding apparatus 100 is installed is maintained. Thereby, since the precision of the temporary joining apparatus 140 is stabilized, positioning can be performed accurately.

  The temporary bonding apparatus 140 is an apparatus that accurately aligns two opposing substrates 180 and superimposes them on each other, so that the adjustment range is very narrow. Therefore, prior to loading into the temporary bonding apparatus 140, the prealigner 130 approximately grasps the positions of the individual substrates 180 so that the positions of the substrates 180 are within the adjustment range of the temporary bonding apparatus 140. The temporary joining device 140 is loaded into the robot arm 172 while adjusting the direction based on the position roughly grasped by the pre-aligner 130. Thereby, the positioning in the temporary joining apparatus 140 can be ensured.

  The substrate holder rack 150 accommodates a plurality of substrate holders 190 and makes them stand by. The substrate holder 190 holds the substrate 180 by electrostatic adsorption, and a specific configuration will be described later.

  The temporary bonding apparatus 140 includes a fixed stage 141, a moving stage 142, and an interferometer 144. Further, a heat insulating wall 145 and a shutter 146 are provided so as to surround the temporary joining device 140. The space surrounded by the heat insulating wall 145 and the shutter 146 is communicated with an air conditioner or the like, and the temperature is controlled, so that the alignment accuracy in the temporary bonding apparatus 140 is maintained.

  In the temporary bonding apparatus 140, the moving stage 142 carries the substrate 180 or the substrate holder 190 that holds the substrate 180. In contrast, the fixed stage 141 holds the substrate holder 190 and the substrate 180 in a fixed state.

  The substrate removing unit 160 takes out the substrate 180 sandwiched and bonded by the substrate holder 190 from the substrate holder 190 carried out from the pressurizer 240 described later. The substrate 180 taken out from the substrate holder 190 is returned to and stored in the substrate cassette 113 by the robot arms 172 and 171 and the moving stage 142. The substrate holder 190 from which the substrate 180 has been taken out is returned to the substrate holder rack 150 and waits.

  The substrate 180 loaded in the bonding apparatus 100 is a single silicon wafer, compound semiconductor wafer, or the like on which a plurality of circuit patterns are already formed periodically. In addition, the loaded substrate 180 may be a laminated substrate that is already formed by laminating a plurality of wafers.

  Of the pair of robot arms 171, 172, the robot arm 171 disposed on the side closer to the substrate cassettes 111, 112, 113 moves the substrate 180 between the substrate cassettes 111, 112, 113, the pre-aligner 130, and the temporary bonding apparatus 140. Transport. The robot arm 171 also has a function of turning over one of the substrates 180 to be joined. Accordingly, the surfaces of the substrate 180 on which circuits, elements, terminals, and the like are formed can be opposed to each other.

  On the other hand, the robot arm 172 disposed on the side far from the substrate cassettes 111, 112, 113 is a substrate 180 between the temporary bonding apparatus 140, the substrate holder rack 150, the substrate removing unit 160, the substrate holder rack 150, and the air lock chamber 220. And the substrate holder 190 is conveyed. The robot arm 172 is also responsible for loading and unloading the substrate holder 190 with respect to the substrate holder rack 150.

  The vacuum environment unit 202 includes a heat insulating wall 210, an air lock chamber 220, a robot arm 230, and a plurality of pressure devices 240. The heat insulating wall 210 surrounds the vacuum environment unit 202 to maintain a high internal temperature of the vacuum environment unit 202 and to block heat radiation to the outside of the vacuum environment unit 202. Thereby, the influence which the heat of the vacuum environment part 202 has on the atmospheric environment part 102 can be suppressed.

  The robot arm 230 conveys the substrate 180 and the substrate holder 190 between any one of the pressurizing devices 240 and the air lock chamber 220. The air lock chamber 220 includes shutters 222 and 224 that open and close alternately on the atmosphere environment unit 102 side and the vacuum environment unit 202 side.

  When the substrate 180 and the substrate holder 190 are carried into the vacuum environment unit 202 from the atmospheric environment unit 102, first, the shutter 222 on the atmospheric environment unit 102 side is opened, and the robot arm 172 moves the substrate 180 and the substrate holder 190 to the air lock chamber. Carry into 220. Next, the shutter 222 on the atmosphere environment unit 102 side is closed, and the shutter 224 on the vacuum environment unit 202 side is opened.

  The air lock chamber 220 is provided with a heater 221, and the substrate 180 and the substrate holder 190 to be loaded are preheated by the heater 221 before being pressurized and heated by the pressure device 240. That is, by using the time for exchanging the atmosphere in the air lock chamber 220, the substrate 180 and the substrate holder 190 are heated to some extent before being carried into the pressurizing device 240, thereby improving the throughput of the pressurizing device 240. Note that heating in the air lock chamber 220 is preferably performed before the substrate 180 and the substrate holder 190 are carried into the air lock chamber 220. Thereby, the time for the substrate 180 and the substrate holder 190 to stay in the air lock chamber 220 can be shortened.

  Subsequently, the robot arm 230 unloads the substrate 180 and the substrate holder 190 from the air lock chamber 220 and loads them into one of the pressurizing devices 240. The pressurizing device 240 presses hot the substrate 180 carried into the pressurizing device 240 while being sandwiched between the substrate holders 190. Thereby, the substrate 180 is permanently bonded. Specific processing and configuration will be described later.

  The pressurizing apparatus 240 includes a main body that pressurizes the substrate 180 and the substrate holder 190 and a pressurization chamber in which the main body is disposed. The robot arm 230 is installed in the robot arm chamber. That is, the plurality of pressurizing chambers, robot arm chambers, and air lock chambers 220 constituting the vacuum environment unit 202 are individually partitioned and the atmosphere can be adjusted separately. As shown in the figure, the vacuum environment unit 202 includes a plurality of pressurization chambers and an air lock chamber 220 arranged in the circumferential direction with the robot arm chamber as the center.

  When the substrate 180 and the substrate holder 190 are carried out from the vacuum environment unit 202 to the atmospheric environment unit 102, the above series of operations are executed in reverse order. Through a series of these operations, the substrate 180 and the substrate holder 190 can be carried into or out of the vacuum environment unit 202 without leaking the internal atmosphere of the vacuum environment unit 202 to the atmosphere environment unit 102 side.

  One of the plurality of pressurizing devices 240 can be replaced with a cooling device. At this time, the cooling chamber in which the cooling device is installed is also arranged around the robot arm chamber. The cooling device is loaded with the substrate 180 and the substrate holder 190 heated by the pressurizing device 240, and plays a role of cooling them to a certain temperature. The cooling device preferably cools the cooling chamber in advance before the heated substrate 180 and substrate holder 190 are carried in.

  Here, the flow until the two substrates 180 are overlapped and integrated will be briefly described. When the bonding apparatus 100 starts operating, the robot arm 171 carries the substrates 180 one by one into the pre-aligner 130 and pre-aligns them. At this time, first, pre-alignment is performed from the substrate 180 whose bonding surface faces downward. In parallel with the pre-alignment, the robot arm 172 takes out the substrate holder 190 stored with the surface holding the substrate 180 facing downward from the substrate holder rack 150, and transports it to the fixed stage 141 with the mounting surface facing downward. . The fixing stage 141 fixes the substrate holder 190 that has been transported by vacuum suction. Note that the fixed stage 141 is positioned above the moving stage 142.

  Thereafter, the robot arm 171 takes out the pre-aligned substrate 180 from the pre-aligner, and temporarily places it on a plurality of push-up pins protruding from the moving stage 142 with a reversing mechanism in the middle of conveyance and with the joint surface facing downward. To do. The substrate 180 temporarily placed on the push-up pin is lifted to the fixed stage 141 side by the push-up pin and pressed against the mounting surface of the substrate holder 190 that is already fixed to the fixed stage 141. The substrate holder 190 is supplied with electric power from the fixed stage 141 and electrostatically adsorbs and fixes the substrate 180.

  Next, the substrate 180 with the bonding surface facing upward is pre-aligned. In parallel with this, the robot arm 172 takes out the substrate holder 190 whose surface holding the substrate 180 is upward from the substrate holder rack 150 and conveys it to the moving stage 142 whose mounting surface is upward. The moving stage 142 fixes the transported substrate holder 190 by vacuum suction. Note that when the substrate holder 190 whose surface holding the substrate 180 is upward is transported to the moving stage 142, the push-up pin is retracted from the stage surface of the moving stage 142.

  Thereafter, the robot arm 171 takes out the pre-aligned substrate 180 from the pre-aligner and places it on the mounting surface of the substrate holder 190 that is already fixed to the moving stage 142. The substrate holder 190 is supplied with electric power from the moving stage 142 and electrostatically attracts and fixes the substrate 180. In this way, the substrate holder 190 and the substrate 180 are fixed to the respective stages so that their joint surfaces face each other.

  When the bonding surfaces are fixed so as to face each other, the moving stage 142 is moved precisely while monitoring the position by the interferometer 144, and the bonding surface of the substrate 180 placed is held on the fixed stage 141. Alignment is performed with respect to the bonded surface of the substrate 180 formed. When the alignment is completed, the moving stage 142 is moved to the fixed stage 141 side, and the joining surfaces are brought into contact with each other to temporarily join them. Temporary joining is realized by causing the suction mechanisms provided on each of the two substrate holders 190 facing to be integrated.

  The two substrates 180 and the two substrate holders 190 that are temporarily joined and integrated are transferred to the air lock chamber 220 by the robot arm 172. The substrate 180 and the substrate holder 190 transferred to the air lock chamber 220 are loaded into the pressurizing device 240 by the robot arm 230.

  By being heated and pressurized in the pressurizing device 240, the two substrates 180 are bonded to each other and become permanently integrated. Thereafter, the substrate 180 and the substrate holder 190 are unloaded from the vacuum environment unit 202 and carried into the substrate removing unit 160, where the substrate 180 and the substrate holder 190 are separated from each other.

  The bonded substrate 180 is transferred to and stored in the substrate cassette 113. In this case, the moving stage 142 is also involved in the transfer from the robot arm 172 to the robot arm 171. The substrate holder 190 is returned to the substrate holder rack 150 by the robot arm 172.

  Next, the substrate holder 190 will be described. FIG. 2 is a perspective view showing the substrate holder 190 as viewed from above. In the figure, the substrate 180 is held on the upper surface of the substrate holder 190. FIG. 3 is a perspective view showing the substrate holder 190 as viewed from below.

  The substrate holder 190 has a holder main body 191, an adsorber 192, and a voltage application terminal 194, and has a disk shape whose diameter is slightly larger than that of the substrate 180 as a whole. The holder body 191 is integrally formed of a highly rigid material such as ceramic or metal. The adsorbers 192 are formed of a ferromagnetic material, and a plurality of adsorbers 192 are arranged in an outer peripheral region that is outside the held substrate 180 on the holding surface that holds the substrate 180. In the case of the figure, a total of six adsorbers 192 are arranged every 120 degrees with two as one set. The voltage application terminal 194 is embedded in the back surface of the surface holding the substrate 180.

  The holder main body 191 has high flatness on the holding surface. The holder main body 191 has a plurality of positioning holes 193 formed through the holder main body 191 on the front and back sides outside the region where the held substrate 180 is electrostatically attracted. Furthermore, the holder main body 191 has a plurality of insertion holes 195 formed through the holder main body 191 on the front and back sides inside the region where the held substrate 180 is electrostatically attracted. A push-up pin is inserted into the insertion hole 195 so that the substrate 180 can be detached from the substrate holder 190.

  The positioning hole 193 is used for positioning the substrate holder 190 by fitting with a positioning pin provided in the fixed stage 141 or the like. The adsorber 192 is disposed in a depressed region formed in the holder main body 191 so that the upper surface is located in substantially the same plane as the holding surface. The voltage application terminal 194 is embedded in the back surface of the holder body 191. By supplying a voltage via the voltage application terminal 194, a potential difference is generated between the substrate holder 190 and the substrate 180, and the substrate 180 is electrostatically attracted to the substrate holder 190. The fixed stage 141 and the like are provided with voltage supply terminals, respectively, so that electrostatic adsorption between the substrate 180 and the substrate holder 190 can be maintained.

  The substrate holder 190 placed on the moving stage 142 and the substrate holder 190 placed on the fixed stage 141 have slightly different configurations. Specifically, instead of the adsorber 192, a plurality of magnets are arranged to face the adsorber 192. By combining the attractor 192 and the magnet, the two substrate holders 190 are integrated by sandwiching the two substrates 180. Hereinafter, the two integrated substrates 180 and the two substrate holders 190 are referred to as a substrate holder pair.

  Next, the structure of the pressure device 240 will be described in detail. FIG. 4 is a front view schematically showing the entire structure of the pressurizing device 240. The pressurizing device 240 is installed in the pressurizing chamber adjusted in a vacuum environment as described above. The pressurizing device 240 includes an upper top plate 31, an upper heat module 41, and an upper pressure control module 51 installed on the ceiling side, a lower top plate 32, a lower heat module 42, and a lower pressure control module installed on the floor side. 52 and the lifting module 60. The upper top plate 31, the upper heat module 41, and the upper pressure control module 51 form an upper pressure module, and the lower top plate 32, the lower heat module 42, and the lower pressure control module 52 form a lower pressure module. In the present embodiment, since the upper heat plate 41 and the lower heat module 42 have a function of heating the upper top plate 31 and the lower top plate 32, the upper pressure module and the lower pressure module are respectively heating modules. Can also play a role as

  A pair of substrate holders in which the two substrate holders 190 are integrated by sandwiching the two substrates 180 are carried into and placed on the lower top plate 32 by the robot arm 230. The substrate holder pair is brought into contact with the upper top plate 31 as the elevating module 60 is raised, and is pressed and heated between the upper pressurizing module and the lower pressurizing module.

  The upper pressurizing module and the lower pressurizing module installed opposite to each other are modules having the same structure. Therefore, the structure of the lower pressure module will be described below as a representative.

  FIG. 5 is a cross-sectional view schematically showing the structure of the lower pressure module. In the figure, the main structure is simplified and a part thereof is omitted.

  The lower top plate 32 serving as a stage portion for placing the substrate holder body is a circular plate made of silicon carbide, and is screwed to the lower heat module 42 at the peripheral portion. The lower heat module 42 includes a plurality of heater plates 401, 402, and 403 that are in contact with each other on the surface opposite to the surface on which the substrate holder body of the lower top plate 32 is placed, in a cylindrical shape. The heater plates 401, 402, and 403 are heating units, which are made of, for example, copper, and an electric heater 404 is embedded in each of them. The electric heater 404 is supplied with electric power by a conductive wire 405, and a bead 406 made of ceramic, for example, is used as its coating so as to withstand high heat. A plurality of beads 406 are connected to penetrate the conductive wire 405 and are led from the heating space to the non-heating space.

  The heater plates 401, 402, and 403 are heated by the electric heater 404 during the heating control and transmit the heat to the lower top plate 32. Further, at the time of cooling control after completion of heating, the cooling pipe 407 functioning as a cooler is used for cooling. The heater plates 401, 402, and 403 are supported and fixed by a frame 410 that is formed radially from a central axis that passes through the center of the lower top plate 32.

  The frame 410 is connected to and supported by one end in the axial direction by a plurality of support columns 411. The other end of each column portion 411 is connected to the load cell 412. Each load cell 412 is installed on the surface opposite to the surface to which the support column 411 is connected so as to be in contact with the outside of the hollow pressurizing unit 501 that is a main element of the lower pressure control module 52. The load cell 412 is a pressure detection unit, and detects the pressure at which the hollow pressure unit 501 presses the column part 411 through the hollow pressure unit 501 and the column unit 411.

  The internal space of the lower heat module 42 is divided into a heating space and a non-heating space by a heat shield plate 420 installed in parallel to the mounting surface of the substrate holder pair of the lower top plate 32. The heat shield plate 420 is a partition that performs a function of not transmitting the heat of the heating space heated by the heater plates 401, 402, and 403 to the non-heating space where the hollow pressurizing unit 501, load cell 412 and the like that dislike high temperatures are installed as much as possible. It is a board. The heat shield plate 420 is provided with a through-hole through which the support column 411 passes. That is, the support column 411 exists across the heating space and the non-heating space. The heat shield plate 420 is also provided with a through-hole through which the conducting wire 405 penetrates, and a cap 421 is provided around the through-hole to guide the conducting wire 405 in a direction different from the direction in which the conducting wire 405 is pulled out from the through-hole. ing.

  Between the heat shield plate 420 and the hollow pressure member 501, a plurality of heat reflecting plates 422 are provided in parallel with the heat shield plate 420 and spaced apart from each other. Similarly to the heat shield plate 420, the heat reflecting plate 422 is also provided with a through hole that allows the support column 411 to pass therethrough. These heat reflecting plates 422 are formed of a metal plate such as aluminum, for example. A multilayer film that reflects the wavelength of radiation near the target heating temperature of the lower top plate 32 is formed on at least the surface of the one heating space. The target heating temperature of the lower top plate 32 is, for example, 450 ° C. to 500 ° C. when the substrate 180 that is a wafer is bonded. The heat reflecting plate 422 may be configured to be replaced according to the target heating temperature. Thereby, the transfer of heat from the heater plates 401, 402, 403 to the hollow pressurizing unit 501 can be relaxed. In addition to being provided in parallel with the heat shield plate 420, it may be provided in parallel with the axial direction of the support column 411. As a result, heat leakage from the lower heat module 42 to the outside can be reduced.

  The hollow pressurizing unit 501 is a bag-shaped pressure control unit formed of a rubber sheet or the like, and the inside thereof is filled with a fluid. Air, water, or oil is used as the fluid. For example, hydrofluoroether having excellent environmental characteristics is used. Then, the amount of fluid filled therein is adjusted by controlling the valve 502 installed in the hollow pressurizing unit 501 and the supply pipe 503. Specifically, the other end of the supply pipe 503 is connected to a pump (not shown), and the amount of fluid inside the hollow pressurizing unit 501 is increased or decreased by controlling the pump together with the valve 502. The hollow pressurizing unit 501 expands or contracts depending on the amount of fluid inside. In particular, when the amount of fluid flowing in and out through the valve 502 is adjusted in relation to the pressure received by the lower pressure control module 52 from the elevating module 60, the surfaces in contact with the plurality of load cells 412 are made flat or the peripheral portion Can be made convex or the central part can be controlled to be convex.

  The hollow pressurizing part 501 not only forms a bag with an elastic material such as a rubber sheet, but also uses, for example, a surface contacting the load cells 412 as a deformed plate, and a lifting module 60 side and an outer peripheral side as a highly rigid plate. It may be in the form of a box to be formed. Even in such a form, if the inside is kept in an airtight bag shape, the internal pressure can be adjusted by controlling the fluid that enters and exits from the outside, and the pressure is controlled with respect to the surface in contact with the load cell 412. Can do.

  Next, the shape and arrangement of the heater plates 401, 402, and 403 will be described. FIG. 6 is a top view of the lower heat module 42 showing the shape and arrangement of the heater plates 401, 402, 403.

  As shown in the figure, centering on the central axis passing through the center of the lower top plate 32, there is one circular heater plate 401 located in the middle, six fan-shaped heater plates 402 on the outer periphery thereof, and further on the outer periphery thereof. Twelve fan-shaped heater plates 403 are arranged. The sector shape of the heater plates 402 and 403 has a concentric arc with the central heater plate 401.

  The planar area covered by the heater plates 401, 402, and 403 is wider than the area corresponding to the placement surface of the substrate holder 190 placed on the lower top plate 32. Thereby, the back surface of the substrate holder 190 can be heated uniformly. In addition, each of the heater plates 401, 402, and 403 is arranged to be spaced apart from each other while being parallel to each other. Thereby, even if the heater plates 401, 402, and 403 are heated and expanded by the electric heaters 404 embedded therein, it is possible to avoid contact with each other. The distance between each other is set in advance according to the target heating temperature or the like. For example, the heater plates 401, 402, 403 are made of copper, the diameter of the lower top plate 32 is about 330 mm, and the target heating temperature is 450 ° C. Is set to about 1 mm.

  Further, the heating surfaces of the respective heater plates 401, 402, and 403 have the same area. Accordingly, the diameter, the central angle, etc. are designed so that the circular and sector shapes have the same area. Further, in the example of the figure, the radial direction is set to three steps and the number is determined, but the number of radial steps and the number per step can be arbitrarily set. Furthermore, if the thickness of each heater plate 401, 402, 403 is also the same, each heat capacity is also the same, which is more preferable.

  A cooling pipe 407 functioning as a cooler is piped to cool one or more of the heater plates 401, 402, 403. For example, as shown in the drawing, a pipe as a cooling pipe 407 is stretched so as to be in contact with either of the heater plates 402 and 403, and an external pump is controlled so that the refrigerant circulates in the pipe. The material of the pipe is preferably the same material as the heater plates 401, 402, and 403. Even if they are not the same material, if the linear expansion coefficient is the same, thermal sliding due to a temperature change does not occur on the contact surface, so that it can be applied as a material for a pipe.

  FIG. 7 is a top view of the lower heat module 42 showing the positional relationship among the heater plates 401, 402, 403, the frame 410 and the support column 411. The frame 410 has a shape in which a plurality of arm portions are radially extended from an annular portion provided at a central portion. The heater plate 401 is fixed with screws 408 at the annular portion, and the heater plates 402 and 403 are similarly fixed with screws 408 at the arm portions. As shown in the drawing, the screws 408 are preferably arranged at positions that are rotationally symmetric or bilaterally symmetric on the center line in each heater plate 401, 402, 403.

  The pressure from the hollow pressurizing unit 501 is transmitted to the heater plates 401, 402, and 403 through the plurality of support columns 411 and the frame 410. The heater plates 401, 402, and 403 press and heat the lower top plate 32. If the hollow pressurizing unit 501 is regarded as an actuator that generates a pressing force in the axial direction of the support column 411, the pressing force is, for example, when focusing on the support column 411 that presses one heater plate 402, the support column 411 → the heater plate. It is transmitted in the order of 402 → lower top plate 32. Speaking of the relationship of the pressing surfaces, the pressing surface that the support column 411 presses against the heater plate 402 is smaller than the pressing surface that the heater plate 402 presses against the lower top plate 32. That is, the pressing force is transmitted while spreading in the transmitting direction. In other words, the localized pressure is transmitted in a gradually distributed manner. By transmitting the pressure generated by the hollow pressurizing unit 501 to the lower top plate 32 in this way, a uniform pressing force can be generated on the lower top plate 32, or the entire substrate 180 can be pressed uniformly. As described above, an intentional gentle pressure distribution can be generated on the lower top plate 32. In this embodiment, the frame 410 is interposed between the heater plates 401, 402, 403 and the column part 411, but if attention is paid to the vicinity of each column part 411, the localized pressure is gradually dispersed. There is no change in being conveyed.

  Moreover, in this embodiment, although the structure which presses the several support | pillar part 411 using the single hollow pressurization part 501 expanded or contracted by adjusting the amount of fluid inside is demonstrated, The present invention can also be applied to the case of using actuators that individually press each. That is, even if the pressing force generated by the actuator is localized, the lower top plate 32 can be pressed over a wide surface by gradually dispersing the pressing force.

  Next, the load cell 412 that is in contact with the outside of the hollow pressurizing unit 501 and interposed between the column unit 411 will be described. FIG. 8 is a top view and a front view of the load cell 412. Strain gauges 413, which are piezoelectric elements, are attached to two places on the upper surface of the load cell 412, and similarly, strain gauges 413 are attached to two places on the lower surface. The output lines of the strain gauges attached to the four places are gathered together at the side terminal portions 414 and connected to the outside via the lead wires 415.

  Near the center of the upper surface, a screw hole 416 for connecting the support column 411 is provided. Further, two screw holes 417 are provided so as to be symmetric with respect to the screw hole 416. The load cell 412 is fixed to the hollow pressure part 501 through the screw hole 417.

  By monitoring the outputs of the plurality of load cells 412 provided in this way, it is possible to detect the pressure applied to each column portion 411. And according to the detected pressure, the pressure of the hollow pressurization part 501 can be adjusted, and raising / lowering of the raising / lowering module 60 can be adjusted. Further, when an abnormal pressure exceeding an assumed range is detected, it is possible to perform control to stop pressurization.

  In addition, the piezoelectric element generates a potential difference according to its magnitude when pressure is applied, so that the applied pressure can be detected. On the contrary, when electric power is applied, physical deformation can be caused. Thus, when pressure distribution is generated in a specific region while detecting the pressure of the support column 411, power is supplied to the strain gauge 413 of the load cell 412 in that region or a region other than that region and applied to the support column 411. Can be controlled to increase the pressure produced. Thus, by causing the load cell 412 to act as an auxiliary actuator, more precise pressure control can be realized. In particular, it is suitable when the substrate holder body placed on the lower top plate 32 is pressed evenly. The arrangement of the load cell 412 is not limited to the above position, and a plurality of the load cells 412 may be provided on the elevating module 60, for example, and the pressure may be adjusted with respect to the pressure applied to the lower pressure control module.

  FIG. 9 is a cross-sectional view for explaining the wiring of the electric heater 404. Here, the heater plate 401 will be described as a representative example, but the configuration of the heater plates 402 and 403 is the same.

  As shown in the drawing, a conducting wire 405 is drawn from an electric heater 404 embedded in the heater plate 401. In an environment where the temperature is not so high, the conductive wire is usually protected by a vinyl film, but in this embodiment, the heater plate 401 is heated to 450 ° C. to 500 ° C., and therefore the vinyl film cannot be used. In addition, since the heating space and the non-heating space around the conducting wire are in a vacuum atmosphere, it is not possible to use a material such as a resin that generates gas in the vacuum atmosphere. Therefore, beads 406 formed of an insulating material that has a melting point higher than the temperature of the heating space and does not generate gas even in a vacuum atmosphere are used as a protective material for the conducting wire 405. For example, ceramic is suitable as the material. A plurality of beads 406 that protect the conducting wire 405 are configured so as to penetrate the conducting wire 405 from the heating space to the non-heating space so that the conducting wire 405 can be bent.

  The heating space and the non-heating space are divided by a heat shield plate 420, and the heat shield plate 420 is provided with a through hole 423 through which the conducting wire 405 is inserted. A flange 424 is provided on the peripheral edge of the through hole 423. The flange 424 is an upright portion formed by being bent in the insertion direction of the conducting wire 405. A through portion is formed by the through hole 423 and the flange 424.

  The beads 406 are connected to each other with a slight gap so that the conducting wire 405 is bent. That is, each bead 406 has a movable amount so that it can move along the conducting wire 405. Here, if the movable amount is larger than the height h of the penetrating portion, the conductive wire 405 may directly contact the penetrating portion. Therefore, this movable amount is set to be smaller than the height h of the penetrating portion.

  Next, the structure of the lifting module 60 will be described. FIG. 10 is a cross-sectional view schematically showing the structure of the lifting module 60. In the figure, the main structure is simplified and a part thereof is omitted.

  The elevating module 60 has a two-stage structure up and down. A main EV section 610 on the lower pressure control module 52 side and a sub EV section 620 on the floor surface side. The main EV unit 610 is fastened to the lower pressure control module 52 at the stage 611. As the entire lifting module 60, the lower pressure control module 52 can be moved up and down by moving the stage 611 up and down with respect to the floor surface, so that pressure can be applied to the substrate holder body.

  The main EV section 610 is composed of one cylinder-piston mechanism having a large diameter, and the sub EV section 620 is formed by three cylinder-piston mechanisms having a small diameter at intervals of 120 ° in the circumferential direction when viewed from above. Arranged and configured. However, the main EV unit 610 and the sub EV unit 620 are not stacked one above the other independently, but are devised to raise and lower the stage 611 while acting on each other. Each structure will be described below.

  The main EV unit 610 includes a main piston 612 having a stage 611 as an upper surface thereof, a main cylinder 613 that is externally fitted to the main piston, and a bellows 614 that is connected to the main cylinder 613 and follows up and down of the main piston 612. The main room 615, which is a space formed between the main cylinder 613 and the main piston 612, is kept airtight even when the main cylinder 613 moves up and down. A main valve 616 is connected to the main room 615, and fluid flows in and out from the outside. The main room 615 is filled with fluid, and the amount of fluid in the main room 615 can be changed by controlling the main valve 616 for the inflow and outflow of this fluid. The main piston 612 can be moved up and down by changing the amount of fluid in the main room 615.

  The sub EV unit 620 includes three sub EV parts 620 as described above, but includes a sub piston 621 and a sub cylinder 624 that fits around the sub piston 621. The sub-piston 621 is inserted from the outside of the main cylinder 613 into the piston guide 617 provided in the main cylinder 613 and reaches the main room 615. A fixing portion 622 for fixing to the main piston 612 is provided at the tip of the sub-piston 621 located inside the main room 615. The sub piston 621 is fastened to the main piston 612 by the fixing portion 622.

  The sub-piston 621 includes a piston disk 623 that is fitted to the sub-cylinder 624 at the end opposite to the end where the fixing portion 622 is provided. The space in the sub cylinder 624 is divided by the piston disk 623 into an upper sub room 625 located on the main cylinder 613 side and a lower sub room 626 located on the floor surface side.

  Both the upper subroom 625 and the lower subroom 626 are kept airtight. An upper sub-valve 627 is connected to the upper sub-room 625, and fluid flows in and out from the outside. Further, a lower sub-valve 628 is connected to the lower sub-room 626 so that fluid flows in and out from the outside. The upper subroom 625 and the lower subroom 626 are filled with fluid. Also, since the total volume of the upper subroom 625 and the lower subroom 626 is always constant, the volume ratio of the upper subroom 625 and the lower subroom 626 is changed by cooperatively controlling the upper subvalve 627 and the lower subvalve 628.

  When the volume of the upper subroom 625 is increased, the volume of the lower subroom 626 is decreased and the sub piston 621 is lowered. Since the sub piston 621 is connected to the main piston 612, the main piston 612 is also lowered. At this time, the main valve 616 is also cooperatively controlled, and fluid is discharged to the outside by the volume reduction of the main room 615 accompanying the lowering of the main piston 612.

  Conversely, if the volume of the lower subroom 626 is increased, the volume of the upper subroom 625 is decreased and the sub piston 621 is raised. Then, the main piston 612 is also raised. At this time, the main valve 616 is also cooperatively controlled, and the fluid flows into the main room 615 by an amount corresponding to the volume increase of the main room 615 as the main piston 612 rises. FIG. 11 is a cross-sectional view showing a state in which the main piston 612 is raised by increasing the volume of the lower subroom 626.

  The sub-piston 621 follows when the main piston 612 is moved up and down by adjusting the amount of fluid in the main room 615 using the main valve 616. Therefore, at this time as well, the upper sub-valve 627 and the lower sub-valve 628 are cooperatively controlled, and the volume change of the upper sub-room 625 and the lower sub-room 626 is allowed as the sub-piston 621 follows.

  Air, water, and oil are used as the fluid filled in the main room 615, the upper subroom 625, and the lower subroom 626. For example, hydrofluoroether having excellent environmental characteristics is used.

  As described above, by configuring the elevating module 60 in two stages of the main EV unit 610 and the sub EV unit 620, the control can be varied depending on how the stage 611 is to be moved up and down. Specifically, when it is desired to move at a speed equal to or higher than a predetermined speed, the fluid of the sub EV unit 620 that can obtain a large displacement by inflow / outflow of a small volume is controlled, and when a pressure higher than a predetermined pressure is to be applied, The fluid of the main EV unit 610 that remains in a slight displacement even when the large volume flows in and out is controlled. Further, the fluid in the main EV unit 610 may be controlled when it is desired to move at a speed less than a predetermined speed.

  According to the embodiment of the pressurizing device 240 described above, the upper pressurizing modules having the same structure as the pressurizing module described in detail are arranged facing each other, and placed on the lower pressurizing module by the lifting module 60. The substrate holder body thus made is brought into contact with the upper pressure module and heated under pressure. However, the embodiment is not limited to this. For example, even if the structure is such that a flat surface plate is installed instead of installing the upper pressure module on the ceiling side and the structure is simply pressed from below to above, a certain degree of pressure uniformity is expected. can do.

  As mentioned above, although this invention was demonstrated using embodiment, the technical scope of this invention is not limited to the range as described in the said embodiment. It will be apparent to those skilled in the art that various modifications or improvements can be added to the above-described embodiment. It is apparent from the scope of the claims that the embodiments added with such changes or improvements can be included in the technical scope of the present invention.

31 Upper top plate, 32 Lower top plate, 41 Upper heat module, 42 Lower heat module, 51 Upper pressure control module, 52 Lower pressure control module, 60 Lifting module, 100 Laminating apparatus, 101 Housing, 102 Air environment part, 111, 112, 113 Substrate cassette, 120 Control panel, 130 Pre-aligner, 140 Temporary joining device, 141 Fixed stage, 142 Moving stage, 144 Interferometer, 145 Thermal insulation wall, 146, 222, 224 Shutter, 150 Substrate holder rack, 160 Substrate Removal part, 171, 172, 230 Robot arm, 180 substrate, 190 substrate holder, 191 holder main body, 192 adsorption element, 193 positioning hole, 194 voltage application terminal, 195 insertion hole, 202 vacuum environment part, 210 heat insulation wall, 220 Air Lock Chamber, 221 Heater, 240 Pressurizer, 401, 402, 403 Heater Plate, 404 Electric Heater, 405 Conductor, 406 Beads, 407 Cooling Tube, 410 Frame, 411 Post, 412 Load Cell, 413 Strain Gauge, 414 Terminal part,
415 lead wire, 416, 417 screw hole, 420 heat shield plate, 421 cap, 422 heat reflecting plate, 423 through hole, 424 flange, 501 hollow pressurizing part, 502 valve, 610 main EV part, 611 stage, 612 main piston, 613 Main cylinder, 614 Bellows, 615 Main room, 616 Main valve, 617 Piston guide, 620 Sub EV part, 621 Sub piston, 622 Fixed part, 623 Piston disk, 624 Sub cylinder, 625 Upper sub room, 626 Lower sub room, 627 Upper part Sub valve, 628 Lower sub valve

Claims (8)

A stage portion having a placement surface on which the object to be heated is placed;
A plurality of heater plates disposed on a surface to be heated opposite to the placement surface of the stage part;
The heating module, wherein the plurality of heater plates cover at least a region corresponding to the mounting surface, have the same heat capacity, and are adjacently spaced apart from each other.   2. The heating module according to claim 1, wherein each of the plurality of heater plates has the same area and the same thickness.   The heating module according to claim 1 or 2, wherein a material of the plurality of heater plates is copper.   4. The device according to claim 1, wherein the mounting surface is circular, and an outer shape of each of the plurality of heater plates is a fan shape or a circular shape formed along a circumferential direction and a radial direction of the circular shape. The heating module as described.   The heating module according to claim 1, further comprising a cooler that cools at least one of the plurality of heater plates.   The heating module according to claim 5, wherein the cooler includes a pipe that is in contact with at least one of the plurality of heater plates, and a refrigerant that is circulated through the pipe.   The heating module according to claim 6, wherein the pipe is made of a material having the same linear expansion coefficient as the plurality of heater plates.   A laminating apparatus for laminating a plurality of wafers as the object to be heated, comprising the heating module according to claim 1.

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