JP2015026309A - Circuit substrate model generating device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a configuration that can create a circuit substrate model for performing simulation evaluating an electromagnetic influence of a circuit substrate as three-dimensional data while suppressing workload.SOLUTION: A circuit substrate model generating device 10 comprises a storage part 32 that associates a plurality of candidate components to be selection candidates with three-dimensional information and characteristic values of the respective candidate components, and stores them. A CPU 21 functions so as to create data of a circuit substrate model obtained by incorporating, in a wiring structure specified by wiring shape data, configuration of the candidate components each corresponding to component type data of the electronic component in each position into the positions of electronic components specified by plural pieces of the component position data while reflecting three-dimensional information and a characteristic value of each candidate component.

Description

  The present invention relates to a circuit board model generation device.

  When designing and evaluating a circuit board, a technique for evaluating a designed electronic circuit by simulation is widely used. For example, in Patent Document 1, when a plurality of simulation constraint values and priorities to be executed are input, necessary information is automatically extracted from the component information library 7 and a simulation is performed to obtain an optimal component placement region. Is disclosed.

Japanese Patent Laid-Open No. 2002-230067

  By the way, in the simulation for evaluating the electromagnetic influence on the circuit board, in order to more accurately evaluate the influence of the electromagnetic field, model data specifying the specific shape of the circuit board and the specific position of each electronic component (circuit board) Model) must be generated. However, in order to drop from the designed circuit diagram into a model in which each electronic component is placed in a circuit board having a specific shape, the position of each electronic component in the data specifying the shape of the circuit board (circuit board model) Must be combined to identify the specific contents of each electronic component. Conventionally, in order to accurately perform this operation, the position and characteristics of each electronic component have been manually input, so that the work load is large and the work time is inevitably prolonged. Moreover, although it is assumed that some processes are automatically performed as in Patent Document 1, this method has a problem that three-dimensional evaluation cannot be performed.

  The present invention has been made to solve the above-described problems, and generates a circuit board model for performing simulation for evaluating the electromagnetic influence of a circuit board as three-dimensional data while reducing the work load. The aim is to provide a possible configuration.

In order to achieve the above object, the invention of claim 1
At least wiring shape data for specifying the wiring shape of the circuit board, a plurality of component type data for specifying the component types of a plurality of electronic components mounted on the circuit board, and each of the electronic components on the circuit board A reading unit (21) for reading the wiring shape data, the component type data, and the component position data from the circuit board artwork data including a plurality of component position data for specifying positions;
A storage unit (32) that stores a plurality of candidate parts that are selection candidates and the three-dimensional information and characteristic values of each candidate part in association with each other,
A search unit (21) for searching the storage unit (32) for the three-dimensional information and the characteristic values of the candidate parts respectively corresponding to the plurality of part type data read by the reading unit (21);
In the wiring structure specified by the wiring shape data read by the reading unit (21), the component of the electronic component at each position is located at the position of the electronic component specified by the plurality of component position data. Circuit board model data incorporating the configuration of each candidate part corresponding to the type data reflecting at least the three-dimensional information and the characteristic value of each candidate part searched by the search unit (21) A generating unit (21) for generating
It is provided with.

According to the first aspect of the present invention, the wiring shape data, the component type data, and the component position data are read from the circuit board artwork data, respectively, and the three-dimensional information and characteristics of the candidate parts corresponding to the plurality of read component type data, respectively. The value is retrieved from the storage unit. In the generation unit, each candidate component corresponding to the component type data of the electronic component at each position is located at the position of each electronic component specified by the plurality of component position data in the wiring structure specified by the wiring shape data. Circuit board model data is generated so as to reflect the three-dimensional information and characteristic values of each of the retrieved candidate parts.
According to this configuration, the specific contents (three-dimensional information and characteristic values) of each electronic component included in the artwork data can be automatically read with reference to the storage unit. Then, in the wiring structure specified by the wiring shape data of the artwork data, the specific contents (three-dimensional information and characteristic values) of each electronic component are automatically placed at the position of each electronic component specified by the component type data. In addition, circuit board model data can be generated so as to be accurately incorporated. Therefore, it is possible to generate a circuit board model for performing a simulation for evaluating the electromagnetic influence of the circuit board as three-dimensional data while suppressing the work load.

FIG. 1 is an explanatory diagram illustrating functions of the circuit board model generation device according to the first embodiment of the present invention. FIG. 2 is a block diagram schematically illustrating an electrical configuration of the circuit board model generation device according to the first embodiment of the present invention. FIG. 3 is a flowchart illustrating the flow of a circuit board model generation process performed by the circuit board model generation apparatus of FIG. FIG. 4 is a circuit diagram illustrating a circuit specified by artwork data generated by the board wiring tool. FIG. 5 is an explanatory diagram conceptually illustrating an example of data such as the product number and position of each electronic component included in the artwork data generated by the board wiring tool. FIG. 6 is an explanatory diagram conceptually illustrating a data example of each candidate component stored in the storage unit of the circuit board model generation device of FIG. FIG. 7 is an explanatory diagram conceptually illustrating an example of a circuit board model generated by the circuit board model generation apparatus of FIG. FIG. 8 is an explanatory diagram conceptually illustrating a part model in the circuit board model, and FIG. 8A is a conceptual view of the schematic structure of the component model as viewed obliquely from above. FIG. 8B is a conceptual diagram in plan view of the schematic structure of the component model, and FIG. 8C is a conceptual diagram of the schematic structure of the component model viewed from the side. FIG. 9 is a conceptual diagram schematically showing a structure near the component model of FIG. 8 in the circuit board model generated by the circuit board model generation device of FIG. FIG. 10 is an explanatory diagram conceptually illustrating an example of a circuit board model generated by a circuit board model generation device according to another embodiment of the present invention.

[First embodiment]
Hereinafter, a first embodiment embodying the present invention will be described with reference to the drawings.
(Outline of circuit board model generator)
First, the overall configuration of the circuit board model generation device 10 will be described with reference to FIGS. 1 and 2. A circuit board model generation apparatus 10 shown in FIG. 2 is configured as an apparatus that generates a circuit board model based on information read from artwork data of a circuit board.

  The “circuit board model data” generated by the circuit board model generation device 10 specifies the wiring structure on the board and the positions and structures of the plurality of electronic components, and the specific contents (characteristics, etc.) of each electronic component. ). The virtual contents of the circuit board expressed by such data (the circuit board model) is a circuit board model that virtually expresses the wiring shape of the circuit board and the configuration and characteristics of each electronic component. . This circuit board model is a model for performing a circuit simulation for evaluating the operation and characteristics of the circuit, such as an electromagnetic field simulation for analyzing an electromagnetic influence generated in the circuit board. That is, if “circuit board model data” is generated by the circuit board model generation device 10 of this configuration, the specific contents of the circuit board model (that is, the shape of the wiring pattern on the circuit board, the position of each electronic component, The configuration of each electronic component (size, height, etc.), the electrical characteristics of each electronic component (constants such as resistance value and capacity), etc.) can be specified. A field simulation can be performed.

  Here, basic functions of the circuit board model generation device 10 will be described. As shown in FIG. 1, the circuit board model generation device 10 is configured to acquire artwork data created by a board wiring tool. The board wiring tool may be provided in the circuit board model generation apparatus 10 or may be provided in an apparatus different from the circuit board model generation apparatus 10. Then, the circuit board model generation device 10 uses the acquired artwork data to specify wiring shape data for specifying the wiring shape of the circuit board and a plurality of types for specifying the component types of a plurality of electronic components mounted on the circuit board. The component type data and a plurality of component position data for specifying the positions of the electronic components on the circuit board are read. Further, three-dimensional information and characteristic values of candidate parts respectively corresponding to the plurality of read part type data are searched from the storage unit 32 of the part model library storage server 30. In the wiring structure specified by the read wiring shape data, each candidate part corresponding to the part type data of the electronic part at each position is located at each electronic part position specified by a plurality of part position data. The data (circuit board model data) incorporating the above-described configuration reflecting the retrieved three-dimensional information and characteristic values of each candidate part is generated. Hereinafter, each configuration for realizing such basic functions will be described in detail.

(Hardware configuration of circuit board model generation device)
As shown in FIG. 2, the circuit board model generation device 10 is configured as a computer, for example, and executes a program (see FIG. 3) described later to generate a circuit board model, and a “circuit board model”. A part model library storage server 30 that stores data of a large number of electronic parts (candidate parts) that are candidates for generating a “part model” that forms a part of the part model. The “component model” is a virtual content of each component expressed by the “circuit board model” (each configuration expressed by virtually determining the configuration, characteristics, etc. of each electronic component). Specifically, each component model includes at least information such as “unique information for identifying a component (for example, model number)”, “position on a circuit board”, “size information (height, etc.)”, and “direction”. The specific contents of each component on the circuit board specified by As data for defining such a “part model”, data of each candidate part stored in the part model library storage server 30 is used.

  As shown in FIG. 2, the main body unit 20 includes a CPU 21, a storage unit 22, a display unit 23, an operation unit 24, and a communication unit 25. Similarly, the part model library storage server 30 includes a CPU, a storage unit 32, a display unit, an operation unit, and a communication unit (in FIG. 2, configurations other than the storage unit 32 are omitted). Show). Hereinafter, each configuration of the circuit board model generation device 10 will be specifically described.

  The CPU 21 is configured to perform various types of information processing, and mainly functions to control the entire circuit board model generation device 10. Also, it functions to execute various programs stored in the storage unit 22 and perform processing according to the programs.

  The storage unit 22 includes a storage device such as a ROM, a RAM, a non-volatile memory such as a semiconductor memory, and a hard disk. The CPU 21 reads and executes various programs, circuit board artwork data, retrieved data, and other data. Is stored. For example, a program for performing the process shown in FIG. 3 is stored in the storage unit 22, and the CPU 21 is configured to read the program from the storage unit 22 and execute it.

  The display unit 23 is configured by a known display device such as a liquid crystal display device, and is configured to be able to display a processing result by each program. Specifically, for example, a circuit diagram used for generating a circuit board model (a circuit diagram created by a board wiring tool (see FIG. 4)) or a circuit board model generated by the processing shown in FIG. 3 (see FIG. 7). Etc. can be displayed.

  The operation unit 24 is configured by a known input device such as a keyboard and a mouse, and is configured to allow an external operation by a user (such as a user of the circuit board model generation device 10).

  The communication unit 25 is configured as a communication interface for communicating with an external device. The communication unit 25 is configured to receive data such as three-dimensional information and characteristic values of candidate parts from the part model library storage server 30 in response to a command from the CPU 21. The communication unit 25 is configured to transmit data such as three-dimensional information and characteristic values of candidate parts to the part model library storage server 30 in response to a command from the CPU 21.

  The storage unit 32 of the part model library storage server 30 is configured by a storage device such as a semiconductor memory such as a ROM, a RAM, and a nonvolatile memory, or a hard disk. As shown in FIG. 6, the storage unit 32 stores data (component library) in which a plurality of candidate components that are selection candidates are associated with the three-dimensional information and the characteristic values of the candidate components. ing. In this component library, three-dimensional information and characteristic values are associated with each registered candidate component (electronic component that is a selection candidate), and a large number of such candidate component data are listed. .

(Artwork data)
Next, “circuit board artwork data” used for generating a circuit board model will be described. The circuit board artwork data is CAD data generated by a known board design tool (board wiring tool). Note that a program for causing a computer to function as a board design tool may be stored in the storage unit 22. In this case, the CPU 21 can cause the circuit board model generation device 10 to function as a board design tool by executing the program (for example, a program for generating CAD data by a known method). In this case, “circuit board artwork data” is also generated by the circuit board model generation apparatus 10. Conversely, the “circuit board artwork data” may be generated by a device other than the circuit board model generation device 10 and transferred to the circuit board model generation device 10.

  “Circuit board artwork data” used in the circuit board model generation apparatus 10 includes at least wiring shape data for specifying the wiring shape of the circuit board and component types of a plurality of electronic components mounted on the circuit board. It is configured as data including a plurality of component type data to be specified and a plurality of component position data for specifying the respective positions of the electronic components on the circuit board.

  Specifically, the “circuit board artwork data” includes data specifying the position and shape of the wiring pattern on the circuit board as “wiring shape data”. A wiring structure 50 having such a wiring pattern (the structure of the wiring portion excluding the layout of the electronic components in the layout of the circuit board in FIG. 7) is specified. That is, by reading the “wiring shape data”, a figure of the wiring structure 50 as shown in FIG. 7 can be expressed. Specifically, the data can specify the position where the wiring pattern is arranged on the circuit board. In this configuration, for example, the predetermined position on the substrate of the circuit board is the origin, the predetermined direction along the substrate surface is the X direction, and the direction orthogonal to the X direction among the directions along the substrate surface is the Y direction, the X direction, and A coordinate system is used in which the direction orthogonal to the Y direction is the Z direction. The “wiring shape data” is data that can specify the layout of the wiring pattern in such a coordinate space, and further can specify the width and thickness of the wiring at each position where the wiring pattern is arranged. It is like that. The “wiring shape data” may include, for example, data related to the shape and position of a via penetrating the substrate.

  The “circuit board artwork data” includes “component type data” for specifying the component type of the electronic component mounted on the circuit board. The “component type” of an electronic component is a classification of the electronic component based on the function and shape of the electronic component, a characteristic value such as a resistance value of the electronic component, and specifically, a resistance, a capacitor, a coil, etc. It is a structure classified according to elements such as functions and manufacturers. The “part type data” for specifying each electronic component may be unique data that can specify each electronic part. In this configuration, a model number (part manufacturer part number) is used as the “part type data” (see FIG. (See 5: later)

  Further, the “circuit board artwork data” includes “component position data” for specifying the position of each electronic component on the circuit board. This “component position data” is data for specifying the position of each electronic component specified by the above “component type data” on the circuit board. Specifically, in the coordinate space in which the X direction, the Y direction, and the Z direction are determined as described above, the position (X coordinate and Y coordinate) of each electronic component specified by the “component type data” on the board surface. ) And data for specifying the orientation of each electronic component (see FIG. 5: described later).

  The artwork data may include data other than the wiring shape data, component type data, and component position data, for example, data related to the shape and position of a via penetrating the substrate. Note that the “circuit board artwork data” used in this configuration can be any known method as long as it finally includes the above-mentioned “wiring shape data”, “part type data”, “part position data”, and the like. It may be generated by any software, or may be generated by any software.

  Such artwork data is acquired or generated by the circuit board model generation device 10 and then temporarily stored in the storage unit 22 and used for generation processing (FIG. 3) described later. The artwork data may be configured as data used during actual board manufacture (for example, chip mounting data used during surface mounting of each electronic component).

(Circuit board model generation process)
Next, the flow of the circuit board model generation process performed by the circuit board model generation apparatus 10 will be described with reference to the flowchart shown in FIG. The process of FIG. 3 is a process executed by the CPU 21 when a predetermined condition is satisfied (for example, at a predetermined operation by the user) based on a program (automatic arrangement program) stored in the storage unit 22.

  Hereinafter, for example, a case where the artwork data of the circuit diagram illustrated in FIG. 4 is stored in the storage unit 22 will be described as a representative example. In the generation process of FIG. 3, first, the CPU 21 reads the above-described artwork data stored in the storage unit 22 (step S1). Then, component information is acquired from the read artwork data (step S2). The artwork data includes information on a plurality of electronic components (component type data and component position data of each electronic component) constituting the circuit diagram of FIG. 4, and in S2, such components of each electronic component are included. You will get information.

  For example, in the circuit of FIG. 4, electronic components such as ICs, MOS transistors, resistors, capacitors, and coils are arranged in combination with wiring. For each electronic component, IC, MOS1, MOS2, R01 , R02, C01, C02, C11, C12, C13, C14, C21, and L1 are assigned component numbers. Then, as part information (part type data and part position data of each electronic part) of each electronic part included in the artwork data, each part No. The specific information of each component specified in Fig. 5 is configured as shown in Fig. 5. Thus, in the artwork data, it is possible to specify how each electronic component is connected in the circuit and how the power supply terminal (+ B), the output terminal (OUT), and the ground terminal (GND) are provided. It has become.

  As shown in FIG. 5, the part information of each electronic part included in the artwork data is information for specifying the part number, part manufacturer part number, part name, manufacturer, constant, center coordinate, direction (angle), etc. of each part. It is configured. “Part No.” is a serial number of each electronic component included in the circuit (see FIG. 4) specified by the artwork data, for example, and this “part No.” It is possible to identify which part it is. The “part manufacturer part number” is data for specifying the part type of the part of the “part No.” associated with it, and is data for specifying the part number (model number) assigned to the part. The “product name” is a name of a type in which electronic components are distinguished by function, such as IC, MOS (MOS transistor), Resistor (resistor), Condenser (capacitor), Coil (coil), and the like. “Manufacturer” is the name of the manufacturer that manufactures the electronic component. “Constant” is a characteristic value of an electronic component. For example, if “Product name” is Resistor, it is a resistance value, if “Product name” is Coil, it is an inductance value, and “Product name” is Condensor. Capacity value. The “center coordinate” is the center position of each electronic component on the XY plane in the coordinate system (XYZ coordinate system) set on the substrate to be attached. In addition, as a coordinate of the center position of each electronic component, it can be set as the coordinate which shows the position of the midpoint of the line segment which ties both terminals of each electronic component, for example. The “direction (angle)” is an arrangement angle in the circuit diagram of the electronic component. A reference direction is defined for each electronic component, and this “direction (angle)” is an angle formed by a reference direction defined for each electronic component and a predetermined direction (for example, Y direction) on the substrate surface. It has become. For example, in the IC shown in FIGS. 4 and 7 (IC of AA1 in FIG. 5), the longitudinal direction is the reference direction. In the example of FIG. 5, the direction of this IC is the difference between the reference direction and the Y direction. The direction in which the formed angle is 0 ° is determined. Similarly, other electronic components have their respective reference directions, and in the data of FIG. 5, the angle formed by the reference direction and the Y direction is defined as “direction (angle)”.

  In the generation process of FIG. 3, in step S2, the component type data of all the electronic components of the circuit (see FIG. 4) specified by the artwork data is acquired. For example, when the artwork data is assumed to be a circuit as shown in FIG. 4, in step S2, the part manufacturer part number (model number) of each part shown in FIG. 5 is specified as “part type data”. For example, in the example of FIG. 5, since the “part manufacturer part number” of the electronic part whose “part No.” is C13 is EE4, in step S2, the model number (part manufacturer part number) of EE4 is used as the part type data of C13. Identify. In step S2, the model numbers (part manufacturer part numbers) of other parts of the circuit shown in FIG. 4 are similarly specified.

  In this configuration, the CPU 21 that can execute the processes of S1 and S2 corresponds to an example of a “reading unit”. From the artwork data generated by the above-described board wiring tool (board design tool), wiring shape data, It functions to read the component type data and the component position data, respectively.

  After step S2, the component library stored in the storage unit 32 is searched based on the acquired component type data of each electronic component (S3). Specifically, the model number (part manufacturer part number) of any electronic part that has not been searched among the electronic parts specified in step S2 is searched from the part library (S3). Then, it is determined whether or not the model number to be searched exists in the parts library (S4). If it is determined in S3 that the model number to be searched does not exist in step S4, the process proceeds to No in step S4, and the electronic model of that model number is handled so as not to arrange the component model (S5). If it is determined in step S4 that the model number to be searched exists in step S3, the process proceeds to Yes in step S4, and information associated with the model number is read from the component library shown in FIG.

  Note that the CPU 21 corresponds to an example of a “search unit” and searches the storage unit 32 of the part model library storage server 30 for three-dimensional information and characteristic values of candidate parts respectively corresponding to the plurality of read part type data. To work.

  A component library as shown in FIG. 6 is stored in the storage unit 32 of the component model library storage server 30, and various information is associated with each candidate component that is a selection candidate at the time of circuit board model generation, and is listed. Has been. A “candidate part” whose data is registered in the part library is an electronic part that can be a selection candidate in the generation process of the circuit board model, and in this configuration, a large number of such electronic parts (candidate parts) that are candidates. These data (data that can specify the three-dimensional shape and characteristic values) are stored in a database in advance. The “three-dimensional information” of the candidate part is data reflected in the part model when the circuit board model is generated. For example, the three-dimensional shape and size of the part model (for example, the area occupied on the board of the circuit board model, or X Data for specifying the length of each of the direction and Y directions), the height (for example, the height of the circuit board model from the board), and the like. The “characteristic value” of the candidate part is characteristic data reflected in the part model when the circuit board model is generated. For example, if the type of the candidate part is a resistance, the characteristic value is a resistance value, a withstand voltage value, or the like. If the candidate component type is a capacitor, the characteristic value is a capacitance value or a withstand voltage value. If the candidate component type is a coil, the characteristic value is an inductance value or a withstand voltage value.

  Specifically, in the component library shown in FIG. 6, for each candidate electronic component (candidate component), product number, component manufacturer, type, mounting method, specifications (capacity, pressure resistance, size, height), LCR setting Port values (capacity, ESL, ESR), model-path, and the like are recorded. Here, the “part number” corresponds to part type data that specifies the part type of the candidate part, and has the same concept as the part manufacturer part number (model number) described above. “Part manufacturer” is the name of the manufacturer that manufactures the candidate part. The “type” is a name of a type in which candidate parts are distinguished by function, such as a resistor, a coil, and a multilayer ceramic capacitor. The “mounting method” is a method for mounting a candidate component on a wiring shape. For example, when the candidate component is a surface mount device (SMD), it is indicated as SMD. “Specification” is a characteristic value (for example, capacitance value, pressure resistance value, etc.) or three-dimensional information (for example, size, height, etc.) of a candidate part, and “LCR setting port value” is a concentrated value. The set value of the characteristic value as a constant element (for example, capacitance value, ESL (equivalent series inductance) value, ESR (equivalent series resistance) value, etc.), and “model-path” is a storage area of the storage unit 32 This is a character string indicating the location of candidate part data. Note that the “size” of the “specification” is, for example, data of the area required for component mounting on the substrate when the candidate component is mounted on the substrate, and the “height” is, for example, the bottom portion of each candidate component (each candidate This is the height data from a predetermined bottom defined for each part.

  In the generation process of FIG. 3, for example, the search target part in S <b> 3 is a part number. If the electronic component is “C13”, “EE4” which is the component manufacturer part number (model number) of the component “C13” is searched from the component library. In this case, since the electronic part (candidate part) of the product number (model number) “EE4” is specified in the part library shown in FIG. 6, the process proceeds to Yes in S4, and in S5, first, “EE4” is retrieved from the part library. Each part information about the electronic part (candidate part) of the product number (model number) is read out. Specifically, the three-dimensional information (size and height) and characteristic values (capacity and pressure resistance) of the product number (model number) of “EE4” are read. Then, in the wiring structure 50 specified by the wiring shape data of the artwork data read in S1, the read three-dimensional information (size and height) is reflected on the part (part searched for in S3). Data specifying the mounting structure arranged in a form is generated. That is, in the wiring structure specified by the wiring shape data of the artwork data based on the data generated in step S5, the parts to be searched in S3 are arranged at what position and in what size and height. Can be identified.

  Specifically, when the three-dimensional information and characteristic values of the part C13 are reflected and the part model is incorporated in step S5, the wiring shape data of the artwork data (data acquired in S1) as shown in FIG. In the wiring structure 50 specified by (5), the position of the part of C13 (the position specified by the part position data included in the artwork data. In the example of FIG. 5, the center coordinate (X, Y) is (27.5). , 15.3)) is a virtual structure of the size and height of the C13 part (part number "EE4" part) specified in the part library ("EE4" part). Place the original figure). Further, since the C13 part (part number “EE4” part) has a height of H5, not only the center coordinates in the X and Y directions but also the center coordinates in the Z direction can be specified. For example, if the upper surface of the wiring structure 50 is a reference position (zero position) in the Z direction, the coordinates of the center position of this component in the Z direction are H5 / 2. In addition, part no. Since the electronic component whose C13 is C13 is specified as an angle of 0 ° by the component position data of FIG. 5, the angle formed by a predetermined reference direction of the electronic component and a predetermined direction (for example, the Y direction) of the electronic component is 0. Place so that it is at °. In FIG. 7, the arrangement position of the electronic component of C13 is shown as a one-dot chain line AR1.

  In this manner, if data that can specify a layout (circuit board model) in which a component model (virtual structure indicating an electronic component) is incorporated in the virtual wiring structure 50 specified by the wiring shape data is generated. Using this data, the wiring layout and component layout on the circuit board can be specified three-dimensionally. In particular, in the circuit board model generated in this way, not only the three-dimensional structure of the wiring pattern on the circuit board (wiring structure 50) but also the three-dimensional structure of each component mounted on the circuit board (the X direction of each part). , Y direction, Z direction center position, height, size) can also be specified. Note that the figure (outer shape) of the component model incorporated into the wiring structure 50 when the circuit board model is generated may be determined in advance for each candidate component in the component library shown in FIG. 6, for example.

  As described above, in step S5, a part model (virtual structure indicating an electronic part) for the part that was searched in S3 is incorporated into the virtual wiring structure 50 specified by the wiring shape data. Data that can represent the layout is generated, and the incorporated component is associated with a characteristic value (characteristic value associated with the component library) associated with the component. Then, in step S6 after step S5 or S7, it is determined whether the processes after S3 have been repeated by the number of points of all electronic components specified by the part type data of the artwork data acquired in S1. If there is an unprocessed electronic component that has not been subjected to the processing after S3 (search processing, etc.) among all the electronic components specified by the artwork data, the process proceeds to No in step S6, and the unprocessed electronic component is processed. The process after S3 is similarly performed on any of the parts.

  For example, as described above, the part No. In step S6 after the processing from step S3 is performed on the electronic component of C13, the component No. If it is determined that the processing after S3 is not performed for the electronic components such as L1 and R01, the processing of S3 to S6 is performed on the unprocessed electronic components of L1, and then the unprocessed electronic components of R01 are processed. A process of generating a component model of each electronic component is performed, for example, the processing of S3 to S6 is performed on the component. If the processes after S3 are repeated by the number of points of all the electronic components specified by the part type data of the artwork data acquired in S1, the process proceeds to No in S6, and the finally generated layout is generated. The final “circuit board model” (a layout in which component models of all electronic components (virtual structures indicating electronic components) are incorporated into the virtual wiring structure 50 specified by the wiring shape data) Then, such a layout is specified, and data that can be displayed is treated as “circuit board model data” (S8).

  The layout generated in this way (a layout in which a part model (virtual structure indicating an electronic part) is incorporated in the virtual wiring structure 50 specified by the wiring shape data) is displayed on the display unit 23, for example. It can be done. That is, the display unit 23 displays the wiring structure 50 (virtual figure of the wiring pattern on the circuit board) specified by the wiring shape data included in the artwork data based on the generated “circuit board model data”. The display functions in combination with the display of a plurality of component model graphics (virtual graphics of each component mounted on the wiring board) generated by the generation processing of FIG.

  In this configuration, the CPU 21 that executes the processes of S4, S5, etc. corresponds to an example of a “generating unit”, and each position of each electronic component specified by a plurality of component position data included in the artwork data is set at each position. Functions to generate circuit board model data incorporating the configuration of each candidate part corresponding to the part type data of the electronic part, reflecting the retrieved three-dimensional information and characteristic values of each candidate part .

In the following, the “component model” that forms part of the “circuit board model” will be described in more detail.
In the “circuit board model” generated by the generation process of FIG. 3, as described above, the position and orientation of each electronic component on the wiring board can be specified. More specifically, A virtual fixed figure (solid model) and a position of a setting port for setting the LCR of each electronic component can be specified.

  For example, the above-described part No. For example, a component model 40 as shown in FIG. 8 is configured as the component model of “C13”. The component model 40 includes a virtual setting port 41 and a virtual fixed figure (solid model) 42. The fixed figure 42 includes two inner portions 42A and 42A and two outer portions 42B and 42B configured as electrode portions connected to the wiring structure 50. Such a fixed figure 42 (in particular, the shapes of the inner portions 42A and 42A and the outer portions 42B and 42B and their positions within the component) may be determined in advance for each component in the component library. . The setting port 41 extends in the direction in which the two inner portions 42A and 42A face each other, and the center position of the part of the part model 40 (here, the part of “C13”) (the X direction obtained as described above, It is arranged as a linear figure passing through the center position in the Y direction and Z direction).

  In this example, since the outer portions 42B and 42B correspond to electrodes, it is specified that the components specified by the component model 40 are respectively connected to portions overlapping the outer portions 42B and 42B in the wiring structure 50. . Further, when the setting port 41 is set at a position higher than the surface of the wiring structure 50, even if a part of the wiring structure 50 extends so as to intersect with the setting port 41 as shown in FIG. These are specified to be spaced apart from each other and not short-circuited. As described above, in this configuration, it is possible to easily realize the component model 40 that straddles a part of the wiring structure 50. Therefore, it is possible to avoid unintended mutual interference in the virtual wiring pattern and electronic parts expressed by the circuit board model, and to generate a model close to the actually assumed structure (structure in which no short circuit occurs). can do.

  For example, an electronic component (part number EE4) having “component No.” C13 shown in FIG. 5 has the coordinates (X, Y) = (27.5, 15.3) shown in FIG. ) And the height (H5) of the part specified in the library of FIG. 6, the coordinates (X, Y, Z) of the center position are specified as (27.5, 15.3, H5 / 2). The Further, when the direction in which the inner portions 42A and 42A face each other is the reference direction of the component, the angle between the reference direction and the reference direction of the board (for example, the Y direction) is 0 ° according to the component position data (FIG. 5). It arrange | positions so that it may become. In the part model of such a part, the setting port 41 is arranged to extend in the Y direction and pass through the coordinates (27.5, 15.3, H5 / 2) of the center position. In the setting port 41, for example, at the position of the coordinates (27.5, 15.3, H5 / 2) of the center position, the characteristic values (for example, L, C, R) of the part specified in the part library It is treated so that there is a component that reflects. For example, since the capacitance value (C) of the electronic component of C13 (the electronic component of the product number EE4) is set to 2.2 μF, it is 2.2 μF at the position (27.5, 15.3, H5 / 2). Treated as having a capacitive component. In addition, in the electronic component of the product number EE4, since the resistance value and the inductance are not particularly defined, the resistance value (R) and the inductance (L) are set to 0.

  According to this configuration as described above, the specific contents (three-dimensional information and characteristic values) of each electronic component included in the artwork data can be automatically read with reference to the storage unit 32. Then, in the wiring structure 50 specified by the wiring shape data of the artwork data, the specific contents (three-dimensional information and characteristic values) of each electronic component are automatically assigned to the position of each electronic component specified by the component type data. In addition, circuit board model data can be generated so that it can be accurately and accurately incorporated. Therefore, it is possible to generate a circuit board model for performing a simulation for evaluating the electromagnetic influence of the circuit board as three-dimensional data while suppressing the work load. In particular, it is not necessary to manually set the specific position of each electronic component and the port of each electronic component one by one, and there is no need to manually input the characteristic values at each port. Therefore, work efficiency can be greatly improved.

  The “circuit board model data” generated in this way can be used for various analyses. For example, a well-known circuit simulator (for example, analyzing the electromagnetic influence generated in a circuit board) that calculates the operation and characteristics of the circuit using the “circuit board model” generated by the above generation process (FIG. 3) as an evaluation target. When the program of the known electromagnetic field simulator) is stored in the storage unit 22, the CPU 21 can execute the program to evaluate the “circuit board model” by a known method. In this case, the circuit board model generation device 10 also functions as a circuit simulator. For example, when an electromagnetic field simulation is performed on the “circuit board model” obtained by the processing of FIG. 3 by a known method, the intensity distribution of the electromagnetic field generated on the circuit board is expressed as a circuit board model by color gradation or the like. By combining and displaying on the display unit 23, the result of the electromagnetic field simulation can also be visualized.

[Other Embodiments]
The present invention is not limited to the embodiments described with reference to the above description and drawings. For example, the following embodiments are also included in the technical scope of the present invention.

In the above embodiment, the configuration including the wiring shape data, the component type data, and the component position data is exemplified as the “circuit board artwork data”. However, data other than these may be included. For example, the artwork data includes the heat sink shape data specifying the shape of the heat sink combined with the circuit board and the relative position of the heat sink to the circuit board, and the shape of the harness combined with the circuit board and the relative position of the harness to the circuit board. It is good also as a structure containing at least any one of the harness shape data which identify | isolates, or the shape of the housing | casing combined with a circuit board, and the relative position with respect to the circuit board of the said housing | casing. In this case, the “circuit board model” represents not only the virtual structure of the board, wiring, and each electronic component, but also the virtual structure of the heat sink and harness as shown in FIG. For example, if artwork data includes both heat sink shape data and harness shape data, if `` circuit board model data '' is generated, the wiring structure on the circuit board, the position of each electronic component on the circuit board, In addition to the orientation, structure, and characteristics, the relative position and shape of the heat sink with respect to the circuit board can be specified, and the relative position and shape of the harness with respect to the circuit board can also be specified.
The “heat sink shape data” includes data specifying the relative position of the heat sink with respect to the circuit board (for example, the center position of the heat sink and the orientation of the heat sink in the XYZ coordinate system described above) and the external shape of the heat sink. Moreover, the data etc. which specify the material of a heat sink may be contained. With this data, in the circuit board model as shown in FIG. 10, the layout (virtual structure of the heat sink) of the heat sink 70 with respect to the circuit board 60 (virtual structure of the circuit board) is specified. That is, by reading “heat sink shape data”, the figure of the heat sink 70 as shown in FIG. 10 can be expressed.
The “harness shape data” includes data for specifying the relative position of the harness with respect to the circuit board (for example, the center position of each harness and the orientation of each harness in the XYZ coordinate system described above) and the outer shape of each harness. Moreover, the data etc. which identify the material of a harness may be contained. With this data, in the circuit board model as shown in FIG. 10, the layout (virtual structure of the harness) of each harness 80 with respect to the circuit board 60 (virtual structure of the circuit board) is specified. That is, by reading “harness shape data”, the figure of the harness 80 as shown in FIG. 10 can be expressed.
“Case shape data” includes data specifying the relative position of the casing with respect to the circuit board (for example, the center position of the casing and the orientation of the casing in the XYZ coordinate system described above) and the outer shape of the casing. Yes. Moreover, the data etc. which specify the material of a housing | casing may be included. With this data, in the circuit board model as shown in FIG. 10, the layout (virtual structure of the casing) of each casing 90 with respect to the circuit board 60 (virtual structure of the circuit board) is specified. . That is, the figure of the housing 90 as shown in FIG. 10 can be expressed by reading “housing shape data”.
In this example, when generating a circuit board model, as a base for incorporating electronic components in the process of FIG. 3, not only the wiring structure specified by the wiring shape data but also the heat sink shape data and harness shape read from the artwork data Unlike the first embodiment, only the virtual structure (structure model) as shown in FIG. 10 combined with the data and the structure specified by the housing shape data is used, and the processing of FIG. Itself) is the same as in the first embodiment. In this example, when the CPU 21 corresponding to the reading unit reads the artwork data in S1 of FIG. 3, not only the wiring shape data, the component type data, and the component position data, but also the heat sink shape data, the harness shape data, The housing shape data is also read.
In addition, when the CPU 21 corresponding to the generation unit generates the circuit board model in S3 to S8, the wiring structure specified by the wiring shape data read in S1, the heat sink shape data, the harness shape data, and the housing For the structural model (virtual structure as shown in FIG. 10) combined with the structure specified by the shape data, a component model of each electronic component is generated by the processing of S3 to S8 as in the first embodiment. As a result, the configuration of each candidate part corresponding to the part type data of the electronic part at each position is registered in the part library at the position of each electronic part specified by the plurality of part position data included in the artwork data. The circuit board model data is generated by incorporating the three-dimensional information and the characteristic value of each candidate part.
Thus, by generating a circuit board model incorporating a heat sink, a harness, a housing, or the like, a more accurate simulation can be performed in consideration of these effects.

  In the above-described embodiment, a configuration in which a program that functions as a board design tool (board wiring tool) is stored in the storage unit 22 and artwork data is generated in the circuit board model generation apparatus 10 is illustrated. Not limited to. For example, the artwork data used for the processing in FIG. 3 may be input from the external device to the circuit board model generation device 10 via the communication unit 25. In this case, the artwork data acquired from the outside is used for the processing of FIG.

  Further, in the above embodiment, a part library (data obtained by listing each candidate part and the three-dimensional information of each candidate part in association with each other) as shown in FIG. 6 is stored in the storage unit 32 of the part model library storage server 30. However, such a component library may be stored in the storage unit 22 of the main body unit 20.

10 ... Circuit board model generation device 21 ... CPU (reading unit, search unit, generation unit)
32 ... Storage unit 50 ... Wiring structure

Claims (2)

At least wiring shape data for specifying the wiring shape of the circuit board, a plurality of component type data for specifying the component types of a plurality of electronic components mounted on the circuit board, and each of the electronic components on the circuit board A reading unit (21) for reading the wiring shape data, the component type data, and the component position data from the circuit board artwork data including a plurality of component position data for specifying positions;
A storage unit (32) that stores a plurality of candidate parts that are selection candidates and the three-dimensional information and characteristic values of each candidate part in association with each other,
A search unit (21) for searching the storage unit (32) for the three-dimensional information and the characteristic values of the candidate parts respectively corresponding to the plurality of part type data read by the reading unit (21);
In the wiring structure specified by the wiring shape data read by the reading unit (21), the component of the electronic component at each position is located at the position of the electronic component specified by the plurality of component position data. Circuit board model data incorporating the configuration of each candidate part corresponding to the type data reflecting at least the three-dimensional information and the characteristic value of each candidate part searched by the search unit (21) A generating unit (21) for generating
A circuit board model generation device (10), comprising: In the artwork data, the shape of the heat sink combined with the circuit board and the heat sink shape data for specifying the relative position of the heat sink to the circuit board, or the shape of the harness combined with the circuit board and the circuit board of the harness Includes at least one of harness shape data for specifying a relative position with respect to the shape of a housing combined with the circuit board and housing shape data for specifying a relative position of the housing with respect to the circuit board,
The reading unit (21) is configured to read at least one of the heat sink shape data, the harness shape data, and the housing shape data.
The generation unit includes the wiring structure specified by the wiring shape data read by the reading unit (21), the heat sink shape data read by the reading unit (21), the harness shape data, and With respect to a structural model combined with a structure specified by at least one of the housing shape data, the electronic component at each position is positioned at each electronic component specified by a plurality of the component position data. The circuit of each of the candidate parts corresponding to the part type data is incorporated by reflecting at least the three-dimensional information and the characteristic value of each of the candidate parts searched by the search unit (21). The circuit board model generation device (1) according to claim 1, wherein the circuit board model data is generated. ).

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