JP2015018975A - Capacitor and flexible printed wiring board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a capacitor that allows easily adjusting its capacitance and being downsized, and to provide a flexible printed wiring board.SOLUTION: A capacitor of the present invention includes: a first substrate having a first base material layer with insulation property and flexibility and a first conductive pattern stacked on one surface side of the first base material layer; a second substrate stacked on the first substrate, and having a second base material layer with insulation property and flexibility and a second conductive pattern stacked on one surface side of the second base material layer; and thin dielectric body interposed between the first substrate and the second substrate. The first conductive pattern has a plurality of electrode portions arranged in one direction, a plurality of lead-out portions each extending from the plurality of electrode portions, and a breakable portion connecting the plurality of lead-out portions. The breakable portion is disposed so as not to be overlapped with the second conductive pattern as viewed from the top. The dielectric body may be disposed so as not to be overlapped with the breakable portion as viewed from the top.

Description

  The present invention relates to a capacitor and a flexible printed wiring board.

  Many of the various electric circuits incorporated in electronic devices and the like include a capacitor called a trimmer capacitor that can adjust the electrostatic capacity in order to adjust circuit characteristics. Naturally, miniaturization is strongly required for trimmer capacitors for adjusting circuit characteristics of small electronic devices such as mobile phones and wearable devices.

  A conventional trimmer capacitor is configured such that the distance between the counter electrodes and the area of the counter electrodes can be mechanically changed using a driver or the like (for example, Japanese Patent Laid-Open No. 58-148421). Since such a conventional trimmer capacitor has a three-dimensional mechanical structure, there is a limit in reducing the installation area and the installation height. Further, in the conventional trimmer capacitor, since the capacitance changes at the moment when the driver is released due to the elastic force of the mechanical structure, it is not easy to accurately adjust the capacitance. Furthermore, the conventional trimmer capacitor may require an insulating driver, or the capacitance may change due to movement of the electrode due to an impact such as dropping.

  Therefore, a capacitor is known that adjusts the capacitance by irreversibly reducing the area of the electrode without making the electrode movable. As such a capacitor, for example, a first conductive pattern including a first electrode laminated on an insulating base material layer, a dielectric layer laminated on the first conductive pattern, and a dielectric layer A second conductive pattern including a plurality of second electrodes opposed to the first electrode and a connection part connecting the plurality of second electrodes, and cutting the connection part of the second conductive pattern with a laser. Has proposed a capacitor for adjusting the capacitance by reducing the effective area of the electrode (Japanese Patent Laid-Open No. 2005-94017).

JP 58-148421 A JP 2005-94017 A JP 2004-364143 A

  When a capacitor having a multilayer structure as described in JP-A-2005-94017 is intended to cut the connection portion of the second conductive pattern by a mechanical means such as a punch or a cutter, peeling between each layer or second There is a possibility that the conductive pattern is cut and malfunctions. For this reason, the capacitor described in Japanese Patent Application Laid-Open No. 2005-94017 adjusts the electrostatic capacity by cutting the connection portion of the second conductive pattern with a laser. In other words, such a conventional capacitor cannot easily adjust its capacitance because a predetermined laser device is required.

  The present invention has been made based on the above-described circumstances, and an object of the present invention is to provide a capacitor and a flexible printed wiring board in which the capacitance can be easily adjusted and the size can be reduced.

  The invention made in order to solve the above-described problems is a first substrate having a first base layer having insulation and flexibility and a first conductive pattern laminated on one surface side of the first base layer. And a second substrate having a second conductive layer stacked on the first substrate and laminated on one surface side of the second substrate layer having insulation and flexibility; and A thin-film dielectric interposed between the first substrate and the second substrate, wherein the first conductive pattern extends from the plurality of electrode portions arranged in one direction and from the plurality of electrode portions, respectively. A capacitor having a plurality of lead portions and a severable portion connecting the plurality of lead portions, wherein the severable portion is disposed so as not to overlap the second conductive pattern in plan view.

  Furthermore, another invention made in order to solve the above-mentioned problems is a circuit in which the capacitor, the third base layer having insulation and flexibility, and the one side of the third base layer are laminated. And a main substrate having a pattern, wherein the first base material layer or the second base material layer extends from the third base material layer.

  The capacitor and flexible printed wiring board of the present invention can be easily adjusted in capacitance and can be miniaturized.

FIG. 1 is a schematic perspective view showing a capacitor according to an embodiment of the present invention. FIG. 2 is a schematic plan view of the capacitor of FIG. FIG. 3 is a schematic cross-sectional view taken along line AA in FIG. FIG. 4 is a schematic perspective view showing the first conductive pattern and the second conductive pattern extracted from FIG. FIG. 5 is a schematic plan view showing the manufacturing process of the capacitor of FIG. FIG. 6 is a schematic perspective view of a flexible printed wiring board including the capacitor of FIG.

[Description of Embodiment of the Present Invention]
The present invention provides a first substrate layer having insulation and flexibility, a first substrate having a first conductive pattern laminated on one surface side of the first substrate layer, and an overlay on the first substrate. A second substrate layer having insulation and flexibility, a second substrate having a second conductive pattern laminated on one surface side of the second substrate layer, the first substrate, and the second substrate. A plurality of electrode portions arranged in one direction, a plurality of lead portions respectively extending from the plurality of electrode portions, and the plurality of lead portions. And a disconnectable portion that connects the lead-out portions, and the disconnectable portion is disposed so as not to overlap the second conductive pattern in plan view.

  Since the capacitor has a severable portion in which the first conductive pattern of the first substrate does not overlap the second conductive pattern in plan view, it is possible to use the second means by using mechanical means such as a punch without using a laser. The electrostatic capacity can be adjusted easily and reliably by cutting the cuttable portion of the first substrate without cutting the conductive pattern. Moreover, since the said cut | disconnectable part is arrange | positioned so that the extraction part extended from each electrode part may be connected, it cut | disconnects between the extraction parts whose separation distance is larger than the separation distance between adjacent electrode parts. . For this reason, the capacitor has a large tolerance for cutting work and is easy to work, and the distance between the electrode portions can be minimized to reduce the size (small area). Furthermore, the capacitor can be easily manufactured because it can be formed by sandwiching a dielectric between the first substrate and the second substrate.

  It is preferable that the capacitor is arranged so that the dielectric does not overlap the cuttable portion in plan view. Since the dielectric does not overlap the severable part, when adjusting the capacitance, only the first base material layer and the second base material layer need be cut in addition to the severable part, and the dielectric is cut. It is easy to work because there is no need to do it.

  The capacitor may be formed by folding the first substrate and the second substrate along a line parallel to the one direction. Thereby, since lamination | stacking of the 1st conductive pattern to a 1st base material layer and lamination | stacking of a 2nd conductive pattern to a 2nd base material layer can be performed in the same process, manufacture of the said capacitor becomes easy.

  In the capacitor, two wiring patterns connected to the first conductive pattern and the second conductive pattern are formed on one of the first base material layer and the second base material layer. One side may extend to the other of the first base material layer and the second base material layer through the folded region. If comprised in this way, since the wiring terminal of the said capacitor | condenser is arrange | positioned only to one side of a 1st board | substrate and a 2nd board | substrate, it is easy to incorporate the said capacitor | condenser in a circuit.

  The capacitor may have a through hole or a notch at a position where the first substrate and the second substrate overlap in a plan view. The first substrate and the second substrate can be accurately positioned by inserting a pin into the through hole or fitting a guide into the notch.

  In the capacitor, it is preferable that the first conductive pattern and the second conductive pattern are stacked on each facing surface side of the first base material layer and the second base material layer. With such an arrangement, the capacitance between the electrodes of the capacitor can be reduced and the capacitance can be increased. Further, the capacitance can be increased also by the absence of the first base material layer and the second base material layer between the first conductive pattern and the second conductive pattern. For this reason, the capacitor can be miniaturized. In addition, since the capacitor can reduce the electrode area for obtaining a certain capacitance, the internal resistance can be reduced and the loss can be reduced.

  Another aspect of the present invention includes the capacitor, and a main substrate having a third base material layer having insulation and flexibility and a circuit pattern laminated on one surface side of the third base material layer, A flexible printed wiring board in which the first base material layer or the second base material layer extends from the third base material layer. The flexible printed wiring board can be easily adjusted in capacitance and can be miniaturized. Moreover, since the flexible printed wiring board can be formed integrally with the capacitor, it is easy to manufacture, and the circuit characteristics can be easily adjusted by the capacitor, and the size can be reduced. Also. Since the first substrate, the second substrate, and the main substrate are all flexible, they can be easily incorporated into electronic devices.

[Details of the embodiment of the present invention]
Hereinafter, an embodiment of a capacitor according to the present invention will be described in detail with reference to the drawings.

[Capacitor]
The capacitor shown in FIGS. 1, 2 and 3 has a first substrate 1, a second substrate 2 opposite to the first substrate 1, and a thin film-like structure interposed between the first substrate 1 and the second substrate 2. And a dielectric 3. The dielectric 3 is bonded to the first substrate 1 and the second substrate 2 by an adhesive layer 4. A through hole 5 is formed in the first substrate 1, and a through hole 6 is formed in the second substrate 2 at a position overlapping the through hole 5 in plan view.

<First substrate>
The first substrate 1 includes a first base layer 7 having electrical insulation and flexibility, and a first conductive pattern 8 laminated on the side of the first base layer 7 facing the second substrate 2. Have

(First base material layer)
The said 1st base material layer 7 is comprised with the sheet-like member which has insulation and flexibility. Specifically, a resin film can be used as the sheet-like member constituting the first base material layer 7. As a material for this resin film, for example, polyimide, polyethylene terephthalate or the like is preferably used. Moreover, it is preferable that this resin film has translucency so that the shape of the below-mentioned 1st conductive pattern 8 can be confirmed. In addition, the 1st base material layer 7 may contain a filler, an additive, etc.

  The average thickness of the first base material layer 7 is not particularly limited, but the lower limit is preferably 5 μm and more preferably 10 μm. There exists a possibility that the intensity | strength of the 1st base material layer 7 may become inadequate that the average thickness of the 1st base material layer 7 is less than the said minimum. On the other hand, as an upper limit of the average thickness of the 1st base material layer 7, 100 micrometers is preferable and 50 micrometers is more preferable. If the average thickness of the first base material layer 7 exceeds the upper limit, it may be difficult to cut the first base material layer 7 together with the first conductive pattern 8.

(First conductive pattern)
As shown in FIG. 4, the first conductive pattern 8 includes a plurality of substantially square electrode portions 9 arranged in one direction and the same area, and a plurality of electrode portions 9 extending in a direction perpendicular to the one direction. A plurality of strip-shaped lead portions 10 that are narrower than the electrode portion 9 and the tips of the plurality of lead portions 10 are connected to each other and are continuous in the one direction, and have a width similar to that of the lead portion. And a cutable portion 11. The lead-out part 10 and the severable part 11 are arranged so as not to overlap with a second conductor pattern of the second substrate 2 described later in plan view.

  The 1st conductive pattern 8 is a layer which consists of material which has electroconductivity, The material of this 1st conductive pattern 8 should just have electroconductivity, and a thing with small electrical resistance is preferable. For example, the first conductive pattern 8 is formed of copper.

  The shapes of the electrode part 9, the lead part 10, and the severable part 11 of the first conductive pattern 8 can be formed by an appropriate method according to the method of laminating the conductive material. For example, the metal part laminated | stacked on the 1st base material layer 7 can be masked, and can be etched, and the electrode part 9, the extraction | drawer part 10, and the cutting | disconnection part 11 can be formed. As a method for forming this metal film, for example, a metal foil or the like may be attached to the first base material layer 7 with an adhesive or the like, or a metal may be vapor-deposited on the first base material layer 7. Moreover, when forming the 1st conductive pattern 8 with an electroconductive paste, the electrode part 9, the extraction | drawer part 10, and the cutting | disconnection part 11 can be formed with a printing technique.

  The lower limit of the average thickness of the first conductive pattern 8 is preferably 0.1 μm and more preferably 1 μm. If the average thickness of the first conductive pattern 8 is less than the lower limit, the internal resistance may increase, the loss may be excessive, or the first conductive pattern 8 may be torn. On the other hand, the upper limit of the average thickness of the first conductive pattern 8 is preferably 100 μm, and more preferably 80 μm. If the average thickness of the first conductive pattern 8 exceeds the upper limit, the capacitor may be unnecessarily thick.

  The lower limit of the separation distance between the adjacent electrode portions 9 in the first conductive pattern 8 is preferably 0.05 mm, and more preferably 0.1 mm. If the distance between the electrode portions 9 is less than the lower limit, the electrode portions 9 may come into contact with each other and the capacitance may not be adjusted. On the other hand, the upper limit of the separation distance of the electrode portion 9 is preferably 5 mm, and more preferably 1 mm. If the distance between the electrode portions 9 exceeds the upper limit, the capacitor may be unnecessarily enlarged.

  What is necessary is just to design suitably about the dimension (the length of an arrangement direction, and the width | variety perpendicular to it) of the said electrode part 9 according to the adjustment unit amount of the electrostatic capacitance requested | required of the said capacitor | condenser. The adjustment unit amount of the capacitance of the capacitor can be, for example, 10 pF to 15 pF.

  The lower limit of the width in the arrangement direction of the electrode portion 9 of the lead portion 10 is preferably 0.2 mm, and more preferably 0.5 mm. When the width | variety of the said drawer | drawing-out part 10 is less than the said minimum, there exists a possibility that conduction | electrical_connection of the drawer | drawing-out part 10 may become inadequate. On the other hand, the upper limit of the width of the drawer 10 is preferably 5 mm, and more preferably 2 mm. When the width of the drawer portion 10 exceeds the upper limit, the distance between adjacent drawer portions 10 becomes small, and it becomes difficult to cut the cutable portion 11 between the drawer portions 10 without damaging the drawer portions 10. There is a possibility that the adjustment work of the capacitance is not easy.

  The lower limit of the extending length of the lead portion 10 in the direction perpendicular to the arrangement direction of the electrode portions 9 is preferably 0.2 mm, and more preferably 0.5 mm. When the extension length of the lead-out portion 10 is less than the lower limit, the distance between the electrode portion 9 and the cuttable portion 11 is reduced, and it becomes difficult to cut the cuttable portion 11 without damaging the electrode portion 9. There is a fear. On the other hand, the upper limit of the drawing length of the lead-out part 10 is preferably 5 mm, and more preferably 2 mm. When the extending length of the extraction portion 10 exceeds the upper limit, the capacitor may be unnecessarily enlarged.

  The lower limit of the width of the cuttable portion 11 in the direction perpendicular to the arrangement direction of the electrode portions 9 is preferably 0.2 mm, and more preferably 0.5 mm. When the width | variety of the said cutable part 11 is less than the said minimum, there exists a possibility that the conduction | electrical_connection of the cuttable part 11 may become inadequate. On the other hand, the upper limit of the width of the cuttable portion 11 is preferably 5 mm, and more preferably 2 mm. When the width of the cuttable portion 11 exceeds the upper limit, the width to be cut when adjusting the capacitance is excessive, and there is a possibility that the adjustment of the capacitance may not be easy, and the capacitor is unnecessarily large. There is a risk of becoming.

<Second substrate>
The second substrate 2 includes a second base layer 12 having electrical insulation and flexibility, and a second conductive pattern 13 and two layers laminated on the surface of the second base layer 12 facing the substrate 2. Wiring patterns 14 and 15 are provided.

(Second base material layer)
About the material and thickness of the said 2nd base material layer 12, the thing similar to the said 1st base material layer 7 can be used. Further, as shown in FIG. 1, the second base material layer 12 is connected to the first base material layer 7 by a folded region 16 that can be folded along a line parallel to the arrangement direction of the electrode portions 9 of the first substrate 1. It is preferable that That is, preferably, the 1st base material layer 7, the 2nd base material layer 12, and the return region 16 are formed from one sheet-like member.

(Second conductive pattern)
As shown in FIG. 4, the second conductive pattern 13 is opposed to all the electrode portions 9 of the first conductive pattern 8 (one electrode having the smallest rectangular shape that overlaps with all the electrode portions 9 in plan view). It is formed in a shape.

  The material and average thickness of the second conductive pattern 13 can be the same as those of the first conductive pattern 8. The second conductive pattern 13 can be formed by the same method as the first conductive pattern 8. Moreover, when the 1st base material layer 7 and the 2nd base material layer 12 are formed with one sheet | seat, it is preferable to form the 2nd conductive pattern 13 at the same process as the 1st conductive pattern 8 simultaneously. .

(Wiring pattern)
The wiring patterns 14 and 15 are strip-shaped conductor layers that extend to the outside of the second substrate 2 in plan view together with the first base material layer 7 and are exposed at the end of the capacitor. One wiring pattern 14 is connected to the first conductive pattern 8, and the other wiring pattern 15 is connected to the second conductive pattern 13. These wiring patterns 14 and 15 are wiring terminals for connecting the first conductive pattern 8 and the second conductive pattern 13 to an external circuit.

  One wiring pattern 14 extends in the arrangement direction of the electrode portions 9 in parallel with the wiring pattern 15 outside the second substrate 2 in a plan view, but the arrangement direction of the electrode portions 9 in the vicinity of the folded region 16. Are bent at right angles to each other and extended to the first base material layer 7 through the folded region 16 so as to be insulated from the second conductive pattern 13 and connected to the first conductive pattern 8. The other wiring patterns 14 and 15 are linearly connected to the end of the second conductive pattern 13.

  The material and average thickness of the wiring patterns 14 and 15 can be the same as those of the first conductive pattern 8. The first conductive pattern 8 is preferably formed simultaneously in the same process as the first conductive pattern 8. The widths of the wiring patterns 14 and 15 can be the same as those of the cuttable portion 11 of the first conductive pattern 8.

<Folding area>
The folded region 16 is provided on one end side in the arrangement direction of the electrode portions 9 of the first substrate 1 so that the wiring pattern 14 can be disposed so as not to interfere with the second conductive pattern 13.

  The lower limit of the length in the arrangement direction of the electrode portions 9 in the folded region 16 is preferably 1 mm, and more preferably 2 mm. There exists a possibility of a fracture | rupture as the said length of the return | turnback area | region 16 is less than the said minimum. The upper limit of the length of the folded region 16 is preferably 15 mm, and more preferably 5 mm. If the length of the folded region 16 exceeds the above condition, folding becomes difficult, and the first conductive pattern 8 and the second conductive pattern 13 may not be brought into close contact with the dielectric 3.

<Dielectric material>
The dielectric 3 is a layer that insulates the first conductive pattern 8 and the second conductive pattern 13 and increases the capacitance between the first conductive pattern 8 and the second conductive pattern 13. As shown in FIG. 2, the dielectric 3 includes the electrode portion 9 and the second conductive pattern 13 of the first conductive pattern 8 in a plan view, but does not overlap the cuttable portion 11 of the first conductive pattern 8. It is formed in a rectangular shape.

  Although it does not specifically limit as the dielectric material 3, The thing which contains the inorganic dielectric particle in the insulating synthetic resin, and has the flexibility formed in the sheet form is used suitably.

  The dimensional difference between the length in the arrangement direction of the electrode portion 9 of the dielectric 3 and the width in the direction perpendicular to the arrangement direction, and the length in the arrangement direction and the width in the direction perpendicular to the second conductive pattern 13 As a minimum, 0.2 mm is preferred and 0.5 mm is more preferred. When the dimensional difference is less than the lower limit, a part in which the dielectric 3 is not interposed between the electrodes of the capacitor may occur due to an assembly error, and the capacitance of the capacitor and its adjustment unit amount may be reduced. On the other hand, the upper limit of the dimensional difference is preferably 5 mm, and more preferably 2 mm. If the dimensional difference exceeds the upper limit, the dielectric 3 protrudes to the cuttable portion 11 side, making it difficult to cut the cuttable portion 11 or extending the lead-out portion 10 to avoid it. There is a risk of unnecessarily increasing the size of the capacitor.

  The average thickness of the dielectric 3 is not particularly limited and is selected according to the capacitance required for the capacitor. The lower limit is preferably 5 μm, and more preferably 10 μm. When the average thickness of the dielectric 3 is less than the above lower limit, the strength of the dielectric 3 is insufficient, and there is a possibility that the dielectric 3 may be damaged during the stacking operation with the first substrate 1 and the second substrate 2. On the other hand, the upper limit of the average thickness of the dielectric 3 is preferably 5 mm, and more preferably 1 mm. When the average thickness of the base material layer 31 exceeds the upper limit, the distance between the electrodes becomes excessively large, and the capacitor may be unnecessarily enlarged.

<Adhesive layer>
The adhesive layer 4 is a layer made of an adhesive that bonds the first substrate 1 and the second substrate 2 to the dielectric 3. Although it does not specifically limit as an adhesive agent which comprises the adhesive bond layer 4, The thing excellent in the softness | flexibility and heat resistance is preferable, As this adhesive agent, an epoxy resin, a polyimide resin, a polyester resin, a phenol, for example is preferable. Various resin-based adhesives such as resin, polyurethane resin, acrylic resin, melamine resin, and polyamideimide resin can be used.

  The lower limit of the average thickness of the adhesive layer 4 is preferably 5 μm and more preferably 10 μm. When the average thickness of the adhesive layer 4 is less than the above lower limit, the adhesive strength between the first substrate 1 and the second substrate 2 and the dielectric 3 may be insufficient. On the other hand, the upper limit of the average thickness of the adhesive layer 4 is preferably 50 μm, and more preferably 40 μm. When the average thickness of the adhesive layer 4 exceeds the above upper limit, the distance between the first substrate 1 and the second substrate 2 is increased, and the capacitance is reduced, so that the capacitor may be unnecessarily enlarged.

<Manufacturing method>
For example, as shown in FIG. 5, the capacitor includes the first conductive pattern 8 and the second conductive material on one sheet in which the first base material layer 7 and the second base material layer 12 are connected via the folded region 16. A step of forming the conductive pattern 13 and the wiring patterns 14 and 15; a step of bonding the dielectric 3 on the second conductive pattern 13 of the second substrate 2 by the adhesive layer 4; And a step of bonding the first substrate 1 onto the dielectric 3 by the layer 4.

  In the step of bonding the first substrate 1 on the dielectric 3, the first substrate 1 is positioned with respect to the second substrate 2 by inserting pins into the through holes 5 and 6. As a result, the first conductive pattern 8 can be accurately opposed to the second conductive pattern 13, and the designed capacitance can be obtained.

<Capacitance adjustment method>
The capacitor can easily cut off any number of electrode portions 9 by cutting off the portion between the drawable portions 10 of the cuttable portion 11 with a tool such as a punch. FIG. 4 shows an example in which the cuttable portion 11 is cut with a circular punch P in order to cut off the electrode portion 9 at the tip (left end in the drawing). Since the capacitance of the capacitor is proportional to the total area of the electrode portions 9 connected to the wiring pattern 14, the static electricity corresponding to one electrode portion 9 can be obtained by cutting off some of the electrode portions 9 in this way. The capacitance of the capacitor can be reduced to a desired value using the capacitance as an adjustment unit.

<Advantages>
In the capacitor, even if the distance between the electrode portions 9 of the first conductive pattern 8 is reduced, the distance between the lead portions 10 is sufficiently large. Accordingly, the capacitor can be reduced in size by reducing the separation distance between the electrode portions 9, and the length of the severable portion 11 that can be excised without interfering with the electrode portion 9 and the lead-out portion 10 is large. The electric capacity can be adjusted easily.

  Further, the cuttable portion 11 does not overlap with the dielectric 3 in plan view. For this reason, it is not necessary to cut the dielectric 3 when adjusting the capacitance of the capacitor, and only the first base material layer 7 and the second base material layer 12 are cut in addition to the cuttable portion 11. do it. Therefore, the capacitance of the capacitor can be easily adjusted.

  The capacitor is composed of one sheet in which the first base material layer 7 and the second base material layer 12 are connected via the folded region 16, and the first conductive pattern 8 and the second conductive pattern 13 are in the same process. Since it is formed by, manufacturing man-hours are small.

  In addition, since the through-hole 5 and the through-hole 6 are formed in the first substrate 1 and the second substrate 2, respectively, the capacitor is folded at the folding portion 16 to stack the first substrate 1 and the second substrate 2. At this time, the first conductive pattern 8 and the second conductive pattern 13 can be positioned so as to face each other exactly as designed. Thereby, the electrostatic capacitance of the said capacitor | condenser and its adjustment unit amount (electrostatic capacity corresponding to each electrode part 9) do not vary.

  In the capacitor, the first conductive pattern 8 and the second conductive pattern 13 are laminated on the opposing surface sides of the first base material layer 7 and the second base material layer 12. Accordingly, the first conductive pattern 8 and the second conductive pattern 13 are insulated from the outside by the first base material layer 7 and the second base material layer 12. Moreover, since the 1st base material layer 7 and the 2nd base material layer 12 with a dielectric constant are not interposed between the 1st conductive pattern 8 and the 2nd conductive pattern 13, an electrostatic capacitance can be enlarged.

  Since the capacitor adjusts the electrostatic capacity by electrically separating one or the plurality of electrode portions 9 by cutting off the cuttable portion 11, the electrostatic capacity does not change even when an impact such as dropping is applied.

  The capacitor is flexible as a whole because each component has flexibility. For this reason, it can be folded and incorporated in accordance with the shape of the dead space of a small electronic device or device. For example, the capacitor can be provided by being wound around another component of the electronic device.

[Flexible lint wiring board]
The flexible printed wiring board of FIG. 6 has the capacitor of FIG. 1, FIG. 2 and FIG. 3, the third base material layer 17 having insulation and flexibility, and one surface side of the third base material layer 17. A main board 19 having circuit patterns 18 to be stacked is provided.

  The third base material layer 17 extends from the second base material layer 12, and wiring patterns 14 and 15 are connected to the circuit pattern 18. That is, the third base material layer 17 is integrally formed by the same sheet as the first base material layer 7 and the second base material layer 12. The circuit pattern 18 can be formed simultaneously in the same process as the first conductive pattern 8, the second conductive pattern 13, and the wiring patterns 14 and 15.

<Advantages>
The flexible printed wiring board formed integrally with the capacitor whose capacitance can be easily adjusted can easily adjust the circuit characteristics by the capacitor. The flexible printed wiring board has flexibility including the capacitor portion. Therefore, it can be mounted on a small electronic device such as a cellular phone by utilizing the dead space at the end of the casing.

[Electronic parts]
The electronic component includes the capacitor and a printed wiring board having a circuit pattern. This circuit pattern is connected to the wiring patterns 14 and 15 of the capacitor.

  As a method of connecting the circuit pattern and the wiring patterns 14 and 15, for example, a method of providing a connector on the circuit pattern terminals and the wiring patterns 14 and 15, and connecting the terminals of the circuit pattern and the wiring patterns 14 and 15 by soldering. Examples thereof include a connection method, a method in which an anisotropic conductive adhesive is laminated between the circuit pattern terminals and the wiring patterns 14 and 15, and the like.

<Advantages>
The electronic component can easily adjust the circuit characteristics because the capacitor whose capacitance is easy to adjust is connected to the circuit pattern. Therefore, the electronic component can be suitably used for small electronic devices such as mobile phones.

[Other Embodiments]
The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is not limited to the configuration of the embodiment described above, but is defined by the scope of the claims, and is intended to include all modifications within the meaning and scope equivalent to the scope of the claims. The

  For example, the first substrate and the second substrate may be formed separately from different materials, and the folded region that connects the two may be omitted.

  Moreover, the 1st conductive pattern and the 2nd conductive pattern may be laminated | stacked on the surface on the opposite side to the opposing surface of a 1st base material layer and a 2nd base material layer. Furthermore, the capacitor may have two or more rows of first conductive patterns and second conductive patterns.

  Further, the second conductive pattern may have a shape in which an electrode portion facing the electrode portion of the first conductive pattern is connected.

  When a plurality of through holes are provided, not only a through hole that is accurately positioned by a positioning pin, but also a long hole or a large-diameter hole that has play with respect to the pin may be provided. Moreover, you may provide a notch so that it may overlap with a 1st board | substrate and a 2nd board | substrate in planar view instead of a through-hole.

  In addition, the first substrate and the second substrate and the dielectric can be thermocompression bonded. For example, by using a thermoplastic resin as a main component of the dielectric, adhesion between the first substrate and the second substrate and the dielectric is achieved. The agent layer may be omitted.

  Further, in the capacitor, the first base material layer or the second base material layer may be marked so as to indicate the relationship between the cutting position of the severable portion and the expected decrease in capacitance.

  The flexible printed wiring board may be connected so that the capacitor is stacked on the main board.

  As described above, the capacitor of the present invention can easily adjust the capacitance, and can be suitably used as a trimmer capacitor for circuit adjustment. In addition, the flexible printed wiring board of the present invention can be easily used for a small electronic device because the circuit characteristics can be easily adjusted, the circuit characteristics after the adjustment are stable, and it is small and flexible. .

DESCRIPTION OF SYMBOLS 1 1st board | substrate 2 2nd board | substrate 3 Dielectric material 4 Adhesive layers 5, 6 Through-hole 7 1st base material layer 8 1st conductor pattern 9 Electrode part 10 Lead-out part 11 Cutting | disconnection part 12 2nd base material layer 13 2nd Conductive patterns 14 and 15 Wiring pattern 16 Bending region 17 Third substrate layer 18 Circuit pattern 19 Main substrate P Punch

Claims (7)

A first base layer having insulating properties and flexibility, and a first substrate having a first conductive pattern laminated on one surface side of the first base layer;
A second substrate having a second conductive layer stacked on the first substrate and laminated on one surface side of the second substrate layer having insulation and flexibility; and
A thin-film dielectric interposed between the first substrate and the second substrate,
The first conductive pattern is
A plurality of electrode portions arranged in one direction;
A plurality of lead portions respectively extending from the plurality of electrode portions;
A disconnectable portion for connecting the plurality of drawer portions,
A capacitor in which the cuttable portion is disposed so as not to overlap the second conductive pattern in plan view.   The capacitor according to claim 1, wherein the dielectric is disposed so as not to overlap the cuttable portion in plan view.   3. The capacitor according to claim 1, wherein the first substrate and the second substrate are formed by folding a single substrate along a line parallel to the one direction. 4.   Two wiring patterns connected to the first conductive pattern and the second conductive pattern are formed on one of the first base material layer and the second base material layer, and one of the two wiring patterns is The capacitor according to claim 3, wherein the capacitor extends to the other of the first base material layer and the second base material layer through a folded region.   The capacitor according to any one of claims 1 to 4, wherein the first substrate and the second substrate have a through hole or a cutout at a position where they overlap in a plan view.   The said 1st conductive pattern and the said 2nd conductive pattern are laminated | stacked on each opposing surface side of the said 1st base material layer and the said 2nd base material layer, The any one of Claims 1-5. Capacitor. A capacitor according to any one of claims 1 to 6,
A third substrate layer having insulation and flexibility, and a main substrate having a circuit pattern laminated on one surface side of the third substrate layer,
A flexible printed wiring board in which the first base material layer or the second base material layer extends from the third base material layer.

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