JP2015015276A - Connector, and led lighting apparatus - Google Patents

Connector, and led lighting apparatus Download PDF

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JP2015015276A
JP2015015276A JP2013139520A JP2013139520A JP2015015276A JP 2015015276 A JP2015015276 A JP 2015015276A JP 2013139520 A JP2013139520 A JP 2013139520A JP 2013139520 A JP2013139520 A JP 2013139520A JP 2015015276 A JP2015015276 A JP 2015015276A
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flexible substrate
connector
led
led module
electrode
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JP6171634B2 (en
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加藤 英昭
Hideaki Kato
英昭 加藤
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Toyoda Gosei Co Ltd
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Toyoda Gosei Co Ltd
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Abstract

PROBLEM TO BE SOLVED: To enable a contact terminal to contact to an electrode of a connection object, without pressing and bending a flexible substrate.SOLUTION: In a part of wiring 56 buried in a flexible substrate 51 with exposure from the flexible substrate 51 to the surface side thereof, there is provided a contact terminal 56b protruding from the flexible substrate 51 in a thickness direction thereof because of formation thicker in the thickness direction of the flexible substrate 51 as compared to a surrounding wiring part. Thus, the protruded contact terminal 56b is made to contact to an electrode 36a of a connection object without pressing and bending the flexible substrate 51 toward the electrode 36a of the connection object.

Description

本発明は、LEDモジュールの電極に外部電源を接続するコネクタに関する。   The present invention relates to a connector for connecting an external power source to an electrode of an LED module.

基板上にLEDパッケージやLEDチップを配置したLEDモジュールを、照明器具に設置して発光利用する場合、基板固定の方法や、電力供給の方法や、光取出しの方法や、放熱(伝熱)の方法等について留意する必要があるが、電力供給の方法としては、次の[1]〜[3]に示す方法がある。   When an LED module in which an LED package or LED chip is placed on a board is installed in a lighting fixture and used for light emission, the board fixing method, power supply method, light extraction method, heat dissipation (heat transfer) Although it is necessary to pay attention to the method and the like, there are the following methods [1] to [3] as a method of supplying power.

[1]LEDモジュールの電極に外部電源から延びる配線を直接半田付けする方法。
[2]外部電源から延びる配線の先端部に、導体の弾性体接点を接続し、該弾性体接点をLEDモジュールの電極に接触させる方法(特許文献1)。そして、配線の先端部に弾性体接点を接続する方法としては、半田付けで接続する方法や、配線の先端部に弾性体接点を速結端子や圧接端子やタブ端子として接続する方法等がある。
[3]LEDモジュールの電極に外部電源を接続するコネクタを設置する方法(特許文献2)。
[1] A method of directly soldering a wiring extending from an external power source to an electrode of an LED module.
[2] A method in which an elastic contact of a conductor is connected to the tip of a wiring extending from an external power source, and the elastic contact is brought into contact with an electrode of the LED module (Patent Document 1). And as a method of connecting the elastic contact to the tip of the wiring, there are a method of connecting by soldering, a method of connecting the elastic contact to the tip of the wiring as a quick connection terminal, a pressure contact terminal, a tab terminal, etc. .
[3] A method of installing a connector for connecting an external power source to the electrode of the LED module (Patent Document 2).

特開平04−082174号公報Japanese Patent Laid-Open No. 04-082174 特開2010−287480号公報JP 2010-287480 A

[1]の方法は、照明器具を組み立てる現場で半田付けを行わなければならないので、現場での作業が手間となる。また、[2]の方法も、現場で配線の先端部にある弾性体接点をLEDモジュールの電極に接触させなければならないので、現場での作業が手間となる。また、[3]の方法は、現場でコネクタを設置するだけでよいので、現場での作業が[1][2]に比べて手間とならない。しかしながら、LEDモジュールの周辺に纏まった広いスペースがない場合等、コネクタを設置するスペースがない場合には、用いることができない。   In the method [1], since the soldering must be performed at the site where the lighting fixture is assembled, the work at the site is troublesome. In the method [2], since the elastic contact at the tip of the wiring must be brought into contact with the electrode of the LED module at the site, the work at the site is troublesome. Moreover, since the method [3] only needs to install the connector at the site, the work at the site is less time-consuming than [1] and [2]. However, when there is no space for installing the connector, such as when there is no wide space around the LED module, it cannot be used.

そこで、本発明者は、図11に示す参考例のLED照明器具9のように、コネクタ90を、可撓性のあるフレキシブル基板91とそれに埋設された配線96とから構成し、配線96の一部に、フレキシブル基板91からその面側に露出した接触端子96bを設けることを考えた。そして、LEDモジュール30を固定する固定部材40に、押圧突起49を設け、その押圧突起49でフレキシブル基板91の接触端子96b周辺を集中的にLEDモジュール30の電極36aに向けて押圧することで、この部分を押し曲げて、接触端子96bを電極36aに接触させることを考えた。   Therefore, the present inventor configures the connector 90 from a flexible flexible substrate 91 and a wiring 96 embedded therein, like the LED lighting apparatus 9 of the reference example shown in FIG. It was considered that the contact terminals 96b exposed on the surface side from the flexible substrate 91 were provided in the part. Then, by providing a pressing protrusion 49 on the fixing member 40 that fixes the LED module 30, and pressing the periphery of the contact terminal 96b of the flexible substrate 91 toward the electrode 36a of the LED module 30 with the pressing protrusion 49, It was considered that the contact terminal 96b was brought into contact with the electrode 36a by pushing and bending this portion.

この参考例によれば、LEDモジュール30の周辺に纏まった広いスペースがない場合等にも、LEDモジュール30と固定部材40との間の隙間等、各隙間を利用して柔軟にコネクタ90を設置することができる。しかしながら、押圧突起49でフレキシブル基板91の接触端子96b周辺を集中的に押圧してこの部分を押し曲げるため、この部分で、押圧突起49がフレキシブル基板91を貫通して絶縁破壊を起こすおそれがある。   According to this reference example, the connector 90 can be flexibly installed using each gap such as a gap between the LED module 30 and the fixing member 40 even when there is no wide space around the LED module 30. can do. However, since the pressing protrusion 49 concentrates and presses the periphery of the contact terminal 96b of the flexible substrate 91 to push and bend this portion, the pressing protrusion 49 may penetrate the flexible substrate 91 and cause dielectric breakdown at this portion. .

そこで、フレキシブル基板を押し曲げなくても、接触端子を接続対象物の電極に接触させられるようにすることを目的とする。   Then, it aims at making it possible to make a contact terminal contact the electrode of a connection object, without pushing and bending a flexible substrate.

上記目的を達成するため、本発明のコネクタは、接続対象物の電極に外部電源を接続するコネクタにおいて、可撓性のあるフレキシブル基板と、該フレキシブル基板に埋設された配線とを含み構成され、配線の一部に、フレキシブル基板からその面側に露出するとともに周囲の配線部分に比べてフレキシブル基板の厚さ方向に厚く形成されたことで、フレキシブル基板からその厚さ方向に突出した接触端子が設けられたことで、フレキシブル基板を接続対象物の電極に向けて押し曲げなくても、該突出した接触端子が接続対象物の電極に接触するように構成されたことを特徴とする。   In order to achieve the above object, a connector of the present invention is a connector for connecting an external power supply to an electrode of a connection object, and includes a flexible flexible substrate and wiring embedded in the flexible substrate, A part of the wiring is exposed to the surface side from the flexible substrate and formed thicker in the thickness direction of the flexible substrate than the surrounding wiring portion, so that the contact terminal protruding in the thickness direction from the flexible substrate is formed. By being provided, the protruding contact terminal is configured to be in contact with the electrode of the connection object without pressing and bending the flexible substrate toward the electrode of the connection object.

接続対象物は、特に限定されないが、LEDチップを備えたLEDモジュールであることが好ましい。但し、本発明のコネクタは、LEDモジュール以外の接続対象物に対しても使用することができる。   Although a connection target object is not specifically limited, It is preferable that it is an LED module provided with the LED chip. However, the connector of this invention can be used also for connection objects other than an LED module.

接触端子の厚さは、特に限定されないが、接触端子は、周囲の配線部分に比べてフレキシブル基板の厚さ方向に30〜300μm厚く形成されてことが好ましい。30μmに満たないと、接触端子がフレキシブル基板からその厚さ方向に十分に突出しないことで、接触端子が電極に十分に強く接触しないおそれがある一方、300μmを超えると接触端子が無駄に厚くなり過ぎるからである。より好ましくは、接触端子は、周囲の配線部分に比べてフレキシブル基板の厚さ方向に60〜200μm厚く形成されていることである。   Although the thickness of a contact terminal is not specifically limited, It is preferable that the contact terminal is formed 30-300 micrometers thick in the thickness direction of a flexible substrate compared with the surrounding wiring part. If it is less than 30 μm, the contact terminal does not sufficiently protrude in the thickness direction from the flexible substrate, so that the contact terminal may not contact the electrode sufficiently strongly. On the other hand, if it exceeds 300 μm, the contact terminal becomes uselessly thick. It is because it passes. More preferably, the contact terminal is formed to be 60 to 200 μm thicker in the thickness direction of the flexible substrate than the surrounding wiring portion.

本発明のコネクタを採用した電気器具は、特に限定されないが、次のLED照明器具を例示する。すなわち、筐体と、LEDチップを備えたLEDモジュールと、筐体にLEDモジュールを固定する固定部材と、LEDモジュールと固定部材との間の隙間に介装された本発明のコネクタとを含み構成され、固定部材は、フレキシブル基板をLEDモジュールの電極に向けて押圧することで、前記突出した接触端子をLEDモジュールの電極に押圧する押圧部を備えたLED照明器具である。ここで、このような押圧部を設けるのは、それにより、該突出した接触端子とLEDモジュールの電極との接触をより確実なものにできるからである。   Although the electric appliance which employ | adopted the connector of this invention is not specifically limited, The following LED lighting fixture is illustrated. That is, a configuration including a housing, an LED module including an LED chip, a fixing member that fixes the LED module to the housing, and the connector of the present invention interposed in a gap between the LED module and the fixing member The fixing member is an LED lighting device including a pressing portion that presses the protruding contact terminal against the electrode of the LED module by pressing the flexible substrate toward the electrode of the LED module. Here, the reason why such a pressing portion is provided is that the contact between the protruding contact terminal and the electrode of the LED module can be made more reliable.

本発明よれば、フレキシブル基板を接続対象物の電極に向けて押し曲げなくても、突出した接触端子が接続対象物の電極に接触するので、フレキシブル基板を押し曲げる必要性がなくなる。そのため、フレキシブル基板を押し曲げるために、フレキシブル基板の接触端子周辺を集中的に押圧する必要性もなくなり、この部分が貫通され難くなる。そのため、絶縁破壊も生じ難くなる。   According to the present invention, even if the flexible board is not pushed and bent toward the electrode of the connection object, the protruding contact terminal contacts the electrode of the connection object, so that it is not necessary to push and bend the flexible board. Therefore, in order to push and bend the flexible substrate, there is no need to intensively press the periphery of the contact terminal of the flexible substrate, and this portion is difficult to penetrate. Therefore, dielectric breakdown is less likely to occur.

(a)は、実施例1のLED照明器具を示す斜視図、(b)は、正面断面図である。(A) is a perspective view which shows the LED lighting fixture of Example 1, (b) is front sectional drawing. 実施例1のLED照明器具を示す分解斜視図である。It is a disassembled perspective view which shows the LED lighting fixture of Example 1. FIG. (a)は、実施例1のLED照明器具のフレキシブル基板の基板材料の下面側を示す斜視図、(b)は、上面側を示す斜視図、(c)は、フレキシブル基板を示す斜視図である。(A) is a perspective view which shows the lower surface side of the board | substrate material of the flexible substrate of the LED lighting fixture of Example 1, (b) is a perspective view which shows an upper surface side, (c) is a perspective view which shows a flexible substrate. is there. (a)は、実施例1のLED照明器具のフレキシブル基板の基板材料を示す平面図、(b)は、正面断面図である。(A) is a top view which shows the board | substrate material of the flexible substrate of the LED lighting fixture of Example 1, (b) is front sectional drawing. 実施例2のLED照明器具を示す分解斜視図である。It is a disassembled perspective view which shows the LED lighting fixture of Example 2. FIG. (a)は、実施例3のLED照明器具を示す斜視図、(b)は、正面断面図である。(A) is a perspective view which shows the LED lighting fixture of Example 3, (b) is front sectional drawing. 実施例3のLED照明器具を示す分解斜視図である。6 is an exploded perspective view showing an LED lighting apparatus of Example 3. FIG. (a)は、実施例3のLED照明器具のフレキシブル基板の上面側を示す斜視図、(b)は、下面側を示す斜視図である。(A) is a perspective view which shows the upper surface side of the flexible substrate of the LED lighting fixture of Example 3, (b) is a perspective view which shows the lower surface side. 実施例4のLED照明器具を示す平面図である。It is a top view which shows the LED lighting fixture of Example 4. (a)は、変更例1のフレキシブル基板の基板材料を示す底面図、(b)は、変更例2のフレキシブル基板の基板材料を示す底面図である。(A) is a bottom view which shows the board | substrate material of the flexible substrate of the modification 1, (b) is a bottom view which shows the board | substrate material of the flexible substrate of the modification 2. (a)は、参考例のLED照明器具を示す斜視図、(b)は、正面断面図である。(A) is a perspective view which shows the LED lighting fixture of a reference example, (b) is front sectional drawing.

以下、本発明のコネクタ及びLED照明器具を図面を参照に説明する。なお、以下では、図面に合わせて、LED基板の厚さ方向の一方及び他方を、それぞれ「上」「下」といい、LED基板の面方向の4方を、それぞれを「前」「後」「左」「右」というが、任意に回転させた状態、例えば「上」が前で「下」が後の状態等、で実施してもよい。   Hereinafter, the connector and LED lighting fixture of this invention are demonstrated with reference to drawings. In the following, according to the drawings, one and the other in the thickness direction of the LED substrate are referred to as “upper” and “lower”, respectively, and the four directions in the surface direction of the LED substrate are referred to as “front” and “rear”, respectively. Although referred to as “left” and “right”, it may be carried out in an arbitrarily rotated state, for example, “up” is in front and “down” is in back.

図1〜図4に示す実施例1のLED照明器具1は、次に示す、筐体10と、放熱体20と、LEDモジュール30と、固定部材40と、コネクタ50とを含み構成されている。   The LED lighting fixture 1 of Example 1 shown in FIGS. 1-4 is comprised including the housing | casing 10, the heat radiator 20, the LED module 30, the fixing member 40, and the connector 50 which are shown next. .

[筐体10]
筐体10は、LEDモジュール30やその他の部材が取り付けられるケースである。この筐体10の上面には、固定部材40を螺着するためのネジ孔14,14が穿設されている。
[Case 10]
The housing 10 is a case to which the LED module 30 and other members are attached. Screw holes 14 and 14 for screwing the fixing member 40 are formed in the upper surface of the housing 10.

[放熱体20]
放熱体20は、熱伝導性を向上させることでLEDモジュール30からの放熱性を向上させる目的と、LEDモジュール30を筐体10の上面よりも一段かさ上げすることで光の取出し効率を向上させる目的とで設けられた略直方体のブロックである。よって、この放熱体20は、熱伝導性の高い材料(例えば、銅、アルミニウム又はそれらの合金、合成樹脂など)で設けられている。そして、この放熱体20の下端部の四隅には、固定部材40の係止爪42,42・・に係止される切欠24,24・・が凹設されている。
[Heat radiator 20]
The heat dissipating body 20 improves the heat extraction efficiency by improving the heat conductivity and improving the heat dissipation from the LED module 30 and raising the LED module 30 by one step above the upper surface of the housing 10. It is a substantially rectangular parallelepiped block provided for the purpose. Therefore, the heat radiating body 20 is provided with a material having high thermal conductivity (for example, copper, aluminum, an alloy thereof, a synthetic resin, or the like). And in the four corners of the lower end portion of the heat radiating body 20, notches 24, 24,... That are locked to the locking claws 42, 42,.

[LEDモジュール30]
LEDモジュール30は、次に示す、LED基板31と、LEDチップ32,32・・と、封止枠33と、封止体34と、LED配線36とを含み構成されている。
[LED module 30]
The LED module 30 includes an LED substrate 31, LED chips 32, 32..., A sealing frame 33, a sealing body 34, and LED wiring 36, which will be described below.

LED基板31は、上下両面が平坦な略正方形の平板状の基板であって、放熱体20の上面に設置される。このLED基板31は、全体が絶縁体の基板(例えば、窒化アルミニウムなどの絶縁材料のバルブ材からなる基板)であってもよいし、一部のみが絶縁体の基板(例えば、アルミニウムなどの金属材料の表面に絶縁層が形成された基板)であってもよい。   The LED substrate 31 is a substantially square flat substrate whose upper and lower surfaces are flat, and is installed on the upper surface of the radiator 20. The LED substrate 31 may be an insulating substrate (for example, a substrate made of a valve material made of an insulating material such as aluminum nitride), or only a part of the LED substrate 31 (for example, a metal such as aluminum). It may also be a substrate with an insulating layer formed on the surface of the material.

LEDチップ32,32・・は、LED基板31の中央部の上面に左右方向に間隔を空けて碁盤目状に実装されている。   The LED chips 32, 32,... Are mounted on the upper surface of the central portion of the LED substrate 31 in a grid pattern with a space left and right.

封止枠33は、合成樹脂からなる略正方形の枠であって、LED基板31の中央部の上面にLEDチップ32,32・・を取り囲むようにして設置されている。そして、この封止枠33の正方形は、LED基板31の正方形に対して45°傾いている。   The sealing frame 33 is a substantially square frame made of a synthetic resin, and is installed on the upper surface of the central portion of the LED substrate 31 so as to surround the LED chips 32, 32. The square of the sealing frame 33 is inclined 45 ° with respect to the square of the LED substrate 31.

封止体34は、蛍光体を含有したシリコーン樹脂からなり、封止枠33の内側に充填されている。そして、この封止体34とその内側に封止されたLEDチップ32,32・・とがLEDモジュール30の発光部を構成し、封止体34の表面が発光面を構成している。   The sealing body 34 is made of a silicone resin containing a phosphor, and is filled inside the sealing frame 33. The sealing body 34 and the LED chips 32, 32,... Sealed inside thereof constitute a light emitting part of the LED module 30, and the surface of the sealing body 34 constitutes a light emitting surface.

LED配線36は、LEDチップ32,32・・に電力を供給するための配線であって、LED基板31の上面に設置された導電体の層(例えば、金属箔)からなる。そして、このLED配線36の一部、詳しくは、LED基板31の上面の四隅に位置する部分には、封止枠33の外方に露出した電極36a,36a・・が設けられている。   The LED wiring 36 is a wiring for supplying power to the LED chips 32, 32..., And is made of a conductor layer (for example, a metal foil) installed on the upper surface of the LED substrate 31. In addition, electrodes 36 a, 36 a... Exposed to the outside of the sealing frame 33 are provided at a part of the LED wiring 36, specifically at portions located at the four corners of the upper surface of the LED substrate 31.

[固定部材40]
固定部材40は、筐体10にLEDモジュール30を固定するための部材であって、弾力性が高い薄板材(例えば、ステンレス板、燐青銅板、銅板、真鍮板などの金属板、合成樹脂板など)がプレス加工によって折り曲げられて形成されている。この固定部材40は、LEDモジュール30と放熱体20とを上方から覆う下方に開口した箱状の箱状部40aと、該箱状部40aの下端の前端から前方及び後端から後方に突出した固定用突起40b,40bとを含み構成されている。
[Fixing member 40]
The fixing member 40 is a member for fixing the LED module 30 to the housing 10 and is a thin plate material having high elasticity (for example, a metal plate such as a stainless steel plate, a phosphor bronze plate, a copper plate, a brass plate, or a synthetic resin plate). Etc.) are bent by press working. The fixing member 40 protrudes from the front end at the lower end of the box-shaped portion 40a to the front and from the rear end to the rear from the lower end of the box-shaped portion 40a that covers the LED module 30 and the radiator 20 from above. The fixing projections 40b and 40b are included.

そして、この固定部材40の箱状部40aの上部の中央部には、封止体34を露出させるための透光窓43が設けられている。また、この固定部材40の箱状部40aの下端の四隅には、放熱体20の切欠24,24・・を係止する係止爪42,42・・が設けられている。そして、この固定部材40のコネクタ50の上面と接触する部分、詳しくは、箱状部40aの下面の透光窓43の各辺の外側に位置する部分は、コネクタ50のフレキシブル基板51の上面を下方に押し曲げることなく押圧することで、コネクタ50の接触端子56b,56b・・をLEDモジュール30の電極36a,36a・・に押圧する押圧部45,45・・を構成している。   A transparent window 43 for exposing the sealing body 34 is provided in the central portion of the upper portion of the box-shaped portion 40 a of the fixing member 40. Further, at the four corners at the lower end of the box-shaped portion 40a of the fixing member 40, locking claws 42, 42,... For locking the notches 24, 24,. And the part which contacts the upper surface of the connector 50 of this fixing member 40, specifically, the part located in the outer side of each side of the translucent window 43 of the lower surface of the box-shaped part 40a is the upper surface of the flexible substrate 51 of the connector 50. The pressing portions 45, 45,... That press the contact terminals 56b, 56b,... Of the connector 50 against the electrodes 36a, 36a,.

また、この固定部材40の固定用突起40b,40bには、ネジS1,S1を通すためのネジ通孔44,44が貫設されている。そして、ネジS1,S1がそのネジ通孔44,44に通されてから筐体10のネジ穴14,14に螺着されたことで、この固定部材40は、その内側にコネクタ50とLEDモジュール30と放熱体20とを内包した状態で、筐体10に固定されている。   Further, screw through holes 44 and 44 through which the screws S1 and S1 are passed are provided in the fixing protrusions 40b and 40b of the fixing member 40, respectively. Since the screws S1 and S1 are passed through the screw through holes 44 and 44 and screwed into the screw holes 14 and 14 of the housing 10, the fixing member 40 is connected to the connector 50 and the LED module inside thereof. 30 and the heat radiating body 20 are included and fixed to the housing 10.

[コネクタ50]
コネクタ50は、LEDモジュール30の電極36aに外部電源(図示略)を接続するための部材であって、LEDモジュール30と固定部材40との間の隙間に介装されている。このコネクタ50は、次に示す、フレキシブル基板51と、コネクタ配線56とを含み構成されている。
[Connector 50]
The connector 50 is a member for connecting an external power source (not shown) to the electrode 36 a of the LED module 30, and is interposed in a gap between the LED module 30 and the fixing member 40. The connector 50 includes a flexible substrate 51 and connector wiring 56 shown below.

フレキシブル基板51は、可撓性及び絶縁性を有する基板であって、基板材料51pが折り曲げられて形成されている。その基板材料51pは、合成樹脂(例えば、ポリアミド、液晶ポリマー、結晶性ポリマーなど)からなるフレキシブル絶縁層51eの表面(下面)に、同じく合成樹脂からなる厚さA=20μm程度の絶縁カバーフィルム51fが結合されて構成されている。このフレキシブル基板51は、LEDモジュール30と放熱体20の上部とを上方から覆う下方に開口した箱状の箱状部51aと、その箱状部51aの右下の端から下方に延びたのち右方に延びる入力側突起51bとを含み構成されている。そして、このフレキシブル基板51の箱状部51aの上部の中央部には、封止体34を露出させるための透光窓53が貫設されている。   The flexible substrate 51 is a substrate having flexibility and insulation, and is formed by bending a substrate material 51p. The substrate material 51p is formed on the surface (lower surface) of a flexible insulating layer 51e made of a synthetic resin (for example, polyamide, liquid crystal polymer, crystalline polymer, etc.), and the insulating cover film 51f having a thickness A of about 20 μm also made of synthetic resin. Are combined. The flexible substrate 51 includes a box-shaped box-shaped portion 51a that opens downward to cover the LED module 30 and the upper portion of the heat radiating body 20, and extends downward from the lower right end of the box-shaped portion 51a. And an input-side protrusion 51b extending in the direction. A transparent window 53 for exposing the sealing body 34 is provided through the central portion of the upper portion of the box-shaped portion 51 a of the flexible substrate 51.

コネクタ配線56,56は、LEDモジュール30の電極36a,36a・・に外部電源(図示略)を接続するための配線であって、フレキシブル基板51のフレキシブル絶縁層51eと絶縁カバーフィルム51fとの間に埋設された厚さB=20〜50μm程度の導電体の層(例えば、胴箔等の金属箔)からなる。   The connector wires 56, 56 are wires for connecting an external power source (not shown) to the electrodes 36a, 36a,... Of the LED module 30, and are provided between the flexible insulating layer 51e of the flexible substrate 51 and the insulating cover film 51f. It is made of a conductor layer (for example, a metal foil such as a body foil) having a thickness B of about 20 to 50 μm embedded in the substrate.

そして、このコネクタ配線56,56の一部、詳しくは、入力側突起51bの右端部に位置する部分の上面には、フレキシブル基板51から露出した入力側の接触端子56a,56aが設けられている。そして、この入力側の接触端子56a,56aが外部電源(図示略)の電極に接触する。   Further, input-side contact terminals 56a and 56a exposed from the flexible substrate 51 are provided on a part of the connector wirings 56 and 56, specifically on the upper surface of the portion located at the right end of the input-side protrusion 51b. . The contact terminals 56a, 56a on the input side are in contact with electrodes of an external power source (not shown).

また、このコネクタ配線56,56の別の一部、詳しくは、透光窓53の各辺の外側に位置する部分の下面には、フレキシブル基板51から露出するとともに周囲の配線部分に比べて下方に付加厚さB=70〜120μm程度厚く形成されたことで、フレキシブル基板51から絶縁カバーフィルム51fの下面よりも下方に50〜100μm程度突出した出力側の接触端子56b,56b・・が設けられている。そのため、出力側の各接触端子56bは、フレキシブル基板51の該接触端子56b周辺をLEDモジュール30の電極36aに向けて押し曲げなくても、該電極36aに接触するようになっている。 Further, another part of the connector wirings 56, specifically, the lower surface of the part located outside each side of the light transmission window 53, is exposed from the flexible substrate 51 and is lower than the surrounding wiring part. Since the additional thickness B + is formed to be about 70 to 120 μm thick, the output side contact terminals 56 b, 56 b, which protrude about 50 to 100 μm below the lower surface of the insulating cover film 51 f from the flexible substrate 51. Is provided. Therefore, each contact terminal 56b on the output side comes into contact with the electrode 36a without pressing and bending the periphery of the contact terminal 56b of the flexible substrate 51 toward the electrode 36a of the LED module 30.

出力側の各接触端子56bは、次のようにして形成する。すなわち、まず、絶縁カバーフィルム51fの透光窓53の各辺の外側に位置する部分を除去してコネクタ配線56の一部を露出させる。次に、その露出させたコネクタ配線56の一部に、メッキバンプ(電解メッキによる銅の析出)を行う。その後、メッキバンプの表面(下面)に、金メッキを行い接点とする。この金メッキは、メッキバンプの腐食を防止して接触抵抗の増大を防止する目的で行うものである。以上により、各接触端子56bを形成する。   Each contact terminal 56b on the output side is formed as follows. That is, first, a portion of the insulating cover film 51f located outside each side of the transparent window 53 is removed to expose a part of the connector wiring 56. Next, a plating bump (precipitation of copper by electrolytic plating) is performed on a part of the exposed connector wiring 56. Thereafter, gold plating is applied to the surface (lower surface) of the plating bump to form a contact. This gold plating is performed for the purpose of preventing corrosion of the plating bumps and preventing an increase in contact resistance. Thus, each contact terminal 56b is formed.

本実施例1によれば、次の[A]〜[C]の効果を得ることができる。   According to the first embodiment, the following effects [A] to [C] can be obtained.

[A]コネクタ50は、その基板に可撓性のあるフレキシブル基板51を用いているので、本実施例1のようにLEDモジュール30の周辺に纏まった広いスペースがない場合等にも、LEDモジュール30と固定部材40との間の隙間を利用して柔軟にコネクタ50を設置することができる。 [A] Since the connector 50 uses a flexible flexible substrate 51, the LED module can be used even when there is no wide space around the LED module 30 as in the first embodiment. The connector 50 can be flexibly installed using a gap between the fixing member 40 and the fixing member 40.

[B]フレキシブル基板51をLEDモジュール30の電極36a,36a・・に向けて押し曲げなくても、突出した出力側の接触端子56b,56b・・がLEDモジュール30の電極36a,36a・・に接触するので、フレキシブル基板51を押し曲げる必要性がなくなる。そのため、フレキシブル基板51を押し曲げるために、フレキシブル基板51の接触端子56b,56b・・周辺を集中的に押圧する必要性もなくなり、この部分が貫通され難くなる。そのため、絶縁破壊も生じ難くなる。 [B] Even if the flexible substrate 51 is not pushed and bent toward the electrodes 36a, 36a,... Of the LED module 30, the protruding output side contact terminals 56b, 56b,. Since the contact is made, the need to push and bend the flexible substrate 51 is eliminated. Therefore, there is no need to intensively press the periphery of the contact terminals 56b, 56b,... Of the flexible substrate 51 in order to push and bend the flexible substrate 51, and this portion is difficult to penetrate. Therefore, dielectric breakdown is less likely to occur.

[C]固定部材40の押圧部45が、その固定部材40の弾力性でフレキシブル基板51を下方に押圧することで、出力側の接触端子56b,56b・・をLEDモジュール30の電極36a,36a・・に押圧するため、出力側の接触端子56b,56b・・とLEDモジュール30の電極36a,36a・・との間に反発力や接触抵抗がある場合等にも、それらに抗して両者の接触を確実なものにすることができる。 [C] The pressing portion 45 of the fixing member 40 presses the flexible substrate 51 downward by the elasticity of the fixing member 40, so that the output side contact terminals 56b, 56b,. In order to press against, even when there is a repulsive force or contact resistance between the output side contact terminals 56b, 56b, and the electrodes 36a, 36a,. The contact can be ensured.

図5に示す本実施例2のLED照明器具2は、実施例1のLED照明器具1と比べて次の[ア]の点で相違し、その他の点で同様である。
[ア]放熱体20が、略直方体のブロックではなく円柱状のブロックであり、それに合わせて、固定部材40及びコネクタ50も丸みを帯びた形状をしている点。
The LED lighting fixture 2 of the second embodiment shown in FIG. 5 is different from the LED lighting fixture 1 of the first embodiment in the following [A], and is the same in other points.
[A] The heat dissipating body 20 is not a substantially rectangular parallelepiped block but a cylindrical block, and the fixing member 40 and the connector 50 are also rounded accordingly.

本実施例2によっても、実施例1に記載の[A]〜[C]の効果を得ることができる。   Also according to the second embodiment, the effects [A] to [C] described in the first embodiment can be obtained.

図6〜図8に示す本実施例3のLED照明器具3は、実施例1のLED照明器具1と比べて次の[ア]〜[キ]の点で相違し、その他の点で同様である。
[ア]LED照明器具3は、放熱体20を備えない点。
[イ]筐体10に、固定部材40を螺着するためのネジ孔14,14の他に、コネクタ50を螺着するためのネジ孔15,15が設けられている点。
[ウ]LEDモジュール30は、放熱体20の上面にではなく、筐体10の上面に直接設置されている点。
[エ]固定部材40は、下方に開口した箱状ではなく、前後方向に長くて左右方向に幅をもつ平板状である点。
[オ]固定部材40は、放熱体20を係止する係止爪42,42・・の代わりに、LED基板31を係止する係止爪46,46・・を備えている点。その係止爪46,46は、固定部材40の透光窓43の各辺の近傍に位置する部位が、略コ字形に切り込まれて形成されている。
[カ]フレキシブル基板51は、下方に開口した箱状ではなく、左右方向に長くて前後方向に幅をもつ平板状である点。
[キ]フレキシブル基板51に、ネジS2,S2を通すためのネジ通孔55,55が貫設されている点。
The LED lighting device 3 of the third embodiment shown in FIGS. 6 to 8 is different from the LED lighting device 1 of the first embodiment in the following points [a] to [ki], and is the same in other points. is there.
[A] The LED lighting apparatus 3 does not include the heat radiator 20.
[A] The housing 10 is provided with screw holes 15 and 15 for screwing the connector 50 in addition to the screw holes 14 and 14 for screwing the fixing member 40.
[C] The LED module 30 is directly installed on the upper surface of the housing 10, not on the upper surface of the radiator 20.
[D] The fixing member 40 is not a box shape opened downward, but a flat plate shape that is long in the front-rear direction and has a width in the left-right direction.
[E] The fixing member 40 is provided with locking claws 46, 46,... For locking the LED substrate 31 instead of the locking claws 42, 42,. The locking claws 46 are formed by cutting portions located in the vicinity of each side of the transparent window 43 of the fixing member 40 into a substantially U shape.
[F] The flexible substrate 51 is not in a box shape opened downward, but in a flat plate shape that is long in the left-right direction and has a width in the front-rear direction.
[G] Screw through holes 55 and 55 for passing the screws S2 and S2 are formed through the flexible substrate 51.

本実施例3によっても、実施例1に記載の[A]〜[C]の効果を得ることができる。   Also according to the third embodiment, the effects [A] to [C] described in the first embodiment can be obtained.

図9に示す本実施例4のLED照明器具4は、実施例3のLED照明器具3と比べて、次の[ア][イ]の点で相違し、その他の点で同様である。
[ア]コネクタ50は、透光窓53を備えず、代わりに、封止体34を露出させる形で左右2つに分離されている点。
[イ]固定部材40は、透光窓43を備えず、代わりに、封止体34を露出させる形で左右2つに分離されている点。
The LED lighting device 4 of the fourth embodiment shown in FIG. 9 is different from the LED lighting device 3 of the third embodiment in the following points [a] and [b], and is the same in other points.
[A] The connector 50 does not include the translucent window 53, but instead is separated into two on the left and right sides so that the sealing body 34 is exposed.
[A] The fixing member 40 does not include the translucent window 43, and instead is separated into two on the left and right sides so as to expose the sealing body 34.

本実施例4によっても、実施例1に記載の[A]〜[C]の効果を得ることができる。   Also according to the fourth embodiment, the effects [A] to [C] described in the first embodiment can be obtained.

なお、本発明は前記実施例1〜4に限定されるものではなく、例えば次の変更例1〜5のように、発明の趣旨から逸脱しない範囲で適宜変更して具体化することもできる。   In addition, this invention is not limited to the said Examples 1-4, For example, like the following modifications 1-5, it can also change suitably in the range which does not deviate from the meaning of invention, and can also be embodied.

[変更例1]
図10(a)に示すように、出力側の各接触端子56bの形状を任意の形状に変更してもよい。
[Modification 1]
As shown in FIG. 10A, the shape of each contact terminal 56b on the output side may be changed to an arbitrary shape.

[変更例2]
図10(b)に示すように、コネクタ配線56の出力側の同一の露出部に、複数の突出した接触端子56b,56bを設けてもよい。
[Modification 2]
As shown in FIG. 10B, a plurality of protruding contact terminals 56 b and 56 b may be provided on the same exposed portion on the output side of the connector wiring 56.

[変更例3]
入力側の各接触端子56aも、出力側の各接触端子56bと同様にフレキシブル基板51から突出させてもよい。
[Modification 3]
The contact terminals 56a on the input side may also protrude from the flexible substrate 51 in the same manner as the contact terminals 56b on the output side.

[変更例4]
出力側の各接触端子56bに金メッキを行う代わりに、ニッケル等の他の金属のメッキを行ってもよい。
[Modification 4]
Instead of performing gold plating on each contact terminal 56b on the output side, other metal such as nickel may be plated.

[変更例5]
入力側の各接触端子56aやLEDモジュール30の各電極36aに、金やニッケル等の各種金属のメッキを行ってもよい。露出した導電体の層(例えば、金属箔)の腐食を防止することができ、それにより、接触抵抗の増大を防止することができるからである。
[Modification 5]
Each contact terminal 56a on the input side and each electrode 36a of the LED module 30 may be plated with various metals such as gold and nickel. This is because corrosion of the exposed conductor layer (for example, metal foil) can be prevented, thereby preventing increase in contact resistance.

1 LED照明
2 LED照明
3 LED照明
4 LED照明
10 筐体
30 LEDモジュール(接続対象物)
32 LEDチップ
36a LEDモジュールの電極
40 固定部材
45 押圧部
50 コネクタ
51 フレキシブル基板
56 コネクタ配線(配線)
56b 出力側の接触端子(突出した接触端子)
DESCRIPTION OF SYMBOLS 1 LED lighting 2 LED lighting 3 LED lighting 4 LED lighting 10 Case 30 LED module (connection object)
32 LED chip 36a Electrode of LED module 40 Fixing member 45 Press part 50 Connector 51 Flexible substrate 56 Connector wiring (wiring)
56b Contact terminal on output side (protruding contact terminal)

Claims (3)

接続対象物の電極(36a)に外部電源を接続するコネクタ(50)において、
可撓性のあるフレキシブル基板(51)と、該フレキシブル基板(51)に埋設された配線(56)とを含み構成され、
配線(56)の一部に、フレキシブル基板(51)からその面側に露出するとともに周囲の配線部分に比べてフレキシブル基板(51)の厚さ方向に厚く形成されたことで、フレキシブル基板(51)からその厚さ方向に突出した接触端子(56b)が設けられたことで、フレキシブル基板(51)を接続対象物の電極(36a)に向けて押し曲げなくても、該突出した接触端子(56b)が接続対象物の電極(36a)に接触するように構成されたことを特徴とするコネクタ。
In the connector (50) for connecting an external power source to the electrode (36a) of the connection object,
A flexible flexible substrate (51), and a wiring (56) embedded in the flexible substrate (51).
A part of the wiring (56) is exposed to the surface side from the flexible substrate (51) and is formed thicker in the thickness direction of the flexible substrate (51) than the surrounding wiring part. ) From the contact terminal (56b) projecting in the thickness direction, the projecting contact terminal (56b) does not have to be bent toward the connection target electrode (36a). 56b) is configured to come into contact with the electrode (36a) of the connection object.
接続対象物は、LEDチップ(32)を備えたLEDモジュール(30)である請求項1記載のコネクタ。   The connector according to claim 1, wherein the object to be connected is an LED module (30) including an LED chip (32). 筐体(10)と、LEDチップ(32)を備えたLEDモジュール(30)と、筐体(10)にLEDモジュール(30)を固定する固定部材(40)と、LEDモジュール(30)と固定部材(40)との間の隙間に介装された請求項2記載のコネクタ(50)とを含み構成され、
固定部材(40)は、フレキシブル基板(51)をLEDモジュール(30)の電極(36a)に向けて押圧することで、前記突出した接触端子(56b)をLEDモジュール(30)の電極(36a)に押圧する押圧部(45)を備えたLED照明器具。
A housing (10), an LED module (30) including an LED chip (32), a fixing member (40) for fixing the LED module (30) to the housing (10), and an LED module (30) The connector (50) according to claim 2, wherein the connector (50) is interposed in a gap between the member (40) and
The fixing member (40) presses the flexible substrate (51) toward the electrode (36a) of the LED module (30), thereby causing the protruding contact terminal (56b) to move to the electrode (36a) of the LED module (30). The LED lighting fixture provided with the press part (45) pressed against.
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